Conductive foam, manufacturing method thereof and electronic equipment

Abstract

The invention provides conductive foam, a manufacturing method thereof and electronic equipment, and relates to the technical field of electronic communication, the conductive foam is applied to the electronic equipment, and the conductive foam comprises a foam substrate; the conductive layer covers at least a first surface of the foam substrate, and the first surface is used for being electrically connected with a first structure in the electronic equipment through the conductive layer; the conductive layer at least comprises a conductive slurry layer which is used for deforming under the action of external pressure. Therefore, the conductive foam which is conductive, relatively low in working height in the first direction, relatively low in PIM and relatively small in stress can be provided, when the conductive foam is applied to the electronic equipment, the thickness of the electronic equipment can be reduced, the PIM of a contact interface between the conductive foam and a structure in the electronic equipment is reduced, and the reliability of the electronic equipment is improved. In addition, radiation stray interference and the like can be reduced or eliminated.

Description

[0001] This application is a divisional application of a Chinese patent application submitted to the National Intellectual Property Administration on May 26, 2023, with the application number 202310613241.2 and the application title "Conductive Foam and Its Manufacturing Method, Electronic Device". Technical Field

[0002] This application relates to the field of electronic communication technologies, and in particular, to a conductive foam and its manufacturing method, and an electronic device. Background Art

[0003] With the continuous development of mobile communication technologies, the internal structure of electronic devices has become increasingly complex and the integration degree has become increasingly high. For example, taking a mobile phone as an example of an electronic device, the high integration degree of the components included makes the thickness of the mobile phone thinner and thinner; in this case, the distance between adjacent components in the thickness direction of the mobile phone will become smaller and smaller. In this situation, how to reduce radiated spurious emissions (RSE) and how to avoid signal interference between adjacent components are particularly important.

[0004] In related technologies, foams are often provided in electronic devices to reduce radiated spurious emissions, conduct electricity, prevent static electricity, etc. However, current foams cannot achieve a low working height and low passive intermodulation (PIM), which in turn causes the electronic device to be unable to achieve ultra-thinness and have good performance when applied to the electronic device.

[0005] Therefore, there is an urgent need for a new solution to solve the above problems. Summary of the Invention

[0006] Embodiments of this application provide a conductive foam and its manufacturing method, and an electronic device. By providing a conductive layer on at least a first surface of the foam substrate, the conductive foam can have both electrical conductivity and good compressibility or stretchability, so that it can achieve a low working height, have a small PIM, small stress in a first direction, and also have a large contact area with the structure in the electronic device.

[0007] To achieve the above object, this application adopts the following technical solutions:

[0008] In a first aspect, a conductive foam is provided, which is applied to an electronic device. The conductive foam includes:

[0009] A foam substrate;

[0010] A conductive layer covering at least a first surface of the foam substrate, the first surface being used for electrical connection with a first structure in the electronic device through the conductive layer; the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used for deforming under the action of an external pressure.

[0011] An embodiment of the present application provides a conductive foam. By providing a conductive paste layer covering at least the first surface of the foam substrate, the conductive paste in the conductive paste layer has properties such as certain ductility, good electrical conductivity, and relatively large resistivity. And the conductive paste is in a liquid state before film formation, and the volume will shrink during the curing process. Therefore, while the conductive foam exhibits good electrical conductivity, it can also deform under the action of pressure. Combining with the elasticity of the foam substrate, the working height of the conductive foam in the first direction can be relatively low. At the same time, the conductive paste is sintered into a layer, and the volume shrinks to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small. And when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large.

[0012] Thus, the present application provides a conductive foam with a relatively low working height, small PIM, and low stress in the first direction. When the conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface between the conductive foam and the structure in the electronic device relatively small. In addition, it can realize the electrical connection of the structure in the electronic device through the conductive foam, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0013] In a first possible implementation manner of the first aspect, the conductive paste layer includes a paste main body and a plurality of connected conductive particles, and the conductive particles are doped in the paste main body.

[0014] In this implementation manner, a plurality of connected conductive particles in the conductive paste layer can generate multiple current paths, so that the conductive paste layer conducts electricity. At the same time, the paste main body in the conductive paste layer is soft, so that the conductive paste layer can deform under the action of an external pressure.

[0015] Optionally, the conductive layer is a first conductive paste layer, and the first conductive paste layer is used for deforming under the action of an external pressure.

[0016] In this implementation, by providing a first conductive paste layer covering at least the first surface of the foam substrate, since the first conductive paste has properties such as certain ductility, good electrical conductivity, and a relatively large resistivity, and the first conductive paste is in a liquid state before film formation and its volume will shrink during the curing process, the conductive foam not only exhibits good electrical conductivity but also can be deformed under pressure. Combining with the elasticity of the foam substrate, the working height of the conductive foam in the first direction can be relatively low. At the same time, the first conductive paste is sintered into a layer and its volume shrinks to ensure the contact force between multiple conductive particles, so that the PIM inside the first conductive paste is very small. Moreover, when the first conductive paste cures into a conductive paste layer, the first conductive particles in the first conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large.

[0017] Optionally, the conductive layer is a second conductive paste layer, and the second conductive paste layer is configured to be deformed under an external pressure.

[0018] In this implementation, by providing a second conductive paste layer covering at least the first surface of the foam substrate, since the second conductive paste has properties such as certain ductility, good electrical conductivity, and a relatively large resistivity, and the second conductive paste is in a liquid state before film formation and its volume will shrink during the curing process, the conductive foam not only exhibits good electrical conductivity but also can be deformed under pressure. Combining with the elasticity of the foam substrate, the working height of the conductive foam in the first direction can be relatively low. At the same time, the second conductive paste is sintered into a layer and its volume shrinks to ensure the contact force between multiple conductive particles, so that the PIM inside the second conductive paste is very small. Moreover, when the second conductive paste cures into a conductive paste layer, the second conductive particles in the second conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large.

[0019] In a possible implementation of the first aspect, the conductive layer further includes a first substrate layer, and the first substrate layer is configured to be deformed under the external pressure;

[0020] The orthographic projection of the conductive paste layer on the foam substrate at least partially coincides with the orthographic projection of the first substrate layer on the foam substrate.

[0021] In this implementation, by setting the first substrate layer and the conductive paste layer, on the one hand, the first substrate layer is elastic and can be well compressed or stretched; on the other hand, the conductive paste in the conductive paste layer has properties such as certain ductility, good conductivity, and large resistivity, and the volume will shrink during the curing process of the conductive paste. As a result, while the conductive foam exhibits good conductivity, it can also deform under pressure. Combining with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low; at the same time, the conductive paste is sintered into a layer and the volume shrinks, which can make the PIM inside the conductive paste very small; and when the conductive paste cures into the conductive paste layer, it spreads out, which can make the contact area between the conductive foam and the structure in the electronic device relatively large.

[0022] In a possible implementation of the first aspect, the conductive paste layer is the first conductive paste layer, and the first conductive paste layer is disposed on the side of the first substrate layer away from the foam matrix;

[0023] The conductive layer further includes a first adhesive layer, and the first adhesive layer is disposed between the first substrate layer and the foam matrix. The first adhesive layer is used to bond the first substrate layer and the foam matrix and deform under the action of the external pressure.

[0024] In this implementation, good bonding between the first substrate layer and the foam matrix can be achieved through the first adhesive layer; at the same time, the first adhesive layer can be compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam matrix is relatively small, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix can be relatively small, and further the working height of the conductive foam in the first direction can be relatively low. Thus, a conductive foam with a relatively low working height, small PIM, and low stress in the first direction can be obtained.

[0025] When the conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface of the conductive foam and the structure in the electronic device relatively small; in addition, it can achieve the electrical connection of the structure in the electronic device through the conductive foam and reduce or eliminate radiation and spurious interference, etc., effectively improving the performance of the electronic device.

[0026] In a possible implementation of the first aspect, the conductive paste layer is the first conductive paste layer, and the first conductive paste layer at least wraps the surface of the first substrate layer close to the foam matrix and the surface of the first substrate layer away from the foam matrix;

[0027] The conductive layer further includes a first adhesive layer disposed between the first conductive paste layer and the foam substrate. The first adhesive layer is used to bond the first conductive paste layer and the foam substrate and deform under the action of an external pressure.

[0028] In this implementation, the first conductive paste layer and the foam substrate can be well bonded through the first adhesive layer. At the same time, the first adhesive layer can be compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer in the direction perpendicular to the foam substrate is small. Furthermore, the working height of the conductive foam in the first direction can be low. Moreover, the first adhesive layer does not affect the PIM and other properties of the first conductive paste in the first conductive paste layer. Therefore, a conductive foam with a low working height, small PIM, and low stress in the first direction can be obtained.

[0029] When the conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface of the conductive foam and the structure in the electronic device small. In addition, the conductive foam can achieve directional electrical connection of the structure in the electronic device and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0030] In a possible implementation manner of the first aspect, the first adhesive layer is an adhesive layer.

[0031] In this implementation, the first substrate layer / first conductive paste layer and the foam substrate can be well bonded through the adhesive layer. At the same time, the adhesive layer can be compressed or stretched, and the thickness of the adhesive layer in the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer in the direction perpendicular to the foam substrate is small. Furthermore, the working height of the conductive foam in the first direction can be low. Therefore, a conductive foam with a low working height, small PIM, and low stress in the first direction can be obtained. And the adhesive layer is simple to implement and has a low cost.

[0032] In a possible implementation manner of the first aspect, the first adhesive layer is a second conductive paste layer.

[0033] In this implementation, the first substrate layer / first conductive paste layer and the foam substrate can be well bonded through the second conductive paste layer. At the same time, the second conductive paste layer can be compressed or stretched, and the thickness of the second conductive paste layer in the direction perpendicular to the foam substrate can be small, so that the thickness of the conductive layer in the direction perpendicular to the foam substrate can be small. Furthermore, the working height of the conductive foam in the first direction can be low. Therefore, a conductive foam with a low working height, small PIM, and low stress in the first direction can be obtained.

[0034] In a possible implementation of the first aspect, the first surface of the foam substrate is at least divided into a first region and a second region. Along the direction perpendicular to the foam substrate, the height of the part of the conductive layer located in the first region is less than the height of the part of the conductive layer located in the second region.

[0035] In this implementation, by setting the height of the conductive foam in the first region and the second region to be different along the direction perpendicular to the foam substrate, when applied to an electronic device, the conductive foam can be electrically connected to at least two structures with different heights, enriching the application of the conductive foam in the electronic device.

[0036] In a possible implementation of the first aspect, the structure of the part of the conductive layer located in the first region is the same as the structure of the part of the conductive layer located in the second region;

[0037] Along the direction perpendicular to the foam substrate, the height of at least one layer of the conductive layer located in the first region is less than the height of the part located in the second region.

[0038] In this implementation, it can be ensured that the height of the conductive layer in the first region is less than that in the second region, and the height difference should not be too large, which is simple and easy to implement.

[0039] In a possible implementation of the first aspect, the conductive layer further includes a second substrate layer, and the second substrate layer is disposed in the second region and on the side of the conductive paste layer away from the foam substrate.

[0040] In this implementation, by providing the second substrate layer in the second region, it can be ensured that along the direction perpendicular to the foam substrate, the height of the conductive layer in the first region is less than that in the second region, and the height difference can be relatively large, which is simple and easy to implement.

[0041] In a possible implementation of the first aspect, the shape of the foam substrate is a polyhedron, and the polyhedron at least includes the connected first surface, second surface, and third surface;

[0042] The conductive layer at least covers the first surface, the second surface, and the third surface.

[0043] In this implementation, the foam substrate at least includes the connected first surface, second surface, and third surface, and the conductive layer at least covers the first surface, the second surface, and the third surface of the foam substrate, so as to provide a variety of conductive foams with a relatively low working height, low PIM, and low stress in the first direction, enriching the application of the conductive foam in the electronic device.

[0044] In a possible implementation of the first aspect, when the polyhedron includes the first surface, the second surface, and the third surface, the first surface is disposed opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface, and the entire third surface of the polyhedron.

[0045] In this implementation, the first surface and the second surface of the foam substrate are disposed opposite to each other, and the first surface is connected to the second surface through the third surface. Moreover, a conductive layer is provided to cover at least part of the first surface, the entire third surface, and at least part of the second surface of the polyhedron, so that a conductive layer in a shape similar to a "C" can be formed. When this conductive foam is applied to an electronic device, the directionality of the conductive foam can be ensured, thereby enabling identification and anti-misassembly.

[0046] In a possible implementation of the first aspect, when the polyhedron includes the first surface, the second surface, the third surface, and the fourth surface, the first surface is disposed opposite to the second surface, and the third surface is disposed opposite to the fourth surface. The first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface.

[0047] In this implementation, by disposing the first surface opposite to the second surface and the third surface opposite to the fourth surface, and connecting the first surface to the second surface through the third surface and the fourth surface respectively, and providing a conductive layer to cover the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface of the foam substrate, a conductive layer in a shape similar to a certain type can be formed. When this conductive foam is applied to an electronic device, the directionality of the conductive foam can be ensured, thereby enabling identification and anti-misassembly.

[0048] Optionally, when the polyhedron includes the first surface, the second surface, and the third surface, the first surface is disposed opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface, and the entire third surface of the polyhedron;

[0049] The conductive foam further includes a second adhesive layer, and the second adhesive layer is disposed on part of the second surface.

[0050] In this implementation, by providing a second adhesive layer on part of the second surface, the conductive foam can be well electrically connected to the structure in the electronic device, realizing the application of the conductive foam.

[0051] Optionally, when the polyhedron includes a first surface, a second surface, a third surface, and a fourth surface, the first surface is disposed opposite to the second surface, and the third surface is disposed opposite to the fourth surface. The first surface is connected to the second surface through the third surface and the fourth surface respectively. The conductive layer covers the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface;

[0052] The conductive foam further includes a second adhesive layer disposed on part of the second surface.

[0053] In this implementation, by providing a second adhesive layer on part of the second surface, the conductive foam can be well electrically connected to the structure in the electronic device, realizing the application of the conductive foam.

[0054] In a possible implementation manner of the first aspect, the second surface of the polyhedron is used to be electrically connected to a second structure in the electronic device through the conductive layer.

[0055] In this implementation, the first surface of the conductive foam can be electrically connected to a first structure in the electronic device through the conductive layer, and the second surface can be electrically connected to a second structure in the electronic device through the conductive layer, thereby at least realizing the electrical connection between the first structure and the second structure in the electronic device.

[0056] In a possible implementation manner of the first aspect, the first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative member.

[0057] In this implementation, the conductive foam can be electrically connected to at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative member, etc. in the electronic device through the conductive layer.

[0058] In a possible implementation manner of the first aspect, the second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative member.

[0059] In this implementation, the conductive foam can be electrically connected to at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative member, etc. in the electronic device through the conductive layer.

[0060] In a second aspect, an electronic device is provided, including the conductive foam as in the first aspect or any possible implementation manner of the first aspect.

[0061] The electronic device provided by the embodiment of the present application can reduce the thickness of the electronic device while using the conductive foam as in the first aspect or any possible implementation manner of the first aspect, and the PIM between the structure in the electronic device and the contact interface of the conductive foam can be relatively small; moreover, the electronic device can reduce or eliminate radiation spurious interference, etc., effectively improving the performance of the electronic device.

[0062] In a possible implementation manner of the second aspect, the first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

[0063] In this implementation manner, the first surface of the conductive foam can be electrically connected to the display screen through a conductive layer, and the second surface of the conductive foam can be electrically connected to the metal middle frame through a conductive layer; at the same time, since the conductive foam can be well compressed or stretched, it can not only achieve a lower working height in the first direction but also avoid damaging the display screen, ensuring excellent performance of the electronic device.

[0064] In a possible implementation manner of the second aspect, the first structure at least includes a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam when rotating.

[0065] In this implementation manner, the camera assembly such as a camera is electrically connected to the conductive foam. Since the working height of the conductive foam in the first direction is relatively low, it can be placed between the camera and other structures; when the camera rotates in any direction, since the conductive foam can be well compressed or stretched, the camera can always maintain electrical connection with the conductive foam, ensuring the performance of the electronic device; at the same time, since the conductive foam is an independent structure and separable, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic device and cause the entire electronic device to be scrapped; moreover, the conductive foam can effectively absorb the tolerance existing when electrically connected to the structure of the electronic device, thus avoiding poor contact; in addition, the conductive foam can make the grounding (GND) path shorter; at the same time, if problems such as glue overflow occur, the conductive foam can also be improved through strain. Therefore, the performance of the electronic device in the embodiment of the present application has been greatly improved.

[0066] In the third aspect, a manufacturing method of a conductive foam is provided, and the manufacturing method includes:

[0067] Form a conductive layer on at least the first surface of the foam substrate; wherein, the first surface is used to be electrically connected to the first structure in the electronic device through the conductive layer, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under the action of an external pressure.

[0068] The manufacturing method of the conductive foam provided by the embodiments of the present application forms a conductive paste through methods such as spraying, printing, sputtering, vacuum plating, dipping, etc., and bakes / heats and cures to form a conductive paste layer, which is simple and easy to implement. At the same time, the conductive paste in the conductive paste layer has properties such as certain ductility, good conductivity, and relatively large resistivity. Moreover, the conductive paste is in a liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also deform under pressure. Combining with the elasticity of the foam matrix, the conductive foam can have a lower working height in the first direction. And, the conductive paste is sintered into a layer, and the volume shrinks to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small. In addition, when the conductive paste cures into a conductive paste layer, the conductive particles in the conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large.

