Manufacturing device and method of chip component

Abstract

The invention discloses a manufacturing device and method for a chip component, and relates to the technical field of manufacturing devices for chip components, the manufacturing device comprises a frame body, a group of first driving shafts are rotatably connected in the frame body, and the surfaces of the group of first driving shafts are connected through a group of first synchronous belts. When a second synchronous belt drives a cut chip type damping resistor to move to a first blocking piece, the first blocking piece pushes the chip type damping resistor to enter a clamping block, so that the chip type damping resistor and the clamping block synchronously move, and when the chip type damping resistor moves to a first gear on the surface of a rotating shaft and is meshed with a rack, the chip type damping resistor is clamped. The chip type damping resistor and the clamping block synchronously rotate by a circle, so that the two sides of the chip type damping resistor are polished through the polishing device at the top of the frame body in the rotating process, the quality of the chip type damping resistor is improved, the working procedures of cutting, polishing and the like of the chip type component are synchronously achieved through cooperation of all the components, and the working efficiency is improved. Therefore, time consumption of procedure connection is reduced, and working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing devices for chip components, and specifically to a manufacturing device and method for chip components. Background Art

[0002] Under the background of the rapid development of the modern electronics industry, chip components are widely used in various electronic products due to their small size, excellent performance, and easy automation installation. There are many types of chip components, such as chip damping resistors. Chip damping resistors are usually made of viscoelastic polymer materials and are attached to the vibration source or noise propagation path by pasting or other means. Its main function is to convert vibration energy into heat energy, thereby reducing vibration and noise.

[0003] Currently, when processing chip damping resistors, the raw materials are usually transported to the cutting area for cutting, and then after cutting, they are transferred to the next process for grinding. The grinding device is used to perform the grinding process on the cutting area, thereby improving the processing quality.

[0004] However, when processing chip damping resistors, since cutting and grinding are different processing procedures, when the chip damping resistor enters the next process, it needs to be manually collected and transferred to the next process, which increases the time-consuming of process connection and thus reduces work efficiency. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a manufacturing device and method for chip components, so as to solve the technical problem that since cutting and grinding are different processing procedures, when the chip damping resistor enters the next process, it needs to be manually collected and transferred to the next process, which increases the time-consuming of process connection and thus reduces work efficiency.

[0006] To achieve the above object, the present invention provides the following technical solutions: A manufacturing device for chip components includes a frame body. A group of first drive shafts are rotatably connected inside the frame body, and the surfaces of the group of first drive shafts are connected by a group of first synchronous belts. One end of one of the first drive shafts movably penetrates through one side of the frame body and extends to the outside. A first motor that fits with the first drive shaft is installed on one side of the frame body, and the output end of the first motor is connected to the corresponding first drive shaft. A laser cutting device is installed on the top of the frame body. A group of second drive shafts are rotatably connected inside the frame body, and a group of second synchronous belts are arranged on the surfaces of the group of second drive shafts. A group of third drive shafts are rotatably connected inside the frame body, and a group of third synchronous belts are arranged on the surfaces of the group of third drive shafts. Two groups of connecting pieces are hingedly connected to the surface of each of the third synchronous belts. Each connecting piece is connected to a clamping block through a rotating shaft. A fixed block is fixedly connected to the top of the frame body. A group of first blocking pieces are fixedly connected to the bottom of the fixed block, and the first blocking pieces fit with the second synchronous belts. A first gear is fixedly connected to the surface of each rotating shaft. Sliding grooves that fit with the rotating shafts and the first gears are arranged on both sides of the frame body. A rack that fits with the first gear is fixedly connected to the top of each sliding groove. An active block is rotatably connected inside the frame body through a connecting shaft. A group of grinding devices are arranged on the top and bottom of the active block. A cleaning device that fits with the grinding devices is installed on the top of the frame body. Second gears are fixedly connected to both ends of the connecting shaft. One end of one of each group of rotating shafts is fixedly connected to a connecting rod, and a third gear that meshes with the second gear is rotatably connected to the surface of the connecting rod.

