Double-light-path cutting method based on refraction-reflection laser beam collecting system

Abstract

The invention provides a double-light-path cutting method based on a refraction-reflection laser beam collecting system, and relates to the technical field of laser cutting, and the method comprises the following steps: S1, introducing a laser beam in an optical fiber into a starting point of a light path in a laser; s2, guiding the light into an optical element assembly through a light path reflecting mirror; s3, the optical element assembly performs optical path correction on the laser beam; s4, total reflection collection is conducted on the refracted light beams and the reflected light beams through a total reflection mirror and a half-surrounded angle-controllable total reflection mirror; s5, the laser beam of the main light path adjusts the incident laser beam, so that the focus of the laser beam acts on the surface of the workpiece; s6, an auxiliary light path focusing lens adjusts the refraction-reflection laser beam, so that the focus of the refraction-reflection laser beam acts on the surface of the workpiece; according to the invention, by arranging the half-surrounded angle-controllable holophote and the holophote, the absorption of laser energy by elements in the laser is reduced, the collected laser is collected, the surface of a workpiece is pretreated, the reflection of the surface of the workpiece is reduced, and the utilization rate of the laser energy is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting, and in particular to a dual-path cutting method based on a refraction-reflection laser beam collection system. Background Art

[0002] Laser cutting is a high-precision machining technology that uses a high-power density laser beam to irradiate the surface of a material, causing it to quickly melt, vaporize, or reach the ignition point, and blowing away the molten slag with the aid of high-pressure auxiliary gas to achieve material separation. Its core principle is that a high-energy laser beam generated by a laser is focused by an optical system to form a high-power density light spot. After this light spot irradiates the surface of the workpiece, the material is quickly heated to the melting point or vaporization point, and the molten or vaporized material is carried away by a high-speed air flow to achieve high-precision cutting.

[0003] In the metal processing industry, laser cutting can accurately cut metal materials such as carbon steel, stainless steel, aluminum alloy, and copper alloy, and is applied to fields such as sheet metal processing, mechanical part manufacturing, and precision instrument manufacturing to achieve high-precision manufacturing of complex parts and improve production efficiency. In the automotive manufacturing field, laser cutting technology is widely used in the processing of body structural parts, chassis, exhaust pipes, engine components, etc. Its high-precision and flexible processing capabilities make automotive production more efficient and can meet the needs of personalized manufacturing. In the aerospace field, laser cutting is widely used in the precision processing of high-strength and difficult-to-machine materials such as titanium alloy, aluminum alloy, stainless steel, and composite materials, such as aircraft structural parts, engine blades, and satellite components, to ensure the lightweight, high strength, and high reliability of the components. In the electronic and electrical industry, laser cutting can be used in the manufacturing of precision circuit boards, semiconductor packaging, and microelectronic devices to ensure high precision and high efficiency and meet the requirements of miniaturization and high performance of electronic equipment. In the medical device manufacturing field, laser cutting is used in the manufacturing of medical devices such as scalpels, implants, and stents to ensure high precision, no burrs, and no pollution, and improve the quality and safety of medical devices. In the architectural decoration industry, laser cutting is used for personalized processing of metal curtain walls, engraved patterns, stainless steel decorative components, etc., making architectural designs more exquisite and complex while maintaining high processing precision and stability. In addition, laser cutting is also widely used in industries such as energy equipment manufacturing, rail transit, shipbuilding, and home appliance manufacturing.

