Preparation method and application of surface engineered film

Abstract

The invention discloses a preparation method and application of a surface engineered film, including a preparation method of a porous surface film and a preparation method of a patterned film which are cooperatively used, the preparation method of the porous surface film comprises the following steps: hot-pressing a dry high-damping styrene copolymer composition into a sheet, and foaming to obtain high-damping foam, cutting to obtain a film with a porous surface and a skin layer surface film; the preparation method of the patterned film comprises the following steps: uniformly mixing and stirring an organic silicon prepolymer and a curing agent, pouring on the porous surface of the porous surface film or the cortex surface film, covering with a glass plate, putting into a vacuum oven, curing, slowly stripping an organic silicon film body, cleaning with ethanol, and drying with N2 to obtain the patterned film. The preparation method has the beneficial effects that a solvent-free green production process is adopted, the processing flow is simple and controllable, and a reproducible technical path is provided for industrialization of high-performance friction electric devices.

Description

Technical Field

[0001] The present invention relates to the technical field of triboelectric nanogenerators, and particularly to a preparation method and application of a surface-engineered thin film. Background Art

[0002] During the long-term operation of triboelectric nanogenerators (TENGs), frictional wear between materials will significantly reduce their triboelectric performance and even lead to failure. Therefore, the development of damping triboelectric nanogenerators (TENGs) with high buffer and shock absorption performance is crucial for improving their long-term stability and durability.

[0003] To improve the stability and lifespan of TENGs, researchers have attempted to achieve damping effects through structural innovation. For example, Zhang et al. reported an active resonance triboelectric system composed of a pendulum, a rotating arm, and a flexible-ring TENG, which has excellent structural design and high-frequency damping effects and can be used to harvest water wave energy. Li et al. developed a leaf-shaped TENG that generates contact electrification through the damped forced vibration of flexible blades, a vein-bearing plate, and counterweight sheets. Hu et al. fabricated a hybrid generator that combines a sliding-mode TENG and an electromagnetic generator based on an original automotive shock absorber for harvesting suspension vibration energy. However, these mechanical devices rely on complex structural assemblies, which limit the system flexibility, and lack compatible materials with both high damping performance and triboelectric characteristics, and the development of related materials remains blank.

[0004] Meanwhile, surface engineering films are widely used as friction layers to improve the output performance of TENGs, but their preparation faces significant bottlenecks. Traditional methods such as chemical etching, template replication, laser processing, and plasma sputtering can construct micro-nano structured surfaces, but they have problems such as high cost and poor stability and are difficult to apply on a large scale. In contrast, through-hole materials have become an ideal choice for new friction materials due to their advantages of light weight, high specific surface area, and stable structure. However, current through-hole material preparation technologies such as electrospinning, sacrificial templating, 3D printing, and freeze-drying have defects such as chemical solvent pollution, high energy consumption, low production efficiency, and high manufacturing costs, thus restricting their industrialization process. Summary of the Invention

[0005] In view of the problems of high cost, poor stability and solvent pollution in the current preparation methods of surface engineering molds used as friction layers, the present invention provides a preparation method of a surface-engineered thin film and an application of using this engineered thin film to prepare a triboelectric nanogenerator. This method uses supercritical nitrogen (scN2) as a physical foaming agent, and the pore structure of the through-hole elastomer material can be precisely designed by regulating process parameters. It has the advantages of environmental friendliness, controllable cost and industrial-scale production. It can not only realize the stable construction of the internal through-hole morphology of the material, but also open up an innovative path for the development of functional materials with synergistically optimized high damping performance and triboelectric performance, and can break through the double limitations of traditional mechanical structures and surface engineering technologies.

