Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Abstract

Provided are a semiconductor manufacturing apparatus and a semiconductor device manufacturing method capable of more appropriately connecting a semiconductor chip to an object. The semiconductor manufacturing apparatus is used for connecting a semiconductor chip to an object, and includes a fixing member and a holding member. The fastener is formed of an elastic material and is in contact with the semiconductor chip. The holder holds the fixing member. A recess into which the fixing member is inserted is formed on the surface of the holder. In the center of the bottom surface of the recessed portion, a protruding portion is formed which protrudes from the bottom surface of the recessed portion by a maximum amount than other portions of the bottom surface of the recessed portion.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device. Background Art

[0002] There is known a semiconductor manufacturing apparatus for connecting a semiconductor chip to a substrate. Summary of the Invention

[0003] According to the disclosed embodiments, there is provided a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device that can more appropriately connect a semiconductor chip to an object.

[0004] The semiconductor manufacturing apparatus according to the embodiment is a semiconductor manufacturing apparatus for connecting a semiconductor chip to an object, and includes a collet and a holder. The collet is formed of an elastic material and contacts the semiconductor chip. The holder holds the collet. A recess for inserting the collet is formed on the surface of the holder. A protruding portion having the largest protruding amount from the bottom surface of the recess is formed at the center of the bottom surface of the recess compared to other portions of the bottom surface of the recess.

[0005] The method of manufacturing a semiconductor device according to the embodiment is a method of manufacturing a semiconductor device for connecting a semiconductor chip to an object, and connects the semiconductor chip in contact with the collet to the object using the above semiconductor manufacturing apparatus. Brief Description of the Drawings

[0006] Figure 1 is a front view showing a front structure of the semiconductor manufacturing apparatus according to the first embodiment.

[0007] Figure 2 is a perspective view showing a three-dimensional structure of the semiconductor manufacturing apparatus according to the first embodiment.

[0008] Figure 3 is a perspective view showing a three-dimensional structure of the holder according to the first embodiment.

[0009] Figure 4 is a plan view showing a planar structure of the holder according to the first embodiment.

[0010] Figure 5 is a sectional view showing a sectional structure along the V-V line of Figure 4

[0011] Figure 6 is a sectional view showing a sectional structure along the VI-VI line of Figure 2

[0012] Figure 7(A) and (B) in the figure are a front view and a cross-sectional view respectively showing an operation example of the semiconductor manufacturing apparatus according to the first embodiment.

[0013] Figure 8 (A) and (B) in the figure are cross-sectional views showing operation examples of the semiconductor manufacturing apparatus according to the first embodiment.

[0014] Figure 9 (A) and (B) in the figure are cross-sectional views showing operation examples of the semiconductor manufacturing apparatus according to the first embodiment.

[0015] Figure 10 (A) to (D) in the figure are diagrams schematically showing the transition of the pressure applied to the semiconductor chip according to the first embodiment.

[0016] Figure 11 It is a cross-sectional view showing the cross-sectional structure of the semiconductor manufacturing apparatus according to the first embodiment.

[0017] Figure 12 (A) to (D) in the figure are diagrams schematically showing the transition of the pressure applied to the semiconductor chip according to the first embodiment.

[0018] Figure 13 It is a plan view showing the planar structure of the holder according to the comparative example.

[0019] Figure 14 (A) to (D) in the figure are diagrams schematically showing the transition of the pressure applied to the semiconductor chip according to the comparative example.

[0020] Figure 15 It is a front view showing the front structures of the fixing member and the semiconductor chip C respectively according to the comparative example.

[0021] Figure 16 It is a perspective view showing the three-dimensional structure of the semiconductor manufacturing apparatus according to the modified example of the first embodiment.

[0022] Figure 17 It is a perspective view showing the three-dimensional structure of the holder according to the second embodiment.

[0023] Figure 18 It is a plan view showing the planar structure of the holder according to the second embodiment.

[0024] Figure 19 It is a perspective view showing the three-dimensional structure of the semiconductor manufacturing apparatus according to the second embodiment.

[0025] Figure 20 It shows along Figure 19 the cross-sectional structure of the XX-XX line.

[0026] Figure 21In FIGS. (A) and (B), cross-sectional views showing operation examples of the semiconductor manufacturing apparatus according to the second embodiment are respectively shown.

[0027] Figure 22 In FIGS. (A) and (B), front views showing the front structure of the fixing member according to other embodiments are shown.

[0028] Figure 23 The bottom view showing the bottom structure of the fixing member according to other embodiments is shown.

[0029] Figure 24 The front view showing the front structure of the fixing member according to other embodiments is shown.