[0069] The embodiments of the present application provide a conductive foam, its manufacturing method, and an electronic device. Since the conductive paste layer in the conductive layer covering at least the first surface of the foam matrix has properties such as certain ductility, good conductivity, and relatively large resistivity, and because the foam matrix has elasticity, the conductive foam has a lower working height, smaller PIM, and smaller stress in the first direction. When the conductive foam is applied to an electronic device, it can have a relatively large contact surface with the structure in the electronic device, and the PIM of this contact surface is small. At the same time, it can also make the electronic device thinner and reduce or eliminate radiation spurious interference, etc., thus effectively improving the performance of the electronic device and providing a good user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 It is a schematic structural diagram of the first electronic device provided by the embodiments of the present application;

[0071] Figure 2 It is a schematic structural diagram of an all-round wire-drawing foam in the related art;

[0072] Figure 3 It is a three-dimensional structural diagram with a cross-section of the first conductive foam provided by the embodiments of the present application;

[0073] Figure 4 For Figure 3 The cross-sectional schematic diagram of the conductive foam shown;

[0074] Figure 5 It is a three-dimensional structural diagram with a cross-section of the second conductive foam provided by the embodiments of the present application;

[0075] Figure 6 For Figure 5 The cross-sectional schematic diagram of the conductive foam shown;

[0076] Figure 7Schematic diagram of the structure of the conductive paste layer of the conductive foam provided by the embodiment of the present application before curing;

[0077] Figure 8 Schematic diagram of the structure of the conductive paste layer of the conductive foam provided by the embodiment of the present application after curing;

[0078] Figure 9 Schematic diagram of the three-dimensional structure with a cross-section of the third conductive foam provided by the embodiment of the present application;

[0079] Figure 10 is Figure 9 Schematic diagram of the cross-section of the conductive foam shown;

[0080] Figure 11 Schematic diagram of the structure of the fourth conductive foam provided by the embodiment of the present application;

[0081] Figure 12 Schematic diagram of the microscopic structure of the non-woven fabric provided by the embodiment of the present application;

[0082] Figure 13 Schematic diagram of the structure of the fifth conductive foam provided by the embodiment of the present application;

[0083] Figure 14 Schematic diagram of the structure of the sixth conductive foam provided by the embodiment of the present application;

[0084] Figure 15 Schematic diagram of the structure of the seventh conductive foam provided by the embodiment of the present application;

[0085] Figure 16 Schematic diagram of the structure of the eighth conductive foam provided by the embodiment of the present application;

[0086] Figure 17 Schematic diagram of the structure of the ninth conductive foam provided by the embodiment of the present application;

[0087] Figure 18 Schematic diagram of the structure of the tenth conductive foam provided by the embodiment of the present application;

[0088] Figure 19 Schematic diagram of the structure of the eleventh conductive foam provided by the embodiment of the present application;

[0089] Figure 20 Schematic diagram of the structure of the second electronic device provided by the embodiment of the present application;

[0090] Figure 21 Schematic diagram of the structure of the third electronic device provided by the embodiment of the present application;

[0091] Figure 22 Schematic diagram of the structure of the first electronic device in the related art;

[0092] Figure 23 Schematic diagram of the structure of the second electronic device in the related art;

[0093] Figure 24 Schematic diagram of the structure of the fourth electronic device provided by the embodiment of the present application;

[0094] Figure 25 Schematic diagram of the structure of the fifth electronic device provided by the embodiment of the present application;

[0095] Figure 26 Schematic diagram of the structure of the sixth electronic device provided by the embodiment of the present application;

[0096] Figure 27 Schematic diagram of the structure of the electronic device provided by the embodiment of the present application;

[0097] Figure 28 Schematic diagram of the structure of the seventh electronic device provided by the embodiment of the present application;

[0098] Figure 29 Schematic diagram of the structure of the eighth electronic device provided by the embodiment of the present application;

[0099] Figure 30 Flow chart of the first manufacturing method of the conductive foam provided by the embodiment of the present application;

[0100] Figure 31 Flow chart of the second manufacturing method of the conductive foam provided by the embodiment of the present application;

[0101] Figure 32 Flow chart of the third manufacturing method of the conductive foam provided by the embodiment of the present application;

[0102] Figure 33 Flow chart of the first manufacturing method of the actual applied conductive foam provided by the embodiment of the present application.

[0103] Reference numerals:

[0104] 01 - Electronic device; 101 - Display module; 1011 - Display screen; 1012 - Touch panel; 1013 - Metal frame; 102 - Middle frame; 1021 - Frame; 1022 - Carrier plate; 103 - Rear case; 501 - Front camera; 502 - Shielding cover; 503 - Conductive cloth; 504 - PCB; 505 - Bracket steel sheet; 506 - Screw; 507 - Substrate of the front camera; 508 - Rear camera; 509 - Substrate of the rear camera; 102 - Middle frame; 105 - Antenna; 106 - Insulating material layer; 107 - Plastic; 108 - Reed; 109 - Laser-engraved surface; 110 - Anti-oxidation layer; OZ - First direction (thickness direction of the mobile phone); OX - Second direction (width direction of the mobile phone); OY - Third direction (length direction of the mobile phone); 111 - Display screen;

[0105] 03 - Omnidirectional brushed foam; 121 - Adhesive of the omnidirectional brushed foam; 122 - Metal wire;

[0106] 05 - Conductive foam; 1 - Foam substrate; 10 - First foam substrate; 11 - First surface of the foam substrate; 12 - Second surface of the foam substrate; 13 - Third surface of the foam substrate; 14 - Fourth surface of the foam substrate; 2 - Conductive layer; 21 - First conductive paste layer; 211 - First paste main body; 212 - First conductive particles; 22 - Second conductive paste layer; 221 - Second paste main body; 222 - Second conductive particles; D1 - Conductive path; Q1 - First area; Q12 - Second area; 5 - Adhesive layer; 6 - First base material layer; 7 - Second adhesive layer; 8 - Different-color PET layer; 9 - Second base material layer. Detailed implementation manners

[0107] Next, the technical solutions in the embodiments of the present application will be clearly and elaborately described with reference to the accompanying drawings. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means "or". For example, A / B may mean A or B; "and / or" in the text is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B may mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0108] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as implying or suggesting relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. The meaning of "at least one" is one or more.

[0109] First, some terms in the embodiments of the present application are explained to facilitate understanding by those skilled in the art.

[0110] 1. Foam

[0111] Foam refers to materials such as polyurethane and plastic particles that have been foamed, simply referred to as foam. Foam has characteristics such as light weight, elasticity, quick pressure-sensitive fixation, easy use, flexible bending, ultra-thin volume, and reliable performance.

[0112] 2. Conductive foam

[0113] Conductive foam refers to a material in which a conductive cloth is wrapped around a foam core. After treatment, it has good surface conductivity and can be easily fixed to the structure to be shielded with adhesive tape or the like.

[0114] 3. Passive intermodulation

[0115] Passive intermodulation refers to the mixing of two or more frequencies in a non-linear device, resulting in spurious signals.

[0116] 4. Radiation spurs

[0117] Radiation spurs refer to the radiation at discrete frequencies other than the carrier frequency and the sidebands and adjacent channels caused by normal modulation and switching transients when modulated with a standard signal; radiation spurs may be harmonic components, intermodulation signals, etc. generated by some non-linear structures.

[0118] 5. Seepage theory of conductive paste

[0119] When the content of conductive particles in the conductive paste is relatively high, the conductive network is mainly formed by the direct connection of conductive particles.

[0120] 6. Tunnel effect theory or field emission theory of conductive paste

[0121] When the content of conductive particles in the conductive paste is relatively low, the conductive particles are not sufficient to make direct contact. At this time, an external electric field is applied, and electrons penetrate the organic matter through the tunnel effect and jump to nearby conductive particles to make the conductive network unobstructed. When the tunnel effect theory or field emission theory is dominant in the conductive paste, the PIM performance of the conductive paste is poor.

[0122] 7. Non-woven fabric

[0123] Non-woven fabric, also known as non-woven cloth, needle-punched cotton, needle-punched non-woven fabric, etc., is produced using materials such as polyester fiber and polyester fiber, and is made through a needle-punching process. Non-woven fabric has no warp or weft threads. It is a fabric formed without the need for spinning and weaving. Instead, textile staple fibers or filaments are arranged directionally or randomly to form a fiber web structure, and then it is strengthened by mechanical, heat-bonding, or chemical methods. Non-woven fabric has the characteristics of moisture-proof, breathable, flexible, lightweight, flame-retardant, non-toxic, odorless, low price, recyclable, etc.

[0124] The above is a simple introduction to the terms involved in the embodiments of this application, and will not be elaborated further below.

[0125] Exemplarily, Figure 1 An electronic device 01 applicable to the embodiments of this application is shown.

[0126] As Figure 1 shown, taking the electronic device 01 as a mobile phone as an example, the mobile phone may include a display module 101, a middle frame 102, a rear shell 103, etc. The middle frame 102 is disposed between the display module 101 and the rear shell 103. The middle frame 102 includes a frame 1021 and a carrier plate 1022 surrounded by the frame. An internal structure, such as components, etc., is installed on one side of the carrier plate 1022. The internal structure of the mobile phone can achieve functions through electrical connection, and this electrical connection is usually a weak force contact, which causes harmonic waves, passive intermodulation and other non-linear products to be easily generated at the contact interface of the internal structure. Non-linear products are the main source of mobile phone radiation spurious, and radiation spurious interference is an important index for mobile phone acceptance.

[0127] In order to reduce or eliminate radiation spurious interference, the internal structure of the mobile phone can be electrically connected through foam. There are many types of foam provided by related technologies. For example, all-round wire-drawn foam, etc. These foams have been widely used due to characteristics such as low PIM.

[0128] Exemplarily, Figure 2 An all-round wire-drawn foam 03 in related technology is shown. As Figure 2 shown, the all-round wire-drawn foam 03 includes an adhesive layer 121 and metal wires 122. Among them, the adhesive layer 121 can include any one of conductive adhesive, insulating adhesive, etc., and the metal wires 122 can include copper wires, etc. However, when the all-round wire-drawn foam 03 is compressed, the problem of breakage of the metal wires 122 may occur, or the problem of non-rebound and permanent deformation of the metal wires 122 may occur, which may lead to difficulty in compressing its working height in the first direction. It should be noted that the first direction is Figure 2 the OZ direction shown in

[0129] Then, as can be seen from the above several examples, the foam materials provided in the related art cannot achieve a lower working height in the first direction, nor can they further reduce PIM.

[0130] In view of this, the present application provides a conductive foam. The conductive foam is provided with a conductive layer covering at least the first surface of the foam matrix. The conductive layer at least includes a conductive paste layer. The conductive paste layer has advantages such as good ductility, good conductivity, and very small internal PIM. At the same time, the conductive paste is in a liquid state before film formation, and the volume will shrink during the curing process, so that while the conductive foam exhibits good conductivity, it can also deform under the action of pressure and rebound after the pressure disappears, thereby effectively reducing the working height of the conductive foam in the first direction and achieving a very small PIM, and the conductive foam itself will not have problems such as fracture and permanent deformation.

[0131] When the conductive foam of the present application is applied to an electronic device, the contact area between the conductive foam and the structure in the electronic device is large, and it can effectively reduce the thickness of the electronic device to achieve ultra-thinness. At the same time, it can also reduce the interface PIM between the structure in the electronic device and the contact surface of the conductive foam, and reduce or eliminate radiation spurious interference, etc.

[0132] The embodiments of the present application do not impose any restrictions on the specific type of the electronic device. In some embodiments, the electronic device of the present application may include a mobile phone, a wearable device (such as a smart bracelet, a smart watch, earphones, etc.), a tablet computer, a laptop, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a cellular phone, a personal digital assistant (PDA), an Internet of Things (IOT) device such as an augmented reality (AR) / virtual reality (VR) device, an in-vehicle electronic device, and may also be a device such as a television, a large screen, a printer, a projector, etc.

[0133] In the application, taking the electronic device as a mobile phone as an example, as Figure 1As shown, the mobile phone may include a display module 101, a middle frame 102, a rear cover 103, etc. Among them, the display module 101 includes a display screen 1011 and a touch panel 1012 disposed on the light-emitting side of the display screen 1011; one side of the carrier plate 1022 is mounted with the display module 101, and the other side is mounted with internal structures such as a camera assembly, an antenna, a circuit board, a battery, etc. The frame 1021 of the middle frame 102 and the carrier plate 1022 may be an integral structure; the rear cover 103 is mounted on the middle frame 102, and the rear cover 103 is used to protect the above internal structures. As Figure 1 shown, the mobile phone may further include a metal frame 1013 mounted on the non-light-emitting side of the display screen 1011. One side of the metal frame 1013 facing away from the display screen 1011 may be adhered to one side of the middle frame 102 through an adhesive layer, so as to achieve the purpose of mounting the display module 101 on one side of the middle frame 102.

[0134] In some embodiments, in the electronic device of the present application, the first structure may be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.; the second structure may be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc. The first structure and the second structure may be the same, or of course different, specifically subject to actual applications. Exemplarily, the camera assembly may include a camera; the circuit board may include a printed circuit board (PCB), a flexible printed circuit (FPC), etc.

[0135] It should be noted that the above display screen may include a liquid crystal display (LCD), an organic light emitting diode (OLED) display screen, etc.

[0136] The above touch panel may include a cover plate made of glass or transparent resin material and a touch electrode pattern located on the side of the cover plate close to the display screen.

[0137] Only the content related to the inventive point is introduced here, and the remaining structures can be obtained with reference to the related art and will not be described in detail here.

[0138] Based on the above structure, when the conductive foam provided by this application is applied to an electronic device, it can be electrically connected to any one of the first structures and / or other structures other than the first structure in the electronic device. Thus, while realizing the electrical connection of the structures in the electronic device through the conductive foam, it can also reduce the thickness of the electronic device, reduce the PIM of the contact surface between the structure in the electronic device and the conductive foam, and in addition, can also reduce or eliminate radiation stray interference, etc., providing a good user experience.

[0139] In the application, at least one surface of the conductive foam provided by the embodiment of this application is used to be electrically connected to at least one structure in the electronic device through a conductive paste layer. At this time, the structures in the electronic device may include at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.

[0140] As an example, when the conductive foam includes a first surface, it may be that the first surface is used to be electrically connected to one first structure through a conductive paste layer, or the first surface is used to be electrically connected to multiple first structures through a conductive paste layer, and no specific limitation is made here.

[0141] As an example, when the conductive foam includes a first surface and other surfaces, for example, when the conductive foam includes a first surface and a second surface, it may be that the first surface is electrically connected to the first structure through a conductive paste layer, and the second surface is electrically connected to the second structure through a conductive paste layer. The second structure can refer to the first structure, which will not be elaborated here. The number of the first structure and the second structure, etc. can also be determined according to actual needs.

[0142] The following Figures 3 to 19 will introduce the conductive foam 05 provided by the embodiment of this application in detail.

[0143] As shown in Figures 3 to 6 、 Figures 9 to 11 、 Figures 13 to 19 , the conductive foam 05 provided by this application includes:

[0144] A foam matrix 1.

[0145] A conductive layer 2, covering at least the first surface 11 of the foam matrix 1. The first surface 11 is used to be electrically connected to the first structure in the electronic device through the conductive layer 2; the conductive layer 2 at least includes a conductive paste layer, and the conductive paste layer is used to deform under the action of an external pressure.

[0146] Among them, the conductive paste layer includes a paste main body and a plurality of connected conductive particles, and the conductive particles are doped in the paste main body.

[0147] This application does not specifically limit the materials, manufacturing processes, etc. of the above-mentioned foam substrate. Exemplarily, the materials of the foam substrate may include polyurethane, resins based on silica substrates, etc. For example, the above-mentioned foam substrate can be formed by a foaming process to serve as the foam core of the conductive foam. The surface of the foamed foam substrate has multiple micropores, and the foam substrate has elasticity and can be well compressed, stretched and deformed.

[0148] This application does not specifically limit the shape of the above-mentioned foam substrate. Exemplarily, the shape of the foam substrate may include polyhedrons, spheres, cylinders, etc. When the shape of the foam substrate is a polyhedron, the polyhedron may include regular polyhedrons or irregular polyhedrons. When the shape of the foam substrate is a regular polyhedron, the regular polyhedron may include cubes, hexahedrons, octahedrons, etc. In Figures 3 to 6 , Figures 9 to 11 , Figures 12 to 19 Among them, the shape of the foam substrate 1 is a hexahedron.

[0149] A polyhedron has multiple surfaces, and the multiple surfaces at least include a first surface, which is the surface that needs to be electrically connected to the first structure in the electronic device; of course, at least one of the other surfaces of the polyhedron except the first surface can also be electrically connected to other structures in the electronic device except the first structure. Exemplarily, the polyhedron can also be provided with a second surface electrically connected to the second structure in the electronic device. Among all the surfaces of the polyhedron, the number of surfaces that need to be electrically connected to the structure of the electronic device can be determined according to the actual application of the conductive foam. At this time, the electrical connection can be an indirect electrical connection, that is, the surface of the polyhedron is electrically connected to the structure in the electronic device through a conductive layer; of course, it can also be that the surface of the polyhedron is sequentially electrically connected to the structure in the electronic device through a first adhesive layer, a conductive layer, etc., and no specific limitation is made here.

[0150] The volume, etc. of the above-mentioned foam substrate of this application can be determined according to actual needs.

[0151] It should be understood that the above-mentioned conductive layer covering at least the first surface of the foam substrate means that: the conductive layer can only cover the first surface of the foam substrate; or, in addition to covering the first surface of the foam substrate, the conductive layer can also cover other surfaces of the foam substrate, where the other surface refers to any surface other than the first surface, and no specific limitation is made here. Taking the shape of the foam substrate as a hexahedron as an example, the conductive layer can cover one surface (the first surface) of the foam substrate; or, the conductive layer can cover two surfaces (the first surface and the second surface) of the foam substrate; or, the conductive layer can cover more than three surfaces of the foam substrate, specifically subject to actual application.

[0152] The following takes the shape of the foam substrate as a hexahedron to specifically exemplify the situation where the conductive layer covers the foam substrate:

[0153] As an example, Figures 3 to 6 , Figures 9 - 11 in [specific context], the conductive layer 2 covers all the first surfaces 11 (upper surfaces), all the second surfaces 12 (lower surfaces), all the third surfaces 13 (left surfaces) and all the fourth surfaces 14 (right surfaces) of the foam substrate 1.

[0154] As another example, Figures 13 to 14 in [specific context], the conductive layer covers some of the first surfaces 11 (upper surfaces), some of the second surfaces 12 (lower surfaces) and all the third surfaces 13 (left surfaces) of the foam substrate 1.

[0155] As yet another example, Figures 15 to 18 in [specific context], the conductive layer covers all the first surfaces 11 (upper surfaces), some of the second surfaces 12 (lower surfaces) and all the third surfaces 13 (left surfaces) of the foam substrate 1.

[0156] As still another example, Figure 19 in [specific context], the conductive layer covers all the first surfaces 11 (upper surfaces), some of the second surfaces 12 (lower surfaces), all the third surfaces 13 (left surfaces) and all the fourth surfaces 14 (right surfaces) of the foam substrate 1.

