Semiconductor process equipment

Abstract

The invention discloses semiconductor process equipment, and belongs to the technical field of semiconductor processing. The disclosed semiconductor process equipment comprises a process chamber, a thermal insulation layer, a first exhaust device and a second exhaust device, the heat preservation layer wraps the process chamber, an airflow gap is formed between the heat preservation layer and the process chamber, an air inlet channel, a first exhaust port and a second exhaust port are formed in the heat preservation layer at intervals, the first exhaust port and the second exhaust port are arranged at intervals in the axial direction of the process chamber, and the air inlet channel, the first exhaust port and the second exhaust port all communicate with the airflow gap; the first exhaust device is communicated with the first exhaust port in an on-off mode, and the second exhaust device is communicated with the second exhaust port in an on-off mode. According to the scheme, the problem that the internal temperature of the process chamber of the semiconductor process equipment related to the related technology is not uniform can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor process equipment. Background Art

[0002] In semiconductor process equipment, wafers are usually processed in the process chamber of the semiconductor process equipment, and a thermal insulation layer wrapped around the periphery of the process chamber provides heat insulation and heat preservation for the process chamber. An air inlet channel is provided on the thermal insulation layer wrapped around the side wall of the process chamber, and the air inlet channel is connected to the space between the process chamber and the thermal insulation layer. To reduce the temperature of the process chamber, cold air can enter the space between the process chamber and the thermal insulation layer through the air inlet channel and be discharged from the exhaust port provided on the thermal insulation layer wrapped around the top of the process chamber.

[0003] Specifically, an exhaust device is connected to the exhaust port. The exhaust device includes an exhaust pipe and a cooling member and a fan provided on the exhaust pipe. The cooling member is used to cool the hot gas coming out of the exhaust port. The fan can provide suction force, which can prompt the above-mentioned cold air to enter the air inlet channel and the space between the process chamber and the thermal insulation layer, and prompt the cold air to be discharged from the exhaust port, so as to take away the heat of the process chamber and achieve rapid cooling of the process chamber. However, since the exhaust port is located at the top of the process chamber, under the action of the fan, the cold air can quickly take away the heat at the top of the process chamber, while the cooling rate at the bottom of the process chamber is slower, which easily leads to uneven temperature at the top and bottom of the process chamber, and further easily leads to uneven temperature inside the process chamber.

[0004] In summary, the process chamber of the semiconductor process equipment related to the related technology has the problem of uneven internal temperature. Summary of the Invention

[0005] This application discloses a semiconductor process equipment to solve the problem of uneven internal temperature in the process chamber of the semiconductor process equipment related to the related technology.

[0006] To solve the above technical problems, this application adopts the following technical solutions: A semiconductor process equipment includes a process chamber, a thermal insulation layer, a first exhaust device, and a second exhaust device; The thermal insulation layer wraps the process chamber, and there is an air flow gap between them. The thermal insulation layer is provided with an air inlet channel, a first exhaust port, and a second exhaust port at intervals. The first exhaust port and the second exhaust port are arranged at intervals along the axial direction of the process chamber, and the air inlet channel, the first exhaust port, and the second exhaust port are all connected to the air flow gap. The first exhaust device is connected to the first exhaust port in a switchable manner, and the second exhaust device is connected to the second exhaust port in a switchable manner.

[0007] The technical solution adopted in this application can achieve the following beneficial effects: In this application, since the first exhaust port and the second exhaust port are arranged at intervals along the axial direction of the process chamber, that is, there is a certain distance between the first exhaust port and the second exhaust port, and a second exhaust device is added at the second exhaust port in this application. When rapid cooling is required, the second exhaust device can be opened, and the second exhaust device can quickly take away the heat near the second exhaust port of the process chamber, thereby increasing the cooling rate near the second exhaust port of the process chamber, and further reducing the temperature difference between the vicinity of the first exhaust port and the vicinity of the second exhaust port of the process chamber during cooling, and further improving the uniformity of the internal temperature of the process chamber. Therefore, the semiconductor process equipment disclosed in this application can solve the problem that the process chamber of the semiconductor process equipment involved in the related technology has relatively uneven internal temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a partial cross-sectional structural schematic diagram of the semiconductor process equipment disclosed in the embodiment of this application; Figure 2 and Figure 3 is a structural schematic diagram of the semiconductor process equipment in different perspectives disclosed in the embodiment of this application; Figure 4 and Figure 5 is Figure 2 a partial enlarged schematic diagram of different parts of; Figure 6 is a partial top view structural schematic diagram of the semiconductor process equipment disclosed in the embodiment of this application.

