V-CUT processing technology for circuit board

Abstract

The invention discloses a circuit board V-CUT processing technology, which belongs to the technical field of printed circuit boards, and comprises the following steps: after a printed circuit board is fixedly arranged on a V cutting machine, firstly measuring the distance D between the edge of a side plate of a positioning hole and a test knife line, and then subtracting the distance d0 between the center of the positioning hole and the upper edge of the printed circuit board from the distance D; therefore, the distance d between the center of the positioning hole and the test knife line is indirectly obtained. Respectively reading an upper reference distance d1, a processing reference distance d2 and a lower reference distance d3; calculating d4 = d1 + d2 + d3, and judging whether the value of d4 is equal to the value of the actually measured distance d of the test knife line or not or whether the difference value is within a preset threshold range or not; error compensation is correspondingly carried out so as to rapidly realize positioning; controlling a V groove according to a preset control method during V-cutting processing; therefore, the defects of inaccurate V-groove processing, easy deformation of the circuit board after V-CUT and the like are reduced. Therefore, the technical problem of how to improve the V-cutting processing efficiency of the printed circuit board is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards, and particularly to a V-CUT processing technology for circuit boards. Background Art

[0002] A printed circuit board, whose English name is Printed Circuit Board, abbreviated as PCB; usually, it can also be called a printed wiring board, which is an important electronic component and also a carrier for connecting electronic components. Since the circuit board is made by electronic printing technology, it is called a "printed" circuit board. Before the appearance of PCB, the interconnection between electronic components was directly composed of wires to form a complete circuit. Currently, the circuit panel or wire connection only exists as an effective experimental tool, while PCB has occupied an absolute dominant position in the electronics industry.

[0003] In order to facilitate the production and processing of PCB and improve the assembly and soldering efficiency, usually, a large board is used as the mother board and these mother boards are batch processed into a certain number of types of daughter boards, and then these daughter boards are separated from the mother board. This separation process is generally called PCB sub-boarding; and before sub-boarding the PCB, it is necessary to first perform V-CUT processing on it using a V-CUT machine.

[0004] Specifically, during factory processing, the operator can place the mother board on the V-CUT machine for positioning and cutting. Then, the tool will draw V-shaped cut marks on both the front and back sides of the PCB, but the board is not completely cut off. In the industry, this processing technology is usually called "V-CUT" processing. After the V-CUT operation, it is necessary to disconnect the PCB using a sub-boarding machine. The accuracy of the entire sub-boarding process mainly depends on the V-CUT process because it determines the position where the PCB needs to be cut. As long as the positioned cut marks are accurate, the subsequent work only needs to disconnect the board along the cut marks.

[0005] Based on this, Chinese Patent CN103419233B discloses a combined fully automatic V-CUT machine for circuit board processing; its technical key points include that the V-CUT machine is composed of a longitudinal cutting unit, a transverse conveying mechanism arranged at the conveying end of the longitudinal cutting unit, a transverse cutting unit connected to the output end of the transverse conveying mechanism, and a control terminal; the longitudinal cutting unit and the transverse cutting unit cooperate to automatically cut the four sides of the circuit board to be cut; the longitudinal cutting unit mainly consists of a longitudinal cutting table, a lifting plate feeding mechanism arranged in front of the longitudinal cutting table, a negative pressure plate sucking and conveying mechanism arranged above the lifting plate feeding mechanism, and a longitudinal cutting mechanism arranged on the front side of the conveying direction of the negative pressure plate sucking and conveying mechanism. The output end of the longitudinal cutting mechanism corresponds to the conveying line of the transverse conveying mechanism; this patent solution provides a combined fully automatic V-CUT machine for circuit board processing with a compact structure and high working efficiency; it can be used for the automatic V-CUT process of circuit boards.

[0006] However, the above-disclosed V-cutting machine still has the technical problem of poor processing efficiency. Specifically, V-cutting is generally the last or the penultimate process in PCB manufacturing, depending on different requirements for circuit board processing. Since the layout and wiring on the mother board are fine and dense, and V-cutting is performed simultaneously from both sides of the PCB, the V-cutting operation has high requirements for the product positioning accuracy. At the same time, due to the large number of processed products, the speed of V-cutting directly affects the production efficiency. That is to say, this requires the V-cutting operation to be completed as quickly as possible. In the prior art, manual placement and positioning are required, and it is difficult to meet both the V-cutting accuracy and the fast production requirements only by relying on manual labor, resulting in the processing efficiency of the V-cutting process becoming a bottleneck process for improving the manufacturing of PCBs. Summary of the Invention

[0007] Based on this, it is necessary to provide a V-cutting process for circuit boards to solve the technical problem of how to improve the V-cutting processing efficiency of printed circuit boards.

