Chip soldering device with automatic positioning function

Abstract

The application discloses a chip welding device with automatic positioning function and relates to the technical field of chip welding.The chip welding device comprises a machine table, a positioning plate, a suction unit and a welding unit, wherein the positioning plate, the suction unit and the welding unit are all installed on the machine table, the positioning plate is provided with an adjusting mechanism and two positioning pins, the adjusting mechanism and the two positioning pins are used for clamping a substrate, the suction unit is connected with a control system circuit, the suction unit comprises a moving mechanism and a suction mechanism, the suction mechanism is installed on the moving mechanism, and the suction mechanism is used for sucking a chip; the moving mechanism is used for automatically positioning the chip; and the welding unit is used for welding the chip on the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip welding, and particularly relates to a chip welding device with automatic positioning function. BACKGROUND

[0002] With the development of electronic devices towards miniaturization and high density, the chip welding process puts forward higher requirements on positioning accuracy and compatibility. The traditional chip welding device usually uses a vacuum suction claw or a mechanical clamping claw to fix the chip. However, the existing suction claw structure has the following defects. The suction nozzle size is fixed, and it is difficult to adapt to different specifications of chips. The suction nozzle needs to be frequently replaced, which leads to reduced production efficiency and increased operation and maintenance costs. The rigid clamping is easy to cause damage to the edge of the chip, especially for the chip with high mechanical stress sensitivity of ultra-thin chip or brittle material. The traditional suction claw lacks self-adaptive adjustment capability. In the automatic positioning process, the pad is deviated due to size deviation, which affects the welding yield.

[0003] Although some improved schemes try to alleviate the compatibility problem through a multi-nozzle array or an elastic material, the adjustment range is limited and depends on manual intervention, which is difficult to meet the real-time demand of self-adaptive positioning of the high-speed production line. In the prior art, the contact area between the suction nozzle and the chip is uncontrollable, which is easy to cause unstable suction of small-size chips or uneven local stress of large-size chips. SUMMARY

[0004] The present application relates to the technical field of chip welding, and particularly relates to a chip welding device with automatic positioning function.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a chip welding device with automatic positioning function, comprising a machine table, a positioning plate, a suction unit and a welding unit, the positioning plate, the suction unit and the welding unit are all installed on the machine table, the positioning plate is provided with an adjusting mechanism and two positioning pins, the adjusting mechanism and the two positioning pins clamp the substrate, the suction unit is connected with a control system circuit, the suction unit comprises a moving mechanism and a suction mechanism, the suction mechanism is installed on the moving mechanism, and the suction mechanism suctions the chip, the moving mechanism automatically positions the chip, and the welding unit welds the chip to the substrate.

[0006] Further, the positioning plate is rectangular, and a bolt and a pair of sliding groove plates are arranged at the center positions of two adjacent edges of the positioning plate, the bolt is located at the center of the pair of sliding groove plates, a pressing plate is slidingly installed between each pair of sliding groove plates, a through hole is formed in the center of the pressing plate, the bolt passes through the through hole, a hexagonal nut is screwed on the bolt, and the hexagonal nut is located above the pressing plate. The operator places the substrate on the positioning plate, first presses one corner of the substrate against the two positioning pins to preliminarily position the substrate, and then clamps the substrate by using the adjusting mechanism to prevent movement during welding.

[0007] Further, the adjusting mechanism comprises a first connecting rod, a second connecting rod and a movable clamp, the first connecting rod and the second connecting rod are the same in structure, a sliding groove is formed on the first connecting rod, the sliding groove slides along the bolt, a right-angle groove is formed on the movable clamp, the movable clamp is rotatably connected with the first connecting rod and the second connecting rod respectively, the first connecting rod and the second connecting rod are located between the positioning plate and the pressing plate, the operator moves the movable clamp to make the right-angle groove flush with the other corner of the base plate, then tightens the hexagonal nut, the first connecting rod and the second connecting rod are pressed by the pressing plate, the movable clamp is fixed, the base plate is fixed, the fixed first connecting rod and the second connecting rod form a stable triangular connection, which ensures that the movable clamp cannot be moved at will, and through the movable clamp which can be adjusted, different specifications of base plates can be fixed to meet the welding requirements in different situations.