[0030] Explanation of Reference Numerals

[0031] C: semiconductor chip, M: substrate (object), 10: semiconductor manufacturing apparatus, 20: holding member, 22: recess, 23, 82: protrusion, 24a to 24d: corner, 26a, 26b, 83a, 83b, 84a, 84b: ventilation hole, 30: fixing member, 33a, 33b, 90a to 90d, 91a to 91d: through hole, 83, 84: step portion, 80, 81: groove portion, 271 to 274: side wall portion. Detailed Embodiments

[0032] Hereinafter, embodiments will be described with reference to the drawings.

[0033] For ease of understanding the description, the same reference numerals are given to the same constituent elements in the respective drawings as much as possible, and redundant descriptions are omitted.

[0034] 1 First Embodiment

[0035] The semiconductor manufacturing apparatus and the method of manufacturing a semiconductor device according to the first embodiment will be described.

[0036] 1.1 Outline of Semiconductor Manufacturing Apparatus

[0037] Figure 1 The front view showing the front structure of the semiconductor manufacturing apparatus 10 according to the present embodiment is shown. The semiconductor manufacturing apparatus 10 according to the present embodiment is a device for connecting a semiconductor chip C to a substrate M. The semiconductor chip C is a bare chip without a package. The semiconductor manufacturing apparatus 10 is a so-called flip-chip bonding device that picks up a semiconductor chip C formed on a predetermined wafer, flips the semiconductor chip C, and connects it to the substrate M.

[0038] In addition, the semiconductor manufacturing apparatus 10 may also be an apparatus that connects semiconductor chips C to a predetermined wafer instead of the substrate M. The substrate M and the wafer are an organic substrate having wirings formed on the upper surface, or semiconductor elements of the semiconductor chips C. In the present embodiment, the substrate M and the wafer are examples of objects to which the semiconductor chips C are connected.

[0039] 1.2 Configuration of Semiconductor Manufacturing Apparatus

[0040] Next, the configuration of the semiconductor manufacturing apparatus 10 will be specifically described.

[0041] Figure 2 is a perspective view showing the three-dimensional structure of the semiconductor manufacturing apparatus 10. As Figure 2 shown, the semiconductor manufacturing apparatus 10 includes a holding member 20 and a fixing member 30.

[0042] Figure 3 is a perspective view showing the three-dimensional structure of the holding member 20. Figure 4 is a plan view showing the planar structure of the holding member 20. As Figure 3 and Figure 4 shown, the holding member 20 is formed in a thin rectangular parallelepiped shape. At the central portion of the surface 21 of the holding member 20, a rectangular parallelepiped-shaped recess 22 into which the fixing member 30 is inserted is formed. Interference prevention (relief groove) processing is performed on the corner portions 22a to 22d of the recess 22. Hereinafter, the thickness direction of the holding member 20 is referred to as the "Z direction". In addition, the short side direction of the recess 22 is referred to as the "X direction", and the long side direction of the recess 22 is referred to as the "Y direction".

[0043] On the bottom surface 220 of the recess 22, a protrusion 23 and stepped portions 24 and 25 are formed. The protrusion 23 is formed at substantially the center of the bottom surface 220 of the recess 22. The protrusion 23 is formed in a substantially rectangular parallelepiped shape having a short side in the X direction and a long side in the Y direction. The stepped portion 24 is formed around the protrusion 23, is larger than the protrusion 23 in the X direction and the Y direction, and has a shape similar to that of the protrusion 23. The stepped portion 25 is formed around the stepped portion 24, is larger than the stepped portion 24 in the X direction and the Y direction, and has a shape similar to that of the stepped portion 24. Figure 4 The chain double-dashed line L20 shown represents the outer edge of the semiconductor chip C. As Figure 4 shown, the stepped portion 25 has an outer edge slightly smaller than the outer edge of the semiconductor chip C.

[0044] Figure 5 is a cross-sectional view showing the cross-sectional structure along the Figure 4 V-V line. As Figure 5As shown, the protruding amount of the protruding portion 23 starting from the bottom surface 220 of the recess 22 is set as "H10", the protruding amount of the stepped portion 24 is set as "H11", and the protruding amount of the stepped portion 25 is set as "H12". At this time, among the above-mentioned protruding amounts H10 to H12, the relationship of "H10 > H11 > H12" holds. That is, the protruding amounts of the protruding portion, the stepped portion 24, and the stepped portion 25 gradually decrease.