[0007] By adopting the above technical solution, the first motor is started to drive the first synchronous belt to move, so as to realize the cutting of the chip damping resistor through the laser cutting device. After the cut chip damping resistor is conveyed to the second synchronous belt, the third synchronous belt drives the connecting piece and the clamping block to move. Then, when the cut chip damping resistor is conveyed to the position of the first baffle, the first baffle can push the chip damping resistor into the clamping block to realize the clamping of the chip damping resistor. Then, the third synchronous belt drives the clamping block and the chip damping resistor to move until the clamping block and the rotating shaft move to the position of the rack. At this time, the first gear on the surface of the rotating shaft can be meshed with the rack, so that the clamped chip damping resistor rotates synchronously with the clamping block for one circle. Therefore, during the rotation process, the grinding device at the top of the frame body is used to grind both sides of the chip damping resistor, improving the quality of the chip damping resistor. At the same time, when the grinding device finishes grinding a group of cut chip damping resistors, the corresponding rotating shaft drives the connecting rod and the third gear to move to the position of the second gear. Then, through the meshing of the second gear and the third gear, the flipping of the connecting shaft and the movable block is realized, and the positions of the grinding devices at the top and bottom of the movable block are exchanged. Then, the cleaning device is started to clean the just flipped-up grinding device, avoiding the impurities generated by grinding from affecting the quality of subsequent grinding of the chip damping resistor. This structure realizes the processes of cutting, grinding, etc. of the chip components synchronously through the cooperation between various components, thereby reducing the time-consuming of process connection and facilitating the improvement of work efficiency.

[0008] The present invention is further configured such that one end of one of the second drive shafts movably penetrates through one side of the frame body and extends to the outside. A second motor that fits one of the second drive shafts is installed on one side of the frame body, and the output end of the second motor is connected to one end of one of the second drive shafts. One of the second drive shafts and one of the third drive shafts are connected by a fourth synchronous belt.

[0009] By adopting the above technical solution, the second motor is started to drive one of the second drive shafts to move, so that a group of second synchronous belts and the other second drive shaft move, facilitating the movement of the cut chip damping resistor. Then, the fourth synchronous belt drives one of the third drive shafts to move, so that the third synchronous belt rotates at the same speed as the second synchronous belt, facilitating better clamping of the chip damping resistor by the clamping block.

[0010] The present invention is further configured such that the first baffle is made of an elastic material.

[0011] By adopting the above technical solution, when the first baffle pushes the chip damping resistor into a relative set of clamping blocks, after the chip damping resistor is unable to move further due to the action of frictional force, the frictional force is converted into an external force applied to the first baffle, causing the first baffle to deform. Then, the clamping blocks can drive the chip damping resistor to move from the position of the first baffle, ensuring the smooth operation of the device.

[0012] The present invention is further configured such that rubber strips are fixedly connected to the top and bottom of each of the clamping blocks, and a rubber layer is provided in each of the clamping blocks.

[0013] By adopting the above technical solution, when the first baffle pushes the chip damping resistor into a relative set of clamping blocks, the frictional force between the clamping blocks and the chip damping resistor can be increased through the rubber layer, thereby being able to clamp the component more firmly and prevent it from displacing or falling during the processing, ensuring the accuracy and quality of the processing. At the same time, the rubber strips can play a positioning role. After the first baffle pushes the chip damping resistor into the clamping blocks, the frictional force of the chip damping resistor after entering the clamping blocks is increased through the rubber strips, causing the first baffle to deform, facilitating better driving of the chip damping resistor to move, and avoiding the chip damping resistor falling out of the clamping blocks due to excessive thrust of the first baffle, which affects the use of the device.

[0014] The present invention is further configured such that a set of columns is fixedly connected to the surface of the frame body, a blanking platform is fixedly connected to one side of the set of columns, and a second baffle is fixedly connected to the top of the columns.

[0015] By adopting the above technical solution, when the third synchronous belt drives the polished chip damping resistor to move to the position of the second baffle, the second baffle can push the chip damping resistor to squeeze the rubber strips, causing them to deform. Then, the chip damping resistor can pass through the rubber strips and fall onto the blanking platform, facilitating the collection of the processed components and improving the convenience and orderliness of production.

[0016] The present invention is further configured such that rubber pads are provided on the surfaces of the second baffle and the blanking platform.

[0017] By adopting the above technical solution, when the second baffle pushes the chip damping resistor to fall out of the clamping blocks, the damage caused by the collision between the second baffle and the chip damping resistor can be reduced. At the same time, the rubber pad on the surface of the blanking platform can protect the chip damping resistor and avoid damage caused by the collision between the chip damping resistor and the blanking platform.