[0008] Further, the moving mechanism comprises a pair of side supports, a pair of upper layer guide rails, a pair of sliding supports, a pair of synchronous sprocket assemblies, a pair of chains, a support shaft and a lead screw, a pair of the upper layer guide rails are symmetrically installed between a pair of side supports, a pair of the sliding supports are slidably installed on a pair of the upper layer guide rails, a pair of the synchronous sprocket assemblies are rotatably installed at two ends of a pair of the upper layer guide rails, a second servo motor is installed on one of the side supports, the second servo motor is connected with one of the synchronous sprocket assemblies, the second servo motor drives the synchronous sprocket assembly to rotate, the synchronous sprocket assembly drives two chains to move, the chains drive two sliding supports to move simultaneously, and drive the adsorption mechanism to move along the direction of the upper layer guide rails.

[0009] Further, each of the synchronous sprocket assemblies is composed of two sprockets and a rotating shaft, the two sprockets are coaxially installed at two ends of the rotating shaft, a pair of the chains are symmetrically connected between two synchronous sprocket assemblies, two sliding supports are respectively connected at the middle parts of the two chains, the support shaft and the lead screw are rotatably installed between a pair of the sliding supports, a first servo motor is arranged on one of the sliding supports, and a motor shaft of the first servo motor is coaxially connected with the lead screw.

[0010] Further, the adsorption mechanism comprises a case, a sleeve, a hollow screw, a baffle, a hollow cup motor and a nut, the sleeve is connected at the bottom of the case, a hollow sliding sleeve and an internally threaded rotating sleeve are arranged at the bottom of the case, the hollow sliding sleeve is slidably connected with the support shaft, and the internally threaded rotating sleeve is threadedly connected with the lead screw, the first servo motor drives the lead screw to rotate, the lead screw drives the case to slide along the direction of the support shaft, and under the control of the first servo motor and the second servo motor, the case moves along the directions of two coordinate axes, so that the adsorption mechanism can be fixed to any position on the base plate.

[0011] Further, the hollow cup motor is installed at the bottom of the sleeve, the nut is installed at the inner ring of the hollow cup motor, the hollow screw is screwed with the nut, a sliding groove is formed in the hollow screw, the bottom of the sleeve is provided with a limiting block, the limiting block is in sliding connection with the sliding groove of the hollow screw, and the baffle is connected to the top of the hollow screw.

[0012] Further, the air pump is arranged in the case, the air suction end of the air pump is connected with the hollow screw through an air suction pipe, the bottom of the hollow screw is connected with a cross-shaped suction claw, a cross-shaped groove is formed in the bottom of the cross-shaped suction claw, the cross-shaped groove is in communication with the hollow part of the hollow screw, the hollow cup motor drives the nut to rotate, controls the up-down sliding of the hollow screw in the sleeve, the hollow screw drives the cross-shaped suction claw to descend, and the cross-shaped suction claw stops moving after contacting the chip, the air pump sucks air through the air suction pipe, the air pressure in the cross-shaped groove is reduced to generate negative pressure to suck the chip, the hollow cup motor drives the nut to rotate to control the rising of the hollow screw, the chip is lifted and moved to the position to be welded, the welding machine group welds the chip to the substrate by using the laser welding mode, the air pump stops sucking air, the negative pressure in the air suction pipe disappears, and the cross-shaped suction claw releases the chip.

[0013] Further, four electromagnetic springs are evenly arranged in the cross-shaped suction claw, the four electromagnetic springs are connected with the control system circuit, the cross-shaped suction claw is made of flexible material, the electromagnetic spring controls the length of the cross-shaped suction claw extending to the outer ring by controlling the size of the current, the cross-shaped suction claw extends to the outer ring to the longest under the condition of no electricity, under the condition of electricity, the higher the current intensity, the shorter the electromagnetic spring contracts, and the smaller the cross-shaped suction claw contracts, the size of the current of the electromagnetic spring is adjusted to realize the adjustment of the contour of the cross-shaped suction claw to adapt to the adsorption of chips of different sizes, the cross-shaped suction claw is made of flexible material, even if the cross-shaped suction claw is deformed after the electromagnetic spring is elongated, the cross-shaped suction claw can still be flexibly attached to the chip after contacting the chip, the cross-shaped groove forms a sealed state, the cross-shaped suction claw is elongated for adsorption of large chips, and the cross-shaped suction claw is contracted for adsorption of small chips, the contact area is adjusted to make the adsorption more firm and reduce shaking in the carrying process.

