Communication circuit board processing device

Abstract

The invention provides a communication circuit board processing device, and belongs to the technical field of communication circuit board processing. The communication circuit board processing device comprises a soaking pool, the top of the soaking pool is provided with a multi-layer board copper deposition mechanism, the multi-layer board copper deposition mechanism comprises two supporting walls and a hanging rod, the supporting walls are fixedly installed on the top of the soaking pool, the top of each supporting wall is provided with a first hydraulic rod, and the hanging rod is fixedly installed on the top of the soaking pool. And a mounting plate is mounted at the output end of the first hydraulic rod. According to the invention, the multilayer board copper deposition mechanism is arranged, a first hydraulic rod is started to drive a C-shaped board and a substrate to enter the soaking pool for copper deposition operation, and at the moment, a bearing frame slides back and forth along a hanging rod, so that the substrate moves up and down in annular grooves of a plurality of first rollers and annular grooves of second rollers; compared with the prior art, the problem of non-uniform copper deposition at the through holes and the blind holes in the substrate is avoided, and the copper deposition effect is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of communication circuit board processing, and more specifically, to a communication circuit board processing device. Background Art

[0002] A communication circuit board is an integrated circuit board that realizes signal reception, amplification, processing, and transmission by integrating electronic components and circuits. It is a core component in electronic communication devices and is widely used in fields such as communication, automotive, and industrial control. The processing of communication circuit boards is a high-precision process in electronic manufacturing, involving high-frequency signal processing, multi-layer board lamination, and advanced surface treatment technologies.

[0003] In the prior art for the processing of communication circuit boards, electroless copper plating is an important step before electroplating copper and affects conductivity. However, during electroless copper plating, due to the presence of blind holes, through holes, and other holes on the circuit board, it is easy to cause uneven electroless copper plating at the holes. Summary of the Invention

[0004] To make up for the above deficiencies, the present invention provides a communication circuit board processing device that overcomes the above technical problems or at least partially solves the above problems.

[0005] The present invention is implemented as follows:

[0006] The present invention provides a communication circuit board processing device, including an immersion tank. A multi-layer board electroless copper plating mechanism is provided on the top of the immersion tank. The multi-layer board electroless copper plating mechanism includes:

[0007] Support walls, the support walls are fixedly installed on the top of the immersion tank. The number of the support walls is two. A first hydraulic rod is installed on the top of the support walls, and a mounting plate is installed at the output end of the first hydraulic rod.

[0008] Mounting rods, the mounting rods are fixedly installed at the bottom of the mounting plate. The bottom of the mounting rods is fixedly installed with a bottom plate. A carrier is slidably sleeved on the surface of the mounting rods. A plurality of C-shaped plates are fixedly installed on the top of the carrier. Adjusting plates are slidably sleeved on the inner walls of the plurality of C-shaped plates. A driving rod is integrally formed between the plurality of adjusting plates.

[0009] In a preferred embodiment, first chutes and second chutes are formed on the inner walls of the C-shaped plates. The adjusting plates are slidably sleeved inside the second chutes. A third chute is formed on the left side of the adjusting plates. A plurality of first rollers and a plurality of second rollers are respectively rotatably installed inside the first chutes and the third chutes. Annular grooves are formed on the outer surfaces of the first rollers and the second rollers.

[0010] In a preferred embodiment, a first moving plate is fixedly installed at the top of one of the adjusting plates. A first moving groove penetrating up and down is formed in the top wall of one of the C-shaped plates. The first moving plate is slidably sleeved inside the first moving groove. A support frame and a first support plate are fixedly installed at the top of one of the C-shaped plates. A driving lead screw is rotatably installed between the support frame and the first support plate. The driving lead screw is threadedly sleeved inside the first moving plate.

[0011] In a preferred embodiment, an L-shaped plate and a straight groove plate are integrally formed at the bottom of the mounting plate. A first turntable and a second turntable are rotatably installed on the opposite sides of the L-shaped plate and the straight groove plate respectively. A first eccentric shaft is arranged between the first turntable and the second turntable. A pull rod is fixedly installed on the outer surface of the carrier frame. A connecting rod is arranged between the first eccentric shaft and the pull rod. One end of the connecting rod is rotatably sleeved on the surface of the pull rod. The other end of the connecting rod is rotatably sleeved on the surface of the first eccentric shaft.

[0012] In a preferred embodiment, a copper deposition adjusting mechanism is arranged on the mounting plate. The copper deposition adjusting mechanism includes first displacement grooves. There are two first displacement grooves, which are respectively formed in the first turntable and the second turntable. A first limiting strip is fixedly installed inside the first displacement groove. A first displacement block is slidably sleeved on the surface of the first limiting strip. The left and right sides of the first eccentric shaft are respectively fixedly connected to the two first displacement blocks. One end of one of the first displacement blocks is fixedly installed with a first adjusting block. A first adjusting rod is fixedly installed at the end of the second turntable away from the first turntable. A second adjusting block is slidably sleeved on the surface of the first adjusting rod. A first rotating rod is arranged between the first adjusting block and the second adjusting block. One end of the first rotating rod is rotatably sleeved inside the first adjusting block. The other end of the first rotating rod is rotatably sleeved inside the second adjusting block.

