A small bistable relay with a high-insulation process structure

Abstract

The present invention discloses a small bistable relay with a high-insulation process structure, which relates to the technical field of relays and solves the problems that the relay needs to be continuously powered on to maintain the closed state, with high energy consumption, resulting in a large temperature rise, easily affecting the service life of the relay, and being prone to malfunction and out-of-control due to unstable working voltage, and having poor working stability. The small bistable relay with a high-insulation process structure includes a base, an integrated bistable relay mechanism, a moving and static reed assembly, and an automatic dispensing device. In the present invention, based on the matrix process of the relay, the production and assembly operations of high-insulation relay products can be realized, greatly improving the insulation performance of the relay. After the iron core is magnetized by applying a positive DC pulse voltage, the closed state of the moving contact can be maintained unchanged only by the magnetic force of the ring magnet magnetizing the iron core, and the coil does not need to be continuously powered on, greatly reducing the energy consumption, with a smaller temperature rise and higher safety of the relay.

Description

Technical Field

[0001] The present invention relates to the technical field of relays, and in particular to a small bistable relay with a high-insulation process structure. Background Art

[0002] A relay is an electrical control device. When the change of the input quantity (excitation quantity) reaches the specified requirement, it is an electrical appliance that causes a predetermined step change in the controlled quantity in the electrical output circuit. It has an interactive relationship between a control system (also known as an input circuit) and a controlled system (also known as an output circuit), and is usually applied to an automatic control circuit, playing roles such as automatic regulation, safety protection, and circuit conversion in the circuit.

[0003] During the production and assembly process of a relay, the insulation process is a main process in relay assembly, which can ensure that the assembled relay has an insulation function and guarantee the safety of the relay during use.

[0004] The existing Chinese patent application with the publication number of CN118800623A discloses a relay, which includes a contact container, a static contact lead-out end, a fixing member, a movable member, a movable part, and a first magnetic conductor. The contact container includes an insulating cover and a yoke iron plate. The insulating cover is connected to the side surface of the yoke iron plate, and the insulating cover and the yoke iron plate form a contact chamber; the insulating cover is provided with a first through hole, and the first through hole communicates with the contact chamber; the static contact lead-out end passes through the first through hole; the fixing member is arranged in the contact chamber and is fixedly connected to the yoke iron plate; the movable member is movably arranged in the contact chamber and includes a moving spring, and the moving spring is used to contact or separate from a pair of static contact lead-out ends; the movable part is movably connected to the fixing member; the first magnetic conductor is arranged in the contact chamber and is connected to the movable part. The first magnetic conductor is arranged on the side of the moving spring facing the static contact lead-out end; in this invention, the fixing member is connected to the yoke iron plate. Since the fixing member is fixed relative to the yoke iron plate, the magnetic attraction force generated between the first magnetic conductor and the movable member is transferred to the yoke iron plate, so that excessive coil holding force is not required, thereby reducing the coil power consumption and the volume of the relay, and improving the short-circuit resistance.

[0005] However, the relay has the following defects during specific use:

[0006] 1. With the increasing competition intensity in the relay industry, the economy of thrift has become the first element for the survival and development of enterprises. Therefore, high-energy-consuming products can no longer meet the modern production requirements. The current power relays need to be continuously powered on to maintain the closed state, with high energy consumption, resulting in a large temperature rise, which is likely to affect the service life of the relay, and is prone to malfunction and out-of-control due to unstable working voltage, and the working stability is poor;

[0007] 2. With the development of applications, small-sized bistable relays have great development potential. Especially in recent years, there have been great breakthroughs in the development of smart homes. However, due to the high-precision and high-quality requirements during the assembly of small-sized bistable relays, most of the small-sized bistable relays on the market currently cannot meet the insulation requirements and are difficult to put into actual production. Summary of the Invention

[0008] The purpose of the present invention is to provide a small-sized bistable relay with a high-insulation process structure to solve the problems raised in the above background technology.

[0009] To achieve the above-mentioned invention purpose, the present invention adopts the following technical solutions:

[0010] The present invention provides a small-sized bistable relay with a high-insulation process structure, including a base, an integrated bistable relay mechanism, a moving and static reed assembly, and an automatic dispensing device. The integrated bistable relay mechanism is installed on the top of the base. A group of moving and static reed assemblies are connected to both the left and right sides of the integrated bistable relay mechanism. The moving and static reed assemblies are installed on the side of the base.