[0014] Compared with the prior art, the beneficial effects of the present application are:

[0015] The fixed first connecting rod and the second connecting rod form a stable triangular connection, so that the movable clamp cannot be moved at will, different specifications of substrates can be fixed through the adjustable movable clamp, and the welding requirements under different conditions can be met, the size of the current of the electromagnetic spring is adjusted to realize the adjustment of the contour of the cross-shaped suction claw to adapt to the adsorption of chips of different sizes, the contact area is adjusted to make the adsorption more firm and reduce shaking in the carrying process. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The overall structure of the present application is shown in the figure Figure One ;

[0017] Figure 2 The overall structure of the present application is shown in the figure Figure Two ;

[0018] Figure 3 The structure of the adsorption unit of the present application is shown in the figure

[0019] Figure 4 The structure of the adsorption mechanism of the present application is shown in the figure

[0020] Figure 5 The connection structure of the hollow screw of the present application is shown in the figure

[0021] Figure 6 The structure of the positioning plate part of the present application is shown in the figure.

[0022] In the figure: 1, machine table; 2, positioning plate; 3, side support; 4, upper guide rail; 5, sliding support; 6, synchronous sprocket assembly; 7, chain; 8, support shaft; 9, lead screw; 10, first servo motor; 11, machine box; 12, sleeve; 13, hollow screw; 14, baffle; 15, hollow cup motor; 16, nut; 17, suction pipe; 18, air pump; 19, cross suction claw; 20, electromagnetic spring; 21, chip; 22, base plate; 23, positioning pin; 24, movable clamp; 25, first connecting rod; 26, second connecting rod; 27, bolt; 28, sliding chute plate; 29, pressing plate; 30, hexagonal nut. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0024] Embodiment: as Figures 1-6As shown, the present application provides a technical scheme, a chip welding device with automatic positioning function, including machine table 1, positioning plate 2, adsorption unit and welding unit (not shown in the figure), positioning plate 2, adsorption unit and welding unit are installed on the machine table 1, the positioning plate 2 is provided with adjusting mechanism and two positioning pins 23, the adjusting mechanism and the two positioning pins 23 clamp the substrate 22, the adsorption unit is connected with the control system circuit, the adsorption unit includes moving mechanism and adsorption mechanism, the adsorption mechanism is installed on the moving mechanism, the adsorption mechanism adsorbs the chip 21, the moving mechanism automatically positions the chip 21, the welding unit welds the chip 21 on the substrate 22, the positioning plate 2 is rectangular, the center position of the two adjacent edges of the positioning plate 2 is provided with bolt 27 and a pair of sliding groove plate 28, the bolt 27 is located at the center of the pair of sliding groove plate 28, the pressure plate 29 is slidingly installed between each pair of sliding groove plate 28, the pressure plate 29 is provided with a through hole in the center, the bolt 27 passes through the through hole, the hexagon nut 30 is screwed on the bolt 27, the hexagon nut 30 is located above the pressure plate 29, the operator places the substrate 22 on the positioning plate 2, first, one corner of the substrate 22 is attached to the two positioning pins 23, so that it is preliminarily positioned, after positioning, the adjusting mechanism is used to clamp the substrate 22 to prevent movement during welding.

[0025] The adjusting mechanism includes first connecting rod 25, second connecting rod 26 and movable clamp 24, the first connecting rod 25 and the second connecting rod 26 are the same structure, the first connecting rod 25 is provided with a sliding groove, the sliding groove slides along the bolt 27, the movable clamp 24 is provided with a right angle slot, the movable clamp 24 is rotatably connected with the first connecting rod 25 and the second connecting rod 26, the first connecting rod 25 and the second connecting rod 26 are located between the positioning plate 2 and the pressure plate 29, the operator moves the movable clamp 24 so that the right angle slot is attached to the other corner of the substrate 22, then tightens the hexagon nut 30, the pressure plate 29 is used to press the first connecting rod 25 and the second connecting rod 26, the movable clamp 24 is fixed, the substrate 22 is fixed, the fixed first connecting rod 25 and the second connecting rod 26 form a stable triangular connection, which ensures that the movable clamp 24 cannot move randomly, through the adjustable movable clamp 24, the substrate 22 of different specifications is fixed, which meets the welding requirements in different situations.