[0013] In a preferred embodiment, a first sliding ring is fixedly installed on the side of the second adjusting block away from the second turntable. A first sliding groove is formed on the outer surface of the first sliding ring. A connecting plate is integrally formed between the two mounting plates. A second moving groove penetrating up and down is formed in the connecting plate. A second moving plate is slidably sleeved inside the second moving groove. A first clamping ring is fixedly installed at the bottom of the second moving plate. The first sliding ring is rotatably sleeved inside the first clamping ring.

[0014] In a preferred embodiment, a first bevel gear is fixedly sleeved on the surface of the driving lead screw. A spline sleeve is rotatably installed inside the support frame. A second bevel gear is fixedly sleeved on the surface of the spline sleeve. The first bevel gear meshes with the second bevel gear. Second support plates are fixedly installed at the tops of the two mounting plates. A bidirectional lead screw is rotatably installed between the two second support plates.

[0015] In a preferred embodiment, a spline shaft is rotatably installed inside the connecting plate. The spline shaft is slidably sleeved inside a spline sleeve. A third bevel gear is fixedly sleeved on the surface of the spline shaft. A fourth bevel gear is fixedly sleeved on the surface of the bidirectional lead screw. The third bevel gear meshes with the fourth bevel gear. A first motor is installed on the top of one of the mounting plates. The output end of the first motor is connected to the bidirectional lead screw.

[0016] In a preferred embodiment, a copper deposition liquid shaking mechanism is arranged on the top of the L-shaped plate. The copper deposition liquid shaking mechanism includes a connecting shaft. The connecting shaft is fixedly installed on one side of the first turntable away from the second turntable. An eccentric plate is fixedly installed at the end of the connecting shaft away from the first turntable. A straight slot is formed on the side of the eccentric plate away from the connecting shaft. A second eccentric shaft is slidably sleeved inside the straight slot.

[0017] In a preferred embodiment, a second motor is installed on the top of the L-shaped plate. The output end of the second motor is installed with a third turntable. A second adjusting rod is fixedly installed on the side of the third turntable close to the eccentric plate. A fourth turntable is fixedly installed at the end of the second adjusting rod close to the eccentric plate. A second displacement slot penetrating left and right is formed on the fourth turntable. A second limiting strip is fixedly installed inside the second displacement slot. A second displacement block is slidably sleeved on the surface of the second limiting strip. One end of the second displacement block is fixedly connected to the second eccentric shaft. A third adjusting block is fixedly installed at the other end of the second displacement block. A fourth adjusting block is slidably sleeved on the surface of the second adjusting rod. A second rotating rod is arranged between the third adjusting block and the fourth adjusting block. One end of the second rotating rod is rotatably sleeved inside the third adjusting block. The other end of the second rotating rod is rotatably sleeved inside the fourth adjusting block. A second hydraulic rod is installed on the top of the L-shaped plate. The output end of the second hydraulic rod is installed with a third moving plate. A second clamping ring is integrally formed on the top of the third moving plate. A second sliding ring is fixedly installed on the side of the fourth adjusting block away from the fourth turntable. A second sliding slot is formed on the outer surface of the second sliding ring. The second sliding ring is rotatably sleeved inside the second clamping ring.

[0018] A communication circuit board processing device provided by the present invention has the following beneficial effects:

[0019] 1. By arranging a multi-layer board copper deposition mechanism, starting the first hydraulic rod drives the U-shaped plate and the substrate into the soaking pool for copper deposition operation. At this time, the carrier is reciprocally slid along the mounting rod, so that the substrate moves up and down in the annular grooves of the plurality of first rollers and the annular grooves of the second rollers, thereby avoiding the problem of uneven copper deposition at the through holes and blind holes on the substrate. Compared with the prior art, the copper deposition effect is significantly improved.

[0020] 2. By setting up a copper deposition adjustment mechanism, when the second moving plate moves away from the second turntable, the first clamping ring drives the first sliding ring to move, so that the first eccentric shaft approaches the centers of the first turntable and the second turntable. When the eccentric distance of the first eccentric shaft becomes shorter, the circumference of the circular trajectory along which the connecting rod rotates becomes shorter. As a result, when the carrier moves reciprocally, the reciprocating movement stroke becomes smaller.