[0009] DESCRIPTION OF THE REFERENCE NUMERALS: 100 - process chamber, 110 - air flow gap; 200 - thermal insulation layer, 210 - intake channel, 220 - first exhaust port, 230 - second exhaust port, 240 - first thermal insulation layer, 250 - second thermal insulation layer, 251 - intake port, 260 - annular channel; 300 - first exhaust device, 310 - cooling element, 311 - first inlet, 312 - second inlet, 313 - top surface, 314 - side surface, 315 - front surface, 316 - back surface, 317 - heat exchange tube, 318 - first water outlet, 320 - fan, 330 - first air box, 340 - second air box, 341 - connecting pipe, 350 - first main pipe, 360 - second main pipe, 370 - branch pipe, 380 - third air box; 400 - second exhaust device, 410 - second exhaust pipeline, 420 - first stop valve; 510 - Water - cooling pipe, 511 - Water inlet, 512 - Second water outlet, 520 - Water - receiving tray, 530 - First bracket, 531 - Diversion channel, 540 - Heat - insulating member, 550 - Control valve, 560 - Second bracket, 570 - Water - cooling jacket; 610 - Outer shell, 620 - Mounting plate, 621 - Cooling channel, 630 - Process door, 640 - Heat - preservation barrel, 650 - Cassette, 660 - Wafer; 710 - Second shut - off valve, 720 - Clamping member, 730 - Handle. Detailed implementation manners

[0010] To make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0011] The semiconductor process equipment disclosed in the embodiments of the present application will be described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0012] Please refer to Figures 1-6 , the present application discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes a process chamber 100, a thermal insulation layer 200, a first exhaust device 300, and a second exhaust device 400.

[0013] The process chamber 100 is a place for processing wafers 660. Specifically, the wafers 660 are placed in the process chamber 100 through cassettes 650. The process chamber 100 may be provided with an opening, and the cassette 650 can enter or exit the process chamber 100 through the opening. The opening can be specifically blocked by the process door 630, so that the process door 630 provides a sealed reaction environment for the process chamber 100. There is a heat - preservation barrel 640 between the process door 630 and the cassette 650, and the process door 630 supports the cassette 650 through the heat - preservation barrel 640. The heat - preservation barrel 640 can play a role in heat preservation to ensure the process stability of the process chamber 100.

[0014] The thermal insulation layer 200 wraps the process chamber 100, that is, the thermal insulation layer 200 wraps the outer wall of the process chamber 100, and there is a certain gap between the two. The gap can specifically be an air - flow gap 110. The air - flow gap 110 can facilitate the passage of gas. The thermal insulation layer 200 has the functions of heat preservation and heat insulation to further ensure the process stability of the process chamber 100.

[0015] Please refer to Figure 1An air inlet channel 210, a first exhaust port 220 and a second exhaust port 230 are provided on the thermal insulation layer 200. The air inlet channel 210 can be arranged opposite to the side wall of the process chamber 100, and the first exhaust port 220 and the second exhaust port 230 can be arranged at intervals along the axial direction of the process chamber 100, that is, the first exhaust port 220 and the second exhaust port 230 have a certain distance in the axial direction of the process chamber 100, and the air inlet channel 210, the first exhaust port 220 and the second exhaust port 230 are all connected with the air flow gap 110, so that during the cooling process, the cold air entering through the air inlet channel 210 can enter the air flow gap 110 to cool the outer wall of the process chamber 100, thereby achieving the effect of cooling the interior of the process chamber 100, and the cold air with heat can flow to the first exhaust port 220 and the second exhaust port 230.

[0016] The first exhaust device 300 is connected to the first exhaust port 220 in an on-off manner, and the second exhaust device 400 is connected to the second exhaust port 230 in an on-off manner. In a specific process, the first exhaust device 300 needs to be disconnected from the first exhaust port 220, and the second exhaust device 400 needs to be disconnected from the second exhaust port 230. In a specific cooling process, the first exhaust device 300 is connected to the first exhaust port 220, and the second exhaust device 400 is connected to the second exhaust port 230, so that a part of the cold air can take away the heat from the side wall of the process chamber 100 and the area near the first exhaust port 220 when flowing to the first exhaust port 220, and finally be discharged from the first exhaust device 300, while another part of the cold air can take away the heat from the side wall of the process chamber 100 and the area near the second exhaust port 230 when flowing to the second exhaust port 230, and finally be discharged from the second exhaust device 400.

[0017] It can be seen from the foregoing that, since there is a certain distance between the first exhaust port 220 and the second exhaust port 230, and since a part of the cold air can take away the heat from the side wall of the process chamber 100 and near the first exhaust port 220, and another part of the cold air can take away the heat from the side wall of the process chamber 100 and near the second exhaust port 230, this allows the present application to cool down various parts of the process chamber 100, and the cooling effect at various parts is relatively uniform.