[0026] The moving mechanism comprises a pair of side supports 3, a pair of upper guide rails 4, a pair of sliding supports 5, a pair of synchronous chain wheel assemblies 6, a pair of chains 7, a support shaft 8 and a lead screw 9, the pair of upper guide rails 4 are symmetrically installed between the pair of side supports 3, the pair of sliding supports 5 are respectively slidably installed on the pair of upper guide rails 4, the pair of synchronous chain wheel assemblies 6 are rotatably installed at two ends of the pair of upper guide rails 4, a second servo motor (not shown in the figure) is installed on one side support 3, the second servo motor is connected with one synchronous chain wheel assembly 6, each synchronous chain wheel assembly 6 is composed of two chain wheels and a rotating shaft, the two chain wheels are coaxially installed at two ends of the rotating shaft, the pair of chains 7 are symmetrically connected between the two synchronous chain wheel assemblies 6, the two sliding supports 5 are respectively connected at the middle portions of the two chains 7, the support shaft 8 and the lead screw 9 are rotatably installed between the pair of sliding supports 5, a first servo motor 10 is arranged on one sliding support 5, a motor shaft of the first servo motor 10 is coaxially connected with the lead screw 9, the adsorbing mechanism comprises a case 11, a sleeve 12, a hollow screw 13, a baffle 14, a hollow cup motor 15 and a nut 16, the sleeve 12 is connected at the bottom of the case 11, the bottom of the case 11 is provided with a hollow sliding sleeve and an internally threaded sleeve, the hollow sliding sleeve is slidably connected with the support shaft 8, and the internally threaded sleeve is threadedly connected with the lead screw 9.

[0027] The second servo motor drives the synchronous chain wheel assembly 6 to rotate, the synchronous chain wheel assembly 6 drives the two chains 7 to move, the chains 7 drive the two sliding supports 5 to simultaneously move, and drive the adsorbing mechanism to move along the direction of the upper guide rail 4, the first servo motor 10 drives the lead screw 9 to rotate, and the lead screw 9 drives the case 11 to slide along the direction of the support shaft 8, under the control of the first servo motor 10 and the second servo motor, the case 11 moves along the directions of the two coordinate axes, so that the adsorbing mechanism is fixed to any position on the substrate 22.

[0028] The hollow cup motor 15 is installed at the bottom of the sleeve 12, the nut 16 is installed at the inner ring of the hollow cup motor 15, the hollow screw rod 13 is screwed with the nut 16, a sliding groove is formed on the hollow screw rod 13, a limiting block is arranged at the bottom of the sleeve 12, the limiting block is slidably connected with the sliding groove of the hollow screw rod 13, the baffle 14 is connected at the top of the hollow screw rod 13, the air pump 18 is arranged in the cabinet 11, the suction end of the air pump 18 is connected with the hollow screw rod 13 through the suction pipe 17, the cross suction claw 19 is connected at the bottom of the hollow screw rod 13, a cross groove is formed at the bottom of the cross suction claw 19, the cross groove is communicated with the hollow part of the hollow screw rod 13, the hollow cup motor 15 drives the nut 16 to rotate, controls the hollow screw rod 13 to slide up and down in the sleeve 12, the hollow screw rod 13 drives the cross suction claw 19 to descend, stops moving after the cross suction claw 19 contacts the chip 21, the air pump 18 sucks air through the suction pipe 17, the negative pressure is generated in the cross groove due to the decrease of air pressure, the chip 21 is adsorbed, the hollow cup motor 15 drives the nut 16 to rotate, controls the hollow screw rod 13 to ascend, lifts the chip 21, and moves to the position to be welded, the welding machine set welds the chip 21 to the substrate 22 by using the laser welding mode, the air pump 18 stops sucking air, the negative pressure in the suction pipe 17 disappears, and the cross suction claw 19 releases the chip 21.

[0029] The four electromagnetic springs 20 are evenly arranged in the cross suction claw 19, the four electromagnetic springs 20 are connected with the control system circuit, the cross suction claw 19 is made of flexible material, the electromagnetic spring 20 controls the length of the cross suction claw 19 extending to the outer ring by controlling the size of the current, the cross suction claw 19 extends to the outer ring to the longest in the case of no electricity, in the case of electricity, the higher the current intensity, the shorter the electromagnetic spring 20 contracts, and the smaller the cross suction claw 19 contracts, the size of the current of the electromagnetic spring 20 is adjusted to realize the adjustment of the contour of the cross suction claw 19 to adapt to the adsorption of chips 21 of different sizes, since the cross suction claw 19 is made of flexible material, even if the electromagnetic spring 20 extends to cause the cross suction claw 19 to deform, the cross suction claw 19 can still be flexibly attached to the chip 21 after contacting the chip 21, the cross groove forms a sealed state, the cross suction claw 19 is extended for adsorption of large chips 21, and the cross suction claw 19 is contracted for adsorption of small chips 21, the contact area is adjusted to make the adsorption more firm and reduce shaking in the carrying process.