[0004] However, in the prior art, lasers are prone to serious heating during continuous processing. The heating of lasers mainly comes from energy conversion loss, thermal effect of gain medium, absorption heating of optical components and power loss of electronic devices. The heating problem of lasers is largely caused by laser absorption caused by refraction and reflection of lasers by optical components in the laser light path. At present, the reflectivity of the total reflection mirror in the laser can reach 99.5% for lasers, while the pass rate of the lens in it for lasers is only between 80% and 95%. Due to the physical properties of the lens, it is difficult to improve its performance at present. This means that a large amount of laser energy is absorbed by the internal components of the laser during reflection and refraction, causing the temperature of the laser to rise, especially for high-power lasers. This not only wastes laser energy, but also has a great impact on the service life of the laser. Therefore, it is very necessary to invent a dual-light path cutting method based on a refraction-reflection laser beam collection system. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a dual-optical path cutting method based on a refraction-reflection laser beam collection system. By setting a semi-enclosed controllable angle total reflection mirror and a total reflection mirror, the laser reflected and refracted by each lens is collected through the total reflection lens, so as to improve the energy utilization rate, reduce the absorption of laser energy by the internal components of the laser, and reduce the heat generation. At the same time, the collected laser is collected and guided to the secondary optical path to pre-treat the workpiece surface, reduce the reflection of the workpiece surface, and increase the energy concentration rate of the main optical path light spot, so as to solve the problems mentioned in the background technology part.

[0006] A dual-light path cutting system based on a refraction-reflection laser beam collection system comprises a lens, a laser beam, an optical fiber, an optical path reflector, an optical component assembly, a main optical path, a main optical path focusing lens and a workpiece, wherein the lens is arranged on the optical path of the laser beam emitted by the optical fiber; the optical path reflector is arranged on the side of the lens away from the optical fiber; the workpiece is arranged on the optical path of the optical path reflector; the main optical path focusing lens is arranged between the workpiece and the optical path reflector; the optical component assembly is arranged between the optical path reflector and the main optical path focusing lens; the main optical path is the optical path of the laser beam processed by the lens, the optical path reflector, the optical component assembly and the main optical path focusing lens; A dual-light path cutting system based on a refraction-reflection laser beam collection system also includes a secondary light path, a total reflection mirror, a semi-enclosed controllable angle total reflection mirror, an angle control mechanism, a controller and a secondary light path focusing lens, wherein the semi-enclosed controllable angle total reflection mirror is installed on both sides of the main light path focusing lens; the controller is connected to the semi-enclosed controllable angle total reflection mirror through the angle control mechanism; the light beam emitted by the semi-enclosed controllable angle total reflection mirror is reflected onto the secondary light path focusing lens through the total reflection mirror, and the secondary light path is the light path in which the collected light beam is processed through the total reflection mirror and the secondary light path focusing lens.

[0007] Further, the optical element assembly includes a reflecting mirror, a focusing mirror, a half-wave plate, a polarization beam splitter, a timer shutter, a spatial light modulator, and a convex lens. The reflecting mirror, the focusing mirror, the half-wave plate, the polarization beam splitter, the timer shutter, the spatial light modulator, and the convex lens correct the optical path of the laser beam. The semi-surround controllable angle total reflection mirror and the total reflection mirror are both composed of multiple total reflection lenses, and each total reflection lens is connected to an angle control mechanism.

[0008] Further, patch sensors are arranged on both the semi-surround controllable angle total reflection mirror and the total reflection mirror. The patch sensors are connected to a controller.

[0009] A dual-path cutting method based on a refraction-reflection laser beam collection system, using the above-mentioned dual-path cutting system based on a refraction-reflection laser beam collection system, includes the following steps: S1: Through the coordinated action of components such as a winding reel, an optical fiber trough box, a winding directional reel, and a balancer, the laser beam in the optical fiber is introduced into the starting point of the internal optical path of the laser. S2: Through the action of a lens, the laser beam is flattened into a parallel beam, and then is introduced into the optical element assembly through an optical path reflecting mirror. S3: The optical element assembly corrects the optical path of the laser beam. S4: The laser beam passes through the focusing lens through the middle opening of the semi-surround controllable angle total reflection mirror. At the same time, the refracted beam and the reflected beam will pass through a refraction-reflection beam collection optical path composed of multiple total reflection mirrors and semi-surround controllable angle total reflection mirrors to totally reflect and collect the refracted beam and the reflected beam. S5: The laser beam on the main optical path adjusts the incident laser beam so that its focus acts on the surface of the workpiece. S6: The focusing lens on the secondary optical path adjusts the refraction-reflection laser beam so that its focus acts on the surface of the workpiece and ensures that its focus is in front of the focus of the laser beam on the main optical path.