[0006] In order to achieve the above-mentioned invention purpose, the present invention provides a preparation method of a surface-engineered thin film, and the preparation method includes the following steps: The first step: Prepare a porous surface thin film Hot press the dry high-damping styrene copolymer composition into a sheet; under the conditions of 100°C - 130°C and a constant high pressure, saturate the sheet with scN2 for 1.5 - 2.5 h, and then quickly release the pressure to obtain a high-damping foam; the constant high pressure is preferably 15 - 25 MPa, particularly preferably 20 MPa; the foaming temperature is preferably 120°C; There is a very thin skin layer around the high-damping foam after foaming, and the inside is all pore structures. Cut the high-damping foam by mechanical slicing method to obtain a thin film with a porous surface (both sides are porous surfaces) and a skin surface thin film (one side is a porous surface and the other side is a skin surface); wherein, the thickness of both the porous surface thin film and the skin surface thin film is 450 - 550 µm; The second step: Prepare a patterned thin film Mix the silicone prepolymer and the curing agent evenly, pour it on the porous surface of the porous surface thin film or the skin surface thin film, cover it with a glass plate and put it into a vacuum oven, and cure it at 95 - 105°C for 0.5 - 1.5 h and then take it out; Slowly peel off the silicone thin film body formed on the porous surface, wash it with ethanol, and dry it with N2 to obtain a patterned thin film.

[0007] Among them, the high-damping styrene-based copolymer composition is SEBS or a blend of SEBS and ethylene-vinyl acetate rubber (EVM); wherein, the ratio of SEBS to EVM is 50 parts / 50 parts, and the crosslinking agent BIPB is 0.6 parts. The specific preparation process of this blend is as follows: Set the internal mixer to 110°C, then put SEBS and EVM with a mass ratio of 1:1 into the internal mixer and knead for 5 minutes, then add the crosslinking agent BIPB and continue kneading for 5 minutes to obtain the SEBS / EVM blend. Then place it on a flat die press at a temperature of 170°C and a pressure of 10 MPa and mold for 5 minutes, and then cold press for 5 minutes to obtain a sheet; the blend of SEBS and ethylene-vinyl acetate rubber (EVM) is a prior art and will not be elaborated here.

[0008] The organosilicon prepolymer is a PDMS prepolymer or an Ecoflex prepolymer; the mass ratio of the PDMS prepolymer to the curing agent is 8 - 12:1, preferably 10:1; the mass ratio of the Ecoflex prepolymer to the curing agent is 1 - 3:2, preferably 1:1. Of course, this description (mixing and stirring the organosilicon prepolymer and the curing agent evenly) also includes directly using products containing the organosilicon prepolymer and the curing agent, such as Dow Corning PDMS or Ecoflex platinum-catalyzed silicone rubber.

[0009] In the first step, the specific process of hot-pressing the high-damping styrene-based copolymer composition into a sheet is as follows: Dry the high-damping styrene-based copolymer composition in a vacuum drying oven at 55°C - 65°C for 5 - 7 hours, and then under the conditions of 180°C - 200°C and 7.5 - 8.5 MPa, perform vacuum-assisted hot pressing for 9 - 11 minutes to obtain a sheet.

[0010] To better achieve the above-mentioned invention purpose, the present invention also provides a TENG with a vertical contact-separation working mode, including a positive friction layer and a negative friction layer. The surface of the positive friction layer is distributed with micro-nano-sized pits formed after foaming, and the surface of the negative friction layer is distributed with micro-nano-sized bumps corresponding to and complementary to the pits on the positive friction layer; there is a 6-mm air gap between the positive friction layer and the negative friction layer.

[0011] The positive friction layer is a porous surface film or a cortical surface film obtained by using the aforementioned preparation method of the surface-engineered high-damping film; the negative friction layer is a patterned film obtained by using the above-mentioned preparation method of the surface-engineered high-damping film.

[0012] The vertical contact-separation TENG uses nickel tape as an electrode; it can be assembled non-flexibly, such as encapsulated with polyimide PI and polymethyl methacrylate PMMA. If considering environments such as wearable, flexible assembly can be selected, such as encapsulated with a TPU film.