[0008] A V-cutting process for circuit boards includes the following steps: S1: Place the main body of the mother board to be cut on the working platform of the V-cutting machine, so that the pneumatically controlled positioning pins provided on the working platform of the V-cutting machine pass through a processing positioning hole to fix the main body of the mother board on the working platform, so that there is no relative movement between the main body of the mother board and the working platform of the V-cutting machine; S2: The V-cutting machine starts the trial cutting operation to process a trial cutting trajectory outside the V-CUT area set on the main body of the mother board; S3: Measure the distance between the nearest side of the main body of the mother board to the processing positioning hole and the trial cutting trajectory, denoted as the first distance D; the V-cutting machine reads the distance from the center of the reference positioning hole to the nearest adjacent side of the main body of the mother board from the engineering document for manufacturing the PCB, denoted as the second distance d0; define the distance from the center of the processing positioning hole to the trial cutting trajectory as the measured distance d of the trial cutting line, and calculate d = D - d0; S4: The V-cutting machine reads respectively: the distance from the center of the reference positioning hole to the upper reference line, i.e., the upper reference distance d1, the distance between the upper reference line and the lower reference line, i.e., the processing reference distance d2, and the distance from the lower reference line to the reference trial cutting line, i.e., the lower reference distance d3; and calculate d4 = d1 + d2 + d3; then, determine whether the value of d4 is equal to the value of the measured distance d of the trial cutting line or the difference is within the preset threshold range; if so, jump to step S5; if not, assign the absolute value of the difference between d4 and d to the error compensation t, and input the error compensation t into the V-cutting machine for error correction, and then process an error correction trajectory outside the V-CUT area set on the main body of the mother board again, and then return to step S3, and replace the position of the original trial cutting trajectory with the position of the error correction trajectory, and recalculate; S5: Perform V-grooving on the V-CUT area provided on the motherboard body. After completing the processing of one side, remove the motherboard body from the processing platform, turn it over, and return to step S1; if the V-grooving of both sides of the motherboard body is completed, then jump to step S6; S6: Remove the motherboard body from the processing platform and store the processed motherboard body.

[0009] Specifically, in step S5, after the motherboard body completes the V-CUT processing, a number of first V-groove structures and second V-groove structures are processed and set in the V-CUT areas on its upper and lower surfaces; the bottom of the first V-groove structure and the bottom of the second V-groove structure are arranged staggeredly.

[0010] Specifically, in step S5, the groove depth of the first V-groove or the second V-groove is one-third of the board thickness of the motherboard body.

[0011] Specifically, in step S5, when the side length of the longest side of the motherboard body 1 ≤ 150 mm, the distance between the bottom of the first V-groove and the bottom of the second V-groove is one-fifth of the board thickness of the motherboard body.

[0012] Specifically, in step S5, when the side length of the longest side of the motherboard body > 150 mm and the board thickness of the motherboard body ≥ 1.6 mm, the distance between the bottom of the first V-groove and the bottom of the second V-groove is one-fifth of the board thickness of the motherboard body.

[0013] Specifically, in step S5, when the side length of the longest side of the motherboard body > 150 mm and the board thickness of the motherboard body < 1.2 mm, the distance between the bottom of the first V-groove and the bottom of the second V-groove is one-fourth of the board thickness of the motherboard body.

