Mounting support of eddy current sensor, mounting and debugging method and storage medium

Abstract

The invention provides a mounting support of an eddy current sensor, a mounting and debugging method and a storage medium. The installation support comprises a support body and a processing assembly, the support body comprises a fixed assembly and a movable assembly, the movable assembly is arranged in the fixed assembly to form a first cavity and a second cavity in the inner space of the fixed assembly, a probe of the eddy current sensor is arranged at one end of the movable assembly, and the processing assembly is arranged in the first cavity. The fixed assembly is provided with a first opening and a second opening, the movable assembly penetrates through the first opening to drive the probe to be close to or far away from the tested equipment when moving in the internal space of the fixed assembly, and a cable of the eddy current sensor is connected to the processing assembly through a built-in through hole of the movable assembly and the second opening; and the processing assembly is configured to control the movable assembly to move in the internal space of the fixed assembly based on a gap value between the probe and the tested equipment so as to adjust the sensor mounting gap. According to the invention, the capability of measuring large displacement change by using a small-mileage sensor can be achieved.

Description

Technical Field

[0001] This application relates to the technical field of gas turbine testing, and particularly to a mounting support for an eddy current sensor, a mounting and debugging method, and a storage medium. Background Art

[0002] An eddy current sensor (also known as an eddy current displacement sensor) is a non-contact linear measurement tool that can accurately measure the static and dynamic relative displacement changes between the measured metal object and the probe end face. The principle of the eddy current sensor is to accurately measure the relative position between the measured device and the probe end face through the principle of the eddy current effect. Its characteristics are good long-term working reliability, high sensitivity, strong anti-interference ability, non-contact measurement, fast response speed, and being unaffected by media such as oil and water. It is widely used in the measurement of rotor displacement changes of large rotating machinery.

[0003] In order to accurately measure the displacement change of the measured position, it is necessary to design a corresponding mounting seat to ensure that the sensor is stably installed and perpendicular to the measured surface. The mounting seats of eddy current sensors in related technologies often cannot automatically adjust the mounting gap. When measuring equipment with a relatively high degree of maturity, since the displacement can be accurately evaluated, the type selection of the eddy current sensor can be accurately realized. Therefore, the appropriate mounting gap can be relatively accurately evaluated during installation, achieving accurate measurement without colliding with the probe. However, for measured equipment with a low degree of maturity, the displacement change cannot be accurately given, or the given range is large, resulting in difficulty in selecting an eddy current sensor with a corresponding range. Moreover, eddy current sensors with a large range have large external dimensions, and it is also difficult to have sufficient installation space. Summary of the Invention

[0004] The embodiments of this application provide a mounting support for an eddy current sensor, a mounting and debugging method, and a storage medium, which solve the problem of how to ensure both the accuracy of measurement and that the eddy current sensor is not damaged after installation when the displacement change of the measured equipment cannot be accurately evaluated.

[0005] According to the first aspect of the embodiments of this application, a mounting support for an eddy current sensor is provided, including: a support body and a processing component, where,

[0006] The support body includes a fixed component and a movable component. The movable component is placed inside the fixed component to form a first cavity and a second cavity in the internal space of the fixed component. The probe of the eddy current sensor is placed at one end of the movable component. The fixed component is provided with a first opening and a second opening. When the movable component moves in the internal space of the fixed component, it passes through the first opening to drive the probe to approach or move away from the measured equipment. The cable of the eddy current sensor is connected to the processing component through the internal through hole of the movable component and the second opening;

[0007] The processing component is configured to control the movement of the movable component within the internal space of the fixed component based on the gap value between the probe and the device under test, so as to adjust the sensor installation gap.

[0008] According to the second aspect of the embodiments of the present application, there is provided a method for installing and debugging an eddy current sensor. The method is implemented based on the installation support of the foregoing first aspect, and the method includes:

[0009] Obtain the real-time gap value between the probe of the eddy current sensor and the device under test;

[0010] Based on the real-time gap value, control the movement of the movable component within the internal space of the fixed component to adjust the sensor installation gap.

[0011] According to the third aspect of the embodiments of the present application, there is provided a storage medium storing instructions that, when run on a processing component, cause the processing component to execute the method of the foregoing first aspect.

[0012] According to the fourth aspect of the embodiments of the present application, there is provided a program product including at least one of a program and instructions. When the at least one of the program and instructions is executed by a processing component, the steps of the method described in the foregoing first aspect are implemented.

