Manufacturing method and system for adding patch magnetic ring patch cap

Abstract

The invention relates to the field of material science, and discloses a manufacturing method of a patch cap added with a patch magnetic ring, which comprises the following steps of: analyzing a connection coefficient of a base connected with the magnetic ring, and establishing a magnetic ring three-dimensional model of the base connected with the magnetic ring; extracting vertex characterization of the base connection magnet ring, defining a magnet ring patch cap pattern of the base connection magnet ring, and establishing a patch cap three-dimensional model of the base connection magnet ring; coupling the magnetic ring three-dimensional model and the patch cap three-dimensional model to obtain a patch cap magnetic ring model, extracting patch cap plane parameters of the patch cap magnetic ring model, calculating plane flatness of the patch cap magnetic ring model, and performing structure optimization on the patch cap magnetic ring model to obtain an optimized patch cap magnetic ring model; and analyzing a compatibility coefficient of the patch cap magnet ring model, constructing a finished patch cap of the base connection magnet ring, and combining the finished patch cap with the base connection magnet ring to obtain a finished patch cap magnet ring. The surface mounting quality of the cap magnet ring can be improved.

Description

Technical Field

[0001] The present invention relates to a manufacturing method and system for adding a patch cap to a patch magnetic ring, belonging to the field of materials science. Background Art

[0002] The patch cap of the patch magnetic ring refers to a cap that realizes the automatic patching of the magnetic ring. Through the patch cap of the magnetic ring, the client can perform automatic patching, which can effectively save the client's labor cost to the greatest extent and reduce the defective rate of the client, thereby improving the competitiveness of the client's products and striving for a larger market share.

[0003] The traditional method of the patch cap of the patch magnetic ring is to mold an integral outer shell, put the wound magnetic ring into the outer shell, and then fix it with glue to achieve rapid patching. This method has complex mold opening operation of the outer shell and more difficult assembly, and is prone to deviation, resulting in a high defective rate of the patch cap of the magnetic ring. Summary of the Invention

[0004] The present invention provides a manufacturing method and system for adding a patch cap to a patch magnetic ring, and its main purpose is to improve the patching quality of the capped magnetic ring.

[0005] To achieve the above object, a manufacturing method for adding a patch cap to a patch magnetic ring provided by the present invention includes:

[0006] Obtain a magnetic ring image of the wound magnetic ring, analyze the characteristics of the wound magnetic ring based on the magnetic ring image, and define the connection parameters between the wound magnetic ring and a preset magnetic ring base according to the characteristics of the wound magnetic ring;

[0007] Connect the wound magnetic ring and the magnetic ring base based on the connection parameters to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and establish a three-dimensional magnetic ring model of the base-connected magnetic ring when the connection coefficient meets a preset connection threshold;

[0008] Extract the vertex representation of the base-connected magnetic ring based on the three-dimensional magnetic ring model, where the vertex representation includes the magnetic size, the size of the middle hole, and the depth of the middle hole. Define the patch cap pattern of the base-connected magnetic ring according to the vertex representation, and establish a three-dimensional patch cap model of the base-connected magnetic ring through the patch cap pattern;

[0009] In a preset simulation environment, couple the three-dimensional magnetic ring model and the three-dimensional patch cap model to obtain a patch cap magnetic ring model, extract the patch cap plane parameters of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the patch cap plane parameters, and optimize the structure of the patch cap magnetic ring model through the plane flatness to obtain an optimized patch cap magnetic ring model;

[0010] Analyze the compatibility coefficient of the patch cap magnetic ring model using a preset magnetic ring compatibility algorithm. When the compatibility coefficient meets the preset compatibility standard, construct the finished patch cap of the base-connected magnetic ring, and combine the finished patch cap and the base-connected magnetic ring to obtain the finished patch cap magnetic ring.

[0011] Optionally, analyzing the winding magnetic ring characteristics of the winding magnetic ring based on the magnetic ring image includes:

[0012] Preprocess the magnetic ring image to obtain a preprocessed magnetic ring image;

[0013] Extract the magnetic ring winding contour of the preprocessed magnetic ring image;

[0014] According to the magnetic ring winding contour, extract the magnetic ring winding area of the preprocessed magnetic ring image;

[0015] Extract the circular closed contour and geometric structure of the magnetic ring winding area;

[0016] Based on the circular closed contour, determine the number of turns of the winding magnetic ring;

[0017] Calculate the wire diameter and winding density of the magnetic ring winding area;

[0018] Combine the number of turns, the wire diameter, the winding density, and the geometric structure to determine the winding magnetic ring characteristics of the winding magnetic ring.

[0019] Optionally, defining the connection parameters of the winding magnetic ring and a preset magnetic ring base according to the winding magnetic ring characteristics includes:

[0020] Analyze the electromagnetic performance of the winding magnetic ring according to the winding magnetic ring characteristics;

[0021] Determine the application requirements of the winding magnetic ring;

[0022] Based on the application requirements and the electromagnetic performance, analyze the base performance indicators of the magnetic ring base;

[0023] When the base performance indicators meet the preset base performance threshold, mark the connection surface of the magnetic ring base;

[0024] Identify the flatness, roughness, and fit tolerance of the connection surface;

[0025] Combine the application requirements, the electromagnetic performance, the flatness, the roughness, and the fit tolerance to define the connection parameters of the connection points.

[0026] Optionally, analyzing the electromagnetic performance of the wound magnetic ring according to the characteristics of the wound magnetic ring includes:

[0027] Calculating the inductance of the wound magnetic ring according to the characteristics of the wound magnetic ring by using the following formula:

[0028]

[0029] where L represents the inductance of the wound magnetic ring, μ n represents the permeability of free space, N represents the number of turns of the winding in the characteristics of the wound magnetic ring, l represents the effective length of the magnetic ring in the characteristics of the wound magnetic ring, r represents the average radius in the characteristics of the wound magnetic ring, and π represents the circumference ratio;

[0030] Marking the current frequency and the skin effect correction coefficient of the wound magnetic ring based on the characteristics of the wound magnetic ring;

[0031] And calculating the AC resistance of the wound magnetic ring through the current frequency and the skin effect correction coefficient:

[0032] Calculating the quality factor of the wound magnetic ring through the inductance and the AC resistance;

[0033] Analyzing the electromagnetic performance of the wound magnetic ring by combining the inductance, the AC resistance and the quality factor.

[0034] Optionally, calculating the AC resistance of the wound magnetic ring through the current frequency and the skin effect correction coefficient includes:

[0035] Calculating the DC resistance of the wound magnetic ring;

[0036] Calculating the AC resistance of the wound magnetic ring according to the DC resistance, the current frequency and the skin effect correction coefficient by using the following formula:

[0037]

[0038] where R ac represents the AC resistance of the wound magnetic ring, R dc represents the DC resistance of the wound magnetic ring, f represents the current frequency, and K c represents the skin effect correction coefficient.

