High-speed three-dimensional photoetching system for photon lead bonding

Abstract

The invention discloses a high-speed three-dimensional photoetching system for photon lead bonding, which comprises a laser, a beam expanding and shaping module, a dynamic focusing module, a double-galvanometer scanning module and a processing monitoring module, and is characterized in that a light beam emitted by the laser is expanded and shaped by the beam expanding and shaping module and then enters the dynamic focusing module for variable focusing; asymmetric aberration and vignetting of the focused light beam are eliminated through the conjugate orthogonal double-galvanometer scanning module, and the light beam enters the processing monitoring module to form a writing field for photoetching on a sample. Through conjugate orthogonality and combination of the double-galvanometer scanning module meeting the imaging relation and the processing monitoring module, the writing field area is increased, the photoetching processing speed is increased, and the photoetching quality is improved.

Description

Technical Field

[0001] The present invention belongs to the field of lithography, and particularly relates to a high-speed three-dimensional lithography system for photonic wire bonding. Background Art

[0002] Photonic wire bonding (PWB) technology has broad application potential in the fields of optical communication, optical sensing, micro-nano processing, biomedicine, etc. due to its advantages such as low loss, low cost, material compatibility, and high integration. Photonic wire bonding technology usually consists of a three-dimensional lithography system jointly composed of the two-photon polymerization effect of a special photoresist and a maskless scanning lithography system. Such a three-dimensional lithography system generally consists of an XY galvanometer, a scanning mirror, a field lens, a dynamic focusing lens, an objective lens, etc. By controlling the two mirrors on the XY galvanometer, the deflection of the laser beam is controlled, and then the focusing of the laser beam is controlled by the dynamic focusing lens or the Z-axis displacement motor carrying the objective lens. However, in common three-dimensional lithography systems, the XY galvanometer usually only satisfies the orthogonal relationship. At large scanning angles, due to the influence of asymmetric aberration and vignetting, there are differences in the focal spot quality between the center and the edge in a single field of view. There is a non-linear error between the actual processing size and the laser deflection angle controlled by the scanning mirror, which seriously affects the processing quality of the writing field edge in a single writing field, thus limiting the high-precision alignment limit performance required for photonic wire bonding.

[0003] Patent document CN116819762A proposes a method of inserting a compensation galvanometer in an orthogonal double-galvanometer system to eliminate asymmetric aberration at large-angle scanning. This method can minimize the deviation of the beam at the entrance pupil of the objective lens at large scanning angles, thereby achieving stable large field of view and uniform high-brightness light slicing imaging. Although this method improves the writing field range and processing quality to a certain extent, since the deflection angle of the compensation mirror is several times that of the first galvanometer, it greatly limits the scanning speed of the galvanometer, thus affecting the actual processing speed, and at the same time increasing the cost and debugging difficulty of the system.

[0004] Patent document CN119773247A proposes an error compensation and correction method based on an orthogonal two-axis galvanometer. By collecting the angle difference between the scanning plane and the processing plane, the processing plane is deflected and corrected to eliminate the problem of non-coincidence between the scanning plane and the processing plane, thereby reducing the influence of asymmetric aberration in the orthogonal double-galvanometer scanning system to a certain extent. Although this method finally achieves a relatively uniform processing effect in a single scanning field of view, it does not solve the optical quality defects still existing in the lithography system, and the debugging and calibration process is relatively cumbersome.

[0005] Therefore, the existing three-dimensional lithography systems cannot meet the high-precision alignment requirements and high-speed processing capabilities required by the photon wire bonding technology. In actual production applications, there is an urgent need for a three-dimensional lithography system with a large processing area, high processing speed, good processing quality, and low cost to meet the high-efficiency and high-quality processing requirements of the photon wire bonding technology. Summary of the Invention

[0006] In view of the problems of small scanning angles of the dual galvanometer system and slow processing speeds of the triple galvanometer system, the present invention proposes a dual galvanometer scanning system with conjugate orthogonality and satisfying the imaging relationship. Combining a dynamic focusing lens, scanning mirrors, and a field lens, it significantly improves the processing accuracy and processing speed of the three-dimensional lithography system under the condition of relatively low cost. At the same time, it increases the write field size and accelerates the industrialization process of the photon wire bonding technology.