[0013] The beneficial effects of the present invention are as follows: By combining supercritical nitrogen foaming with a mechanical slicing process, the present invention successfully prepares a surface porous film with both high damping characteristics and excellent triboelectric properties. By constructing a triboelectric nanogenerator (hereinafter referred to as "CS-TENG") with a complementary shape to a convex film, a double breakthrough in material properties and device functions is achieved. Moreover, the present invention adopts a solvent-free green production process, with a simple and controllable processing flow, and has the characteristics of intelligent parameter adjustment and flexible assembly method, providing a replicable technical path for the industrialization of high-performance triboelectric devices. Specifically: After foaming treatment, the high damping styrene-based copolymer composition (such as SEBS or modified composite material SEBS / EVM) has a reduced rebound height and improved cushioning performance. Through surface engineering treatment, the frictional loss is significantly reduced. Moreover, the foaming density of the high damping styrene-based copolymer composition (such as SEBS or modified composite material SEBS / EVM) and the patterning parameters of the silicone prepolymer (PDMS prepolymer or Ecoflex prepolymer) can be precisely controlled only by adjusting the foaming temperature (on the basis that other conditions in Example 1 remain unchanged, only adjusting the foaming temperature from 120 °C to 110 °C and 130 °C, the display of the film's open-cell surface and transfer surface is shown in Figure 2 ); In addition, compared with traditional TENGs without complementary shapes, the output performance of the CS-TENG of the present invention has achieved a leapfrog improvement. The open-circuit voltage reaches 310 V and the short-circuit current reaches 1.15 μA, which are increased by 270% and 287.5% respectively, and can drive 120 LED arrays and continuously charge a capacitor; In addition, due to the high flexibility and durability of pf-SEBS and PDMS, the assembled CS-TENG can be used as a self-powered sensor to detect impact forces and various deformations, and a remote control system can be developed by integrating 4 CS-TENG units, showing unique value in the fields of children's intellectual training and elderly rehabilitation assistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a process diagram for preparing a surface open-cell film by mechanical planing in Examples 1-3 of the present invention.

[0015] Figure 2 It is the SEBS porous surface prepared by different foaming methods and the corresponding PDMS transfer structure in Examples 1-3 of the present invention.

[0016] Figure 3 It is the performance enhancement test and potential simulation results of the CS-TENG in Example 9 of the present invention.

[0017] Figure 4 It is the triboelectric working principle diagram of the CS-TENG in Example 9 of the present invention.

[0018] Figure 5Output Isc signals of the flexible CS-TENG for different deformations in Embodiment 9 of the present invention.

[0019] Figure 6 Remote control of a trolley is realized by SRC based on CS-TENG in Embodiment 9 of the present invention. Detailed implementation manners

[0020] To clearly illustrate the technical features of this solution, the following describes this solution through specific implementation manners.

[0021] Embodiment 1 The embodiment of the present invention provides a preparation method of a surface-engineered high-damping film, and the preparation method includes the following steps: The first step: Prepare a porous surface SEBS film Dry SEBS in a vacuum drying oven at 60 °C for 6 h, and then under the conditions of 190 °C and 8 MPa, perform vacuum-assisted hot pressing for 10 min to obtain a SEBS sheet; Under the conditions of 120 °C and a constant pressure of 20 MPa, saturate the SEBS sheet with scN2 for 2 h, and then quickly release the pressure to obtain a high-damping SEBS foam; Cut the high-damping SEBS foam by a mechanical slicing method to obtain a porous surface SEBS film (pf-SEBS) and a cortical surface SEBS film (cs-SEBS) (see Figure 1 ); among them, both the porous surface SEBS film (pf-SEBS) and the cortical surface SEBS film (cs-SEBS) are 500 µm; The second step: Prepare a patterned PDMS film After mixing and stirring the PDMS prepolymer and the curing agent evenly according to a weight ratio of 10:1, cover a glass plate on the porous surface of the porous surface film or the cortical surface film, and place it in a vacuum oven. After curing at 100 °C for 1 h, take it out; the size of the PDMS film can be controlled by a fixed mold in this step, and the size of the fixed mold in this embodiment is 50 mm × 50 mm × 0.2 mm; Slowly peel off the film body formed on the porous surface, wash it with ethanol, and dry it with N2 to obtain a patterned PDMS film.