[0021] 3. By setting up a copper deposition liquid shaking-off mechanism, when the user activates the second hydraulic rod, the speed at which the carrier drives the substrate to reciprocate in the immersion tank slows down, preventing a large number of bubbles from being generated due to excessive reciprocating movement. On the contrary, when it is necessary to shake off the excess copper deposition liquid after the substrate has completed copper deposition, the second hydraulic rod is activated in the reverse direction, making the speed of the reciprocating movement of the carrier faster, which is more suitable for shaking off the copper deposition liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0023] Figure 1 is a three-dimensional structural schematic diagram of the overall structure provided by the embodiment of the present invention;

[0024] Figure 2 is a structural schematic diagram of a multi-layer board copper deposition mechanism provided by the embodiment of the present invention;

[0025] Figure 3 is a structural schematic diagram of a C-shaped plate provided by the embodiment of the present invention;

[0026] Figure 4 is an exploded view of an adjusting plate and a second sliding groove provided by the embodiment of the present invention;

[0027] Figure 5 is a structural schematic diagram of a first adjusting rod and a first rotating rod provided by the embodiment of the present invention;

[0028] Figure 6 is a structural schematic diagram of a second moving groove and a second moving plate provided by the embodiment of the present invention;

[0029] Figure 7 is an exploded view of a first clamping ring and a first sliding ring provided by the embodiment of the present invention;

[0030] Figure 8 is an exploded view of a second clamping ring and a second sliding ring provided by the embodiment of the present invention.

[0031] In the figure: 1, soaking pool; 201, support wall; 202, first hydraulic rod; 203, mounting plate; 204, mounting rod; 205, bottom plate; 206, bearing frame; 207, U-shaped plate; 208, adjusting plate; 209, driving rod; 210, first chute; 211, second chute; 212, third chute; 213, first roller; 214, second roller; 215, annular groove; 216, first moving plate; 217, first moving groove; 218, support frame; 219, first support plate; 220, driving lead screw; 221, L-shaped plate; 222, straight groove plate; 223, first turntable; 224, second turntable; 225, first eccentric shaft; 226, pull rod; 227, connecting rod; 301, first displacement groove; 302, first limiting strip; 303, first displacement block; 304, first adjusting block; 305, first adjusting rod; 306, second adjusting block; 307, first rotating rod; 308, first sliding ring; 309, first sliding groove; 310, connecting plate; 311, second moving groove; 312, second moving plate; 313, first snap ring; 314, first bevel gear; 315, spline sleeve; 316, second bevel gear; 317, second support plate; 318, bidirectional lead screw; 319, spline shaft; 320, third bevel gear; 321, fourth bevel gear; 322, first motor; 401, coupling shaft; 402, eccentric plate; 403, straight slot opening; 404, second eccentric shaft; 405, second motor; 406, third turntable; 407, second adjusting rod; 408, fourth turntable; 409, second displacement groove; 410, second limiting strip; 411, second displacement block; 412, third adjusting block; 413, fourth adjusting block; 414, second rotating rod; 415, second hydraulic rod; 416, third moving plate; 417, second snap ring; 418, second sliding ring; 419, second sliding groove. Detailed implementation manners

[0032] To make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Refer to Figures 1 - 8, the present invention provides a technical solution: a communication circuit board processing device, including an immersion tank 1. The top of the immersion tank 1 is open, and a copper deposition solution is provided inside the immersion tank 1. A multi-layer board copper deposition mechanism is arranged on the top of the immersion tank 1. The multi-layer board copper deposition mechanism includes a support wall 201 and a hanging rod 204. The support wall 201 is fixedly installed on the top of the immersion tank 1, and the number of the support walls 201 is two. A first hydraulic rod 202 is installed on the top of the support wall 201, and a hanging plate 203 is installed at the output end of the first hydraulic rod 202. The hanging rod 204 is fixedly installed at the bottom of the hanging plate 203, and a bottom plate 205 is fixedly installed at the bottom of the hanging rod 204. A bearing frame 206 is slidably sleeved on the surface of the hanging rod 204. A plurality of U-shaped plates 207 are fixedly installed on the top of the bearing frame 206. Adjusting plates 208 are slidably sleeved on the inner walls of the plurality of U-shaped plates 207. A limiting block is installed on the top of the adjusting plate 208. A limiting groove is opened on the top wall of the U-shaped plate 207, and the limiting block is slidably sleeved inside the limiting groove to limit the moving direction of the adjusting plate 208. A driving rod 209 is integrally formed among the plurality of adjusting plates 208. A first sliding groove 210 and a second sliding groove 211 are opened on the inner wall of the U-shaped plate 207. The adjusting plate 208 is slidably sleeved inside the second sliding groove 211. A third sliding groove 212 is opened on the left side of the adjusting plate 208. A plurality of first rollers 213 and a plurality of second rollers 214 are respectively rotatably installed inside the first sliding groove 210 and the third sliding groove 212. Annular grooves 215 are opened on the outer surfaces of the first rollers 213 and the second rollers 214. By setting the multi-layer board copper deposition mechanism, the user places multiple substrates in the plurality of second sliding grooves 211 respectively, and makes the substrates move to the left, so that the left sides of the substrates are sleeved inside the annular grooves 215 of the first rollers 213. At this time, the middle adjusting plate 208 is moved. Through the cooperation of the driving rod 209, the plurality of adjusting plates 208 move to the left simultaneously, so that the annular grooves 215 of the second rollers 214 are sleeved on the right side surfaces of the substrates. Thus, the limiting of the substrates is completed, and substrates of various different specifications can be adapted. The first hydraulic rod 202 is started, so that the hanging plate 203 drives the hanging rod 204 and the bottom plate 205 to move downward, thereby driving the U-shaped plates 207 and the substrates into the immersion tank 1 for copper deposition operation. At this time, the bearing frame 206 is reciprocally slid along the hanging rod 204, so that the substrates move up and down inside the annular grooves 215 of the plurality of first rollers 213 and the annular grooves 215 of the second rollers 214, thereby avoiding the problem of uneven copper deposition at the through holes and blind holes on the substrates. Compared with the prior art, the copper deposition effect is significantly improved;