[0030] The working principle of the present application is as follows: the operator places the substrate 22 on the positioning plate 2, first sticks one corner of the substrate 22 to the two positioning pins 23 to preliminarily position the substrate 22, then clamps the substrate 22 by using the adjusting mechanism to prevent the substrate 22 from moving during welding, the operator moves the movable fixture 24 to make the right-angle slot of the movable fixture 24 align with another corner of the substrate 22, then tightens the hexagonal nut 30, and the first connecting rod 25 and the second connecting rod 26 are pressed by the pressing plate 29, so that the movable fixture 24 is fixed, and the substrate 22 is fixed, the fixed first connecting rod 25 and the second connecting rod 26 form a stable triangular connection, so that the movable fixture 24 cannot be moved at will, and the movable fixture 24 can be adjusted, so that the substrate 22 of different specifications can be fixed, and the welding requirements in different situations can be met.

[0031] The second servo motor drives the synchronous sprocket assembly 6 to rotate, the synchronous sprocket assembly 6 drives the two chains 7 to move, the chains 7 drive the two sliding supports 5 to move simultaneously, and drive the adsorption mechanism to move along the direction of the upper guide rail 4, the first servo motor 10 drives the lead screw 9 to rotate, the lead screw 9 drives the machine box 11 to slide along the direction of the support shaft 8, and under the control of the first servo motor 10 and the second servo motor, the machine box 11 moves along the direction of the two coordinate axes, so that the adsorption mechanism can fix the chip 21 to any position on the substrate 22.

[0032] The hollow cup motor 15 drives the nut 16 to rotate, controls the hollow screw 13 to slide up and down in the sleeve 12, and drives the cross-shaped adsorption claw 19 to descend, stops moving after the cross-shaped adsorption claw 19 contacts the chip 21, the air pump 18 draws air through the air pipe 17, the negative pressure is generated in the cross-shaped slot due to the decrease of air pressure, the chip 21 is adsorbed, the hollow cup motor 15 drives the nut 16 to rotate, controls the hollow screw 13 to rise, lifts the chip 21, and moves to the position to be welded, the welding machine set welds the chip 21 to the substrate 22 by using the laser welding mode, the air pump 18 stops drawing air, the negative pressure in the air pipe 17 disappears, and the cross-shaped adsorption claw 19 releases the chip 21.

[0033] The electromagnetic spring 20 controls the length of the cross-shaped suction claw 19 extending to the outer ring by controlling the size of the current, and the cross-shaped suction claw 19 extends to the outer ring to the longest in the case of no electricity, in the case of electricity, the higher the current intensity, the shorter the electromagnetic spring 20 contracts, the smaller the cross-shaped suction claw 19 contracts, by adjusting the size of the current of the electromagnetic spring 20, the profile of the cross-shaped suction claw 19 is adjusted to adapt to the suction of chips 21 of different sizes, since the cross-shaped suction claw 19 is made of flexible material, even if the cross-shaped suction claw 19 is deformed after the electromagnetic spring 20 is stretched, the cross-shaped suction claw 19 can still be flexibly attached to the chip 21 after contacting the chip 21, the cross-shaped groove forms a sealed state, the cross-shaped suction claw 19 is stretched for large chips 21, and the cross-shaped suction claw 19 is contracted for small chips 21, by adjusting the corresponding contact area, the suction is more firm, and the shaking in the carrying process is reduced.

