Electronic device unit
By designing the material locking connection between the cooler unit and the power unit in the vehicle field, the problems of inefficient and insufficient design diversity of existing cooling systems are solved, and more efficient heat transfer and cooling effects are achieved, reducing costs.
Patent Information
- Application Number
- CN202411880057.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-20
- Filing Date
- 2024-12-19
- Publication Date
- 2025-06-20
AI Technical Summary
In the existing vehicle field, the cooling systems of power modules have problems such as inefficiency and insufficient design diversity, resulting in poor cooling effects and high cost.
By designing an electronic device unit, in which a material-locking connection is formed between the cooler unit and the power unit, a predetermined spacing and brazing connection are utilized to improve heat transfer and cooling efficiency.
Achieve more efficient heat transfer and cooling effects, increase design diversity, and reduce costs, meeting the demand for efficient and inexpensive vehicle components.
Smart Images
Figure CN120186945A_ABST
Abstract
Description
Field of Technology
[0001] The present invention relates to an electronic device unit, a method for manufacturing an electronic device unit, and a vehicle. Background Art
[0002] Currently, in the field of vehicles, there are various different solutions for the cooling of power modules and the construction of cooling systems. Due to the increasing number of power modules in the vehicle field, as well as the increasing cooling requirements and quality requirements, the demand for innovative and robust cooling systems is growing continuously.
[0003] In the vehicle field, weight is continuously reduced to reduce consumption, and competition is becoming increasingly fierce, which leads to cost pressure and an increasing demand for inexpensive and more efficient vehicle components. Summary of the Invention
[0004] The electronic device unit according to the invention having the features of claim 1 has the advantage over known solutions that the heat transfer between the power unit and the cooler unit can be significantly improved, because the heat can be transported away better through the material-locking connection between the power unit and the cooler unit. Another advantage is that the cooler unit can already be pre-assembled so that the power unit can subsequently be pushed in laterally in order to be able to form a material-locking connection. Therefore, a higher design diversity can be achieved in the design of individual power units or power modules, and at the same time standardized double-sided coolers can be used.
[0005] According to the invention, this is achieved in that the electronic device unit has a cooler unit and a power unit. The cooler unit has a first cooling element and a second cooling element, wherein the first cooling element and the second cooling element are arranged at a predetermined distance relative to each other, and the predetermined distance is set for clamping the power unit by means of the first cooling element and by means of the second cooling element so that a material-locking connection can be formed between the power unit and the cooler unit.
[0006] In other words, the cooler unit, such as a double-sided cooler, is designed in such a way that it can clamp the power unit between two cooling elements and then be transported to a furnace in order to form a material-locking connection. Therefore, the assembly of the power unit and its shape can be more diverse.
[0007] The dependent claims indicate preferred improvements of the invention.
[0008] Preferably, the material-locking connection is a soldering connection. The advantage of this embodiment is that the heat generated in the power unit can be transported to the cooler unit in an improved manner, in particular compared to thermal paste or the like, by means of the soldering connection between the cooler unit and the power unit.
[0009] Furthermore preferably, the material-locking connection part has a first connection section and a second connection section, wherein the first connection section provides a first material-locking connection part between the first side part of the power unit and the first cooling element, and wherein the second connection section provides a second material-locking connection part between the second side part of the power unit and the second cooling element.
[0010] The advantage of this embodiment is that the cooling power at the power unit is significantly improved because the cooling area can be significantly increased by means of the material-locking connection parts at the two side parts of the power unit. For example, the power unit has an upper side and a lower side, wherein the upper side is materially locked to the first cooling element, and the lower side is materially locked to the second cooling element. Therefore, the cooling area at the power unit can be significantly increased, and the power unit can also be cooled on both sides. Preferably, the fluid configured to cool the power unit can flow through the cooler unit, in particular through the first cooling element and the second cooling element.
[0011] Furthermore preferably, at least one brazing material is arranged between the cooler unit and the power unit to form the material-locking connection part.
[0012] The advantage of this embodiment is that the solder can be specifically matched according to the surface of the power unit or the surface of the cooler unit to further improve the heat conduction ability.
[0013] Preferably, the brazing material is a plate having a cross-section substantially as large as that of the power unit.