[0022] Embodiment 2 The embodiment of the present invention provides a preparation method of a surface-engineered high-damping film, and the preparation method includes the following steps: The first step: Prepare a porous surface SEBS film Dry SEBS in a vacuum drying oven at 55 °C for 7 h, and then under the conditions of 180 °C and 8.5 MPa, perform vacuum-assisted hot pressing for 11 min to obtain a SEBS sheet; Under the conditions of 110 °C and a constant pressure of 25 MPa, saturate the SEBS sheet with scN2 for 1.5 h, and then quickly release the pressure to obtain a high-damping SEBS foam; Cut the high-damping SEBS foam by mechanical slicing method to obtain a SEBS film with a porous surface (pf-SEBS) and a SEBS film with a cortical surface (cs-SEBS) (see Figure 1 ); among them, both the porous surface SEBS film (pf-SEBS) and the cortical surface SEBS film (cs-SEBS) are 450 µm; Step 2: Prepare a patterned PDMS film After mixing and stirring the PDMS prepolymer and the curing agent evenly according to a weight ratio of 10:1, cover a glass plate on the porous surface of the porous surface film or the cortical surface film, and place it in a vacuum oven. Take it out after curing at 95 °C for 1.5 h; the size of the PDMS film can be controlled by fixing the mold, and the size of the fixed mold in this example is 50 mm × 50 mm × 0.2 mm; Slowly peel off the film body formed on the porous surface, wash it with ethanol, and dry it with N2 to obtain a patterned PDMS film.

[0023] Example 3 The embodiment of the present invention provides a preparation method of a surface-engineered high-damping film, and the preparation method includes the following steps: Step 1: Prepare a porous surface SEBS film Dry the SEBS in a vacuum drying oven at 65 °C for 5 h, and then under the conditions of 200 °C and 7.5 MPa, vacuum-assisted hot pressing for 9 min to obtain a SEBS sheet; Under the conditions of 130 °C and a constant pressure of 15 MPa, saturate the SEBS sheet with scN2 for 2.5 h, and then quickly release the pressure to obtain a high-damping SEBS foam; Cut the high-damping SEBS foam by mechanical slicing method to obtain a porous surface SEBS film (pf-SEBS) and a cortical surface SEBS film (cs-SEBS) (see Figure 1 ); among them, both the porous surface SEBS film (pf-SEBS) and the cortical surface SEBS film (cs-SEBS) are 550 µm; Step 2: Prepare a patterned PDMS film After mixing and stirring the PDMS prepolymer and the curing agent evenly according to a weight ratio of 12:1, cover a glass plate on the porous surface of the porous surface film or the cortical surface film, and place it in a vacuum oven. Take it out after curing at 105 °C for 0.5 h; the size of the PDMS film can be controlled by fixing the mold, and the size of the fixed mold in this example is 50 mm × 50 mm × 0.2 mm; Slowly peel off the thin film formed on the porous surface, wash it with ethanol, and dry it with N2 to obtain a patterned PDMS film.

[0024] Example 4 An embodiment of the present invention provides a preparation method of a surface-engineered high-damping thin film, and the preparation method includes the following steps: The first step: Prepare a porous surface thin film Blend the SEBS and ethylene-vinyl acetate rubber (EVM) blend in a vacuum drying oven at 60 °C for 6 h, and then under the conditions of 190 °C and 8 MPa, perform vacuum-assisted hot pressing for 10 min to obtain a sheet; Under the conditions of 120 °C and a constant pressure of 20 MPa, saturate the SEBS sheet with scN2 for 2 h, and then quickly release the pressure to obtain a high-damping foam; Cut the high-damping foam by a mechanical slicing method to obtain a porous surface thin film and a cortical surface thin film; wherein, both the porous surface thin film and the cortical surface thin film are 500 µm; The second step: Prepare a patterned PDMS thin film After mixing and stirring the PDMS prepolymer and the curing agent evenly according to a weight ratio of 10:1, cover a glass plate on the porous surface of the porous surface thin film or the cortical surface thin film, put it into a vacuum oven, and cure it at 100 °C for 1 h and then take it out; the size of the PDMS thin film can be controlled by fixing the mold, and the size of the fixed mold in this example is 60 mm × 60 mm × 0.3 mm; Slowly peel off the thin film body formed on the porous surface, wash it with ethanol, and dry it with N2 to obtain a patterned PDMS film.