[0157] It should be noted that at least one of the first surface, the second surface, the third surface and the fourth surface is used for electrical connection with the structure in the electronic device based on the conductive layer. Exemplarily, it can be that all of the first surface, the second surface, the third surface and the fourth surface are electrically connected with the structure in the electronic device based on the conductive layer. Specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, the second surface is used for electrical connection with the second structure in the electronic device based on the conductive layer, the third surface is used for electrical connection with the third structure in the electronic device based on the conductive layer, and the fourth surface is used for electrical connection with the fourth structure in the electronic device based on the conductive layer; or, it can be that only one surface is used for electrical connection with the structure in the electronic device based on the conductive layer. Specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, while the second surface, the third surface and the fourth surface are not used for electrical connection with the structure in the electronic device based on the conductive layer; of course, there can also be other situations, which are not specifically limited here. Among them, the first structure, the second structure, the third structure and the fourth structure can all be any one of a display screen, a camera module, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc., which is specifically determined according to actual needs.

[0158] It should be understood that the above-mentioned conductive layer including at least a conductive paste layer means that the conductive layer may only include a conductive paste layer. For example, the conductive layer is the first conductive paste layer / the second conductive paste layer; or, in addition to the conductive paste layer, the conductive layer may further include other film layers. For example, it may also include a first adhesive layer, a first substrate layer, etc., which are not specifically limited herein.

[0159] This application does not specifically limit the conductive paste of the above-mentioned conductive paste layer. Exemplarily, the conductive paste may include a polymer conductive paste (cured into a film by baking or heating, with an organic polymer as the bonding phase), a sintered conductive paste (sintered into a film, sintering temperature > 500 °C, with glass powder or oxide as the bonding phase), etc. In the following embodiments of this application, the conductive paste is taken as an example of a polymer conductive paste for illustration.

[0160] In application, the conductive paste may include a paste body and a plurality of conductive particles. The plurality of conductive particles are doped in the paste body. The plurality of conductive particles are not connected before curing and are connected after curing, so that multiple current paths are generated in the conductive paste layer formed after curing, thereby conducting electricity. And after curing, the conductive particles shrink in volume to ensure contact between adjacent particles, effectively reducing the PIM inside the conductive paste; at the same time, after curing, the conductive particles spread out, which can increase the contact area between the conductive paste layer and the structure in the electronic device.

[0161] This application does not specifically limit the paste body. Exemplarily, the paste body may include a resin. Specifically, the resin may be any one of silicone resin, silane-modified resin, epoxy resin, silica resin, etc. Among them, silicone resin and silane-modified resin have the characteristics of good elasticity, relatively high viscosity, relatively high adhesiveness, low volume shrinkage rate after curing (for example, less than 10%), high temperature resistance, and no internal stress. Epoxy resin and silica resin have the characteristics of relatively low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation.

[0162] This application does not specifically limit the type, shape, particle size, etc. of the conductive particles. Exemplarily, the conductive particles may include metal conductive particles. Specifically, the metal conductive particles may be any one or a combination of silver (Ag) particles, copper (Gu) particles, gold (Au) particles, aluminum (Al) particles, nickel (Ni) particles, etc.; the shape of the metal conductive particles may include any one of spherical, spiky, flaky, rod-shaped, linear, etc.; the particle size of the metal conductive particles may be in the micron level, nanometer level, etc. Specifically, the particle size value range of the metal conductive particles may include 5 - 20 μm, that is, the particle size of the metal conductive particles may be 5 μm, 8 μm, 10 μm, 13 μm, 17 μm, or 20 μm, etc.

[0163] It should be noted that the elastic moduli of the above-mentioned conductive particles are different. When the main body of the paste is the same resin, when the conductive particles with a smaller elastic modulus are selected and doped into the resin, the conductive paste can undergo a small deformation under a low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

[0164] Table 1 below shows the elastic modulus, Poisson's ratio, pressure, and pressure corresponding to silver particles, copper particles, gold particles, aluminum particles, nickel particles, iron particles, and platinum particles of the same size.

[0165] Table 1

[0166] Particle Elastic modulus (GPa) Poisson's ratio Ag 83 0.37 Cu 130 0.34 Au 78 0.44 Al 70 0.35 Ni 207 0.31 Fe 211 0.29 Pt 168 0.38

[0167] It can be seen from Table 1 that the elastic moduli of silver, gold, and aluminum are all relatively small. When doped into the resin to form a paste layer, since silver, gold, and aluminum are good conductors in themselves and soft, they can be well compressed or stretched. Moreover, the silver particles, gold particles, and aluminum particles in the conductive paste layer can spread out after compression, so that the contact area between the conductive paste layer and the structure in the electronic device is relatively large.

[0168] In addition, the required conductive particles can also be selected according to other conditions:

[0169] As an example, the conductive particles can be selected according to the pressure. For example, when the pressure is relatively high, nickel particles can be selected, and the properties of nickel particles are more stable than those of silver particles, etc.; for another example, when the pressure is moderate, copper particles can be selected, and the cost of copper particles is lower than that of silver particles, etc.

[0170] As another example, the conductive particles can be selected according to the current in the conductive path in the conductive foam. For example, when the current is relatively low or in the low-current region, copper particles can be selected to reduce the cost; for another example, when the current is relatively high or in the high-current region, low-PIM particles such as silver particles and gold particles can be selected to ensure the performance of the conductive foam.

[0171] This application does not specifically limit the doping concentration of the conductive particles in the above-mentioned conductive paste in the main body of the paste. Exemplarily, the range of the mass fraction of the conductive particles in the main body of the paste can include 75-85%. Specifically, the mass fraction of the conductive particles in the main body of the paste can be 75%, 78%, 80%, 81%, 83%, or 85%, etc. Among them, the higher the mass fraction of the conductive particles in the main body of the paste, the smaller the resistivity and the worse the elongation at break. Therefore, the mass fraction of the conductive particles in the main body of the paste can be set relatively high to meet the compression or stretching of the conductive paste layer.

[0172] As an example, take the conductive paste as conductive silver paste. The conductive silver paste includes resin and silver particles, and the silver particles are doped in the resin. Among them, the mass fraction of the silver particles can be 80%, the mass fraction of the resin can be 20%, and the resin can be compressed or stretched; the density of the silver particles can be 10, and the density of the resin can be 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the silver particles to the volume fraction of the resin can be 2:5. After the conductive silver paste is cured, the volume can shrink by about 50%, effectively reducing the PIM between the silver particles, which can even be ignored. Moreover, it can also make the ratio of the volume fraction of the silver particles to the volume fraction of the resin in the conductive silver paste layer be 1:1.25. When contacting the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after being activated under low pressure, further increasing the contact area; the tensile adhesion of the conductive silver paste can have a value range including 8-9 Mpa. Specifically, the tensile adhesion of the conductive silver paste can be 8 Mpa or 9 Mpa, etc.

[0173] It should be noted that the silver particles can be micron-sized spherical, spiky, flaky, rod-shaped silver, or can also be nano-sized silver wires, silver rods, etc., specifically subject to the actual application.

[0174] When the thickness of the conductive paste layer in the direction perpendicular to the foam substrate ranges from 10-13 μm, the resistivity of the conductive paste layer can reach 200 mΩ. Then, if it is desired that the resistivity of the conductive paste layer is lower, the thickness of the conductive paste layer in the direction perpendicular to the foam substrate can be set smaller. This application does not specifically limit the thickness of the above-mentioned conductive paste layer in the direction perpendicular to the foam substrate. Exemplarily, the thickness range of the conductive paste layer in the direction perpendicular to the foam substrate can include 5-10 μm. Specifically, the thickness of the conductive paste layer in the direction perpendicular to the foam substrate can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, etc.

[0175] This application does not specifically limit the manufacturing process of the above-mentioned conductive paste layer. Exemplarily, when the conductive layer only includes the conductive paste layer, the conductive paste can be formed on the surface of the foam substrate by spraying, printing, etc., and then the conductive paste layer can be formed by curing methods such as baking / heating the conductive paste; or, when the conductive layer includes the conductive paste layer and the first substrate layer, the conductive paste can be formed on the surface of the first substrate layer by spraying, printing, etc., and then the conductive paste layer can be formed by curing methods such as baking / heating the conductive paste; or, when the conductive layer includes the conductive paste layer and the first substrate layer, the first substrate can be immersed in the conductive paste first, and then the first substrate layer, the conductive paste and the foam substrate can be combined.

[0176] As an example, when the paste matrix in the conductive paste is silicone resin or silane-modified resin, the silicone resin or silane-modified resin can be first coated by spraying, and then the conductive paste can be baked / heat-cured; alternatively, the first substrate can be immersed in the silicone resin or silane-modified resin, and then the conductive paste can be baked / heat-cured. Of course, other manufacturing processes can also be used, which are not specifically limited here.

[0177] As another example, when the paste matrix in the conductive paste is epoxy resin or silica resin, the epoxy resin or silica resin can be first printed by printing, and then the conductive paste can be baked / heat-cured; alternatively, the first substrate can be immersed in the epoxy resin or silica resin, and then the conductive paste can be baked / heat-cured. Of course, other manufacturing processes can also be used, which are not specifically limited here.

[0178] It should be noted that the paste matrix can also be selected according to the material of the foam matrix. Exemplarily, a substrate with a material similar to that of the foam matrix can be selected as the paste matrix. For example, for a silicone rubber conductive foam, a resin with a silica substrate can be selected, thereby improving the bonding between the foam matrix and the conductive paste.

[0179] Exemplarily, Figure 8 and Figure 9 both take the conductive layer including the first conductive paste layer 21 and the first conductive paste in the first conductive paste layer 21 being the first polymer conductive paste as an example to illustrate the conduction mechanism. Among them, Figure 8 shows a schematic diagram of the first polymer conductive paste before film formation; Figure 9 shows a schematic diagram of the first polymer conductive paste after film formation.

[0180] As Figure 8 shown, before film formation, that is, when uncured, since the first conductive particles 212 do not directly contact, the first conductive paste layer does not have conductivity at this time, and no conductive path will be generated. As Figure 9 shown, during the curing process, as the solvent continuously volatilizes, the distance between the first conductive particles 212 becomes smaller and smaller until they directly contact each other to form a conductive path D1. This is the percolation theory of the first conductive paste. Figure 9 Taking the generation of two conductive paths D1 in the first conductive paste layer as an example for illustration.

[0181] It should be noted that the mass fraction of the first conductive particles in the first conductive paste should be such that the conduction mechanism of the first conductive paste is mainly based on the percolation theory at least. At this time, it includes: the conduction mechanism of the first conductive paste is only the percolation theory; or, the conduction mechanism of the first conductive paste is mainly based on the percolation theory, and can also be supplemented by the tunneling effect theory or the field emission theory. When the mass fraction range of the first conductive particles in the first conductive paste includes 75-85%, the conduction mechanism of the first conductive paste can be mainly based on the percolation theory at least.

[0182] This application does not specifically limit the source of the above-mentioned external pressure. Exemplarily, it can be the pressure directly applied to the conductive foam by the outside; or, it can also be the pressure applied to other structures in the electronic device and then applied to the conductive foam by this structure; or, it can also be the pressure generated by other structures in the electronic device itself and applied to the conductive foam.

[0183] Arbitrarily select two conductive foams of this application below, namely conductive foam 1 and conductive foam 2. Respectively make the first surface of conductive foam 1 electrically connected to the laser-engraved surface in the electronic device and the second surface electrically connected to the copper foil in the electronic device, and make the first surface of conductive foam 2 electrically connected to the laser-engraved surface in the electronic device and the second surface electrically connected to the copper foil in the electronic device. Then, measure the PIM values and the worst tapping values of conductive foam 1 and conductive foam 2 respectively, as shown in Table 2 below.

[0184] Table 2

[0185]

[0186]

[0187] Provide the conductive foam 3 of the related technology below. The surface of the conductive foam 3 is coated with a gold-plated layer. Make the first surface of the conductive foam 3 electrically connected to the laser-engraved surface in the electronic device to form a first contact surface, and the second surface electrically connected to the copper foil in the electronic device. Then, measure the PIM value, the worst tapping value on the workbench, and the worst tapping value on the first contact surface of the conductive foam 3, as shown in Table 3 below.

[0188] Table 3

[0189]

[0190] As can be seen from Table 2 and Table 3, for the conductive foam 1 and conductive foam 2 of the present application, as the external force increases, the worst tapping values at various locations are very stable, and the PIM value also changes little, with good effects. For the conductive foam 3 in the related art, when the external force is small, the worst tapping value of the first contact surface is unstable; moreover, as the external force increases, the PIM value will tend to be stable. However, if the pressure is too high, problems may occur at the contact interfaces on the side that is not pressure-resistant among the multiple contact interfaces between the conductive foam and the structure in the electronic device. For example, screen film printing, battery cover film printing, etc. Therefore, the pressure should not be too high.

[0191] It should be noted that in actual application, the conductive foam may further include structures such as a second adhesive layer and a release layer. The present application does not make specific limitations on the type, position, etc. of the second adhesive layer. Exemplarily, the second adhesive layer may include any one of conductive adhesives, insulating adhesives, etc. Specifically, the second adhesive layer may be any one of a full conductive adhesive, a partial insulating adhesive, etc.; the second adhesive layer may be provided on any surface of the foam substrate.

[0192] The present application does not make specific limitations on the type, position, etc. of the release layer. Exemplarily, the release layer may include release paper; the release layer may be provided on the side of the second adhesive layer away from the conductive layer to protect the second adhesive layer. When using the conductive foam, the release layer can be removed to electrically connect the conductive layer to the structure in the electronic device through the second adhesive layer.

[0193] Only the content related to the inventive points is introduced here, and the remaining structures can be obtained with reference to the related art and will not be elaborated here.

[0194] The conductive foam provided by the embodiment of the present application, by providing a conductive paste layer covering at least the first surface of the foam substrate, on the one hand, the conductive paste in the conductive paste layer has certain ductility, good conductivity, and a relatively large resistivity (10 -5 -10 -4It has properties such as Ω×cm), and the conductive paste is in a liquid state before film formation, and its volume will shrink during the curing process. As a result, while the conductive foam exhibits good conductivity, it can also deform under pressure. Combining with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low. For example, the working height of the conductive foam in the first direction ranges from 0.1 - 0.15 mm. Specifically, the working height of the conductive foam in the first direction can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, or 0.15 mm, etc.; on the other hand, the conductive paste is sintered into layers, and the volume shrinks to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; on the other hand, when the conductive paste cures into a conductive paste layer, the conductive particles in the conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large. For example, the contact area can reach more than 43.46%.

[0195] Therefore, the present application provides a conductive foam with a relatively low working height, small PIM, and low stress in the first direction. When this conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface of the conductive foam and the structure in the electronic device relatively small; in addition, it can realize the electrical connection of the structure in the electronic device through the conductive foam, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0196] The following combines Figure 3 and Figure 4 , and specifically illustrates the case where the conductive layer is the first conductive paste layer 21.

[0197] In Figure 3 and Figure 4 , the conductive layer is the first conductive paste layer 21. Multiple first conductive particles 212 in the first conductive paste layer 21 are doped in the first paste matrix 211. The multiple first conductive particles 212 are not connected before curing and are connected after curing, so that multiple current paths are generated in the first conductive paste layer 21 formed after curing, thereby conducting electricity. And after curing, the first conductive particles 212 shrink in volume to ensure the contact between adjacent particles, effectively reducing the PIM inside the first conductive paste; at the same time, after curing, the first conductive particles 212 spread out, which can increase the contact area between the first conductive paste layer 21 and the structure in the electronic device.

[0198] The present application does not specifically limit the conductive paste in the above-mentioned first conductive paste layer. Exemplarily, the conductive paste can include polymer conductive paste, sintered conductive paste, etc. In the following embodiments of the present application, the conductive paste in the first conductive paste layer is taken as an example of polymer conductive paste for illustration.

[0199] This application does not specifically limit the first paste matrix. Exemplarily, the first paste matrix may include a first resin. Specifically, the first resin may be an epoxy resin, a silica resin, etc. Among them, both the epoxy resin and the silica resin have characteristics such as a relatively small viscosity, easy leveling, a relatively large volume change rate after curing (for example, greater than 50%), easy curing, a relatively large internal stress, and good heat dissipation.

[0200] This application does not specifically limit the type, shape, size, etc. of the first conductive particles. Exemplarily, the first conductive particles may include first metal conductive particles. Specifically, the first metal conductive particles may be any one or a combination of silver particles, copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the first metal conductive particles may include any one of spherical, spiky, flaky, rod-shaped, wire-shaped, etc.; the size of the first metal conductive particles may be in the micron level, nanometer level, etc. Specifically, the particle size value range of the first metal conductive particles may include 5 - 20 μm, that is, the particle size of the first metal conductive particles may be 5 μm, 8 μm, 10 μm, 13 μm, 17 μm, or 20 μm, etc.

[0201] It should be noted that the elastic moduli of the above-mentioned first conductive particles are different. When the first paste matrix is the same first resin, when selecting first conductive particles with a relatively small elastic modulus and doping them into the first resin, the first conductive paste can undergo a small deformation under a low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

[0202] This application does not specifically limit the doping concentration of the first conductive particles in the above-mentioned first conductive paste in the first paste matrix. Exemplarily, the mass fraction value range of the first conductive particles in the first paste matrix may include 75 - 85%.

[0203] Specifically, the mass fraction of the first conductive particles in the first paste matrix may be 75%, 78%, 80%, 81%, 83%, or 85%, etc.

[0204] As an example, it is described by taking the first conductive paste as the first conductive silver paste, where the first conductive silver paste includes a first resin and first silver particles, and the first silver particles are doped in the first resin. Among them, the mass fraction of the first silver particles can be 80%, the mass fraction of the first resin can be 20%, and the first resin can be compressed or stretched; the density of the first silver particles can be 10, and the density of the first resin can be 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the first silver particles to the volume fraction of the first resin can be 2:5. After the first conductive silver paste is cured, the volume can shrink by about 50%, effectively reducing the PIM between the first silver particles, which can even be negligible. Moreover, it can also make the ratio of the volume fraction of the first silver particles to the volume fraction of the first resin in the first conductive silver paste layer be 1:1.25. When contacting the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, since the silver particles themselves are good conductors and soft, they will deform after being activated under low pressure, further increasing the contact area; the value range of the tensile adhesion of the first conductive silver paste can include 8-9 Mpa. Specifically, the tensile adhesion of the first conductive silver paste can be 8 Mpa or 9 Mpa, etc.

[0205] It should be noted that the silver particles can be micron-sized spherical, spiky, flaky, rod-shaped silver, or can also be nano-sized silver wires, silver rods, etc., specifically subject to the actual application.

