Laser welding equipment and transposition device thereof

Abstract

The invention discloses a transposition device of laser welding equipment. The transposition device comprises a mounting body, a pickup head, an adjusting mechanism and an optical element, the pick-up head is fixedly arranged on the installation body and comprises a pick-up face and a light receiving face. The pickup surface picks up a plurality of light-emitting elements by a pickup force. The light receiving surface faces the pickup surface. The adjusting mechanism is arranged on the mounting body. The optical element is connected with the adjusting mechanism, faces the light receiving surface at intervals, and comprises a plurality of micro lenses. The optical element is used for receiving laser light, and the laser light is processed into multiple welding light beams through the multiple micro lenses and projected to the light receiving face. Wherein the adjusting mechanism translates the position of the optical element relative to the pickup head so as to change the relative position of the plurality of welding beams correspondingly projected to the light receiving surface, so that at least one of the plurality of picked light emitting elements is welded to the circuit substrate.

Description

Technical Field

[0001] The present invention relates to a mass transfer welding device, and more particularly to a laser welding device and its transposition device. Background Art

[0002] At present, the operation of the pickup head of the mass transfer welding device is to first move to the relative position of the temporary substrate, complete alignment with the target light-emitting elements on the temporary substrate, and then pick up the elements. Next, it moves from the temporary substrate to the circuit substrate, aligns the picked-up light-emitting elements with the pixels of the circuit substrate, and then bonds them. Finally, the bonded light-emitting elements and the pixels of the circuit substrate are welded together by welding.

[0003] Since the current transfer welding method requires the number of elements picked up each time to be the same as the distribution of some pixels of the circuit substrate, after each single welding operation, it is necessary to return to the temporary substrate to pick up the next batch of light-emitting elements. Such repeated back-and-forth and alignment times consume a lot of time, resulting in poor production efficiency. Summary of the Invention

[0004] In view of the problems existing in the above-mentioned prior art, the laser welding device and its transposition device of the present invention are not limited by the number and distribution of pixels of the circuit substrate, and can pick up more light-emitting elements at one time and weld them on the circuit substrate one by one.

[0005] To achieve the above object, the laser welding device of the present invention includes a workbench, a laser device, and a transposition device. The workbench is used to carry a circuit substrate. The laser device is arranged on the workbench and is used to project a laser beam. The transposition device is arranged on the workbench and includes a mounting body, a pickup head, an adjustment mechanism, and an optical element. The pickup head is fixedly arranged on the mounting body and includes a pickup surface and a light-receiving surface. The pickup surface picks up a plurality of light-emitting elements by a pickup force. The light-receiving surface faces the pickup surface. The adjustment mechanism is arranged on the mounting body. The optical element is connected to the adjustment mechanism, is spaced from and faces the light-receiving surface, and includes a plurality of microlenses arranged in an array. The optical element is used to receive the laser beam and process it into multiple welding beams through the plurality of microlenses and project them onto the light-receiving surface. Wherein, when the picked-up plurality of light-emitting elements are bonded to the circuit substrate, the adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light-receiving surface, so as to weld at least one of the picked-up plurality of light-emitting elements to the circuit substrate.

[0006] In this way, the laser welding device of the present invention can pick up more light-emitting elements each time through the pickup head of the transposition device, and translate the optical element through the adjustment mechanism, so that the microlenses are aligned with the picked-up light-emitting elements at different positions each time, and the light-emitting elements are welded to the circuit substrate batch by batch, thereby reducing the time consumed by the current repeated back-and-forth and alignment of the transposition device.

[0007] To achieve the above object, the transposition device of the laser welding equipment of the present invention includes a mounting body, a pickup head, an adjustment mechanism, and an optical element. The pickup head is fixedly arranged on the mounting body and includes a pickup surface and a light-receiving surface. The pickup surface picks up a plurality of light-emitting elements by a pickup force. The light-receiving surface faces the pickup surface. The adjustment mechanism is arranged on the mounting body. The optical element is connected to the adjustment mechanism, is spaced apart from and faces the light-receiving surface, and includes a plurality of microlenses. The optical element is used to receive laser light and process it into multiple welding beams through the plurality of microlenses and project them onto the light-receiving surface. Among them, the adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light-receiving surface, so as to weld at least one of the picked-up plurality of light-emitting elements to the circuit board.