[0045] Figure 3 and Figure 4 The reference numerals 221 to 224 shown respectively represent the side surfaces of the recess 22. In Figure 5 , the height of the side surface 222 starting from the bottom surface 220 of the recess 22 is represented by "H20". The other side surfaces 221, 223, and 224 also have the same height H20. Between the protruding amount H10 of the protruding portion 23 and the height H20 of the side surfaces 221 to 224 of the recess 22, the relationship of "H10 < H20" holds. That is, the protruding portion 23 is formed to be lower than the height of the side surfaces 221 to 224 of the recess 22.

[0046] As Figure 3 and Figure 4 shown, a plurality of vent holes 26a and 26b are formed in the stepped portion 24 and open at its top surface 240. The vent holes 26a and 26b are arranged to be arranged in the Y direction with the protruding portion 23 interposed therebetween. As Figure 5 shown, the vent hole 26a is formed to extend from the stepped portion 24 toward the inside of the holding member 20. The same applies to the vent hole 26b.

[0047] As Figure 3 and Figure 4 shown, on the surface 21 of the holding member 20, side wall portions 271 to 274 are formed along the respective side surfaces 221 to 224 of the recess 22. The side wall portion 271 is coplanar with the side surface 221 of the recess 22 and is formed to protrude from the surface 21 of the holding member 20. The other side wall portions 272 to 274 are also formed in the same manner.

[0048] As Figure 2 shown, the fixing member 30 is formed in a shape corresponding to the recess 22 of the holding member 20, that is, it is formed in a thin rectangular parallelepiped shape having a short side in the X direction and a long side in the Y direction. The fixing member 30 is formed of a rubber elastic body mainly composed of natural rubber or synthetic rubber having a Shore A hardness of 50 or more and 100 or less. In addition, the Shore A hardness is based on ISO 868.

[0049] Figure 6 is a cross-sectional view showing the cross-sectional structure along the VI-VI line of Figure 2 , specifically, it is a cross-sectional view showing the cross-sectional structure including the vent hole 26a of the holding member 20. As Figure 6As shown, a protrusion 32 is formed on the surface 31 of the fixing member 30. As Figure 2 shown, the protrusion 32 is formed in a substantially rectangular parallelepiped shape having a short side in the X direction and a long side in the Y direction. The protrusion 32 has substantially the same size as the semiconductor chip C in the X and Y directions. A plurality of through holes 33a and 33b that open at the top surface 320 thereof are formed in the protrusion 32. As Figure 6 shown, the through hole 33a is formed to penetrate from the top surface 320 of the protrusion 32 through the inside of the fixing member 30 to the back surface 34 of the fixing member 30 on the side opposite to the top surface 320. The through hole 33a is disposed at a position facing the vent hole 26a of the holding member 20 in the Z direction. The through hole 33b is also formed to pass through the inside of the fixing member 30 and is disposed at a position facing the vent hole 26b of the holding member 20 in the Z direction. In addition, Figure 2 the reference numerals 35 to 38 shown respectively denote the side surfaces of the fixing member 30.

[0050] As Figure 6 shown, the fixing member 30 is inserted into the recess 22 of the holding member 20. The back surface 34 of the fixing member 30 contacts the top surface 230 of the protrusion 23 of the holding member 20. The side surface 35 of the fixing member 30 contacts the side surface 221 of the recess 22 and the inner surface of the side wall portion 271. Similarly, the side surface 37 of the fixing member 30 contacts the side surface 223 of the recess 22 and the inner surface of the side wall portion 273. In addition, the side surface 36 of the fixing member 30 contacts the side surface 222 of the recess 22 and the inner surface of the side wall portion 272, and the side surface 38 of the fixing member 30 contacts the side surface 224 of the recess 22 and the side wall portion 274. By the frictional force acting on their contact portions, the fixing member 30 is held by the holding member 20. By being surrounded by Figure 6 shown, the back surface 34 of the fixing member 30 and the recess 22 of the holding member 20, a space S is formed. Hereinafter, this space S will be referred to as the "internal space S".

[0051] 1.3 Operation Example of Semiconductor Manufacturing Apparatus

[0052] Next, an operation example of the semiconductor manufacturing apparatus 10 of the present embodiment will be described.