[0206] This application does not specifically limit the thickness of the above-mentioned first conductive paste layer in the direction perpendicular to the foam substrate. Exemplarily, the value range of the thickness of the first conductive paste layer in the direction perpendicular to the foam substrate can include 5-10 μm. Specifically, the thickness of the first conductive paste layer in the direction perpendicular to the foam substrate can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, etc.

[0207] This application does not specifically limit the manufacturing process of the above-mentioned first conductive paste layer. Exemplarily, the first conductive paste can be first formed on the surface of the foam substrate by methods such as printing, and then the first conductive paste layer can be formed by curing methods such as baking / heating the first conductive paste.

[0208] The conductive foam provided by the embodiments of the present application, by providing a first conductive paste layer covering at least the first surface of the foam matrix, on the one hand, the first conductive paste in the first conductive paste layer has properties such as a relatively small viscosity, easy to level, a relatively large volume change rate after curing, easy to cure, a relatively large internal stress, and good heat dissipation. Moreover, the first conductive paste is in a liquid state before film formation, and the volume will shrink during the curing process, so that while the conductive foam exhibits good conductivity, it can also deform under pressure. Combining with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low; on the other hand, the first conductive paste is sintered into a layer, and the volume shrinks to ensure the contact force between multiple first conductive particles, so that the PIM inside the first conductive paste is very small; on the other hand, when the first conductive paste cures into the first conductive paste layer, the conductive particles in the first conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large.

[0209] Therefore, the present application provides a conductive foam with a relatively low working height, small PIM, and low stress in the first direction. When this conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface between the conductive foam and the structure in the electronic device relatively small; in addition, it can realize the electrical connection of the structure in the electronic device through the conductive foam, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0210] The following Figure 5 and Figure 6 are used to specifically illustrate the case where the conductive layer is the second conductive paste layer 22.

[0211] In Figures 5 to 6 and Figure 19 , the conductive layer is the second conductive paste layer 22. A plurality of second conductive particles 222 in the second conductive paste layer 22 are doped in the second paste matrix 221. The plurality of second conductive particles 222 are not connected before curing and are connected after curing, so that multiple current paths are generated in the second conductive paste layer 22 formed after curing, thereby conducting electricity. And after curing, the second conductive particles 222 shrink in volume to ensure the contact between adjacent particles, effectively reducing the PIM inside the second conductive paste; at the same time, after curing, the second conductive particles 222 spread out, which can increase the contact area between the second conductive paste layer 22 and the structure in the electronic device.

[0212] The present application does not specifically limit the conductive paste in the above-mentioned second conductive paste layer. Exemplarily, the conductive paste may include polymer conductive paste, sintered conductive paste, etc. In the following embodiments of the present application, the conductive paste in the second conductive paste layer is taken as an example of polymer conductive paste for illustration.

[0213] This application does not specifically limit the second paste matrix. Exemplarily, the second paste matrix may include a second resin. Specifically, the second resin may be any one of silicone resins, silane-modified resins, etc. Among them, silicone resins and silane-modified resins both have characteristics such as good elasticity, relatively high viscosity, relatively high adhesiveness, low volume shrinkage rate after curing (for example, less than 10%), high temperature resistance, and no internal stress.

[0214] This application does not specifically limit the type, shape, size, etc. of the second conductive particles. Exemplarily, the second conductive particles may include second metal conductive particles. Specifically, the second metal conductive particles may be any one or a combination of silver particles, copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the second metal conductive particles may include any one of spherical, spiky, flaky, rod-shaped, linear, etc.; the size of the second metal conductive particles may be in the micrometer range, nanometer range, etc. Specifically, the particle size value range of the second metal conductive particles may include 5 - 20 μm, that is, the particle size of the second metal conductive particles may be 5 μm, 8 μm, 10 μm, 13 μm, 17 μm, 20 μm, etc.

[0215] It should be noted that the elastic moduli of the above-mentioned second conductive particles are different. When the second paste matrix is the same second resin, when selecting second conductive particles with a smaller elastic modulus and doping them into the second resin, the second conductive paste can undergo slight deformation under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

[0216] This application does not specifically limit the doping concentration of the second conductive particles in the above-mentioned second conductive paste in the second paste matrix. Exemplarily, the mass fraction value range of the second conductive particles in the second paste matrix may include 75 - 85%.

[0217] Specifically, the mass fraction of the second conductive particles in the second paste matrix may be 75%, 78%, 80%, 81%, 83%, 85%, etc.

[0218] As an example, it is described by taking the second conductive paste as the second conductive silver paste, where the second conductive silver paste includes a second resin and second silver particles, and the second silver particles are doped in the second resin. Among them, the mass fraction of the second silver particles can be 80%, the mass fraction of the second resin can be 20%, and the second resin can be compressed or stretched; the density of the second silver particles can be 10, and the density of the second resin can be 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the second silver particles to the volume fraction of the second resin can be 2:5. After the second conductive silver paste is cured, the volume can shrink by about 50%, effectively reducing the PIM between the second silver particles, which can even be negligible. Moreover, it can also make the ratio of the volume fraction of the second silver particles to the volume fraction of the second resin in the second conductive silver paste layer be 1:1.25. When contacting the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, since the silver particles themselves are good conductors and soft, they will deform after being activated under low pressure, further increasing the contact area; the tensile adhesion of the second conductive silver paste can have a value range including 8 - 9 Mpa. Specifically, the tensile adhesion of the second conductive silver paste can be 8 Mpa or 9 Mpa, etc.

[0219] It should be noted that the silver particles can be micron-sized spherical, spiky, flaky, rod-shaped silver, or can also be nano-sized silver wires, silver rods, etc., specifically subject to the actual application.

[0220] This application does not specifically limit the thickness of the above-mentioned second conductive paste layer in the direction perpendicular to the foam substrate. Exemplarily, the thickness value range of the second conductive paste layer in the direction perpendicular to the foam substrate can include 5 - 10 μm. Specifically, the thickness of the second conductive paste layer in the direction perpendicular to the foam substrate can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, etc.

[0221] This application does not specifically limit the manufacturing process of the above-mentioned second conductive paste layer. Exemplarily, the second conductive paste can be first formed on the surface of the foam substrate by spraying or other methods, and then the second conductive paste layer can be formed by curing methods such as baking / heating the second conductive paste.

[0222] The conductive foam provided by the embodiment of the present application, by providing a second conductive paste layer covering at least the first surface of the foam matrix, on the one hand, the second conductive paste in the second conductive paste layer has the properties of good elasticity, large viscosity, large adhesiveness, low volume shrinkage rate after curing, high temperature resistance, no internal stress, etc., and the second conductive paste is in a liquid state before film formation and its volume will shrink during the curing process, so that while the conductive foam exhibits good conductivity, it can also deform under pressure. Combining with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be lower; on the other hand, the second conductive paste is sintered into a layer and its volume shrinks to ensure the contact force between multiple second conductive particles, so that the PIM inside the second conductive paste is very small; on the other hand, when the second conductive paste cures into the second conductive paste layer, the conductive particles in the second conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0223] Therefore, the present application provides a conductive foam with a lower working height, small PIM, and low stress in the first direction. When this conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface of the conductive foam and the structure in the electronic device smaller; in addition, it can achieve the electrical connection of the structure in the electronic device through the conductive foam, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0224] Optionally, as an implementable manner, referring to Figures 9 to 11 、 Figures 13 to 18 shown, the conductive layer further includes a first substrate layer 6, and the first substrate layer 6 is used to deform under the action of an external pressure; the orthographic projection of the conductive paste layer on the foam matrix at least partially coincides with the orthographic projection of the first substrate layer 6 on the foam matrix.

[0225] The present application does not specifically limit the type of the above-mentioned first substrate layer. Exemplarily, the above-mentioned first substrate layer may include a polyimide (PI) layer, non-woven fabric, etc.

[0226] It should be noted that the first substrate layer should be able to be well compressed or stretched, the surface roughness of the first substrate layer is moderate, there are no scratches or only very few scratches on the surface, and it is suitable for spraying, printing, etc. of the conductive paste.

[0227] The present application does not specifically limit the thickness of the above-mentioned first substrate layer in the direction perpendicular to the foam matrix. Exemplarily, the thickness value range of the first substrate layer in the direction perpendicular to the foam matrix may include 1-2 μm. Specifically, the thickness of the first substrate layer in the direction perpendicular to the foam matrix may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm or 2 μm, etc.

[0228] It should be understood that at least partial coincidence of the orthographic projection of the above-mentioned conductive paste layer on the foam substrate with the orthographic projection of the first base material layer on the foam substrate means that: the orthographic projection of the conductive paste layer on the foam substrate coincides partially with the orthographic projection of the first base material layer on the foam substrate; or, the orthographic projection of the conductive paste layer on the foam substrate coincides entirely with the orthographic projection of the first base material layer on the foam substrate, and no specific limitation is made here.

[0229] In the case where the orthographic projection of the conductive paste layer on the foam substrate coincides partially with the orthographic projection of the first base material layer on the foam substrate, it may be that the orthographic projection of the conductive paste layer on the foam substrate is within the orthographic projection of the first base material layer on the foam substrate; or, it may be that the orthographic projection of the first base material layer on the foam substrate is within the orthographic projection of the conductive paste layer on the foam substrate.

[0230] No specific limitation is made here for the structure of the above-mentioned conductive paste layer. Exemplarily, the conductive paste layer may be a single layer. For example, the conductive paste layer may be a first conductive paste layer / second conductive paste layer; or, the conductive paste layer may be a multi-layer. For example, the conductive paste layer may include a first conductive paste layer and a second conductive paste layer.

[0231] No specific limitation is made in this application for the thickness of the single-layer conductive paste layer in the direction perpendicular to the foam substrate. Exemplarily, the value range of the thickness of the single-layer conductive paste layer in the direction perpendicular to the foam substrate may include 5-10 μm. Specifically, the thickness of the single-layer conductive paste layer in the direction perpendicular to the foam substrate may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

[0232] No specific limitation is made in this application for the relationship between the conductive paste layer and the first base material layer. Exemplarily, the conductive paste layer and the first base material layer may be independent film layers respectively. As an example, the conductive paste layer may be provided on either side of the first base material layer; as another example, the conductive paste layer may at least wrap the surface of the first base material layer close to the foam substrate and the surface of the first base material layer away from the foam substrate.

[0233] Or, exemplarily, the conductive paste layer and the first base material layer are not independent film layers. As an example, in addition to at least wrapping the surface of the first base material layer close to the foam substrate and the surface of the first base material layer away from the foam substrate, the conductive paste layer may also penetrate into the interior of the first base material layer. As Figure 13 shown, when the first base material layer is non-woven fabric, since the non-woven fabric has no warp and weft, but only arranges textile short fibers or filaments in a directional or random manner to form a fiber web structure, then immersing the non-woven fabric in the conductive paste, the conductive paste can at least wrap the two surfaces of the non-woven fabric and penetrate into the pores of the non-woven fabric to form a conductive layer.

[0234] The conductive foam provided by the embodiment of the present application, by providing a first substrate layer and a conductive paste layer, on the one hand, the first substrate layer has elasticity and can be well compressed or stretched; on the other hand, the conductive paste has properties such as certain ductility, good conductivity, and large resistivity, and the volume of the conductive paste will shrink during the curing process, so that while the conductive foam exhibits good conductivity, it can also deform under pressure. Combining with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low; at the same time, the conductive paste is sintered into a layer and the volume shrinks, which can make the PIM inside the conductive paste very small; and when the conductive paste cures into the conductive paste layer, it spreads out, which can make the contact area between the conductive foam and the structure in the electronic device relatively large.

[0235] Therefore, the present application provides a conductive foam with a relatively low working height, small PIM, and low stress in the first direction. When this conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface of the conductive foam and the structure in the electronic device relatively small; in addition, it can realize the electrical connection of the structure in the electronic device through the conductive foam and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0236] Optionally, as an implementable way, as Figures 9 to 11 shown, the conductive paste layer is the first conductive paste layer 21, and the first conductive paste layer 21 is arranged on the side of the first substrate layer 6 away from the foam matrix 1; the conductive layer further includes a first bonding layer, and the first bonding layer is arranged between the first substrate layer 6 and the foam matrix 1, and the first bonding layer is used to bond the first substrate layer 6 and the foam matrix 1 and deform under the action of external pressure.

[0237] The present application does not specifically limit the type of the first bonding layer. Exemplarily, the first bonding layer can be an adhesive layer, a conductive paste layer, etc.

[0238] As Figure 9 and Figure 10 shown, when the first bonding layer is the adhesive layer 5, the material of the adhesive layer 5 can be a thermosetting adhesive.

[0239] As Figure 11 shown, when the first bonding layer is a conductive paste layer, the conductive paste layer can be the second conductive paste layer 22.

[0240] The present application does not specifically limit the thickness of the first bonding layer along the direction perpendicular to the foam matrix. Exemplarily, the value range of the thickness of the first bonding layer along the direction perpendicular to the foam matrix can include 1 - 2 μm. Specifically, the thickness of the first bonding layer along the direction perpendicular to the foam matrix can be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm, or 2 μm, etc.

[0241] It should be noted that when the first adhesive layer is the second conductive paste layer, in the direction perpendicular to the foam substrate, the present application does not specifically limit the thickness value range of the conductive layer composed of the second conductive paste layer, the first substrate layer, and the first conductive paste layer. Exemplarily, the thickness value range may include 10-20 μm. Specifically, the thickness of the conductive layer composed of the second conductive paste layer, the first substrate layer, and the first conductive paste layer may be 10 μm, 13 μm, 15 μm, 16 μm, 18 μm, 20 μm, and so on.

[0242] It should be noted that when the conductive layer covers multiple surfaces of the foam substrate, for Figures 9 to 11 any one of the conductive foams, the thicknesses of the conductive layers covering different surfaces of the foam substrate may be partially the same; or, the thicknesses of the conductive layers covering different surfaces of the foam substrate may be all the same; or, the thicknesses of the conductive layers covering different surfaces of the foam substrate may be all different, and no specific limitation is made here.

[0243] The conductive foam provided by the embodiments of the present application can bond the first conductive paste layer and the foam substrate well through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer in the direction perpendicular to the foam substrate can be small. In this way, the working height of the conductive foam in the first direction can be low; moreover, the first adhesive layer does not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, so that a conductive foam with a low working height, small PIM, and low stress in the first direction can be obtained. When the conductive foam is applied to an electronic device, it can reduce the thickness of the electronic device while making the PIM between the contact interface of the conductive foam and the structure in the electronic device small; in addition, it can realize the electrical connection of the structure in the electronic device through the conductive foam and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0244] Optionally, as an implementable way, as Figures 13 to 18 shown, the conductive paste layer is the first conductive paste layer 21, and the first conductive paste layer 21 at least wraps the surface of the first substrate layer 6 close to the foam substrate 1 side and the surface of the first substrate layer 6 far from the foam substrate 1 side; the conductive layer further includes a first adhesive layer, and the first adhesive layer is arranged between the first conductive paste layer 21 and the foam substrate 1, and the first adhesive layer is used to bond the first conductive paste layer 21 and the foam substrate 1 and deform under the action of an external pressure.

[0245] It should be understood that the above-mentioned first conductive paste layer covering at least the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side means that the first conductive paste layer can only cover the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side; or, in addition to covering the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side, the first conductive paste layer can also include other surfaces of the first substrate layer; or, in addition to covering the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side, the first conductive paste layer can also penetrate into the interior of the first substrate layer, and no specific limitation is made here.

[0246] As an example, when the first substrate layer is a PI layer, the first conductive paste layer can cover the surface of the PI layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side.

[0247] As another example, when the first substrate layer is a PI layer, the first conductive paste layer can cover all surfaces of the PI layer.

[0248] As yet another example, when the first substrate layer is a non-woven fabric, the first conductive paste layer can cover the surface of the non-woven fabric close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side.

[0249] As still another example, when the first substrate layer is a non-woven fabric, the first conductive paste layer can cover all surfaces of the non-woven fabric.

[0250] As a further example, when the first substrate layer is a non-woven fabric, the first conductive paste layer can cover all surfaces of the non-woven fabric and penetrate into the internal pores of the non-woven fabric. At this time, since the first conductive paste is filled inside the non-woven fabric, the non-woven fabric is not easily torn when compressed or stretched.

[0251] It should be noted that the orthographic projection of the above-mentioned first substrate layer on the foam matrix and the orthographic projection of the first conductive paste layer on the foam matrix can partially overlap; or, the orthographic projection of the first substrate layer on the foam matrix and the orthographic projection of the first conductive paste layer on the foam matrix can completely overlap, and no specific limitation is made here.

[0252] The present application does not make specific limitations on the type of the first adhesive layer. Exemplarily, the first adhesive layer can be an adhesive layer, a conductive paste layer, etc.

[0253] As Figure 13 and Figure 14 、 Figure 17 and Figure 18 shown, when the first adhesive layer is the adhesive layer 5, the material of the adhesive layer 5 can be a thermosetting adhesive.

[0254] As Figure 15 and Figure 16 shown, when the first adhesive layer is a conductive paste layer, the conductive paste layer may be the second conductive paste layer 22.

[0255] This application does not specifically limit the thickness of the first adhesive layer in the direction perpendicular to the foam substrate. Exemplarily, the thickness range of the first adhesive layer in the direction perpendicular to the foam substrate may include 1 - 2 μm. Specifically, the thickness of the first adhesive layer in the direction perpendicular to the foam substrate may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm, or 2 μm, etc.

[0256] It should be noted that when the first adhesive layer is the second conductive paste layer, in the direction perpendicular to the foam substrate, this application does not specifically limit the thickness range of the conductive layer composed of the second conductive paste layer, the first substrate layer, and the first conductive paste layer. Exemplarily, the thickness range may include 10 - 20 μm. Specifically, the thickness of the conductive layer composed of the second conductive paste layer, the first substrate layer, and the first conductive paste layer may be 10 μm, 13 μm, 15 μm, 16 μm, 18 μm, or 20 μm, etc.

[0257] As an example, Figure 13 and Figure 14 in, the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and forms a conductive layer with the adhesive layer 5, and this conductive layer is provided on a part of the first surface 11, a part of the second surface 12, and all of the third surface 13 of the foam substrate 1.

[0258] As another example, as Figure 15 shown, the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and forms a conductive layer with the second conductive paste layer 22, and this conductive layer is provided on all of the first surface 11, a part of the second surface 12, and all of the third surface 13 of the foam substrate 1.