[0039] Optionally, when the connection coefficient meets the preset connection threshold, establishing the three-dimensional model of the magnetic ring of the base connection magnetic ring includes:

[0040] When the connection coefficient meets the preset connection threshold, establishing a three-dimensional coordinate system of the magnetic ring of the base connection magnetic ring, and collecting the spatial data of the magnetic ring of the base connection magnetic ring based on the three-dimensional coordinate system;

[0041] Analyze the spatial data attributes of the spatial data;

[0042] Generate a measurement view of the base connection magnetic ring according to the spatial data attributes;

[0043] Mark the Figure 3 view coordinates of the measurement view;

[0044] According to the Figure 3 view coordinates, construct a three-dimensional coordinate map of the base connection magnetic ring;

[0045] Based on the three-dimensional coordinate map, establish a three-dimensional magnetic ring model of the base connection magnetic ring.

[0046] Optionally, the establishing the three-dimensional magnetic ring model of the base connection magnetic ring based on the three-dimensional coordinate map includes:

[0047] Identify the three-dimensional magnetic ring nodes of the base connection magnetic ring;

[0048] According to the three-dimensional coordinate map, use the following formula to calculate the three-dimensional node coordinates of the magnetic ring three-dimensional nodes:

[0049]

[0050] where Q(X i , Y i ) represents the three-dimensional node coordinates of the i-th three-dimensional node, X i represents the i-th abscissa of the three-dimensional node coordinates, Y i represents the i-th ordinate of the three-dimensional node coordinates, E represents the three-dimensional coordinate map, S i represents the i-th three-dimensional node, b represents the number of three-dimensional nodes, and σ represents the three-dimensional coordinate system of the base connection magnetic ring:

[0051] Based on the three-dimensional node coordinates, construct the three-dimensional pose of the base connection magnetic ring;

[0052] Through the three-dimensional pose, establish the three-dimensional magnetic ring model of the base connection magnetic ring.

[0053] Optionally, the coupling the three-dimensional magnetic ring model and the patch cap three-dimensional model in a preset simulation environment to obtain a patch cap magnetic ring model includes:

[0054] Integrate the three-dimensional magnetic ring model and the patch cap three-dimensional model into the simulation environment, and analyze the integrity of the three-dimensional magnetic ring model and the integrity of the cap three-dimensional model of the three-dimensional magnetic ring model and the patch cap three-dimensional model;

[0055] When the integrity of the magnetic ring three-dimensional model and the integrity of the patch cap three-dimensional model meet the preset integrity thresholds of the magnetic ring three-dimensional model and the patch cap three-dimensional model, define the coupling interface and coupling parameters of the magnetic ring three-dimensional model and the patch cap three-dimensional model;

[0056] Mesh the magnetic ring three-dimensional model and the patch cap three-dimensional model to obtain a magnetic ring mesh model and a patch cap mesh model;

[0057] Calculate the mesh density of the magnetic ring mesh model and the patch cap mesh model at the coupling interface;

[0058] When the mesh density meets the preset mesh density threshold, use the coupling interface and the coupling parameters to couple the magnetic ring mesh model and the patch cap mesh model to obtain the patch cap magnetic ring model.

[0059] Optionally, the analysis of the compatibility coefficient of the patch cap magnetic ring model using the preset magnetic ring compatibility algorithm includes:

[0060] Define the compatibility requirements of the patch cap magnetic ring model;

[0061] Collect the compatibility data of the patch cap magnetic ring model;

[0062] According to the compatibility requirements, define the compatibility algorithm parameters of the magnetic ring compatibility algorithm;

[0063] Based on the compatibility algorithm parameters and the compatibility data, use the magnetic ring compatibility algorithm to analyze the compatibility index of the patch cap magnetic ring model;

[0064] Define the compatibility weight of the compatibility index, and determine the compatibility coefficient of the patch cap magnetic ring model through the compatibility weight.

[0065] To solve the above problems, the present invention also provides a manufacturing system for adding a patch magnetic ring and a patch cap, the system includes:

[0066] A winding magnetic ring connection module, configured to obtain a magnetic ring image of the winding magnetic ring, analyze the winding magnetic ring characteristics of the winding magnetic ring based on the magnetic ring image, and define the connection parameters between the winding magnetic ring and a preset magnetic ring base according to the winding magnetic ring characteristics;

[0067] A magnetic ring three-dimensional model construction module, configured to connect the winding magnetic ring and the magnetic ring base based on the connection parameters to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and establish a magnetic ring three-dimensional model of the base-connected magnetic ring when the connection coefficient meets the preset connection threshold;

[0068] The cap three-dimensional model construction module is used to extract the vertex characterization of the base-connected magnetic ring based on the three-dimensional magnetic ring model, where the vertex characterization includes magnetic size, central hole size, and central hole depth. According to the vertex characterization, the magnetic ring patch cap pattern of the base-connected magnetic ring is defined, and through the magnetic ring patch cap pattern, the patch cap three-dimensional model of the base-connected magnetic ring is established;

[0069] The cap magnetic ring model optimization module is used to couple the three-dimensional magnetic ring model and the patch cap three-dimensional model in a preset simulation environment to obtain a patch cap magnetic ring model, extract the patch cap plane parameters of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the patch cap plane parameters, and optimize the structure of the patch cap magnetic ring model through the plane flatness to obtain an optimized patch cap magnetic ring model;

[0070] The patch cap preparation module is used to analyze the compatibility coefficient of the patch cap magnetic ring model by using a preset magnetic ring compatibility algorithm. When the compatibility coefficient meets the preset compatibility standard, the finished patch cap of the base-connected magnetic ring is constructed, and the finished patch cap and the base-connected magnetic ring are combined to obtain a finished patch cap magnetic ring.

[0071] To solve the above problems, the present invention also provides an electronic device, which includes:

[0072] At least one processor; and,

[0073] A memory communicatively connected to the at least one processor; wherein,

[0074] The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to implement the above-mentioned method for manufacturing an increased patch magnetic ring patch cap.

[0075] To solve the above problems, the present invention also provides a computer-readable storage medium, in which at least one instruction is stored, and the at least one instruction is executed by a processor in an electronic device to implement the above-mentioned method for manufacturing an increased patch magnetic ring patch cap.

[0076] Compared with the problems described in the background art, firstly, the present invention ensures the precise connection between the winding magnetic ring and the magnetic ring base, improving the assembly quality and reliability of the product. Moreover, through the extraction of vertex characterization and the definition of the magnetic ring patch cap pattern, the perfect matching between the magnetic ring and the cap is achieved, enhancing the stability and aesthetics of the overall structure. At the same time, the coupling analysis and structural optimization in the simulation environment significantly improve the planar flatness of the patch cap magnetic ring model, thereby enhancing the electromagnetic compatibility, reducing electromagnetic interference, and improving the performance of the product. Finally, through the analysis of the magnetic ring compatibility algorithm, it is ensured that the compatibility coefficient of the finished patch cap magnetic ring reaches the preset standard, which not only enhances the market competitiveness of the product but also provides customers with a higher-performance, more reliable, and more beautiful magnetic ring solution, greatly enhancing the user experience. Therefore, the present invention can improve the patching quality of the cap magnetic ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Figure 1 FIG. is a schematic flowchart of a method for manufacturing an additional patch magnetic ring patch cap provided by an embodiment of the present invention;

[0078] Figure 2 FIG. is a functional module diagram of a manufacturing system for an additional patch magnetic ring patch cap provided by an embodiment of the present invention;

[0079] Figure 3 FIG. is a schematic structural diagram of an electronic device of a manufacturing system for an additional patch magnetic ring patch cap provided by an embodiment of the present invention;

[0080] The implementation, functional features, and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0081] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0082] An embodiment of the present application provides a method for manufacturing an additional patch magnetic ring patch cap. The execution subject of the method for manufacturing the additional patch magnetic ring patch cap includes, but is not limited to, at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present application. In other words, the method for manufacturing the additional patch magnetic ring patch cap can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to: a single server, a server cluster, a cloud server, or a cloud server cluster, etc.

