Heating equipment for semiconductor heat treatment and heating method thereof

Abstract

The invention discloses heating equipment for semiconductor heat treatment and a heating method thereof, and relates to the field of wafer oxidation processing.The heating equipment comprises an oxidation furnace and a traditional quartz boat, a telescopic mechanism is arranged in the oxidation furnace, a furnace door is arranged at the end of the telescopic mechanism, and connecting assemblies are rotationally connected to the four corners of the traditional quartz boat correspondingly; the connecting assembly comprises a connecting rod, a first protruding block and a second protruding block are arranged at the two ends of the connecting rod correspondingly, a plurality of sets of hanging sleeves used for clamping the second protruding block are installed on the side face of the furnace door by arranging a hanging support, and a lifting loading vehicle is arranged on the side face of the oxidizing furnace. And a plurality of groups of fixing mechanisms for fixing the connecting assemblies are arranged at the top of the lifting loading vehicle. By arranging the lifting loading vehicle and the fixing mechanism, a traditional quartz boat containing wafers can be rapidly and safely loaded to the hanging bracket of the furnace door, so that the traditional quartz boat is not in contact with an operator in the process of mounting and taking materials, and the operator is prevented from being injured in a high-temperature environment.

Description

Technical Field

[0001] The present invention relates to the field of wafer oxidation processing, and particularly to a heating device for semiconductor heat treatment and a heating method thereof. Background Art

[0002] The wafer oxidation process is an important process in semiconductor manufacturing, which is used to form a layer of silicon dioxide (SiO2) film on the wafer surface. The silicon dioxide film plays various roles in semiconductor devices, such as isolation, protection, masking, etc. The core purpose of the oxidation process is to react oxygen or water vapor with the silicon substrate to grow an oxide layer on the wafer surface.

[0003] The oxidation process of wafers usually uses an oxidation furnace. The wafers to be oxidized are loaded onto a quartz boat and pushed into the oxidation furnace. The quartz boat for loading wafers is made of high-temperature-resistant quartz material and can hold multiple groups of wafers. Usually, the wafers to be oxidized are loaded onto the quartz boat by a loading machine or manually, and then the staff transfers the quartz boat to the mounting rack of the furnace door. The telescopic device of the furnace door is started to close the furnace door. When the furnace door is closed, it will push the mounting rack and the mounted quartz boat into the furnace cavity. The furnace cavity is evacuated to a low-pressure state by a vacuum pumping device, and then the heating coils distributed on the radial outer side of the horizontal circular furnace cavity will heat the furnace cavity to 800°C - 1200°C. The atmosphere device is located at the end face inside the furnace cavity and introduces pure oxygen (or water vapor-containing) flowing along the horizontal axis direction of the furnace cavity. Thus, in a high-temperature environment, a silicon dioxide film is formed on the surface of the wafers.

[0004] As a wafer loading tool, the quartz boat for loading wafers is usually non-standard customized according to the actual application situation. Therefore, for easy loading and unloading, the quartz boat is installed on the mounting rod inside the furnace door in a hanging manner. When the wafers are heated and oxidized in the furnace cavity, the quartz boat will also be heated to a very high temperature. This makes the temperature of the quartz boat very high when the wafer oxidation is completed. Therefore, the staff can wait for it to cool naturally or use the temperature control system of the oxidation furnace to accelerate its cooling to a low temperature and then use protective gloves to take it. However, the long waiting time for the quartz boat to cool will reduce the oxidation work efficiency of the wafers, and the cooling of the oxidation furnace will waste a lot of heat energy. Therefore, in actual work, the staff usually wears high-temperature-resistant protective clothing, gloves and masks and uses special high-temperature-resistant tools to clamp and transfer the quartz boat to the cooling area. The protective equipment is used to prevent the operator from being injured in a high-temperature environment, but there are still risks. It can be seen that there are still certain risks in the wafer oxidation process even when wearing protective equipment, and the protective equipment, as a consumable, has a high input cost. The operator wearing the protective equipment will reduce the flexibility of the body and is prone to breakage of the wafers during the clamping and transfer process. Summary of the Invention

