Thermal image camera

By arranging the equipment in the thermal image camera, the visual structure group is arranged relative to the infrared structure group, thereby reducing the heat impact, solving the problem of reducing the measurement accuracy by thermal influence, and achieving higher measurement accuracy.

CN120194813APending Publication Date: 2025-06-24ROBERT BOSCH GMBH
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Patent Information

Application Number
CN202411877351.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-12-22
Filing Date
2024-12-19
Publication Date
2025-06-24

AI Technical Summary

Technical Problem

Existing thermal image cameras are susceptible to heat during the measurement process, resulting in a decrease in measurement accuracy.

Method used

The arrangement of the visual structure group relative to the infrared structure group is reduced by arranging the thermal influence.

Benefits of technology

It effectively reduces the thermal impact and improves the measurement accuracy of thermal image cameras.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN120194813A_ABST
    Figure CN120194813A_ABST
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Abstract

Disclosed is a thermal image camera (100) having a housing (110), having a front support (120), having an infrared structure group (140) for detecting infrared radiation, having a visual structure group (160) for receiving visual radiation, and having at least one cooling element (180) at least for cooling the infrared structure group (140), the set of infrared structures (140) and the set of visual structures (160) are substantially disposed within the housing (110). According to the invention, the thermal image camera (100) has an arrangement device (200), which is designed to arrange the visual structure group (160) relative to the infrared structure group (160).
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Description

Technical Field

[0001] The present invention relates to a thermal imaging camera. Background Art

[0002] A handheld thermal imaging camera for non - contact acquisition of two - dimensional temperature information of a scene is known from DE 10 2016 219 388 A1. The handheld thermal imaging camera has a housing which has at least one infrared detector array composed of a plurality of pixels sensitive to infrared radiation. Summary of the Invention

[0003] The present invention starts from a thermal imaging camera which has a housing, a front support, an infrared structure group for detecting infrared radiation, a visual structure group for receiving visual radiation and at least one cooling element which is at least used for cooling the infrared structure group, wherein the infrared structure group and the visual structure group are basically arranged in the housing. It is proposed that the thermal imaging camera has an arrangement device which is configured to arrange the visual structure group relative to the infrared structure group.

[0004] The present invention provides a thermal imaging camera in which thermal influence can be reduced by arranging the visual structure group relative to the infrared structure group.

[0005] A "thermal imaging camera" refers to a device for non - contact measurement of two - dimensional temperature information of a scene when at least outputting information related to two - dimensional temperature information, for example when outputting one or more temperature descriptions, and the one or more temperature descriptions are advantageously two or more temperature values, temperature distributions or the like. In an embodiment of the thermal imaging camera, the two - dimensional temperature information can exist in the form of a thermal image which consists of a plurality of location - resolved and / or spatially - angularly - resolved temperature measurement values.

[0006] The thermal imaging camera can be configured as a handheld thermal imaging camera. A "handheld" thermal imaging camera should in particular be understood as meaning that the thermal imaging camera can be transported only by means of the user's hand, in particular by means of one hand of the user, without the assistance of a transport device. In particular, the thermal imaging camera can also be guided through space in a handheld manner during the measurement process in a movement freely performed by the user of the thermal imaging camera. The mass of the handheld thermal imaging camera is in particular less than 5 kg, advantageously less than 3 kg and particularly advantageously less than 1 kg.

[0007] The housing can be configured as a shell-type housing having two half-shells. The housing has a handle or a handle area by means of which the thermal imaging camera can be guided by a user. The housing receives at least the essential functional components of the thermal imaging camera. Thus, the infrared structure group and the visual structure group are substantially arranged within the housing. In addition, the front support, the cooling element, and / or the arrangement device can be substantially arranged within the housing. Furthermore, the housing receives at least one control unit, an input device and / or an output device (in particular a display device), an energy supply unit, and an analysis and processing unit. The thermal imaging camera can have at least one operating element which is configured to operate the thermal imaging camera. In addition, the housing can have at least one access opening into which visual radiation and / or infrared radiation can enter.