[0034] Refer to Figures 1 - 8, a first moving plate 216 is fixedly installed at the top of one of the adjusting plates 208. A first moving groove 217 penetrating up and down is formed in the top wall of one of the U-shaped plates 207. The first moving plate 216 is slidably sleeved inside the first moving groove 217. A support frame 218 and a first support plate 219 are fixedly installed at the top of one of the U-shaped plates 207. A driving lead screw 220 is rotatably installed between the support frame 218 and the first support plate 219. The driving lead screw 220 is threadedly sleeved inside the first moving plate 216. By providing the driving lead screw 220, when the driving lead screw 220 rotates, due to the threaded connection between the driving lead screw 220 and the first moving plate 216, and the limiting cooperation of the first moving groove 217, the first moving plate 216 drives the adjusting plate 208 in the middle position to move leftward, so that substrates of different specifications can be clamped;

[0035] Refer to Figures 1 - 8 , an L-shaped plate 221 and a straight groove plate 222 are integrally formed at the bottom of the mounting plate 203. A first turntable 223 and a second turntable 224 are respectively rotatably installed on the opposite sides of the L-shaped plate 221 and the straight groove plate 222. A first eccentric shaft 225 is arranged between the first turntable 223 and the second turntable 224. A pull rod 226 is fixedly installed on the outer surface of the carrier 206. A connecting rod 227 is arranged between the first eccentric shaft 225 and the pull rod 226. One end of the connecting rod 227 is rotatably sleeved on the surface of the pull rod 226, and the other end of the connecting rod 227 is rotatably sleeved on the surface of the first eccentric shaft 225. By providing the connecting rod 227, when the first turntable 223 rotates, it drives the first eccentric shaft 225 to rotate. Since one end of the connecting rod 227 is rotatably sleeved on the surface of the pull rod 226 and the other end of the connecting rod 227 is rotatably sleeved on the surface of the first eccentric shaft 225, under the limiting cooperation between the carrier 206 and the mounting rod 204, the carrier 206 reciprocates along the mounting rod 204;

[0036] Refer to Figures 1 - 8, a copper deposition adjusting mechanism is provided on the mounting plate 203. The copper deposition adjusting mechanism includes a first displacement groove 301. There are two first displacement grooves 301, and the two first displacement grooves 301 are respectively formed on the first turntable 223 and the second turntable 224. A first limiting strip 302 is fixedly installed inside the first displacement groove 301. A first displacement block 303 is slidably sleeved on the surface of the first limiting strip 302. The left and right sides of the first eccentric shaft 225 are respectively fixedly connected to the two first displacement blocks 303. One end of one of the first displacement blocks 303 is fixedly installed with a first adjusting block 304. One end of the second turntable 224 away from the first turntable 223 is fixedly installed with a first adjusting rod 305. A second adjusting block 306 is slidably sleeved on the surface of the first adjusting rod 305. A first rotating rod 307 is arranged between the first adjusting block 304 and the second adjusting block 306. One end of the first rotating rod 307 is rotatably sleeved inside the first adjusting block 304, and the other end of the first rotating rod 307 is rotatably sleeved inside the second adjusting block 306. One side of the second adjusting block 306 away from the second turntable 224 is fixedly installed with a first sliding ring 308. A first sliding groove 309 is formed on the outer surface of the first sliding ring 308. A connecting plate 310 is integrally formed between the two mounting plates 203. A second moving groove 311 penetrating up and down is formed on the connecting plate 310. A second moving plate 312 is slidably sleeved inside the second moving groove 311. A first clamping ring 313 is fixedly installed at the bottom of the second moving plate 312. The first sliding ring 308 is rotatably sleeved inside the first clamping ring 313. Without affecting the rotation of the first sliding ring 308, the horizontal movement of the first clamping ring 313 can drive the first sliding ring 308 to move horizontally. By setting the copper deposition adjusting mechanism, when the second moving plate 312 moves away from the second turntable 224, the first clamping ring 313 drives the first sliding ring 308 to move, causing the first rotating rod 307 to rotate, driving the first displacement block 303 to move upward along the first limiting strip 302, so that the first eccentric shaft 225 approaches the centers of the first turntable 223 and the second turntable 224. When the eccentric distance of the first eccentric shaft 225 becomes shorter, the circumference of the circular trajectory of the rotation of the connecting rod 227 becomes shorter, so that when the carrier 206 moves reciprocally, the reciprocating movement stroke becomes smaller;

