Plating device

Abstract

A disorder in an electric field formed between the anode and the substrate is detected. A plating device (10) is provided with: a plating tank (50) for accommodating a plating solution (Q); an anode (21) disposed in the plating bath (50); a substrate holder (40) for holding the substrate (WF) such that the surface (WF1) to be plated faces the anode (21); an anode mask (70) that is disposed between the anode (21) and the substrate holder (40), has an anode opening (70a) that penetrates the anode (21) side and the substrate holder (40) side, and is configured so that the size of the anode opening (70a) can be adjusted; an adjustment plate (30) disposed between the anode mask (70) and the substrate holder (40); a measurement electrode (74) disposed between the anode mask (70) and the adjustment plate (30); a reference electrode (75) disposed in the plating solution (Q) accommodated in the plating bath (50); and a measurer (76) that measures the voltage between the reference electrode (75) and the measurement electrode (74).

Description

Technical Field

[0001] This application relates to a plating apparatus. Background Art

[0002] As an example of an electrolytic plating apparatus, an immersion-type plating apparatus and a cup-type plating apparatus are well known. They have in common that a substrate (e.g., a semiconductor wafer) is held by a substrate holder and immersed in a plating solution, and a voltage is applied between the substrate (cathode) and the anode, whereby a conductive film is deposited on the surface of the substrate. Among the two, the direction in which the surface to be plated of the substrate faces is different. In the immersion-type plating apparatus, the substrate is immersed in the plating solution with the surface to be plated facing sideways, and in the cup-type plating apparatus, the substrate is immersed in the plating solution with the surface to be plated facing downward.

[0003] An immersion-type plating apparatus is disclosed in Patent Document 1. The plating apparatus includes an anode mask for adjusting the electric field between the anode and the substrate. The anode mask is a plate-like member disposed between the anode and the substrate holder, has an opening at the center through which the current flowing between the anode and the substrate passes, and is configured to be able to adjust the diameter of the opening.

[0004] Patent Document 1: Japanese Patent No. 6335763

[0005] The plating apparatus disclosed in Patent Document 1 does not consider detecting the disturbance of the electric field formed between the anode and the substrate.

[0006] That is, a part of the anode mask (e.g., a member for adjusting the diameter of the opening of the anode mask) may deteriorate and break due to chemical changes caused by the plating solution. If a part of the anode mask breaks, the electric field between the anode and the substrate is disturbed, and it is difficult to form a desired film thickness distribution of the plating on the surface to be plated. In addition, not only the anode mask, but also other components disposed in the plating tank may be damaged due to chemical changes caused by the plating solution.

[0007] In addition, in the plating apparatus, it is required to arrange the anode, the anode mask, and the substrate (substrate holder) at appropriate positions with axial alignment. However, if the arrangement position of any component is shifted, the electric field between the anode and the substrate is disturbed, and it is difficult to form a desired film thickness distribution of the plating film. Summary of the Invention

[0008] Therefore, one of the objects of this application is to detect the disturbance of the electric field formed between the anode and the substrate.

[0009] According to one embodiment, a plating apparatus is disclosed, including: a plating bath for containing a plating solution; an anode disposed in the plating bath; a substrate holder for holding a substrate with a surface to be plated facing the anode; an anode mask disposed between the anode and the substrate holder, having an anode opening penetrating through the anode side and the substrate holder side, and configured to be able to adjust the size of the anode opening; an electric field adjusting member disposed between the anode mask and the substrate holder; a measurement electrode disposed between the anode mask and the electric field adjusting member; a reference electrode disposed in the plating solution contained in the plating bath; and a measuring device for measuring the voltage between the reference electrode and the measurement electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a cross-sectional view showing the overall structure of a plating apparatus according to one embodiment.

[0011] Figure 2 is a schematic front view of an anode mask according to one embodiment.

[0012] Figure 3 is a longitudinal cross-sectional view of an anode mask according to one embodiment.

[0013] Figure 4 is a schematic front view of an anode mask according to one embodiment.

[0014] Figure 5 is a schematic front view of an anode mask according to one embodiment.

[0015] Figure 6 is a cross-sectional view showing the overall structure of a plating apparatus according to one embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and repeated descriptions are omitted.