[0005] Based on this, the object of the present invention is to provide a heating device for semiconductor heat treatment and a heating method thereof to solve the technical problems mentioned in the above background.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heating device for semiconductor heat treatment, comprising an oxidation furnace and a traditional quartz boat, wherein a telescopic mechanism is arranged inside the oxidation furnace, and a furnace door is arranged at the end of the telescopic mechanism, and the four corners of the traditional quartz boat are rotatably connected with connecting components, and the connecting components include a connecting rod, and the two ends of the connecting rod are respectively provided with a first bump and a second bump, and the side of the furnace door is provided with a plurality of groups of mounting sleeves for engaging the second bump by providing a mounting bracket, and a lifting loader is arranged on the side of the oxidation furnace, and a plurality of groups of fixing mechanisms for fixing the connecting components are arranged on the top of the lifting loader; The fixing mechanism comprises a mounting platform mounted on the top of the lifting loader, and two sets of protection frames are symmetrically arranged on the top of the mounting platform, and a bearing platform is arranged between the two sets of protection frames, and moving blocks are movably installed on the inner sides of the two sets of protection frames through the arrangement of limited position components, and the sides of the two sets of moving blocks are arranged with threaded rods; Two groups of first fixing rods are movably penetrated inside the two groups of moving blocks, and the first fixing rods are sleeved with first springs outside, and the ends of the two groups of first fixing rods are provided with first clamping blocks for clamping the connecting rods, and the two groups of first clamping blocks are symmetrically arranged; The sides of the two groups of protection frames are rotatably connected with threaded sleeves, the top of the mounting platform is rotatably connected with two groups of first transmission shafts, and the two groups of first transmission shafts and the two groups of threaded sleeves are transmission-connected by setting a first bevel gear set, and the outsides of the two groups of first transmission shafts are both provided with first spur gears, the bottom of the bearing platform is rotatably connected with a collar, and the outside of the collar is provided with an outer gear ring, and the outer gear ring and the two groups of first spur gears are meshed with each other; A plurality of clamping assemblies for clamping the first protrusion are arranged on the inner side of the collar, and the clamping assembly comprises a shell, a second spring is installed on the inner side of the shell, a second fixing rod is movably installed on the inner side of the shell, and a second clamping block is arranged at the end of the second fixing rod.

[0007] By adopting the above technical solution, a traditional quartz boat containing wafers can be quickly and safely loaded onto the mounting bracket of the furnace door by setting up a lifting loader and a fixing mechanism, so that the traditional quartz boat does not come into contact with the operator during the installation and material removal process, thereby avoiding the operator from being injured in a high temperature environment. After the operator uses the lifting loader and the fixing mechanism to transfer the traditional quartz boat, he can use protective equipment with a relatively lower protection level and is lighter, which not only saves consumables costs, but also improves body flexibility, thereby improving the stability of wafer operation during work and reducing the risk of wafer damage due to human factors.

[0008] The present invention is further configured such that two sets of second drive shafts are rotatably connected to the top of the lifting loader, and the two sets of second drive shafts and multiple sets of fixing mechanisms are drivingly connected through a transmission mechanism. The transmission mechanism includes a second bevel gear set, and the second bevel gear set and the threaded sleeve are drivingly connected through a sprocket assembly.

[0009] Preferably, by arranging two sets of second drive shafts to drive the transmission mechanism to drive the fixing mechanism to work, the transmission mechanism includes a second bevel gear set and a sprocket assembly. The rotation of the second drive shaft drives the rotation and engagement of the second bevel gear set, thereby driving the sprocket assembly to transmit power, and then the sprocket assembly drives the threaded sleeve to rotate.

[0010] The present invention is further configured such that the traditional quartz boat includes two sets of first mounting brackets. The first mounting brackets are made of high-temperature resistant metal materials, and multiple strip-shaped quartz carriers are arranged between the two sets of first mounting brackets. The strip-shaped quartz carriers are made of quartz, and engaging grooves for clamping wafer chips are provided on the sides of the multiple strip-shaped quartz carriers.

[0011] Preferably, by arranging the traditional quartz boat, it can be used to clamp multiple sets of wafer chips, thereby realizing the transfer of the wafer chips into the oxidation furnace.

[0012] The present invention is further configured such that a horizontal furnace chamber is arranged inside the oxidation furnace, a heating device is arranged outside the horizontal furnace chamber, and a vacuum pumping device and an oxygen introduction device are connected to one end of the horizontal furnace chamber.

[0013] Preferably, by arranging the heating device, the temperature of the horizontal furnace chamber can be increased. The vacuum pumping device is used to pump the horizontal furnace chamber to a low pressure, and the oxygen introduction device is used to fill the horizontal furnace chamber with pure oxygen.

[0014] The present invention is further configured such that connection components are rotatably connected to the four corners of the adjustable quartz boat. The adjustable quartz boat includes a second mounting bracket, and two sets of third drive shafts are rotatably connected to the inner side of the second mounting bracket. Multiple arc-shaped quartz carriers are alternately arranged outside the two sets of third drive shafts. The arc-shaped quartz carriers are made of quartz, and the arc-shaped quartz carriers distributed on the two sets of third drive shafts are symmetrically arranged.

[0015] Preferably, by arranging the adjustable quartz boat to clamp the wafer chips, the multiple sets of wafer chips can be staggered after being pushed into the furnace chamber. When the wafer chips are staggered, the contact area with oxygen will increase, thereby improving the oxidation rate.