[0008] The front support can be received by the housing. Here, the front support can enclose the housing relative to the environment. The functional components of the thermal imaging camera can be substantially protected within the housing against environmental influences. The front support has openings for the infrared structure group and the visual structure group. The front support has a receiving portion for the visual structure group. The receiving portion for the visual structure group is configured to at least partially surround the visual structure group. The visual structure group can abut against the receiving portion of the front support by means of an end face. It is possible that the visual structure group abuts against the front support, in particular against the receiving portion of the front support, by means of visual optics. The front support can be manufactured, for example, from a thermally conductive material, such as aluminum.

[0009] The visual structure group includes at least one visual camera for taking at least one image and / or video in the visual spectrum of radiation, an optics for the visual camera, and a circuit board for the visual camera. The visual structure group, in particular the circuit board for the visual camera, is connected to the control unit in terms of signal technology. The optics for the visual camera is configured to refract, converge, and / or focus visual radiation and conduct it to the visual camera.

[0010] In addition, the front support has a further receiving portion. The further receiving portion of the front support can have an adhesive layer or an adhesive pad. The further receiving portion of the front support is configured to receive at least one infrared window and / or a glass plate for the visual structure group. In addition, it is possible that the further receiving portion of the front support receives, for example, a laser and a lens for a light source (such as an LED). In addition, a seal can be applied to and / or adhered to the front support.

[0011] The infrared structure group can have an infrared housing, an infrared sensor, infrared optics, and / or an infrared circuit board. The infrared housing is configured to arrange the infrared optics relative to the infrared sensor. The infrared sensor can be configured as an infrared detector array. It is also conceivable that the infrared sensor is configured as a bolometer, in particular a microbolometer. For measuring infrared radiation, the thermal imaging camera has an infrared structure group and an analysis and processing unit. The infrared sensor has a plurality of pixels sensitive to infrared radiation. The infrared sensor detects the infrared radiation radiated in a spatial angular range and projected onto the surface of the infrared sensor, and generates a detection signal based on the detected intensity of the incident infrared radiation. The infrared sensor has a two-dimensional detection surface on the surface facing the scene, and a plurality of pixels sensitive to infrared radiation are arranged on the two-dimensional detection surface. Here, each pixel in the pixels of the infrared detector array can, on the premise of being irradiated with infrared radiation, obtain image information and thereby generate a detection signal. Next, the detection signals provided by each pixel can be used to determine temperature information. In particular, the detection signal of each pixel can be forwarded to the analysis and processing unit of the thermal imaging camera. The detection signal can be analyzed and processed by the analysis and processing unit individually and / or in combination with the detection signals of other pixels. The infrared optics is configured to refract, converge, and / or focus the infrared radiation and conduct it onto the infrared sensor. The infrared sensor can be arranged on the infrared circuit board. Thus, the infrared sensor can be arranged between the infrared circuit board and the infrared optics. The infrared circuit board is connected in terms of signal technology to the control unit and / or the analysis and processing unit, so that the detection signal can be conducted from the infrared structure group to the control unit and / or the analysis and processing unit. The infrared structure group can at least partially engage into the recess of the front bracket. Here, the infrared structure group can be engaged into the recess by means of the infrared optics. The infrared structure group can define an optical axis, which can be the main incident direction of the infrared radiation. In particular, "axial" should be understood as being substantially parallel to the optical axis. And "radial" should be understood as being substantially perpendicular to the optical axis.

[0012] The thermal imaging camera has a control unit that is at least used to control the infrared structure group and / or the visual structure group. For this purpose, the control unit is connected in terms of signal technology to at least the infrared structure group and the visual structure group. In addition, the control unit is connected in terms of signal technology to the analysis and processing unit. For example, the control unit can be arranged in the handle of the hand-held power tool, in the area of the energy supply interface, or in the area of the infrared structure group and / or the visual structure group. The control unit has at least one main circuit board. The main circuit board can be arranged opposite to the front bracket. For example, the main circuit board can be arranged in the direction towards the output device.