[0017] Figure 1 is a cross-sectional view showing the overall structure of a plating apparatus according to one embodiment. As shown in the figure, the plating apparatus 10 of the present embodiment has: an anode holder 20 configured to hold an anode 21; a substrate holder 40 configured to hold a substrate WF; and a plating bath 50 that houses the anode holder 20 and the substrate holder 40 therein. In the present embodiment, the substrate WF is formed in a disc shape, and the anode 21 is formed in a disc shape corresponding to the shape of the substrate WF.

[0018] As Figure 1As shown, the plating bath 50 includes: a plating treatment bath 52 that houses a plating solution Q containing additives; a plating solution discharge bath 54 that receives and discharges the plating solution Q that overflows from the plating treatment bath 52; and a partition wall 55 that separates the plating treatment bath 52 from the plating solution discharge bath 54.

[0019] The anode support 20 holding the anode 21 and the substrate support 40 holding the substrate WF are immersed in the plating solution Q in the plating treatment bath 52, and the anode 21 and the plating surface WF1 of the substrate WF are arranged to face each other in a substantially parallel manner. In other words, the substrate support 40 holds the substrate WF in a state where the plating surface WF1 faces the side. A voltage is applied to the anode 21 and the substrate WF while they are immersed in the plating solution Q in the plating treatment bath 52. Thereby, metal ions are reduced on the plating surface WF1 of the substrate WF, and a film is formed on the plating surface WF1.

[0020] The plating treatment bath 52 has a plating solution supply port 56 for supplying the plating solution Q into the bath. The plating solution discharge bath 54 has a plating solution discharge port 57 for discharging the plating solution Q that overflows from the plating treatment bath 52. The plating solution supply port 56 is arranged at the bottom of the plating treatment bath 52, and the plating solution discharge port 57 is arranged at the bottom of the plating solution discharge bath 54.

[0021] When the plating solution Q is supplied from the plating solution supply port 56 to the plating treatment bath 52, the plating solution Q overflows from the plating treatment bath 52, crosses the partition wall 55, and flows into the plating solution discharge bath 54. The plating solution Q that has flowed into the plating solution discharge bath 54 is discharged from the plating solution discharge port 57, and impurities are removed by a filter or the like provided in the plating solution circulation device 58. The plating solution Q from which impurities have been removed is supplied to the plating treatment bath 52 via the plating solution supply port 56 by the plating solution circulation device 58.

[0022] The plating apparatus 10 has an anode mask 70 for adjusting the electric field between the anode 21 and the substrate WF. The anode mask 70 is, for example, a substantially plate-shaped member made of a dielectric material and is provided in front of the anode support 20. Here, the front of the anode support 20 refers to the side surface facing the substrate support 40. That is, the anode mask 70 is arranged between the anode 21 and the substrate support 40. The anode mask 70 has an anode opening 70a that penetrates the anode 21 side and the substrate support 40 side in a substantially central portion, in other words, through which the current flowing between the anode 21 and the substrate WF passes. Preferably, the diameter of the anode opening 70a is smaller than the diameter of the anode 21. The anode mask 70 is configured to be able to adjust the diameter of the anode opening 70a. This will be described below.

[0023] Figure 2 is a simplified front view of the anode mask 70. Figure 2 is Figure 1 a view in the direction of line A-A inFigure 2 As shown, the anode mask 70 has a plate-shaped anode mask body 71 and a substantially annular edge portion 73 formed at the center of the anode mask body 71. The anode mask 70 has a plurality of aperture blades 72 configured to be able to adjust the anode opening 70a. The aperture blades 72 are mounted on the edge portion 73 and cooperate to demarcate the anode opening 70a. The aperture blades 72 respectively enlarge or reduce the diameter of the anode opening 70a (adjust the diameter of the anode opening 70a) by the same structure as the aperture mechanism of the camera. Figure 2 The anode opening 70a of the anode mask 70 shown is formed into a non-circular shape (e.g., polygon) by the aperture blades 72. In this case, the diameter of the anode opening 70a refers to the shortest distance between the opposing sides of the polygon or the diameter of the inscribed circle. Alternatively, the diameter of the anode opening 70a can also be defined by the diameter of a circle having an area equivalent to the opening area.