[0011] The automatic dispensing device performs dispensing treatment on the assembled small-sized bistable relay with a high-insulation process structure.

[0012] Among them, the integrated bistable relay mechanism includes:

[0013] A magnetic circuit component, which is installed on one side of the top of the base. Moving and static reed assemblies are arranged on both the left and right sides of the magnetic circuit component. A magnet component is arranged on the side of the magnetic circuit component.

[0014] Among them, moving and static reed assemblies are arranged on both sides of the bottom of the magnet component. The magnet component is electrically connected to the magnetic circuit component. The tops of the magnetic circuit component and the magnet component are assembled and sealed through a housing.

[0015] As a preferred solution of the present invention, a plurality of positioning insertion rods penetrate through the interior of the base and extend into the interior of the magnetic circuit component. All the plurality of positioning insertion rods are arranged on the side of the moving and static reed assembly.

[0016] Among them, an assembly port is opened at the center of the interior of the base, and the magnetic circuit component is installed inside the assembly port.

[0017] As a preferred solution of the present invention, the moving and static reed assembly includes:

[0018] A conductive insertion rod, which penetrates through the base and extends to the inner wall of the magnetic circuit component. A plurality of protruding portions are installed on one side of the conductive insertion rod located inside the magnetic circuit component.

[0019] Wherein, a plurality of movable springs are installed on the outer sides of the protrusions, the movable springs are arranged on the side of the conductive plug, and the movable springs are arranged on the outer side of the magnetic circuit assembly;

[0020] A moving contact, the moving contact being mounted on a side surface of the moving reed, the moving contact being arranged on a side surface of the raised portion, and a static contact being arranged on a side surface of the moving contact;

[0021] A static reed is provided with a static contact point inside the static reed, the static reed passes through the base, and the static reed is provided on the side of the dynamic reed.

[0022] As a preferred solution of the present invention, the movable spring is installed at the eccentric position of the bottom of the magnet assembly, and the static spring is arranged on the side of the magnet assembly.

[0023] Wherein, the movable spring is bent.

[0024] As a preferred embodiment of the present invention, the magnetic circuit assembly includes:

[0025] A relay insulating sheet, wherein the central portion of the relay insulating sheet protrudes outward, and the protruding portion of the relay insulating sheet constitutes an assembly protrusion, the assembly protrusion extends to the interior of the assembly opening, and the relay insulating sheet is mounted on the top of the base.

[0026] Wherein, a plurality of positioning rods are provided through the interior of the relay insulation sheet, and the relay insulation sheet is provided as an enclosing structure;

[0027] A coil skeleton, the coil skeleton is installed inside the relay insulating sheet, the positioning rod is provided through the inside of the coil skeleton, and the relay coil is wound around the outside of the coil skeleton;

[0028] An iron core is installed inside the coil frame, the iron core extends to the outside of the coil frame, and the bottom of the iron core extends to the inside of the magnet assembly.

[0029] As a preferred solution of the present invention, a yoke is installed on the inner bottom of the relay insulation sheet, and the top of the yoke is equipped with the coil skeleton through a reserved opening.

[0030] Wherein, a concave block is provided on one side of the yoke located outside the relay insulation sheet, an iron core is supported and positioned on the top of the concave block, and the structural shape of the yoke is "L" shaped.

[0031] The iron core and the yoke are connected to the coil frame through a riveting process, and the coil frame and the relay coil are assembled through a glue potting process.

[0032] As a preferred embodiment of the present invention, the magnet assembly includes:

[0033] A push piece, the push piece is installed on the top of the base, the push piece abuts against the side of the relay insulation piece, and the structure of the push piece is "T" shaped;

[0034] The inner groove is opened at the inner center of the push piece, and the left and right sides of the inner groove are equipped with armature pieces, and the inner side of the armature piece is provided with a magnet.

[0035] The magnet is installed inside the inner groove, an iron core is provided on the side of the magnet, and the iron core is located between two armature pieces.

[0036] As a preferred solution of the present invention, alignment bumps are installed on both sides of the bottom of the push piece, and the alignment bumps are arranged on the left and right sides of the inner groove.

[0037] Wherein, a movable spring piece is provided through the interior of the alignment protrusion.