[0037] Refer to Figures 1 - 8, a first bevel gear 314 is fixedly sleeved on the surface of the driving lead screw 220. A spline sleeve 315 is rotatably installed inside the support frame 218. A second bevel gear 316 is fixedly sleeved on the surface of the spline sleeve 315. The first bevel gear 314 and the second bevel gear 316 are meshed with each other. Second support plates 317 are fixedly installed at the tops of the two mounting plates 203. A bidirectional lead screw 318 is rotatably installed between the two second support plates 317. A spline shaft 319 is rotatably installed inside the connecting plate 310 through a bearing. The spline shaft 319 is slidably sleeved inside the spline sleeve 315. On the premise that the spline shaft 319 and the spline sleeve 315 can slide relative to each other, the rotation of the spline shaft 319 can drive the rotation of the spline sleeve 315. A third bevel gear 320 is fixedly sleeved on the surface of the spline shaft 319. A fourth bevel gear 321 is fixedly sleeved on the surface of the bidirectional lead screw 318. The third bevel gear 320 and the fourth bevel gear 321 are meshed with each other. A first motor 322 is installed at the top of one of the mounting plates 203. The output end of the first motor 322 is connected to the bidirectional lead screw 318. By providing the spline shaft 319 and the spline sleeve 315, when the user starts the first motor 322, it drives the bidirectional lead screw 318 to rotate, so that the two second moving plates 312 move in opposite directions, reducing the stroke of the reciprocating movement of the carrier 206 driving the substrate. At the same time, when the bidirectional lead screw 318 rotates, through the meshing connection of the third bevel gear 320 and the fourth bevel gear 321, the third bevel gear 320 drives the spline shaft 319 to rotate. Through the meshing of the spline teeth of the spline shaft 319 and the spline teeth of the spline sleeve 315, the spline sleeve 315 drives the second bevel gear 316 to rotate. Through the meshing connection of the first bevel gear 314 and the second bevel gear 316, the first bevel gear 314 drives the driving lead screw 220 to rotate, thereby driving the adjusting plate 208 to move leftward to clamp the substrate. And when the size of the substrate is smaller, the number of rotation turns of the bidirectional lead screw 318 and the driving lead screw 220 is more, and the eccentric distance of the first eccentric shaft 225 is shorter. Thus, when the substrate is smaller, the reciprocating movement stroke of the carrier 206 and the substrate is smaller, reducing the plating speed difference between the edge and the central area of the substrate, and avoiding the problem that a large number of bubbles are generated at the through holes and blind holes due to the too large reciprocating movement stroke when the substrate is small, which affects the copper deposition effect;