[0025] Among them, the blend of SEBS and ethylene-vinyl acetate rubber (EVM) is a prior art, the ratio of SEBS to EVM is 50 / 50, and the crosslinking agent is 0.6 parts of BIPB. The specific preparation process of this blend is as follows: Set the internal mixer to 110 °C, then put SEBS and EVM with a mass ratio of 1:1 into the internal mixer and knead for 5 min, then add the crosslinking agent BIPB and continue to knead for 5 min to obtain the SEBS / EVM blend, and then place it on a flat die press at a temperature of 170 °C and a pressure of 10 MPa for molding for 5 min, and then perform cold pressing for 5 min to obtain a sheet; the blend of SEBS and ethylene-vinyl acetate rubber (EVM) is a prior art and will not be elaborated here.

[0026] Example 5 An embodiment of the present invention provides a preparation method of a surface-engineered high-damping thin film, and the preparation method includes the following steps: The first step: Prepare a porous surface SEBS thin film The SEBS was dried in a vacuum drying oven at 60 °C for 6 h, and then vacuum-assisted hot pressing was carried out at 190 °C and 8 MPa for 10 min to obtain SEBS sheets; Under the conditions of 130 °C and a constant pressure of 20 MPa, the SEBS sheets were saturated with scN2 for 2 h, and then the pressure was rapidly released to obtain highly damped SEBS foams; The highly damped SEBS foams were cut by a mechanical slicing method to obtain porous surface SEBS films (pf-SEBS) and cortical surface SEBS films (cs-SEBS); among them, both the porous surface SEBS films (pf-SEBS) and the cortical surface SEBS films (cs-SEBS) were 500 µm; Step 2: Prepare patterned Ecoflex films After mixing and stirring the Ecoflex prepolymer and the curing agent evenly according to a weight ratio of 1:1, a glass plate was covered on the porous surface of the porous surface film or the cortical surface film and placed in a vacuum oven, and after curing at 100 °C for 1 h, it was taken out; the size of the Ecoflex film can be controlled by a fixed mold in this step, and the size of the fixed mold in this example was 50 mm × 50 mm × 0.2 mm; The film body formed on the porous surface was slowly peeled off, washed with ethanol, and dried with N2 to obtain a patterned Ecoflex film.

[0027] Example 6 The embodiment of the present invention provides a preparation method of a surface-engineered highly damped film, and the preparation method includes the following steps: Step 1: Prepare a porous surface film The SEBS and ethylene-vinyl acetate rubber (EVM) blend were dried in a vacuum drying oven at 60 °C for 6 h, and then vacuum-assisted hot pressing was carried out at 190 °C and 8 MPa for 10 min to obtain sheets; Under the conditions of 130 °C and a constant pressure of 20 MPa, the SEBS sheets were saturated with scN2 for 2 h, and then the pressure was rapidly released to obtain highly damped foams; The highly damped foams were cut by a mechanical slicing method to obtain porous surface films and cortical surface films; among them, both the porous surface films and the cortical surface films were 550 µm; Step 2: Prepare patterned Ecoflex films After mixing and stirring the Ecoflex prepolymer and the curing agent evenly according to a weight ratio of 1:1, a glass plate was covered on the porous surface of the porous surface film or the cortical surface film and placed in a vacuum oven, and after curing at 100 °C for 1 h, it was taken out; the size of the Ecoflex film can be controlled by a fixed mold in this step, and the size of the fixed mold in this example was 50 mm × 50 mm × 0.2 mm; The thin film formed on the porous surface was slowly peeled off, washed with ethanol, and dried with N2 to obtain a patterned Ecoflex film.