[0024] The aperture blades 72 respectively enlarge or reduce the diameter of the anode opening 70a manually, for example. In addition, the aperture blades 72 can also be configured to be driven by air pressure or electric driving force respectively.

[0025] Referring Figure 1 , the plating apparatus 10 has a regulating plate 30 as an example of an electric field regulating component for regulating the electric field between the anode 21 and the substrate WF. The regulating plate 30 is, for example, a substantially plate-shaped component made of a dielectric material and is disposed between the anode mask 70 and the substrate holder 40 (substrate WF). The regulating plate 30 has a regulating opening 30a that penetrates through the anode 21 side and the substrate holder 40 side, in other words, through which the current flowing between the anode 21 and the substrate WF passes. Preferably, the diameter of the regulating opening 30a is smaller than the diameter of the substrate WF.

[0026] Similar to the anode mask 70, the regulating plate 30 can also be configured to be able to adjust the diameter of the regulating opening 30a by the aperture blades. However, the adjustment of the diameter of the regulating opening 30a is not limited to the aperture blades. For example, by installing an elastic tube on a substantially annular edge portion and allowing a fluid (such as air, nitrogen, or other gases, or water) to enter and exit the cavity inside the elastic tube to expand / contract the elastic tube, the diameter of the regulating opening 30a can be adjusted.

[0027] Preferably, the regulating plate 30 is at a position closer to the substrate holder 40 than the middle position between the anode holder 20 and the substrate holder 40. The closer the regulating plate 30 is disposed to the substrate holder 40, the more accurately the film thickness of the peripheral portion of the substrate WF can be controlled by adjusting the diameter of the regulating opening 30a of the regulating plate 30.

[0028] A paddle 18 is provided between the adjusting plate 30 and the substrate support 40. The paddle 18 is used to stir the plating solution Q near the plated surface WF1 of the substrate WF. One end of the paddle 18 is fixed to the paddle driving device 19. The paddle 18 moves along the plated surface WF1 of the substrate WF through the paddle driving device 19, thereby stirring the plating solution Q.

[0029] The plating apparatus 10 further includes a diaphragm box 60. The diaphragm box 60 is a box-shaped member for accommodating the anode support 20 (anode 21) and the anode mask 70 in the plating tank 50. The diaphragm box 60 has a diaphragm 62 disposed between the anode mask 70 and the adjusting plate 30. The diaphragm 62 is a film that separates the anode region where the anode 21 is disposed from the cathode region where the substrate WF is disposed. The diaphragm box 60 has a plunger 64, and the plunger 64 is used to discharge the plating solution Q from the diaphragm box 60 when the diaphragm box 60 is lifted from the plating tank 50.

[0030] Next, a method for detecting the disturbance of the electric field of the plating apparatus 10 will be described. As Figure 2 shown, the plating apparatus 10 includes a measurement electrode 74 (three measurement electrodes 74-1, 74-2, and 74-3 in the Figure 2 embodiment), a reference electrode 75, and a measuring device 76 that measures the voltage between the reference electrode 75 and the measurement electrode 74.

[0031] In the Figure 2 embodiment, the measurement electrodes 74-1, 74-2, and 74-3 are arranged at equal intervals (120° intervals) on the surface of the anode mask 70 on the substrate support 40 side, around the circumference with respect to the center of the anode opening 70a. More specifically, the measurement electrodes 74-1, 74-2, and 74-3 are arranged on the surface of the aperture blade 72 on the substrate support 40 side. However, the arrangement of the measurement electrode 74 is not limited to Figure 2 the arrangement in the

[0032] embodiment, and it may also be arranged between the anode mask 70 and the adjusting plate 30 (electric field adjusting member). In the case of having a plurality of measurement electrodes 74, each measurement electrode 74 may also be arranged at equal intervals on the circumference centered on the imaginary axis connecting the center of the anode 21 and the center of the substrate WF. The number of measurement electrodes 74 may also be odd. Figure 2 The reference electrode 75 is arranged at a position on the surface of the anode mask 70 on the substrate support 40 side that is farther from the center of the anode mask 70 than the measurement electrodes 74-1, 74-2, and 74-3. However, the arrangement of the reference electrode 75 is not limited to