[0018] The various components of the above-mentioned semiconductor process equipment are all arranged in the main box of the semiconductor process equipment, and the process chamber 100 is installed on the inner wall of the main box through the mounting plate 620. The mounting plate 620 is arranged at the opening, and a cooling channel 621 is provided on the mounting plate 620 to facilitate cooling of the mounting plate 620 and the main box, thereby preventing the surrounding components from overheating.

[0019] In this application, since the first exhaust port 220 and the second exhaust port 230 are arranged at intervals along the axial direction of the process chamber 100, that is, there is a certain distance between the first exhaust port 220 and the second exhaust port 230, and a second exhaust device 400 is added at the second exhaust port 230 in this application. When rapid cooling is required, the second exhaust device 400 can be opened, and the second exhaust device 400 can quickly take away the heat near the second exhaust port 230 of the process chamber 100, thereby increasing the cooling rate near the second exhaust port 230 of the process chamber 100, and further reducing the temperature difference between the area near the first exhaust port 220 and the second exhaust port 230 of the process chamber 100 during cooling, and then improving the uniformity of the internal temperature of the process chamber 100. Therefore, the semiconductor process equipment disclosed in this application can solve the problem of uneven internal temperature in the process chamber 100 of the semiconductor process equipment involved in the related art.

[0020] Optionally, taking the process chamber 100 as a vertical structure as an example, the process chamber 100 may include a top and a bottom, and the top and the bottom are connected by the above-mentioned side walls. The first exhaust port 220 may face the top, and the second exhaust port 230 may face the area near the bottom of the side wall. At this time, the second exhaust port 230 is far from the first exhaust port 220, so that there is a large distance between the first exhaust port 220 and the second exhaust port 230, which can further improve the uniformity of the internal temperature of the process chamber 100 during the cooling process.

[0021] The first exhaust device 300 may specifically include a first exhaust pipeline, and the first exhaust pipeline can discharge the cold air with heat. To ensure the exhaust speed of the first exhaust pipeline, the first exhaust device 300 may further include a cooling member 310 and a fan 320, and the cooling member 310, the first exhaust pipeline and the fan 320 are sequentially connected. The cooling member 310 has a first inlet 311 and a second inlet 312 arranged at intervals. The first inlet 311 is connected to the first exhaust port 220 in a switchable manner, so that the cooling member 310 can cool the hot gas discharged through the first exhaust port 220. The fan 320 can provide suction, and the suction can prompt the above-mentioned cold air to enter the intake channel 210 and the air flow gap 110, and prompt the cold air to be discharged from the first exhaust port 220, thereby taking away the heat of the process chamber 100 to achieve the purpose of quickly cooling the process chamber 100.

[0022] Optionally, the second exhaust device 400 may specifically include a second exhaust pipe 410, which can discharge the cold air with heat. To ensure the exhaust speed of the second exhaust pipe 410, one end of the second exhaust pipe 410 is connected to the second exhaust port 230 in a switchable manner, and the other end of the second exhaust pipe 410 is connected to the second inlet 312, so that the first exhaust pipe and the second exhaust pipe 410 share the same cooling member 310 and fan 320, which can simplify the structural complexity and reduce costs while ensuring the exhaust speed of the second exhaust pipe 410. Of course, in other embodiments, the second exhaust device 400 may also be provided with a cooling member and a fan separately.

[0023] Optionally, please refer to Figure 1 , the second exhaust device 400 may further include a first cut-off valve 420, which is provided on the second exhaust pipe 410 to connect one end of the second exhaust pipe 410 to the second exhaust port 230 in a switchable manner. Optionally, the first cut-off valve 420 may be a butterfly valve, so as to control the air volume of the second exhaust pipe 410 by adjusting the opening degree of the butterfly valve. Of course, the embodiments of the present application do not make specific limitations on this.

[0024] Optionally, since the side of the fan 320 away from the first exhaust pipe is connected to the factory service negative pressure end, to avoid the influence of the factory service negative pressure on the temperature of the process chamber 100, a second cut-off valve 710 may be provided between the first exhaust pipe and the cooling member 310. The second cut-off valve 710 can connect or disconnect the first exhaust pipe and the cooling member 310. During the process, the second cut-off valve 710 can preferably disconnect the first exhaust pipe and the cooling member 310 to isolate the negative pressure of the factory service exhaust, thereby avoiding the influence of the factory service negative pressure on the temperature of the process chamber 100, that is, avoiding the temperature loss of the process chamber 100 during the process.

[0025] Optionally, the thermal insulation layer 200 may only include a first thermal insulation layer 240.