[0014] In summary, in a V-CUT processing technology of a circuit board according to the present invention, after the printed circuit board is fixedly installed on a V-cutting machine, the distance D between the edge of one side of the positioning hole and the trial cutting line is first measured, and then the distance d0 between the center of the positioning hole and the upper edge of the printed circuit board is subtracted from the distance D; thereby, the distance d between the center of the positioning hole and the trial cutting line is indirectly obtained; and the distance between the center of the reference positioning hole and the upper reference line, that is, the upper reference distance d1, the distance between the upper reference line and the lower reference line, that is, the processing reference distance d2, and the distance between the lower reference line and the reference trial cutting line, that is, the lower reference distance d3 are defined; and d4 = d1 + d2 + d3 is calculated, and by judging whether the value of d4 is equal to the measured distance d of the trial cutting line or the difference value is within a preset threshold range; then corresponding error compensation is performed to quickly realize the positioning during V-cut processing; and then the V-groove is controlled according to a preset control method during V-cut processing; thereby reducing defects such as inaccurate V-groove processing and easy deformation of the circuit board after V-CUT. Therefore, a V-CUT processing technology of a circuit board according to the present invention solves the technical problem of how to improve the V-cut processing efficiency of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 6 is a schematic structural diagram of a printed circuit board to be subjected to V-CUT processing applied to a V-CUT processing technology of a circuit board according to the present invention; Figure 2 FIG. 7 is a schematic structural diagram of another printed circuit board to be subjected to V-CUT processing applied to a V-CUT processing technology of a circuit board according to the present invention; Figure 3 FIG. 8 is a schematic structural diagram of a V-groove of a printed circuit board applied to a V-CUT processing technology of a circuit board according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0017] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0018] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0019] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0021] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0022] Please refer to Figures 1 to 2 , a printed circuit board to be V-CUT processed, which includes: a motherboard body 1, processing positioning holes 2, a tool test track 3, and a V-CUT area 4; a plurality of the processing positioning holes 2 are provided on one side of the motherboard body 1, the tool test track 3 is disposed on the other side of the motherboard body 1 relative to the processing positioning holes 2, and the V-CUT area 4 is disposed on the motherboard body 1 between the processing positioning holes 2 and the tool test track 3 shown.

[0023] Specifically, generally, there are three basic features on the engineering document for designing the motherboard body 1, namely, a reference positioning hole, a reference line, and a reference tool test line; among them, during actual processing operations, the reference positioning hole can be made to coincide with the center of the processing positioning hole 2, and the reference line includes a lower reference line 401 and an upper reference line 402, and the V-CUT area 4 is formed between the lower reference line and the upper reference line; thus, it can be defined that the distance from the center of the reference positioning hole to the upper reference line 402 is the upper reference distance d1; the distance between the upper reference line 402 and the lower reference line 401 is defined as the processing reference distance d2; the distance from the lower reference line 401 to the reference tool test line is the lower reference distance d3.

[0024] Therefore, a V-CUT processing process for a circuit board according to the present invention includes the following steps: S1: Place the motherboard body 1 to be cut on the working platform of the V-cutting machine, so that the pneumatically controlled positioning pins provided on the working platform of the V-cutting machine pass through a processing positioning hole 2 to fix the motherboard body 1 on the working platform, so that there is no relative movement between the motherboard body 1 and the working platform of the V-cutting machine; S2: The V-cutting machine starts the tool test operation to process a tool test track 3 outside the V-CUT area provided on the motherboard body 1; S3: Measure the distance from the side of the motherboard body 1 closest to the processing positioning hole 2 to the tool test track 3, denoted as the first distance D; the V-cutting machine reads from the engineering document for manufacturing the PCB the distance from the center of the reference positioning hole to the adjacent side of the motherboard body 1 closest to it, denoted as the second distance d0; define the distance from the center of the processing positioning hole 2 to the tool test track 3 as the measured tool test line distance d, and calculate d = D - d0; S4: The V-cut machine respectively reads: the distance from the center of the reference positioning hole to the upper reference line 402, i.e., the upper reference distance d1, the distance between the upper reference line 402 and the lower reference line 401, i.e., the processing reference distance d2, and the distance from the lower reference line 401 to the reference tool testing line, i.e., the lower reference distance d3; and calculates d4 = d1 + d2 + d3; then, it further determines whether the value of d4 is equal to the actually measured distance d of the tool testing line or the difference is within a preset threshold range; if so, it jumps to step S5; if not, it assigns the absolute value of the difference between d4 and d to the error compensation t, inputs the error compensation t into the V-cut machine for error correction, then processes again outside the V-CUT area set on the motherboard main body 1 to obtain an error correction trajectory, and then returns to step S3, replaces the position of the original tool testing trajectory 3 with the position of the error correction trajectory, and recalculates; S5: Perform V-cut processing on the V-CUT area set on the motherboard main body 1. After completing the processing of one side, remove the motherboard main body 1 from the processing platform, turn it over, and return to step S1; if the V-cut processing of both sides of the motherboard main body 1 is completed, then jump to step S6; S6: Remove the motherboard main body 1 from the processing platform and store the processed motherboard main body 1.