[0028] Among them, the specific preparation process of SEBS and ethylene-vinyl acetate rubber (EVM) is as follows: The internal mixer was set to 110 °C, and then SEBS and EVM with a mass ratio of 1:1 were put into the internal mixer and kneaded for 5 min. Then, the cross-linking agent BIPB was added and kneaded for another 5 min to obtain a SEBS / EVM blend. Then, it was placed on a flat die press at a temperature of 170 °C and a pressure of 10 MPa and molded for 5 min, and then cold-pressed for 5 min to obtain a sheet.

[0029] Example 7 An embodiment of the present invention provides a TENG with a vertical contact-separation working mode, including a positive friction layer, a negative friction layer, and an electrode layer. Micro-nano-sized pits formed after foaming are distributed on the inner surface of the positive friction layer, and micro-nano-sized bumps corresponding to and complementary to the pits of the positive friction layer are distributed on the inner surface of the negative friction layer; there is a 6-mm air gap between the positive friction layer and the negative friction layer.

[0030] The positive friction layer and the negative friction layer are respectively a porous surface SEBS film and a patterned PDMS film obtained by using the preparation method of the surface-engineered high-damping thin film provided in Example 1.

[0031] The triboelectric nanogenerator uses nickel tape as the electrode; it can be assembled non-flexibly, such as encapsulated with polyimide PI and polymethyl methacrylate PMMA. If considering environments such as wearable, flexible assembly can be selected, such as encapsulated with a TPU film.

[0032] Example 8 An embodiment of the present invention is a TENG, which is improved on the basis of Example 7. The difference is that the positive friction layer and the negative friction layer are respectively a porous surface thin film and a patterned thin film obtained by using the preparation method of the surface-engineered high-damping thin film provided in any one of Examples 2-6.

[0033] Example 9 An embodiment of the present invention provides a TENG with a vertical contact-separation working mode, including using the porous surface SEBS film prepared in Example 1 as the positive friction layer, the patterned PDMS film as the negative friction layer, and nickel tape as the electrode. The porous surface SEBS film is paired and installed with the convex-patterned PDMS film.

[0034] It is obtained through test experiments that for the highly damped SEBS prepared by using supercritical nitrogen (scN2) foaming technology, compared with that before foaming, the rebound height is reduced by 87.5%, and the buffering effect is increased by 700%. The test method is as follows: a rebound test track is composed of a 100-mm-high transparent plastic tube and a 100-mm-long scale, and a small metal ball of a certain mass makes a free-fall motion from the top of the plastic tube, and the rebound height after the ball contacts the foam material at the bottom of the plastic tube is observed.

[0035] A porous surface SEBS film (pf-SEBS) with excellent damping and triboelectric properties is obtained by mechanical slicing and paired with a convex-patterned PDMS film to form a complementary-shaped TENG. Its working principle is as Figure 4 shown. Compared with the TENG without complementary shape (a traditional TENG composed of an unfoamed SEBS film and an un-surface-engineered PDMS film), its open-circuit voltage (Voc) and short-circuit current (Isc) are increased by 270% and 287.5% respectively, reaching 310 V and 1.15 μA (see Figure 3 ). The excellent output performance of the CS-TENG enables it to light at least 120 LED lights, charge a capacitor, and also power small electronic devices.

[0036] Due to the high flexibility and durability of pf-SEBS and PDMS, the assembled CS-TENG can be used as a self-powered sensor to detect impact forces and various deformations, as Figure 5 shown, Figure 5 (a) is a schematic diagram of the flexible packaging of the CS-TENG; (b) the flexible CS-TENG is placed at the heel position inside the shoe to monitor different current signals during normal walking, fast walking, and running; (c) the current signal output when gently touching the CS-TENG with a finger and hitting it with a fist; (d) the current output when stretching the CS-TENG by hand; (e) the current output when repeatedly bending the CS-TENG by hand; (f) the current output when twisting the CS-TENG by hand. Through the comparison of the above signals, it can be confirmed that the CS-TENG has a high corresponding sensitivity to different forms of forces, and the force intensity and even type of the CS-TENG can be distinguished through the signals.

