Micro-LED chip multi-station Raman detection device

Abstract

The invention belongs to the technical field of chip detection, and particularly relates to a Micro-LED chip multi-station Raman detection device which comprises a bottom plate, a storage box is fixedly mounted at the top of the bottom plate, a circular plate is fixedly mounted at the top of the storage box, a plurality of detection cavities are fixedly mounted at the top of the circular plate, a plurality of chip placing boxes are arranged at the top of the circular plate, and the chip placing boxes are used for placing chips. The plurality of detection cavities are arranged right above the plurality of sheet placing boxes, and the plurality of detection cavities can coincide with the positions of the plurality of sheet placing boxes respectively; when a mass balance block slides at the bottom of a chip placing plate, the mass balance block pulls a chip pushing rod to move above the chip placing plate through two connecting rods, so that when the mass balance block is pulled downwards to drive the chip placing plate to rotate, the mass balance block drives the chip pushing rod to push a chip to slide downwards at the top of the chip placing plate; the moving speed of the chip in the chip placing plate can be accelerated, and meanwhile the phenomenon that the chip is placed on the top of the chip placing plate and cannot slide off can be prevented.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection, and specifically relates to a multi-station Raman detection device for Micro-LED chips. Background Art

[0002] Micro-LED chips are a new type of light-emitting chips and play an important role in fields such as display technology. The structure of Micro-LED chips mainly includes parts such as a substrate, an epitaxial layer, and electrodes. The substrate usually uses materials such as sapphire and silicon carbide to provide mechanical support and electrical conduction paths for the chips. The epitaxial layer is the core light-emitting region of the chip, and a P-N structure is formed by growing different semiconductor materials. When a forward voltage is applied to the chip, electrons and holes recombine at the P-N junction, releasing energy and emitting it in the form of photons, thereby achieving light emission.

[0003] A Chinese patent with the publication number CN118549342A discloses a multi-station rapid Raman detection system for LED chips, which includes a feeding unit, a detection unit, and a discharging unit cooperating with a material transfer unit, and can successively achieve the feeding, detection, and discharging of LED chips. The transition between adjacent two links is executed smoothly, which helps to improve the efficiency of the LED chip detection process. The overall execution logic can be operated by a background control system, and the execution process is orderly. In the face of the detection of a large number of LED chips, it can also run smoothly.

[0004] In the current prior art, when removing unqualified chips, it is usually necessary to use a robotic arm to replace manual removal to prevent chips from remaining inside the detection device and affecting subsequent detections. Since there is a certain movement process required for the robotic arm to pick up materials, when using the robotic arm to remove chips, the efficiency during removal will be reduced to a certain extent, which is not conducive to the detection operation of a large number of chips.

[0005] Therefore, the present invention provides a multi-station Raman detection device for Micro-LED chips. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows: A multi-station Raman detection device for Micro-LED chips according to the present invention includes a bottom plate. A storage box is fixedly installed on the top of the bottom plate. A circular plate is fixedly installed on the top of the storage box. A plurality of detection chambers are fixedly installed at the middle position of the top of the circular plate. A plurality of chip placement boxes are arranged on the outer periphery of the top of the circular plate. The chip placement boxes are used to place chips. The plurality of detection chambers are arranged directly above the plurality of chip placement boxes and the positions of the plurality of detection chambers can respectively coincide with the positions of the plurality of chip placement boxes. A chip extraction component is arranged inside each of the plurality of chip placement boxes. The chip extraction component includes a chip pushing rod. The chip extraction component is used to drive the chip pushing rod to move the chip out of the chip placement box. A plurality of control opening components are arranged at the bottom of the circular plate. The number and positions of the control opening components correspond to the number and positions of the plurality of detection chambers. The control opening components are used to control the chip extraction component to perform chip extraction operations;

[0008] Before use, by arranging corresponding detection systems, such as an appearance detection system, a function detection system, etc., in the plurality of detection chambers 3. When it is necessary to detect the chip, the chip is placed in the chip placement box 6, and then the chip placement box 6 is driven to move intermittently so that it enters the detection systems in the plurality of detection chambers 3 in sequence. The detection systems in the plurality of detection chambers 3 will detect the chips that enter, thereby realizing multi-station detection of the chips. When the detection system in the detection chamber 3 detects that the chip in the chip placement box 6 is unqualified, the control opening component corresponding to the detection chamber 3 controls the chip extraction component to perform chip extraction operations. The chip extraction component will drive the chip pushing rod 607 to move the chip out of the chip placement box 6, thereby preventing unqualified chips from continuing to be placed in the chip placement box 6. At the same time, through the cooperation of the control opening component and the chip extraction component to perform chip extraction, compared with the mechanical arm 201 moving to pick up, place and move it out, it can save the energy loss and time of the mechanical arm 201 during movement, and is more conducive to chip extraction operations during multi-station detection of chips.

[0009] Preferably, a motor is fixedly installed at the bottom of the circular plate. A support rod is fixedly installed at the output end of the motor. A plurality of connection ends of the support rod are respectively fixedly connected to the outer walls of the plurality of chip placement boxes. A ring plate is fixedly installed on the outer wall of the circular plate. The bottoms of the plurality of chip placement boxes are slidably connected to the tops of the circular plate and the ring plate. When the chip is placed in the chip placement box, the motor drives the support rod to rotate intermittently. When the support rod rotates, the support rod drives the plurality of chip placement boxes to rotate on the top of the circular plate, so that the plurality of chip placement boxes enter the respective detection chambers in sequence through rotation, and perform sequential detection operations on the chips in the chip placement boxes, playing a role in driving the chips to be detected in sequence.