[0259] As yet another example, as Figure 16 shown, the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and is provided on all of the first surface 11, a part of the second surface 12, and all of the third surface 13 of the foam substrate 1. At the same time, the second conductive paste layer 22 is provided on all of the first surface 11 and a part of the second surface 12 of the foam substrate 1 to form a conductive layer.

[0260] It should be noted that, firstly, the conductive paste layer may further include a first conductive paste layer and a second conductive paste layer. Among them, the first conductive paste layer at least wraps the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side, and the second conductive paste layer at least wraps the surface of the first conductive paste layer close to the foam matrix side, the surface of the first conductive paste layer far from the foam matrix side, and is used to bond the first conductive paste layer and the foam matrix.

[0261] As an example, the first conductive paste layer wraps the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side, and the second conductive paste layer wraps the surface of the first conductive paste layer close to the foam matrix side and the surface of the first conductive paste layer far from the foam matrix side.

[0262] As another example, the first conductive paste layer wraps the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side, and the second conductive paste layer wraps all surfaces of the first conductive paste layer.

[0263] As yet another example, the first conductive paste layer wraps all surfaces of the first substrate layer, and the second conductive paste layer wraps the surface of the first conductive paste layer close to the foam matrix side and the surface of the first conductive paste layer far from the foam matrix side.

[0264] As still another example, the first conductive paste layer wraps all surfaces of the first substrate layer, and the second conductive paste layer wraps all surfaces of the first conductive paste layer, which is not specifically limited here.

[0265] Secondly, the conductive paste layer may also be a second conductive paste layer. Among them, the second conductive paste layer at least wraps the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side, and the second conductive paste layer is used to bond with the foam matrix.

[0266] As an example, the second conductive paste layer wraps the surface of the first substrate layer close to the foam matrix side and the surface of the first substrate layer far from the foam matrix side.

[0267] As another example, the second conductive paste layer wraps all surfaces of the first substrate layer, which is not specifically limited here.

[0268] Thirdly, when the conductive layer covers multiple surfaces of the foam matrix, for Figures 13 to 18 any one of the conductive foams, the thicknesses of the conductive layers covering different surfaces of the foam matrix may be partially the same; or, the thicknesses of the conductive layers covering different surfaces of the foam matrix may be all the same; or, the thicknesses of the conductive layers covering different surfaces of the foam matrix may all be different, which is not specifically limited here.

[0269] The conductive foam provided by the embodiment of the present application wraps at least the surface of the first base layer close to the foam matrix side and the surface of the first base layer far from the foam matrix side through the first conductive paste layer, and the first conductive paste layer can be well bonded to the foam matrix through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam matrix is small, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix can be small. In this way, the working height of the conductive foam in the first direction can be low; moreover, the first adhesive layer does not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, so that a conductive foam with a low working height, small PIM, and low stress in the first direction can be obtained. When the conductive foam is applied to an electronic device, the thickness of the electronic device can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic device can be small; in addition, the electrical connection of the structure in the electronic device can be realized through the conductive foam, and radiation stray interference and the like can be reduced or eliminated, effectively improving the performance of the electronic device.

[0270] Optionally, as an implementable manner, as Figure 17 and Figure 18 shown, the first surface 11 of the foam matrix 1 is at least divided into a first region Q1 and a second region Q2. Along the direction perpendicular to the foam matrix 1, the height of the part of the conductive layer located in the first region Q1 is less than the height of the part of the conductive layer located in the second region Q2.

[0271] It should be understood that the first surface of the above-mentioned foam matrix being at least divided into a first region and a second region means that the first surface of the foam matrix can be only divided into a first region and a second region; or, in addition to being divided into a first region and a second region, the first surface of the foam matrix can also be divided into other regions, such as a third region, a fourth region, etc., which are not specifically limited here.

[0272] The present application does not specifically limit the position, area relationship, etc. between the first region and the second region. Exemplarily, the first region and the second region can be located at any position, where the area of the first region can be larger than the area of the second region; or, the area of the first region can be smaller than the area of the second region; or, the area of the first region can be equal to the area of the second region.

[0273] The following specifically describes how to achieve that the height of the part of the conductive layer located in the first region is less than the height of the part of the conductive layer located in the second region.

[0274] The first way can be that the structure of the part of the conductive layer located in the first region is the same as that of the part located in the second region, but the heights are different.

[0275] It should be understood that in the case where the conductive layer is a single layer, for example, when the conductive layer is a conductive paste layer, for example, when the conductive layer is the first conductive paste layer, along the direction perpendicular to the foam substrate, the height of the part of the first conductive paste layer located in the first region is less than the height of the part of the first conductive paste layer located in the second region; and for another example, when the conductive layer is the second conductive paste layer, along the direction perpendicular to the foam substrate, the height of the part of the second conductive paste layer located in the first region is less than the height of the part of the second conductive paste layer located in the second region.

[0276] It should be understood that in the case where the conductive layer is a multi-layer, along the direction perpendicular to the foam substrate, it may be that the height of at least one layer of the conductive layer in the first region is different from that in the second region.

[0277] For example, in the case where the conductive layer includes a first adhesive layer, a first base material layer, and a first conductive paste layer, along the direction perpendicular to the foam substrate, it may be that the height of at least one layer of the first adhesive layer, the first base material layer, and the first conductive paste layer in the first region is different from that in the second region. Specifically, along the direction perpendicular to the foam substrate, it may be that the height of the part of the first adhesive layer in the first region is different from that in the second region, and the height of the part of the first base material layer and the first conductive paste layer in the first region is the same as that in the second region; or, it may be that the height of the part of the first base material layer in the first region is different from that in the second region, and the height of the part of the first adhesive layer and the first conductive paste layer in the first region is the same as that in the second region; or, it may be that the height of the part of the first conductive paste layer in the first region is different from that in the second region, and the height of the part of the first adhesive layer and the first base material layer in the first region is the same as that in the second region; or, it may be that the height of the part of the first adhesive layer and the first base material layer in the first region is different from that in the second region, and the height of the part of the first conductive paste layer in the first region is the same as that in the second region; or, it may be that the height of the part of the first adhesive layer and the first conductive paste layer in the first region is different from that in the second region, and the height of the part of the first base material layer in the first region is the same as that in the second region; or, it may be that the height of the part of the first base material layer and the first conductive paste layer in the first region is different from that in the second region, and the height of the part of the first adhesive layer in the first region is the same as that in the second region; or, it may be that the height of the part of the first adhesive layer, the first base material layer, and the first conductive paste layer in the first region is different from that in the second region.

[0278] Of course, the conductive layer may further include other film layers, and thus there may be other various setting methods, which are not specifically limited here.

[0279] As an example, in Figure 17In the case, the portions of the conductive layer located in the first region Q1 and the second region Q2 both include an adhesive layer 5, a first base material layer 6, and a first conductive paste layer 21. As Figure 17 shown, along the direction perpendicular to the foam substrate 1, the heights of the adhesive layer 5 and the first base material layer 6 in the first region Q1 are the same as those in the second region Q2, and the height of the first conductive paste layer 21 in the first region Q1 is less than that in the second region Q2.

[0280] Second, it can be that the structure of the portion of the conductive layer located in the first region is different from that of the portion of the conductive layer located in the second region and the heights are different.

[0281] It should be understood that in the case where the conductive layer is multilayered, along the direction perpendicular to the foam substrate, it can be that the heights of the same layer structure in the portion of the conductive layer in the first region and the portion in the second region are different.

[0282] Exemplarily, when the conductive layer in the first region includes a first adhesive layer, a first base material layer, and a first conductive paste layer, and the conductive layer in the second region includes a first adhesive layer, a first base material layer, a first conductive paste layer, and a second base material layer, along the direction perpendicular to the foam substrate, it can be that at least one layer among the first adhesive layer, the first base material layer, and the first conductive paste layer has different heights in the portion in the first region and the portion in the second region. Specifically, along the direction perpendicular to the foam substrate, it can be that the height of the first adhesive layer in the portion in the first region is different from that in the portion in the second region, and the heights of the first base material layer and the first conductive paste layer in the portion in the first region are the same as those in the portion in the second region; or, it can be that the height of the first base material layer in the portion in the first region is different from that in the portion in the second region, and the heights of the first adhesive layer and the first conductive paste layer in the portion in the first region are the same as those in the portion in the second region; or, it can be that the height of the first conductive paste layer in the portion in the first region is different from that in the portion in the second region, and the heights of the first adhesive layer and the first base material layer in the portion in the first region are the same as those in the portion in the second region; or, it can be that the heights of the first adhesive layer and the first base material layer in the portion in the first region are different from those in the portion in the second region, and the height of the first conductive paste layer in the portion in the first region is the same as that in the portion in the second region; or, it can be that the heights of the first adhesive layer and the first conductive paste layer in the portion in the first region are different from those in the portion in the second region, and the height of the first base material layer in the portion in the first region is the same as that in the portion in the second region; or, it can be that the heights of the first base material layer and the first conductive paste layer in the portion in the first region are different from those in the portion in the second region, and the height of the first adhesive layer in the portion in the first region is the same as that in the portion in the second region; or, it can be that the heights of the first adhesive layer, the first base material layer, and the first conductive paste layer in the portion in the first region are all different from those in the portion in the second region.

[0283] Of course, the conductive layer may further include other film layers, and thus there may be various other setting manners, which are not specifically limited herein.

[0284] It should be understood that in the case where the conductive layer is multilayered, along the direction perpendicular to the foam substrate, the height of the same layer structure in the conductive layer in the first region may be the same as that in the second region.

[0285] Exemplarily, when the conductive layer in the first region includes a first adhesive layer, a first substrate layer, and a first conductive paste layer, and the conductive layer in the second region includes a first adhesive layer, a first substrate layer, a first conductive paste layer, and a second substrate layer, along the direction perpendicular to the foam substrate, the height of the first adhesive layer, the first substrate layer, and the first conductive paste layer in the first region may be the same as that in the second region.

[0286] Of course, the conductive layer may further include other film layers, and thus there may be various other setting manners, which are not specifically limited herein.

[0287] As an example, in Figure 18 , the part of the conductive layer located in the first region Q1 includes an adhesive layer 5, a first substrate layer 6, and a first conductive paste layer 21, and the part of the conductive layer located in the second region Q2 includes an adhesive layer 5, a first substrate layer 6, a first conductive paste layer 21, and a second substrate layer 9. As Figure 18 shown, along the direction perpendicular to the foam substrate 1, the heights of the adhesive layer 5, the first substrate layer 6, and the first conductive paste layer 21 located in the first region Q1 and the second region Q2 are the same. Thus, the second substrate layer 9 makes the height of the part of the conductive layer located in the first region Q1 less than the height of the part of the conductive layer located in the second region Q2.

[0288] This application does not specifically limit the type of the above-mentioned second substrate layer. Exemplarily, the above-mentioned second substrate layer may include a polyimide layer, non-woven fabric, etc.

[0289] It should be noted that the second substrate layer should be able to be well compressed or stretched, the surface roughness of the second substrate layer is moderate, and there should be no scratches or only very few scratches on the surface, etc.

[0290] This application does not specifically limit the thickness of the above-mentioned second substrate layer along the direction perpendicular to the foam substrate. Exemplarily, the thickness value range of the second substrate layer along the direction perpendicular to the foam substrate may include 1 - 2 μm. Specifically, the thickness of the second substrate layer along the direction perpendicular to the foam substrate may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm, or 2 μm, etc.

[0291] It should be noted that, first, the above-mentioned second substrate layer can also be replaced with any other structure. For example, the second substrate layer and at least the first conductive paste layer that wraps the surface of the second substrate layer close to the foam matrix side and the surface of the second substrate layer far from the foam matrix side are not specifically limited here.

[0292] Second, along the direction perpendicular to the foam matrix, if the height of the conductive paste layer in the first region is set to be less than the height of the conductive paste layer in the second region to achieve that the height of the conductive layer in the first region is less than the height of the conductive layer in the second region, since the conductive paste layer can only be sprayed / printed with a relatively thin height, thus, it is applicable to the case where the step difference between the height of the conductive layer in the first region and the height of the conductive layer in the second region is small. Exemplarily, the value range of the step difference between the height of the conductive layer in the first region and the height of the conductive layer in the second region can include 28 - 32 μm. Specifically, the step difference between the height of the conductive layer in the first region and the height of the conductive layer in the second region can be 28 μm, 29 μm, 30 μm, 31 μm or 32 μm, etc.

[0293] If it is necessary to achieve a large step difference between the height of the conductive layer in the first region and the height of the conductive layer in the second region, it can be achieved by setting the height of any layer in the conductive layer in the first region to be different from the height in the second region; or, other film layer structures can be set in the second region, etc., which are not specifically limited here.

[0294] For the conductive foam provided by the embodiments of the present application, along the direction perpendicular to the foam matrix, by setting the height of the conductive layer in the first region to be different from the height of the part of the conductive layer in the second region, when applied to an electronic device, the conductive foam can be electrically connected to at least two structures with different heights, enriching the application of the conductive foam in the electronic device.

[0295] Optionally, as an implementable manner, as Figures 3 to 6 、as Figures 9 to 11 、 Figures 12 to 19 shown, the shape of the foam matrix 1 is a polyhedron, and the polyhedron at least includes the connected first surface 11, second surface 12 and third surface 13; the conductive layer at least covers the first surface 11, second surface 12 and third surface 13.

[0296] It should be understood that among all the surfaces of the above polyhedron, at least one surface is used to be electrically connected to the structure in the electronic device through the conductive layer.

[0297] Exemplarily, the first surface of the polyhedron may be used to electrically connect to a first structure in the electronic device through a conductive layer, while other surfaces are not used to electrically connect to the structure in the electronic device through the conductive layer; or, the first surface of the polyhedron may be used to electrically connect to the first structure in the electronic device through a conductive layer, and the second surface may be used to electrically connect to the second structure in the electronic device through a conductive layer, while other surfaces are not used to electrically connect to the structure in the electronic device through a conductive layer. Of course, other methods are also possible and are not specifically limited here.

[0298] The present application does not specifically limit the above-mentioned polyhedron. For example, the polyhedron may include a regular polyhedron or an irregular polyhedron. When the shape of the foam matrix is ​​a regular polyhedron, the regular polyhedron may include a cube, a hexahedron, an octahedron, and the like.

[0299] It should be understood that the above-mentioned polyhedron includes at least a connected first surface, a second surface and a third surface, which means that the polyhedron may only include a connected first surface, a second surface and a third surface; or, in addition to the connected first surface, the second surface and the third surface, the polyhedron may also include a fourth surface, a fifth surface, a sixth surface, etc., which is not specifically limited here.

[0300] It should be understood that the above-mentioned conductive layer at least covers the first surface, the second surface and the third surface, which means that the conductive layer can only cover the first surface, the second surface and the third surface; or, in addition to covering the first surface, the second surface and the third surface, the conductive layer can also cover the fourth surface, the fifth surface, the sixth surface, etc., and no specific limitation is made here.

[0301] The following is a specific example of a case where the conductive layer covers the foam substrate, assuming that the shape of the foam substrate is a hexahedron:

[0302] As an example, in Figures 3 to 6 ,like Figures 9 to 11 In the figure, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not marked in the figure, front surface) and a sixth surface (not marked in the figure, rear surface). Figures 3 to 6 ,like Figures 9 to 11 As shown, the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface).

[0303] As another example, in Figures 13 to 18In this case, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not labeled in the figure, front surface), and a sixth surface (not labeled in the figure, rear surface). As Figures 13 to 18 shown, the conductive layer covers at least part of the first surface 11 (upper surface), part of the second surface 12 (lower surface), and the entire third surface 13 (left surface).

[0304] As another example, in Figure 19 this case, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not labeled in the figure, front surface), and a sixth surface (not labeled in the figure, rear surface). As Figure 19 shown, the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface), the entire third surface 13 (left surface), and the entire fourth surface 14 (right surface).

[0305] It should be noted that when the shape of the foam substrate is a hexahedron, the positions of the above-mentioned first surface, second surface, third surface, fourth surface, fifth surface, and sixth surface are not specifically defined. Exemplarily, it can be as Figures 3 to 6 shown, the first surface 11 is the upper surface, the second surface 12 is the lower surface, the third surface 13 is the left surface, the fourth surface 14 is the right surface, the fifth surface is the front surface, and the sixth surface is the rear surface; or, it can be that the first surface is the upper surface, the second surface is the left surface, the third surface is the right surface, the fourth surface is the lower surface, the fifth surface is the front surface, and the sixth surface is the rear surface. Of course, there can also be other situations, which specifically depend on the actual application. Figures 9 to 11 、 Figures 13 to 19

[0306] The conductive foam provided by the embodiment of the present application has a foam substrate that at least includes the connected first surface, second surface, and third surface, and the conductive layer covers at least the first surface, second surface, and third surface of the foam substrate. In this way, during actual application, when the conductive foam is electrically connected to the structure in the electronic device, the conductive layer in the conductive foam is conductive, and a variety of conductive foams with a low working height, low PIM, and low stress in the first direction can be provided, enriching the application of the conductive foam in the electronic device.

[0307] Figures 13 to 18 Optionally, as an implementable manner, as Figures 13 to 18As shown, the polyhedron includes a first surface 11, a second surface 12, and a third surface 13. The first surface 11 is disposed opposite to the second surface 12, and the first surface 11 is connected to the second surface 12 through the third surface 13; the conductive layer covers at least part of the first surface 11, at least part of the second surface 12, and the entire third surface 13 of the polyhedron.

[0308] It should be understood that the above-mentioned conductive layer covering at least the first surface, at least part of the second surface, and the entire third surface of the polyhedron means that: the conductive layer can cover part of the first surface, part of the second surface, and the entire third surface of the polyhedron; or, the conductive layer can cover part of the first surface, the entire second surface, and the entire third surface of the polyhedron; or, the conductive layer can cover the entire first surface, part of the second surface, and the entire third surface of the polyhedron; or, the conductive layer can cover the entire first surface, the entire second surface, and the entire third surface of the polyhedron, and no specific limitation is made here.

[0309] As an example, as Figure 13 shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6, and the adhesive layer 5 covers part of the first surface 11 (upper surface), part of the second surface 12 (lower surface), and the entire third surface 13 (left surface) of the hexahedron, so as to form a conductive layer in the shape of a "C".

[0310] It should be noted that in Figure 13 , the conductive foam 05 further includes a second adhesive layer 7, and the second adhesive layer 7 can be disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to both the adhesive layer 5 and the first conductive paste layer 21.