[0033] Figure 3 is a perspective cross-sectional view of the anode mask 70 and the diaphragm 62 of an embodiment. As Figure 3 shown, the anode mask body 71 has a plate-shaped first anode mask body 71-1 and a plate-shaped second anode mask body 71-2. The first anode mask body 71-1 and the second anode mask body 71-2 are arranged to face each other with a space therebetween. The pattern wiring 77 is disposed in the space between the first anode mask body 71-1 and the second anode mask body 71-2. The pattern wiring 77 can be formed by forming a copper foil pattern on a substrate such as epoxy resin. Since the first anode mask body 71-1 and the second anode mask body 71-2 function as a sealing material, it is possible to prevent the plating solution Q from invading the space inside where the pattern wiring 77 is accommodated.

[0034] The plating apparatus 10 can measure the voltage of the measurement electrode 74 with respect to the reference electrode 75 by the measuring device 76, and thus can detect the disturbance of the electric field formed between the anode 21 and the substrate WF. Hereinafter, an example related to the detection of the disturbance of this electric field will be described.

[0035] Referring to Figure 2 , the plating apparatus 10 has a detection component 80 that is configured to detect the breakage of the anode mask 70 or the adjustment plate 30 (electric field adjustment component) based on the time change of the voltage measured by the measuring device 76. That is, a part of the anode mask 70 (for example, the aperture blade 72 for adjusting the diameter of the anode opening) may deteriorate due to chemical changes caused by the plating solution, resulting in breakage. If a part of the anode mask is broken, the electric field between the anode and the substrate is disturbed, and it is difficult to form a desired film thickness distribution on the surface to be plated. In addition, not only the anode mask 70 but also the adjustment plate 30 may be damaged due to chemical changes caused by the plating solution.

[0036] In contrast, the detection component 80 detects that the voltage of at least one of the measurement electrodes 74-1, 74-2, and 74-3 has changed with respect to the normal state based on the time change of the voltage measured by the measuring device 76. For example, when the aperture blade 72 disposed near the measurement electrode 74-1 is broken, the voltage of the measurement electrode 74-1 changes with respect to the normal state. When the detection component 80 detects that the voltage of the measurement electrode 74-1 has changed with respect to the normal state, it can issue an alarm indicating the possibility that the aperture blade 72 disposed near the measurement electrode 74-1 is broken. In addition, the detection component 80 can issue an alarm and stop the operation of the plating apparatus 10.

[0037] Figure 4 is a simplified front view of the anode mask of an embodiment. As Figure 4As shown, the plating apparatus 10 may also have six measurement electrodes 74-1 to 74-6. In this case, the measurement electrodes 74-1 to 74-6 are arranged at equal intervals (60° intervals) on the surface of the anode mask 70 on the substrate holder 40 side, around the circumference with respect to the center of the anode opening 70a.

[0038] The detection unit 80 is configured to detect breakage of the anode mask 70 or the adjustment plate 30 (electric field adjustment unit) for each of the measurement electrodes 74-1 to 74-6, based on the temporal change in the voltage measured by the measuring device 76. As in the present embodiment, by increasing the number of measurement electrodes 74, the location where the electric field between the anode 21 and the substrate WF is disturbed can be detected more specifically. As a result, for example, when a breakage occurs in the aperture blade 72, the breakage location can be determined more specifically.

[0039] Figure 5 is a simplified front view of an anode mask of an embodiment. This embodiment is an embodiment of a plating apparatus for performing a plating process on a rectangular substrate WF. As Figure 5 shown, the anode opening 70a is formed in a rectangular shape corresponding to the shape of the rectangular substrate WF.

[0040] As Figure 5 shown, the anode mask 70 has a plurality of shielding members 79 (shielding members 79-1, 79-2, 79-3, 79-4) provided on each side of the rectangular anode opening 70a. Each shielding member 79 can move in a direction approaching the center of the anode opening 70a and in a direction away from the center of the anode opening 70a. Further, as Figure 5 shown, the plating apparatus 10 includes a plurality of (four) measurement electrodes 74-1, 74-2, 74-3, 74-4 respectively arranged with respect to each side of the rectangular anode opening 70a.

[0041] The plating apparatus 10 has an opening adjustment unit 90 configured to move the shielding member 79 based on the voltages of the plurality of measurement electrodes measured by the measuring device 76. When the axial alignment of the anode 21, the anode mask 70, and the substrate WF (substrate holder 40) is shifted, the opening adjustment unit 90 can adjust the anode opening 70a.