[0013] The "analysis and processing unit" of the thermal imaging camera should be understood as the following unit: This unit has at least one information input terminal for receiving detection signals, an information processing unit for processing, especially analyzing and processing the received detection signals, and an information output section for transmitting the processed and / or analyzed detection signals and / or analysis and processing information. Advantageously, the analysis and processing unit has the following components: The components include at least one processor, a memory, and a running program with analysis and processing routines and calculation routines. In particular, the electronic components of the analysis and processing unit can be arranged on a circuit board or a printed circuit board, preferably arranged on a common circuit board together with the control unit of the thermal imaging camera for controlling the thermal imaging camera. Additionally, the control unit and the analysis and processing unit can also be implemented as a single component, for example, a single component in the form of a microcontroller. The analysis and processing unit is set to receive, analyze and process the detection signals generated by the infrared detector array, especially the detection signals of the pixels that can be connected to the analysis and processing unit in terms of signal technology, and perform the analysis and processing of the two-dimensional temperature information of the scene based on the detection signals of at least a plurality of illuminated pixels of the infrared detector array. Preferably, the analysis and processing unit is set to perform the analysis and processing of one or more temperature measurement values, especially also the average temperature measurement value, and particularly preferably the thermal image, based on the detection signals of at least a plurality of illuminated pixels. In this way, the analysis and processing unit is used to obtain the two-dimensional temperature information, especially the thermal image, from the measured infrared radiation. The analyzed two-dimensional temperature information, especially the thermal image, can be provided by the analysis and processing unit to the user of the thermal imaging camera via an output device and / or to an external device via a data communication interface for further processing and / or output.

[0014] The output device is configured to show the two-dimensional temperature information, especially the thermal image, and provide and display information to the user. The output device can be configured as a display, for example. The output device can be arranged on the housing opposite to the front bracket. For example, the output device can reproduce the images or videos of the visual structure group and / or the detection signals of the infrared structure group.

[0015] The input device is configured to receive the user's input and forward the input to the control unit at least. The input device can have at least one operating element. For example, the operating element can be configured to turn on and / or turn off the thermal imaging camera, take a photo of the scene, set the operating mode, or activate other functions of the thermal imaging camera.

[0016] The cooling element is configured to cool at least the infrared structure group. Here, the cooling element can be arranged opposite to the front bracket, in particular, substantially arranged within the housing. The cooling element can be arranged axially along the optical axis between the front bracket and the output device. The cooler element is made of a heat-conductive material. The cooling element absorbs heat from at least the visual structure group and the infrared structure group and dissipates the heat in order to reduce, in particular, minimize the thermal interference effect.

[0017] The arrangement device arranges the visual structure group mechanically relative to the infrared structure group. Exemplarily, the arrangement device can be configured as a frame, a housing or a tank. The arrangement device can be shaped around the optical axis. In addition, the arrangement device is configured to thermally insulate the infrared structure group from the visual structure group. In addition, the arrangement device is configured to reduce the interfering radiation onto the infrared structure group. The arrangement device is substantially made of a non-heat-conductive, i.e., thermally insulating material. Here, the arrangement device can decouple the cooling element from the front bracket.

[0018] The energy supply unit is provided for battery operation by means of a battery, for battery operation by means of an accumulator, in particular a hand-held power tool battery pack, and / or for mains operation. The energy supply unit is provided for at least supplying energy to the thermal imaging camera. In a preferred embodiment, the energy supply is configured for battery operation. In the context of the present invention, a "hand-held power tool battery pack" should be understood as the combination of at least one battery cell and a battery pack housing. Advantageously, the hand-held power tool battery pack is configured to supply energy to a hand-held power tool for commercially common battery operation. For example, at least one battery cell can be configured as a lithium-ion battery cell with a rated voltage of 3.6V. Exemplarily, the hand-held power tool battery pack can include up to ten battery cells, wherein different numbers of battery cells can also be considered. The implementation of the hand-held power tool for battery operation and the operation of the hand-held power tool for mains operation are well known to those skilled in the art, and therefore, the details of the energy supply are not discussed here.