[0083] Embodiment 1:

[0084] Referring to Figure 1 as shown, it is a schematic flowchart of a method for manufacturing an additional patch magnetic ring patch cap provided by an embodiment of the present invention. In this embodiment, the method for manufacturing the additional patch magnetic ring patch cap includes:

[0085] S1. Obtain the magnetic ring image of the wound magnetic ring. Based on the magnetic ring image, analyze the characteristics of the wound magnetic ring, and define the connection parameters between the wound magnetic ring and a preset magnetic ring base according to the characteristics of the wound magnetic ring.

[0086] It should be explained that the wound magnetic ring refers to an electromagnetic component, usually made of a magnetic material (such as ferrite), with a coil (wire) wound thereon. The magnetic ring image refers to the visual representation of the wound magnetic ring, usually obtained by photography or scanning.

[0087] Based on the magnetic ring image, the present invention analyzes the characteristics of the wound magnetic ring, which can provide a data basis for the subsequent connection of the magnetic ring.

[0088] Specifically, the analysis of the characteristics of the wound magnetic ring based on the magnetic ring image includes:

[0089] Preprocess the magnetic ring image to obtain a preprocessed magnetic ring image;

[0090] Extract the magnetic ring winding contour of the preprocessed magnetic ring image;

[0091] According to the magnetic ring winding contour, extract the magnetic ring winding area of the preprocessed magnetic ring image;

[0092] Extract the circular closed contour and geometric structure of the magnetic ring winding area;

[0093] Based on the circular closed contour, determine the number of turns of the winding of the wound magnetic ring;

[0094] Calculate the wire diameter and winding density of the magnetic ring winding area;

[0095] Combine the number of turns of the winding, the wire diameter, the winding density, and the geometric structure to determine the characteristics of the wound magnetic ring.

[0096] Among them, the preprocessed magnetic ring image refers to the magnetic ring image optimized through a series of image processing steps (such as grayscale conversion, denoising, contrast enhancement, edge detection, etc.). The magnetic ring winding contour refers to the boundary between the winding and the background identified through edge detection or other image segmentation techniques in the preprocessed magnetic ring image. The magnetic ring winding region refers to the region in the image defined by the winding contour. The circular closed contour refers to the complete circular contour identified in the magnetic ring winding region. The geometric structure refers to the spatial arrangement and shape of the winding in the magnetic ring winding region. The number of winding turns refers to the total number of turns of the winding on the magnetic ring. The wire diameter refers to the diameter of the wire used for the winding. The winding density refers to the total amount of winding per unit area. The winding magnetic ring characteristics refer to the set of all relevant parameters and attributes extracted from the preprocessed magnetic ring image, including parameters such as the number of winding turns, wire diameter, winding density, and geometric structure.

[0097] Optionally, the circular closed contour and geometric structure of the magnetic ring winding region can be extracted by fitting a circle using the least squares method.

[0098] According to the winding magnetic ring characteristics of the present invention, defining the connection parameters between the winding magnetic ring and the preset magnetic ring base can ensure that the connection between the winding magnetic ring and the magnetic ring base not only meets the electrical performance requirements but also has good mechanical stability and reliability.

[0099] Specifically, defining the connection parameters between the winding magnetic ring and the preset magnetic ring base according to the winding magnetic ring characteristics includes:

[0100] Analyze the electromagnetic performance of the winding magnetic ring according to the winding magnetic ring characteristics;

[0101] Determine the application requirements of the winding magnetic ring;

[0102] Based on the application requirements and the electromagnetic performance, analyze the base performance indicators of the magnetic ring base;

[0103] When the base performance indicators meet the preset base performance threshold, mark the connection surface of the magnetic ring base;

[0104] Identify the flatness, roughness, and fit tolerance of the connection surface;

[0105] Combined with the application requirements, the electromagnetic performance, the flatness, the roughness, and the fit tolerance, define the connection parameters of the connection points.

[0106] Among them, the electromagnetic properties refer to the behavior and performance of the wound magnetic ring in the electromagnetic field, including but not limited to inductance, resistance, quality factor (Q factor), and the application requirements refer to the functional requirements of the wound magnetic ring in specific applications, including operating frequency, operating temperature, environmental conditions, electrical specifications, mechanical strength, reliability, cost limitations, etc. The base performance indicators

[0107] refer to the performance standards that the magnetic ring base must meet, including the stability of electrical connection, the strength of mechanical structure, heat management ability, corrosion resistance, vibration resistance, etc. The base performance threshold refers to the minimum standard that the base performance indicators must reach in order to meet the application requirements. The connection surface refers to the area where the magnetic ring contacts the base, used to achieve electrical and mechanical connections. The flatness refers to the flatness of the connection surface, and the roughness refers to the microscopic unevenness of the connection surface. The fit tolerance refers to the allowable deviation range of the connection surface size and shape. The connection parameters refer to the specific parameters that define the design and manufacture of the connection points, including connection methods (such as welding, bonding, mechanical fixing), types of connection materials, connection dimensions, tightening torque, electrical contact area, etc. parameters.

[0108] Furthermore, according to the characteristics of the wound magnetic ring, analyze the electromagnetic properties of the wound magnetic ring, including:[[]]

[0109] According to the characteristics of the wound magnetic ring, calculate the inductance of the wound magnetic ring using the following formula:[[]]

[0110]

[0111] where L represents the inductance of the wound magnetic ring, μ n represents the permeability of free space, N represents the number of turns of the winding in the characteristics of the wound magnetic ring, l represents the effective length of the magnetic ring in the characteristics of the wound magnetic ring, r represents the average radius in the characteristics of the wound magnetic ring, and π represents the circumference ratio;

[0112] Based on the characteristics of the wound magnetic ring, mark the current frequency and skin effect correction factor of the wound magnetic ring;

[0113] And calculate the AC resistance of the wound magnetic ring through the current frequency and skin effect correction factor;

[0114] Calculate the quality factor of the wound magnetic ring through the inductance and the AC resistance;

[0115] Combining the inductance, the AC resistance, and the quality factor, analyze the electromagnetic properties of the wound magnetic ring.

[0116] Among them, the inductance is a physical quantity that measures the ability of the wound magnetic ring to store magnetic field energy. The vacuum permeability is a constant that represents the propagation ability of the magnetic field in a vacuum. The number of turns of the winding is the total number of turns of the wire on the wound magnetic ring. The effective length of the magnetic ring is the magnetic path length of the magnetic ring. The average radius is the radius of the wound magnetic ring. The current frequency is the frequency of the alternating current passing through the wound magnetic ring. The skin effect correction factor is a factor used to correct the non-uniform distribution of current on the surface of the wire caused by high-frequency current. The alternating current resistance is the actual resistance value of the wire of the wound magnetic ring under high-frequency conditions due to the skin effect and proximity effect. The quality factor is a parameter that measures the energy storage efficiency of the wound magnetic ring. The electromagnetic performance is the comprehensive performance of parameters such as the inductance, resistance, and quality factor of the wound magnetic ring.