[0007] To achieve the above objectives, the present invention adopts the following technical solutions:

[0008] A high-speed three-dimensional lithography system for photon wire bonding, characterized in that it includes a laser, a beam expanding and shaping module, a dynamic focusing module, a dual galvanometer scanning module, and a processing monitoring module. The beam emitted by the laser first undergoes beam expansion and shaping through the beam expanding and shaping module, and then enters the dynamic focusing module for variable focusing. The focused beam eliminates the vignetting effect through the conjugate orthogonal dual galvanometer scanning module and enters the processing monitoring module to form a write field for lithography on the sample.

[0009] The present invention improves the write field area, enhances the lithography processing speed, and improves the lithography quality through the combination of the conjugate orthogonal dual galvanometer scanning module and the processing detection module.

[0010] Further, the beam expanding and shaping module includes a beam expander group, and a small hole is provided at the center of the beam expander group for spatial filtering.

[0011] The beam expander group can be two plano-convex lenses. Spatial filtering is performed through a small hole provided between the two plano-convex lenses, thereby achieving the effect of beam shaping.

[0012] Further, the dynamic focusing module includes at least two lenses and an axial motor. One of the lenses is fixed to the axial motor for compensating the focal length, and the axial motor moves along the Z-axis, while the other lenses are fixed in position.

[0013] The dynamic focusing module introduces a divergence / convergence amount to the expanded parallel beam, thereby achieving variable focusing within a certain axial range.

[0014] In the application of photon wire bonding, when scanning and lithographing different layer heights, the high-speed axial motor can ensure the axial focusing speed.

[0015] Furthermore, the dynamic focusing module consists of a negative lens and a positive lens. The relationship between the change in the focal point position and the change in the distance between the negative lens and the positive lens is as follows:

[0016]

[0017] Where Δs is the change in the focal point position, Δd is the change in the position between the negative lens and the positive lens, f1 is the focal length of the negative lens, f2 is the focal length of the positive lens, d is the initial distance between the negative lens and the positive lens, and f′ is the equivalent focal length.

[0018] For this non-linear relationship, the computer needs to further fit the functional relationship between the change in the focal point position and the change in the lens spacing, and then perform precise dynamic control.

[0019] Furthermore, the dual galvanometer scanning module includes an X galvanometer, a first scanning mirror, a second scanning mirror, and a Y galvanometer. The focused light beam passes through the X galvanometer and is conjugated and imaged by the 4f imaging system composed of the first scanning mirror and the second scanning mirror to the Y galvanometer. The first scanning mirror and the second scanning mirror form a bi-Gaussian structure, and the first scanning mirror and the second scanning mirror are the same scanning mirrors.

[0020] Two opposed scanning mirrors form a bi-Gaussian structure, eliminating most of the aberrations.

[0021] Furthermore, the processing monitoring module includes a third scanning mirror, a field lens, and an objective lens. The third scanning mirror and the field lens form a 4f imaging system, and the light from the Y galvanometer and the entrance pupil of the objective lens form an imaging relationship.

[0022] With the help of a specially designed third scanning mirror with a small front focal length and a field lens with a large back focal length, the scanning angle can be further increased, thereby increasing the writing field area.