[0008] In this way, the pickup head of the transposition device of the laser welding equipment of the present invention picks up more light-emitting elements each time, and the adjustment mechanism translates the optical element so that the microlenses are aligned with the picked-up light-emitting elements at different positions each time, and the light-emitting elements are welded to the circuit board batch by batch, so as to reduce the time consumed by the current transposition device for repeated round trips and alignment.

[0009] The detailed structure or features of the laser welding equipment and its transposition device provided by the present invention will be described in detail in the subsequent detailed description of the embodiments. However, those skilled in the art should understand that this detailed description and the specific embodiments listed for implementing the present invention are only for explaining the present invention and are not used to limit the scope of the patent application of the present invention. Description of the Drawings

[0010] Figure 1 is a schematic diagram of an embodiment in which a temporary substrate and a circuit board are located on the laser welding equipment of the present invention;

[0011] Figure 2 is Figure 1 a cross-sectional schematic diagram of the transposition device in

[0012] Figure 3 is Figure 1 a top view schematic diagram of the transposition device in Figure 2 but omitting the upper part structure of the mounting body in

[0013] Figure 4 is a schematic diagram of the transposition device picking up the light-emitting elements of the temporary substrate;

[0014] Figure 5 is a schematic diagram of the laser device welding the picked-up light-emitting elements to the circuit board through the transposition device;

[0015] Figure 6 is a continuation of Figure 5 and is a schematic diagram of the transposition device being moved above the circuit board;

[0016] Figure 7 is a continuation Figure 6 , a schematic diagram showing that the transposition device again attaches the picked-up light-emitting elements to the circuit board and aligns the microlenses of the optical elements with the respective light-emitting elements for welding;

[0017] Among them, reference numerals:

[0018] 10: Laser welding equipment

[0019] 11: Workbench

[0020] 13: Laser device

[0021] 131: Laser light

[0022] 15: Transposition device

[0023] 151: Mounting body

[0024] 1511: Upper mounting part

[0025] 1513: Lower mounting part

[0026] 153: Pickup head

[0027] 1531: Pickup surface

[0028] 1533: Light-receiving surface

[0029] 155: Adjustment mechanism

[0030] 1551: First driving member

[0031] 1552: First single-axis slide

[0032] 1553: First double-axis slide

[0033] 1554: Second driving member

[0034] 1555: Second single-axis slide

[0035] 1556: Second double-axis slide

[0036] 1557: First movement axis

[0037] 1558: Second movement axis

[0038] 157: Optical element

[0039] 1571: Microlens

[0040] 20: Temporary substrate

[0041] 30: Circuit board

[0042] 31: Pixel

[0043] 33: Solder Pad

[0044] 50: Light-emitting Element

[0045] 51: Metal Block. Detailed Embodiment

[0046] The applicant hereby states that throughout the specification, including the embodiments described below and the claims of the patent application, the directional terms are based on the directions in the drawings. Secondly, in the embodiments and drawings to be described below, the same reference numerals represent the same or similar elements or their structural features.

[0047] As Figure 1 shown, the laser welding device 10 of the present invention includes a workbench 11, a laser device 13, and a transfer device 15. The workbench 11 is used to carry a temporary substrate 20 and a circuit board 30. The temporary substrate 20 is used to temporarily fix a plurality of light-emitting elements (such as LEDs) 50 for subsequent transfer procedures. The circuit board 30 has a plurality of pixels 31. In this embodiment, each pixel 31 includes three pairs of solder pads 33, and each pair of solder pads 33 is used to connect the light-emitting element 50. The three pairs of solder pads 33 are respectively used to connect the light-emitting elements 50 of the three primary colors (such as red light, blue light, and green light).

[0048] In other embodiments, the temporary substrate 20 can also be placed on other carriers, and is not limited to being provided on the workbench 11 of the laser welding device 10.

[0049] The laser device 13 is disposed on the workbench 11 and is used to project a laser beam. Although the laser device 13 is shown above the transfer device 15 in the figure, in fact, the laser device 13 can also be disposed at other positions and is not limited to being disposed above the transfer device 15.