[0053] The semiconductor manufacturing apparatus 10 further includes a flip-chip member 40 as shown in Figure 7 (A) below. As shown in Figure 7 (A) below, the flip-chip member 40 picks up the semiconductor chip C formed on a predetermined wafer. After that, as shown in Figure 7 (B) below, after turning the flip-chip member 40 upside down, the semiconductor chip C is brought into contact with the top surface 320 of the protrusion 32 of the fixing member 30. In addition, Figure 7 (B) below shows along Figure 2The cross-sectional structure of line VII-VII shown, specifically, a cross-sectional view showing the cross-sectional structure including the protrusion 23. Subsequently, the air in the internal space S is evacuated via the vent holes 26a and 26b of the holding member 20 by the vacuum pump 50, making the internal space S negative pressure. Thereby, the fixing member 30 is held in a state of contacting the top surface 230 of the protrusion 23 of the holding member 20. In addition, by evacuating the air in the internal space S using the vacuum pump 50, the air in the through holes 33a and 33b of the fixing member 30 is also evacuated, so the through holes 33a and 33b of the fixing member 30 also become negative pressure. Thereby, a force is generated to adsorb the semiconductor chip C in contact with the surface 31 of the fixing member 30 to the fixing member 30. By such an adsorption force, the semiconductor chip C is held in a state of being adsorbed to the fixing member 30. The fixing member 30 has a hardness that is difficult to deform when the internal space S is negative pressure.

[0054] Thereafter, the flip-chip member 40 moves away from the semiconductor chip C, and then, while maintaining the state of holding the semiconductor chip C on the fixing member 30, the semiconductor chip C is moved above the substrate M as shown in Figure 8 (A). At this time, by using the camera 60 to identify the position of a predetermined mark provided on the semiconductor chip C, the semiconductor chip C is positioned such that "the position on the substrate M where the semiconductor chip C should be connected" and "the position of the semiconductor chip C held on the fixing member 30" are aligned in the vertical direction.

[0055] After the positioning of the semiconductor chip C is completed, while maintaining the state of holding the semiconductor chip C on the fixing member 30, the holding member 20 is displaced toward the substrate M, and after the semiconductor chip C contacts the substrate M as shown in Figure 8 (B), the holding member 20 is pressed against the substrate M with a predetermined external force F. Thereby, as shown in Figure 9 (A) and (B), the fixing member 30 gradually elastically deforms, so that the bottom surfaces 220 of the protrusion 23, the step portion 24, the step portion 25, and the recess 22 sequentially contact the back surface 34 of the fixing member 30. Therefore, the pressure applied to the fixing member 30 from the holding member 20 gradually changes.

[0056] Specifically, as shown in Figure 8 (B), in a state where only the protrusion 23 of the holding member 20 contacts the back surface 34 of the fixing member 30, pressure is applied to the fixing member 30 from the holding member 20 only via the protrusion 23. Therefore, it is easy to apply pressure to the vicinity of the central portion of the semiconductor chip C as shown in Figure 8 (B) and as shown in Figure 10 (A). In addition, in Figure 10In (A) to (D) thereof, dot shading is added to the portion of the semiconductor chip C where pressure is applied from the fixing member 30. Additionally, regarding the dot shading, the higher the dot density, the greater the applied pressure.

[0057] Subsequently, when, as shown in (A) of Figure 9 further, the stepped portion 24 of the holding member 20 is in contact with the back surface 34 of the fixing member 30, pressure is applied to the fixing member 30 from the holding member 20 via the protruding portion 23 and the stepped portion 24. Therefore, it easily becomes a state as shown in (A) of Figure 9 wherein, as shown in (B) of Figure 10 pressure is applied not only to the vicinity of the central portion of the semiconductor chip C but also to the peripheral portion thereof.

[0058] Subsequently, when, as shown in (B) of Figure 9 further, the stepped portion 25 of the holding member 20 is in contact with the back surface 34 of the fixing member 30, pressure is applied to the fixing member 30 from the holding member 20 via the protruding portion 23 and the stepped portions 24 and 25. Therefore, it easily becomes a state as shown in (B) of Figure 9 wherein, as shown in (C) of Figure 10 pressure is further applied to substantially the entire area of the semiconductor chip C. Thereafter, as shown in (D) of Figure 10 appropriate pressure is applied to the entire area of the semiconductor chip C.

[0059] 1.4 Function and Effect of the Semiconductor Manufacturing Apparatus of the First Embodiment

[0060] As described above, the semiconductor manufacturing apparatus 10 of the present embodiment includes a holding member 20 and a fixing member 30. The fixing member 30 is formed of an elastic material and is in contact with the semiconductor chip C. The holding member 20 holds the fixing member 30. On the surface 21 of the holding member 20, a recess 22 for inserting the fixing member 30 is formed. At the central portion of the bottom surface 220 of the recess 22, a protruding portion 23 having the largest protruding amount from the bottom surface 220 of the recess 22 compared to the other portions of the bottom surface 220 of the recess 22 is formed. Around the protruding portion 23, stepped portions 24 and 25 having a protruding amount smaller than that of the protruding portion 23 from the bottom surface 220 of the recess 22 are formed. The plurality of stepped portions 24 and 25 are formed such that the protruding amount gradually decreases stepwise as it goes outward from the protruding portion 23.