[0023] Furthermore, the writing field size is

[0024] The correspondence between the scanning angle of the dual galvanometer scanning module and the writing coordinates is:

[0025] Where W represents the side length of the writing field, y ′ represents the height of the intermediate image plane in front of the field lens, β represents the actual magnification of the objective lens, f s represents the focal length of the first scanning mirror, f o represents the focal length of the objective lens, θ max represents the maximum scanning angle supported by the first scanning mirror, f t represents the focal length of the field lens, represents the deflection angle of the light in the X direction after the X galvanometer, represents the deflection angle of the light in the Y direction after the Y galvanometer, θGx represents the mechanical deflection angle of the X galvanometer, θ Gy represents the mechanical deflection angle of the Y galvanometer;

[0026] To ensure the lithography processing quality of the entire writing field, the following relationship needs to be satisfied:

[0027] 1.

[0028] 2. θ ray = 2θ G ≤ θ max ;

[0029] where FN is the field number of the objective lens, and θ G is the mechanical deflection angle of the X / Y galvanometer.

[0030] Furthermore, the dual-galvanometer scanning module includes a first concave mirror, a Y galvanometer, a second concave mirror, and an X galvanometer. The focused beam is reflected by the first concave mirror to the center of the X galvanometer. The distance from the center of the first concave mirror to the center of the Y galvanometer is half of the focal length of the first concave mirror. The Y galvanometer reflects the beam to the center of the second concave mirror. The distance from the center of the Y galvanometer to the center of the second concave mirror is twice the focal length of the second concave mirror. The second concave mirror reflects the beam to the center of the X galvanometer. The distance from the center of the second concave mirror to the center of the X galvanometer is twice the focal length of the second concave mirror. The Y galvanometer and the X galvanometer are orthogonal to each other in position, and the Y galvanometer and the X galvanometer have an object-image conjugate relationship.

[0031] Since the Y galvanometer and the X galvanometer are located at twice the focal length on both sides of the concave mirror, the Y galvanometer and the X galvanometer have an object-image conjugate relationship. When the Y galvanometer and the X galvanometer scan at different angles respectively, there is a fixed point of the beam at the X galvanometer, effectively reducing the asymmetric aberration and ensuring the subsequent processing quality.

[0032] Furthermore, the dual-galvanometer scanning module includes a Y galvanometer, a doublet lens, and an X galvanometer. The focused beam is incident on the center of the X galvanometer. The X galvanometer reflects the light vertically into the center of the doublet lens. The processing beam is incident on the center of the X galvanometer after passing through the doublet lens. The center of the X galvanometer is located at the rear focal point of the doublet lens. The Y galvanometer and the X galvanometer have an object-image conjugate relationship.

[0033] Since the center of the X galvanometer is located at the rear focal point of the doublet lens, the Y galvanometer and the X galvanometer have an object-image conjugate relationship. When the Y galvanometer and the X galvanometer scan at different angles respectively, there is a fixed point of the beam at the X galvanometer, reducing the asymmetric aberration to a certain extent. However, due to the limitation of the doublet lens material, it does not have the high-power laser processing ability.

[0034] Furthermore, the processing monitoring module further includes a dichroic mirror, a high-magnification immersion objective lens, a focusing lens, and a camera. The parallel light beam passing through the field lens is reflected by the dichroic mirror and enters the high-magnification immersion objective lens, and the distance from the field lens to the entrance pupil of the objective lens is equal to the back focal length of the field lens. The light beam is focused on the surface of the sample coated with photoresist supporting two-photon polymerization effect through the high-magnification immersion objective lens, and the reflected light is observed by passing through the focusing lens to reach the camera.

[0035] Due to the above technical solutions, the present invention has the following beneficial effects:

[0036] 1. By combining the conjugate orthogonal dual galvanometer scanning module and the processing detection module, the writing field area is increased, the photolithography processing speed is improved, and the photolithography quality is enhanced.

[0037] 2. In the dynamic focusing module, the axial motor can introduce divergence / convergence to the collimated light beam after beam expansion, thereby realizing variable focusing within a certain axial range.

[0038] 3. The dual galvanometer scanning module can have various structures. The Y galvanometer and the X galvanometer have an object-image conjugate relationship, which can effectively reduce the asymmetric aberration and ensure the subsequent processing quality.