[0010] Preferably, conveyor belts are symmetrically and fixedly installed on the outer wall of the ring plate. Mechanical arms are fixedly installed on one side of each of the two conveyor belts. Multiple chip placement boxes can be placed between one side of the two mechanical arms. When chip feeding operation is required, one of the conveyor belts is driven to move the chips. When the conveyor belt drives the chips to the mechanical arm, at this time, the motor drives the chip placement box to come between the two mechanical arms through the support rod. One of the mechanical arms takes out the qualified chips in the chip placement box and places them on the other conveyor belt, so that they are moved away by transmission. At the same time, the other mechanical arm places the chips transmitted by the conveyor belt into the chip placement box, performing the chip feeding operation and playing the role of placing chips.

[0011] Preferably, a plurality of cavity tubes are fixedly installed on the top of the cavity pipe. The number of cavity tubes is the same as the number of detection cavities. The tops of the plurality of cavity tubes are respectively located directly below the plurality of detection cavities. When the chips in the chip placement box are detected and determined to be unqualified products, the chip taking component is controlled to perform the chip taking operation through the control opening component. The chip taking component drives the pushing rod to move the chips out of the chip placement box. The chips moved out of the chip placement box will fall downward from the top of the cavity tube and finally be concentrated in the storage box for waste collection, playing the role of transmitting and collecting defective chips.

[0012] Preferably, placement plates are hinged to the inner walls of the multiple chip placement boxes. Sleeve rods are fixedly installed inside the multiple chip placement boxes. Slide rods are slidably connected to the inner walls of the multiple sleeve rods. The tops of the multiple slide rods can respectively fit with the bottoms of the multiple placement plates. The bottoms of the multiple slide rods are slidably connected to the inner wall of the ring plate. When the mechanical arm drives the chips to be placed, the mechanical arm drives the chips to be placed on the placement plate in the chip placement box. Subsequently, when the motor drives the chip placement box to move through the support rod, the chip placement box drives the slide rods at the bottom through the sleeve rods to move inside the ring plate, providing a chip taking path for the control opening component to control the chip taking component to take out the chips, and at the same time providing an access point for the chip placement box to rotate inside the ring plate, improving the stability during rotation.

[0013] Preferably, the control-opening assembly includes a telescopic cylinder fixedly installed at the bottom of the circular plate. There are multiple angular grooves on the inner wall of the annular plate, and the positions where the multiple angular grooves are opened correspond to the positions of the multiple detection cavities. A wedge plate is fixedly installed at the output end of the telescopic cylinder. The outer wall of the wedge plate is slidably connected to the inner wall of the annular plate and the outer wall of the wedge plate can coincide with the top opening position of the angular groove. The bottom ends of the multiple sliding rods can be respectively slidably connected to the inner walls of the multiple angular grooves. When the chip placement box rotates in the annular plate through the sliding rods, when the sliding rods move to the middle position at the top of the wedge plate, the movement of the chip placement box is stopped. At this time, the chip placement box moves to directly below the detection cavity, and the detection system in the detection cavity will perform a detection operation on the chip. When the detection system in the detection cavity detects that the chip in the chip placement box is a defective product, the corresponding telescopic cylinder is controlled to operate through the detection system. The telescopic cylinder will drive the wedge plate to slide out from the bottom of the sliding rod to the outside of the annular plate, and the angular grooves in the annular plate will be exposed. At this time, the bottom of the sliding rod will be in a suspended state. Driven by gravity, the sliding rod will fall into the angular groove, and the chip placement plate in the chip placement box will lose the top limit of the sliding rod and thus rotate downward and open at the top of the chip placement box, playing a role in controlling the downward rotation and opening of the chip placement plate.

[0014] Preferably, firmware devices are fixedly installed on the inner walls of the multiple chip placement plates. When the robotic arm drives the chip for placement, the robotic arm drives the chip to be placed on the firmware device at the top of the chip placement plate. When the chip is placed on the firmware device, the firmware device operates to fix the chip in place, preventing the chip from shifting during movement and affecting the detection operation of the detection system on it.

[0015] Preferably, the chip-taking assembly further includes mass balance blocks. There are two mass balance blocks. Round rods are hinged to the tops of the two mass balance blocks. The outer walls of the two round rods are slidably connected to the bottom inner wall of the chip-placement plate. Connecting rods are fixedly installed on the outer walls of the two mass balance blocks. The chip-pushing rod is fixedly installed between the two connecting rods. The outer walls of the two connecting rods are slidably connected to the inner wall of the chip-placement plate. The bottom of the chip-pushing rod can be slidably connected to the top of the chip-placement plate. Oblique sliding openings are formed in the inner walls of multiple chip-placement boxes. The top of the chip-placement plate can be on the same straight line as the lower surface sliding opening position of the oblique sliding opening. When the top of the sliding rod loses its limit on the chip-placement plate in the chip-placement box, at this time, the fixing device stops operating and stops fixing the chip. Subsequently, the chip-placement plate will rotate under the gravitational pull of the mass balance blocks. When the mass balance blocks move downward by gravity, the mass balance blocks will slide downward at the bottom of the chip-placement plate through the round rods. When the mass balance blocks move downward, the two mass balance blocks pull the chip-pushing rod to move above the chip-placement plate through the two connecting rods, so that the chip-pushing rod pushes the chip placed on the top of the chip-placement plate to move. Through the continuous pulling of the mass balance blocks, when the mass balance blocks cannot move downward, at this time, the chip-placement plate rotates to the maximum position, and the chip placed on the top of the chip-placement plate will finally slide out of the oblique sliding opening in the chip-placement box under the push of the chip-pushing rod, and finally fall into the storage box through the cavity tube for collection. When the mass balance blocks pull down to drive the chip-placement plate to rotate, the mass balance blocks drive the chip-pushing rod to push the chip downward on the top of the chip-placement plate, which can accelerate the speed of the chip moving in the chip-placement plate, and at the same time prevent the phenomenon that the chip placed on the top of the chip-placement plate cannot slide down.