[0038] As a preferred solution of the present invention, the push piece, the armature piece and the magnet are integrally formed by a mold.

[0039] Compared with the prior art, the small bistable relay proposed in the present invention can realize a high-insulation process structure, which can solve the problem that the existing power relay needs to be continuously energized to maintain a closed state, resulting in high energy consumption and low stability.

[0040] One or more of the above technical solutions have the following beneficial effects:

[0041] 1. In a small, bistable, high-insulation relay structure, the relay's base process enables the production and assembly of high-insulation relays. Furthermore, the epoxy resin potting process within the relay coil's magnetic circuit significantly enhances the relay's insulation performance. After a positive DC pulse voltage is applied to the core, the magnetic force of the ring magnet alone maintains the moving contact's closed state. The coil no longer needs to be energized, significantly reducing energy consumption, minimizing relay temperature rise, and improving safety.

[0042] 2. In a small bistable relay with a high-insulation process structure, the bistable relay includes a setting process and a reset process. The setting process is: when the relay needs to be in a closed state, a positive DC pulse voltage is applied to the relay coil. The relay coil generates a magnetic field, which interacts with the magnetic field of the permanent magnet, so that the relay moving reed is attracted and contacts the static contact, thereby closing the circuit. The moving contact and the static contact are locked in a closed state by the moving reed to ensure the stable operation of the relay. The reset process is: when the relay needs to be in an open state, a reverse DC pulse voltage is applied to the relay coil. The magnetic field generated by the coil is opposite to the direction of the magnetic field of the permanent magnet, so that the moving reed is subjected to a repulsive force and separated from the static contact, thereby disconnecting the circuit, and the moving contact is restored to its initial position by the spring.

[0043] 3. In a small, bistable, high-insulation relay, the design of an insulating sheet enclosure and automated dispensing equipment allow for glue potting of the magnetic circuit (coil bobbin and relay coil), achieving high- and low-voltage insulation. This design also significantly improves the relay's insulation withstand voltage, meeting the requirements of various application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0045] Furthermore, the terms "installed," "disposed," "provided with," "connected," "connected," and "socketed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0046] Figure 1 It is a schematic structural diagram of the present invention as a whole;

[0047] Figure 2 This is a schematic diagram of the overall explosion structure of the present invention;

[0048] Figure 3 is an exploded view of the connection between the relay and the automatic dispensing device of the present invention;

[0049] Figure 4 It is a schematic structural diagram of the overall main view of the present invention;

[0050] Figure 5 It is a structural schematic diagram of the dynamic and static reed assembly of the present invention;

[0051] Figure 6 It is an exploded view of the connection between the base and the relay insulating sheet of the present invention;

[0052] Figure 7 It is a schematic structural view of the sectional view of the connection between the base and the magnetic circuit assembly of the present invention;

[0053] Figure 8 It is a schematic structural view of the magnetic circuit assembly of the present invention;

[0054] Figure 9 It is a schematic structural view of the connection between the magnetic circuit assembly and the magnet assembly of the present invention;

[0055] Figure 10 It is a schematic structural view of the magnet assembly of the present invention;

[0056] In the figure:

[0057] 10. Base; 101. Positioning insertion rod; 102. Assembly port;

[0058] 20. Integrated steady-state relay mechanism;

[0059] 30. Moving and static reed assembly; 301. Conductive insertion rod; 302. Protrusion; 303. Moving reed; 304. Moving contact; 305. Static contact; 306. Static reed;

[0060] 40. Automatic dispensing equipment;

[0061] 50. Magnetic circuit assembly; 501. Relay insulating sheet; 502. Assembly protrusion; 503. Coil skeleton; 504. Relay coil; 505. Iron core; 506. Yoke iron; 5061. Concave block;

[0062] 60. Magnet assembly; 601. Pushing sheet; 6011. Alignment convex block; 602. Inner groove; 603. Armature plate; 604. Magnet. Detailed implementation manners