[0039] 4. By combining the dynamic focusing module and the dual galvanometer scanning module, the three-dimensional photolithography system can simultaneously achieve large-angle scanning and high-speed axial focusing speed, which is of great significance for micro-nano 3D processing including photon lead technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The present invention will be further described below with reference to the drawings.

[0041] Figure 1 It is a system schematic diagram of a high-speed three-dimensional photolithography system for photon lead bonding in Example 1.

[0042] Figure 2 It is a schematic diagram of the dual galvanometer scanning module in Example 1.

[0043] Figure 3 It is a schematic diagram of the dual galvanometer scanning module in Example 2.

[0044] Figure 4 It is a schematic diagram of the dual galvanometer scanning module in Example 3.

[0045] Figure 5 It is a schematic diagram of the traditional orthogonal dual galvanometer scanning module in Comparative Example 1.

[0046] Figure 6 It is the Huygens RSF pattern of Example 1.

[0047] Figure 7 It is the Huygens RSF pattern of Comparative Example 1. Detailed Implementation Manner

[0048] Example 1

[0049] As Figure 1 shown, a high-speed three-dimensional lithography system for photon wire bonding includes a femtosecond laser 1, a beam expanding and shaping module 2, a dynamic focusing module 3, a Y galvanometer 4, a first scanning mirror 5, a second scanning mirror 6, an X galvanometer 7, a third scanning mirror 8, a field lens 9, a dichroic mirror 10, a high-magnification immersion oil objective lens 11, a sample 12 spin-coated with a photoresist supporting two-photon polymerization effect, a focusing lens 13, and a CCD camera 14. 4-7 together constitute a dual galvanometer scanning module 15, and 8-14 together constitute a processing monitoring module 16. Among them, the first scanning mirror 5, the second scanning mirror 6, and the third scanning mirror 8 are exactly the same, and all are image-space telecentric f-θ scanning mirrors. The third scanning mirror can be a scanning mirror with better quality and a larger scanning angle. The field lens is an infinity-corrected lens barrel lens matching the focal length of the objective lens.

[0050] The laser emitted by the femtosecond laser 1 is beam-expanded and shaped by the beam expanding and shaping module 2. The beam expanding and shaping module 2 can use two plano-convex lenses 17 as a beam expander group, and a small hole 18 is used for spatial filtering in the middle of the beam expander group to achieve the effect of beam shaping.

[0051] The parallel light emitted from the beam expanding and shaping module 2 is variably focused within a certain axial range by the dynamic focusing module 3. In the initial position, the dynamic focusing module 3 does not introduce divergence / convergence to the parallel light beam. The dynamic focusing module 3 includes two lenses 19 and an axial motor 20, and one of the lenses 19 is installed on the axial motor 20.

[0052] In the initial position, the beam-expanded parallel light beam is incident on the Y galvanometer 4 at an angle of 45°. The parallel light beam reflected by the Y galvanometer 4 passes through the centers of the first scanning mirror 5 and the second scanning mirror 6 in sequence, ensuring that the Y galvanometer 4 is located at the front focal point of the first scanning mirror 5. The second scanning mirror 6 is essentially an inverted first scanning mirror 5, ensuring that the distance between the second scanning mirror 6 and the first scanning mirror 5 is equal to twice the back focal length of the first scanning mirror 5. The X galvanometer 7 is located at the back focal point of the second scanning mirror 6, and it is ensured that the light beam emitted from the second scanning mirror 6 is incident on the X galvanometer 7 at an angle of 45°, and the scanning directions of the Y galvanometer 4 and the X galvanometer 7 are orthogonal to each other. Here, the scanning direction of the Y galvanometer 4 is denoted as Y-direction scanning, and the scanning direction of the X galvanometer 7 is denoted as X-direction scanning. In this way, the Y galvanometer 4, the first scanning mirror 5, the second scanning mirror 6, and the X galvanometer 7 form a 4f system. The Y galvanometer 4 and the X galvanometer 7 have an object-image conjugate relationship. The Y galvanometer 4 scans within the scanning angle supported by the first scanning mirror 5, and the emitted scanning light beams are all located at the same point of the X galvanometer 7. As Figure 2As shown, GM_Y represents the Y galvanometer mirror, GM_X represents the X galvanometer mirror, SL1 represents the first scanning mirror, and SL2 represents the second scanning mirror.