[0016] Preferably, rectangular boxes are symmetrically and fixedly installed on the top of the chip-placement plate. The internal structures of the two rectangular boxes are the same. A rectangular plate is fixedly installed on the inner wall of the rectangular box. Multiple limiting blocks are slidably connected to the inner wall of the rectangular plate. One ends of the multiple limiting blocks are fixedly installed with extrusion rods. A return spring is arranged between the multiple limiting blocks and the rectangular plate. A pushing block is fixedly installed on the outer wall of the chip-pushing rod. The outer wall of the pushing block is slidably connected to the outer wall of the extrusion rod. The connecting end outer wall of the pushing block is slidably connected to the inner walls of the rectangular plate and the rectangular box. When the mass balance blocks slide downward at the bottom of the chip-placement plate, the chip-pushing rod drives the pushing block to slide in the rectangular box. When the pushing block slides, the pushing block pushes the extrusion rod to move, and the extrusion rod will push the multiple limiting blocks to pull the return spring to move. The multiple limiting blocks will extend out of the rectangular box and be placed on both sides of the chip to limit its top, preventing the phenomenon that the chip warps and gets stuck in the chip-placement plate due to its light weight when the chip slides downward, and playing a role in limiting the sliding of the chip.

[0017] Preferably, baffles are symmetrically and fixedly installed on the outer wall of the sleeve rod, electromagnets are symmetrically and fixedly installed on the outer wall of the top end of the sliding rod, magnetic blocks are fixedly installed on the top of the two mass balance blocks respectively, the positions of the two electromagnets can correspond to the positions of the two magnetic blocks respectively, the two baffles are respectively placed between the two electromagnets and the mass balance blocks, the bottom of the placement plate can be attached to the tops of the two baffles. When the chip slides out from the inclined sliding port and falls into the storage box, at this time, the motor drives the placement box to rotate in place within the annular plate, the sliding rod will slide out from the corner groove, and the top of the sliding rod will extend towards the bottom of the placement plate again, so as to push the inclined placement plate back to its original position at the top of the inner wall of the placement box and perform a reset operation on the placement plate. When the placement plate is reset, the electromagnet connected to the outer wall of the placement box magnetically attracts and pulls the magnetic block on the top of the mass balance block, so that the two mass balance blocks move back from one end of the bottom of the placement plate to the middle position at the bottom end, playing a role in magnetically resetting the mass balance block. When the sliding rod slides out from the corner groove, the telescopic cylinder drives the wedge plate to insert back into the annular plate to block the corner groove and provide a support point for the arrival of the next placement box.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. For the Micro-LED chip multi-station Raman detection device of the present invention, when the mass balance block moves downward by gravity, the mass balance block slides downward at the bottom of the placement plate through the round rod, and the two mass balance blocks drive the pusher rod to move above the placement plate through the two connecting rods. Thus, when the mass balance block drives the placement plate to rotate by pulling down, the mass balance block drives the pusher rod to push the chip downward on the top of the placement plate, which can accelerate the speed of the chip moving in the placement plate and also prevent the phenomenon that the chip cannot slide when placed on the top of the placement plate.

[0020] 2. For the Micro-LED chip multi-station Raman detection device of the present invention, when the mass balance block slides downward at the bottom of the placement plate, the pusher rod drives the pusher block to slide in the rectangular box. When the pusher block slides, the pusher block pushes the extrusion rod to move, and the extrusion rod will push a plurality of limiting blocks to pull the reset spring to move. The plurality of limiting blocks will extend out of the rectangular box and be placed on both sides of the chip to limit the top of the chip, preventing the phenomenon that the chip warps and gets stuck in the placement plate when the chip slides downward due to its light weight, playing a role in limiting the sliding of the chip.

[0021] 3. In the multi-station Raman detection device for Micro-LED chips according to the present invention, when the chip slides out from the inclined slide opening and falls into the chip receiving box, the motor drives the chip placing box to rotate and change positions within the ring plate at this time. Then the slide rod slides out from the corner groove, and the top of the slide rod retracts towards the bottom of the chip placing plate again, so as to push the inclined chip placing plate back to its original position at the top inner wall of the chip placing box, performing a reset operation on the chip placing plate. When the reset of the chip placing plate is completed, the electromagnet connected to the outer wall of the chip placing box magnetically attracts and pulls the magnet on the top of the mass balance block, so that the two mass balance blocks move back from one end of the bottom of the chip placing plate to the middle position at the bottom end, playing a role in magnetically resetting the mass balance blocks.

[0022] 4. In the multi-station Raman detection device for Micro-LED chips according to the present invention, when the detection system in the detection chamber detects that the chip in the chip placing box is a defective product, the detection system controls the corresponding telescopic cylinder to operate. The telescopic cylinder drives the wedge plate to slide out from the bottom of the slide rod to the outside of the ring plate, and the corner groove in the ring plate is exposed. At this time, the bottom of the slide rod is in a suspended state. Driven by gravity, the slide rod will fall into the corner groove, and the chip placing plate in the chip placing box will lose the top limit of the slide rod and thus rotate downward and open at the top of the chip placing box, playing a role in controlling the downward rotation and opening of the chip placing plate.