[0013] According to the technical solution of the present application, the movement function of the movable component can be controlled by controlling the pressure in the cavities on both sides of the movable component, and the installation gap can be adjusted automatically online, solving the problem of how to ensure the measurement accuracy and prevent the eddy current sensor from being damaged after installation when the displacement change of the device under test cannot be accurately evaluated. Thus, the ability to measure large displacement changes using a small-range eddy current sensor can be achieved.

[0014] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the drawings, in which:

[0016] Figure 1 is an exemplary diagram of the installation support of the eddy current sensor provided by the embodiments of the present application;

[0017] Figure 2 is an exemplary diagram of the internal configuration control logic of the processing component provided by the embodiments of the present application;

[0018] Figure 3 is a flowchart of the method for installing and debugging the eddy current sensor provided by the embodiments of the present application. DETAILED DESCRIPTION

[0019] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0020] The following describes exemplary embodiments of the present application in conjunction with the accompanying drawings. Various details of the embodiments of the present application are included to assist understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0021] The terms used in one or more embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit one or more embodiments of the present application. The singular forms "a", "the", and "said" used in one or more embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" used in one or more embodiments of the present application refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0022] It should be understood that although the terms first, second, etc. may be used in one or more embodiments of the present application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of one or more embodiments of the present application, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining".

[0023] The mounting bracket, mounting and debugging method, and storage medium of the eddy current sensor according to the embodiments of the present application will be described below with reference to the accompanying drawings.

[0024] Figure 1 The following is an exemplary diagram of the mounting bracket of the eddy current sensor provided for the embodiments of the present application. As Figure 1As shown, the mounting support of the eddy current sensor may include: a support body 100 and a processing component 200. Among them, the support body 100 may include a fixed component 101 and a movable component 102. The movable component 102 may be placed inside the fixed component 101 to form a first cavity 101a and a second cavity 101b in the internal space of the fixed component 101. The probe 21 of the eddy current sensor may be placed at one end of the movable component 102. The fixed component 101 may be provided with a first opening 1011 and a second opening 1012. When the movable component 102 moves in the internal space of the fixed component 101, it passes through the first opening 1011 to drive the probe 21 to approach or move away from the device under test. The cable 22 of the eddy current sensor may be connected to the processing component 200 through the built-in through hole of the movable component 102 and the second opening 1012. Exemplarily, the movable component 102 may be a piston. For example, both sides of the piston are in a protruding structure. The probe 21 of the eddy current sensor may be placed at the top of the protruding structure on one side of the piston. This side of the protruding structure may pass through the first opening 1011 to drive the probe 21 to approach or move away from the device under test. The protruding structure on the other side of the piston may be fixed to or pass through the second opening 1012. For example, the protruding structure on the other side of the piston may be fixed at the second opening 1012, and the material of the protruding structure on the other side of the piston may be a telescopic material to ensure that the piston can move in the internal space of the fixed component 101. Another example is that the protruding structure on the other side of the piston may pass through the second opening 1012. For example, when the piston moves in the internal space of the fixed component 101, the protruding structures on both sides of the piston may pass through the first opening 1011 or the second opening 1012 as the piston moves. Exemplarily, the device under test may be a gas turbine.

[0025] In some embodiments, as Figure 1 shown, the mounting support of the eddy current sensor may further include: a pressure regulating component 400. The fixed component 101 may be provided with a first through hole 1021 and a second through hole 1022. The first through hole 1021 communicates with the first cavity 101a, and the second through hole 1022 communicates with the second cavity 101b. The pressure regulating component 400 may be connected to the first through hole 1021 through a first pipe 11, and the pressure regulating component 400 may be connected to the second through hole 1022 through a second pipe 12.

[0026] In some embodiments, the pressure transmission medium of the pressure regulating assembly may be a gas or a liquid. Exemplarily, the pressure regulating assembly 400 may be a solenoid valve, but is not limited thereto. In one possible implementation, the pressure transmission medium of the pressure regulating assembly may be a gas, and the first pipe 11 and the second pipe 12 may be gas supply pipelines. By controlling the solenoid valve to operate, the air pressures in the first cavity 101a and the second cavity 101b can be changed, so as to push the movable assembly 102 to move within the internal space of the fixed assembly 101. In another possible implementation, the pressure transmission medium of the pressure regulating assembly may be a liquid, and the first pipe 11 and the second pipe 12 may be liquid supply pipelines. By controlling the solenoid valve to operate, the hydraulic pressures in the first cavity 101a and the second cavity 101b can be changed, so as to push the movable assembly 102 to move within the internal space of the fixed assembly 101.