[0053] In the initial position, the parallel light beam reflected from the X galvanometer mirror 7 enters the processing monitoring module 16, that is, it passes through the third scanning mirror 8 and the center of the field lens 9 in sequence, and the X galvanometer mirror 7 is located at the front focal point of the third scanning mirror 8. The distance between the third scanning mirror 8 and the field lens 9 is equal to the sum of the focal lengths of the third scanning mirror 8 and the field lens 9. The parallel light beam passing through the field lens 9 is reflected by the dichroic mirror 10 at an angle of 45° and enters the high-magnification immersion oil objective lens 11. The distance from the field lens 9 to the entrance pupil of the objective lens is equal to the back focal length of the field lens 9. In this way, the X galvanometer mirror 7, the third scanning mirror 8, the field lens 9, and the entrance pupil of the objective lens form another 4f system. The X galvanometer mirror 7 and the entrance pupil of the objective lens have a conjugate object-image relationship. After the scanning of the Y galvanometer mirror 4 and the X galvanometer mirror 7, the processing light with different scanning angles can always completely enter the entrance pupil of the objective lens.

[0054] In the initial position, the processing light beam is focused on the surface of the sample 12 coated with a photoresist that supports two-photon polymerization effect through the high-magnification immersion oil objective lens 11. Utilizing the nonlinear optical effect of this kind of photoresist, a photochemical reaction is initiated, which can be observed by the reflected light reaching the CCD camera 14 through the focusing lens 13. By means of image recognition and other technologies, the position and movement path of the laser focus can be accurately controlled, and the photoresist can be cured point by point in three-dimensional space to form the required photon leads or other micro-nano structures.

[0055] In particular, for a dynamic focusing lens group composed of a negative lens and a positive lens, the change amount of the focus position and the change amount of the lens spacing satisfy the following relationship:

[0056]

[0057] Among them, Δs is the change amount of the focus position, Δd is the change amount of the lens position, f1 is the focal length of the negative lens, f2 is the focal length of the positive lens, d is the initial distance between the two lenses, and f′ is the equivalent focal length. For this non-linear relationship, it is necessary for the computer to further fit the functional relationship between the change amount of the focus position and the change amount of the lens spacing, and then perform precise dynamic control.

[0058] Embodiment 2

[0059] A high-speed three-dimensional lithography system for photon lead bonding, which is different from that in Embodiment 1 in that the dual galvanometer mirror scanning module is different. It is a concave mirror reflection type dual galvanometer mirror scanning module, and the other modules are the same. As Figure 3 shown, where GM_Y represents the Y galvanometer mirror 4, GM_X represents the X galvanometer mirror 7, CM1 represents the first concave mirror 1 with a focal length of -100 mm, and CM2 represents the second concave mirror with a focal length of -50 mm.