[0023] 5. In the multi-station Raman detection device for Micro-LED chips according to the present invention, when the chip in the chip placing box is detected and determined to be a defective product, the chip taking component is controlled to perform a chip taking operation through the control opening component. The chip taking component drives the pushing rod to move the chip out of the chip placing box. The chip moved out of the chip placing box will fall downward from the top end of the cavity tube and finally be concentrated in the chip receiving box for waste collection, playing a role in transporting and collecting defective chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] Figure 1 is the front view of the present invention;

[0026] Figure 2 is the structural schematic diagram of the circular plate in the present invention;

[0027] Figure 3 is the structural schematic diagram of the support rod in the present invention;

[0028] Figure 4 is the structural schematic diagram of the wedge plate in the present invention;

[0029] Figure 5 is the structural schematic diagram of the corner groove in the present invention;

[0030] Figure 6 is the structural schematic diagram of the ring plate in the present invention;

[0031] Figure 7 is a schematic structural view of the middle film cassette in the present invention;

[0032] Figure 8 is a schematic structural view of the middle sleeve rod in the present invention;

[0033] Figure 9 is a schematic structural view of the middle connecting rod in the present invention;

[0034] Figure 10 is a schematic structural view of the middle round rod in the present invention;

[0035] Figure 11 is a schematic structural view of the middle film pushing rod in the present invention;

[0036] Figure 12 is a schematic structural view of the middle limit block in the present invention;

[0037] Figure 13 is a schematic structural view of the middle extrusion rod in the present invention.

[0038] In the figure: 1, bottom plate; 2, conveyor belt; 201, robotic arm; 3, detection cavity; 4, cavity tube; 401, storage box; 5, round plate; 6, film cassette; 601, sliding rod; 602, sleeve rod; 603, baffle; 604, electromagnet; 605, mass balance block; 606, connecting rod; 607, film pushing rod; 608, round rod; 609, magnetic block; 7, ring plate; 701, angular groove; 8, motor; 801, support rod; 9, telescopic cylinder; 901, wedge plate; 10, fixing device; 11, film placing plate; 12, rectangular box; 1201, limit block; 1202, pushing block; 1203, return spring; 1204, extrusion rod; 1205, rectangular plate. Detailed implementation manners

[0039] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0040] Such as Figures 1 to 13As shown in the figure, a multi-station Raman detection device for Micro-LED chips according to an embodiment of the present invention includes a bottom plate 1. A storage box 401 is fixedly installed on the top of the bottom plate 1. A circular plate 5 is fixedly installed on the top of the storage box 401. A plurality of detection chambers 3 are fixedly installed at the middle position on the top of the circular plate 5. A plurality of chip placement boxes 6 are arranged on the outer periphery of the top of the circular plate 5. The chip placement boxes 6 are used to place chips. The plurality of detection chambers 3 are arranged directly above the plurality of chip placement boxes 6 and the plurality of detection chambers 3 can respectively coincide with the positions of the plurality of chip placement boxes 6. A chip taking component is arranged inside each of the plurality of chip placement boxes 6. The chip taking component includes a chip pushing rod 607. The chip taking component is used to drive the chip pushing rod 607 to move the chip out of the chip placement box 6. A plurality of control opening components are arranged at the bottom of the circular plate 5. The number and positions of the control opening components correspond to the number and positions of the plurality of detection chambers 3. The control opening components are used to control the chip taking component to perform the chip taking operation;

[0041] When using a robotic arm for material taking, the robotic arm needs to have a certain movement process. When taking out with a robotic arm, to a certain extent, the efficiency during taking out will be reduced, which is not conducive to large-scale chip detection operations;

[0042] Before use, by arranging corresponding detection systems, such as an appearance detection system, a function detection system, etc., in the plurality of detection chambers 3. When it is necessary to detect a chip, the chip is placed in the chip placement box 6, and then the chip placement box 6 is driven to move intermittently so that it enters the detection systems in the plurality of detection chambers 3 in sequence. The detection systems in the plurality of detection chambers 3 will detect the chips that enter, thereby realizing multi-station detection of the chips. When the detection system in the detection chamber 3 detects that the chip in the chip placement box 6 is unqualified, the control opening component corresponding to the detection chamber 3 controls the chip taking component to perform the chip taking operation. The chip taking component will drive the chip pushing rod 607 to move the chip out of the chip placement box 6, thereby preventing unqualified chips from continuing to be placed in the chip placement box 6. At the same time, through the cooperation of the control opening component and the chip taking component for chip taking, compared with the movement of the robotic arm 201 to pick up, place and move it out, the energy loss and time during the movement of the robotic arm 201 can be saved, which is more conducive to the chip taking operation during multi-station detection of the chip.

[0043] Such as Figures 2 to 3 As shown in the figure, a motor 8 is fixedly installed at the bottom of the circular plate 5. A support rod 801 is fixedly installed at the output end of the motor 8. A plurality of connection ends of the support rod 801 are respectively fixedly connected to the outer walls of the plurality of chip placement boxes 6. An annular plate 7 is fixedly installed on the outer wall of the circular plate 5. The bottoms of the plurality of chip placement boxes 6 are slidably connected to the tops of the circular plate 5 and the annular plate 7;

[0044] When the chip is placed into the chip placement box 6, the motor 8 drives the rod 801 to rotate intermittently. When the rod 801 rotates, the rod 801 drives multiple chip placement boxes 6 to rotate on the top of the circular plate 5, so that multiple chip placement boxes 6 enter each detection cavity 3 in turn through rotation, and perform various detection operations on the chips in the chip placement boxes 6 in turn, playing a role in driving the chips to be detected in turn.

[0045] As Figures 1 to 2 shown, conveyor belts 2 are symmetrically and fixedly installed on the outer wall of the ring plate 7. On one side of each of the two conveyor belts 2, a robotic arm 201 is fixedly installed. Multiple chip placement boxes 6 can be placed between one side of the two robotic arms 201;

[0046] When chip feeding operation needs to be performed on the chips, one of the conveyor belts 2 is driven to move the chips. When the conveyor belt 2 drives the chips to move to the robotic arm 201, at this time, the motor 8 drives the chip placement box 6 to come between the two robotic arms 201 through the rod 801. One of the robotic arms 201 drives the qualified chips in the chip placement box 6 to be taken out and placed on the other conveyor belt 2, so that they are driven to move away. At the same time, the other robotic arm 201 drives the chips transmitted by the conveyor belt 2 and places them in the chip placement box 6, performing chip feeding operation on the chips, playing a role in placing the chips. It should be noted here that the two conveyor belts 2 and the motor 8 operate synchronously.