[0027] In an embodiment of the present application, the processing component 200 may be configured to: based on the gap value between the probe 21 and the device under test, control the movable assembly 102 to move within the internal space of the fixed assembly to adjust the sensor installation gap.

[0028] In some embodiments, the processing component 200 may, based on the real-time gap value between the probe and the device under test, adjust the respective pressures in the first cavity 101a and the second cavity 101b by controlling the pressure regulating assembly 102, so as to drive the movable assembly 102 to move within the internal space of the fixed assembly 101. Exemplarily, the processing component 200 may pre-configure corresponding control logics. The processing component 200 may collect the gap value between the probe and the device under test in real time. When the gap value between the probe and the device under test is less than a first threshold, the processing component 200 may control the pressure regulating assembly 400 to act, so as to move the eddy current sensor away from the device under test, and immediately correct the actual measurement value of the eddy current sensor based on the moving distance of the movable assembly 102 after the movement to obtain the true displacement value.

[0029] Exemplarily, when the eddy current sensor is away from the device under test, such as when the difference between the real-time gap value between the probe of the eddy current sensor and the device under test and the upper limit of the range is less than or equal to a second threshold (that is, the real-time gap value between the probe and the device under test is close to the upper limit of the range of the eddy current sensor), the processing component 200 may control the pressure regulating assembly 400 to act, so as to move the eddy current sensor towards the device under test, and immediately correct the actual measurement value of the eddy current sensor based on the moving distance of the movable assembly 102 after the movement to obtain the true displacement value. It should be noted that when driving the movable assembly 102 to move, the moving distance of the movable assembly 102 needs to be less than the range of the eddy current sensor, which can be determined during the design stage of the mounting bracket.

[0030] In some embodiments, the sum of the measurement range of the eddy current sensor and the distance that the movable component can move is greater than the displacement change value of the device under test, and the measurement range of the eddy current sensor is greater than the distance that the movable component can move; when the mounting bracket is initially installed, with reference to the measurement range of the eddy current sensor, when the device under test is in a stationary state, the sensor installation gap is equal to the actual measurement value of the eddy current sensor and less than the measurement range of the eddy current sensor. For example, as Figure 2 shown, the corresponding control logic of the internal configuration of the processing component is shown, where the blue arrow represents the first through hole 1021 and the red arrow represents the second through hole 1022. By controlling the pressure of the first through hole 1021 and the second through hole 1022, the distance between the probe and the surface to be measured is changed. The measured value is corrected according to the distance between the sensor probe and the surface to be measured, and the true displacement value X d is obtained, realizing the on-line installation gap adjustment during the measurement process. As Figure 2 shown, assuming that the displacement change value of the device under test is A, the measurement range of the eddy current sensor is B, and the distance that the movable component can move is C. When selecting and designing the installation of the eddy current sensor, it is necessary to ensure that B + C > A and B > C. When the mounting bracket is initially installed, with reference to the measurement range of the eddy current sensor, assuming the installation distance (installation gap) is D (D < B), the actual measurement value of the eddy current sensor is X, and the true displacement value X d of the device under test when it is in a stationary state is equal to X. During the operation of the device under test, the displacement changes: when the gap between the eddy current sensor and the device under test is less than the first threshold, the processing component 200 controls the pressure regulating component 400 to act, so that the first through hole 1021 discharges the pressure transmitting medium, and the second through hole 1022 discharges the pressure transmitting medium, pushing the eddy current sensor away from the device under test. Immediately after the push, the processing component 200 will calculate a new displacement amount, and the true displacement value is the measured value minus the push distance, that is, X d = X - C, where C is the push distance, that is, the distance that the movable component can move. Exemplarily, the value of C can be a fixed value, which can be determined based on factors such as the actual size and shape of the mounting seat. Or, exemplarily, the value of C can be a dynamic value. For example, it can be determined based on the gap size between the eddy current sensor and the device under test (that is, the distance that the movable component can move). For example, when the gap between the eddy current sensor and the device under test is less than the first threshold, if the gap between the eddy current sensor and the device under test is smaller, the distance that the movable component can move can be larger.