[0060] In the initial position, the expanded parallel light beam is incident on the center of the first concave mirror at an angle of approximately 5.8°. The first concave mirror reflects the incident light beam to the center of the Y galvanometer 4, with an incident angle of approximately 3.3°. Ensure that the distance from the center of the first concave mirror to the center of the Y galvanometer 4 is half of the focal length of the first concave mirror, i.e., 50 mm. The Y galvanometer 4 reflects the light beam to the center of the second concave mirror, with an incident angle of approximately 4°. Ensure that the distance from the center of the Y galvanometer 4 to the center of the second concave mirror is twice the focal length of the second concave mirror, i.e., 100 mm. The second concave mirror reflects the light beam to the center of the X galvanometer 7, with an incident angle of approximately 40°. Ensure that the distance from the center of the second concave mirror to the center of the X galvanometer 7 is twice the focal length of the second concave mirror, i.e., 100 mm. Through the beam shrinking effect of the first concave mirror and the second concave mirror, the diameter of the parallel light beam emerging from the X galvanometer 7 is reduced by half compared to the diameter of the light beam incident on the first concave mirror. The Y galvanometer 4 and the X galvanometer 7 are orthogonal to each other in position. The Y galvanometer 4 is set to scan in the Y direction, and the X galvanometer 7 is set to scan in the X direction.

[0061] Since the Y galvanometer 4 and the X galvanometer 7 are located at two times the focal length on both sides of the second concave mirror, the Y galvanometer 4 and the X galvanometer 7 have a conjugate object-image relationship. When the Y galvanometer 4 and the X galvanometer 7 scan at different angles respectively, there is a fixed point of the light beam at the X galvanometer 7, as Figure 3 shown. Similar to Embodiment 1, the asymmetric aberration is effectively reduced, ensuring the subsequent processing quality.

[0062] Embodiment 3

[0063] A high-speed three-dimensional lithography system for photon lead bonding, which is different from that in Embodiment 1 in that the dual galvanometer scanning module is different. It is a dual-lens transmissive dual galvanometer scanning module, and the other modules are the same. Figure 4 As shown, where GM_Y represents the Y galvanometer 4, GM_X represents the X galvanometer 7, DL1 represents the doublet lens 1 with a focal length of 100 mm, and DL2 represents the doublet lens 2 with a focal length of 50 mm.

[0064] In the initial position, the expanded parallel light beam is incident perpendicularly to the center of the doublet lens 1. After passing through the doublet lens 1, the light beam is incident on the center of the Y galvanometer 4 at an angle of 45°, ensuring that the distance from the center of the doublet lens 1 to the center of the Y galvanometer 4 is half of the focal length of the doublet lens 1. The Y galvanometer 4 reflects the light beam and makes it incident perpendicularly to the center of the doublet lens 2, ensuring that the distance from the center of the Y galvanometer 4 to the center of the doublet lens 2 is twice the object-side focal length of the doublet lens 2 (100 mm). The processing light beam passes through the doublet lens 2 and is incident on the center of the X galvanometer 7 at an angle of 45°, ensuring that the distance from the center of the doublet lens 2 to the center of the X galvanometer 7 is twice the image-side focal length of the doublet lens 2 (100 mm). The Y galvanometer 4 and the X galvanometer 7 are orthogonal to each other in position. The Y galvanometer 4 is set to scan in the Y direction, and the X galvanometer 7 is set to scan in the X direction.

[0065] Since the center of the Y galvanometer 4 and the center of the X galvanometer 7 are respectively located at twice the object-side focal length and the image-side focal length of the doublet lens 2, the Y galvanometer 4 and the X galvanometer 7 have an inverted and equal-sized object-image conjugate relationship. When the Y galvanometer 4 and the X galvanometer 7 scan at different angles respectively, there is a fixed point of the light beam at the X galvanometer 7, which reduces the asymmetric aberration to a certain extent.

[0066] Comparative Example 1

[0067] To further demonstrate the writing performance of the high-speed three-dimensional lithography system described in the present invention in a single writing field, the scanning performance differences of the traditional orthogonal dual-galvanometer scanning module in a single writing field were analyzed through ZEMAX simulation, as Figure 5 shown. With the help of ZEMAX simulation software, the wavefront diffraction effect was directly simulated by the Huygens sub-wave integral method, and the Huygens FSF diffraction patterns of the present invention and the traditional orthogonal dual-galvanometer scanning module at various scanning angles were compared. In the simulation analysis, except for the different scanning modules, the other condition parameters were the same.