[0047] As Figures 1 to 2 shown, multiple cavity tubes 4 are fixedly installed on the top of the cavity tube 4. The number of cavity tubes 4 is the same as the number of detection cavities 3. The tops of the multiple cavity tubes 4 are respectively placed directly below the multiple detection cavities 3;

[0048] When the chips in the chip placement box 6 are detected and determined to be unqualified products, the chip taking component is controlled to perform chip taking operation through the control opening component. The chip taking component drives the pushing rod 607 to move the chips out of the chip placement box 6. The chips moved out of the chip placement box 6 will fall downward from the top of the cavity tube 4 and finally be concentrated in the object receiving box 401 for waste collection, playing a role in transporting and collecting defective chips.

[0049] As Figures 6 to 8 shown, placement plates 11 are hinged to the inner walls of multiple chip placement boxes 6. Sleeve rods 602 are fixedly installed inside the multiple chip placement boxes 6. Slide rods 601 are slidably connected to the inner walls of the multiple sleeve rods 602. The tops of the multiple slide rods 601 can respectively fit with the bottoms of the multiple placement plates 11. The bottoms of the multiple slide rods 601 are slidably connected to the inner wall of the ring plate 7;

[0050] When the robotic arm 201 drives the chip for placement, the robotic arm 201 drives the chip and places it on the chip placement plate 11 in the chip placement box 6. Subsequently, when the motor 8 drives the chip placement box 6 to move through the support rod 801, the chip placement box 6 drives the slide bar 601 at the bottom through the sleeve rod 602 to move within the ring plate 7, providing a chip removal path for the subsequent control opening component to control the chip removal component to remove the chip, and at the same time providing an access point for the chip placement box 6 to rotate within the ring plate 7, improving the stability during rotation.

[0051] As Figures 6 to 7 shown, the control opening component includes a telescopic cylinder 9. The telescopic cylinder 9 is fixedly installed at the bottom of the circular plate 5. There are multiple corner grooves 701 on the inner wall of the ring plate 7. The opening positions of the multiple corner grooves 701 correspond to the positions of the multiple detection chambers 3. The output end of the telescopic cylinder 9 is fixedly installed with a wedge plate 901. The outer wall of the wedge plate 901 is slidably connected to the inner wall of the ring plate 7 and the outer wall of the wedge plate 901 can coincide with the top opening position of the corner groove 701. The bottom ends of the multiple slide bars 601 can be respectively slidably connected to the inner walls of the multiple corner grooves 701;

[0052] When the chip placement box 6 rotates within the ring plate 7 through the slide bar 601, when the slide bar 601 moves to the middle position at the top of the wedge plate 901, the movement of the chip placement box 6 is stopped. At this time, the chip placement box 6 moves to directly below the detection chamber 3, and the detection system in the detection chamber 3 will perform a detection operation on the chip. When the detection system in the detection chamber 3 detects that the chip in the chip placement box 6 is a defective product, the corresponding telescopic cylinder 9 is controlled to operate through the detection system. The telescopic cylinder 9 will drive the wedge plate 901 to slide out from the bottom of the slide bar 601 to the outside of the ring plate 7, and the corner grooves 701 in the ring plate 7 will be exposed. At this time, the bottom end of the slide bar 601 will be in a suspended state. Driven by gravity, the slide bar 601 will fall into the corner groove 701, and the chip placement plate 11 in the chip placement box 6 will lose the top limit of the slide bar 601 and thus rotate downward and open at the top of the chip placement box 6, playing a role in controlling the downward rotation and opening of the chip placement plate 11.

[0053] As Figures 7 to 8 shown, firmware devices 10 are fixedly installed on the inner walls of the multiple chip placement plates 11;

[0054] When the robotic arm 201 drives the chip for placement, the robotic arm 201 drives the chip to be placed on the firmware device 10 at the top of the chip placement board 11. When the chip is placed on the firmware device 10, the firmware device 10 operates to fix the position of the chip, preventing the chip from shifting during movement and affecting the detection operation of the detection system. Here, it should be noted that the firmware device 10 can be a vacuum adsorption device. By using a vacuum pump to extract the air in the adsorption cavity, a negative pressure is formed between the adsorption head and the surface of the chip, thereby generating an adsorption force to firmly adsorb the chip. By controlling the magnitude of the vacuum degree, the adsorption force can be precisely controlled to ensure that the chip can be firmly adsorbed without causing damage to the chip. When it is necessary to release the chip, through valve control, the vacuum in the adsorption cavity is slowly released to make the adsorption force disappear, realizing the accurate placement of the chip.

[0055] As Figures 8 to 10 shown, the chip picking component further includes mass balance blocks 605. There are two mass balance blocks 605. Round rods 608 are hinged to the tops of the two mass balance blocks 605. The outer walls of the two round rods 608 are slidably connected to the bottom inner wall of the chip placement board 11. Connecting rods 606 are fixedly installed on the outer walls of the two mass balance blocks 605. The pusher rod 607 is fixedly installed between the two connecting rods 606. The outer walls of the two connecting rods 606 are slidably connected to the inner wall of the chip placement board 11. The bottom of the pusher rod 607 can be slidably connected to the top of the chip placement board 11. Oblique sliding openings are formed in the inner walls of multiple chip placement boxes 6. The top of the chip placement board 11 can be on the same straight line as the lower surface sliding opening position of the oblique sliding opening;