[0026] In another embodiment, please refer to Figure 1 , the thermal insulation layer 200 may include a first thermal insulation layer 240 and a second thermal insulation layer 250. The first thermal insulation layer 240 wraps the process chamber 100, and the second thermal insulation layer 250 is sleeved outside the first thermal insulation layer 240. The first thermal insulation layer 240 and the second thermal insulation layer 250 have better thermal insulation and heat insulation effects on the process chamber 100.

[0027] In this embodiment, an air inlet channel 210 and a first exhaust port 220 may be provided at intervals on the first thermal insulation layer 240, and an air inlet port 251 and a second exhaust port 230 may be provided at intervals on the second thermal insulation layer 250. An annular channel 260 is formed between the first thermal insulation layer 240 and the second thermal insulation layer 250. The air inlet port 251, the annular channel 260 and the air inlet channel 210 are connected in sequence, and the annular channel 260 is connected to the second exhaust port 230. External cold air can enter the airflow gap 110 through the air inlet port 251, the annular channel 260 and the air inlet channel 210, and a part of the cold air with heat can be discharged through the first exhaust port 220, and another part of the cold air with heat can be discharged through the air inlet channel 210, the annular channel 260 and the second exhaust port 230 in sequence.

[0028] Optionally, the number of the air inlet channels 210 may be at least two, and the air inlet channels 210 may be arranged at intervals to ensure that cold air can enter each part of the air flow gap 110, thereby ensuring that the amount of cold air entering the air flow gap 110 is sufficient.

[0029] Optionally, refer to Figures 1 to 3 The first exhaust device 300 may include a cooling member 310, a first exhaust pipeline, a fan 320, a first wind box 330 and a second wind box 340. The cooling member 310 is the cooling member 310 described above, and the fan 320 is the fan 320 described above. The cooling member 310 is connected to the first exhaust port 220 in an on-off manner. The first exhaust pipeline may include a first main pipe 350, a second main pipe 360 ​​and at least two branch pipes 370 arranged in parallel. The cooling member 310, the first main pipe 350, the first wind box 330, the at least two branch pipes 370, the second wind box 340, the second main pipe 360 ​​and the fan 320 are connected in sequence.

[0030] Specifically, one end of the first wind box 330 is connected to the first main pipe 350, that is, one end of the first wind box 330 is provided with a connecting port, and the other end of the first wind box 330 is connected to one ends of the at least two branch pipes 370 arranged in parallel, that is, the other end of the first wind box 330 is provided with at least two connecting ports, and the at least two connecting ports correspond one to one with one end of the at least two branch pipes 370, and one end of the second wind box 340 is connected to the other end of the at least two branch pipes 370 arranged in parallel, that is, one end of the second wind box 340 is provided with at least two connecting ports, and the at least two connecting ports correspond one to one with the other end of the at least two branch pipes 370, and the other end of the second wind box 340 is connected to the second main pipe 360, that is, the other end of the second wind box 340 is provided with a connecting port. It can be seen that the first wind box 330 and the second wind box 340 both act as transfer wind boxes.

[0031] In this embodiment, the extending direction of the first main pipe 350 intersects with the extending direction of the branch pipe 370, that is, the first air box 330 can change the flow direction of the cold air with heat in the first main pipe 350, and the cross-sectional area of the first main pipe 350 and the cross-sectional area of the second main pipe 360 are both larger than the cross-sectional area of the branch pipe 370. This enables each of the at least two branch pipes 370, when embedded in an external equipment cabinet (the equipment cabinet is installed in the above-mentioned main chassis), to occupy a smaller space in the embedding direction.

[0032] Meanwhile, since the present application is provided with the at least two branch pipes 370 arranged in parallel, this can ensure that the first exhaust pipeline has sufficient exhaust air volume, that is, it can ensure the cooling rate of the process chamber 100. In addition, in this embodiment, the present application can flexibly adjust the number of the branch pipes 370, the number of the first air boxes 330, and the number of the second air boxes 340 according to the actual layout, so as to flexibly adjust the space occupied by the branch pipes 370 in the embedding direction on the equipment cabinet. At the same time, the present application can also flexibly adjust the dimensions of the branch pipes 370, the first air boxes 330, and the second air boxes 340 according to the actual situation. Of course, in other embodiments, the first exhaust pipeline may not include the at least two branch pipes 370 arranged in parallel.

[0033] Optionally, the first exhaust device 300 may further include at least one third air box 380. Each branch pipe 370 may include at least two sub-branch pipes that are separately arranged, that is, each branch pipe 370 can be divided into at least two segments, and the at least two sub-branch pipes of each branch pipe 370 can be connected through the third air box 380 to enable the at least two sub-branch pipes of each branch pipe 370 to communicate with each other. This can prevent the branch pipes 370 from being unable to pass through the door of the main chassis due to their excessive length. That is, this segmented method can easily transport each branch pipe 370 into the main chassis and assemble them through the third air box 380. Of course, in other embodiments, each branch pipe 370 may not include at least two sub-branch pipes that are separately arranged, that is, each branch pipe 370 is an integral structure.