[0311] Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and is spaced from both the first adhesive layer and the first conductive paste layer, and no specific limitation is made here. Among them, the second adhesive layer can bond the conductive foam to the structure in the electronic device, and no specific limitation is made on the type of the second adhesive layer. Exemplarily, the second adhesive layer can include a back adhesive, and the back adhesive can include any one of conductive adhesive, insulating adhesive, etc.

[0312] As another example, as Figure 14 shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6, and the adhesive layer 5 covers part of the first surface 11 (upper surface), part of the second surface 12 (lower surface), and the entire third surface 13 (left surface) of the hexahedron, so as to form a conductive layer in the shape of a "C".

[0313] It should be noted that in Figure 14 , the conductive foam 05 can further include a second adhesive layer 7 and a different-color polyethylene terephthalate (PET) layer 8.

[0314] As Figure 14 shown, the second adhesive layer 7 can be disposed on at least a part of the second surface 12 of the foam substrate 11 and connected to the adhesive layer 5 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least a part of the second surface of the foam substrate and spaced apart from both the first adhesive layer and the first conductive paste layer, and no specific limitation is made here.

[0315] As Figure 14 shown, the different-color PET layer 8 is disposed on a part of the first surface 11 (upper surface) of the foam substrate 1 and connected to the adhesive layer 5 and the first conductive paste layer 21. Of course, the different-color PET layer can also be disposed on at least a part of the first surface of the foam substrate and spaced apart from both the first adhesive layer and the first conductive paste layer, and no specific limitation is made here.

[0316] It should be noted that the above-mentioned different-color PET layer can have a color. In this way, on the one hand, it can clearly identify the side of the conductive foam with the different-color PET layer for electrical connection with the structure in the electronic device, which is more conducive to preventing misoperation; on the other hand, if there is a step difference between the structure in the electronic device and the conductive foam, the different-color PET layer can also fill the step difference.

[0317] As yet another example, as Figure 15 shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6, and the second conductive paste layer 22 covers all of the first surface 11 (upper surface), a part of the second surface 12 (lower surface), and all of the third surface 13 (left surface) of the hexahedron, thereby forming a conductive layer in a shape similar to the letter "C".

[0318] It should be noted that, first, in Figure 15 , the conductive foam 05 can also include a second adhesive layer 7, and the second adhesive layer 7 is disposed on at least a part of the second surface 12 of the foam substrate 1 and connected to both the second conductive paste layer 22 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least a part of the second surface of the foam substrate and spaced apart from both the second conductive paste layer and the first conductive paste layer, and no specific limitation is made here.

[0319] Second, the conductive layer composed of the first conductive paste layer, the first substrate layer, and the second conductive paste layer can also only cover a part of the first surface of the foam substrate. In this case, for the part of the first surface of the foam substrate where no conductive layer is provided, no structure can be provided, or structures such as a different-color PET layer can be provided, and no specific limitation is made here.

[0320] As yet another example, as Figure 16As shown, the first conductive paste layer 21 and the first substrate layer 6 cover all the first surfaces 11 (upper surfaces), part of the second surfaces 12 (lower surfaces), and all the third surfaces 13 (left surfaces) of the hexahedron. The second conductive paste layer 22 only covers all the first surfaces 11 (upper surfaces) and part of the second surfaces 12 (lower surfaces) of the hexahedron, thereby forming a conductive layer in the shape of a "C".

[0321] It should be noted that, first, in Figure 16 , the conductive foam 05 further includes a second adhesive layer 7. The second adhesive layer 7 is disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to both the second conductive paste layer 22 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and is spaced apart from both the second conductive paste layer and the first conductive paste layer, and no specific limitation is made here.

[0322] Second, the conductive layer formed by the first conductive paste layer, the first substrate layer, and the second conductive paste layer can also only cover part of the first surface of the foam substrate. In this case, no structure may be provided on the part of the first surface of the foam substrate where no conductive layer is provided, or structures such as a different-color PET layer may be provided, and no specific limitation is made here.

[0323] As another example, as Figure 17 shown, the conductive layer formed by the first conductive paste layer 21, the first substrate layer 6, and the adhesive layer 5 covers all the first surfaces 11 (upper surfaces), part of the second surfaces 12 (lower surfaces), and all the third surfaces 13 (left surfaces) of the hexahedron, thereby forming a conductive layer in the shape of a "C". At the same time, along the direction perpendicular to the foam substrate 1, the height of the first conductive paste layer 21 in the first region Q1 is less than the height of the first conductive paste layer 21 in the second region Q2.

[0324] It should be noted that in Figure 17 , the conductive foam 05 further includes a second adhesive layer 7. The second adhesive layer 7 is disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to both the adhesive layer 5 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and is spaced apart from the first adhesive layer and the first conductive paste layer, and no specific limitation is made here.

[0325] As another example, as Figure 18As shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6, and the adhesive layer 5 covers all the first surfaces 11 (upper surfaces), part of the second surfaces 12 (lower surfaces), and all the third surfaces 13 (left surfaces) of the hexahedron. And the second substrate layer 9 is located on part of the first surfaces 11 (upper surfaces) of the hexahedron, thus forming a conductive layer in the shape of a "C". At the same time, along the direction perpendicular to the foam matrix 1, the height of the first conductive paste layer 21, the first substrate layer 6, and the first adhesive layer 5 in the first region Q1 is equal to the height of the first conductive paste layer 21, the first substrate layer 6, and the first adhesive layer 5 in the second region Q2.

[0326] It should be noted that in Figure 18 , the conductive foam 05 further includes a second adhesive layer 7, and the second adhesive layer 7 is disposed on at least part of the second surface 12 of the foam matrix 1 and is connected to both the adhesive layer 5 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and is spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.

[0327] It should be understood that the first surface, the second surface, the third surface, the fourth surface, the fifth surface, and the sixth surface of the above-mentioned hexahedron can also be located at other positions of the hexahedron. For example, it can also be that the first surface is the upper surface, the second surface is the left surface, the third surface is the right surface, the fourth surface is the lower surface, the fifth surface is the front surface, and the sixth surface is the rear surface. At this time, when the conductive layer covers at least part of the first surface, at least part of the second surface, and all the third surfaces of the hexahedron, the conductive layer forms a conductive layer in the shape of an inverted "U".

[0328] For another example, it can also be that the first surface is the lower surface, the second surface is the left surface, the third surface is the right surface, the fourth surface is the upper surface, the fifth surface is the front surface, and the sixth surface is the rear surface. At this time, when the conductive layer covers at least part of the first surface, at least part of the second surface, and all the third surfaces of the hexahedron, the conductive layer forms a conductive layer in the shape of a "U".

[0329] For still another example, it can also be that the first surface is the upper surface, the second surface is the lower surface, the third surface is the right surface, the fourth surface is the left surface, the fifth surface is the front surface, and the sixth surface is the rear surface. At this time, when the conductive layer covers at least part of the first surface, at least part of the second surface, and all the third surfaces of the hexahedron, the conductive layer forms a conductive layer in the shape of .

[0330] Of course, corresponding to other positions of the first surface, the second surface, the third surface, the fourth surface, the fifth surface, and the sixth surface, the conductive layer can also form other structures, which are not specifically limited here.

[0331] The conductive foam provided by the embodiments of the present application, on the one hand, has the first surface and the second surface of the foam matrix arranged opposite to each other, and the first surface is connected to the second surface through the third surface. Moreover, a conductive layer is provided to cover at least part of the first surface, all of the third surface, and at least part of the second surface of the polyhedron, so as to form a conductive layer in the shape of a "C". On the other hand, when the conductive foam is applied to an electronic device, it can ensure the directionality of the conductive foam, so as to identify and prevent misassembly. At the same time, it can also reduce the thickness of the electronic device and make the PIM between the contact interface of the conductive foam and the structure in the electronic device smaller. In addition, it can achieve the directional electrical connection of the structure in the electronic device and reduce or eliminate radiation and stray interference, etc., effectively improving the performance of the electronic device.

[0332] Optionally, as an implementable manner, as Figures 3 to 6 , Figures 9 to 11 , Figure 19 shown, the polyhedron includes a first surface 11, a second surface 12, a third surface 13, and a fourth surface 14. The first surface 11 and the second surface 12 are arranged opposite to each other, and the third surface 13 and the fourth surface 14 are arranged opposite to each other. The first surface 11 is connected to the second surface 12 through the third surface 13 and the fourth surface 14 respectively. The conductive layer covers all of the first surface 11, at least part of the second surface 12, all of the third surface 13, and all of the fourth surface 14.

[0333] It should be understood that the above description that the conductive layer covers all of the first surface, all of the third surface, all of the fourth surface, and at least part of the second surface means that the conductive layer covers all of the first surface, all of the third surface, all of the fourth surface, and part of the second surface; or the conductive layer covers all of the first surface, all of the third surface, all of the fourth surface, and all of the second surface. There is no specific limitation here.

[0334] As an example, as Figures 3 to 6 , Figures 9 to 11 shown, the conductive layer 2 covers all of the first surface 11 (upper surface), all of the second surface 12 (lower surface), all of the third surface 13 (left surface), and all of the fourth surface 14 (right surface) of the hexahedron.

[0335] As another example, as Figure 19 shown, the conductive layer covers all of the first surface 11 (upper surface), part of the second surface 12 (lower surface), all of the third surface 13 (left surface), and all of the fourth surface 14 (right surface) of the hexahedron, so as to form a conductive layer in the shape of type.

[0336] It should be noted that, first, in Figure 19Among them, the conductive foam 05 further includes a second adhesive layer 7, and the second adhesive layer 7 is disposed on at least a part of the second surface 12 of the foam substrate 1 and is spaced apart from the second conductive paste layer 22. Of course, the second adhesive layer may also be disposed on at least a part of the second surface of the foam substrate and connected to the second conductive paste layer, and no specific limitation is made here.

[0337] Second, the conductive layer in the embodiment of the present application is not limited to the second conductive layer, and may also be any other structure. For example, the conductive layer may be a first adhesive layer, a first substrate layer, a first conductive paste layer, etc. The specific setting method may refer to the above embodiments, and the setting of the second adhesive layer may also refer to the above second conductive paste layer, which will not be elaborated here.

[0338] It should be understood that the first surface, the second surface, the third surface, the fourth surface, the fifth surface, and the sixth surface of the above hexahedron may also be located at other positions of the hexahedron. For example, the first surface may be the lower surface, the second surface may be the left surface, the third surface may be the upper surface, the fourth surface may be the right surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. At this time, when the conductive layer covers all the first surfaces, at least part of the second surfaces, all the third surfaces, and all the fourth surfaces of the hexahedron, the conductive layer forms a conductive layer in the shape of a "D".

[0339] For another example, the first surface may be the left surface, the second surface may be the upper surface, the third surface may be the right surface, the fourth surface may be the lower surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. At this time, when the conductive layer covers all the first surfaces, at least part of the second surfaces, all the third surfaces, and all the fourth surfaces of the hexahedron, the conductive layer forms a type of conductive layer.

[0340] For still another example, the first surface may be the upper surface, the second surface may be the right surface, the third surface may be the lower surface, the fourth surface may be the left surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. At this time, when the conductive layer covers all the first surfaces, at least part of the second surfaces, all the third surfaces, and all the fourth surfaces of the hexahedron, the conductive layer forms a type of conductive layer.

[0341] Of course, corresponding to other positions of the first surface, the second surface, the third surface, the fourth surface, the fifth surface, and the sixth surface, the conductive layer may also form other structures, and no specific limitation is made here.

[0342] On the one hand, by setting the first surface and the second surface of the foam substrate to face each other, and connecting the first surface to the second surface through the third surface, and further setting a conductive layer to cover at least part of the first surface, all the third surfaces, and at least part of the second surface of the polyhedron, a On the other hand, when the conductive foam is applied to an electronic device, the directionality of the conductive foam can be ensured, so that while anti-fooling identification is carried out, the thickness of the electronic device can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic device is small. In addition, the directional electrical connection of the structure in the electronic device can be achieved through the conductive foam, and radiation stray interference can be reduced or eliminated, effectively improving the performance of the electronic device.

[0343] Only the content related to the inventive points is introduced above. For the remaining structures, reference can be made to the related art and will not be elaborated here.

[0344] The embodiment of the present application further provides an electronic device, which includes the above-mentioned conductive foam.

[0345] Since the electronic device provided by the embodiment of the present application includes a conductive foam with a low working height, small PIM, and low stress in the first direction, the thickness of the electronic device can be effectively reduced. At the same time, the PIM between the contact interface of the structure in the electronic device and the conductive foam can be small. Moreover, the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0346] Next, taking the shape of the conductive foam as a hexahedron as an example, various applications of the conductive foam in the electronic device will be specifically described.

[0347] Optionally, as Figure 20 and Figure 21 shown, the first structure in the electronic device at least includes a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam when rotating.

[0348] The present application does not make specific limitations on the above-mentioned camera assembly. Exemplarily, the camera assembly may include a camera, etc.

[0349] When the camera assembly is a camera, the camera may include a front camera and a rear camera. Among them, the front camera may be disposed on a side of the display module away from the middle frame; the rear camera may be disposed on a side of the rear shell away from the middle frame, specifically subject to actual applications.

[0350] It should be understood that the first structure in the above-mentioned electronic device at least including a camera assembly means that: the first structure in the electronic device may only include a camera assembly; or, in addition to including a camera assembly, the first structure in the electronic device may further include other structures, which are not specifically limited here.

[0351] Figure 22 and Figure 23 respectively show schematic structural diagrams of the electrical connection between the front camera 501 and the shielding cover 502 in the related art.

[0352] AsFigure 22 As shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503, and the shielding cover 502 is electrically connected to the PCB 504, resulting in a relatively long grounding (GND) path flowing back to the PCB 504 and being unable to effectively improve problems such as electromagnetic shielding of the electronic device.

[0353] As Figure 23 shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503 and the bracket steel sheet 505, which may cause there to be no space on the substrate 507 of the front camera 501 to place the screw 506 to ensure the distance between the bracket steel sheet 505 and the substrate 507.

[0354] At this time, if a single-sided conductive adhesive is used to ensure the distance between the bracket steel sheet 505 and the substrate 507, there may be a problem of non-contact; if a double-sided conductive adhesive is used to ensure the distance between the bracket steel sheet 505 and the substrate 507, the front camera 501 may be damaged when the bracket steel sheet 505 is disassembled. Moreover, if the bracket steel sheet 505 is an insert-molded bracket steel sheet, although there is a screw 506 near the bracket steel sheet 505, the insert-molded bracket steel sheet may cause glue overflow at the edge of the sealant. If an insulating layer is formed between the bracket steel sheet 505 and the conductive adhesive, problems such as insufficient contact or non-contact may occur.

[0355] To solve the above problems, it can be considered to electrically connect structures such as a camera component, for example, a camera, and a shielding cover by providing a conductive foam.

[0356] However, the conductive foams in the related art often cannot be placed near the camera due to problems such as a relatively high working height.

[0357] Therefore, the conductive foam provided in the embodiments of the present application, which has a relatively low working height in the first direction and relatively small stress and PIM, can well achieve the electrical connection between the camera and other structures and can improve problems such as electromagnetic shielding in the electronic device.

[0358] Figure 20 The schematic diagram shows the conductive foam 05 in the embodiments of the present application for electrically connecting the front camera 501 and the shielding cover 502. Figure 22 The schematic diagram shows the conductive foam 05 in the embodiments of the present application for electrically connecting the rear camera 508 and the shielding cover 502.

[0359] As Figure 20 shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive foam 05, and the shielding cover 502 and the PCB 504 are fixedly connected by screws 506.

[0360] As Figure 21As shown, the middle frame 102 and the substrate 509 of the rear camera 508 are electrically connected through the conductive foam 05, the shielding cover 502 and the bracket steel sheet 505 are electrically connected through the conductive foam 05, and the substrate 509 of the rear camera 508 is also fixedly connected to the PCB 504 through the screw 506.

[0361] On the one hand, for the electronic device provided by the embodiment of the present application, the imaging component such as the camera is electrically connected to the conductive foam. Since the working height of the conductive foam in the first direction is relatively low, it can be placed between the camera and other structures. When the camera rotates in any direction, since the conductive foam can be well compressed or stretched, the camera can always maintain electrical connection with the conductive foam, ensuring the performance of the electronic device. On the other hand, since the conductive foam is an independent structure and separable, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic device, resulting in the overall scrapping of the electronic device. On the other hand, the conductive foam can effectively absorb the tolerances existing when electrically connected to the structure of the electronic device, thereby avoiding poor contact. On the other hand, the conductive foam can make the grounding (GND) path shorter. At the same time, if problems such as glue overflow occur, the conductive foam can also be improved through strain. Thus, the performance of the electronic device in the embodiment of the present application has been greatly improved.

[0362] Optionally, in Figure 24 the electronic device, as Figure 24 shown, the first surface 11 of the foam substrate 1 is electrically connected to the display screen 111 through the conductive layer, and the second surface 12 of the foam substrate 1 is connected to the middle frame 102 through the conductive layer.

[0363] Thus, the first surface and the second surface in the foam substrate are electrically connected to the structures in the electronic device, so that the conductive foam can conduct electricity along the second direction and the third direction respectively, where the second direction and the third direction can be set perpendicular to each other.

[0364] For the electronic device provided by the embodiment of the present application, by realizing the electrical connection with the display screen and the middle frame through the conductive foam respectively, the stress between the contact interface of the conductive foam and the antenna and the stress between the contact interface of the conductive foam and the middle frame can be effectively reduced, effectively improving the performance of the electronic device.

[0365] Optionally, in Figure 25 the electronic device, as Figure 25 shown, the first surface 11 of the foam substrate 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam substrate 1 is electrically connected to the PCB 504 through the conductive layer.

[0366] Thus, two surfaces in the foam substrate are electrically connected to the structures in the electronic device, so that the conductive foam can be electrically conducted along the second direction and the third direction respectively, where the second direction and the third direction can be set perpendicular to each other.

[0367] It should be noted that Figure 25 the PCB 504 in [[ID]] can be replaced with structures such as a display screen, a battery cover, a decorative part, etc.

[0368] Figure 25 The middle frame 102 in [[ID]] can be a metal middle frame, and an anti-oxidation layer 110 is wrapped around the periphery of the metal middle frame.

[0369] Such as Figure 25 shown, the surface of the middle frame 102 in contact with the reed 108 can be subjected to laser engraving treatment to form a laser engraving surface 109.