[0061] According to this configuration, when the holding member 20 is pressed against the substrate M, the protruding portion 23, the stepped portion 24, and the stepped portion 25 of the holding member 20 come into contact with the fixing member 30 in sequence. Thereby, it is possible to, as Figure 10As shown in (A) to (D), pressure is gradually applied from the central portion of the semiconductor chip C toward the outside. Thereby, it is difficult to form voids between the substrate M and the semiconductor chip C, and thus the semiconductor chip can be more appropriately connected to the substrate M.

[0062] In the holding member 20, vent holes 26a and 26b that open to the bottom surface 220 of the recess 22 are formed only in the stepped portion 24. In the fixing member 30, through holes 33a and 33b that penetrate from the surface 31 in contact with the semiconductor chip C to the back surface 34 facing the bottom surface 220 of the recess 22 of the holding member 20 are formed. By evacuating through the vent holes 26a and 26b of the holding member 20 and the through holes 33a and 33b of the fixing member 30, the state where the semiconductor chip C is in contact with the fixing member 30 can be maintained.

[0063] In the semiconductor manufacturing apparatus 10 of the present embodiment, when the semiconductor chip C is adsorbed to the fixing member 30, it is possible that, as Figure 11 shown, a portion 71 of the semiconductor chip C corresponding to the through hole 33a of the fixing member 30 is sucked into the through holes 33a and 33b of the fixing member 30 and is slightly deformed in a concave shape. Similar slight deformation of the semiconductor chip C may also occur in a portion facing the through hole 33b of the fixing member 30. In the case where such slight deformation of the semiconductor chip C occurs, when the semiconductor chip C comes into contact with the substrate M, for example, as Figure 12 (A) of the figure shows, bubbles B11 and B12 may be formed between the semiconductor chip C and the substrate M. Regarding this point, since in the semiconductor manufacturing apparatus 10 of the present embodiment, pressure is gradually applied from the central portion of the semiconductor chip C toward the outside, even if bubbles B11 and B12 are formed between the semiconductor chip C and the substrate M, the bubbles B11 and B12 can be squeezed as Figure 12 (B) to (D) of the figure shows, and made to flow toward the outside and eliminated. Therefore, it is difficult for bubbles B11 and B12 to remain between the semiconductor chip C and the substrate M.

[0064] In addition, in the case where vent holes 26c are formed in the protruding portion 23 as Figure 13 shown and through holes are formed in the fixing member 30 corresponding to the vent holes 26c, when the semiconductor chip C is adsorbed to the fixing member 30, the central portion of the semiconductor chip C may be slightly deformed in a concave shape. In this case, as Figure 14 (A) of the figure shows, a bubble B10 may also be formed between the central portion 70 of the semiconductor chip C and the substrate M. In the case where such a bubble B10 is formed, as Figure 14As shown in (B) to (D), even if pressure is gradually applied from the central portion 70 of the semiconductor chip C toward the outside, the bubbles B10 are not squeezed and flow outward, so they remain.

[0065] Regarding this point, in the semiconductor manufacturing apparatus 10 of the present embodiment, as Figure 3 and Figure 4 shown, no vent holes are formed in the protruding portion 23, so it is difficult to form Figure 14 the bubbles B10 as shown in (C). Therefore, a situation where such bubbles B10 remain can be avoided.

[0066] The fixing member 30 has a hardness of Shore A hardness Ha of 50 or more and Shore A hardness Ha of 100 or less.

[0067] When the internal space S is made negative pressure by the vacuum pump 50 in the case where the hardness of the fixing member 30 is low, for example, the fixing member 30 may bend as Figure 15 shown. When the semiconductor chip C is adsorbed to the fixing member 30 in such a case where the fixing member 30 has bent, the semiconductor chip C may bend along the shape of the fixing member 30. When detecting the position of the semiconductor chip C using the camera 60 in such a case where the semiconductor chip C has bent, it may not be possible to detect the position of the semiconductor chip C with high precision.

[0068] Regarding this point, the fixing member 30 of the present embodiment can maintain its original shape as Figure 8 shown in (A) even if the internal space S becomes negative pressure by having the above-described hardness. Therefore, when the semiconductor chip C is adsorbed to the fixing member 30, the semiconductor chip C is less likely to bend, so the position of the semiconductor chip C can be detected more precisely by the camera 60. As a result, the semiconductor chip C can be connected to the substrate M with higher precision.