[0034] In this embodiment, the present application can flexibly adjust the number of the third air boxes 380 and the number of the sub-branch pipes included in each branch pipe 370 according to the actual layout, and at the same time, the present application can also flexibly adjust the dimensions of the third air boxes 380 and the dimensions of each sub-branch pipe according to the actual situation.

[0035] Optionally, please refer to Figure 5, when the second air box 340 is connected to each branch pipe 370, a connecting pipe 341 can be protrudingly provided at the above-mentioned communication port of the second air box 340. One end of the branch pipe 370 can extend into the connecting pipe 341, and the two can be connected by a clamping member 720. The clamping member 720 can specifically be a hose clamp. The clamping member 720 can ensure the connection stability between the connecting pipe 341 and the branch pipe 370. At the same time, the clamping member 720 can facilitate the disassembly and assembly of the connecting pipe 341 and the branch pipe 370. Of course, in other embodiments, the connecting pipe 341 and the branch pipe 370 can be adhesively connected.

[0036] Optionally, the connection manners of the first air box 330 and the third air box 380 with each branch pipe 370 can be the same as the connection manner of the second air box 340 with each branch pipe 370. Of course, the connection manners of the first air box 330 and the third air box 380 with each branch pipe 370 can also be different from the connection manner of the second air box 340 with each branch pipe 370.

[0037] Optionally, the first exhaust device 300 includes a cooling member 310. The cooling member 310 is connected to the first exhaust port 220 in a switchable manner. The cooling member 310 is the cooling member 310 described above. Inside the main chassis, specifically, other components such as various circuits are arranged around the cooling member 310. To avoid damage to the components around it due to the too high outer surface temperature of the cooling member 310, that is, to avoid affecting the normal operation of the components around it, the semiconductor process equipment can further include a water cooling pipe 510. The water cooling pipe 510 is arranged on the outer wall of the cooling member 310 so that the water cooling pipe 510 can cool the outer wall of the cooling member 310, thereby avoiding affecting the components around it.

[0038] At the same time, the cooling member 310 combined with the water cooling pipe 510 can further reduce the temperature of the gas entering the first exhaust device 300. Of course, in other embodiments, the semiconductor process equipment may not include the water cooling pipe 510. At this time, by changing the layout manner of the cooling member 310, the cooling member 310 can be far away from the above-mentioned various circuits.

[0039] Optionally, the cooling member 310 is provided with a first inlet 311. The first inlet 311 is connected to the first exhaust port 220 in a switchable manner. The first inlet 311 is the first inlet 311 described above. Please refer to Figures 2 to 4 , the cooling member 310 has a top surface 313, a side surface 314 close to the first inlet 311, and a front surface 315 and a back surface 316 arranged opposite to each other. The top surface 313, the side surface 314, the front surface 315, and the back surface 316 are connected. The water cooling pipe 510 can be attached to the top surface 313, the side surface 314, the front surface 315, and the back surface 316. That is, at this time, the length of the water cooling pipe 510 is longer.

[0040] In this embodiment, since the first inlet 311 and the first exhaust port 220 are connected in a switchable manner, during the cooling process, the temperature of the area of the cooling member 310 near the first inlet 311 is relatively high. This makes the temperatures of the top surface 313, side surfaces 314, front surface 315, and back surface 316 relatively high. Since the water-cooling pipes 510 are attached to the top surface 313, side surfaces 314, front surface 315, and back surface 316, the water-cooling pipes 510 can directly cool the top surface 313, side surfaces 314, front surface 315, and back surface 316, which has a more obvious protective effect on the components arranged around the cooling member 310. Of course, in other embodiments, the water-cooling pipes 510 can be attached to the side surface of the cooling member 310 away from the first inlet 311.

[0041] Optionally, please refer to Figure 1 , Figure 3 and Figure 6 , a heat exchange pipe 317 is provided in the cooling member 310. The heat exchange pipe 317 is the main component for the cooling member 310 to achieve the cooling function. The first water outlet 318 of the heat exchange pipe 317 can be connected to the water inlet 511 of the water-cooling pipe 510, that is, the heat exchange pipe 317 is connected to the water-cooling pipe 510. This enables the cooling water entering the heat exchange pipe 317 to enter the water-cooling pipe 510. Therefore, the cooling water discharged from the heat exchange pipe 317 can be fully utilized to cool the outer wall of the cooling member 310, so as to simplify the connection complexity between the heat exchange pipe 317 and the water-cooling pipe 510 and the water supply end and drainage end of the external factory service while saving resources. Of course, in other embodiments, the first water outlet 318 of the heat exchange pipe 317 and the water inlet 511 of the water-cooling pipe 510 may not be connected.