[0014] The advantage of this embodiment is that the brazing material as a plate can be arranged at the power unit and can also be pushed into the cooler unit together with the power unit. Here, the cooling power can be further increased based on the plate-shaped brazing material because there are no bubbles or the like in the brazing layer.
[0015] Another aspect of the present invention relates to a method for manufacturing an electronic device unit, the method having the steps of:
[0016] - Providing a cooler unit having a first cooling element and a second cooling element, wherein the first cooling element and the second cooling element are arranged at a predetermined spacing,
[0017] - Introducing a power unit into the cooler unit,
[0018] - Forming a material-locking connection part between the cooler unit and the power unit.
[0019] The advantage of this embodiment is that the power unit can be laterally pushed into the cooler unit, enabling the omission of thermal paste or the like. Preferably, a pre-assembled cooler unit is provided such that only the power unit needs to be pushed into the cooler unit. Once the power unit is in a predetermined position in the cooler unit, the combination of the power unit and the cooler unit is sent, in particular together with brazing material, into a furnace or the like, enabling a material-locking connection to be formed between the cooler unit and the power unit.
[0020] Furthermore preferably, the method also has the steps of:
[0021] - increasing a predetermined spacing between a first cooling element and a second cooling element by means of a spreading unit,
[0022] - pushing the power unit in while the spacing between the first cooling element and the second cooling element is increased.
[0023] The advantage of this embodiment is that sufficient space is obtained, in particular by spreading the two elements, by briefly increasing the spacing between the first cooling element and the second cooling element such that the power unit can be pushed between the cooling elements. Thereby, additional steps of screwing or mounting the cooling elements at the cooler unit are omitted.
[0024] Furthermore preferably, the method also has the steps of:
[0025] - removing the spreading unit from the cooler unit when the power unit is in a predetermined position, wherein the cooler unit is configured to exert a predetermined force on the power unit after removing the spreading unit.
[0026] The advantage of this embodiment is that the power unit no longer slides relative to the cooler unit during the movement travel between the installation of the power unit in the cooler unit and the furnace for forming the material-locking connection.
[0027] Furthermore preferably, a first orientation for forming the material-locking connection is oriented substantially orthogonally to a second orientation for pushing in the power unit and / or for removing the spreading unit.
[0028] The advantage of this embodiment is that the power unit together with the corresponding brazing material can be pushed between the two cooling elements, and the clamping force exerted by the cooling elements enables a brazing connection between the power unit and the cooler unit to be formed without shrink holes or the like. In this regard, "substantially orthogonal" particularly means a deviation of + / - 15°.
[0029] A further aspect of the present invention relates to a vehicle having an electronic device unit as described previously and hereinafter, and / or an electronic device unit constructed by means of the steps of the method as described previously and hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Embodiments of the present invention will be described in detail hereinafter with reference to the drawings. In the drawings:
[0031] Figure 1 An electronic device unit according to one embodiment is shown.
[0032] Figure 2 and Figure 3 A flowchart showing the steps of a method according to one embodiment is shown.
[0033] Figure 4 A vehicle according to one embodiment is shown. DETAILED DESCRIPTION
[0034] Preferably, all identical elements, units and / or steps are provided with the same reference numerals in all the figures.
[0035] Figure 1 An electronic device unit 10 according to one embodiment is shown. The electronic device unit 10 preferably has a cooler unit 12 and a power unit 14. Furthermore, preferably, the cooler unit 12 has a first cooling element 16 and a second cooling element 18, wherein the first cooling element 16 and the second cooling element 18 are arranged at a predetermined spacing 20 relative to each other, wherein the predetermined spacing 20 is set such that the power unit 14 is clamped by means of the first cooling element 16 and by means of the second cooling element 18, so that a positive connection 22 can be formed between the power unit 14 and the cooler unit 12. Preferably, the positive connection 20 has a first connection section 24 and a second connection section 26. Furthermore, preferably, the first connection section 24 provides a first positive connection between the first side 28 of the power unit 14 and the first cooling element 16. Preferably, the second connection section 26 provides a second positive connection between the second side 30 of the power unit 14 and the second cooling element 26. In addition, preferably, at least one brazing material 32 is arranged between the cooler unit 12 and the power unit 14. As Figure 1 shown, the positive connection 20 preferably forms along a first orientation 34, wherein a second orientation 36 is arranged substantially orthogonally, which second orientation can in particular be used for inserting the S5 power unit 14.