[0069] In addition, by the fixing member 30 having the above-described hardness, when the holding member 20 is pressed against the substrate M with a predetermined external force F, the fixing member 30 elastically deforms as Figure 9 shown in (A) and (B). Therefore, pressure can be gradually applied from the central portion of the semiconductor chip C toward the outside as Figure 10 shown in (A) to (C).

[0070] Side wall portions 271 to 274 that are coplanar with the side surfaces 221 to 224 of the concave portion 22 and protrude from the surface 21 of the holding member 20 are formed on the holding member 20.

[0071] According to this configuration, the side surfaces 35 to 38 of the fixing member 30 are in contact with the side wall portions 271 to 274 of the holding member 20, respectively, so that it is easy to hold the fixing member 30 by the holding member 20.

[0072] 1.5 Modification of the semiconductor manufacturing apparatus according to the first embodiment

[0073] Next, a modification of the semiconductor manufacturing apparatus according to the first embodiment will be described.

[0074] Figure 16 is a perspective view showing a three-dimensional structure of the holding member 20 of this modification. As Figure 16 shown, a protruding portion 23 and a stepped portion 24 are formed in the concave portion 22 of the holding member 20 in this modification. The corner portions 24a to 24d of the stepped portion 24 are respectively deformed so as to extend toward the corner portions 22a to 22d of the concave portion 22 of the holding member 20.

[0075] According to this configuration, when the holding member 20 is pressed against the substrate M with a predetermined external force F and the stepped portion 24 comes into contact with the back surface 34 of the fixing member 30, it is easy to apply pressure to the vicinity of the corner portions 30a to 30d of the fixing member 30 from the corner portions 24a to 24d of the stepped portion 24. Thereby, it is easy to apply pressure to the fixing member 30 more uniformly from the holding member 20, and thus, the semiconductor chip C can be more appropriately connected to the substrate M.

[0076] 2 Second embodiment

[0077] Next, the semiconductor manufacturing apparatus 10 according to the second embodiment will be described. Hereinafter, the description will focus on the differences from the semiconductor manufacturing apparatus 10 of the first embodiment.

[0078] 2.1 Configuration of the semiconductor manufacturing apparatus

[0079] Figure 17 is a perspective view showing a three-dimensional structure of the holding member 20 of this embodiment. Figure 18 is a plan view showing a planar structure of the holding member 20 of this embodiment. As Figure 17 and Figure 18 shown, two groove portions 80, 81 and a protruding portion 82 are formed on the bottom surface 220 of the concave portion 22 of the holding member 20. The two groove portions 80, 81 are formed in a long hole shape so as to extend in the Y direction, and are arranged in the X direction. Vent holes 83a, 83b are respectively formed at both end portions of the groove portion 80. Vent holes 84a, 84b are also respectively formed at both end portions of the groove portion 81. The protruding portion 82 is formed between the two groove portions 80, 81. The protruding portion 82 is formed to protrude from the bottom surface 220 of the concave portion 22, and is formed to extend in an elongated shape along the groove portions 80, 81. In this embodiment, the groove portions 80, 81 are an example of two adjacent predetermined groove portions.

[0080] Figure 19 is a perspective view showing the three-dimensional structure of the semiconductor manufacturing apparatus 10 of the present embodiment. As Figure 19 shown, the fixing member 30 is inserted into the recess 22 of the holding member 20. The fixing member 30 is formed in a rectangular parallelepiped shape. A plurality of through holes 90a to 90d, 91a to 91d are formed in the fixing member 30. The through holes 90a to 90d are arranged at a predetermined interval in the Y direction. The through holes 91a to 91d are also arranged at a predetermined interval in the Y direction.

[0081] Figure 20 is a cross-sectional view showing the cross-sectional structure along the Figure 19 XVII-XVII line. As Figure 20 shown, the plurality of through holes 90a to 90d, 91a to 91d are formed to penetrate from the surface 31 to the back surface 34 of the fixing member 30. The through holes 90a to 90d are arranged at positions facing the groove portion 80 of the holding member 20. The through holes 91a to 91d are arranged at positions facing the groove portion 81 of the holding member 20.

[0082] 2.2 Operation Example of Semiconductor Manufacturing Apparatus

[0083] Next, an operation example of the semiconductor manufacturing apparatus 10 of the present embodiment will be described.

[0084] In the semiconductor manufacturing apparatus 10 of the present embodiment, as Figure 20 shown, the air in the internal space S is exhausted by the vacuum pump 50 through the vent holes 83a, 83b, 84a, 84b of the holding member 20, so that the internal space S becomes a negative pressure. Thus, the fixing member 30 is held in a state of being adsorbed to the holding member 20. In addition, by exhausting the air in the internal space S by the vacuum pump 50, the inside of the through holes 90a to 90d, 91a to 91d of the fixing member 30 also becomes a negative pressure. Thus, the semiconductor chip C is held in a state of being adsorbed to the fixing member 30.