[0370] For the electronic device provided by the embodiment of the present application, on the one hand, the electrical connection between the reed and the PCB is realized through the conductive foam, which can effectively reduce the PIM between the contact interface of the conductive foam and the reed and the PIM between the contact interface of the conductive foam and the PCB, effectively improving the performance of the electronic device; on the other hand, when one side of the conductive foam is a display screen, the conductive foam will not rebound to cause interface damage, for example, screen film printing, etc., further improving the performance of the electronic device.

[0371] Optionally, in the electronic device of [[ID]] Figure 26 such as Figure 26 shown, the first surface 11 of the foam substrate 1 is electrically connected to the reed 108 through a conductive layer, and the second surface 12 of the foam substrate 1 is electrically connected to the PCB 504 through a conductive layer.

[0372] Thus, two surfaces in the foam substrate are electrically connected to the structures in the electronic device, so that the conductive foam can be electrically conducted along the second direction and the third direction respectively.

[0373] It should be noted that, as Figure 26 shown, the electronic device may further include an antenna 105, a middle frame 102 and a plastic 107, and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

[0374] The surface of the antenna 105 close to the reed 108 can be subjected to laser engraving treatment to form a laser engraving surface 109.

[0375] An anti-oxidation layer 110 can be wrapped around the periphery of the antenna 105.

[0376] The electronic device provided by the embodiment of the present application realizes the electrical connection between the reed and the PCB through the conductive foam, which can effectively reduce the PIM between the contact interface of the conductive foam and the reed and the PIM between the contact interface of the conductive foam and the PCB, and effectively improve the performance of the electronic device.

[0377] Optionally, in the Figure 27 electronic device, as Figure 27 shown, the first surface 11 and the second surface 12 of the foam substrate 1 are electrically connected to the antenna 105 through the conductive layer, the first surface 11 of the foam substrate 1 is also electrically connected to the middle frame 102 through the conductive layer, and one surface of the foam substrate is connected to the insulating material layer 106.

[0378] Thus, the first surface and the second surface in the foam substrate are respectively electrically connected to multiple structures in the electronic device, so that the conductive foam can conduct in multiple directions.

[0379] It should be noted that, as Figure 27 shown, the electronic device may further include plastic 107, and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

[0380] The surface of the foam substrate connected to the insulating material layer may or may not be provided with a first sub-conductive layer, and no specific limitation is made here.

[0381] The electronic device provided by the embodiment of the present application realizes the electrical connection between the antenna and the middle frame through the conductive foam, which can effectively reduce the PIM between the contact interface of the conductive foam and the antenna and the PIM between the contact interface of the conductive foam and the middle frame, and effectively improve the performance of the electronic device.

[0382] Optionally, in the Figure 28 electronic device, as Figure 28 shown, the first surface 11 and the third surface 13 of the foam substrate 1 are respectively electrically connected to the antenna 105 through the conductive layer, the first surface 11 and the fourth surface 14 of the foam substrate 1 are respectively electrically connected to the middle frame 102 through the conductive layer, and the second surface 12 of the foam substrate 1 is electrically connected to the PCB 504 through the conductive layer.

[0383] Thus, the first surface, the second surface, the third surface and the fourth surface of the foam substrate are respectively electrically connected to multiple structures in the electronic device, so that the conductive foam can conduct in multiple directions.

[0384] It should be noted that, as Figure 28 shown, the electronic device may further include plastic 107, and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

[0385] The electronic device provided by the embodiment of the present application realizes the electrical connection of the antenna, the middle frame, and the PCB through the conductive foam, and can effectively reduce the PIM between the contact interface of the conductive foam and the antenna, the PIM between the contact interface of the conductive foam and the middle frame, and the PIM between the contact interface of the conductive foam and the PCB, effectively improving the performance of the electronic device.

[0386] Optionally, in the Figure 29 electronic device, as Figure 29 shown, the first surface 11 of the foam matrix 1 is electrically connected to the antenna 105 and the middle frame 102 respectively through the conductive layer, and one surface of the foam matrix 1 is also connected to the insulating material layer 106.

[0387] Thus, only the first surface in the foam matrix is electrically connected to the structure in the electronic device, so that the conductive foam can conduct along the second direction.

[0388] Figure 29 In the electronic device shown, the heights of the antenna 105 and the middle frame 102 in the direction perpendicular to the foam matrix are different.

[0389] As Figure 29 shown, the electronic device may further include plastic 107, and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

[0390] The surface of the foam matrix connected to the insulating material layer may be provided with a first sub-conductive layer or may not be provided with a first sub-conductive layer, which is not specifically limited here.

[0391] On the one hand, the electronic device provided by the embodiment of the present application realizes the electrical connection between the antenna and the middle frame through the conductive foam, and can effectively reduce the PIM between the contact interface of the conductive foam and the antenna and the PIM between the contact interface of the conductive foam and the middle frame, effectively improving the performance of the electronic device; on the other hand, since the heights of the antenna and the middle frame in the direction perpendicular to the foam matrix are different, one conductive foam realizes the electrical connection with the structures of different heights in the electronic device, enriching the application of the conductive foam.

[0392] The embodiment of the present application provides a manufacturing method of a conductive foam.

[0393] As Figure 30 shown, the manufacturing method includes:

[0394] S1. Provide a foam matrix.

[0395] S2. Form a conductive layer on at least the first surface of the foam matrix.

[0396] Among them, the first surface is used for electrically connecting with the first structure in the electronic device through a conductive layer, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used for deforming under the action of an external pressure.

[0397] This application does not specifically limit the manufacturing process of the above-mentioned conductive layer. As an example, when the conductive layer only includes a conductive paste layer, the conductive paste can be formed on the surface of the foam substrate by methods such as spraying, printing, spraying plating, vacuum plating, etc., and then the conductive paste is baked / heat cured to form a conductive paste layer.

[0398] As another example, when the conductive layer includes a conductive paste layer and a first substrate layer, the conductive paste can be formed on at least one surface of the first substrate layer by methods such as spraying and printing, and then the conductive paste is baked / heat cured to form the first substrate layer and the conductive paste layer.

[0399] As yet another example, when the conductive layer includes a conductive paste layer and a first substrate layer, the first substrate can be immersed in the conductive paste first, and then the conductive paste is baked / heat cured to form the first substrate layer and the conductive paste layer.

[0400] On the one hand, the manufacturing method of the conductive foam provided by the embodiments of this application forms the conductive paste by means such as spraying, printing, spraying plating, vacuum plating, impregnation, etc., and bakes / heat cures to form a conductive paste layer, which is simple and easy to implement; on the other hand, the conductive paste in the conductive paste layer has certain ductility, good electrical conductivity, and a relatively large resistivity (10 -5 -10 -4 Ω×cm), etc. properties, and the conductive paste is in a liquid state before film formation, and the volume will shrink during the curing process, so that while the conductive foam exhibits good electrical conductivity, it can also deform under the action of pressure. Combining with the elasticity of the foam substrate, the working height of the conductive foam in the first direction can be relatively low; on the other hand, the conductive paste is sintered into a layer, and the volume shrinks to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; on the other hand, when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste spread out, so that the contact area between the conductive foam and the structure in the electronic device can be relatively large.

[0401] The following specifically describes the manufacturing methods of various structures of conductive foam in this application.

[0402] As an example, Figure 3 and Figure 4 The manufacturing method of the conductive foam shown includes:

[0403] S11. Print the first conductive paste on all the first surfaces 11, all the second surfaces 12, all the third surfaces 13, and all the fourth surfaces 14 of the foam substrate 1.

[0404] S12. Bake and cure to form the first conductive paste layer 21.

[0405] For the method of manufacturing the conductive foam provided by the embodiments of the present application, on the one hand, printing the first conductive paste and baking / heating and curing to form the first conductive paste layer is simple and easy to implement; on the other hand, a conductive foam with a lower working height, small PIM, and low stress in the first direction can be formed.

[0406] As an example, Figure 5 and Figure 6 the method of manufacturing the conductive foam shown in includes:

[0407] S21. Spray the second conductive paste on all the first surfaces 11, all the second surfaces 12, all the third surfaces 13, and all the fourth surfaces 14 of the foam substrate 1.

[0408] S22. Bake and cure to form the second conductive paste layer 22.

[0409] For the method of manufacturing the conductive foam provided by the embodiments of the present application, on the one hand, spraying the second conductive paste and baking / heating and curing to form the second conductive paste layer is simple and easy to implement; on the other hand, a conductive foam with a lower working height, small PIM, and low stress in the first direction can be formed.

[0410] As an example, Figure 9 and Figure 10 the method of manufacturing the conductive foam shown in includes:

[0411] S31. Form an adhesive layer 5 on all the first surfaces 11, all the second surfaces 12, all the third surfaces 13, and all the fourth surfaces 14 of the foam substrate 1.

[0412] S32. Form a first base layer 6 on the surfaces of the adhesive layer 5 close to the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14.

[0413] S33. Print the first conductive paste on the surfaces of the first base layer 6 close to the first surface 11, the second surface 12, the third surface 13, and the fourth surface 14.

[0414] S34. Bake and cure to form the first conductive paste layer 21.

[0415] It should be noted that instead of forming an adhesive layer on all the first surfaces, all the second surfaces, all the third surfaces, and all the fourth surfaces of the foam substrate, a first base layer can be directly formed on all the first surfaces, all the second surfaces, all the third surfaces, and all the fourth surfaces of the foam substrate; then, a first conductive paste is printed on the surfaces of the first base layer close to the first surface, the second surface, the third surface, and the fourth surface; and after baking and curing, a first conductive paste layer is formed.

[0416] For the manufacturing method of the conductive foam provided by the embodiment of the present application, on the one hand, printing the first conductive paste and baking / heating and curing to form the first conductive paste layer is simple and easy to implement; on the other hand, a conductive foam with a lower working height, small PIM, and low stress in the first direction can be formed.

[0417] As an example, Figure 11 The manufacturing method of the conductive foam shown includes:

[0418] S41. Spray a second conductive paste on all the first surfaces 11, all the second surfaces 12, all the third surfaces 13, and all the fourth surfaces 14 of the foam substrate 1.

[0419] S42. Form a first base layer 6 on the surface of the second conductive paste.

[0420] S43. Print a first conductive paste on the surface of the first base layer 6.

[0421] S44. Bake and cure to form a second conductive paste layer 22 and a first conductive paste layer 21.

[0422] For the manufacturing method of the conductive foam provided by the embodiment of the present application, on the one hand, spraying the second conductive paste, printing the first conductive paste, and baking / heating and curing to form the first conductive paste layer and the second conductive paste layer is simple and easy to implement; on the other hand, a conductive foam with a lower working height, small PIM, and low stress in the first direction can be formed.

[0423] As an example, Figure 13 The manufacturing method of the conductive foam shown includes:

[0424] S51. Form an adhesive layer 5 on some of the first surfaces 11, some of the second surfaces 12, and all the third surfaces 13 of the foam substrate 1.

[0425] S52. Immerse the first base layer 6 in the first conductive paste to form a first intermediate layer with the first conductive paste wrapping all the surfaces of the first base layer 6.

[0426] S53. Form the first intermediate layer on the surfaces of the adhesive layer 5 close to the first surface 11, the second surface 12, and the third surface 13.

[0427] S54. Bake and cure to form a first conductive paste layer 21 that wraps all surfaces of the first substrate layer 6.

[0428] S55. Form a second adhesive layer 7 on a partial second surface 12 of the foam substrate 1.

[0429] Wherein, the second adhesive layer 7 is connected to both the adhesive layer 5 and the first conductive paste layer 21.

[0430] This application does not specifically limit the order of the above steps S51 and S52. Exemplarily, step S51 can be performed first and then step S52; alternatively, step S52 can be performed first and then step S51; or, steps S51 and S52 can be performed simultaneously.

[0431] It should be noted that the manufacturing method may further include:

[0432] S051. Immerse the first substrate layer in the second conductive paste to form a second intermediate layer with the second conductive paste that wraps all surfaces of the first substrate layer.

[0433] S052. Form the second intermediate layer on a partial first surface, a partial second surface, and all third surfaces of the foam substrate.

[0434] S053. Bake and cure to form a second conductive paste layer that wraps all surfaces of the first substrate layer.

[0435] S054. Form a second adhesive layer on a partial second surface of the foam substrate.

[0436] Wherein, the second adhesive layer is connected to the second conductive paste layer.

[0437] The manufacturing method of the conductive foam provided by the embodiments of this application, on the one hand, immerses the first substrate layer in the conductive paste and bakes / heats and cures to form a conductive paste layer that wraps all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height, low PIM, and low stress in the first direction.

[0438] As an example, Figure 14 The manufacturing method of the shown conductive foam includes:

[0439] S61. Form an adhesive layer 5 on a partial first surface 11, a partial second surface 12, and all third surfaces 13 of the foam substrate 1.

[0440] S62. Immerse the first substrate layer 6 in the first conductive paste to form a first intermediate layer with the first conductive paste that wraps all surfaces of the first substrate layer 6.

[0441] S63. A first intermediate layer is formed on the surfaces of the adhesive layer 5 close to the first surface 11, the second surface 12, and the third surface 13.

[0442] S64. Bake and cure to form a first conductive paste layer 21 that wraps all the surfaces of the first base material layer 6.

[0443] S65. A second adhesive layer 7 is formed on a part of the second surface 12 of the foam substrate 1.

[0444] Wherein, the second adhesive layer 7 is connected to both the adhesive layer 5 and the first conductive paste layer 21.

[0445] S66. A different-color PET layer 8 is formed on a part of the first surface 11 of the foam substrate 1.

[0446] Wherein, the different-color PET layer 8 is connected to both the adhesive layer 5 and the first conductive paste layer 21.

[0447] In this application, no specific limitation is imposed on the order of the above steps S61 and S62. Exemplarily, step S61 can be carried out first and then step S62; or, step S62 can be carried out first and then step S61; or, step S61 and step S62 can be carried out simultaneously.

[0448] It should be noted that the manufacturing method may further include:

[0449] S061. Immerse the first base material layer in the second conductive paste to form a second intermediate layer with the second conductive paste that wraps all the surfaces of the first base material layer.

[0450] S062. A second intermediate layer is formed on a part of the first surface, a part of the second surface, and all the third surfaces of the foam substrate.

[0451] S063. Bake and cure to form a second conductive paste layer that wraps all the surfaces of the first base material layer.

[0452] S064. A second adhesive layer is formed on a part of the second surface of the foam substrate.

[0453] Wherein, the second adhesive layer is connected to the second conductive paste layer.

[0454] S065. A different-color PET layer is formed on a part of the first surface of the foam substrate.

[0455] Wherein, the different-color PET layer is connected to the second conductive paste layer.

[0456] The manufacturing method of the conductive foam provided by the embodiments of the present application, on the one hand, immerses the first substrate layer in the conductive paste and bakes / heats and cures it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height, small PIM, and low stress in the first direction.

[0457] As an example, Figure 15 The manufacturing method of the conductive foam shown includes:

[0458] S71. Spray a second conductive paste on all the first surfaces 11, part of the second surfaces 12, and all the third surfaces 13 of the foam substrate 1.

[0459] S72. Immerse the first substrate layer 6 in the first conductive paste to form a first intermediate layer with the first conductive paste covering all surfaces of the first substrate layer 6.

[0460] S73. Form a first intermediate layer on the surfaces of the second conductive paste close to the first surface 11, the second surface 12, and the third surface 13.

[0461] S74. Bake and cure to form a second conductive paste layer 22 and a first conductive paste layer 21 covering all surfaces of the first substrate layer 6.

[0462] S75. Form a second adhesive layer 7 on part of the second surfaces 12 of the foam substrate 1.

[0463] Wherein, the second adhesive layer 7 is connected to both the second conductive paste layer 22 and the first conductive paste layer 21.

[0464] The present application does not specifically limit the order of the above steps S71 and S72. Exemplarily, step S71 can be carried out first and then step S72; or, step S72 can be carried out first and then step S71; or, step S71 and step S72 can be carried out simultaneously.

[0465] It should be noted that the manufacturing method may further include:

[0466] S071. Immerse the first substrate layer in the second conductive paste to form a second intermediate layer with the second conductive paste covering all surfaces of the first substrate layer.

[0467] S072. Form a second intermediate layer on all the first surfaces, part of the second surfaces, and all the third surfaces of the foam substrate.

[0468] S073. Bake and cure to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0469] S074. Form a second adhesive layer on part of the second surfaces of the foam substrate.

[0470] Among them, the second adhesive layer is connected to the second conductive paste layer.

[0471] On the one hand, the method for manufacturing the conductive foam provided by the embodiment of the present application is to immerse the first substrate layer in the conductive paste and bake / heat-cure to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height, small PIM, and low stress in the first direction.

[0472] As an example, Figure 16 The method for manufacturing the conductive foam shown includes:

[0473] S81. Spray the second conductive paste on all the first surfaces 11 and part of the second surfaces 12 of the foam matrix 1.

[0474] S82. Immerse the first substrate layer 6 in the first conductive paste to form a first intermediate layer with the first conductive paste covering all surfaces of the first substrate layer 6.

[0475] S83. Form a first intermediate layer on the surfaces of the second conductive paste close to the first surface 11 and the second surface 12, and on the third surface 13 of the foam matrix.

[0476] S84. Bake and cure to form a second conductive paste layer 22 and a first conductive paste layer 21 covering all surfaces of the first substrate layer 6.

[0477] S85. Form a second adhesive layer 7 on part of the second surfaces 12 of the foam matrix 1.

[0478] Among them, the second adhesive layer 7 is connected to both the second conductive paste layer 22 and the first conductive paste layer 21.

[0479] The present application does not specifically limit the order of the above steps S81 and S82. Exemplarily, step S81 can be performed first and then step S82; or, step S82 can be performed first and then step S81; or, step S81 and step S82 can be performed simultaneously.

[0480] On the one hand, the method for manufacturing the conductive foam provided by the embodiment of the present application is to coat the second conductive paste and immerse the first substrate layer in the first conductive paste, and bake / heat-cure to form a second conductive paste layer and a first conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height, small PIM, and low stress in the first direction.

[0481] As an example, Figure 17 The method for manufacturing the conductive foam shown includes:

[0482] S91. Form an adhesive layer 5 on all the first surfaces 11, part of the second surfaces 12, and all the third surfaces 13 of the foam substrate 1.

[0483] S92. Immerse the first substrate layer 6 in the first conductive paste to form a first intermediate layer with the first conductive paste covering all the surfaces of the first substrate layer 6.

[0484] S93. Form the first intermediate layer on the surfaces of the adhesive layer 5 close to the first surface 11, the second surface 12, and the third surface 13.