[0063] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0064] Please refer to Figures 1 - 10, A small bistable relay with a high-insulation process structure includes a base 10, an integrated stable relay mechanism 20, a moving and static reed assembly 30, and an automatic dispensing device 40. The integrated stable relay mechanism 20 is installed on the top of the base 10. A set of moving and static reed assemblies 30 are connected to both the left and right sides of the integrated stable relay mechanism 20. The moving and static reed assemblies 30 are installed on the side of the base 10. The automatic dispensing device 40 performs dispensing treatment on the assembled small bistable relay with a high-insulation process structure. Among them, the integrated stable relay mechanism 20 includes a magnetic circuit component 50. The magnetic circuit component 50 is installed on one side of the top of the base 10. The moving and static reed assemblies 30 are arranged on both the left and right sides of the magnetic circuit component 50. A magnet component 60 is arranged on the side of the magnetic circuit component 50. Among them, the moving and static reed assemblies 30 are arranged on both sides of the bottom of the magnet component 60. The magnet component 60 is electrically connected to the magnetic circuit component 50. The tops of the magnetic circuit component 50 and the magnet component 60 are assembled and sealed through a housing.

[0065] The above working principle: When assembling the relay, the magnetic circuit component 50 and the magnet component 60 are respectively installed on the top of the base 10 according to the sequence. After the assembly is completed, the relay is assembled and sealed through the housing arranged on the top. Among them, the internal parts of the magnetic circuit component 50 are assembled by using the potting (epoxy resin) process, which can greatly improve the insulation performance and safety of the relay. The magnet component 60 is integrally formed by using the die processing method. On the one hand, it can avoid defects such as gaps and air holes caused by mold splicing or uneven casting. On the other hand, it can reduce the weight, improve the production efficiency, and realize the efficient relay assembly processing operation.

[0066] In the present invention, the magnetic circuit component 50 adopts the principle of an electromagnet of "like poles repel, opposite poles attract".

[0067] In the present invention, a plurality of positioning insertion rods 101 are arranged through the inside of the base 10. The positioning insertion rods 101 extend into the inside of the magnetic circuit component 50. The plurality of positioning insertion rods 101 are all arranged on the side of the moving and static reed assembly 30. Among them, an assembly port 102 is opened at the center of the inside of the base 10. The magnetic circuit component 50 is installed inside the assembly port 102.

[0068] In the small bistable relay with a high-insulation process structure of the present invention, through the design of the positioning insertion rods 101 and the assembly port 102, the internal parts of the magnetic circuit component 50 can be stably assembled.

[0069] Specific reference Figure 5The dynamic and static spring assembly 30 includes a conductive plug 301, which is set through the base 10 and extends to the inner wall of the magnetic circuit assembly 50. A plurality of protrusions 302 are installed on one side of the conductive plug 301 located inside the magnetic circuit assembly 50, wherein a dynamic spring 303 is installed on the outside of the plurality of protrusions 302, and the dynamic spring 303 is set on the side of the conductive plug 301. The dynamic spring 303 is set on the outside of the magnetic circuit assembly 50; a dynamic contact 304, which is installed on the side of the dynamic spring 303, and the dynamic contact 304 is set on the side of the protrusion 302. A static contact 305 is set on the side of the dynamic contact 304; a static spring 306, which is installed inside the static spring 306, and the static spring 306 is set through the base 10 and is set on the side of the dynamic spring 303.

[0070] In this embodiment, the movable spring piece 303 is installed at an eccentric position of the inner bottom of the magnet assembly 60 , and the static spring piece 306 is arranged on the side of the magnet assembly 60 , wherein the movable spring piece 303 is bent.

[0071] In the compact, bistable, high-insulation relay of the present invention, when the relay is set, the magnetic circuit assembly 50 operates and generates a magnetic field, attracting the movable reed 303 within the relay, driving the movable contact 304 into contact with the stationary contact 305, thereby closing the circuit. The movable and stationary contacts 304 and 305 then lock the movable reed 303 in the closed state, ensuring stable relay operation.

[0072] Specific reference Figure 6 、 Figure 7 、 Figure 8 and Figure 9 The magnetic circuit assembly 50 includes a relay insulating sheet 501, the central part of the relay insulating sheet 501 protrudes outward, and the protruding part of the relay insulating sheet 501 constitutes an assembly protrusion 502, the assembly protrusion 502 extends to the inside of the assembly opening 102, the relay insulating sheet 501 is installed on the top of the base 10, wherein a plurality of positioning rods 101 are provided through the inside of the relay insulating sheet 501, and the relay insulating sheet 501 is provided as an enclosing structure; a coil skeleton 503, the coil skeleton 503 is installed inside the relay insulating sheet 501, the positioning rods 101 are provided through the inside of the coil skeleton 503, and the outside of the coil skeleton 503 is wound with a relay coil 504; an iron core 505, the iron core 505 is installed inside the coil skeleton 503, the iron core 505 extends to the outside of the coil skeleton 503, and the bottom of the iron core 505 extends to the inside of the magnet assembly 60.