[0117] Furthermore, calculating the alternating current resistance of the wound magnetic ring through the current frequency and the skin effect correction factor includes:

[0118] Calculating the direct current resistance of the wound magnetic ring;

[0119] According to the direct current resistance, the current frequency, and the skin effect correction factor, use the following formula to calculate the alternating current resistance of the wound magnetic ring:

[0120]

[0121] Among them, R ac represents the alternating current resistance of the wound magnetic ring, R dc represents the direct current resistance of the wound magnetic ring, f represents the current frequency, and K c represents the skin effect correction factor.

[0122] Among them, the direct current resistance refers to the resistance value of the wire of the wound magnetic ring in the absence of the skin effect and proximity effect.

[0123] S2. Based on the connection parameters, connect the wound magnetic ring and the magnetic ring base to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and when the connection coefficient meets the preset connection threshold, establish a three-dimensional magnetic ring model of the base-connected magnetic ring.

[0124] It should be explained that the base-connected magnetic ring refers to the connected magnetic ring obtained by connecting the wound magnetic ring and the magnetic ring base according to the connection parameters.

[0125] The present invention analyzes the connection coefficient of the base-connected magnetic ring, which can provide a basis for later process optimization. Among them, the connection coefficient refers to the stability degree of the connection between the wound magnetic ring and the magnetic ring base.

[0126] Optionally, when the connection coefficient meets the preset connection threshold, establishing the three-dimensional model of the magnetic ring of the base connection magnetic ring can analyze the structure of the base connection magnetic ring and provide a basis for the later design of the patch cap structure.

[0127] Specifically, when the connection coefficient meets the preset connection threshold, establishing the three-dimensional model of the magnetic ring of the base connection magnetic ring includes:

[0128] When the connection coefficient meets the preset connection threshold, establish the three-dimensional coordinate system of the base connection magnetic ring, and based on the three-dimensional coordinate system, collect the spatial data of the base connection magnetic ring;

[0129] Analyze the spatial data attributes of the spatial data;

[0130] According to the spatial data attributes, generate the measurement view of the base connection magnetic ring;

[0131] Mark the Figure 3 dimensional coordinates of the measurement view;

[0132] According to the Figure 3 dimensional coordinates, construct the three-dimensional coordinate diagram of the base connection magnetic ring;

[0133] Based on the three-dimensional coordinate diagram, establish the three-dimensional model of the magnetic ring of the base connection magnetic ring.

[0134] Among them, the connection threshold is a parameter standard set in the design process for evaluating the connection quality between the magnetic ring and the base. The three-dimensional coordinate system is a system used to define and describe the position of points in three-dimensional space. The spatial data is information describing the position, shape, size, and attributes of a three-dimensional object (in this case, the base connection magnetic ring) in three-dimensional space. The spatial data attributes are the characteristics of the spatial data, such as geometric attributes (length, width, height), topological attributes (connection relationship, adjacent relationship), and physical attributes (material, color, weight). The measurement view is an image of the model captured from a specific angle or viewpoint for analysis and measurement. The Figure 3 dimensional coordinates are the three-dimensional coordinate positions of the points marked in the measurement view. The three-dimensional coordinate diagram is a graphical representation showing the coordinate positions of all measurement points in three-dimensional space. The three-dimensional model of the magnetic ring is a virtual three-dimensional representation that precisely simulates the structure, shape, and function of the actual magnetic ring and base connection.

[0135] Furthermore, based on the three-dimensional coordinate diagram, establishing the three-dimensional model of the magnetic ring of the base connection magnetic ring includes:

[0136] Identify the three-dimensional nodes of the magnetic ring of the base connection magnetic ring;

[0137] According to the three-dimensional coordinate diagram, use the following formula to calculate the three-dimensional node coordinates of the three-dimensional nodes of the magnetic ring:

[0138]

[0139] where Q(X i , Y i ) represents the three-dimensional node coordinates of the i-th three-dimensional node, X i represents the i-th abscissa of the three-dimensional node coordinates, Y i represents the i-th ordinate of the three-dimensional node coordinates, E represents the three-dimensional coordinate diagram, S i represents the i-th three-dimensional node, b represents the number of three-dimensional nodes, and σ represents the three-dimensional coordinate system connecting the magnetic ring to the base:

[0140] Based on the three-dimensional node coordinates, construct the three-dimensional pose of the base-connected magnetic ring;

[0141] Through the three-dimensional pose, establish the three-dimensional magnetic ring model of the base-connected magnetic ring.

[0142] Among them, the three-dimensional nodes of the magnetic ring refer to specific points in the three-dimensional magnetic ring model, and these points can be geometric key points of the magnetic ring, such as vertices, center points, intersection points, or key positions of winding. The three-dimensional node coordinates refer to the positions of the three-dimensional nodes of the magnetic ring in the three-dimensional coordinate system, and the three-dimensional pose refers to the position and direction of an object in three-dimensional space.

[0143] S3. Based on the three-dimensional magnetic ring model, extract the vertex characteristics of the base-connected magnetic ring. Among them, the vertex characteristics include magnetic size, central hole size, and central hole depth. According to the vertex characteristics, define the magnetic ring patch cap pattern of the base-connected magnetic ring, and through the magnetic ring patch cap pattern, establish the three-dimensional patch cap model of the base-connected magnetic ring.

[0144] Based on the three-dimensional magnetic ring model of the present invention, extracting the vertex characteristics of the base-connected magnetic ring can provide a data basis for the connection of the later patch cap. Among them, the magnetic size refers to the physical size of the magnetic ring, which includes the outer diameter, inner diameter, height (or thickness), etc. of the magnetic ring. The central hole size refers to the diameter of the central hole of the magnetic ring, and the central hole depth refers to the depth of the central hole of the magnetic ring.

[0145] Optionally, according to the vertex representation, the present invention can define the pattern of the magnetic ring patch cap for connecting the base to the magnetic ring, which can define the pattern of the magnetic ring patch cap and provide accurate guidance for the manufacturing process. Wherein, the pattern of the magnetic ring patch cap refers to the detailed design drawing for manufacturing the top covering of the magnetic ring, including: geometric shape, dimensions and tolerances, material specifications, connection and fixing methods. The three-dimensional model of the patch cap refers to a virtual three-dimensional representation that precisely simulates the structure, shape, and function of the patch cap for connecting the base to the magnetic ring.

[0146] S4. In a preset simulation environment, couple the three-dimensional model of the magnetic ring and the three-dimensional model of the patch cap to obtain a patch cap magnetic ring model, extract the plane parameters of the patch cap of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the plane parameters of the patch cap, and optimize the structure of the patch cap magnetic ring model through the plane flatness to obtain an optimized patch cap magnetic ring model.

[0147] In a preset simulation environment, the present invention couples the three-dimensional model of the magnetic ring and the three-dimensional model of the patch cap to obtain a patch cap magnetic ring model, which can realize the coupled simulation of the magnetic ring and the patch cap model, and thus obtain the detailed simulation results of the patch cap magnetic ring model.