[0042] Optionally, please refer to Figures 2 to 4 and Figure 6 , the semiconductor process equipment may further include a water receiving tray 520. In the height direction of the semiconductor process equipment, the orthographic projections of the water inlet 511 of the water-cooling pipe 510, the second water outlet 512, and the cooling member 310 are all located within the orthographic projection of the water receiving tray 520, so that the water receiving tray 520 can timely receive the cooling water leaking from the water-cooling pipe 510 and the cooling member 310 and discharge it to the factory service drainage end through the drain pipe in a timely manner. Of course, in other embodiments, the semiconductor process equipment may not include the water receiving tray 520.

[0043] Optionally, the first exhaust device 300 may include a cooling member 310. The cooling member 310 is provided with a first inlet 311. The cooling member 310 is the cooling member 310 described above, and the first inlet 311 is the first inlet 311 described above. A first bracket 530 protrudes at the first exhaust port 220. The first bracket 530 is provided with a diversion channel 531. One end of the diversion channel 531 is communicated with the first exhaust port 220, and the other end of the diversion channel 531 is communicably connected to the first inlet 311 in a switchable manner, that is, the diversion channel 531 can communicate the first exhaust port 220 and the first inlet 311, so as to guide the cold air with heat from the first exhaust port 220 to the first inlet 311.

[0044] In this embodiment, the first bracket 530 supports the cooling member 310, that is, the cooling member 310 is placed on the first bracket 530. While ensuring the installation stability of the cooling member 310, the cooling member 310 and the process chamber 100 can be spaced apart by the first bracket 530. Compared with the solution in which the cooling member 310 is installed by other components, the first bracket 530 can make the cooling member 310 closer to the process chamber 100, thereby improving the compactness of the overall structure. Of course, in other embodiments, the first bracket 530 may not protrude at the first exhaust port 220. At this time, the cooling member 310 can be installed on the inner wall of the above-mentioned main chassis.

[0045] Optionally, the first bracket 530 may be provided with a heat-insulating member. Specifically, during the process, the heat-insulating member can prevent the heat of the process chamber 100 from spreading, that is, the heat-insulating member can maintain the temperature near the first exhaust port 220 of the process chamber 100 within the temperature range required by the process. Of course, in other embodiments, the first bracket 530 may not be provided with a heat-insulating member.

[0046] Optionally, in this embodiment, the material of the heat-insulating member may be a relatively hard material, such as gypsum, etc. At this time, the heat-insulating member can be directly attached to the inner wall of the diversion channel 531, and the heat-insulating member is not easily affected by the air flow. At the same time, this installation method is relatively simple and convenient. Of course, in other embodiments, the material of the heat-insulating member may also be a relatively soft material. At this time, the heat-insulating member can be embedded in the first bracket 530 to ensure the installation stability of the heat-insulating member.

[0047] Optionally, the semiconductor process equipment may further include a heat insulator 540 disposed on the first bracket 530. A control valve 550 is movably provided at the first inlet 311. The control valve 550 can move in a direction away from or close to the first bracket 530. When the control valve 550 is away from the first bracket 530, the diversion channel 531 is in communication with the first inlet 311. When the control valve 550 is close to the first bracket 530, the diversion channel 531 is disconnected from the first inlet 311. That is, the diversion channel 531 and the first inlet 311 are communicably connected in a switchable manner through the control valve 550. And when the diversion channel 531 is disconnected from the first inlet 311, the control valve 550 is in contact with the heat insulator 540.

[0048] In this embodiment, during the specific process, that is, when the control valve 550 blocks the first inlet 311 to disconnect the diversion channel 531 from the first inlet 311, at this time, since the control valve 550 is in contact with the heat insulator 540, this enables the heat insulator 540 to prevent the heat of the process chamber 100 from spreading to the control valve 550 and then to the cooling member 310. That is, the heat insulator 540 can play a role in heat preservation and insulation. At the same time, the heat insulator 540 can maintain the temperature at the position near the first exhaust port 220 of the process chamber 100 within the temperature range required by the process. Of course, in other embodiments, the semiconductor process equipment may not include the heat insulator 540.

[0049] Optionally, please refer to Figures 2 to 4 , the semiconductor process equipment may further include a housing 610 that wraps the thermal insulation layer 200, that is, the housing 610 is sleeved outside the thermal insulation layer 200 to protect the thermal insulation layer 200. Optionally, the housing 610 may be a metal housing 610. The semiconductor process equipment may further include a second bracket 560. The first bracket 530 and the second bracket 560 are spaced apart and disposed on the housing 610, specifically, detachably mounted on the housing 610. The second bracket 560 is used to support the cooling member 310. Optionally, the second bracket 560 is detachably connected to the cooling member 310. While the second bracket 560 spaces apart the cooling member 310 and the process chamber 100, it can further ensure the setting stability of the cooling member 310. Of course, in other embodiments, the semiconductor process equipment may not include the second bracket 560.