[0025] Specifically, in the prior art, a V-cut machine is a numerically controlled cutting machine tool. Except for manual loading and unloading, its movement feed and cutting operations are all controlled and completed by a worker operating the human-computer interaction interface of the computer. After successful trial cutting, the position where V-cut needs to be performed on the PCB can be specified through the human-computer interaction interface. The purpose of tool testing is to eliminate the positioning error of the V-cut machine. This is because, due to errors in manufacturing the PCB, there are errors between the actual dimensions of the various lines on the PCB surface and the corresponding ideal dimensions in the engineering document of the PCB. In addition, since the engineering documents corresponding to different specifications of PCBs are different; therefore, the relative positions of the positioning holes, reference lines, and tool testing lines on the PCB are also different, and at the same time, the positions where the PCB needs to be cut also change; this requires controlling the drive program through tool testing to correct the value of the system origin so that the system origin coincides with the mechanical origin. Moreover, since the tool has a certain service life, when the V-cut machine cuts a certain number of PCBs, a new tool needs to be replaced. In this way, the relative position between the position of the newly replaced tool and the mechanical origin of the system changes, that is, an error is generated.

[0026] Through a V-CUT processing technology for circuit boards of the present invention, the defects of inaccurate V-cut dimensions caused by the aforementioned errors or the need for repeated tool alignment during batch processing can be eliminated; thus, the V-cut processing efficiency of printed circuit boards can be improved.

[0027] Further, please continue to refer to Figure 3, after the motherboard body 1 is completed with V-CUT processing, a number of first V-groove structures 101 and second V-groove structures 102 are provided in the V-CUT areas 4 on the upper and lower surfaces thereof; the bottoms of the first V-groove structures 101 and the bottoms of the second V-groove structures 102 are arranged staggeredly. Thus, it is possible to avoid adverse conditions such as deformation of the motherboard body 1 in subsequent processes such as welding.

[0028] Furthermore, when using the aforementioned V-CUT process for actual processing, the following adverse conditions will occur: a. The V-cut is not in place, and it is difficult to separate the boards after welding; b. The V-cut is too excessive, resulting in deformation of the circuit board during the welding process; c. The longitudinal and transverse directions of the V-cut are inconsistent, and the board separation effect is very different.

[0029] Therefore, in the aforementioned step S5, it can be defined that the groove depth of the first V-groove 101 or the second V-groove 102 is one-third of the thickness of the motherboard body 1. Thus, it is possible to avoid defects such as deformation of the circuit board after the V-CUT processing is completed.

[0030] Furthermore, in the aforementioned step S5, when the side length of the longest side of the motherboard body 1 ≤ 150 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102 is one-fifth of the board thickness of the motherboard body 1. For example, when the side length of the longest side of the motherboard body 1 is 150 mm and the board thickness is 0.6 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102, that is, the remaining thickness of the V-CUT, is set to 0.12 mm; if the side length of the longest side of the motherboard body 1 is 140 mm and the board thickness is 1.6 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102, that is, the remaining thickness of the V-CUT, is set to 0.32 mm.

[0031] Furthermore, in the aforementioned step S5, when the side length of the longest side of the motherboard body 1 > 150 mm and the board thickness of the motherboard body 1 ≥ 1.6 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102 is one-fifth of the board thickness of the motherboard body 1. For example, when the side length of the longest side of the motherboard body 1 is 160 mm and the board thickness is 2.0 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102 is 0.4 mm.

[0032] Further, in the foregoing step S5, when the length of the longest side of the motherboard body 1 > 150 mm and the thickness of the motherboard body 1 is less than 1.2 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102 is one-fourth of the thickness of the motherboard body 1. For example, when the length of the longest side of the motherboard body 1 is 160 mm and the thickness is 1.2 mm, the distance between the bottom of the first V-groove 101 and the bottom of the second V-groove 102 is 0.3 mm.

[0033] Thus, according to the control method proposed by a V-CUT processing technology of a circuit board of the present invention, it can ensure that the motherboard body 1 remains unchanged during the subsequent soldering process, and moreover, it is convenient to separate the board after soldering or ensure appropriate force during board separation.