[0036] Figure 2 A flowchart showing the steps of a method 100 for manufacturing an electronic device unit according to one embodiment is shown. The method 100 has the following preferred steps:
[0037] - Provide a cooler unit 12 in which S1 has a first cooling element 16 and a second cooling element 18, wherein the first cooling element 16 and the second cooling element 18 are arranged at a predetermined spacing 20.
[0038] - Introduce the power unit 14 in S2 into the cooler unit 12.
[0039] - Form a material-locking connection 22 in S3 between the cooler unit 12 and the power unit 14.
[0040] Figure 3 A flow chart showing the steps of a method 100 according to one embodiment is shown. Figure 3 The method 100 in preferably has the same steps S1 to S3 as those already explained with respect to Figure 2 Furthermore preferably, the method 100 has a step of increasing S4 the predetermined spacing 20. Furthermore preferably, the method 100 includes a step of pushing in S5 the power unit 14. Furthermore preferably, the method 100 has a step of removing S6 the spreizeinheit.
[0041] Figure 4 A vehicle 200 according to one embodiment is shown. The vehicle 200 preferably has an electronic device unit 10 as described previously and hereinafter. Furthermore preferably, the method 200 has at least one electronic device unit 10 which has been manufactured using the steps of the method 100 as described previously and hereinafter.
Claims
1. An electronic device unit (10), comprising: - a cooler unit (12), - a power unit (14), in, The cooler unit (12) has a first cooling element (16) and a second cooling element (18), wherein the first cooling element (16) and the second cooling element (18) are arranged at a predetermined distance (20) from each other, The predetermined distance (20) is provided for clamping the power unit (14) by means of a first cooling element (16) and by means of a second cooling element (18) so that a material-locked connection (22) can be formed between the power unit (14) and the cooler unit (12).
2. The electronic device unit (10) according to claim 1, wherein: The integrally bonded connection (20) is a soldered connection.
3. The electronic device unit (10) according to any one of the preceding claims, wherein: The integral connection (20) has a first connection section (24) and a second connection section (26). wherein the first connecting section (24) provides a first integrally bonded connection between a first side (28) of the power unit (14) and the first cooling element (16), The second connecting section (26) provides a second integrally bonded connection between a second side (30) of the power unit (14) and the second cooling element (26).
4. The electronics unit (10) according to any one of the preceding claims, wherein: At least one soldering material (32) is arranged between the cooler unit (12) and the power unit (14) in order to form a material-locked connection.
5. The electronic device unit (10) according to claim 4, wherein: The brazing material (32) is a plate having substantially the same cross-section as the power unit (14).
6. A method (100) for producing an electronic device unit (10), comprising the steps of: - providing (S1) a cooler unit (12) having a first cooling element (16) and a second cooling element (18), wherein: The first cooling element (16) and the second cooling element (18) are arranged at a predetermined distance (20) from each other, - introducing (S2) a power unit (14) into the cooler unit (12), - forming (S3) a materially bonded connection (22) between the cooler unit (12) and the power unit (14).
7. The method (100) according to claim 6, further comprising the steps of: - increasing (S4) a predetermined distance (20) between the first cooling element (16) and the second cooling element (18) by means of an expansion unit, - pushing (S5) the power unit (14) in while increasing a predetermined distance between the first cooling element (16) and the second cooling element (18).
8. The method (100) according to claim 7, further comprising the steps of: - when the power unit (14) is located at a predetermined position, removing (S6) the expansion unit from the cooler unit (12), wherein: The cooler unit (12) is provided for generating a predetermined force on the power unit (14) after the expansion unit has been removed.
9. The method (100) according to any one of claims 6 to 8, wherein: A first orientation (34) for forming (S3) a material-locking connection (20) is oriented substantially orthogonally to a second orientation (36) for inserting (S5) the power unit (14) and / or for removing (S6) the expansion unit.
10. A vehicle (200) having an electronics unit (10) according to any one of claims 1 to 5 and / or an electronics unit (10) which has been constructed by the steps of the method (100) according to any one of claims 6 to 9.