[0010] Further, in step S4, when the laser beam passes through the focusing lens, refraction and reflection phenomena occur to weaken the energy of the laser beam. In step S4, the patch sensors on the semi-surround controllable angle total reflection mirror and the total reflection mirror detect the incident beam and output the parameter of its incident angle.

[0011] Further, in step S4, according to the detection data of the patch sensors, the controller controls the angle control structure to rotate the positions of the semi-surround controllable angle total reflection mirror and the total reflection mirror so that the refraction-reflection beam is focused on the focusing lens on the secondary optical path. In step S6, the workpiece is pre-treated using the focus on the secondary optical path, and the focus energy on the secondary optical path can reach 10%-15% of the focus energy on the main optical path.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, by providing a semi-enclosed controllable angle total reflection mirror and a total reflection mirror, the total reflection lens is used to collect the laser reflected and refracted by each lens, improving the energy utilization rate, reducing the absorption of laser energy by the internal components of the laser, reducing the heat generation, and at the same time collecting the collected laser and guiding it to the secondary optical path to preprocess the surface of the workpiece, reducing the surface reflection of the workpiece and increasing the energy concentration rate of the main optical path spot; 2. In the present invention, by providing a controller and a secondary optical path focusing lens, according to the detection data of the patch sensor, the controller controls the angle control mechanism to rotate the positions of the semi-enclosed controllable angle total reflection mirror and the total reflection mirror, so that the refracted-reflected light beam is focused on the secondary optical path focusing lens, and then through the action of the secondary optical path focusing lens, the focus of the refracted-reflected laser beam acts on the workpiece. According to the existing refraction and reflection performance of the lens, the energy of the secondary optical path focus can reach about 10%-15% of the energy of the main optical path focus; at this time, the secondary optical path focus is used to preprocess the workpiece, causing local melting and surface modification on the surface of the workpiece, increasing its surface roughness, reducing the laser beam reflection phenomenon during the machining of the main optical path, and further improving the absorption of the laser beam energy in the machining area, thereby improving the material removal rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural diagram of the present invention.

[0014] Figure 2 is a flow chart of the present invention.

[0015] In the figure: 111, secondary optical path; 112, total reflection mirror; 113, semi-enclosed controllable angle total reflection mirror; 114, angle control mechanism; 115, controller; 116, lens; 117, laser beam; 118, optical fiber; 119, optical path reflection mirror; 1110, optical element assembly; 1111, main optical path; 1112, main optical path focusing lens; 1113, secondary optical path focusing lens; 1114, workpiece. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following further describes the present invention with reference to the accompanying drawings: Embodiment: As shown in the attached Figure 1 to the attached Figure 2 shown The present invention provides a dual-light path cutting system based on a refraction-reflection laser beam collection system, comprising a lens 116, a laser beam 117, an optical fiber 118, an optical path reflector 119, an optical component assembly 1110, a main light path 1111, a main light path focusing lens 1112 and a workpiece 1114, wherein the lens 116 is arranged on the light path of the laser beam 117 emitted by the optical fiber 118; the optical path reflector 119 is arranged on the side of the lens 116 away from the optical fiber 118; the workpiece 1114 is arranged on the light path of the optical path reflector 119; the main light path focusing lens 1112 is installed between the workpiece 1114 and the optical path reflector 119; the optical component assembly 1110 is installed between the optical path reflector 119 and the main light path focusing lens 1112; the main light path 1111 is the light path of the laser beam 117 processed by the lens 116, the optical path reflector 119, the optical component assembly 1110 and the main light path focusing lens 1112; In this embodiment, the dual-light path cutting system based on the refraction-reflection laser beam collection system also includes a secondary light path 111, a total reflection mirror 112, a semi-enclosed controllable angle total reflection mirror 113, an angle control mechanism 114, a controller 115 and a secondary light path focusing lens 1113, the semi-enclosed controllable angle total reflection mirror 113 is installed on both sides of the main light path focusing lens 1112; the controller 115 is connected to the semi-enclosed controllable angle total reflection mirror 113 through the angle control mechanism 114; the light beam emitted by the semi-enclosed controllable angle total reflection mirror 113 is reflected onto the secondary light path focusing lens 1113 through the total reflection mirror 112, and the secondary light path 111 is the light path of the collected light beam processed by the total reflection mirror 112 and the secondary light path focusing lens 1113.