[0034] In summary, for a V-CUT processing technology of a circuit board of the present invention, after the printed circuit board is fixedly installed on the V-cutting machine, first measure the distance D between the edge of one side of the positioning hole and the trial cutting line, and then subtract the distance d0 between the center of the positioning hole and the upper edge of the printed circuit board from the distance D; thereby, indirectly obtain the distance d between the center of the positioning hole and the trial cutting line; and define the distance between the center of the reference positioning hole and the upper reference line 402, that is, the upper reference distance d1, the distance between the upper reference line 402 and the lower reference line 401, that is, the processing reference distance d2, and the distance between the lower reference line 401 and the reference trial cutting line 403, that is, the lower reference distance d3; and calculate d4 = d1 + d2 + d3, and determine whether the value of d4 is equal to the measured distance d of the trial cutting line or the difference is within a preset threshold range; then perform error compensation correspondingly to quickly realize the positioning during V-cut processing; and then control the V-groove according to a preset control method during V-cut processing; thereby reducing defects such as inaccurate V-groove processing and easy deformation of the circuit board after V-CUT. Therefore, a V-CUT processing technology of a circuit board of the present invention solves the technical problem of how to improve the V-cut processing efficiency of a printed circuit board.

[0035] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0036] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A circuit board V-CUT processing technology, characterized in that: It includes the following steps: S1: placing the motherboard body to be cut on the working platform of the V-cutting machine, so that the pneumatically controlled positioning pin provided on the working platform of the V-cutting machine passes through a machined positioning hole to fix the motherboard body on the working platform, so that there is no relative movement between the motherboard body and the working platform of the V-cutting machine; S2: The V-cutting machine starts the test knife operation to obtain the test knife track outside the V-CUT area set on the motherboard body; S3: Measure the distance between the side of the motherboard body closest to the processing positioning hole and the test knife track, which is recorded as the first distance D; the V-cutting machine reads the distance from the hole center of the reference positioning hole to the adjacent side of the motherboard body closest to it from the engineering file of making the PCB, which is recorded as the second distance d0; define the distance from the hole center of the processing positioning hole to the test knife track as the actual measured distance d of the test knife line, and calculate d=D-d0; S4: The V-cutting machine reads respectively: the distance from the center of the reference positioning hole to the upper reference line, i.e., the upper reference distance d1, the distance between the upper reference line and the lower reference line, i.e., the processing reference distance d2, and the distance between the lower reference line and the reference test knife line, i.e., the lower reference distance d3; and calculates d4=d1+d2+d3; then, it is determined whether the value of d4 is equal to the value of the actual measured distance d of the test knife line or whether the difference is within the preset threshold range; if so, jump to step S5; if not, the absolute value of the difference between d4 and d is assigned to the error compensation t, and the error compensation t is input into the V-cutting machine for error correction, and then the error correction track is processed again outside the V-CUT area set on the motherboard body to obtain the error correction track, and then returns to step S3, and the position of the error correction track replaces the position of the original test knife track, and recalculates; S5: Perform V-cut processing on the V-CUT area on the motherboard body. After completing the processing on one side, remove the motherboard body from the processing platform, turn it over and return to step S1; if the V-cut processing is completed on both sides of the motherboard body, jump to step S6; S6: Remove the motherboard body from the processing platform, and store the processed motherboard body.

2. A circuit board V-CUT processing technology according to claim 1, characterized in that: In step S5, after the V-CUT processing is completed on the motherboard body, a plurality of first V-groove structures and second V-groove structures are processed in the upper and lower V-CUT areas thereof; the bottom of the first V-groove structure and the bottom of the second V-groove structure are staggered with each other.

3. A circuit board V-CUT processing technology according to claim 2, characterized in that: In step S5, the groove depth of the first V-groove or the second V-groove is one third of the thickness of the motherboard body.

4. A circuit board V-CUT processing technology according to claim 2, characterized in that: In step S5, when the length of the longest side of the motherboard body 1 is ≤150 mm, the distance between the bottom of the first V-groove and the bottom of the second V-groove is one fifth of the thickness of the motherboard body.

5. A circuit board V-CUT processing technology according to claim 2, characterized in that: In step S5, when the longest side of the motherboard body is longer than 150 mm and the thickness of the motherboard body is greater than or equal to 1.6 mm, the distance between the bottom of the first V-groove and the bottom of the second V-groove is one fifth of the thickness of the motherboard body.

6. A circuit board V-CUT processing technology according to claim 2, characterized in that: In step S5, when the longest side of the motherboard body is longer than 150 mm and the thickness of the motherboard body is less than 1.2 mm, the distance between the bottom of the first V-groove and the bottom of the second V-groove is one quarter of the thickness of the motherboard body.

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