[0148] Specifically, the step of coupling the three-dimensional model of the magnetic ring and the three-dimensional model of the patch cap in a preset simulation environment to obtain a patch cap magnetic ring model includes:

[0149] Integrate the three-dimensional model of the magnetic ring and the three-dimensional model of the patch cap into the simulation environment, and analyze the integrity of the three-dimensional model of the magnetic ring and the integrity of the three-dimensional model of the patch cap;

[0150] When the integrity of the three-dimensional model of the magnetic ring and the integrity of the three-dimensional model of the patch cap meet the preset complete thresholds of the three-dimensional model of the magnetic ring and the complete threshold of the three-dimensional model of the patch cap, define the coupling interface and coupling parameters of the three-dimensional model of the magnetic ring and the three-dimensional model of the patch cap;

[0151] Mesh the three-dimensional model of the magnetic ring and the three-dimensional model of the patch cap to obtain a magnetic ring mesh model and a patch cap mesh model;

[0152] Calculate the mesh density of the magnetic ring mesh model and the patch cap mesh model at the coupling interface;

[0153] When the mesh density meets the preset mesh density threshold, use the coupling interface and the coupling parameters to couple the magnetic ring mesh model and the patch cap mesh model to obtain the patch cap magnetic ring model.

[0154] Among them, the integrity of the magnetic ring three-dimensional model refers to the accuracy and consistency of the magnetic ring three-dimensional model in terms of geometry, topology, and attributes. The integrity of the cap three-dimensional model refers to the accuracy and consistency of the patch cap three-dimensional model in terms of geometry, topology, and attributes. The complete threshold of the magnetic ring three-dimensional model refers to a preset standard or limit value used to determine whether the integrity of the magnetic ring three-dimensional model is acceptable. The complete threshold of the cap three-dimensional model refers to a preset standard or limit value used to judge the integrity of the cap three-dimensional model. The coupling interface refers to the area where the magnetic ring and the patch cap models are interconnected in the simulation environment. The coupling parameter refers to a parameter used to describe the interaction characteristics between the magnetic ring and the patch cap at the coupling interface, such as parameters like fixed points and fixing methods. The magnetic ring mesh model refers to the form in which the three-dimensional model of the magnetic ring is discretized into mesh elements (such as tetrahedrons, hexahedrons, etc.). The patch cap mesh model refers to the form in which the three-dimensional model of the cap is discretized into mesh elements. The mesh density refers to the density of mesh elements in the simulation model. The mesh density threshold is a preset standard or limit value used to determine whether the mesh density is sufficient for accurate simulation analysis. The patch cap magnetic ring model refers to a complete simulation model obtained by integrating the magnetic ring mesh model and the patch cap mesh model through the coupling interface and coupling parameters.

[0155] Optionally, integrating the magnetic ring three-dimensional model and the patch cap three-dimensional model into the simulation environment can utilize simulation software such as ANSYS, COMSOL Multiphysics, or CST Studio Suite.

[0156] Optionally, calculating the mesh density of the magnetic ring mesh model and the patch cap mesh model at the coupling interface can be measured by calculating the number of meshes.

[0157] In the present invention, by extracting the patch cap plane parameters of the patch cap magnetic ring model, based on the patch cap plane parameters, calculating the plane flatness of the patch cap magnetic ring model, the plane flatness of the patch cap magnetic ring model can be obtained, which helps to evaluate the manufacturing quality, assembly accuracy, and its performance in applications of the model. Among them, the patch cap plane parameters refer to the parameters describing the geometric characteristics of the patch cap surface, including but not limited to flatness, roughness, curvature, etc. The plane flatness refers to the degree of deviation of the patch cap surface from the ideal plane. Specifically, the plane flatness can be calculated by the maximum deviation value or the root mean square deviation (RMS).

[0158] The present invention optimizes the structure of the patch cap magnetic ring model through the flatness of the plane, and an optimized patch cap magnetic ring model can be obtained, which not only meets the requirements of plane flatness, but also may have better mechanical properties and electrical properties. Among them, the optimized patch cap magnetic ring model refers to a combined model of a patch cap and a magnetic ring that has undergone a series of design modifications and simulation analyses to meet specific performance requirements. The optimization process aims to improve parameters such as the plane flatness, electromagnetic performance, mechanical strength, and assembly accuracy of the model.

[0159] S5. Analyze the compatibility coefficient of the patch cap magnetic ring model using a preset magnetic ring compatibility algorithm. When the compatibility coefficient meets the preset compatibility standard, construct the finished patch cap connecting the magnetic ring to the base, and combine the finished patch cap and the base connecting magnetic ring to obtain the finished patch cap magnetic ring.

[0160] The present invention can systematically analyze the compatibility coefficient of the patch cap magnetic ring model by analyzing the compatibility coefficient of the patch cap magnetic ring model using a preset magnetic ring compatibility algorithm, and perform design optimization according to the analysis results to ensure the performance and reliability of the final product.

[0161] Specifically, the analysis of the compatibility coefficient of the patch cap magnetic ring model using a preset magnetic ring compatibility algorithm includes:

[0162] Define the compatibility requirements of the patch cap magnetic ring model;

[0163] Collect the compatibility data of the patch cap magnetic ring model;

[0164] According to the compatibility requirements, define the compatibility algorithm parameters of the magnetic ring compatibility algorithm;

[0165] Based on the compatibility algorithm parameters and the compatibility data, analyze the compatibility index of the patch cap magnetic ring model using the magnetic ring compatibility algorithm;

[0166] Define the compatibility weight of the compatibility index, and determine the compatibility coefficient of the patch cap magnetic ring model through the compatibility weight.

[0167] Among them, the compatibility requirements refer to a series of conditions that the chip capping magnetic ring model must meet in terms of design, performance, and operation. The compatibility data refers to the specific information used to evaluate the compatibility of the chip capping magnetic ring model, including geometric dimensions, material properties, performance parameters, etc. The compatibility algorithm parameters refer to a set of set values used for the magnetic ring compatibility algorithm. The compatibility index refers to the specific performance index used to quantitatively evaluate the compatibility of the chip capping magnetic ring model. The magnetic ring compatibility algorithm refers to a calculation method used to analyze the compatibility data of the chip capping magnetic ring model and output the results of the compatibility index. The compatibility weight refers to the importance coefficient assigned to different compatibility indicators. The compatibility coefficient refers to a comprehensive quantitative index that reflects the degree to which the chip capping magnetic ring model meets the compatibility requirements.

[0168] Optionally, the compatibility weight defining the compatibility index can be achieved through statistical analysis.

[0169] Finally, the present invention constructs the finished chip capping of the base-connected magnetic ring and combines the finished chip capping and the base-connected magnetic ring to obtain the finished chip capping magnetic ring, which can complete the construction and assembly of the finished chip capping magnetic ring and obtain a finished product that meets the design requirements. Among them, the finished chip capping refers to the chip capping that has completed the design and manufacturing process, and the finished chip capping magnetic ring refers to the complete component after combining the finished chip capping with the magnetic ring base.