[0050] The transfer device 15 is disposed on the workbench 11 and is located at a relative position to the laser device 13 and is used to receive the laser beam. Among them, the transfer device 15 can move from the temporary substrate 20 to the circuit board 30, or return from the circuit board 30 to the temporary substrate 20. When the transfer device 15 is located at a relative position to the temporary substrate 20, the transfer device 15 is moved close to the temporary substrate 20 to pick up the light-emitting element 50 on the temporary substrate 20. When the transfer device 15 is located at a relative position to the circuit board 30, the transfer device 15 is moved close to the circuit board 30 to make the picked-up light-emitting element contact the solder pads of the pixels of the circuit board 30, so as to weld the light-emitting element 50 to the corresponding solder pads of the pixels of the circuit board 30 through the laser beam.

[0051] As Figure 2As shown, the transposing device 15 includes a mounting body 151, a pick-up head 153, an adjustment mechanism 155, and an optical element 157.

[0052] The mounting body 151 has a hollow structure, and an upper mounting portion 1511 and a lower mounting portion 1513 can be distinguished from the hollow structure. The upper mounting portion 1511 is used for setting the adjustment mechanism 155 and the optical element 157, and the lower mounting portion 1513 is used for setting the pick-up head 153.

[0053] The pick-up head 153 is fixedly arranged on the mounting body 151, and includes a pick-up surface 1531 and a light-receiving surface 1533. The pick-up head 153 is made of an elastic polymer material (such as PDMS) and has optical transparency characteristics. The pick-up surface 1531 picks up the light-emitting element 50 by a pick-up force, such as the viscosity of PDMS itself, or a viscous adhesive is formed on the pick-up surface 1531. The light-receiving surface 1533 faces away from the pick-up surface 1531.

[0054] The adjustment mechanism 155 is arranged on the mounting body 151. The optical element 157 is connected to the adjustment mechanism 155, faces the light-receiving surface 1533, and includes a plurality of microlenses 1571 arranged in an array. The optical element 157 is used to receive the laser light 131 and process it into multiple welding beams 133 through the plurality of microlenses 1571 and project them onto the light-receiving surface 1533. The position where the welding beam 133 is projected on the light-receiving surface is related to the focus of the light condensation of the microlens 1571, and the focus of the light condensation of the microlens 1571 is fixed.

[0055] In order to change the position where the welding beam is projected on the light-receiving surface 1533, the adjustment mechanism 155 can translate the optical element 153, so that the position where the welding beam is projected on the light-receiving surface 1533 is changed.

[0056] As Figure 3 shown, the adjustment mechanism 155 includes a first driving member 1551, a first single-axis slide 1552, a first two-axis slide 1553, a second driving member 1554, a second single-axis slide 1555, and a second two-axis slide 1556. The first driving member 1551 and the second driving member 1554 are taken as motors, and in other embodiments, pneumatic pistons, linear elements, etc. can also be used. The first single-axis slide 1552 and the second single-axis slide 1555 are the same components and are composed of a track, so that the first driving member 1551 and the second driving member 1554 can slide along the track. The first two-axis slide 1553 and the second two-axis slide 1556 are the same components and are composed of a slide rail arranged on the first movement axis and a slide rail arranged on the second movement axis.

[0057] The first driving member 1551 is connected to the optical element 153 and is used to drive the optical element 153 along the first movement axis 1557, and the first movement axis 1557 is, for example, the X-axis direction of a two-dimensional plane. The first single-axis slide 1552 is connected to the first driving member 1551 to allow the first driving member 1551 to slide along the second movement axis (for example, the Y-axis direction of the two-dimensional plane) 1558. The first double-axis slide 1553 is connected to the optical element 153 and is located at a relative position to the first driving member 1551 on the first movement axis 1557. The second movement axis direction 1558 is perpendicular to the first movement axis direction 1557

[0058] The second driving member 1554 is connected to the optical element 153 and is used to drive the optical element 153 along the second movement axis direction 1558. The second single-axis slide 1555 is connected to the second driving member 1554 to allow the second driving member 1554 to slide along the first movement axis 1557. The second double-axis slide 1556 is connected to the optical element 153 and is located at a relative position to the second driving member 1554 on the second movement axis. In this way, the optical element 153 is driven to translate by adjusting the two first driving members 1551 or the two second driving members 1554 of the adjusting mechanism 155, and during the translation process, the optical element 153 can stay at the target position through the configuration of each slide to adjust the relative position of the welding beam projected on the light-receiving surface