[0034] It will be obvious to a person skilled in the art that the application is not limited to the details of the above-described exemplary embodiments, but that the application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. The embodiments should therefore be considered in all respects as illustrative and not restrictive, the scope of the application being defined by the appended claims rather than by the above description, and it is therefore intended that all changes and modifications that fall within the meaning and range of equivalents of the claims be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A chip welding device with automatic positioning function, characterized in that: Including machine table (1), positioning plate (2), adsorption unit and welding unit, positioning plate (2), adsorption unit and welding unit are all installed on machine table (1), the adjusting mechanism and two positioning pins (23) are provided on positioning plate (2), the adjusting mechanism and two positioning pins (23) are clamped to the base plate (22), the adsorption unit is connected with control system circuit, and the adsorption unit includes moving mechanism and adsorption mechanism, the adsorption mechanism is installed on the moving mechanism, and the adsorption mechanism is adsorbed to the chip (21), the moving mechanism is automatically positioned to the chip (21), and the welding unit is welded to the chip (21) on the base plate (22); The positioning plate (2) is rectangular, a bolt (27) and a pair of sliding chute plates (28) are arranged at the center positions of two adjacent edges of the positioning plate (2), the bolt (27) is located at the center of the pair of sliding chute plates (28), a pressing plate (29) is slidably installed between each pair of sliding chute plates (28), a through hole is formed in the center of the pressing plate (29), the bolt (27) penetrates through the through hole, and a hexagon nut (30) is screwed on the bolt (27), and the hexagon nut (30) is located above the pressing plate (29). The adjusting mechanism includes a first connecting rod (25), a second connecting rod (26) and a movable clamp (24), the first connecting rod (25) and the second connecting rod (26) are the same in structure, a sliding groove is formed in the first connecting rod (25), the sliding groove slides along the bolt (27), a right-angle groove is formed in the movable clamp (24), and the movable clamp (24) is rotatably connected with the first connecting rod (25) and the second connecting rod (26), and the first connecting rod (25) and the second connecting rod (26) are located between the positioning plate (2) and the pressing plate (29). The adsorption mechanism includes a gas pump (18) and a cross-shaped adsorption claw (19), a cross-shaped groove is formed in the bottom of the cross-shaped adsorption claw (19), the cross-shaped groove is in communication with the suction end of the gas pump, four electromagnetic springs (20) are uniformly arranged in the cross-shaped adsorption claw (19), the four electromagnetic springs (20) are connected with the control system circuit, the cross-shaped adsorption claw (19) is made of flexible material, the size of the current of the electromagnetic spring (20) is adjusted, the profile of the cross-shaped adsorption claw (19) is adjusted, and the adsorption of chips of different sizes is adapted.

2. The chip bonding apparatus having an automatic positioning function according to claim 1, characterized by: The moving mechanism includes a pair of side supports (3), a pair of upper layer guide rails (4), a pair of sliding supports (5), a pair of synchronous chain wheel assemblies (6), a pair of chains (7), a support shaft (8) and a lead screw (9), a pair of upper layer guide rails (4) are symmetrically installed between a pair of side supports (3), a pair of sliding supports (5) are slidably installed on a pair of upper layer guide rails (4), a pair of synchronous chain wheel assemblies (6) are rotatably installed at the two ends of a pair of upper layer guide rails (4), a second servo motor is installed on one side support (3), and the second servo motor is connected with one synchronous chain wheel assembly (6).

3. The chip bonding apparatus having an automatic positioning function according to claim 2, characterized by: Each of the synchronous chain wheel assemblies (6) is composed of two chain wheels and a rotating shaft, the two chain wheels are coaxially installed at two ends of the rotating shaft, a pair of the chains (7) are symmetrically connected between the two synchronous chain wheel assemblies (6), the two sliding supports (5) are respectively connected at the middle portions of the two chains (7), the support shaft (8) and the screw rod (9) are rotatably installed between the pair of sliding supports (5), the first servo motor (10) is arranged on one sliding support (5), and the motor shaft of the first servo motor (10) is coaxially connected with the screw rod (9).

4. The chip bonding apparatus having an automatic positioning function according to claim 3, wherein: The suction mechanism comprises a case (11), a sleeve (12), a hollow screw rod (13), a baffle (14), a hollow cup motor (15) and a nut (16), the sleeve (12) is connected at the bottom of the case (11), the bottom of the case (11) is provided with a hollow sliding sleeve and an internally threaded rotating sleeve, the hollow sliding sleeve is slidably connected with the support shaft (8), and the internally threaded rotating sleeve is threadedly connected with the screw rod (9).

5. The chip bonding apparatus having an automatic positioning function according to claim 4, characterized by: The hollow cup motor (15) is installed at the bottom of the sleeve (12), the nut (16) is installed at the inner ring of the hollow cup motor (15), the hollow screw rod (13) is screwed with the nut (16), a sliding groove is formed in the hollow screw rod (13), the bottom of the sleeve (12) is provided with a limiting block, the limiting block is slidably connected with the sliding groove of the hollow screw rod (13), and the baffle (14) is connected at the top of the hollow screw rod (13).

6. The chip bonding apparatus having an automatic positioning function according to claim 5, wherein: The air pump (18) is arranged in the case (11), the suction end of the air pump (18) is connected with the hollow screw rod (13) through an air suction pipe (17), the cross suction claw (19) is connected at the bottom of the hollow screw rod (13), and the cross groove is in communication with the hollow portion of the hollow screw rod (13).

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