[0170] Compared with the problems described in the background art, first of all, the present invention ensures the precise connection between the wound magnetic ring and the magnetic ring base, improves the assembly quality and reliability of the product, and through the extraction of vertex characterization and the definition of the magnetic ring chip capping pattern, realizes the perfect matching between the magnetic ring and the capping, enhances the stability and aesthetics of the overall structure. At the same time, the coupling analysis and structural optimization in the simulation environment significantly improve the planar flatness of the chip capping magnetic ring model, thereby enhancing the electromagnetic compatibility, reducing electromagnetic interference, and improving the performance of the product. Finally, through the analysis of the magnetic ring compatibility algorithm, it is ensured that the compatibility coefficient of the finished chip capping magnetic ring reaches the preset standard, which not only enhances the market competitiveness of the product, but also provides customers with a higher-performance, more reliable, and more beautiful magnetic ring solution, greatly enhancing the user experience. Therefore, the present invention can improve the chip quality of the capping magnetic ring.

[0171] Embodiment 2:

[0172] As Figure 2 shown, it is a functional module diagram of a manufacturing system for increasing the chip capping of a chip magnetic ring provided by an embodiment of the present invention.

[0173] The manufacturing system 200 for adding a patch magnetic ring patch cap of the present invention can be installed in an electronic device. According to the functions achieved, the manufacturing system 200 for adding a patch magnetic ring patch cap may include a winding magnetic ring connection module 201, a magnetic ring three-dimensional model construction module 202, a cap three-dimensional model construction module 203, a cap magnetic ring model optimization module 204, and a patch cap preparation module 205. The modules of the present invention may also be referred to as units, which refer to a series of computer program segments that can be executed by a processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0174] In this embodiment, the functions of each module / unit are as follows:

[0175] The winding magnetic ring connection module 201 is used to obtain a magnetic ring image of the winding magnetic ring, analyze the winding magnetic ring characteristics of the winding magnetic ring based on the magnetic ring image, and define the connection parameters between the winding magnetic ring and a preset magnetic ring base according to the winding magnetic ring characteristics;

[0176] The magnetic ring three-dimensional model construction module 202 is used to connect the winding magnetic ring and the magnetic ring base based on the connection parameters to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and establish a three-dimensional magnetic ring model of the base-connected magnetic ring when the connection coefficient meets a preset connection threshold;

[0177] The cap three-dimensional model construction module 203 is used to extract the vertex representation of the base-connected magnetic ring based on the three-dimensional magnetic ring model, where the vertex representation includes the magnetic size, the middle hole size, and the middle hole depth, define the magnetic ring patch cap pattern of the base-connected magnetic ring according to the vertex representation, and establish a three-dimensional patch cap model of the base-connected magnetic ring through the magnetic ring patch cap pattern;

[0178] The cap magnetic ring model optimization module 204 is used to couple the three-dimensional magnetic ring model and the three-dimensional patch cap model in a preset simulation environment to obtain a patch cap magnetic ring model, extract the patch cap plane parameters of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the patch cap plane parameters, and optimize the structure of the patch cap magnetic ring model through the plane flatness to obtain an optimized patch cap magnetic ring model;

[0179] The patch cap preparation module 205 is used to analyze the compatibility coefficient of the patch cap magnetic ring model by using a preset magnetic ring compatibility algorithm, construct a finished patch cap of the base-connected magnetic ring when the compatibility coefficient meets a preset compatibility standard, and combine the finished patch cap and the base-connected magnetic ring to obtain a finished patch cap magnetic ring.

[0180] Specifically, in the embodiments of the present invention, each module in the manufacturing system 200 for adding a patch magnetic ring patch cap adopts the same technical means as the method for manufacturing an add-on patch magnetic ring patch cap described in the accompanying drawings and can achieve the same technical effects, which will not be elaborated here.

[0181] An embodiment of the present invention provides an electronic device for implementing a method for manufacturing an add-on patch magnetic ring patch cap.

[0182] See Figure 3 As shown, the electronic device may include a processor 30, a memory 31, a communication bus 32, and a communication interface 33, and may further include a computer program stored in the memory 31 and executable on the processor 30, such as a program for manufacturing an add-on patch magnetic ring patch cap.

[0183] Among them, the processor may be composed of integrated circuits in some embodiments. For example, it may be composed of a single packaged integrated circuit, or may be composed of multiple integrated circuits with the same or different functions, including a combination of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips. The processor is the control core (Control Unit) of the electronic device, connecting various components of the entire electronic device through various interfaces and lines, and by running or executing programs or modules stored in the memory (such as executing a program for manufacturing an add-on patch magnetic ring patch cap, etc.), and calling data stored in the memory, to perform various functions of the electronic device and process data.

[0184] The memory includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disks, multimedia cards, card-type memories (such as SD or DX memories, etc.), magnetic memories, magnetic disks, optical disks, etc. The memory may be an internal storage unit of the electronic device in some embodiments, such as the mobile hard disk of the electronic device. The memory may also be an external storage device of the electronic device in other embodiments, such as a plug-in mobile hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the electronic device. Further, the memory may include both an internal storage unit and an external storage device of the electronic device. The memory can be used not only to store application software installed on the electronic device and various types of data, such as code based on a program for manufacturing an add-on patch magnetic ring patch cap, etc., but also to temporarily store data that has been output or will be output.

[0185] The communication bus may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The bus can be divided into an address bus, a data bus, a control bus, etc. The bus is configured to enable connection communication between the memory and at least one processor, etc.

[0186] The communication interface is used for communication between the above-mentioned electronic device and other devices, including a network interface and a user interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), and is generally used to establish a communication connection between this electronic device and other electronic devices. The user interface may be a display, an input unit (such as a keyboard), and optionally, the user interface may also be a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch liquid crystal display, and an OLED (Organic Light-Emitting Diode) toucher, etc. Among them, the display may also be appropriately referred to as a display screen or a display unit, and is used to display the information processed in the electronic device and to display a visual user interface.

[0187] For example, although not shown, the electronic device may further include a power source (such as a battery) for powering each component. Preferably, the power source can be logically connected to the at least one processor through a power management system, so as to implement functions such as charge management, discharge management, and power consumption management through the power management system. The power source may also include any components such as one or more DC or AC power sources, a recharge system, a power failure detection circuit, a power converter or an inverter, and a power status indicator. The electronic device may also include a variety of sensors, a Bluetooth module, a Wi-Fi module, etc., which will not be elaborated here.

[0188] It should be understood that the above embodiments are only for illustration purposes and are not limited by this structure in the scope of the patent application.

[0189] The production program for adding patch magnetic rings and patch caps stored in the memory of the electronic device is a combination of multiple instructions. When running in the processor, it can implement:

[0190] Obtain a magnetic ring image of the wound magnetic ring, analyze the wound magnetic ring characteristics of the wound magnetic ring based on the magnetic ring image, and define the connection parameters between the wound magnetic ring and a preset magnetic ring base according to the wound magnetic ring characteristics;

[0191] Based on the connection parameters, connect the winding magnetic ring and the magnetic ring base to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and when the connection coefficient meets the preset connection threshold, establish a three-dimensional magnetic ring model of the base-connected magnetic ring;

[0192] Based on the three-dimensional magnetic ring model, extract the vertex characteristics of the base-connected magnetic ring, where the vertex characteristics include magnetic size, middle hole size, and middle hole depth. According to the vertex characteristics, define the magnetic ring patch cap pattern of the base-connected magnetic ring, and through the magnetic ring patch cap pattern, establish a three-dimensional patch cap model of the base-connected magnetic ring;

[0193] In a preset simulation environment, couple the three-dimensional magnetic ring model and the three-dimensional patch cap model to obtain a patch cap magnetic ring model, extract the patch cap plane parameters of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the patch cap plane parameters, and optimize the structure of the patch cap magnetic ring model through the plane flatness to obtain an optimized patch cap magnetic ring model;

[0194] Use a preset magnetic ring compatibility algorithm to analyze the compatibility coefficient of the patch cap magnetic ring model. When the compatibility coefficient meets the preset compatibility standard, construct the finished patch cap of the base-connected magnetic ring, and combine the finished patch cap and the base-connected magnetic ring to obtain a finished patch cap magnetic ring.