[0056] When the top of the sliding rod 601 loses its limit on the chip placement board 11 in the chip placement box 6, at this time, the firmware device 10 stops the operation of fixing the position of the chip. Subsequently, the chip placement board 11 will rotate under the gravitational pull of the mass balance block 605. When the mass balance block 605 moves downward due to gravity, the mass balance block 605 will slide downward along the bottom of the chip placement board 11 through the round rod 608. When the mass balance block 605 moves downward, the two mass balance blocks 605 pull the pusher rod 607 to move above the chip placement board 11 through the two connecting rods 606, so as to make the pusher rod 607 push the chip placed on the top of the chip placement board 11 to move. Through the continuous pull of the mass balance block 605, when the mass balance block 605 cannot move downward, at this time, the chip placement board 11 rotates to the maximum position, and the chip placed on the top of the chip placement board 11 will finally be pushed by the pusher rod 607 and slide out from the oblique sliding opening in the chip placement box 6, and finally fall into the collection box 401 through the cavity tube 4 for collection. When the mass balance block 605 drives the chip placement board 11 to rotate by pulling downward, the mass balance block 605 drives the pusher rod 607 to push the chip downward on the top of the chip placement board 11, which can accelerate the speed of the chip moving in the chip placement board 11 and prevent the phenomenon that the chip placed on the top of the chip placement board 11 cannot slide down.

[0057] As shown Figures 11 to 13 As shown, rectangular boxes 12 are symmetrically and fixedly installed at the top of the chip placing plate 11. The internal structures of the two rectangular boxes 12 are the same. A rectangular plate 1205 is fixedly installed on the inner wall of the rectangular box 12. A plurality of limiting blocks 1201 are slidably connected to the inner wall of the rectangular plate 1205. One ends of the plurality of limiting blocks 1201 are fixedly installed with extrusion rods 1204. A return spring 1203 is arranged between the plurality of limiting blocks 1201 and the rectangular plate 1205. A pushing block 1202 is fixedly installed on the outer wall of the chip pushing rod 607. The outer wall of the pushing block 1202 is slidably connected to the outer wall of the extrusion rod 1204. The outer wall of the connecting end of the pushing block 1202 is slidably connected to the inner walls of the rectangular plate 1205 and the rectangular box 12;

[0058] When the mass balance block 605 slides downward at the bottom of the chip placing plate 11, the chip pushing rod 607 drives the pushing block 1202 to slide in the rectangular box 12. When the pushing block 1202 slides, the pushing block 1202 pushes the extrusion rod 1204 to move. The extrusion rod 1204 will then push the plurality of limiting blocks 1201 to pull the return spring 1203 to move. The plurality of limiting blocks 1201 will extend out of the rectangular box 12 and be placed on both sides of the chip to limit the top of the chip, preventing the chip from tilting and getting stuck in the chip placing plate 11 due to its light weight when the chip slides downward, playing a role in limiting the sliding of the chip.

[0059] As shown Figures 8 to 9 As shown, baffles 603 are symmetrically and fixedly installed on the outer wall of the sleeve rod 602. Electromagnets 604 are symmetrically and fixedly installed on the top outer wall of the sliding rod 601. Magnetic blocks 609 are fixedly installed on the tops of the two mass balance blocks 605. The positions of the two electromagnets 604 can correspond to the positions of the two magnetic blocks 609 respectively. The two baffles 603 are respectively placed between the two electromagnets 604 and the mass balance blocks 605. The bottom of the chip placing plate 11 can be attached to the tops of the two baffles 603;

[0060] When the chip slides out from the inclined sliding opening and falls into the object receiving box 401, at this time, the motor 8 drives the chip placing box 6 to rotate in the ring plate 7 for position change. The sliding rod 601 will slide out of the corner groove 701. The top of the sliding rod 601 will retract towards the bottom of the chip placing plate 11 again, so as to push the inclined chip placing plate 11 back to its original position at the top inner wall of the chip placing box 6 and perform a reset operation on the chip placing plate 11. When the chip placing plate 11 is reset, the electromagnet 604 connected to the outer wall of the chip placing box 6 magnetically attracts and pulls the magnetic block 609 on the top of the mass balance block 605, so that the two mass balance blocks 605 move back from one end of the bottom of the chip placing plate 11 to the middle position at the bottom end, playing a role in magnetically resetting the mass balance block 605. When the sliding rod 601 slides out of the corner groove 701, the telescopic cylinder 9 drives the wedge plate 901 to be inserted back into the ring plate 7 again to block the corner groove 701 and provide a support point for the arrival of the next chip placing box 6.

[0061] Working principle: Before use, corresponding detection systems such as appearance detection system, function detection system, etc. are placed in multiple detection chambers 3. When it is necessary to detect the chip, the chip is placed in the chip placement box 6, and then the chip placement box 6 is driven to move intermittently, so that it enters the detection systems in multiple detection chambers 3 in turn. The detection systems in multiple detection chambers 3 will detect the entered chip, thus realizing multi-station detection of the chip. When the detection system in the detection chamber 3 detects that the chip in the chip placement box 6 is unqualified, the control opening component corresponding to the detection chamber 3 controls the chip taking component to perform the chip taking operation. The chip taking component will drive the pushing rod 607 to move the chip out of the chip placement box 6, so as to prevent the unqualified chip from continuing to be placed in the chip placement box 6. At the same time, through the cooperation of the control opening component and the chip taking component to perform the chip taking operation, compared with the mechanical arm 201 moving to pick up, place and move it, the energy loss and time during the movement of the mechanical arm 201 can be saved, which is more conducive to the chip taking operation during the multi-station detection of the chip;

[0062] When the chip is placed into the chip placement box 6, the motor 8 drives the rack bar 801 to rotate intermittently. When the rack bar 801 rotates, the rack bar 801 drives multiple chip placement boxes 6 to rotate on the top of the circular plate 5, so that multiple chip placement boxes 6 enter each detection chamber 3 in turn through rotation, and perform various detection operations on the chip in the chip placement box 6 in turn, playing a role in driving the chip to be detected in turn;