[0016] The present invention is further configured such that a second spur gear is rotatably connected to one end of the second mounting bracket, and the second spur gear and the two sets of third drive shafts are drivingly connected through a third bevel gear set. A rack for driving the second spur gear to rotate is arranged inside the horizontal furnace chamber, and the rack is made of high-temperature resistant metal material.

[0017] Preferably, by providing a rack inside the bedroom furnace chamber for driving the second spur gear, when the adjustable quartz boat enters the inside of the bedroom furnace chamber, the second spur gear meshes with the rack, thereby staggering the adjustable quartz boat inside the bedroom furnace chamber.

[0018] A heating method for a heating device used in semiconductor heat treatment, the process of which includes the following steps: S1: First, the operator wears lightweight protective equipment, and then snaps the connection components on the sides of two groups of traditional quartz boats into the corresponding fixing mechanisms. When the fixing mechanisms lock the connection components, the second bumps of the connection components and the strip-shaped quartz carriers are in a parallel state; S2: Then, the operator uses a special fixture to load multiple groups of wafers into the traditional quartz boats respectively, uses a lifting loading vehicle to transfer the traditional quartz boats filled with wafers to one side of the oxidation furnace, starts the lifting loading vehicle to drive the traditional quartz boats to rise, so that the second bumps of multiple groups of connection components snap into the inside of the mounting sleeves, and finally drives the transmission mechanism to drive the fixing mechanisms to loosen multiple groups of connection components by rotating the second transmission shaft, and limits the rotation of multiple groups of connection components and the mounting sleeves, that is, successfully installs the traditional quartz boats to the bottom of the mounting brackets; S3: Next, start the telescopic mechanism to close the furnace door, and start the vacuum pumping device to pump the inside of the horizontal furnace chamber to a low pressure; S4: Start the heating device outside the horizontal furnace chamber and raise the temperature inside the horizontal furnace chamber to 800°C - 1200°C; S5: Finally, start the oxygen introduction device to introduce pure oxygen with a certain flow rate and concentration into the inside of the horizontal furnace chamber. After a period of reaction, a silicon oxide film will be formed on the surface of the wafers.

[0019] In summary, the present invention mainly has the following beneficial effects: By providing a lifting loading vehicle and a fixing mechanism, the present invention can quickly and safely load the traditional quartz boats containing wafers onto the mounting brackets of the furnace door, so that the traditional quartz boats do not come into contact with the operator during the installation and material taking processes, thereby avoiding harm to the operator in a high-temperature environment. When the operator uses the lifting loading vehicle and the fixing mechanism to transfer the traditional quartz boats, they can switch to protective equipment with a relatively lower protection level and lighter weight, which can not only save the consumable cost, but also improve the body flexibility, thereby improving the stability of wafer operation during work and reducing the risk of wafer damage due to human factors.

[0020] In the present invention, by providing an adjustable quartz boat for clamping wafers, multiple groups of wafers can be staggeredly arranged after being pushed into the furnace cavity. When the wafers are staggeredly arranged, the contact area with oxygen is increased, thereby improving the oxidation rate. In the prior art, for a horizontal oxidation furnace, multiple groups of wafers are usually arranged along the axial direction of the furnace cavity, and the axes of multiple groups of wafers are aligned. Since heating coils are distributed on the radial outer side of the horizontal furnace cavity, the gas introduction device of the oxidation furnace introduces oxygen with a certain flow rate from the inner end face of the circular furnace cavity, that is, the movement direction of oxygen is the same as the axis direction of multiple groups of wafers. Then, when oxygen flows, it branches into the space between two groups of wafers to react with silicon, and a certain flow rate of oxygen is also used for discharging reaction products. Therefore, in this application, after the same number of wafers are staggeredly distributed, the wafers can better contact with the oxygen flow, accelerate the discharge of reaction products near the wafers, increase the local oxygen concentration of the wafers, and thus improve the oxidation rate of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a distribution diagram of the oxidation furnace, furnace door, and telescopic mechanism of the horizontal furnace cavity of the present invention; Figure 3 is a schematic diagram of the installation of the mounting bracket and mounting sleeve of the present invention; Figure 4 is a schematic diagram of the structure of the traditional quartz boat of the present invention; Figure 5 is a schematic diagram of the installation of the lifting loading vehicle, fixing mechanism, and traditional quartz boat of the present invention; Figure 6 For the present invention Figure 5 Enlarged view of part A; Figure 7 is a schematic diagram of the structure of the fixing mechanism of the present invention; Figure 8 is a schematic diagram of the internal structure of the fixing mechanism of the present invention; Figure 9 For the present invention Figure 8 Enlarged view of part B; Figure 10 is a distribution diagram of the collar and clamping assembly of the present invention; Figure 11 is a schematic diagram of the structure of the clamping assembly of the present invention; Figure 12 is a schematic diagram of the internal structure of the clamping assembly of the present invention; Figure 13 is a schematic diagram of the overlapping structure of the adjustable quartz boat of the present invention; Figure 14 is a schematic diagram of the staggered structure of the adjustable quartz boat of the present invention; Figure 15 Schematic diagram of the distribution of the third transmission shaft and multiple groups of arc-shaped quartz carriers of the present invention.