[0042] That is, it is required that the anode 21, the anode mask 70, and the substrate WF (substrate holder 40) be arranged at appropriate positions with their axes aligned. However, when the arrangement position of any component is shifted, the electric field between the anode and the substrate is disturbed, and it is difficult to form a desired plating film thickness distribution.

[0043] In contrast, the opening adjustment member 90 compares the voltage values of the measurement electrodes on the opposite sides of the anode opening 70a, and based on the comparison result, moves the shielding members 79-1, 79-2, 79-3, 79-4 to adjust the position of the anode opening 70a. For example, the substrate holder 40 is arranged at a position lower than the appropriate position. In this case, the electric field between the anode and the substrate is disturbed. If the voltage of the measurement electrode 74-1 is compared with the voltage of the measurement electrode 74-3, the voltage of the measurement electrode 74-3 may become higher. Based on this comparison result, the opening adjustment member 90 moves the shielding members 79-1, 79-3 downward, thereby moving the anode opening 70a downward. The opening adjustment member 90 can move the shielding members 79-1, 79-3 downward until the voltage of the measurement electrode 74-1 is equal to the voltage of the measurement electrode 74-3. As a result, the disturbance of the electric field between the anode and the substrate is suppressed, and it is easy to form a desired plating film thickness distribution.

[0044] In the above-described embodiment, an immersion-type plating apparatus in which the substrate WF is immersed in the plating solution with the plating surface WF1 facing sideways has been described as an example, but the present invention is not limited thereto. The present invention can also be applied to a cup-type plating apparatus in which the substrate WF is immersed in the plating solution with the plating surface WF1 facing downward. Hereinafter, this will be described.

[0045] Figure 6 It is a cross-sectional view showing the overall structure of a plating apparatus according to an embodiment. Components having the same functions as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

[0046] As Figure 6 shown, the substrate holder 40 is configured to hold the substrate WF in a state where the plating surface WF1 faces downward. The plating apparatus 10 has a resistor 32 (electric field adjustment member), which is arranged between the anode mask 70 and the substrate holder 40 and has a plurality of openings 32a penetrating the anode 21 side and the substrate holder 40 side. The resistor 32 can be, for example, a perforated plate formed with a plurality of punched openings, but is not limited thereto.

[0047] According to the present embodiment, similarly to the above-described embodiment, the plating apparatus 10 can measure the voltage of the measurement electrode 74 with respect to the reference electrode 75 by the measuring device 76, and thus can detect the disturbance of the electric field formed between the anode 21 and the substrate WF. In addition, the plating apparatus 10 includes a detection component 80 configured to detect breakage of the anode mask 70 or the resistor 32 (electric field adjustment component) based on the temporal change of the voltage measured by the measuring device 76. When the detection component 80 detects a change in the voltage of the measurement electrode 74 with respect to the normal state, it can issue an alarm indicating the possibility of breakage of the aperture blade 72 disposed near the measurement electrode 74. In addition, the detection component 80 can issue an alarm and stop the operation of the plating apparatus 10.

[0048] As described above, several embodiments of the present invention have been described. However, the above-described embodiments of the invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its gist, and the present invention naturally includes its equivalents. In addition, within the scope of being able to solve at least a part of the above problems or within the scope of achieving at least a part of the effects, any combination or omission of the respective components described in the claims and the specification can be made.

[0049] The present application discloses, as one embodiment, a plating apparatus including: a plating bath for accommodating a plating solution; an anode disposed in the plating bath; a substrate holder for holding a substrate such that the surface to be plated faces the anode; an anode mask disposed between the anode and the substrate holder, having an anode opening penetrating the anode side and the substrate holder side, and configured to be able to adjust the size of the anode opening; an electric field adjustment component disposed between the anode mask and the substrate holder; a measurement electrode disposed between the anode mask and the electric field adjustment component; a reference electrode disposed in the plating solution accommodated in the plating bath; and a measuring device for measuring the voltage between the reference electrode and the measurement electrode.

[0050] In addition, the present application discloses, as one embodiment, a plating apparatus, wherein the measurement electrode includes a plurality of measurement electrodes arranged at equal intervals on a circumference centered on an imaginary axis connecting the center of the anode and the center of the substrate.