[0063] When it is necessary to perform the feeding operation on the chip, one of the conveyor belts 2 is driven to move the chip. When the conveyor belt 2 drives the chip to move to the position of the mechanical arm 201, at this time, the motor 8 drives the chip placement box 6 to come between the two mechanical arms 201 through the rack bar 801. One of the mechanical arms 201 takes out the qualified chip in the chip placement box 6 and places it on the other conveyor belt 2, so that it is moved away by transmission. At the same time, the other mechanical arm 201 drives the chip transmitted by the conveyor belt 2 and places it in the chip placement box 6, performing the feeding operation on the chip and playing a role in placing the chip;

[0064] When the chip in the chip placement box 6 is detected and judged to be unqualified, the control opening component controls the chip taking component to perform the chip taking operation. The chip taking component drives the pushing rod 607 to move the chip out of the chip placement box 6. The chip moved out of the chip placement box 6 will fall downward from the top end of the cavity tube 4 and finally be concentrated in the storage box 401 for waste collection, playing a role in transmitting and collecting defective chips;

[0065] When the robotic arm 201 drives the chip for placement, the robotic arm 201 drives the chip and places it on the chip placement board 11 inside the chip placement box 6. Subsequently, when the motor 8 drives the chip placement box 6 to move through the support rod 801, the chip placement box 6 drives the slide bar 601 at the bottom through the sleeve rod 602 to move inside the ring plate 7, providing a chip extraction path for the subsequent control opening component to control the chip extraction component to extract the chip, and at the same time providing an access point for the chip placement box 6 to rotate inside the ring plate 7, improving the stability during rotation;

[0066] When the chip placement box 6 rotates inside the ring plate 7 through the slide bar 601, when the slide bar 601 moves to the middle position at the top of the wedge plate 901, the movement of the chip placement box 6 stops. At this time, the chip placement box 6 moves to directly below the detection chamber 3, and the detection system inside the detection chamber 3 will perform a detection operation on the chip. When the detection system inside the detection chamber 3 detects that the chip inside the chip placement box 6 is a defective product, it controls the corresponding telescopic cylinder 9 to operate through the detection system. The telescopic cylinder 9 will drive the wedge plate 901 to slide out from the bottom of the slide bar 601 to the outside of the ring plate 7, and the corner groove 701 inside the ring plate 7 will be exposed. At this time, the bottom of the slide bar 601 will be in a suspended state, and driven by gravity, the slide bar 601 will fall into the corner groove 701, and the chip placement board 11 inside the chip placement box 6 will lose the top limit of the slide bar 601 and thus rotate downward and open at the top of the chip placement box 6, serving to control the downward rotation and opening of the chip placement board 11;

[0067] When the robotic arm 201 drives the chip for placement, the robotic arm 201 drives the chip and places it on the firmware device 10 on the top of the chip placement board 11. When the chip is placed on the firmware device 10, the firmware device 10 operates to fix the chip in place, preventing the chip from shifting during movement and affecting the detection operation of the detection system on it. It should be noted here that the firmware device 10 can be a vacuum adsorption device or an electrostatic adsorption device, etc.;

[0068] When the placement plate 11 in the placement cassette 6 loses the top limit of the slide bar 601, at this time, the firmware device 10 stops operating and stops fixing the chip. Subsequently, the placement plate 11 will rotate under the gravitational pull of the mass balance block 605. When the mass balance block 605 moves downward by gravity, the mass balance block 605 will slide downward at the bottom of the placement plate 11 through the round rod 608. When the mass balance block 605 moves downward, the two mass balance blocks 605 pull the pusher rod 607 to move above the placement plate 11 through the two connecting rods 606, so that the pusher rod 607 pushes the chip placed on the top of the placement plate 11 to move. Through the continuous pulling of the mass balance block 605, when the mass balance block 605 cannot move downward, at this time, the placement plate 11 rotates to the maximum position, and the chip placed on the top of the placement plate 11 will be pushed by the pusher rod 607 and finally slide out from the inclined slide opening in the placement cassette 6, and finally fall into the storage box 401 through the cavity tube 4 for collection. When the mass balance block 605 drives the placement plate 11 to rotate downward, the mass balance block 605 drives the pusher rod 607 to push the chip downward on the top of the placement plate 11, which can accelerate the speed of the chip when moving in the placement plate 11, and at the same time can also prevent the phenomenon that the chip cannot slide when placed on the top of the placement plate 11;

[0069] When the mass balance block 605 slides downward at the bottom of the placement plate 11, the pusher rod 607 drives the pusher block 1202 to slide in the rectangular box 12. When the pusher block 1202 slides, the pusher block 1202 pushes the extrusion rod 1204 to move, and the extrusion rod 1204 will push a plurality of limit blocks 1201 to pull the return spring 1203 to move. A plurality of limit blocks 1201 will extend out of the rectangular box 12 and be placed on both sides of the chip to limit its top, preventing the phenomenon that the chip warps and gets stuck in the placement plate 11 when the chip slides downward due to its light weight, and playing a role in limiting the sliding of the chip;

[0070] When the chip slides out from the inclined slide opening and falls into the storage box 401, at this time, the motor 8 drives the placement cassette 6 to rotate for replacement in the ring plate 7, and the slide bar 601 will slide out of the corner groove 701, and the top of the slide bar 601 will retract again toward the bottom of the placement plate 11, so as to push the inclined placement plate 11 back to its original position at the top of the inner wall of the placement cassette 6 and perform a reset operation on the placement plate 11. When the placement plate 11 is reset, the electromagnet 604 connected to the outer wall of the placement cassette 6 magnetically attracts and pulls the magnet 609 at the top of the mass balance block 605, so that the two mass balance blocks 605 move back from one end of the bottom of the placement plate 11 to the middle position at the bottom end, playing a role in magnetically resetting the mass balance block 605. When the slide bar 601 moves out of the corner groove 701, the telescopic cylinder 9 drives the wedge plate 901 to insert back into the ring plate 7 again to block the corner groove 701 and provide a support point for the arrival of the next placement cassette 6.