[0017] In this embodiment, the optical element assembly 1110 includes a reflector, a focusing mirror, a half-wave plate, a polarization beam splitter, a timer shutter, a spatial light modulator and a convex lens, and the reflector, the focusing mirror, the half-wave plate, the polarization beam splitter, the timer shutter, the spatial light modulator and the convex lens correct the optical path of the laser beam 117; the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112 are both composed of multiple total reflection lenses, and each total reflection lens is connected to the angle control mechanism 114; the semi-enclosed controllable angle total reflection mirror 113 Chip sensors are arranged on the total reflection mirror 112; the patch sensor is connected to the controller 115; by arranging the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112, the laser reflected and refracted by each lens is collected by the total reflection lens, so as to improve the energy utilization rate, reduce the absorption of laser energy by the internal components of the laser, reduce the heat generation, and at the same time collect the collected laser and guide it to the secondary light path 111, pre-treat the surface of the workpiece 1114, reduce the reflection of the workpiece surface, and increase the energy concentration rate of the main light path light spot.

[0018] A dual - path cutting method based on a refraction - reflection laser beam collection system, using the above - mentioned dual - path cutting system based on a refraction - reflection laser beam collection system, includes the following steps: S1: Through the coordinated action of components such as a winding disc, an optical fiber trough box, a winding directional reel, and a balancer, introduce the laser beam 117 in the optical fiber 118 to the starting point of the internal optical path of the laser. S2: The laser beam 117 is flattened into a parallel beam through the action of the lens 116, and then is introduced into the optical element assembly 1110 through the optical path mirror 119. S3: The optical element assembly 1110 corrects the optical path of the laser beam 117. S4: The laser beam 117 passes through the focusing lens 1112 through the middle opening of the semi - enclosed controllable - angle total - reflection mirror 113. At the same time, the refracted beam and the reflected beam will pass through the refraction - reflection beam collection optical path composed of multiple total - reflection mirrors 112 and semi - enclosed controllable - angle total - reflection mirrors 113 to totally reflect and collect the refracted beam and the reflected beam. S5: The laser beam on the main optical path 1111 adjusts the incident laser beam so that its focus acts on the surface of the workpiece 1114. S6: The focusing lens 1113 on the secondary optical path adjusts the refraction - reflection laser beam so that its focus acts on the surface of the workpiece 1114 and ensures that its focus is in front of the focus of the laser beam on the main optical path.

[0019] In this embodiment, in step S4, when the laser beam 117 passes through the focusing lens 1112, refraction and reflection phenomena occur to the laser beam 117, weakening the energy of the laser beam. In step S4, the patch sensors of the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112 detect the incident beam and output the parameter of its incident angle. In step S4, according to the detection data of the patch sensors, the controller 115 controls the angle control structure 114 to rotate the positions of the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112 so that the refraction-reflection beam is focused on the secondary path focusing lens 1113. In step S6, the workpiece 1114 is preprocessed using the focus of the secondary path 111, and the focus energy of the secondary path 111 can reach 10%-15% of the focus energy of the main path 1111. By setting the controller 115 and the secondary path focusing lens 1113, according to the detection data of the patch sensors, the controller 115 controls the angle control mechanism 114 to rotate the positions of the semi-enclosed controllable angle total reflection mirror 113 and the total reflection mirror 112 so that the refraction-reflection beam is focused on the secondary path focusing lens 1113. Then, through the action of the secondary path focusing lens 1113, the focus of the refraction-reflection laser beam acts on the workpiece 1114. According to the refraction and reflection performance of the existing lens, the focus energy of the secondary path 111 can reach about 10%-15% of the focus energy of the main path 1111. At this time, the workpiece 1114 is preprocessed using the focus of the secondary path 111 to cause local melting and surface modification on the surface of the workpiece 1114, increasing its surface roughness, reducing the laser beam reflection phenomenon during the processing of the main path 1111, further improving the absorption of the laser beam energy in the processing area, and thus improving the material removal rate.