[0051] In addition, the present application discloses, as one embodiment, a plating apparatus, wherein the plurality of measurement electrodes are disposed on the surface of the anode mask on the substrate holder side.

[0052] In addition, in one embodiment of the present application, a plating apparatus is disclosed, which further includes a detection component configured to detect breakage of the anode mask or the electric field adjustment component based on the temporal change of the voltage measured by the above-mentioned measuring device.

[0053] In addition, in one embodiment of the present application, a plating apparatus is disclosed, wherein the anode opening is formed as a rectangle corresponding to the shape of the rectangular substrate held by the substrate holder, the plurality of measurement electrodes are respectively arranged with respect to each side of the rectangular anode opening, the anode mask includes a plurality of shielding components provided on each side of the rectangular anode opening, the plating apparatus further includes an opening adjustment component configured to move the plurality of shielding components in a direction approaching the center of the anode opening or away from the center of the anode opening based on the voltage measured by the above-mentioned measuring device.

[0054] In addition, in one embodiment of the present application, a plating apparatus is disclosed, wherein the substrate holder is configured to hold the substrate with the surface to be plated facing sideways, and the electric field adjustment component includes an adjustment plate having a single adjustment opening penetrating the anode side and the substrate holder side.

[0055] In addition, in one embodiment of the present application, a plating apparatus is disclosed, wherein the substrate holder is configured to hold the substrate with the surface to be plated facing downward, and the electric field adjustment component includes a resistor body having a plurality of openings penetrating the anode side and the substrate holder side.

[0056] Description of Reference Numerals

[0057] 10... plating apparatus; 21... anode; 30... adjustment plate; 30a... adjustment opening; 32... resistor body; 32a... opening; 40... substrate holder; 50... plating bath; 70... anode mask; 70a... anode opening; 74... measurement electrode; 75... reference electrode; 76... measuring device; 79... shielding component; 80... detection component; 90... opening adjustment component; Q... plating solution; WF... substrate; WF1... surface to be plated.

Claims

1. A plating device, characterized in that, Comprising: A plating bath for containing a plating solution; An anode disposed in the plating bath; A substrate holder for holding a substrate with the surface to be plated facing the anode; An anode mask disposed between the anode and the substrate holder, having an anode opening penetrating the anode side and the substrate holder side, and the anode mask is configured to be able to adjust the size of the anode opening; An electric field adjusting member disposed between the anode mask and the substrate holder; A measurement electrode disposed between the anode mask and the electric field adjusting member; A reference electrode disposed in the plating solution contained in the plating bath; And A measuring device for measuring the voltage between the reference electrode and the measurement electrode.

2. The plating device according to claim 1, characterized in that, The measurement electrode includes a plurality of measurement electrodes arranged at equal intervals on a circumference centered on an imaginary axis connecting the center of the anode and the center of the substrate.

3. The plating device according to claim 2, characterized in that, The plurality of measurement electrodes are disposed on the surface of the anode mask on the substrate holder side.

4. The plating device according to any one of claims 1 to 3, characterized in that, Further comprising a detection member configured to detect damage to the anode mask or the electric field adjusting member based on the time variation of the voltage measured by the measuring device.

5. The plating device according to claim 2 or 3, characterized in that, The anode opening is formed as a rectangle corresponding to the shape of the rectangular substrate held by the substrate holder, The plurality of measurement electrodes are respectively arranged with respect to each side of the rectangular anode opening, The anode mask includes a plurality of shielding members provided on each side of the rectangular anode opening, The plating apparatus further includes an opening adjusting member configured to move the plurality of shielding members in a direction approaching the center of the anode opening or away from the center of the anode opening based on the voltage measured by the measuring device.

6. The plating device according to claim 1, characterized in that, The substrate holder is configured to hold the substrate with the surface to be plated facing sideways, The electric field adjusting member includes an adjusting plate having a single adjusting opening penetrating the anode side and the substrate holder side.

7. The plating device according to claim 1, characterized in that, The substrate holder is configured to hold the substrate with the surface to be plated facing downward, The electric field adjusting member includes a resistor body having a plurality of openings penetrating the anode side and the substrate holder side.

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