[0038] Refer to Figures 1 - 8, a copper deposition solution shaking-off mechanism is provided at the top of the L-shaped plate 221. The copper deposition solution shaking-off mechanism includes a coupling shaft 401, which is fixedly installed on the side of the first turntable 223 away from the second turntable 224. One end of the coupling shaft 401 away from the first turntable 223 is fixedly installed with an eccentric plate 402. A straight slot 403 is formed on the side of the eccentric plate 402 away from the coupling shaft 401. A second eccentric shaft 404 is slidably sleeved inside the straight slot 403. The top of the L-shaped plate 221 is installed with a second motor 405 through a heightening seat. The output end of the second motor 405 is installed with a third turntable 406. A second adjusting rod 407 is fixedly installed on the side of the third turntable 406 close to the eccentric plate 402. One end of the second adjusting rod 407 close to the eccentric plate 402 is fixedly installed with a fourth turntable 408. A second displacement slot 409 penetrating left and right is formed on the fourth turntable 408. A second limiting strip 410 is fixedly installed inside the second displacement slot 409. A second displacement block 411 is slidably sleeved on the surface of the second limiting strip 410. One end of the second displacement block 411 is fixedly connected to the second eccentric shaft 404, and the other end of the second displacement block 411 is fixedly installed with a third adjusting block 412. A fourth adjusting block 413 is slidably sleeved on the surface of the second adjusting rod 407. A second rotating rod 414 is provided between the third adjusting block 412 and the fourth adjusting block 413. One end of the second rotating rod 414 is rotatably sleeved inside the third adjusting block 412, and the other end of the second rotating rod 414 is rotatably sleeved inside the fourth adjusting block 413. The top of the L-shaped plate 221 is installed with a second hydraulic rod 415 through a mounting seat. The output end of the second hydraulic rod 415 is installed with a third moving plate 416. A second clamping ring 417 is integrally formed on the top of the third moving plate 416. A second sliding ring 418 is fixedly installed on the side of the fourth adjusting block 413 away from the fourth turntable 408. A second sliding slot 419 is formed on the outer surface of the second sliding ring 418. The second sliding ring 418 is rotatably sleeved inside the second clamping ring 417. Without affecting the rotation of the second sliding ring 418, the horizontal movement of the second clamping ring 417 can drive the second sliding ring 418 to move horizontally. By providing the copper deposition solution shaking-off mechanism, after the copper deposition operation is completed, the first hydraulic rod 202 is started in reverse to drive the carrier 206 to drive the substrate away from the immersion tank 1. After a short wait, the second motor 405 is started to drive the third turntable 406 to rotate. The fourth turntable 408 is driven to rotate through the cooperation of the second adjusting rod 407. The second eccentric shaft 404 squeezes the straight slot 403, so that the eccentric plate 402 drives the first turntable 223 to rotate through the coupling shaft 401, thereby driving the carrier 206 to move reciprocally to shake off the excess copper deposition solution on the substrate and the C-shaped plate 207. And when the user starts the second hydraulic rod 415, the third moving plate 416 drives the second clamping ring 417 to move in the direction close to the third turntable 406, so that the second sliding ring 418 drives the fourth adjusting block 413 to move in the direction close to the third turntable 406, causing the second rotating rod 414 to rotate.Under the limiting cooperation of the second limiting strip 410, the third adjusting block 412 drives the second displacement block 411 to move downward, so that the eccentric distance of the second eccentric shaft 404 becomes shorter. Since the rotation speed of the second motor 405 remains unchanged and the rotation circumference of the second eccentric shaft 404 becomes smaller, the rotation speed of the second eccentric shaft 404 driving the first turntable 223 to rotate becomes slower, and the speed of the carrier 206 driving the substrate to reciprocate in the immersion tank 1 becomes slower, avoiding the generation of a large number of bubbles caused by too fast reciprocating movement. On the contrary, when it is necessary to shake off the excess copper deposition solution after the substrate has been copper deposited, the second hydraulic rod 415 is started in the reverse direction, so that the speed of the carrier 206 reciprocating becomes faster, which is more suitable for shaking off the copper deposition solution.

[0039] Specifically, the working process or principle of the communication circuit board processing device is as follows: When in use, the user places multiple substrates in multiple second chutes 211 respectively, and moves the substrates to the left so that the left sides of the substrates are sleeved in the annular grooves 215 of the first rollers 213. The user starts the first motor 322 to drive the bidirectional lead screw 318 to rotate, so that the two second moving plates 312 move in opposite directions. When the second moving plate 312 moves away from the second turntable 224, the first snap ring 313 drives the first slip ring 308 to move, causing the first rotating rod 307 to rotate, driving the first displacement block 303 to move upward along the first limiting strip 302, so that the first eccentric shaft 225 approaches the centers of the first turntable 223 and the second turntable 224. When the eccentricity distance of the first eccentric shaft 225 becomes shorter, the circumference of the circular trajectory along which the connecting rod 227 rotates becomes shorter, so that when the carrier 206 moves reciprocally, the reciprocating movement stroke becomes smaller. At the same time, when the bidirectional lead screw 318 rotates, through the meshing connection of the third bevel gear 320 and the fourth bevel gear 321, the third bevel gear 320 drives the spline shaft 319 to rotate. Through the meshing of the spline teeth of the spline shaft 319 and the spline teeth of the spline sleeve 315, the spline sleeve 315 drives the second bevel gear 316 to rotate. Through the meshing connection of the first bevel gear 314 and the second bevel gear 316, the first bevel gear 314 drives the driving lead screw 220 to rotate, so as to drive one of the adjusting plates 208 to move leftward to clamp the substrate. Through the cooperation of the driving rod 209, multiple adjusting plates 208 move leftward simultaneously, so that the annular groove 215 of the second roller 214 is sleeved on the right surface of the substrate, thus completing the limiting of the substrate. The user starts the second hydraulic rod 415, and the third moving plate 416 drives the second snap ring 417 to move toward the third turntable 406, so that the second slip ring 418 drives the fourth adjusting block 413 to move toward the third turntable 406, causing the second rotating rod 414 to rotate. Under the limiting cooperation of the second limiting strip 410, the third adjusting block 412 drives the second displacement block 411 to move downward, so that the eccentricity distance of the second eccentric shaft 404 becomes shorter. Since the rotation speed of the second motor 405 remains unchanged and the rotation circumference of the second eccentric shaft 404 becomes smaller, the rotation speed of the second eccentric shaft 404 driving the first turntable 223 to rotate becomes slower. The user starts the first hydraulic rod 202, so that the mounting plate 203 drives the mounting rod 204 and the bottom plate 205 to move downward, thereby driving the C-shaped plate 207 and the substrate into the interior of the immersion tank 1 for electroless copper plating operation. The user starts the second motor 405 to drive the third turntable 406 to rotate, and drives the fourth turntable 408 to rotate through the cooperation of the second adjusting rod 407. The second eccentric shaft 404 squeezes the straight slot 403, so that the eccentric plate 402 drives the first turntable 223 to rotate through the coupling shaft 401. When the first turntable 223 rotates, it drives the first eccentric shaft 225 to rotate.Since one end of the connecting rod 227 is rotatably sleeved on the surface of the pull rod 226, and the other end of the connecting rod 227 is rotatably sleeved on the surface of the first eccentric shaft 225, under the limiting cooperation between the bearing frame 206 and the mounting rod 204, the bearing frame 206 reciprocates along the mounting rod 204, causing the substrate to move up and down in the annular grooves 215 of the plurality of first rollers 213 and the annular grooves 215 of the second rollers 214. After the copper deposition operation is completed, the first hydraulic rod 202 is started in reverse to cause the bearing frame 206 to drive the substrate out of the immersion tank 1. The second hydraulic rod 415 is started in reverse to increase the reciprocating movement speed of the bearing frame 206. After a short wait, the second motor 405 is started again, so that the bearing frame 206 reciprocates to shake off the excess copper deposition liquid on the substrate and the C-shaped plate 207.,