[0085] Subsequently, while maintaining the state in which the semiconductor chip C is held by the fixing member 30, the semiconductor chip C is brought into contact with the substrate M, and then the holding member 20 is pressed against the substrate M with a predetermined external force F. At this time, as Figure 21 shown in (A) and (B), the fixing member 30 is gradually deformed, and thus the protruding portion 82 and the bottom surface 220 of the recess 22 come into contact with the back surface 34 of the fixing member 30 in sequence. Therefore, the pressure applied from the holding member 20 to the fixing member 30 can be gradually changed.

[0086] Specifically, in as Figure 21While maintaining only the state where the protrusion 82 of the holding member 20 is in contact with the back surface 34 of the fixing member 30 as shown in (A) of [], pressure is applied to the fixing member 30 from the holding member 20 only via the protrusion 82. Therefore, it is easy to apply pressure to the vicinity of the central portion of the semiconductor chip C in the state shown in Figure 21 (B) of [].

[0087] Subsequently, when the bottom surface 220 of the concave portion 22 comes into contact with the back surface 34 of the fixing member 30 as shown in (B) of Figure 21 (B) of [], pressure is applied to the fixing member 30 from the holding member 20 via the protrusion 82 and the bottom surface 220 of the concave portion 22. Therefore, in the state shown in Figure 21 (B) of [], it is easy to apply pressure not only to the vicinity of the central portion of the semiconductor chip C but also to the peripheral portion thereof.

[0088] 2.3 Actions and Effects of the Semiconductor Manufacturing Apparatus of the Second Embodiment

[0089] As described above, in the fixing member 30 of the present embodiment, through holes 90a to 90d and 91a to 91d are formed that penetrate from the surface 31 in contact with the semiconductor chip C to the back surface 34 facing the plurality of groove portions 80 and 81. By evacuating through the vent holes 83a, 83b, 84a, 84b of the holding member 20 and the through holes 90a to 90d, 91a to 91d of the fixing member 30, the semiconductor chip C can be held in a state where it is in contact with the fixing member 30. The protrusion 82 is formed to extend in an elongated shape along two adjacent groove portions 80 and 81.

[0090] According to this configuration, as in the first embodiment, pressure can be gradually applied from the central portion of the semiconductor chip C toward the outside. As a result, it is difficult to form bubbles between the substrate M and the semiconductor chip C, and thus the semiconductor chip can be more appropriately connected to the substrate M.

[0091] 3 Other Embodiments

[0092] The present disclosure is not limited to the above specific examples.

[0093] For example, the fixing member 30 may also be formed of two or more materials having different hardnesses. For example, as in Figure 22As shown in (A) of , in the fixing member 30 of the first embodiment, the protruding portion 32 that contacts the semiconductor chip C is formed of the first material M11. In addition, the portion of the fixing member 30 of the first embodiment other than the protruding portion 32, that is, the portion 130 facing the bottom surface 220 of the concave portion 22 of the holding member 20, may be formed of the second material M12. As the first material M11 and the second material M12, a rubber elastomer mainly composed of natural rubber or synthetic rubber is used. However, in order for the portion 130 of the fixing member 30 to elastically deform when contacting the protruding portion 23 and the stepped portions 24 and 25 of the holding member 20, the second material M12 is preferably a rubber elastomer having a lower hardness than the first material M11. In addition, Figure 22 In (A) of , the double-dashed line L11 indicates the boundary between the first material M11 and the second material M12.

[0094] For example, it may also be as Figure 22 shown in (B) of . In the fixing member 30 of the second embodiment, the portion 131 that contacts the semiconductor chip C is also formed of the first material M11. In addition, Figure 22 In (B) of , the double-dashed line L12 indicates the boundary between the first material M11 and the second material M12.

[0095] Figure 23 is a bottom view showing the bottom surface structure of the protruding portion 32 of the fixing member 30 of the first embodiment. Figure 24 is a front view showing the front surface structure of the protruding portion 32 of the fixing member 30 of the first embodiment. It may also be as Figure 23 and Figure 24 shown. In the portion that contacts the semiconductor chip C, that is, the protruding portion 32, the central portion 133 and the outer peripheral portion 134 provided on the outer periphery of the center 133 are formed of different materials. Specifically, the outer peripheral portion 133 of the protruding portion 32 is formed of the first material M11. In addition, the outer peripheral portion 134 of the protruding portion 32 is formed of the second material M12. In Figure 23 and Figure 24 , the double-dashed line L13 indicates the boundary between the first material M11 and the second material M12. In addition, since the semiconductor chip C may bend along the shape of the fixing member 30 as Figure 15 shown when the semiconductor chip C is adsorbed to the fixing member 30, the first material M11 preferably has a hardness of Shore A hardness Ha50 or more.