[0018] The present invention is further configured such that the height of the first synchronous belt is greater than that of the second synchronous belt, and the rotational speed of the second motor is greater than that of the first motor.

[0019] By adopting the above technical solution, when the chip damping resistor to be cut moves to one end of the first synchronous belt, it can fall onto the surface of the second synchronous belt due to the height difference between the first synchronous belt and the second synchronous belt, avoiding affecting the movement of the chip damping resistor after cutting. At the same time, the speed of the second synchronous belt can be made greater than that of the first synchronous belt. Then, when the second synchronous belt drives the cut chip damping resistor to move, it can fit with the clamping block, so that the cut chip damping resistor can be better clamped by the clamping block.

[0020] The present invention is further configured such that support plates are fixedly connected to both sides of each of the connecting members.

[0021] By adopting the above technical solution, when the third synchronous belt drives the connecting member to move to the horizontal plane of the third synchronous belt, the support plate can support the connecting member, facilitating the increase of the stability of the connecting member, and the setting of the support plate will not affect the movement of the connecting member at the position of the third driving shaft.

[0022] The present invention further provides a manufacturing method for chip components, and the steps are as follows: Step 1: Place the chip damping resistor on the first synchronous belt for transportation, and perform cutting through a laser cutting device during the transportation process; Step 2: The cut chip damping resistor falls onto the second synchronous belt for transportation, and the third synchronous belt drives the clamping block to move. Then, the chip damping resistor is pushed into the clamping block by the first baffle; Step 3: The third synchronous belt drives the clamping block and the chip damping resistor clamped therein to move. When the rack and the first gear are engaged, the clamping block and the chip damping resistor clamped therein are driven to rotate one circle, so that the two sides of the chip damping resistor can be polished by the polishing device; Step 4: After several chip damping resistors divided in one piece are polished, one of the rotating shafts drives the third gear to move until it is engaged with the second gear, then the movable block and the polishing device can be driven to rotate half a circle, and then the cleaning device is started to clean the polishing device; Step 5: The polished chip damping resistor is transported through the third synchronous belt, and then the chip damping resistor is pushed to fall out of the clamping block by the second baffle.

[0023] In summary, the present invention mainly has the following beneficial effects: The present invention drives the first synchronous belt to move by starting the first motor, so as to realize the cutting of the chip damping resistor through the laser cutting device. After the cut chip damping resistor is conveyed to the second synchronous belt, the third synchronous belt drives the connecting piece and the clamping block to move. Then, when the cut chip damping resistor is conveyed to the position of the first baffle, the chip damping resistor can be pushed into the clamping block by the first baffle to realize the clamping of the chip damping resistor. Then, the third synchronous belt drives the clamping block and the chip damping resistor to move until the clamping block and the rotating shaft move to the position of the rack. At this time, the first gear on the surface of the rotating shaft can be meshed with the rack, so that the clamped chip damping resistor rotates synchronously with the clamping block for one circle. Therefore, during the rotation process, the grinding device at the top of the frame body is used to grind both sides of the chip damping resistor, improving the quality of the chip damping resistor. This structure realizes the processes of cutting, grinding, etc. of the chip component synchronously through the cooperation between various components, thereby reducing the time-consuming of process connection and facilitating the improvement of work efficiency; Through the design of the second gear and the third gear in the present invention, after a set of connecting pieces and the clamping block on their top complete the grinding of a set of chip damping resistors, the third synchronous belt can drive the corresponding rotating shaft, connecting rod and third gear to move to the position of the second gear. Then, through the meshing of the third gear and the second gear, the rotation of the connecting shaft, the movable block and the grinding device is realized. Therefore, the grinding devices at the top and bottom of the movable block can be swapped in position, so that the cleaning device can be started to clean the grinding device. This is beneficial to timely cleaning the grinding device, effectively removing impurities such as debris and abrasives remaining during the grinding process, and avoiding these impurities from affecting the accuracy and quality of subsequent grinding operations. Description of the Drawings

[0024] Figure 1 is a three-dimensional structure diagram of the present invention; Figure 2 for the present invention Figure 1 is a three-dimensional structure diagram from another perspective in the present invention; Figure 3 is a drive structure diagram of the present invention; Figure 4 is a drive schematic diagram of the clamping structure of the present invention; Figure 5 is a rotation structure diagram of the present invention; Figure 6 is a first baffle structure diagram of the present invention; Figure 7 is a blanking structure diagram of the present invention; Figure 8 is a grinding structure diagram of the present invention; Figure 9 is a clamping structure diagram of the present invention; Figure 10Detailed view of the clamping structure of the present invention; Figure 11 For the present invention Figure 5 Enlarged view of the structure at location A in the present invention.