[0068] In the ZEMAX software, scanning modules as shown in Figure 2 and Figure 5 were respectively constructed. The light source was set as a Gaussian light source with a width of 3 mm and a tapering factor of 1. Different from Embodiment 1, after the light beam in Comparative Example 1 is incident on the Y galvanometer 4 at an angle of 45°, it does not pass through the scanning mirror group but is directly incident on the X galvanometer 7 at an angle of 45°. The Y galvanometer 4 and the X galvanometer 7 are orthogonal to each other in position. The Y galvanometer 4 is set to scan in the Y direction, and the X galvanometer 7 is set to scan in the X direction.

[0069] Set Figure 2 、 Figure 5 The sizes of the galvanometers in the scanning module are both 5 mm target surfaces. Set Figure 5 The distance between the centers of the two galvanometers in is 5 mm to minimize the aberration of the traditional dual-galvanometer scanning mirror system in Comparative Example 1.

[0070] After Figure 2 , Figure 5 the scanning module shown, as described in Embodiment 1, a scanning mirror, a field lens, and a paraxial plane are added in zemax software respectively to simulate a perfect objective lens, where the X galvanometer 7, the scanning mirror, the field lens, and the entrance pupil of the objective lens form a 4f system. Here, the focal length of the paraxial plane is set to 3.6 mm, and the image plane is located at the paraxial image point.

[0071] Control Figure 2 , Figure 3 the mechanical deflection angles of the two galvanometers in the scanning module shown, and respectively make the two galvanometers scan according to the mechanical deflection angles of 0°, 1°, 2°, 3°, 4°, 4.5°, corresponding to the beam deflection angles of 0°, 2°, 4°, 6°, 8°, 9°, and observe whether the Huygens RSF pattern is uniform. The comparison results between Embodiment 1 and Comparative Example 1 are as Figure 6 , Figure 7 shown. It can be seen that the scanning module described in the present invention scans within the mechanical deflection angle of the galvanometer of ±4°, and the Huygens RSF pattern is relatively uniform with small aberration. However, due to its structural characteristics, the traditional orthogonal double-galvanometer scanning module shows obvious asymmetric aberration in the Huygens RSF pattern, and with the increase of the scanning angle, the scanning distortion is more serious, which greatly limits the effective scanning angle and processing speed of the traditional double-galvanometer scanning module, and also increases the difficulty of subsequent aberration correction.

[0072] The above are only specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent replacements, or modifications made based on the present invention to solve basically the same technical problems and achieve basically the same technical effects are all covered by the protection scope of the present invention.

Claims

1. A high-speed three-dimensional lithography system for photonic wire bonding, characterized in that: It includes a laser, a beam expansion and shaping module, a dynamic focusing module, a dual-galvanometer scanning module and a processing monitoring module. The light beam emitted by the laser first passes through the beam expansion and shaping module for beam expansion and shaping, and then enters the dynamic focusing module for variable focusing. The focused light beam passes through the conjugate orthogonal dual-galvanometer scanning module to eliminate the vignetting effect, and enters the processing monitoring module to form a writing field for photolithography on the sample.

2. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 1, characterized in that: The beam expansion and shaping module comprises a beam expansion mirror group, and a small hole is arranged at the center of the beam expansion mirror group for spatial filtering.

3. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 1, characterized in that: The dynamic focusing module includes at least two lenses and an axial motor, wherein one of the lenses is fixed to the axial motor for compensating the focal length, the axial motor moves along the Z axis, and the other lenses are fixed in position.

4. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 3, characterized in that: The dynamic focusing module is composed of a dynamic focusing lens group consisting of a negative lens and a positive lens, and the change in focus position and the change in the distance between the negative lens and the positive lens satisfy the following relationship: Among them, Δs is the position change of the focus, Δd is the position change between the negative lens and the positive lens, f1 is the focal length of the negative lens, f2 is the focal length of the positive lens, d is the initial distance between the negative lens and the positive lens, and f′ is the equivalent focal length.

5. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 1, characterized in that: The dual-galvanometer scanning module includes an X-galvanometer, a first scanning mirror, a second scanning mirror and a Y-galvanometer. The focused light beam passes through the X-galvanometer and is conjugate imaged to the Y-galvanometer by the first scanning mirror and the second scanning mirror to form a 4f imaging system. The first scanning mirror and the second scanning mirror form a double Gaussian structure, and the first scanning mirror and the second scanning mirror are the same scanning mirrors.

6. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 5, characterized in that: The processing monitoring module includes a third scanning mirror, a field lens and an objective lens. The third scanning mirror and the field lens constitute a 4f imaging system, and the light of the Y galvanometer mirror and the entrance pupil of the objective lens form an imaging relationship.

7. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 6, characterized in that: The write field size is The corresponding relationship between the scanning angle of the dual-mirror scanning module and the writing coordinates is: Wherein, W represents the side length of the writing field, y′ represents the height of the intermediate image plane in front of the field lens, β represents the actual magnification of the objective lens, and f s represents the focal length of the first scanning mirror, f o represents the focal length of the objective lens, θ max represents the maximum scanning angle supported by the first scanning mirror, f t represents the focal length of the field lens, represents the deflection angle of the light in the X direction after the X-galvanometer, represents the deflection angle of the light in the Y direction after the Y galvanometer, θ Gx Indicates the mechanical deflection angle of the X-mirror, θ Gy Indicates the mechanical deflection angle of the Y galvanometer; In order to ensure the photolithography processing quality of the entire writing field, the following relationship must be satisfied:

1. 2.i ray =2θ G ≤θ max ; Where FN is the field number of the objective lens, θ G is the mechanical deflection angle of the X galvanometer / the Y galvanometer.

8. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 1, characterized in that: The dual-galvanometer scanning module includes a first concave mirror, a Y galvanometer, a second concave mirror and an X galvanometer. The focused light beam is reflected to the center of the X galvanometer through the first concave mirror. The distance from the center of the first concave mirror to the center of the Y galvanometer is half of the focal length of the first concave mirror. The Y galvanometer reflects the light beam to the center of the second concave mirror. The distance from the center of the Y galvanometer to the center of the second concave mirror is twice the focal length of the second concave mirror. The second concave mirror reflects the light beam to the center of the X galvanometer. The distance from the center of the second concave mirror to the center of the X galvanometer is twice the focal length of the second concave mirror. The Y galvanometer and the X galvanometer are orthogonal to each other in position, and the Y galvanometer and the X galvanometer have an object-image conjugate relationship.

9. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 1, characterized in that: The dual-galvanometer scanning module includes a Y galvanometer, a double-glued lens and an X galvanometer. The focused light beam is incident on the center of the X galvanometer. The X galvanometer vertically incidents the reflected light on the center of the double-glued lens. The processing light beam is incident on the center of the X galvanometer after passing through the double-glued lens. The center of the X galvanometer is located at the rear focus of the double-glued lens. The Y galvanometer and the X galvanometer have an object-image conjugate relationship.

10. A high-speed three-dimensional lithography system for photonic wire bonding according to claim 1, characterized in that: The processing monitoring module also includes a dichroic mirror, a high-power oil immersion objective lens, a focusing lens and a camera. The parallel light beam passing through the field lens is reflected by the dichroic mirror and enters the high-power oil immersion objective lens, and the distance from the field lens to the entrance pupil of the objective lens is equal to the back focal length of the field lens. The light beam is focused by the high-power oil immersion objective lens onto the surface of the sample spin-coated with a photoresist supporting the two-photon polymerization effect, and is observed as reflected light reaching the camera through the focusing lens.

Images