[0022] Description of reference numerals: 1. Oxidation furnace; 2. Horizontal furnace chamber; 3. Telescopic mechanism; 4. Furnace door; 5. Mounting bracket; 6. Mounting sleeve; 7. Traditional quartz boat; 701. First mounting frame; 702. Strip-shaped quartz carrier; 703. Engaging groove; 8. Connection component; 801. Connecting rod; 802. First convex block; 803. Second convex block; 9. Lifting loading vehicle; 10. Fixing mechanism; 1001. Mounting table; 1002. Protective frame; 1003. Bearing table; 1004. Limiting component; 1005. Moving block; 1006. Threaded rod; 1007. First fixing rod; 1008. First spring; 1009. First clamping block; 1010. Threaded sleeve; 1011. First transmission shaft; 1012. First bevel gear set; 1013. First spur gear; 1014. Collar; 1015. External gear ring; 11. Second transmission shaft; 12. Transmission mechanism; 1201. Second bevel gear set; 1202. Sprocket assembly; 13. Clamping component; 1301. Housing; 1302. Second spring; 1303. Second fixing rod; 1304. Second clamping block; 14. Adjustable quartz boat; 1401. Second mounting frame; 1402. Third transmission shaft; 1403. Arc-shaped quartz carrier; 1404. Second spur gear; 1405. Third bevel gear set. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0024] Next, the embodiments of the present invention will be described according to the overall structure of the present invention. Embodiment 1

[0025] Please refer to Figure 1-12, a heating device for semiconductor heat treatment, comprising an oxidation furnace 1 and a traditional quartz boat 7, wherein a telescopic mechanism 3 is arranged inside the oxidation furnace 1, and a furnace door 4 is arranged at the end of the telescopic mechanism 3, and the telescopic mechanism 3 is used to push the furnace door 4 to open and close, and the four corners of the traditional quartz boat 7 are rotatably connected with a connecting assembly 8, and the connecting assembly 8 comprises a connecting rod 801, and the two ends of the connecting rod 801 are respectively provided with a first bump 802 and a second bump 803, and the side of the furnace door 4 is provided with a plurality of groups of mounting sleeves 6 for engaging the second bump 803 by providing a mounting bracket 5, and a lifting loader 9 is arranged on the side of the oxidation furnace 1, and a plurality of groups of fixing mechanisms 10 for fixing the connecting assembly 8 are arranged on the top of the lifting loader 9, and the traditional quartz boat 7 containing wafers can be quickly and safely loaded onto the mounting bracket 5 of the furnace door 4 by providing the lifting loader 9 and the fixing mechanism 10, so that the traditional quartz boat 7 does not contact the operator during the installation and material removal process, thereby preventing the operator from being injured in a high temperature environment; The fixing mechanism 10 includes a mounting platform 1001 mounted on the top of the lifting loader 9, and two sets of protective frames 1002 are symmetrically arranged on the top of the mounting platform 1001, and a bearing platform 1003 is arranged between the two sets of protective frames 1002, and the inner sides of the two sets of protective frames 1002 are movably mounted with moving blocks 1005 through the arrangement of limiting components 1004, and the sides of the two sets of moving blocks 1005 are arranged with threaded rods 1006; Two sets of first fixing rods 1007 are movably penetrated inside the two sets of moving blocks 1005, and the first fixing rods 1007 are sleeved with first springs 1008 outside, and the ends of the two sets of first fixing rods 1007 are provided with first clamping blocks 1009 for clamping the connecting rod 801, and the two sets of first clamping blocks 1009 are symmetrically arranged, and the first springs 1008 are arranged to push the first clamping blocks 1009 to clamp the connecting rod 801, so that the connecting rod 801 can also rotate after being clamped by the two sets of first clamping blocks 1009; The sides of the two groups of protection frames 1002 are rotatably connected with threaded sleeves 1010, the top of the mounting platform 1001 is rotatably connected with two groups of first transmission shafts 1011, and the two groups of first transmission shafts 1011 and the two groups of threaded sleeves 1010 are transmission-connected by setting a first bevel gear set 1012, and the outsides of the two groups of first transmission shafts 1011 are both provided with first spur gears 1013, the bottom of the bearing platform 1003 is rotatably connected with a collar 1014, and the outside of the collar 1014 is provided with an outer gear ring 1015, and the outer gear ring 1015 and the two groups of first spur gears 1013 are meshed with each other; The inner side of the ring 1014 is provided with a plurality of clamping assemblies 13 for clamping the first protrusion 802, and the clamping assembly 13 includes a shell 1301, a second spring 1302 is installed on the inner side of the shell 1301, and a second fixing rod 1303 is movably installed on the inner side of the shell 1301, and a second clamping block 1304 is arranged at the end of the second fixing rod 1303.