[0073] In this embodiment, a yoke 506 is installed at the inner bottom of the relay insulation sheet 501. The top of the yoke 506 is assembled with a coil bobbin 503 through a reserved opening. Among them, a concave block 5061 is provided on one side of the yoke 506 located outside the relay insulation sheet 501, and an iron core 505 is supported and positioned on the top of the concave block 5061. The structural shape of the yoke 506 is "L". Among them, the iron core 505 and the yoke 506 are connected to the coil bobbin 503 through a riveting process, and the coil bobbin 503 and the relay coil 504 are assembled through a potting process.

[0074] In the small bistable relay with a high-insulation process structure of the present invention, when the relay is operating, the relay insulation sheet 501 can be installed on the top of the base 10 through the assembly protrusion 502, and the coil bobbin 503 can be installed inside the relay insulation sheet 501 through a plurality of positioning rods 101. At the same time, the relay coil 504 of the coil bobbin 503 can be stably installed on the outside of the coil bobbin 503 by means of dispensing. When the relay coil 504 operates and generates a magnetic field, the iron core 505 inside it will operate.

[0075] Specifically referring to Figure 9 and Figure 10 , the magnet assembly 60 includes a push piece 601. The push piece 601 is installed on the top of the base 10, and the push piece 601 abuts against the side of the relay insulation sheet 501. The structural shape of the push piece 601 is "T"; an inner groove 602 is opened at the center of the inside of the push piece 601. Armature plates 603 are installed on the left and right sides inside the inner groove 602. A magnet 604 is provided on the inner side of the armature plate 603. Among them, the magnet 604 is installed inside the inner groove 602, and an iron core 505 is provided on the side of the magnet 604. The iron core 505 is located between the two armature plates 603.

[0076] In this embodiment, alignment bumps 6011 are installed on both sides of the bottom of the push piece 601. The alignment bumps 6011 are provided on the left and right sides of the inner groove 602. Among them, a moving reed 303 penetrates through the inside of the alignment bump 6011.

[0077] In addition, in this embodiment, the push piece 601, the armature plate 603 and the magnet 604 are integrally formed by a mold.

[0078] In the small bistable relay with a high-insulation process structure of the present invention, the push piece 601 can be pushed to move the armature plate 603 and the magnet 604 to the side of the iron core 505. At this time, in cooperation with the operation of the iron core 505, electricity will be transmitted to the static reed 306 to achieve operations such as power transmission and power control.

[0079] Accordingly, any person skilled in the art within the scope of the technology disclosed by the present invention, making equivalent substitutions or changes according to the technical solution of the present invention and its inventive concept, shall be covered by the protection scope of the present invention.

Claims

1. A small bistable relay with a high-insulation process structure, comprising a base (10), an integrated steady-state relay mechanism (20), a moving and static reed assembly (30), and an automatic dispensing device (40), characterized in that: An integrated steady-state relay mechanism (20) is installed on the top of the base (10). A set of moving and static reed assemblies (30) are connected to both the left and right sides of the integrated steady-state relay mechanism (20). The moving and static reed assemblies (30) are installed on the side of the base (10). The automatic dispensing device (40) performs dispensing treatment on the assembled small bistable relays with high-insulation process structures. Among them, the integrated steady-state relay mechanism (20) includes:[[]]END]] A magnetic circuit assembly (50). The magnetic circuit assembly (50) is installed on one side of the top of the base (10). Moving and static reed assemblies (30) are arranged on both the left and right sides of the magnetic circuit assembly (50). A magnet assembly (60) is arranged on the side of the magnetic circuit assembly (50). Among them, moving and static reed assemblies (30) are arranged on both sides of the bottom of the magnet assembly (60). The magnet assembly (60) and the magnetic circuit assembly (50) are electrically connected. The tops of the magnetic circuit assembly (50) and the magnet assembly (60) are assembled and sealed through a housing. A plurality of positioning insertion rods (101) are penetrated and arranged inside the base (10). The positioning insertion rods (101) extend into the inside of the magnetic circuit assembly (50). All the plurality of positioning insertion rods (101) are arranged on the side of the moving and static reed assemblies (30). Among them, an assembly port (102) is opened at the center inside the base (10). The magnetic circuit assembly (50) is installed inside the assembly port (102). The moving and static reed assembly (30) includes:[[]]END]] A conductive insertion rod (301). The conductive insertion rod (301) penetrates through the base (10) and extends to the inner wall of the magnetic circuit assembly (50). A plurality of protrusion parts (302) are installed on one side of the conductive insertion rod (301) located inside the magnetic circuit assembly (50). Among them, a moving reed (303) is installed on the outer side of the plurality of protrusion parts (302). The moving reed (303) is arranged on the side of the conductive insertion rod (301). The moving reed (303) is arranged on the outer side of the magnetic circuit assembly (50). A moving contact (304). The moving contact (304) is installed on the side of the moving reed (303). The moving contact (304) is arranged on the side of the protrusion part (302). A static contact (305) is arranged on the side of the moving contact (304). A static reed (306). The static contact (305) is installed inside the static reed (306). The static reed (306) penetrates through the base (10) and is arranged on the side of the moving reed (303).