[0485] S94. Bake and cure to form a first conductive paste layer 21 covering all the surfaces of the first substrate layer 6.

[0486] S95. Print the first conductive paste on the first conductive paste layer 21 in the second region Q2.

[0487] S96. Bake and cure to form the first conductive paste layer 21.

[0488] S97. Form a second adhesive layer 7 on part of the second surfaces 12 of the foam substrate 1.

[0489] Wherein, the second adhesive layer 7 is connected to both the adhesive layer 5 and the first conductive paste layer 21.

[0490] This application does not specifically limit the order of the above steps S91 and S92. Exemplarily, step S91 can be carried out first and then step S92; or, step S92 can be carried out first and then step S91; or, steps S91 and S92 can be carried out simultaneously.

[0491] It should be noted that the manufacturing method may further include:

[0492] S091. Immerse the first substrate layer in the second conductive paste to form a second intermediate layer with the second conductive paste covering all the surfaces of the first substrate layer.

[0493] S092. Form the second intermediate layer on all the first surfaces, part of the second surfaces, and all the third surfaces of the foam substrate.

[0494] S093. Bake and cure to form a second conductive paste layer covering all the surfaces of the first substrate layer.

[0495] S094. Spray the second conductive paste on the second conductive paste layer in the second region.

[0496] S095. Bake and cure to form the second conductive paste layer.

[0497] S096. Form a second adhesive layer on part of the second surfaces of the foam substrate.

[0498] Among them, the second adhesive layer is connected to the second conductive paste layer.

[0499] Of course, when the first substrate layer and the conductive paste layer are separate and independent structures, when forming the conductive paste layer, in a direction perpendicular to the foam matrix, the height of the conductive paste printed / sprayed in the first region can be less than the height of the conductive paste printed / sprayed in the second region.

[0500] For the manufacturing method of the conductive foam provided by the embodiments of the present application, on the one hand, by additionally forming a conductive paste layer in the second region compared to the first region, while the structure of the part of the conductive layer in the first region is the same as that of the part in the second region, in a direction perpendicular to the foam matrix, the height of the part of the conductive layer in the first region is less than the height of the part of the conductive layer in the second region; on the other hand, a conductive foam with a lower working height, small PIM, and low stress in the first direction can be formed.

[0501] As an example, Figure 18 The manufacturing method of the conductive foam shown includes:

[0502] S101. Form an adhesive layer 5 on all the first surfaces 11, part of the second surfaces 12, and all the third surfaces 13 of the foam matrix 1.

[0503] S102. Immerse the first substrate layer 6 in the first conductive paste to form a first intermediate layer with the first conductive paste wrapping all the surfaces of the first substrate layer 6.

[0504] S103. Form a first intermediate layer on the surfaces of the adhesive layer 5 close to the first surface 11, the second surface 12, and the third surface 13.

[0505] S104. Bake and cure to form a first conductive paste layer 21 wrapping all the surfaces of the first substrate layer 6.

[0506] S105. Form a second substrate layer 9 on the first conductive paste layer 21 in the second region Q2.

[0507] S106. Form a second adhesive layer 7 on part of the second surfaces 12 of the foam matrix 1.

[0508] Among them, the second adhesive layer 7 is connected to both the adhesive layer 5 and the first conductive paste layer 21.

[0509] The present application does not specifically limit the order of the above steps S101 and S102. Exemplarily, step S101 can be carried out first and then step S102; or, step S102 can be carried out first and then step S101; or, steps S101 and S102 can be carried out simultaneously.

[0510] It should be noted that the manufacturing method may further include:

[0511] S0101: Immerse the first substrate layer in the second conductive paste to form a second intermediate layer with the second conductive paste covering all surfaces of the first substrate layer.

[0512] S0102: Form the second intermediate layer on all the first surfaces, some of the second surfaces, and all the third surfaces of the foam substrate.

[0513] S0103: Bake and cure to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0514] S0104: Form a second substrate layer on the second conductive paste layer in the second region.

[0515] S0105: Form a second adhesive layer on some of the second surfaces of the foam substrate.

[0516] Wherein, the second adhesive layer is connected to the second conductive paste layer.

[0517] For the manufacturing method of the conductive foam provided by the embodiments of the present application, on the one hand, by additionally forming a second substrate layer in the second region, the structure of the conductive layer in the part of the first region is different from the structure of the part in the second region, and along the direction perpendicular to the foam substrate, the height of the part of the conductive layer in the first region is less than the height of the part of the conductive layer in the second region; on the other hand, a conductive foam with a lower working height, low PIM, and low stress in the first direction can be formed.

[0518] As an example, Figure 19 the manufacturing method of the shown conductive foam includes:

[0519] S111: Spray the second conductive paste on all the first surfaces 11, some of the second surfaces 12, all the third surfaces 13, and all the fourth surfaces 14 of the foam substrate 1.

[0520] S112: Bake and cure to form a second conductive paste layer 22.

[0521] S113: Form a second adhesive layer 7 on some of the second surfaces 12 of the foam substrate 1.

[0522] Wherein, the second adhesive layer 7 is arranged at intervals from the second conductive paste layer 22.

[0523] It should be noted that the manufacturing method may further include:

[0524] S0111: Form an adhesive layer on all the first surfaces, some of the second surfaces, all the third surfaces, and all the fourth surfaces of the foam substrate.

[0525] S0112. Immerse the first substrate layer in the first conductive paste to form a first intermediate layer with the first conductive paste covering all surfaces of the first substrate layer.

[0526] S0113. Form a first intermediate layer on the surfaces of the adhesive layer close to the first surface, the second surface, the third surface, and the fourth surface.

[0527] S0114. Bake and cure to form a first conductive paste layer covering all surfaces of the first substrate layer.

[0528] S0115. Form a second adhesive layer on a part of the second surface of the foam substrate.

[0529] Wherein, the second adhesive layer is spaced from both the adhesive layer and the first conductive paste layer.

[0530] This application does not specifically limit the order of the above steps S0111 and S0112. Exemplarily, step S0111 can be carried out first and then step S0112; or, step S0112 can be carried out first and then step S0111; or, step S0111 and step S0112 can be carried out simultaneously.

[0531] Of course, there can also be manufacturing methods for conductive layers of other structures, which will not be elaborated here.

[0532] The manufacturing method of the conductive foam provided by the embodiments of this application, on the one hand, forms a type of conductive layer on the foam substrate; on the other hand, it can form a conductive foam with a lower working height, small PIM, and low stress in the first direction. In applications, generally select a first foam substrate with a larger volume, form a conductive layer, an adhesive layer, etc., punch it into multiple conductive foams with smaller volumes, and after laminating with a release layer, prepare them for use. When in use, tear off the release layer and electrically connect the conductive foam to at least one structure in the electronic device.

[0533] The following introduces multiple specific manufacturing methods:

[0534] As an example, as shown in

[0535] shown, the manufacturing method includes: Figure 31 shown, the manufacturing method includes:

[0536] S011. Clean the surface of the first foam substrate.

[0537] S012. Select the first conductive silver paste.

[0538] After step S012 of selecting the first conductive silver paste and before step S013 of spraying the first conductive silver paste on the first, second, third, and fourth surfaces of the first foam substrate, the manufacturing method may further include: S019. Adding a diluent. At this time, the selected first conductive silver paste can be diluted to obtain the required first conductive silver paste.

[0539] S013. Spray the first conductive silver paste on the first, second, third, and fourth surfaces of the first foam substrate.

[0540] S014. Bake and cure.

[0541] S015. Detect the resistivity and height.

[0542] If the detected resistivity and height meet the requirements, proceed to the subsequent steps; if the detected resistivity and height do not meet the requirements, scrap. At this time, the resistivity of the conductive foam needs to meet 10 -5 -10 -4 Ω×cm. Specifically, the resistivity of the conductive foam can be 10 -5 Ω×cm, 10 -4 Ω×cm, etc.; the working height of the conductive foam in the first direction needs to meet 0.1 - 0.15 mm. Specifically, the working height of the conductive foam in the first direction can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, or 0.15 mm, etc.

[0543] S016. Cover with a full-surface conductive adhesive.

[0544] S017. Die cut.

[0545] S018. Laminate release paper.

[0546] It should be noted that, first, the order of the above steps S011, S012, and S019 is not specifically limited. Exemplarily, step S011 can be carried out first, followed by steps S012 and S019; or, steps S012 and S019 can be carried out first, followed by step S011; or, steps S011, S012, and S019 can be carried out simultaneously.

[0547] Second, after step S011 of cleaning the surface of the first foam substrate and before step S013 of spraying the first conductive silver paste on the first, second, third, and fourth surfaces of the first foam substrate, the manufacturing method may further include: S020. Molding the first foam substrate by a mold.

[0548] This application does not specifically limit the process of molding the first foam substrate by die molding. Exemplarily, an extrusion molding method can be used to fabricate the first foam substrate. Specifically, select a mechanically foamed first foam substrate for cleaning, place the cleaned first foam substrate at the discharge port of the mold, and extrude the first foam substrate to force the foamed foam substrate to undergo directional plastic deformation and extrude from the die hole in a specific shape. For example, Figure 33 the hexahedral first foam substrate 10 shown. The reason for using mechanical foaming is that after spraying / printing the conductive paste and curing, the conductive foam will not undergo significant dimensional changes.

[0549] Of course, it is also possible to directly mold the first foam substrate into a foam substrate and then fabricate the conductive layer, etc., without punching.

[0550] As another example, as Figure 32 shown, the manufacturing method includes:

[0551] S021. Clean the surface of the first foam substrate.

[0552] S022. Select the first conductive silver paste.

[0553] S023. Place the first conductive silver paste in the groove of the steel plate.

[0554] After step S022. Select the first conductive silver paste and before step S023. Place the first conductive silver paste in the groove of the steel plate, the manufacturing method may further include: S031. Add a diluent. At this time, the selected first conductive silver paste can be diluted to obtain the required first conductive silver paste.

[0555] S024. Dip the pad printing head into the first conductive silver paste and form the first conductive silver paste.

[0556] S025. The pad printing head pads the first conductive silver paste on the first surface, second surface, third surface, and fourth surface of the first foam substrate.

[0557] The pad printing head of this application can print the first conductive silver paste on the first surface, second surface, third surface, and fourth surface of the first foam substrate multiple times and surface dry, and after repeating multiple times, cure; or, the pad printing head can print the first conductive silver paste on the surface of a first foam substrate multiple times in sequence and surface dry, and after repeating multiple times, cure. There is no specific limitation here.

[0558] S026. Bake and cure.

[0559] S027. Detect the resistivity and height.

[0560] If the detected resistivity and height meet the requirements, proceed to the subsequent steps; if the detected resistivity and height do not meet the requirements, it is scrap. At this time, the resistivity of the conductive foam needs to satisfy 10 -5 -10 -4 Ω×cm. Specifically, the resistivity of the conductive foam can be 10 -5 Ω×cm, 10 -4 Ω×cm, etc.; the working height of the conductive foam in the first direction needs to satisfy 0.1 - 0.15 mm. Specifically, the working height of the conductive foam in the first direction can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, or 0.15 mm, etc.

[0561] S028, cover with full-surface conductive adhesive.

[0562] S029, die-cut.

[0563] S030, laminate release paper.

[0564] It should be noted that the order of the above steps S021 to S032 and steps S022 to S024 is not specifically limited. Exemplarily, steps S021 to S032 can be carried out first, and then steps S022 to S024; or, steps S022 to S024 can be carried out first, and then S021 to S032; or, steps S021 to S032 and steps S022 to S024 can be carried out simultaneously.

[0565] After step S021, cleaning the surface of the first foam substrate, and before step S025, the printing head prints the first conductive silver paste on the first surface, second surface, third surface, and fourth surface of the first foam substrate, the manufacturing method may further include: S032, molding the first foam substrate by mold.

[0566] This application does not specifically limit the process of molding the first foam substrate by mold. Exemplarily, the first foam substrate can be manufactured by an extrusion molding method. Specifically, select a mechanically foamed first foam substrate for cleaning, place the cleaned first foam substrate at the discharge port of the mold, extrude the first foam substrate, forcing the foamed foam substrate to undergo directional plastic deformation and extrude from the die hole in a specific shape. For example, Figure 33 the hexahedral first foam substrate 10 shown. The reason for using mechanical foaming is that after spraying / printing the conductive paste and curing, the conductive foam will not undergo large-size changes.

[0567] Of course, it is also possible to directly mold the first foam substrate into a foam substrate and then manufacture the conductive layer, etc., without die-cutting.

[0568] Figure 33For Figure 32 Process flow chart of the structure combined with conductive foam. As shown in (a) of Figure 33 , a first foam substrate 10 is provided; as shown in (b) of Figure 33 , a first conductive silver paste is pad-printed on the first surface and the second surface of the first foam substrate 10; as shown in (c) of Figure 33 , a first conductive silver paste is pad-printed on the third surface and the fourth surface of the first foam substrate 10, and cured to form a first conductive paste layer 21; as shown in (d) of Figure 33 , punching to obtain a plurality of conductive foams. At this time, each conductive foam includes a foam substrate 1 and a first conductive paste layer 21 formed on the first surface, the second surface, the third surface and the fourth surface of the foam substrate 1, and the first conductive paste in the first conductive paste layer 21 is electrically conductive.

[0569] For the structural description of the conductive foam in the embodiments of the present application, reference may be made to the above embodiments, which will not be elaborated here.

[0570] Only the content related to the inventive points will be introduced here, and the remaining manufacturing methods can be obtained by referring to the related technologies, which will not be described in detail here.

[0571] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can obviously make various equivalent modifications or changes according to the above examples. For example, some steps in the above embodiments of the detection method may not be necessary, or some steps may be newly added, etc. Or any combination of any two or any more of the above embodiments. The solutions after such modifications, changes or combinations also fall within the scope of the embodiments of the present application.

[0572] It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the embodiments, and the same or similar parts not mentioned can be referred to each other. For the sake of brevity, they will not be elaborated here.

[0573] It should also be understood that the magnitudes of the serial numbers of the above processes do not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0574] It should also be understood that in the embodiments of the present application, "pre-set" and "pre-defined" can be implemented by pre-saving corresponding codes, tables or other means that can be used to indicate relevant information in a device (for example, including an electronic device). The present application does not limit its specific implementation manner.

[0575] It should also be understood that the methods, situations, categories, and the division of embodiments in the embodiments of the present application are only for the convenience of description and should not constitute special limitations. The features in various methods, categories, situations, and embodiments can be combined with each other without contradiction.

[0576] It should also be understood that in the various embodiments of the present application, if there is no special description and logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0577] Finally, it should be noted that the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A conductive foam, characterized in that, Applied to an electronic device, the conductive foam includes: A foam substrate; A conductive paste layer covering at least a first surface of the foam substrate, the conductive paste layer being electrically connected to a first structure in the electronic device, and the conductive paste layer being configured to deform under an external pressure; The conductive paste layer includes a paste main body and a plurality of connected metal conductive particles, and the metal conductive particles are doped in the paste main body.

2. The conductive foam according to claim 1, characterized in that, The conductive paste layer is in contact with at least a first surface of the foam substrate.

3. The conductive foam according to claim 1 or 2, characterized in that, The mass fraction of the metal conductive particles in the paste main body ranges from 75% to 85%.

4. The conductive foam according to any one of claims 1 to 3, characterized in that, The resistivity range of the conductive paste layer includes 10 -5 - 10 -4 Ω×cm.

5. The conductive foam according to any one of claims 1 to 4, characterized in that, The shape of the metal conductive particles includes any one of spherical, spiky, flaky, rod-shaped, and wire-shaped.

6. The conductive foam according to any one of claims 1 to 5, characterized in that, The contact area between the conductive foam and the first structure is greater than or equal to 43.46%.

7. The conductive foam according to any one of claims 1 to 6, characterized in that, The conductive paste layer is a first conductive paste layer or a second conductive paste layer; The first conductive paste layer includes a first paste main body and a plurality of first metal conductive particles, the first metal conductive particles are doped in the first paste main body, and the first paste main body includes epoxy resin or silica resin; The second conductive paste layer includes a second paste main body and a plurality of second metal conductive particles, the second metal conductive particles are doped in the second paste main body, and the second paste main body includes silicone resin or silane-modified resin.

8. The conductive foam according to any one of claims 1 to 7, characterized in that, The first surface of the foam substrate is at least divided into a first region and a second region, and along a direction perpendicular to the foam substrate, the height of the part of the conductive paste layer located in the first region is less than the height of the part of the conductive paste layer located in the second region.

9. The conductive foam according to any one of claims 1 to 8, characterized in that, The shape of the foam substrate is a polyhedron, and the polyhedron includes at least the connected first surface, second surface, and third surface; The conductive paste layer covers at least the first surface, the second surface, and the third surface.

10. The conductive foam according to claim 9, characterized in that, When the polyhedron includes the first surface, the second surface, and the third surface, the first surface and the second surface are oppositely arranged, and the first surface is connected to the second surface through the third surface; the conductive paste layer covers at least a part of the first surface, at least a part of the second surface, and all of the third surface of the polyhedron.

11. The conductive foam according to claim 9, characterized in that, When the polyhedron includes the first surface, the second surface, the third surface, and the fourth surface, the first surface and the second surface are oppositely arranged, and the third surface and the fourth surface are oppositely arranged, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive paste layer covers all of the first surface, at least a part of the second surface, all of the third surface, and all of the fourth surface.

12. The conductive foam according to any one of claims 9 to 11, characterized in that, The second surface of the polyhedron is configured to be electrically connected to a second structure in the electronic device through the conductive paste layer.

13. The conductive foam according to any one of claims 1 to 12, characterized in that, The first structure in the electronic device is any one of a display screen, a camera module, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative part.

14. The conductive foam according to claim 12, characterized in that, The second structure in the electronic device is any one of a display screen, a camera module, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative member.

15. An electronic device, characterized in that, It includes the conductive foam according to any one of claims 1 to 14.

16. The electronic device according to claim 15, characterized in that, The first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

17. The electronic device according to claim 15, wherein The first structure at least includes a camera module, and the camera module is used to maintain electrical connection with the conductive foam when rotating.

18. A method for manufacturing a conductive foam, characterized in that The manufacturing method includes: forming a conductive paste layer on at least a first surface of the foam substrate; wherein, the conductive paste layer is electrically connected to a first structure in the electronic device, the conductive paste layer is used to deform under the action of an external pressure; the conductive paste layer includes a paste main body and a plurality of connected metal conductive particles, and the metal conductive particles are doped in the paste main body.

Images