[0059] Among them, the driving by the motor is to obtain a relatively stable, fast and accurate positioning. Although in this embodiment, a motor and each slide are respectively arranged on the X-axis and the Y-axis, in other embodiments, when only single-axis translation is required, only one motor and a corresponding slide can also be respectively arranged in the X-axis or Y-axis direction

[0060] Subsequently, through Figures 4 to 7 the operation of the laser welding device 10 is described Figures 4 to 7 the laser device is omitted in the figure, and only the laser light 131 generated by the laser device is shown. Furthermore, the adjusting mechanism is described by taking the two first driving members 1551 in the X-axis direction as an example. Since the operation and purpose of the second driving member are substantially the same as those of the first driving member, the difference lies in the movement in different axial directions. Therefore, the operation of the second driving member will not be described in detail

[0061] As Figure 4 shown, the transposition device 15 moves to the relative position of the temporary substrate 20 and presses down to attach the pickup surface 1531 of the pickup head 153 to the light-emitting element 50. Subsequently, the transposition device 15 moves upward to pick up eight light-emitting elements 50

[0062] As Figure 5As shown, the transposition device 15 moves rightward above the circuit board 30 so that the metal block 51 of the picked-up light-emitting element 50 contacts the solder pad 33. In the figure, there are a total of eight picked-up light-emitting elements 50, but only the metal blocks 51 of four light-emitting elements 50 contact the solder pad 33, and the metal blocks 51 of the other four light-emitting elements 50 do not contact the solder pad 33. Subsequently, the laser light 131 projected by the laser device is directed to the transposition device 15 so that the microlens 1571 of the optical element 157 focuses and projects a welding beam 133. The four welding beams 133 are correspondingly projected onto the metal blocks 51 of the four light-emitting elements 50 that are in contact with the solder pad 33, and the welding is completed.

[0063] Figure 5 After the welding is completed, as Figure 6 shown, the transposition device 15 moves upward away from the position of the solder pad 33 where the welding has been completed. At this time, there are still four light-emitting elements 50 on the transposition device 15 that have not been welded. Then, it moves rightward to an adjacent pixel area. In this way, the transposition device 15 of the laser welding equipment of the present invention can pick up more light-emitting elements 50, and after the previous welding operation, it can directly move to an adjacent pixel area to reduce the moving distance and time, and can improve the travel of repeatedly shuttling between the temporary substrate 20 and the circuit board 30.

[0064] Figure 6 In the middle, the focus of the microlens 1571 is not aligned with the attached light-emitting element 30. Subsequently, after the metal block 51 of the picked-up light-emitting element 50 is aligned with the solder pad 33, it can then contact the solder pad 33 downward, as Figure 7 shown. Then, the drive shaft of the first drive member 1551 drives the optical element 157 rightward along the X-axis, and the first biaxial slide 1553 connected to the other end of the optical element 157 can also slide to a position along the slide rail of the first motion axis through the configuration of the first biaxial slide 1553 to make the microlens 1571 correspond one-to-one to the picked-up light-emitting element 50. Although not shown in the figure, it can be understood that when the optical element 157 translates rightward, the second drive member can slide rightward to a position along the slide rail of the first motion axis through the configuration of the second single-axis slide and the second biaxial slide. Then, the laser light 131 projected by the laser device is again directed to the transposition device 15 so that the microlens 1571 of the optical element 157 focuses and projects a welding beam 133. The four welding beams 133 are correspondingly projected onto the metal blocks 51 of the four light-emitting elements 50 that are in contact with the solder pad 33, and the welding is completed. In this way, the laser welding equipment of the present invention can effectively reduce the time and distance for the transposition device 15 to shuttle between the temporary substrate 20 and the circuit board 30, and can reduce the number of pick-up and alignment times on the temporary substrate 20, and can effectively improve the production efficiency.

[0065] Among them, the distance that the first driving member 1551 of the adjustment mechanism translates the optical element 157 is related to the distance adjacent to the light-emitting element 50 picked up by the picking surface of the picking head 153, that is, it moves to the picked-up light-emitting element 50 to be welded next time, and this distance is much shorter than the round-trip distance of the substrate 20 and the circuit board 30. In other embodiments, the picking head 153 may also pick up more or fewer light-emitting elements 50, and is not limited to those illustrated and described in this embodiment.

[0066] Finally, the components disclosed in the foregoing embodiments of the present invention are only for illustrative purposes and are not intended to limit the scope of the present invention. The substitution or variation of other equivalent components should also be covered by the scope of the patent application of the present invention.