[0195] Specifically, the specific implementation method of the above instructions by the processor can refer to the description of the relevant steps in the corresponding embodiments of the attached drawings, which will not be elaborated here.

[0196] Furthermore, if the modules / units integrated in the electronic device are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium can include: any entity or system that can carry the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disc, computer memory, read-only memory (ROM, Read-Only Memory).

[0197] The present invention also provides a computer-readable storage medium, and the readable storage medium stores a computer program. When the computer program is executed by the processor of the electronic device, it can implement:

[0198] Obtain the magnetic ring image of the winding magnetic ring, based on the magnetic ring image, analyze the winding magnetic ring characteristics of the winding magnetic ring, and according to the winding magnetic ring characteristics, define the connection parameters of the winding magnetic ring and a preset magnetic ring base;

[0199] Connect the winding magnetic ring and the magnetic ring base based on the connection parameters to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and establish a three-dimensional magnetic ring model of the base-connected magnetic ring when the connection coefficient meets the preset connection threshold.

[0200] Extract the vertex representation of the base-connected magnetic ring based on the three-dimensional magnetic ring model, where the vertex representation includes magnetic size, middle hole size, and middle hole depth. Define the magnetic ring patch cap pattern of the base-connected magnetic ring according to the vertex representation, and establish a three-dimensional patch cap model of the base-connected magnetic ring through the magnetic ring patch cap pattern.

[0201] In a preset simulation environment, couple the three-dimensional magnetic ring model and the three-dimensional patch cap model to obtain a patch cap magnetic ring model, extract the patch cap plane parameters of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the patch cap plane parameters, and optimize the structure of the patch cap magnetic ring model through the plane flatness to obtain an optimized patch cap magnetic ring model.

[0202] Analyze the compatibility coefficient of the patch cap magnetic ring model using a preset magnetic ring compatibility algorithm. When the compatibility coefficient meets the preset compatibility standard, construct the finished patch cap of the base-connected magnetic ring and combine the finished patch cap with the base-connected magnetic ring to obtain a finished patch cap magnetic ring.

[0203] In several embodiments provided by the present invention, it should be understood that the disclosed devices, systems, and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0204] The modules described as separate components may or may not be physically separated. The components shown as modules may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0205] In addition, the functional modules in each embodiment of the present invention can be integrated in one processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated units can be implemented in the form of hardware or in the form of a combination of hardware and software functional modules.

[0206] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

[0207] Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

[0208] The embodiments of the present application can acquire and process relevant data based on artificial intelligence technology. Among them, artificial intelligence (AI) is a theory, method, technology, and application system that uses a digital computer or a machine controlled by a digital computer to simulate, extend, and expand human intelligence, perceive the environment, acquire knowledge, and use knowledge to obtain the best results.

[0209] In addition, it is obvious that the term "comprising" does not exclude other units or steps, and the singular does not exclude the plural. The multiple units or systems stated in the system claims can also be implemented by one unit or system through software or hardware. Words such as first, second, etc. are used to denote names and do not denote any particular order.

Claims

1. A method for making a patch cap with a patch magnetic ring, characterized in that: The method comprises: Acquire a magnetic ring image of the winding magnetic ring, analyze the winding magnetic ring features of the winding magnetic ring based on the magnetic ring image, and define connection parameters between the winding magnetic ring and a preset magnetic ring base according to the winding magnetic ring features; Based on the connection parameters, the winding magnetic ring and the magnetic ring base are connected to obtain a base-connected magnetic ring, a connection coefficient of the base-connected magnetic ring is analyzed, and when the connection coefficient meets a preset connection threshold, a magnetic ring three-dimensional model of the base-connected magnetic ring is established; Based on the three-dimensional model of the magnetic ring, extract the vertex representation of the base-connected magnetic ring, wherein the vertex representation includes the magnetic size, the size of the middle hole and the depth of the middle hole, define the magnetic ring patch cap pattern of the base-connected magnetic ring according to the vertex representation, and establish the patch cap three-dimensional model of the base-connected magnetic ring through the magnetic ring patch cap pattern; In a preset simulation environment, the magnetic ring three-dimensional model and the patch cap three-dimensional model are coupled to obtain a patch cap magnetic ring model, the patch cap plane parameters of the patch cap magnetic ring model are extracted, and the plane flatness of the patch cap magnetic ring model is calculated according to the patch cap plane parameters. The patch cap magnetic ring model is structurally optimized according to the plane flatness to obtain an optimized patch cap magnetic ring model; The compatibility coefficient of the patch cap magnetic ring model is analyzed by using a preset magnetic ring compatibility algorithm. When the compatibility coefficient meets the preset compatibility standard, a finished patch cap of the base connected magnetic ring is constructed, and the finished patch cap and the base connected magnetic ring are combined to obtain a finished patch cap magnetic ring.

2. The method for making a patch cap with a patch magnetic ring as claimed in claim 1, characterized in that: The step of analyzing the winding magnetic ring features of the winding magnetic ring based on the magnetic ring image includes: Preprocessing the magnetic ring image to obtain a preprocessed magnetic ring image; Extracting the magnetic ring contour of the preprocessed magnetic ring image; Extracting the magnetic ring line area of ​​the pre-processed magnetic ring image according to the magnetic ring line contour; Extracting the circular closed contour and geometric structure of the magnetic ring winding area; Based on the circular closed contour, determining the number of winding turns of the winding magnetic ring; Calculate the wire diameter and winding density of the magnetic ring winding area; The winding magnetic ring characteristics of the winding magnetic ring are determined in combination with the number of winding turns, the wire diameter, the winding density and the geometric structure.

3. The method for making a patch cap with a patch magnetic ring as claimed in claim 2, characterized in that: Defining connection parameters between the winding magnetic ring and a preset magnetic ring base according to the characteristics of the winding magnetic ring includes: Analyzing the electromagnetic performance of the winding magnetic ring according to the characteristics of the winding magnetic ring; Determining application requirements of the winding magnetic ring; Based on the application requirements and the electromagnetic performance, analyzing the base performance indicators of the magnetic ring base; When the base performance index meets a preset base performance threshold, marking the connection surface of the magnetic ring base; Identifying the flatness, roughness and fit tolerance of the connection surface; The connection parameters of the connection point are defined in combination with the application requirements, the electromagnetic performance, the flatness, the roughness and the fitting tolerance.