[0026] In the above embodiments, please refer to Figure 6 The top of the lifting loader 9 is rotatably connected with two sets of second transmission shafts 11, and the two sets of second transmission shafts 11 and multiple sets of fixing mechanisms 10 are connected by setting a transmission mechanism 12. The transmission mechanism 12 includes a second bevel gear set 1201, and the second bevel gear set 1201 and the threaded sleeve 1010 are connected by setting a sprocket assembly 1202. The two sets of second transmission shafts 11 are driven by the transmission mechanism 12 to drive the fixing mechanism 10 to work. The transmission mechanism 12 includes a second bevel gear set 1201 and a sprocket assembly 1202. The rotation of the second transmission shaft 11 drives the second bevel gear set 1201 to rotate and engage, thereby driving the sprocket assembly 1202 for transmission, and then the sprocket assembly 1202 drives the threaded sleeve 1010 to rotate.

[0027] In the above embodiments, please refer to Figure 4 The traditional quartz boat 7 includes two groups of first mounting frames 701, the first mounting frames 701 are made of high-temperature resistant metal material, and multiple groups of bar quartz carriers 702 are arranged between the two groups of first mounting frames 701, the bar quartz carriers 702 are made of quartz material, and the sides of the multiple groups of bar quartz carriers 702 are provided with engaging grooves 703 for embedding wafers. By setting up the traditional quartz boat 7, it can be used to embed multiple groups of wafers, thereby realizing the transfer of wafers to the oxidation furnace 1.

[0028] In the above embodiments, please refer to Figure 2 A horizontal furnace chamber 2 is arranged inside the oxidation furnace 1, and a heating device is arranged outside the horizontal furnace chamber 2, and one end of the horizontal furnace chamber 2 is connected to a vacuum pumping device and an oxygen introduction device. The temperature of the horizontal furnace chamber 2 can be increased by arranging the heating device, the vacuum pumping device is arranged to evacuate the horizontal furnace chamber 2 to a low pressure, and the oxygen introduction device is arranged to fill the horizontal furnace chamber 2 with pure oxygen. Embodiment 2

[0029] See also Figure 13-15, connection components 8 are rotatably connected to the four corners of the adjustable quartz boat 14. The adjustable quartz boat 14 includes a second mounting frame 1401, and two groups of third drive shafts 1402 are rotatably connected to the inner side of the second mounting frame 1401. A plurality of arc-shaped quartz carriers 1403 are arranged alternately outside the two groups of third drive shafts 1402. The arc-shaped quartz carriers 1403 are made of quartz, and the arc-shaped quartz carriers 1403 distributed on the two groups of third drive shafts 1402 are symmetrically arranged. The adjustable quartz boat 14 is configured to clamp the wafers, so that the multiple wafers can be staggeredly placed after being pushed into the furnace cavity. When the wafers are staggeredly placed, the contact area with oxygen will increase, thereby increasing the oxidation rate.

[0030] In the above embodiment, specifically, please refer to Figure 14 , one end of the second mounting frame 1401 is rotatably connected to a second spur gear 1404, and the second spur gear 1404 and the two groups of third drive shafts 1402 are connected by a third bevel gear set 1405 for transmission. A rack for driving the second spur gear 1404 to rotate is arranged inside the horizontal furnace cavity 2, and the rack is made of high-temperature resistant metal material.

[0031] A heating method for a heating device used in semiconductor heat treatment, the process of which includes the following steps: S1: First, the operator wears lightweight protective equipment, and then engages and installs the connection components 8 on the sides of the two traditional quartz boats 7 into the corresponding fixing mechanisms 10. When the fixing mechanisms 10 lock the connection components 8, the second bumps 803 of the connection components 8 and the strip-shaped quartz carriers 702 are in a parallel state; S2: Then, the operator uses a special fixture to load multiple wafers into the traditional quartz boats 7 respectively, uses the lifting loading vehicle 9 to transfer the traditional quartz boats 7 filled with wafers to one side of the oxidation furnace 1, starts the lifting loading vehicle 9 to drive the traditional quartz boats 7 to rise, so that the second bumps 803 of the multiple connection components 8 are engaged into the internal mounting sleeves 6, and finally drives the transmission mechanism 12 to drive the fixing mechanisms 10 to release the multiple connection components 8 by rotating the second drive shaft 11, and makes the multiple connection components 8 rotationally limited with the mounting sleeves 6, that is, the traditional quartz boats 7 are successfully installed at the bottom of the mounting bracket 5; S3: Next, start the telescopic mechanism 3 to close the furnace door 4, and start the vacuum pumping device to pump the inside of the horizontal furnace cavity 2 to a low pressure; S4: Start the heating device outside the horizontal furnace cavity 2 to raise the temperature inside the horizontal furnace cavity 2 to 800°C - 1200°C; S5: Finally, start the oxygen introduction device to introduce pure oxygen with a certain flow rate and concentration into the horizontal furnace cavity 2. After a period of reaction, a silicon oxide film will be formed on the surface of the wafers.