2. A small bistable relay with a high-insulation process structure according to claim 1, characterized in that: The moving reed (303) is installed at the eccentric position of the inner bottom of the magnet assembly (60). The static reed (306) is arranged on the side of the magnet assembly (60). Among them, the moving reed (303) is bent.

3. A small bistable relay with a high-insulation process structure according to claim 1, characterized in that: The magnetic circuit assembly (50) includes:[[]]END]] A relay insulating sheet (501), wherein the central portion of the relay insulating sheet (501) protrudes outward, and the protruding portion of the relay insulating sheet (501) constitutes an assembly protrusion (502), and the assembly protrusion (502) extends to the inside of the assembly opening (102), and the relay insulating sheet (501) is installed on the top of the base (10), Wherein, a plurality of positioning rods (101) are provided through the interior of the relay insulating sheet (501), and the relay insulating sheet (501) is provided as an enclosing structure; A coil skeleton (503), the coil skeleton (503) being installed inside the relay insulating sheet (501), the positioning rod (101) being provided through the inside of the coil skeleton (503), and the relay coil (504) being wound around the outside of the coil skeleton (503); An iron core (505) is installed inside the coil frame (503), the iron core (505) extends to the outside of the coil frame (503), and the bottom of the iron core (505) extends to the inside of the magnet assembly (60).

4. A small bistable relay with a high-insulation process structure according to claim 3, characterized in that: A yoke (506) is installed on the inner bottom of the relay insulating sheet (501), and the top of the yoke (506) is equipped with the coil skeleton (503) through a reserved opening. The yoke (506) is provided with a concave block (5061) on one side outside the relay insulating sheet (501), and the top of the concave block (5061) supports and positions the iron core (505). The yoke (506) has an "L" shape. The iron core (505) and the yoke (506) are connected to the coil frame (503) through a riveting process, and the coil frame (503) and the relay coil (504) are assembled through a glue potting process.

5. A small bistable relay with a high-insulation process structure according to claim 3, characterized in that: The magnet assembly (60) includes: A push piece (601), the push piece (601) is installed on the top of the base (10), the push piece (601) abuts against the side of the relay insulation piece (501), and the structural shape of the push piece (601) is "T"-shaped; An inner groove (602) is provided at the inner center of the push piece (601), armature pieces (603) are installed on the left and right sides of the inner groove (602), and a magnet (604) is provided on the inner side of the armature piece (603). The magnet (604) is installed inside the inner groove (602), an iron core (505) is provided on the side of the magnet (604), and the iron core (505) is located between two armature pieces (603).

6. A small bistable relay with a high-insulation process structure according to claim 5, characterized in that: Alignment protrusions (6011) are installed on both sides of the bottom of the push piece (601), and the alignment protrusions (6011) are arranged on the left and right sides of the inner groove (602). A movable spring (303) is provided running through the interior of the alignment protrusion (6011).

7. A small bistable relay with a high-insulation process structure according to claim 5, characterized in that: The push piece (601), the armature piece (603) and the magnet (604) are integrally formed by a mold.

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