[0019] In one embodiment of the thermal imaging camera, the arrangement device is arranged, in particular axially along the optical axis, between the front bracket and the cooling element. At least the infrared structure group abuts against the cooling element by means of an infrared circuit board. The cooling element has a receiving portion for the infrared structure group. The receiving portion of the cooling element is configured to at least partially receive the infrared structure group. The arrangement device abuts at least partially and / or at least in sections against the cooling element and / or the front bracket. The cooling element can be at least partially embedded in the arrangement device.

[0020] In an embodiment of the thermal imaging camera, the infrared structure group and the visual structure group are arranged overlapping each other by means of an arrangement device. Here, the infrared structure group and the visual structure group can overlap axially with respect to the optical axis. For example, at least the infrared optics and the circuit board for the visual camera overlap. The infrared structure group and the visual structure group can be arranged radially spaced apart from each other, especially with respect to the optical axis.

[0021] In an embodiment of the thermal imaging camera, the arrangement device has at least one receiving part for the infrared structure group, which receiving part at least partially surrounds the infrared structure group. For example, the receiving part of the arrangement device for the infrared structure group can be configured as an opening or a notch. Here, the receiving part of the arrangement device for the infrared structure group can be configured, for example, circularly, elliptically or polygonal (e.g., triangularly or quadrangularly). The receiving part of the arrangement device for the infrared structure group can at least partially surround the infrared housing. The infrared housing can abut against the receiving part of the arrangement device for the infrared structure group or be spaced apart from this receiving part. The receiving part can have at least two tabs, which are arranged opposite each other. Exemplarily, four adjacent tabs can be provided, which abut against the infrared housing. Exemplarily, the receiving part of the arrangement device for the infrared structure group substantially completely surrounds the infrared housing. The receiving part of the arrangement device for the infrared structure group can fix the infrared housing relative to the visual structure group.

[0022] In an embodiment of the thermal imaging camera, the arrangement device has a receiving part for the visual structure group, which receiving part at least partially surrounds the visual structure group. The receiving part of the arrangement device for the visual structure group can at least partially receive the visual structure group. Here, the visual structure group can only partially abut against the receiving part of the arrangement device for the visual structure group. The receiving part of the arrangement device for the visual structure group can at least partially surround the circuit board for the visual camera. The receiving part of the arrangement device for the infrared structure group and the receiving part of the arrangement device for the visual structure group can be configured on the arrangement device radially offset from each other, especially with respect to the optical axis. Correspondingly, the infrared structure group and the visual structure group can be arranged radially relative to each other. For example, the receiving part of the arrangement device for the visual structure group can be configured shell-shaped, can-shaped, frame-shaped or shelf-shaped. The receiving part of the arrangement device for the visual structure group can have at least one abutting element, which is arranged between the circuit boards of the visual camera and at least partially abuts against the circuit boards of the visual camera. For example, this abutting element can be configured as a tab.

[0023] In an embodiment of the thermal imaging camera, the arrangement device has at least one shielding element configured to shield the thermal radiation of the visual structure group relative to the infrared structure group. The shielding element can be connected to the arrangement device. The arrangement device can configure the shielding element. It is possible that the shielding element and the arrangement device are integral. The shielding element can extend axially along the optical axis. For example, here, the shielding element can be arranged in the direction of the front bracket and away from the infrared structure group. For example, the shielding element can be configured in the form of a tab, a protrusion or an edge.

[0024] In an embodiment of the thermal imaging camera, the front bracket has at least one insulating element configured to insulate the infrared structure group. The insulating element can be connected to the front bracket. It is possible that the front bracket configures the insulating element such that the front bracket and the insulating element are integral. The insulating element can extend axially along the optical axis. Here, the insulating element can extend in the direction towards the infrared structure group. For example, the insulating element can be configured in the form of a tab, a protrusion or an edge. The insulating element can prevent and / or reduce the thermal radiation of the visual structure group in the direction towards the infrared structure group.