[0031] When the gap between the eddy current sensor and the device under test approaches the upper limit of the range of the eddy current sensor, the processing component 200 controls the pressure regulating component 400 to act, so that the pressure transmission medium is discharged from the second through hole 1022, and the pressure transmission medium is discharged from the first through hole 1021, pushing the eddy current sensor towards the device under test. Immediately after the push, the processing component 200 will calculate a new displacement amount. The true displacement value is the measured value plus the pushing distance, that is, X d = X + C, where C is the pushing distance, that is, the distance that the movable component can move. Exemplarily, the value of C can be a fixed value, which can be determined based on factors such as the actual size and shape of the mounting base. Or, exemplarily, the value of C can be a dynamic value. For example, the value of C (that is, the distance that the movable component can move) can be determined based on the gap size between the eddy current sensor and the device under test. For example, when the gap between the eddy current sensor and the device under test approaches the upper limit of the range of the eddy current sensor, if the gap between the eddy current sensor and the device under test is larger, the distance that the movable component can move can be larger.

[0032] That is to say, when the distance between the eddy current sensor and the device under test is close, when the gap is less than the first threshold (which can be set as needed), the processing component 200 controls the eddy current sensor to retract by C. After retraction, the true measured value is X - C; when the eddy current sensor is far from the device under test (when the actual measured value is about to reach the upper limit of the range), the processing component 200 controls the eddy current sensor to extend by C. After extension, the true measured value is X + C. At this time, if the distance between the eddy current sensor and the device under test increases by C again, the eddy current sensor is still within the range. Therefore, the actual measurable upper limit of the eddy current sensor is B + C.

[0033] It should be noted that when the movable range of the device under test is large and the selected range of the eddy current sensor is not sufficient to cover its displacement change, the mounting support provided by the present application can achieve the effect of accurate measurement in the full range, and at the same time, it can ensure that the sensor is not damaged when the distance between the sensor and the device under test becomes smaller.

[0034] By implementing the embodiments of the present application, the function of controlling the movement of the movable component can be achieved by controlling the pressure in the cavities on both sides of the movable component, and the installation gap can be automatically adjusted online, solving the problem of how to ensure both the accuracy of measurement and the non-damage of the eddy current sensor after installation when the displacement change of the device under test cannot be accurately evaluated. Thus, the ability to measure large displacement changes with a small-range eddy current sensor can be achieved.

[0035] Figure 3The flowchart of the installation and debugging method for the eddy current sensor provided by the embodiment of the present application. It should be noted that, in the embodiment of the present application, this method can be implemented based on the installation support described in any of the foregoing embodiments. For the optional implementation manners of the installation support structure, refer to the optional implementation manners of the foregoing embodiments, which will not be elaborated herein. As an example, the execution subject of the installation and debugging method for the eddy current sensor can be a processing component. As Figure 3 shown, the installation and debugging method for the eddy current sensor may include but is not limited to the following steps.

[0036] In step 301, obtain the real-time gap value between the probe of the eddy current sensor and the device to be measured.

[0037] Exemplarily, the processing component can collect the gap value between the probe of the eddy current sensor and the device to be measured in real time.

[0038] In step 302, based on the real-time gap value, control the movable component to move within the internal space of the fixed component to adjust the sensor installation gap.

[0039] In some embodiments, based on the real-time gap value, the pressures in the first cavity and the second cavity can be adjusted by controlling the pressure regulating component to drive the movable component to move within the internal space of the fixed component.

[0040] In a possible implementation manner, when the real-time gap value between the probe and the device to be measured is less than the first threshold, control the pressure regulating component to move the eddy current sensor away from the device to be measured, and immediately correct the actual measurement value of the eddy current sensor based on the moving distance of the movable component after the movement to obtain the true displacement value.

[0041] In a possible implementation manner, when the difference between the real-time gap value between the probe and the device to be measured and the upper limit of the range is less than or equal to the second threshold, control the pressure regulating component to move the eddy current sensor closer to the device to be measured, and immediately correct the actual measurement value of the eddy current sensor based on the moving distance of the movable component after the movement to obtain the true displacement value.

[0042] By implementing the embodiment of the present application, the problem of how to ensure both the measurement accuracy and prevent the eddy current sensor from being damaged after installation when the displacement change of the device to be measured cannot be accurately evaluated is solved, so that the ability to measure large displacement changes with a small-range eddy current sensor can be achieved.

[0043] To implement the above embodiment, the present application further provides a storage medium storing instructions, characterized in that when the instructions run on the processing component, the processing component is caused to execute the installation and debugging method for the eddy current sensor provided by the present application.

[0044] To implement the above embodiments, the present application further provides a program product, including at least one of a program and instructions. When at least one of the program and instructions is executed by a processing component, the steps of the installation and debugging method of the eddy current sensor provided by the present application are implemented.