[0025] In the figure: 1, frame body; 2, first drive shaft; 3, first synchronous belt; 4, first motor; 5, laser cutting device; 6, second drive shaft; 7, second synchronous belt; 8, second motor; 9, third drive shaft; 10, third synchronous belt; 11, fourth synchronous belt; 12, connecting member; 13, rotating shaft; 14, clamping block; 15, first gear; 16, chute; 17, rack; 18, connecting shaft; 19, movable block; 20, grinding device; 21, second gear; 22, connecting rod; 23, third gear; 24, fixed block; 25, first baffle; 26, column; 27, blanking platform; 28, second baffle; 29, rubber pad; 30, rubber strip; 31, rubber layer; 32, cleaning device; 33, support plate. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0027] Next, the embodiments of the present invention will be described according to the overall structure of the present invention.

[0028] A manufacturing device for chip components, as Figures 1-11 shown, includes a frame body 1. A set of first drive shafts 2 are rotatably connected inside the frame body 1, and the surfaces of the set of first drive shafts 2 are connected by a set of first synchronous belts 3. One end of one of the first drive shafts 2 movably penetrates one side of the frame body 1 and extends to the outside. A first motor 4 that fits the first drive shaft 2 is installed on one side of the frame body 1, and the output end of the first motor 4 is connected to the corresponding first drive shaft 2. Starting the first motor 4 drives one of the first drive shafts 2 to rotate, so that the set of first synchronous belts 3 and the other first drive shaft 2 can also move synchronously, facilitating the conveyance of chip damping resistors through the first synchronous belts 3. A laser cutting device 5 is installed on the top of the frame body 1, so that the laser cutting device 5 can complete cutting during the movement of the chip damping resistor, and the laser cutting device 5 can be set as a pulsed laser cutting device to achieve precise cutting of the chip damping and avoid damaging the first synchronous belts 3 and affecting their use.

[0029] Further, a group of second drive shafts 6 are rotatably connected inside the frame 1, and a group of second synchronous belts 7 are arranged on the surfaces of the group of second drive shafts 6. A group of third drive shafts 9 are rotatably connected inside the frame 1, and a group of third synchronous belts 10 are arranged on the surfaces of the group of third drive shafts 9. Two sets of connecting pieces 12 are hingedly connected to the surfaces of each of the third synchronous belts 10. Each connecting piece 12 is connected to a clamping block 14 through a rotating shaft 13, and a damping structure is arranged at the connection between the connecting piece 12 and the rotating shaft 13. At the same time, one end of one of the second drive shafts 6 movably penetrates through one side of the frame 1 and extends to the outside. A second motor 8 that fits with one of the second drive shafts 6 is installed on one side of the frame 1, and the output end of the second motor 8 is connected to one end of one of the second drive shafts 6. Starting the second motor 8 drives one of the second drive shafts 6 to rotate, so that the second synchronous belt 7 and the other second drive shaft 6 move synchronously, thereby realizing the conveying of the cut chip-type damping resistors. One of the second drive shafts 6 and one of the third drive shafts 9 are connected through a fourth synchronous belt 11, so that one of the second drive shafts 6 and one of the third drive shafts 9 can move synchronously through the fourth synchronous belt 11, and then the third synchronous belt 10 and the other third drive shaft 9 can move synchronously, which is convenient for driving the synchronous movement of the connecting piece 12, the rotating shaft 13 and the clamping block 14 through the third synchronous belt 10.

[0030] Both sides of each of the connecting pieces 12 are fixedly connected with support plates 33. Therefore, when the third synchronous belt 10 drives the connecting piece 12 to move horizontally, the stability of the connecting piece 12 can be increased through the support plates 33, which is convenient for the clamping block 14 on its top to better clamp the chip-type damping resistors. And when the connecting piece 12 moves to both ends of the third synchronous belt 10, it can adapt to the arc movement due to the hinge connection between the connecting piece 12 and the third synchronous belt 10, avoiding jamming and affecting the movement of the connecting piece 12.