[0037] In addition, based on the method of the present invention, a self-powered remote control system based on 4 CS-TENGs is also developed, which is used to manipulate the movement trajectory of a vehicle, provide support for the intellectual development of children, and provide assistance for the rehabilitation process of the elderly (see Figure 6 for illustration). Specifically, as Figure 6(a), This application can help the elderly recover lower limb coordination and help infants practice walking through an entertainment form that controls the running trajectory of the trolley. For example, when stepping on the CS-TENG at position F, the trolley will move forward. FBLR are the abbreviations for front, back, left, and right respectively. To test the performance of the constructed wireless sensing system, the demonstrations as shown in Figure 6 (b) and Figure 6 (c) were carried out. In the demonstration of this application, the pressure signal is collected and transmitted by an external circuit composed of a signal amplifier (LM358), a signal processor (STM32), and MCUs (ESP32, F103C8T6). In addition, the same type of single-chip microcomputer (ESP8266) is used as a wireless transmitter and a wireless receiver. The relevant algorithms can be developed on the Arduino IDE and deployed on the MCU of the test vehicle. In short, the method of the present invention has certain application value for promoting material optimization and green industrialization.

[0038] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for preparing a surface engineered film, characterized in that: The preparation method comprises the following steps: Step 1: Preparation of porous surface film The dried high-damping styrene copolymer composition is hot-pressed into a sheet; the sheet is saturated with scN2 for 1.5-2.5 hours at 100° C.-130° C. and constant high pressure conditions, and then the pressure is rapidly released to obtain a high-damping foam; The high damping foam is cut by mechanical slicing to obtain a film with a porous surface and a film with a skin surface; Step 2: Preparation of patterned films After mixing and stirring the organosilicon prepolymer and the curing agent evenly, pouring the mixture onto the porous surface of the porous surface film or the porous surface film of the skin layer, covering the mixture with a glass plate and placing the mixture into a vacuum oven, curing the mixture at 95-105° C. for 0.5-1.5 hours, and then taking the mixture out; The organic silicon thin film formed on the porous surface is slowly peeled off, washed with ethanol, and dried with N2 to obtain a patterned thin film.

2. The preparation method according to claim 1, characterized in that: The high damping styrene copolymer composition is SEBS or a blend of SEBS and ethylene-vinyl acetate rubber (EVM).

3. The preparation method according to claim 1, characterized in that: The organosilicon prepolymer is PDMS prepolymer or Ecoflex prepolymer; The mass ratio of the PDMS prepolymer to the curing agent is 8-12:1; The mass ratio of the Ecoflex prepolymer to the curing agent is 1-3:

2.

4. The preparation method according to claim 1, characterized in that: In the first step, the high damping styrene copolymer composition is hot pressed into a sheet material by: The high damping styrene copolymer composition is dried in a vacuum drying oven at 55° C.-65° C., and then vacuum-assisted hot-pressed at 180° C.-200° C. and 7.5-8.5 MPa for 9-11 minutes to obtain a sheet.

5. The preparation method according to claim 1, characterized in that: The thickness of the porous surface film and the skin surface film are both 450-550 μm.

6. A surface engineered high damping film, characterized in that: The film is prepared by the method for preparing a surface engineered high damping film as described in any one of claims 1 to 5.

7. A TENG, characterized in that: The TENG works in a vertical contact separation mode and includes a positive friction layer and a negative friction layer. The surface of the positive friction layer is distributed with micro-nano sized pits formed after foaming, and the surface of the negative friction layer is distributed with micro-nano sized protrusions corresponding to the pits of the positive friction layer and capable of forming complementary shapes.

8. The TENG according to claim 7, characterized in that: The positive friction layer is a porous surface film or a skin surface film obtained by the preparation method of the surface engineered high damping film according to any one of claims 1 to 5; The negative friction layer is a patterned film obtained by the preparation method of the surface engineered high damping film as described in any one of claims 1 to 4.

9. The TENG according to claim 7, characterized in that: The TENG uses nickel tape as an electrode, and uses polyimide (PI) and polymethyl methacrylate (PMMA) to achieve rigid packaging, or uses TPU film to achieve flexible packaging.

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