4. The method for making a patch cap with a patch magnetic ring as claimed in claim 3, characterized in that: The step of analyzing the electromagnetic performance of the winding magnetic ring according to the characteristics of the winding magnetic ring includes: According to the characteristics of the winding magnetic ring, the inductance of the winding magnetic ring is calculated using the following formula: Wherein, L represents the inductance of the winding magnetic ring, μn represents the vacuum magnetic permeability, N represents the number of winding turns in the winding magnetic ring feature, l represents the effective length of the magnetic ring in the winding magnetic ring feature, r represents the average radius in the winding magnetic ring feature, and π represents pi; Based on the characteristics of the winding magnetic ring, marking the current frequency and skin effect correction coefficient of the winding magnetic ring; And the AC resistance of the winding magnetic ring is calculated by the current frequency and the skin effect correction coefficient: Calculating the quality factor of the winding magnetic ring by using the inductance and the AC resistance; The electromagnetic performance of the winding magnetic ring is analyzed in combination with the inductance, the AC resistance and the quality factor.

5. The method for manufacturing a patch cap with a patch magnetic ring as claimed in claim 4, characterized in that: The step of calculating the AC resistance of the winding magnetic ring by using the current frequency and the skin effect correction coefficient includes: Calculating the DC resistance of the winding magnetic ring; According to the DC resistance, the current frequency and the skin effect correction coefficient, the AC resistance of the winding magnetic ring is calculated using the following formula: Among them, R ac Represents the AC resistance of the winding magnetic ring, R dc represents the DC resistance of the winding magnetic ring, f represents the current frequency, K c Represents the skin effect correction factor.

6. The method for manufacturing a patch cap with a patch magnetic ring as claimed in claim 5, characterized in that: When the connection coefficient meets the preset connection threshold, a three-dimensional model of the magnetic ring of the base connection magnetic ring is established, including: When the connection coefficient meets a preset connection threshold, a three-dimensional coordinate system of the base connection magnetic ring is established, and based on the three-dimensional coordinate system, spatial data of the base connection magnetic ring is collected; analyzing spatial data attributes of the spatial data; Generating a measurement view of the base connection magnetic ring according to the spatial data attributes; marking the three-dimensional coordinates of the measurement view; Constructing a three-dimensional coordinate diagram of the base connection magnetic ring according to the three-dimensional coordinates of the view; Based on the three-dimensional coordinate diagram, a three-dimensional model of the magnetic ring of the base connection magnetic ring is established.

7. The method for manufacturing a patch cap with a patch magnetic ring as claimed in claim 6, characterized in that: The step of establishing a three-dimensional model of a magnetic ring of the base connection magnetic ring based on the three-dimensional coordinate graph includes: Identify the three-dimensional nodes of the magnetic ring of the base connection magnetic ring; According to the three-dimensional coordinate diagram, the three-dimensional node coordinates of the three-dimensional nodes of the magnetic ring are calculated using the following formula: Among them, Q(X i ,Y i ) represents the 3D node coordinates of the i-th 3D node, X i Represents the i-th horizontal coordinate of the three-dimensional node coordinate, Y i represents the i-th ordinate of the three-dimensional node coordinate, E represents the three-dimensional coordinate graph, S i represents the i-th 3D node, b represents the number of 3D nodes, and σ represents the 3D coordinate system of the base connecting the magnetic ring: Based on the three-dimensional node coordinates, construct the three-dimensional position and posture of the base connection magnetic ring; A three-dimensional model of the magnetic ring of the base connection magnetic ring is established through the three-dimensional posture.

8. The method for manufacturing a patch cap with a patch magnetic ring as claimed in claim 7, characterized in that: The method of coupling the magnetic ring three-dimensional model and the patch cap three-dimensional model in a preset simulation environment to obtain a patch cap magnetic ring model includes: Integrate the magnetic ring three-dimensional model and the patch cap three-dimensional model into the simulation environment, and analyze the magnetic ring three-dimensional model integrity and the cap three-dimensional model integrity of the magnetic ring three-dimensional model and the patch cap three-dimensional model; When the integrity of the magnetic ring three-dimensional model and the integrity of the cap three-dimensional model meet the preset magnetic ring three-dimensional model integrity threshold and the cap three-dimensional model integrity threshold, define the coupling interface and coupling parameters of the magnetic ring three-dimensional model and the patch cap three-dimensional model; Meshing the magnetic ring three-dimensional model and the patch cap three-dimensional model to obtain a magnetic ring mesh model and a patch cap mesh model; Calculating the mesh density of the magnetic ring mesh model and the patch cap mesh model at the coupling interface; When the grid density meets a preset grid density threshold, the magnetic ring grid model and the patch cap grid model are coupled using the coupling interface and the coupling parameters to obtain the patch cap magnetic ring model.

9. The method for manufacturing a patch cap with a patch magnetic ring as claimed in claim 8, characterized in that: The using of a preset magnetic ring compatibility algorithm to analyze the compatibility coefficient of the patch cap magnetic ring model includes: Defining the compatibility requirements of the patch cap magnetic ring model; Collecting compatible data of the patch cap magnetic ring model; According to the compatibility requirement, defining compatible algorithm parameters of the magnetic ring compatible algorithm; Based on the compatibility algorithm parameters and the compatibility data, using the magnetic ring compatibility algorithm to analyze the compatibility index of the patch cap magnetic ring model; A compatibility weight of the compatibility index is defined, and a compatibility coefficient of the patch cap magnetic ring model is determined by the compatibility weight.

10. A system for making a patch cap with a patch magnetic ring, characterized in that: Used to perform the method for manufacturing a patch cap with a patch magnetic ring as described in any one of claims 1 to 9, the system comprising: A winding magnetic ring connection module, used for acquiring a magnetic ring image of the winding magnetic ring, analyzing the winding magnetic ring characteristics of the winding magnetic ring based on the magnetic ring image, and defining connection parameters between the winding magnetic ring and a preset magnetic ring base according to the winding magnetic ring characteristics; A magnetic ring three-dimensional model building module is used to connect the winding magnetic ring and the magnetic ring base based on the connection parameters to obtain a base-connected magnetic ring, analyze the connection coefficient of the base-connected magnetic ring, and establish a magnetic ring three-dimensional model of the base-connected magnetic ring when the connection coefficient meets a preset connection threshold; A cap three-dimensional model building module is used to extract the vertex representation of the base-connected magnetic ring based on the magnetic ring three-dimensional model, wherein the vertex representation includes the magnetic size, the size of the middle hole and the depth of the middle hole, and define the magnetic ring patch cap pattern of the base-connected magnetic ring according to the vertex representation, and establish the patch cap three-dimensional model of the base-connected magnetic ring through the magnetic ring patch cap pattern; A cap magnetic ring model optimization module is used to couple the magnetic ring three-dimensional model and the patch cap three-dimensional model in a preset simulation environment to obtain a patch cap magnetic ring model, extract the patch cap plane parameters of the patch cap magnetic ring model, calculate the plane flatness of the patch cap magnetic ring model according to the patch cap plane parameters, perform structural optimization on the patch cap magnetic ring model according to the plane flatness, and obtain an optimized patch cap magnetic ring model; The patch cap preparation module is used to analyze the compatibility coefficient of the patch cap magnetic ring model by using a preset magnetic ring compatibility algorithm. When the compatibility coefficient meets the preset compatibility standard, a finished patch cap of the base connected magnetic ring is constructed, and the finished patch cap and the base connected magnetic ring are combined to obtain a finished patch cap magnetic ring.

Images