Claims

1. A communication circuit board processing device, comprising a soaking tank (1), characterized in that: A multi-layer board copper deposition mechanism is provided at the top of the soaking tank (1), and the multi-layer board copper deposition mechanism includes Support walls (201), the support walls (201) are fixedly installed on the top of the soaking tank (1), the number of the support walls (201) is two, a first hydraulic rod (202) is installed on the top of the support walls (201), and a mounting plate (203) is installed at the output end of the first hydraulic rod (202); Mounting rods (204), the mounting rods (204) are fixedly installed at the bottom of the mounting plate (203), a bottom plate (205) is fixedly installed at the bottom of the mounting rods (204), a bearing frame (206) is slidably sleeved on the surface of the mounting rods (204), a plurality of C-shaped plates (207) are fixedly installed at the top of the bearing frame (206), and adjusting plates (208) are slidably sleeved on the inner walls of the plurality of C-shaped plates (207), and a driving rod (209) is integrally formed between the plurality of adjusting plates (208).

2. A communication circuit board processing device according to claim 1, characterized in that: First chutes (210) and second chutes (211) are formed in the inner walls of the C-shaped plates (207), the adjusting plates (208) are slidably sleeved inside the second chutes (211), a third chute (212) is formed on the left side of the adjusting plates (208), and a plurality of first rollers (213) and a plurality of second rollers (214) are respectively rotatably installed inside the first chutes (210) and the third chutes (212), and annular grooves (215) are formed on the outer surfaces of the first rollers (213) and the second rollers (214).

3. A communication circuit board processing device according to claim 2, characterized in that: A first moving plate (216) is fixedly installed at the top of one of the adjusting plates (208), a first moving groove (217) penetrating up and down is formed in the top wall of one of the C-shaped plates (207), the first moving plate (216) is slidably sleeved inside the first moving groove (217), a support frame (218) and a first support plate (219) are fixedly installed at the top of one of the C-shaped plates (207), a driving lead screw (220) is rotatably installed between the support frame (218) and the first support plate (219), and the driving lead screw (220) is threadedly sleeved inside the first moving plate (216).

4. A communication circuit board processing device according to claim 3, characterized in that: An L-shaped plate (221) and a straight groove plate (222) are integrally formed at the bottom of the mounting plate (203), a first turntable (223) and a second turntable (224) are respectively rotatably installed on the opposite sides of the L-shaped plate (221) and the straight groove plate (222), a first eccentric shaft (225) is arranged between the first turntable (223) and the second turntable (224), a pull rod (226) is fixedly installed on the outer surface of the bearing frame (206), a connecting rod (227) is arranged between the first eccentric shaft (225) and the pull rod (226), one end of the connecting rod (227) is rotatably sleeved on the surface of the pull rod (226), and the other end of the connecting rod (227) is rotatably sleeved on the surface of the first eccentric shaft (225).

5. A communication circuit board processing device according to claim 4, characterized in that: The mounting plate (203) is provided with a copper deposition adjustment mechanism, and the copper deposition adjustment mechanism comprises a first displacement groove (301), two first displacement grooves (301) are provided, and the two first displacement grooves (301) are respectively opened on the first rotating disk (223) and the second rotating disk (224), a first limiting strip (302) is fixedly installed inside the first displacement groove (301), and a first displacement block (303) is slidingly sleeved on the surface of the first limiting strip (302), and the left and right sides of the first eccentric shaft (225) are respectively fixedly connected to the two first displacement blocks (303), and one of the first displacement grooves (301) is fixedly connected to the first rotating disk (223) and the second rotating disk (224). A first adjusting block (304) is fixedly mounted on one end of the first displacement block (303); a first adjusting rod (305) is fixedly mounted on one end of the second rotating disk (224) away from the first rotating disk (223); a second adjusting block (306) is slidably sleeved on the surface of the first adjusting rod (305); a first rotating rod (307) is arranged between the first adjusting block (304) and the second adjusting block (306); one end of the first rotating rod (307) is rotatably sleeved inside the first adjusting block (304); and the other end of the first rotating rod (307) is rotatably sleeved inside the second adjusting block (306).