[0050] Optionally, a handle 730 is detachably provided on the second bracket 560. Through the handle 730, it is convenient to carry and install and maintain the second bracket 560 and the cooling member 310. Optionally, the water receiving tray 520 described above is detachably mounted on the second bracket 560 to ensure the setting stability of the water receiving tray 520.

[0051] Optionally, the first exhaust device 300 may include a cooling member 310 and a first exhaust pipe line that are connected in sequence. The cooling member 310 is connected to the first exhaust port 220 in a switchable manner. The cooling member 310 is the cooling member 310 described above, and the first exhaust pipe line is the first exhaust pipe line described above. The semiconductor process equipment may further include a water-cooling jacket 570, and the water-cooling jacket 570 may be sleeved outside the first exhaust pipe line to facilitate secondary cooling of the hot air in the first exhaust pipe line. That is, this setting method can avoid the temperature of the first exhaust pipe line from being too high, so as to protect the fan 320 and avoid heat damage to the components around the first exhaust pipe line. Of course, in other embodiments, the semiconductor process equipment may not include the water-cooling jacket 570.

[0052] In this application, when rapid cooling is required, the control valve 550, the first stop valve 420, and the second stop valve 710 may all be opened, and the fan 320 is turned on to drive air circulation. At this time, the cold air with heat can be discharged through the first exhaust port 220 and the second exhaust port 230, which can quickly take away the heat of the process chamber 100, so as to achieve the purpose of quickly cooling the process chamber 100; when low-speed or uniform-speed cooling is required, only the first stop valve 420 and the second stop valve 710 may be opened. At this time, the cold air with heat can be discharged only through the second exhaust port 230, which can achieve the purpose of low-speed or uniform-speed cooling of the process chamber 100. Thus, it can be seen that this application can selectively open the control valve 550, the first stop valve 420, and the second stop valve 710 according to actual needs.

[0053] In the above embodiments of this application, the differences between the embodiments are mainly described. As long as the different optimized features between the embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity of the text, they will not be elaborated here.

[0054] The above are only the embodiments of this application and are not intended to limit this application. For those skilled in the art, this application may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the scope of the claims of this application.

Claims

1. A semiconductor process equipment, characterized in that: It comprises a process chamber (100), a heat-insulating layer (200), a first exhaust device (300) and a second exhaust device (400); The thermal insulation layer (200) wraps the process chamber (100), and an airflow gap (110) is provided therebetween; an air intake channel (210), a first exhaust port (220), and a second exhaust port (230) are provided on the thermal insulation layer (200) at intervals; the first exhaust port (220) and the second exhaust port (230) are arranged at intervals along the axial direction of the process chamber (100); the air intake channel (210), the first exhaust port (220), and the second exhaust port (230) are all connected to the airflow gap (110); the first exhaust device (300) is connected to the first exhaust port (220) in an on-off manner; and the second exhaust device (400) is connected to the second exhaust port (230) in an on-off manner.

2. The semiconductor process equipment according to claim 1, characterized in that: The first exhaust device (300) comprises a cooling element (310), a first exhaust pipeline and a fan (320) which are connected in sequence, the cooling element (310) having a first inlet (311) and a second inlet (312) which are arranged at intervals, the first inlet (311) being connected to the first exhaust port (220) in an on-off manner, and the second exhaust device (400) comprising a second exhaust pipeline (410), one end of the second exhaust pipeline (410) being connected to the second exhaust port (230) in an on-off manner, and the other end of the second exhaust pipeline (410) being connected to the second inlet (312).

3. The semiconductor process equipment according to claim 1, characterized in that: The thermal insulation layer (200) comprises a first thermal insulation layer (240) and a second thermal insulation layer (250), wherein the first thermal insulation layer (240) wraps the process chamber (100), and the second thermal insulation layer (250) is sleeved outside the first thermal insulation layer (240); the first thermal insulation layer (240) is provided with the air inlet channel (210) and the first exhaust port (220) at intervals, and the second thermal insulation layer (250) is provided with the air inlet port (251) and the second exhaust port (230) at intervals, and an annular channel (260) is formed between the first thermal insulation layer (240) and the second thermal insulation layer (250); the air inlet port (251), the annular channel (260) and the air inlet channel (210) are connected in sequence, and the annular channel (260) is connected to the second exhaust port (230).