[0020] Working principle In the present invention, through the collaborative action of multiple components such as the winding reel, the optical fiber trough box, the winding directional reel, and the balancer, the laser beam 117 in the optical fiber 118 is introduced to the starting point of the internal optical path of the laser. The laser beam 117 is flattened into a parallel beam through the action of the lens 116 and then introduced into the optical element assembly 1110 through the optical path reflector 119. The optical element assembly 1110 corrects the optical path of the laser beam 117. The laser beam 117 passes through the middle opening of the semi-enclosed controllable angle total reflection mirror 113 and passes through the focusing lens 1112. At the same time, the refracted beam and the reflected beam will pass through the refraction-reflection beam collection optical path composed of multiple total reflection mirrors 112 and semi-enclosed controllable angle total reflection mirrors 113 to totally reflect and collect the refracted beam and the reflected beam. The laser beam of the main path 1111 adjusts the incident laser beam so that its focus acts on the surface of the workpiece 1114. The secondary path focusing lens 1113 adjusts the refraction-reflection laser beam so that its focus acts on the surface of the workpiece 1114 and ensures that its focus is in front of the focus of the main path laser beam. Collect the laser reflected and refracted by each lens through a total reflection lens, improve the energy utilization rate, reduce the absorption of laser energy by the internal components of the laser, reduce the heat generation, and at the same time converge the collected laser and guide it to the secondary optical path 111 to preprocess the surface of the workpiece 1114, reduce the surface reflection of the workpiece, and increase the energy concentration rate of the main optical path spot; according to the detection data of the patch sensor, the controller 115 controls the angle control mechanism 114 to rotate the positions of the semi-surround controllable angle total reflection mirror 113 and the total reflection mirror 112, so that the refraction-reflection light beam converges on the secondary optical path focusing lens 1113, and then through the action of the secondary optical path focusing lens 1113, the focus of the refraction-reflection laser beam acts on the workpiece 1114. According to the existing refraction and reflection performance of the lens, the focus energy of the secondary optical path 111 can reach about 10%-15% of the focus energy of the main optical path 1111; at this time, use the focus of the secondary optical path 111 to preprocess the workpiece 1114, so that the surface of the workpiece 1114 produces local melting and surface modification, increase its surface roughness, reduce the laser beam reflection phenomenon during the processing of the main optical path 1111, and further improve the absorption of the laser beam energy in the processing area, thereby improving the material removal rate.

[0021] Using the technical solution of the present invention, or those skilled in the art being inspired by the technical solution of the present invention to design a similar technical solution and achieving the above technical effects shall fall within the protection scope of the present invention.

Claims

1. A dual-light path cutting system based on a refraction-reflection laser beam collection system, characterized in that: The optical device comprises a lens (116), a laser beam (117), an optical fiber (118), an optical path reflector (119), an optical element assembly (1110), a main optical path (1111), a main optical path focusing lens (1112), and a workpiece (1114), wherein the lens (116) is arranged on the optical path of the laser beam (117) emitted by the optical fiber (118); the optical path reflector (119) is arranged on a side of the lens (116) facing away from the optical fiber (118); and the workpiece (1114) is arranged on the optical path. The optical path of the reflector (119) is a main optical path focusing lens (1112) installed between the workpiece (1114) and the optical path reflector (119); the optical element assembly (1110) is installed between the optical path reflector (119) and the main optical path focusing lens (1112); the main optical path (1111) is a light path processed by the laser light beam (117) through the lens (116), the optical path reflector (119), the optical element assembly (1110) and the main optical path focusing lens (1112); The invention also comprises a secondary optical path (111), a total reflection mirror (112), a semi-enclosed controllable angle total reflection mirror (113), an angle control mechanism (114), a controller (115) and a secondary optical path focusing lens (1113); the semi-enclosed controllable angle total reflection mirror (113) is mounted on both sides of the main optical path focusing lens (1112); the controller (115) is connected to the semi-enclosed controllable angle total reflection mirror (113) via the angle control mechanism (114); the light beam emitted by the semi-enclosed controllable angle total reflection mirror (113) is reflected onto the secondary optical path focusing lens (1113) via the total reflection mirror (112); the secondary optical path (111) is a light path in which the collected light beam is processed via the total reflection mirror (112) and the secondary optical path focusing lens (1113).