Claims

1. A laser welding device, characterized in that: include: A workbench for carrying a circuit substrate; A laser device, disposed on the workbench and used for projecting a laser light; and A transfer device is arranged on a workbench and includes a mounting body, a pickup head, an adjustment mechanism and an optical element. The pickup head is fixedly arranged on the mounting body and includes a pickup surface and a light receiving surface. The pickup surface picks up a plurality of light emitting elements through a pickup force, and the light receiving surface faces away from the pickup surface. The adjustment mechanism is arranged on the mounting body. The optical element is connected to the adjustment mechanism, and The optical element is arranged at intervals facing the light-receiving surface and includes a plurality of micro lenses arranged in an array. The optical element is used to receive the laser light and process it into a plurality of welding beams through the plurality of micro lenses and project them onto the light-receiving surface. When the plurality of light-emitting elements picked up are attached to the circuit substrate, the adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the plurality of welding beams projected onto the light-receiving surface to weld at least one of the plurality of light-emitting elements picked up to the circuit substrate.

2. The laser welding equipment according to claim 1, characterized in that in, The adjustment mechanism includes a first driving member connected to the optical element and used for driving the optical element along a first movement axis.

3. The laser welding equipment according to claim 2, characterized in that in, The adjustment mechanism includes a first uniaxial slide, a second driving member and a second uniaxial slide. The first uniaxial slide is connected to the first driving member to allow the first driving member to slide along a second motion axis. The second driving member is connected to the optical element and is used to drive the optical element along the second motion axis. The second uniaxial slide is connected to the second driving member to allow the second driving member to slide along the first motion axis. The second motion axis is perpendicular to the first motion axis.

4. The laser welding equipment according to claim 3, characterized in that in, The adjustment mechanism includes a first biaxial slide and a second biaxial slide. The first biaxial slide is connected to the optical element and is located at a relative position to the first driving component on the first motion axis. The second biaxial slide is connected to the optical element and is located at a relative position to the second driving component on the second motion axis. The first biaxial slide and the second biaxial slide allow the optical element to slide on the first motion axis and the second motion axis.

5. The laser welding equipment according to claim 4, characterized in that: in, The first driving component and the second driving component respectively include a motor.

6. The laser welding equipment according to claim 1, characterized in that in, The distance that the adjustment mechanism translates the optical element is related to the distance between adjacent light-emitting elements among the plurality of light-emitting elements picked up by the picking surface of the picking head.

7. A transposition device for laser welding equipment, characterized in that: include: - installing the main body; A pick-up head is fixedly arranged on the mounting body and comprises a pick-up surface and a light-receiving surface. The pick-up surface picks up a plurality of light-emitting elements through a pick-up force, and the light-receiving surface faces away from the pick-up surface. an adjustment mechanism disposed on the mounting body; and An optical element is connected to the adjustment mechanism and faces the light receiving surface at intervals and includes a plurality of micro lenses. The optical element is used to receive the laser light and process it into multiple welding beams through the multiple micro lenses and project them onto the light receiving surface. The adjustment mechanism translates the position of the optical element relative to the pickup head to change the relative position of the multiple welding beams projected onto the light receiving surface to weld at least one of the multiple light emitting elements picked up.

8. The transfer device of the laser welding equipment according to claim 7, characterized in that: in, The adjustment mechanism includes a first driving member connected to the optical element and used for driving the optical element along a first movement axis.

9. The transfer device of the laser welding equipment according to claim 8, characterized in that: in, The adjustment mechanism comprises a first uniaxial slide, a second driving member and a second uniaxial slide. The first uniaxial slide is connected to the first driving member to allow the first driving member to slide along a second movement axis. The second driving member is connected to the optical element and is used to drive the optical element along the second movement axis. The second uniaxial slide is connected to the second driving member to allow the second driving member to slide along the first movement axis. The second movement axis is perpendicular to the first movement axis.

10. The transfer device of the laser welding equipment according to claim 7, characterized in that: in, The adjustment mechanism includes a first biaxial slide and a second biaxial slide. The first biaxial slide is connected to the optical element and is located at a relative position to the first driving component on the first motion axis. The second biaxial slide is connected to the optical element and is located at a relative position to the second driving component on the second motion axis. The first biaxial slide and the second biaxial slide allow the optical element to slide on the first motion axis and the second motion axis.

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