[0031] Subsequently, a fixing block 24 is fixedly connected to the top of the frame body 1. A group of first retaining pieces 25 are fixedly connected to the bottom of the fixing block 24, and the first retaining pieces 25 are fitted with the second synchronous belt 7. Therefore, when the second synchronous belt 7 drives the cut chip damping resistor to move to the position of the first retaining piece 25, the chip damping resistor can be pushed into the corresponding clamping block 14 through the first retaining piece 25, and then the clamping of the chip damping resistor is realized through the clamping block 14, so that the clamping block 14 and the chip damping resistor move synchronously. A first gear 15 is fixedly connected to the surface of each rotating shaft 13. Chute 16s that are fitted with the rotating shaft 13 and the first gear 15 are arranged on both sides of the frame body 1. A rack 17 that is fitted with the first gear 15 is fixedly connected to the top of each chute 16. Therefore, when the third synchronous belt 10 drives the clamping block 14 and the clamped chip damping resistor to move to the position of the rack 17, the first gear 15 and the rack 17 are engaged, so that a corresponding group of rotating shafts 13 can drive the clamping block 14 and the chip damping resistor to rotate one circle. A movable block 19 is rotatably connected to the frame body 1 through a connecting shaft 18, and a damping structure is arranged between the frame body 1 and the connecting shaft 18. A group of grinding devices 20 are arranged at the top and bottom of the movable block 19, and the arrangement of the grinding devices 20 is fitted with the positions of both ends of the chip damping resistor during its rotation. Therefore, during the rotation of the clamping block 14 and the chip damping resistor, they can contact the grinding devices 20, thereby realizing the grinding of both sides of the chip damping resistor and facilitating the improvement of the processing quality of the chip damping resistor. A cleaning device 32 that is fitted with the grinding devices 20 is installed on the top of the frame body 1, and the cleaning device 32 can be set as a dust suction cleaning device. Second gears 21 are fixedly connected to both ends of the connecting shaft 18. One end of each rotating shaft 13 in each group is fixedly connected to a connecting rod 22, and a third gear 23 that is engaged with the second gear 21 is rotatably connected to the surface of the connecting rod 22. Therefore, after a group of cut chip damping resistors are ground, one of the rotating shafts 13 can be driven to drive the connecting rod 22 and the third gear 23 to move to the position of the second gear 21, and then the rotation of the connecting shaft 18 and the second gear 21 can be realized through the engagement of the second gear 21 and the third gear 23, so that the positions of the grinding devices 20 at the top and bottom of the movable block 19 are swapped, and then the cleaning device 32 is started to clean the grinding device 20 at the swapped position.

[0032] Therefore, during use, the first motor 4 is started to drive the first synchronous belt 3 to move. The chip-type damping resistor is placed into one end of the first synchronous belt 3, and then the first synchronous belt 3 drives it to move. Thus, the laser cutting device 5 is used to cut the chip-type damping resistor. After cutting, the chip-type damping resistor is conveyed to the second synchronous belt 7, and then the third synchronous belt 10 drives the connecting member 12 and the clamping block 14 to move. When the cut chip-type damping resistor is conveyed to the position of the first baffle 25, the first baffle 25 can push the chip-type damping resistor into the clamping block 14 to clamp the chip-type damping resistor. Then, the third synchronous belt 10 drives the clamping block 14 and the chip-type damping resistor to move. When the clamping block 14 and the rotating shaft 13 move to the position of the rack 17, the first gear 15 on the surface of the rotating shaft 13 can mesh with the rack 17, so that the clamped chip-type damping resistor rotates one circle synchronously with the clamping block 14. Therefore, during rotation, the grinding device 20 on the top of the frame 1 is used to grind both sides of the chip-type damping resistor, improving the quality of the chip-type damping resistor. At the same time, when the grinding device 20 finishes grinding a group of cut chip-type damping resistors, the corresponding rotating shaft 13 drives the connecting rod 22 and the third gear 23 to move to the position of the second gear 21. Thus, through the meshing of the second gear 21 and the third gear 23, the flipping of the connecting shaft 18 and the movable block 19 is realized, swapping the positions of the grinding devices 20 on the top and bottom of the movable block 19. Then, the cleaning device 32 is started to clean the just flipped-up grinding device 20, avoiding the impurities generated by grinding from affecting the quality of subsequent grinding of the chip-type damping resistor. This structure synchronously realizes processes such as cutting and grinding of chip components through the cooperation of various components, thereby reducing the time-consuming of process connection and facilitating the improvement of work efficiency.