4. The semiconductor process equipment according to claim 1, characterized in that: The first exhaust device (300) comprises a cooling element (310), a first exhaust pipeline, a fan (320), a first wind box (330) and a second wind box (340); the cooling element (310) is connected to the first exhaust port (220) in an on-off manner; the first exhaust pipeline comprises a first main pipe (350), a second main pipe (360) and at least two branch pipes (370) arranged in parallel; the cooling element (310), the first main pipe (350), the first wind box (330), the at least two branch pipes (370), the second wind box (340), the second main pipe (360) and the fan (320) are connected in sequence; wherein an extension direction of the first main pipe (350) intersects an extension direction of the branch pipe (370), and a cross-sectional area of ​​the first main pipe (350) and a cross-sectional area of ​​the second main pipe (360) are both larger than a cross-sectional area of ​​the branch pipe (370).

5. The semiconductor process equipment according to claim 4, characterized in that: The first exhaust device (300) further comprises at least one third wind box (380), each of the branch pipes (370) comprising at least two sub-branch pipes which are separately arranged, and the at least two sub-branch pipes of each branch pipe (370) are connected via the third wind box (380) so that the at least two sub-branch pipes of each branch pipe (370) are interconnected.

6. The semiconductor process equipment according to claim 1, characterized in that: The first exhaust device (300) comprises a cooling member (310), the cooling member (310) being connected to the first exhaust port (220) in an on-off manner, and the semiconductor process equipment further comprises a water cooling pipe (510), the water cooling pipe (510) being arranged on the outer wall of the cooling member (310).

7. The semiconductor process equipment according to claim 6, characterized in that: The cooling element (310) is provided with a first inlet (311), and the first inlet (311) is connected to the first exhaust port (220) in an on-off manner. The cooling element (310) has a top surface (313), a side surface (314) close to the first inlet (311), and a front surface (315) and a back surface (316) arranged opposite to each other. The top surface (313), the side surface (314), the front surface (315) and the back surface (316) are connected, and the water cooling pipe (510) is attached to the top surface (313), the side surface (314), the front surface (315) and the back surface (316).

8. The semiconductor process equipment according to claim 6, characterized in that: A heat exchange tube (317) is provided in the cooling element (310), and a first water outlet (318) of the heat exchange tube (317) is connected to a water inlet (511) of the water cooling tube (510).

9. The semiconductor process equipment according to claim 6, characterized in that: The semiconductor process equipment further comprises a water receiving tray (520), and in the height direction of the semiconductor process equipment, the orthographic projection of the water inlet (511) of the water cooling tube (510), the orthographic projection of the second water outlet (512) and the orthographic projection of the cooling element (310) are all located within the orthographic projection of the water receiving tray (520).

10. The semiconductor process equipment according to claim 1, characterized in that: The first exhaust device (300) comprises a cooling member (310), the cooling member (310) is provided with a first inlet (311), a first bracket (530) is protruding from the first exhaust port (220), the first bracket (530) is provided with a guide channel (531), one end of the guide channel (531) is connected to the first exhaust port (220), the other end of the guide channel (531) is connected to the first inlet (311) in an on-off manner, and the first bracket (530) supports the cooling member (310).

11. The semiconductor process equipment according to claim 10, characterized in that: A heat-insulating component is provided on the first bracket (530).

12. The semiconductor process equipment according to claim 10, characterized in that: The semiconductor process equipment further comprises a heat insulating member (540), wherein the heat insulating member (540) is arranged on the first bracket (530), and a control valve (550) is movably arranged at the first inlet (311), and the control valve (550) can move in a direction away from or close to the first bracket (530). When the control valve (550) is away from the first bracket (530), the guide channel (531) is connected to the first inlet (311); when the control valve (550) is close to the first bracket (530), the guide channel (531) is disconnected from the first inlet (311), and the control valve (550) is in contact with the heat insulating member (540).

13. The semiconductor process equipment according to claim 10, characterized in that: The semiconductor process equipment further comprises a second bracket (560) and a shell (610), wherein the shell (610) is sleeved outside the thermal insulation layer (200), the first bracket (530) and the second bracket (560) are spaced apart from each other in the shell (610), and the second bracket (560) is used to support the cooling element (310).

14. The semiconductor process equipment according to claim 1, characterized in that: The first exhaust device (300) comprises a cooling element (310) and a first exhaust pipeline which are connected in sequence, the cooling element (310) being connected to the first exhaust port (220) in an on-off manner, and the semiconductor process equipment further comprises a water cooling jacket (570), the water cooling jacket (570) being sleeved outside the first exhaust pipeline.

15. The semiconductor process equipment according to claim 1, characterized in that: The second exhaust port (230) is far away from the first exhaust port (220).

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