[0032] When the present invention is working specifically: For the first embodiment, when it is necessary to oxidize a wafer, the operator first wears heat-resistant protective equipment (a lightweight model is sufficient), and then installs the traditional quartz boat 7 into the fixing mechanism 10, ensuring that the second bump 803 rotates to a state perpendicular to the strip-shaped quartz carrier 702. Then, multiple groups of first bumps 802 on the side of the traditional quartz boat 7 are respectively pressed and engaged into the holes of the corresponding bearing platforms 1003. At this time, the two moving blocks 1005 of the fixing mechanism 10 are in a separated state. When the first bump 802 is engaged, it will be squeezed into the space between multiple groups of clamping components 13. The side of the bottom of the first bump 802 and the top side of the second clamping block 1304 are both arc-shaped, which is more conducive to engagement. The first bump 802 will squeeze the second clamping block 1304 to move, and then the second clamping block 1304 will push the second fixing rod 1303 to contract into the interior of the housing 1301 and compress the second spring 1302. When the first bump 802 completely enters the interior of the fixing mechanism 10, multiple groups of second clamping blocks 1304 will have a clamping effect on the first bump 802 under the reset action of the second spring 1302. According to the above steps, two traditional quartz boats 7 are installed and engaged into the corresponding fixing mechanisms 10.

[0033] Next, rotate the two second transmission shafts 11. The second transmission shafts 11 drive one of the threaded sleeves 1010 of each fixing mechanism 10 to rotate through the transmission mechanism 12. Then, this group of threaded sleeves 1010 drives the first transmission shaft 1011 below to rotate through the first bevel gear set 1012. The first spur gears 1013 on the outside of this group of first transmission shafts 1011 rotate together, and the first spur gears 1013 will drive the external gear ring 1015 to rotate. In the same way, the two threaded sleeves 1010 will rotate together. The rotation of the two threaded sleeves 1010 will drive the two threaded rods 1006 to approach each other, thereby pushing the two moving blocks 1005 to approach each other, so that the two first clamping blocks 1009 wrap and clamp the connecting rod 801 under the reset action of the first spring 1008.

[0034] At the same time, when the external gear ring 1015 rotates, it will drive the collar 1014 to rotate. Then, multiple groups of clamping components 13 inside the collar 1014 rotate accordingly. Multiple groups of clamping components 13 clamp the first bump 802 and rotate to drive the connecting component 8 to rotate 90°, so that the orientation of the second bump 803 changes from perpendicular to the strip-shaped quartz carrier 702 to parallel to the strip-shaped quartz carrier 702. At this time, multiple groups of fixing mechanisms 10 respectively clamp the connecting components 8 on the side of the traditional quartz boat 7, and the second bump 803 of each connecting component 8 is parallel to the strip-shaped quartz carrier 702.

[0035] After the two sets of traditional quartz boats 7 are installed and clamped together, the operator uses a special fixture to sequentially pick up multiple sets of wafers and snap them into the clamping grooves 703. When the two sets of traditional quartz boats 7 are filled with wafers, the operator moves the lifting and loading vehicle 9 to the front side of the oxidation furnace 1, then starts the telescopic mechanism 3 inside the oxidation furnace 1 to push the furnace door 4 open, and then starts to raise the lifting and loading vehicle 9 to raise the two sets of traditional quartz boats 7 to the alignment position below the mounting bracket 5. Continue to raise the lifting and loading vehicle 9 so that the connecting rods 801 of the multiple sets of connecting components 8 are inserted into the corresponding mounting sleeves 6. Then, according to the above steps, rotating the two second transmission shafts 11 again will cause the two first clamping blocks 1009 of the fixing mechanism 10 to move away from each other and loosen the connecting rod 801, and the fixing mechanism 10 will drive the connecting component 8 to rotate 90° again, so that the second convex block 803 rotates 90° inside the mounting sleeve 6. Thus, the two sets of traditional quartz boats 7 are mounted in the mounting sleeves 6 of the mounting bracket 5 through the connecting component 8. Starting the lowering of the lifting and loading vehicle 9 will cause the second convex blocks 803 of the multiple sets of connecting components 8 to be pulled out from the multiple sets of clamping components 13. Closing the furnace door 4 will push the two sets of traditional quartz boats 7 into the horizontal furnace chamber 2. Start the vacuum pumping device connected to the oxidation furnace 1 to pump the horizontal furnace chamber 2 to a low pressure, then start the heating device distributed radially outside the horizontal furnace chamber 2 to raise the temperature inside the horizontal furnace chamber 2 to between 800°C and 1200°C. Then, open the oxygen introduction device to introduce pure oxygen with a certain flow rate into the inside of the horizontal furnace chamber 2. In a high-temperature environment, the silicon crystals on the surface of the wafers react with oxygen to form a silicon oxide film.