[0033] Furthermore, a group of columns 26 are fixedly connected to the surface of the frame 1. A blanking platform 27 is fixedly connected to one side of the group of columns 26, and a second baffle 28 is fixedly connected to the top of the columns 26. Therefore, when the second synchronous belt 7 drives the clamping block 14 and the chip-type damping resistor it holds to move to the position of the second baffle 28, the second baffle 28 can apply pressure to the chip-type damping resistor, so that the chip-type damping resistor falls out of the clamping block 14, facilitating the completion of the processing of the chip-type damping resistor. At the same time, rubber pads 29 are provided on the surfaces of both the second baffle 28 and the blanking platform 27. When the second baffle 28 pushes the chip-type damping resistor to fall off the clamping block 14, the rubber pads 29 can play a protective role for the chip-type damping resistor, avoiding damage to the chip-type damping resistor due to excessive thrust. And the rubber pad 29 on the blanking platform 27 can play a protective role when the chip-type damping resistor falls onto the platform, avoiding damage caused by the collision between the chip-type damping resistor and the blanking platform 27.

[0034] The first baffle 25 is made of an elastic material. Therefore, after the first baffle 25 pushes the chip damping resistor into the clamping block 14, the force on the first baffle 25 increases, causing it to deform, thus preventing the first baffle 25 from affecting the movement of the chip damping resistor. At the same time, rubber strips 30 are fixedly connected to the top and bottom inside each clamping block 14. The rubber strips 30 can position the chip damping resistor. When the first baffle 25 pushes the chip damping resistor into the corresponding clamping block 14, the rubber strips 30 can impede the movement of the chip damping resistor, increasing its resistance and preventing it from continuing to move, thus avoiding its dropping from the clamping block 14. The resistance causes the first baffle 25 to deform, facilitating the clamping block 14 to drive the chip damping resistor to move, and thus enabling the clamping block 14 to clamp the chip damping resistor. A rubber layer 31 is provided inside each clamping block 14, which can increase the friction between the clamping block 14 and the chip damping resistor, thereby clamping the component more firmly and preventing it from shifting or dropping during processing, ensuring the accuracy and quality of processing.

[0035] In this embodiment, the height of the first synchronous belt 3 is greater than that of the second synchronous belt 7. When the cut chip damping resistor moves to one end of the first synchronous belt 3, it can fall onto the surface of the second synchronous belt 7 due to the height difference between the first synchronous belt 3 and the second synchronous belt 7, enabling the second synchronous belt 7 to continue transporting the chip damping resistor. The rotational speed of the second motor 8 is greater than that of the first motor 4. The rotation of the first motor 4 makes the first synchronous belt 3 move slowly, facilitating the accurate cutting of the chip damping resistor. After the cut chip damping resistor reaches the surface of the second synchronous belt 7, the second synchronous belt 7 can accelerate the transportation of the chip damping resistor, increasing the gap between adjacent chip damping resistors and facilitating subsequent processing of the chip damping resistor.