2. The dual-light path cutting system based on the refraction-reflection laser beam collection system as claimed in claim 1, characterized in that: The optical element assembly (1110) comprises a reflector, a focusing mirror, a half-wave plate, a polarization beam splitter, a timer shutter, a spatial light modulator and a convex lens, and the reflector, focusing mirror, half-wave plate, polarization beam splitter, timer shutter, spatial light modulator and convex lens perform optical path correction on the laser light beam (117).

3. The dual-light path cutting system based on the refraction-reflection laser beam collection system as claimed in claim 2, characterized in that: The semi-enclosed controllable angle total reflection mirror (113) and the total reflection mirror (112) are both composed of a plurality of total reflection lenses, and each total reflection lens is connected to an angle control mechanism (114).

4. The dual-light path cutting system based on the refraction-reflection laser beam collection system as claimed in claim 3, characterized in that: The semi-enclosed controllable angle total reflection mirror (113) and the total reflection mirror (112) are both provided with patch sensors.

5. The dual-light path cutting system based on the refraction-reflection laser beam collection system as claimed in claim 3, characterized in that: The patch sensor is connected to a controller (115).

6. A dual-light path cutting method based on a refraction-reflection laser beam collection system, using the dual-light path cutting system based on a refraction-reflection laser beam collection system according to claim 5, characterized in that: The following steps are involved: S1: Through the coordinated action of a reel, a fiber trough box, a reel-oriented reel, and a balancer, the laser beam (117) in the optical fiber (118) is introduced to the starting point of the optical path inside the laser; S2: The laser beam (117) is flattened into a parallel beam by the lens (116), and then guided into the optical element assembly (1110) through the optical path reflector (119); S3: the optical element assembly (1110) corrects the optical path of the laser beam (117); S4: The laser beam (117) passes through the focusing lens (1112) through the middle opening of the semi-enclosed controllable angle total reflection mirror (113), and the refracted light beam and the reflected light beam pass through a refraction-reflection light beam collection optical path composed of a plurality of total reflection mirrors (112) and the semi-enclosed controllable angle total reflection mirror (113), and the refracted light beam and the reflected light beam are collected by total reflection; S5: The laser beam in the main optical path (1111) adjusts the incident laser beam so that its focus acts on the surface of the workpiece (1114); S6: The secondary optical path focusing lens (1113) adjusts the refracted-reflected laser beam so that its focus acts on the surface of the workpiece (1114) and ensures that its focus is in front of the focus of the primary optical path laser beam.

7. The dual-light path cutting method based on the refraction-reflection laser beam collection system according to claim 6, characterized in that: In the step S4, when the laser beam (117) passes through the focusing lens (1112), the laser beam (117) undergoes refraction and reflection, thereby weakening the energy of the laser beam.

8. The dual-light path cutting method based on the refraction-reflection laser beam collection system according to claim 6, characterized in that: In the step S4, the patch sensors of the semi-enclosed controllable angle total reflection mirror (113) and the total reflection mirror (112) detect the incident light beam and output the parameters of the incident angle.

9. The dual-light path cutting method based on the refraction-reflection laser beam collection system according to claim 6, characterized in that: In the step S4, according to the detection data of the patch sensor, the controller (115) controls the angle control structure (114) to rotate the positions of the semi-enclosed controllable angle total reflection mirror (113) and the total reflection mirror (112) so that the refracted-reflected light beam is focused onto the secondary light path focusing lens (1113).

10. The dual-light path cutting method based on the refraction-reflection laser beam collection system according to claim 6, characterized in that: In the step S6, the workpiece (1114) is pre-processed using the focus of the secondary light path (111), and the focus energy of the secondary light path (111) can reach 10%-15% of the focus energy of the main light path (1111).

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