[0036] After the oxidation treatment of the wafers is completed, open the furnace door 4, and transfer the two sets of traditional quartz boats 7 back into the fixing mechanism 10 on the top of the lifting and loading vehicle 9 according to the above steps. Then, the lifting and loading vehicle 9 carries the high-temperature traditional quartz boats 7 to the cooling area for cooling. The alternating operation of two or more sets of lifting and loading vehicles 9 and traditional quartz boats 7 can ensure the continuous oxidation of the wafers, thereby improving the oxidation efficiency.

[0037] For the second embodiment, when using the adjustable quartz boat 14 to load the wafers, the adjustable quartz boat 14 is first installed in the fixing mechanism 10 in the same way as described above. Here, the length of the adjustable quartz boat 14 can be customized according to the positions between different fixing mechanisms 10. Multiple groups of wafers are respectively clamped into the arc-shaped quartz carriers 1403. When the adjustable quartz boat 14 is sent into the interior of the horizontal furnace chamber 2, there is a rack inside the horizontal furnace chamber 2 for driving the second spur gear 1404 to rotate. The rack is located inside the horizontal furnace chamber 2 for long-term operation, so it is made of high-temperature resistant material. The rack drives the second spur gear 1404 to rotate, and the second spur gear 1404 drives two groups of third transmission shafts 1402 to rotate 45° away from each other through the third bevel gear set 1405. Then, multiple groups of wafers are divided into two groups and are staggered from each other. When the adjustable quartz boat 14 enters the horizontal furnace chamber 2, maintaining an overlapping distribution is beneficial for setting a smaller furnace opening of the horizontal furnace chamber 2 to reduce the loss of the internal temperature of the horizontal furnace chamber 2, achieving the purpose of saving energy.

[0038] Although the embodiments of the present invention have been shown and described, the specific embodiments are only explanations of the present invention and not limitations thereof. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can, without departing from the principles and purposes of the present invention, make modifications, substitutions and variations that do not contribute creatively to the embodiments as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A heating device for semiconductor heat treatment, comprising an oxidation furnace (1) and a conventional quartz boat (7), characterized in that: The oxidation furnace (1) is provided with a telescopic mechanism (3) inside, and a furnace door (4) is provided at the end of the telescopic mechanism (3); the four corners of the conventional quartz boat (7) are rotatably connected to connecting components (8), and the connecting component (8) comprises a connecting rod (801), and the two ends of the connecting rod (801) are respectively provided with a first protrusion (802) and a second protrusion (803); the side of the furnace door (4) is provided with a plurality of mounting sleeves (6) for engaging the second protrusion (803) by providing a mounting bracket (5); the side of the oxidation furnace (1) is provided with a lifting loader (9), and the top of the lifting loader (9) is provided with a plurality of fixing mechanisms (10) for fixing the connecting components (8).

2. A heating device for semiconductor heat treatment according to claim 1, characterized in that: The fixing mechanism (10) comprises a mounting platform (1001) mounted on the top of the lifting loader (9), and two groups of protective frames (1002) are symmetrically arranged on the top of the mounting platform (1001), and a bearing platform (1003) is arranged between the two groups of protective frames (1002), and moving blocks (1005) are movably installed on the inner sides of the two groups of protective frames (1002) by means of a limiting assembly (1004), and the sides of the two groups of moving blocks (1005) are provided with threaded rods (1006); Two groups of first fixing rods (1007) are movably penetrated inside the two groups of moving blocks (1005), and the first fixing rods (1007) are sleeved with first springs (1008) outside, and first clamping blocks (1009) for clamping the connecting rod (801) are arranged at the ends of the two groups of first fixing rods (1007), and the two groups of first clamping blocks (1009) are symmetrically arranged; The sides of the two groups of protection frames (1002) are rotatably connected to threaded sleeves (1010), the top of the mounting platform (1001) is rotatably connected to two groups of first transmission shafts (1011), and the two groups of first transmission shafts (1011) and the two groups of threaded sleeves (1010) are transmission-connected by arranging a first bevel gear set (1012), and the outsides of the two groups of first transmission shafts (1011) are both provided with first spur gears (1013), the bottom of the bearing platform (1003) is rotatably connected to a collar (1014), and the outside of the collar (1014) is provided with an outer gear ring (1015), and the outer gear ring (1015) and the two groups of first spur gears (1013) are meshed with each other; A plurality of clamping assemblies (13) for clamping the first protrusion (802) are arranged on the inner side of the collar (1014), and the clamping assembly (13) comprises a shell (1301), a second spring (1302) is installed on the inner side of the shell (1301), a second fixing rod (1303) is movably installed on the inner side of the shell (1301), and a second clamping block (1304) is arranged at the end of the second fixing rod (1303).