[0036] Although the embodiments of the present invention have been shown and described, the specific embodiments are merely explanations of the present invention and not limitations thereof. The specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions, and variations that do not contribute creatively to the embodiments as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A manufacturing device for a chip component, comprising a frame body (1). A set of first drive shafts (2) are rotatably connected inside the frame body (1), and the surfaces of the set of first drive shafts (2) are connected by a set of first synchronous belts (3). One end of one of the first drive shafts (2) movably penetrates through one side of the frame body (1) and extends to the outside. A first motor (4) that fits the first drive shaft (2) is installed on one side of the frame body (1), and the output end of the first motor (4) is connected to the corresponding first drive shaft (2). A laser cutting device (5) is installed on the top of the frame body (1), characterized in that: A set of second drive shafts (6) are rotatably connected inside the frame body (1), and a set of second synchronous belts (7) are arranged on the surfaces of the set of second drive shafts (6). A set of third drive shafts (9) are rotatably connected inside the frame body (1), and a set of third synchronous belts (10) are arranged on the surfaces of the set of third drive shafts (9). Two sets of connecting pieces (12) are hingedly connected to the surface of each third synchronous belt (10). Each connecting piece (12) is connected to a clamping block (14) through a rotating shaft (13). A fixed block (24) is fixedly connected to the top of the frame body (1). A set of first retaining pieces (25) are fixedly connected to the bottom of the fixed block (24), and the first retaining pieces (25) are fitted with the second synchronous belt (7). A first gear (15) is fixedly connected to the surface of each rotating shaft (13). Sliding grooves (16) that are fitted with the rotating shafts (13) and the first gears (15) are arranged on both sides of the frame body (1). A rack (17) that is fitted with the first gear (15) is fixedly connected to the inner top of each sliding groove (16). A movable block (19) is rotatably connected inside the frame body (1) through a connecting shaft (18). A set of grinding devices (20) are arranged on the top and bottom of the movable block (19). A cleaning device (32) that is fitted with the grinding device (20) is installed on the top of the frame body (1). Second gears (21) are fixedly connected to both ends of the connecting shaft (18). One end of a connecting rod (22) is fixedly connected to one end of each set of one of the rotating shafts (13), and a third gear (23) that meshes with the second gear (21) is rotatably connected to the surface of the connecting rod (22).

2. The manufacturing apparatus for the chip component according to claim 1, wherein: One end of one of the second drive shafts (6) movably penetrates through one side of the frame body (1) and extends to the outside. A second motor (8) that is fitted with one of the second drive shafts (6) is installed on one side of the frame body (1), and the output end of the second motor (8) is connected to one end of one of the second drive shafts (6). One of the second drive shafts (6) and one of the third drive shafts (9) are connected through a fourth synchronous belt (11).

3. The manufacturing apparatus for chip components according to claim 1, characterized in that: The first retaining piece (25) is made of an elastic material.

4. The manufacturing apparatus for the chip component according to claim 1, wherein: Rubber strips (30) are fixedly connected to the inner top and bottom of each clamping block (14), and a rubber layer (31) is arranged inside each clamping block (14).

5. The manufacturing apparatus for chip components according to claim 1, wherein: A set of columns (26) are fixedly connected to the surface of the frame body (1). A blanking platform (27) is fixedly connected to one side of the set of columns (26), and a second retaining piece (28) is fixedly connected to the top of the column (26).

6. The manufacturing apparatus for chip components according to claim 5, wherein: Rubber pads (29) are arranged on the surfaces of the second retaining piece (28) and the blanking platform (27).

7. The manufacturing apparatus for the chip component according to claim 2, wherein: The height of the first synchronous belt (3) is greater than that of the second synchronous belt (7), and the rotation speed of the second motor (8) is greater than that of the first motor (4).

8. The manufacturing apparatus for the chip component according to claim 1, wherein: Support plates (33) are fixedly connected to both sides of each connecting piece (12).

9. A manufacturing method of a chip component, which uses the manufacturing apparatus of the chip component according to any one of claims 1-8, characterized in that: The steps are as follows: Step 1: Place the chip damping resistor on the first synchronous belt (3) for transportation, and perform cutting through the laser cutting device (5) during the transportation process; Step 2: The cut chip damping resistor falls onto the second synchronous belt (7) for transportation, and the third synchronous belt (10) drives the clamping block (14) to move. Then, the chip damping resistor is pushed into the clamping block (14) by the first baffle (25); Step 3: The third synchronous belt (10) drives the clamping block (14) and the chip damping resistor clamped inside it to move. When the rack (17) meshes with the first gear (15), the clamping block (14) and the chip damping resistor clamped by it are driven to rotate one circle, and then the two sides of the chip damping resistor can be polished by the polishing device (20); Step 4: After polishing a number of chip damping resistors that have been segmented, one of the rotating shafts (13) drives the third gear (23) to move until it meshes with the second gear (21). Then, the movable block (19) and the polishing device (20) can be driven to rotate half a circle, and then the cleaning device (32) is started to clean the polishing device (20); Step 5: The polished chip damping resistor is transported through the third synchronous belt (10), and then the chip damping resistor is pushed to fall out of the clamping block (14) by the second baffle (28).

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