[0045] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or in conjunction with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of the computer-readable medium include the following: an electrical connection part with one or more wirings (electronic device), a portable computer diskette case (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, deciphering, or otherwise processing as appropriate, and then storing it in a computer memory.

[0046] It should be understood that each part of the present application can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits with logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits with suitable combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0047] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the method for implementing the above embodiments can be completed by instructing relevant hardware through a program. The program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0048] In addition, each functional unit in various embodiments of the present application may be integrated into one processing module, or each unit may exist physically alone, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. When the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0049] The above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disc, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

[0050] In the present application, unless otherwise clearly specified and defined, terms such as "installed", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

Claims

1. A mounting support for an eddy current sensor, characterized in that: include: The support body and the processing assembly, wherein The support body includes a fixed component and a movable component, the movable component is placed inside the fixed component to form a first cavity and a second cavity in the internal space of the fixed component, the probe of the eddy current sensor is placed at one end of the movable component, the fixed component is provided with a first opening and a second opening, the movable component passes through the first opening when moving in the internal space of the fixed component to drive the probe to approach or move away from the device under test, and the cable of the eddy current sensor is connected to the processing component through the built-in through hole of the movable component and the second opening; The processing component is configured to control the movable component to move within the internal space of the fixed component based on the gap value between the probe and the device under test, so as to adjust the sensor installation gap.

2. The mounting bracket according to claim 1, characterized in that: Also includes: A pressure regulating component; the fixing component is provided with a first through hole and a second through hole, the first through hole is connected to the first cavity, the second through hole is connected to the second cavity, the pressure regulating component is connected to the first through hole through a first pipe, and the pressure regulating component is connected to the second through hole through a second pipe.

3. The mounting bracket according to claim 2, characterized in that: The pressure transmission medium of the pressure regulating component is gas or liquid.

4. The mounting support according to claim 2 or 3, characterized in that: The processing component adjusts the respective pressures in the first cavity and the second cavity by controlling the pressure regulating component based on the real-time gap value between the probe and the device under test, so as to drive the movable component to move in the internal space of the fixed component.

5. The mounting bracket according to claim 1, characterized in that: The sum of the measuring range of the eddy current sensor and the movable distance of the movable component is greater than the displacement change value of the device under test, and the measuring range of the eddy current sensor is greater than the movable distance of the movable component; and When the mounting bracket is initially installed, taking the measuring range of the eddy current sensor as a reference, when the device under test is in a stationary state, the sensor mounting gap is equal to the actual measured value of the eddy current sensor and is smaller than the measuring range of the eddy current sensor.

6. A method for installing and debugging an eddy current sensor, characterized in that: The method is implemented based on the mounting support according to any one of claims 1 to 5, and the method comprises: Obtaining a real-time gap value between a probe of the eddy current sensor and a device under test; Based on the real-time gap value, the movable component is controlled to move within the internal space of the fixed component to adjust the sensor installation gap.

7. The method according to claim 6, characterized in that The controlling the movable component to move within the internal space of the fixed component based on the real-time gap value includes: Based on the real-time gap value, the pressures in the first cavity and the second cavity are adjusted by controlling the pressure regulating component to drive the movable component to move in the internal space of the fixed component.

8. The method according to claim 7, characterized in that Based on the real-time gap value, the pressure in the first cavity and the second cavity is adjusted by controlling the pressure regulating component to drive the movable component to move in the internal space of the fixed component to adjust the sensor installation gap, including: When the real-time gap value between the probe and the device under test is less than a first threshold value, the pressure regulating component is controlled to move the eddy current sensor away from the device under test, and the actual measurement value of the eddy current sensor is corrected based on the moving distance of the movable component immediately after the movement to obtain a true displacement value; or When the difference between the real-time gap value between the probe and the device under test and the upper limit of the measuring range is less than or equal to a second threshold value, the pressure adjustment component is controlled to move the eddy current sensor toward the device under test, and the actual measurement value of the eddy current sensor is corrected based on the moving distance of the movable component immediately after the movement to obtain a true value of the displacement.

9. A storage medium storing instructions, characterized in that: When the instructions are executed on a processing component, the processing component is caused to execute the method according to any one of claims 6 to 8.

10. A program product, comprising at least one of a program and an instruction, characterized in that: When at least one of the program and the instruction is executed by the processing component, the steps of the method described in any one of claims 6 to 8 are implemented.

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