3. A heating device for semiconductor heat treatment according to claim 2, characterized in that: The top of the lifting loader (9) is rotatably connected to two sets of second transmission shafts (11), and the two sets of second transmission shafts (11) and the plurality of fixing mechanisms (10) are transmission-connected by means of a transmission mechanism (12). The transmission mechanism (12) comprises a second bevel gear set (1201), and the second bevel gear set (1201) and the threaded sleeve (1010) are transmission-connected by means of a sprocket assembly (1202).

4. A heating device for semiconductor heat treatment according to claim 3, characterized in that: The conventional quartz boat (7) comprises two groups of first mounting frames (701), the first mounting frames (701) being made of a high temperature resistant metal material, and a plurality of groups of strip quartz carriers (702) being arranged between the two groups of first mounting frames (701), the strip quartz carriers (702) being made of a quartz material, and the sides of the plurality of groups of strip quartz carriers (702) are provided with engaging grooves (703) for embedding wafers.

5. A heating device for semiconductor heat treatment according to claim 4, characterized in that: A horizontal furnace chamber (2) is provided inside the oxidation furnace (1), a heating device is provided outside the horizontal furnace chamber (2), and a vacuum extraction device and an oxygen introduction device are connected to one end of the horizontal furnace chamber (2).

6. A heating device for semiconductor heat treatment according to claim 5, characterized in that: The four corners of the adjustable quartz boat (14) are rotatably connected to connection components (8). The adjustable quartz boat (14) comprises a second mounting frame (1401), and the inner side of the second mounting frame (1401) is rotatably connected to two groups of third transmission shafts (1402). The outer sides of the two groups of third transmission shafts (1402) are staggered with multiple groups of arc-shaped quartz carriers (1403). The arc-shaped quartz carriers (1403) are made of quartz material, and the arc-shaped quartz carriers (1403) distributed on the two groups of third transmission shafts (1402) are symmetrically arranged.

7. A heating device for semiconductor heat treatment according to claim 6, characterized in that: One end of the second mounting frame (1401) is rotatably connected to a second spur gear (1404), and the second spur gear (1404) and the two sets of third transmission shafts (1402) are transmission-connected via a third bevel gear set (1405), and a rack for driving the second spur gear (1404) to rotate is provided inside the horizontal furnace cavity (2), and the rack is made of a high-temperature resistant metal material.

8. A method for heating a heating device for semiconductor heat treatment, characterized in that Using a heating device for semiconductor heat treatment according to any one of claims 1 to 7, the process The following steps are involved: S1: First, the operator wears a light protective gear, and then snaps and installs the connecting components (8) on the sides of two sets of traditional quartz boats (7) into the corresponding fixing mechanisms (10). When the fixing mechanisms (10) lock the connecting components (8), the second protrusions (803) of the connecting components (8) and the strip-shaped quartz carrier (702) are in a parallel state; S2: The operator then uses a special clamp to load the multiple groups of wafers into the traditional quartz boat (7) respectively, uses a lifting loader (9) to transfer the traditional quartz boat (7) filled with wafers to one side of the oxidation furnace (1), starts the lifting loader (9) to drive the traditional quartz boat (7) to rise, so that the second protrusions (803) of the multiple groups of connecting components (8) are engaged with the inside of the mounting sleeve (6), and finally drives the transmission mechanism (12) and the transmission fixing mechanism (10) to loosen the multiple groups of connecting components (8) by rotating the second transmission shaft (11), and makes the multiple groups of connecting components (8) and the mounting sleeve (6) rotate to limit, that is, the traditional quartz boat (7) is successfully installed on the bottom of the mounting bracket (5); S3: Next, the telescopic mechanism (3) is activated to close the furnace door (4), and the vacuum device is activated to evacuate the interior of the horizontal furnace chamber (2) to a low pressure; S4: starting the heating device outside the horizontal furnace chamber (2) to increase the temperature inside the horizontal furnace chamber (2) to 800° C.-1200° C.; S5: Finally, the oxygen introduction device is started to introduce pure oxygen at a certain flow rate and concentration into the interior of the horizontal furnace chamber (2). After a period of reaction, a silicon oxide film will be formed on the surface of the wafer.

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