[0096] It is also possible not to provide the stepped portions 24 and 25 in the holding member 20 of the first embodiment. In addition, it is also possible to provide one stepped portion or three or more stepped portions in the holding member 20 of the first embodiment.

[0097] In the holding member 20 of the second embodiment, it is not limited to providing two groove portions 80 and 81, and three or more groove portions may be provided.

[0098] Some embodiments of the present invention have been described, but these embodiments are only presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their variations are included in the scope and gist of the invention, and are included in the invention described in the claims and the scope equivalent thereto.

Claims

1. A semiconductor manufacturing device for connecting a semiconductor chip to an object. The semiconductor manufacturing device comprises: a fixture formed of an elastic material and in contact with the semiconductor chip; and a holding member that holds the fixture. A recessed portion for inserting the fixing member is formed on the surface of the retaining member. A protrusion is formed at a central portion of the bottom surface of the recessed portion, the protrusion amount of which is the largest from the bottom surface of the recessed portion compared with other portions of the bottom surface of the recessed portion.

2. The semiconductor manufacturing apparatus according to claim 1, A step portion whose protrusion amount from the bottom surface of the recessed portion is smaller than that of the protrusion portion is formed around the protrusion portion.

3. The semiconductor manufacturing apparatus according to claim 2, A plurality of step portions are formed around the protruding portion. The plurality of step portions are formed so that the amount of protrusion from the bottom surface of the recessed portion decreases stepwise as the protrusion moves toward the outside from the protruding portion.

4. The semiconductor manufacturing apparatus according to claim 2, In the retainer, a vent hole opening on the bottom surface of the recessed portion is formed only in the step portion. The fixing member has a through hole formed therein, which passes through from a surface in contact with the semiconductor chip to a back surface facing a bottom surface of the recessed portion of the holding member. By performing vacuum drawing through the vent hole of the holding member and the through hole of the fixing member, the semiconductor chip can be held in a state where the semiconductor chip is in contact with the fixing member.

5. The semiconductor manufacturing apparatus according to claim 2, The fixing member is formed into a rectangular parallelepiped shape, The recessed portion of the retaining member is formed into a rectangular parallelepiped shape corresponding to the fixing member, The step portion is formed in a rectangular parallelepiped shape.

6. The semiconductor manufacturing apparatus according to claim 5, A corner portion of the step portion is deformed to extend toward a corner portion of the recessed portion of the holder.

7. The semiconductor manufacturing apparatus according to claim 1, A plurality of slots in the shape of long holes are formed on the bottom surface of the recessed portion. The retainer is provided with ventilation holes opened at the bottom surfaces of the plurality of grooves. The fixing member has a through hole formed therein, which passes through from a surface in contact with the semiconductor chip to a back surface facing the plurality of grooves. By performing vacuum drawing through the vent hole of the holding member and the through hole of the fixing member, the semiconductor chip can be held in a state where the semiconductor chip is in contact with the fixing member.

8. The semiconductor manufacturing apparatus according to claim 7, The protrusion is formed between two adjacent predetermined groove portions among the plurality of groove portions, and is formed to extend in an elongated shape along the two predetermined groove portions.

9. The semiconductor manufacturing apparatus according to claim 1, The fixing member has a Shore A hardness of Ha50 or more and a Shore A hardness of Ha100 or less.

10. The semiconductor manufacturing apparatus according to claim 1, The fixing member is formed of two or more materials having different hardnesses.

11. The semiconductor manufacturing apparatus according to claim 10, The two or more materials include a first material and a second material having a lower hardness than the first material. The portion of the fixing member in contact with the semiconductor chip is formed of the first material. A portion of the fixing member that faces a bottom surface of the recessed portion of the retaining member is formed of the second material.

12. The semiconductor manufacturing apparatus according to claim 1, The holder has a side wall portion formed therein that is flush with the side surface of the recess and protrudes from the surface of the holder.

13. A method for manufacturing a semiconductor device, for connecting a semiconductor chip to an object, In the method for manufacturing the semiconductor device, the semiconductor manufacturing apparatus according to any one of claims 1 to 11 is used to connect the semiconductor chip in contact with the fixture to the object.

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