6. A communication circuit board processing device according to claim 5, characterized in that: A first slip ring (308) is fixedly installed on the side of the second adjustment block (306) away from the second turntable (224), and a first sliding groove (309) is provided on the outer surface of the first slip ring (308). A connecting plate (310) is integrally formed between the two mounting plates (203), and a second movable groove (311) is provided on the connecting plate (310) and passes through the connecting plate (310) from top to bottom. A second movable plate (312) is slidingly sleeved inside the second movable groove (311), and a first retaining ring (313) is fixedly installed on the bottom of the second movable plate (312), and the first slip ring (308) is rotatably sleeved inside the first retaining ring (313).

7. A communication circuit board processing device according to claim 6, characterized in that: The surface of the driving screw rod (220) is fixedly sleeved with a first bevel gear (314), the interior of the support frame (218) is rotatably mounted with a spline sleeve (315), the surface of the spline sleeve (315) is fixedly sleeved with a second bevel gear (316), the first bevel gear (314) and the second bevel gear (316) are meshed with each other, the tops of the two mounting plates (203) are fixedly mounted with a second support plate (317), and a bidirectional screw rod (318) is rotatably mounted between the two second support plates (317).

8. A communication circuit board processing device according to claim 7, characterized in that: A spline shaft (319) is rotatably mounted inside the connecting plate (310), and the spline shaft (319) is slidably sleeved inside the spline sleeve (315). A third bevel gear (320) is fixedly sleeved on the surface of the spline shaft (319), and a fourth bevel gear (321) is fixedly sleeved on the surface of the bidirectional screw rod (318). The third bevel gear (320) and the fourth bevel gear (321) are meshed with each other. A first motor (322) is mounted on the top of one of the mounting plates (203), and an output end of the first motor (322) is connected to the bidirectional screw rod (318).

9. A communication circuit board processing device according to claim 8, characterized in that: A copper plating liquid shaking-off mechanism is arranged on the top of the L-shaped plate (221), and the copper plating liquid shaking-off mechanism comprises a connecting shaft (401), and the connecting shaft (401) is fixedly mounted on a side of the first rotating disk (223) away from the second rotating disk (224), and an eccentric plate (402) is fixedly mounted on one end of the connecting shaft (401) away from the first rotating disk (223), and a straight slot (403) is provided on a side of the eccentric plate (402) away from the connecting shaft (401), and a second eccentric shaft (404) is provided in a sliding sleeve inside the straight slot (403).

10. A communication circuit board processing device according to claim 9, characterized in that: A second motor (405) is installed on the top of the L-shaped plate (221); a third rotating disk (406) is installed on the output end of the second motor (405); a second adjusting rod (407) is fixedly installed on the side of the third rotating disk (406) close to the eccentric plate (402); a fourth rotating disk (408) is fixedly installed on the end of the second adjusting rod (407) close to the eccentric plate (402); a second displacement groove (409) which passes through the fourth rotating disk (408) is opened, a second limiting strip (410) is fixedly installed inside the second displacement groove (409); a second displacement block (411) is slidably sleeved on the surface of the second limiting strip (410); one end of the second displacement block (411) is fixedly connected to the second eccentric shaft (404); the other end of the second displacement block (411) is fixedly installed with a third adjusting block (412); the surface of the second adjusting rod (407) is slidably sleeved with a second displacement block (411); one end of the second displacement block (411) is fixedly connected to the second eccentric shaft (404); the other end of the second displacement block (411) is fixedly installed with a third adjusting block (412); the surface of the second adjusting rod (407) is slidably sleeved with a second displacement block (411); The movable sleeve is provided with a fourth adjustment block (413), a second rotating rod (414) is provided between the third adjustment block (412) and the fourth adjustment block (413), one end of the second rotating rod (414) is rotatably sleeved inside the third adjustment block (412), and the other end of the second rotating rod (414) is rotatably sleeved inside the fourth adjustment block (413), a second hydraulic rod (415) is installed on the top of the L-shaped plate (221), a third movable plate (416) is installed on the output end of the second hydraulic rod (415), a second retaining ring (417) is integrally formed on the top of the third movable plate (416), a second slip ring (418) is fixedly installed on the side of the fourth adjustment block (413) away from the fourth rotating disk (408), a second sliding groove (419) is provided on the outer surface of the second slip ring (418), and the second slip ring (418) is rotatably sleeved inside the second retaining ring (417).

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