[0071] The above has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-station Raman detection device for Micro-LED chips, characterized by: It includes a bottom plate, a storage box is fixedly installed on the top of the bottom plate, a circular plate is fixedly installed on the top of the storage box, a plurality of detection cavities are fixedly installed in the middle position of the top of the circular plate, a plurality of chip boxes are arranged at the outer periphery of the top of the circular plate, the chip boxes are used to place chips, the plurality of detection cavities are arranged directly above the plurality of chip boxes and the plurality of detection cavities can respectively coincide with the positions of the plurality of chip boxes, a chip taking assembly is arranged inside the plurality of chip boxes, the chip taking assembly includes a chip pushing rod, the chip taking assembly is used to drive the chip pushing rod to move the chip out of the chip box, a plurality of control opening assemblies are arranged at the bottom of the circular plate, the number and position of the control opening assemblies correspond to the number and position of the plurality of detection cavities, and the control opening assembly is used to control the chip taking assembly to perform core taking operation.

2. A multi-station Raman detection device for Micro-LED chips according to claim 1, characterized in that: A motor is fixedly installed at the bottom of the circular plate, a rack rod is fixedly installed at the output end of the motor, multiple connecting ends of the rack rod are respectively fixedly connected to the outer walls of multiple film boxes, a ring plate is fixedly installed on the outer wall of the circular plate, and the bottoms of the multiple film boxes are slidably connected to the tops of the circular plate and the ring plate.

3. A multi-station Raman detection device for Micro-LED chips according to claim 2, characterized in that: Conveyor belts are symmetrically fixedly installed on the outer wall of the ring plate, and mechanical arms are fixedly installed on one side of the two conveyor belts, and multiple film boxes can be placed between one side of the two mechanical arms.

4. A multi-station Raman detection device for Micro-LED chips according to claim 3, characterized in that: A plurality of lumen tubes are fixedly mounted on the top of the lumen tube, the number of the lumen tubes being the same as the number of the detection cavities, and the top ends of the plurality of lumen tubes are respectively placed directly below the plurality of detection cavities.

5. The multi-station Raman detection device for Micro-LED chips according to claim 4, characterized in that: The inner walls of the multiple film boxes are hinged with film plates, the interiors of the multiple film boxes are fixedly installed with sleeve rods, the inner walls of the multiple sleeve rods are slidably connected with sliding rods, the top ends of the multiple sliding rods can respectively fit with the bottoms of the multiple film plates, and the bottom ends of the multiple sliding rods are slidably connected to the inner wall of the ring plate.

6. A multi-station Raman detection device for Micro-LED chips according to claim 5, characterized in that: The control opening component includes a telescopic cylinder, which is fixedly installed at the bottom of the circular plate. A plurality of corner grooves are provided on the inner wall of the ring plate. The opening positions of the plurality of corner grooves correspond to the positions of the plurality of detection cavities. A wedge plate is fixedly installed at the output end of the telescopic cylinder. The outer wall of the wedge plate is slidably connected to the inner wall of the ring plate and the outer wall of the wedge plate can coincide with the top opening position of the corner groove. The bottom ends of the plurality of sliding rods can be slidably connected to the inner walls of the plurality of corner grooves respectively.

7. The multi-station Raman detection device for Micro-LED chips according to claim 6, characterized in that: The inner walls of the plurality of sheet placement plates are all fixedly mounted with a fixing device.

8. The multi-station Raman detection device for Micro-LED chips according to claim 7, characterized in that: The film taking assembly also includes a mass balance block, and there are two mass balance blocks. The tops of the two mass balance blocks are hinged with round rods, and the outer walls of the two round rods are slidably connected to the bottom inner wall of the film placing plate. The outer walls of the two mass balance blocks are fixedly installed with connecting rods, and a film pushing rod is fixedly installed between the two connecting rods. The outer walls of the two connecting rods are slidably connected to the inner wall of the film placing plate, and the bottom of the film pushing rod can be slidably connected to the top of the film placing plate. The inner walls of multiple film placing boxes are provided with inclined sliding openings, and the top of the film placing plate can be in the same straight line as the sliding opening position of the lower surface of the inclined sliding opening.

9. The multi-station Raman detection device for Micro-LED chips according to claim 8, characterized in that: A rectangular box is symmetrically fixedly installed on the top of the sheet placing plate, and the internal structures of the two rectangular boxes are the same. A rectangular plate is fixedly installed on the inner wall of the rectangular box, and a plurality of limit blocks are slidably connected to the inner wall of the rectangular plate. An extrusion rod is fixedly installed on one end of the plurality of limit blocks, and a return spring is arranged between the plurality of limit blocks and the rectangular plate. A push block is fixedly installed on the outer wall of the sheet pushing rod, and the outer wall of the push block is slidably connected to the outer wall of the extrusion rod, and the outer wall of the connecting end of the push block is slidably connected to the rectangular plate and the inner wall of the rectangular box.

10. A multi-station Raman detection device for Micro-LED chips according to claim 9, characterized in that: Baffles are symmetrically fixedly installed on the outer wall of the sleeve rod, electromagnets are symmetrically fixedly installed on the outer wall of the top of the sliding rod, and magnetic blocks are fixedly installed on the tops of the two mass balance blocks. The positions of the two electromagnets can correspond to the positions of the two magnetic blocks respectively, and the two baffles are respectively placed between the two electromagnets and the mass balance blocks, and the bottom of the sheet plate can fit with the tops of the two baffles.

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