[0025] In an embodiment of the thermal imaging camera, the shielding element abuts against the insulating element. In the assembled state of the thermal imaging camera, the shielding element can abut against the insulating element. Thereby, the shielding element and the insulating element can form a common tab that substantially shields the infrared structure group from the thermal radiation of the visual structure group.

[0026] In an embodiment of the thermal imaging camera, the arrangement device has at least one arrangement element configured to arrange the front bracket relative to the infrared structure group and / or the visual structure group. The arrangement device can be connected to the arrangement element. The arrangement device can configure the arrangement element such that the arrangement device and the arrangement element can be integral. The arrangement element orients the front bracket relative to the infrared structure group and / or the visual structure group such that the openings in the front bracket are axially oriented relative to the infrared structure group and / or the visual structure group respectively. The arrangement element can be configured, for example, in a sleeve-like, cylindrical, tabular or screw boss form. The arrangement element can be fitted into the front bracket. For this purpose, the front bracket can have a receiving portion, wherein the arrangement element can be fitted into the receiving portion at least form-locked. A plurality of arrangement elements can be provided, for example two, three, four or more than four.

[0027] In one embodiment of a thermal imaging camera, the cooling element has at least one orientation element, and the arrangement device includes at least one receiving part for the orientation element, wherein the orientation element is configured to orient the arrangement device relative to the cooling element by means of the receiving part for the orientation element. The orientation element can be connected to the cooling element. The cooling element can configure the orientation element such that the cooling element and the orientation element are integral. The orientation element can be at least form-fittingly inserted into the receiving part of the arrangement device for the orientation element. The orientation element can be configured, for example, as a bolt, pin, stud, protrusion or tab. A plurality of orientation elements can be provided, for example two, three or more than three Description of the Drawings

[0028] Hereinafter, the present invention will be described according to a preferred embodiment. The following drawings show:

[0029] Figure 1a Showing a schematic front view of a thermal imaging camera according to the present invention;

[0030] Figure 1b Showing a schematic rear view of a thermal imaging camera according to the present invention;

[0031] Figure 2 Showing a fragment of a longitudinal section of the thermal imaging camera;

[0032] Figure 3 Showing an exploded view of the front bracket, the arrangement device, the cooling element, the infrared structure group and the visual structure group;

[0033] Figure 4a Showing a perspective front view of the arrangement device;

[0034] Figure 4b Showing a perspective rear view of the arrangement device; Detailed Description of the Invention

[0035] Figure 1a Showing a schematic front view of a thermal imaging camera 100 according to the present invention, wherein Figure 1b showing a schematic rear view of the thermal imaging camera 100. Here, by way of example, the thermal imaging camera 100 is shaped as a handheld thermal imaging camera 100. The thermal imaging camera 100 includes a housing 110, a front bracket 120, an infrared structure group 140 for detecting infrared radiation, a visual structure group 160 for receiving visual radiation, and at least one cooling element 180 for cooling at least the infrared structure group 140, also see Figure 2 to FIG. 4. The infrared structure group 140 and the visual structure group 160 are substantially arranged within the housing 110. The thermal imaging camera 100 includes an arrangement device 200, also see Figure 2to Figure 4. The arrangement device 200 is arranged to arrange the visual structure group 160 relative to the infrared structure group 140.

[0036] The housing 110 is shaped as a shell-type housing having two half-shells. The housing 110 includes a handle 112. The front bracket 120, the cooling element 180, and the arrangement device 200 are substantially arranged within the housing 110, also see Figure 2 and Figure 3 The housing 110 receives the control unit 300, the input device 310, the output device 320, the energy supply unit 330, and an analysis and processing unit (not shown). The input device 310 includes, for example, five operating elements 311, 312, 313, 314, 315, also see Figure 1b The five operating elements 311, 312, 313, 314, 315 are arranged to operate the thermal imaging camera 100. The first operating element 311 is configured as a trigger by means of which an image can be taken. The second operating element 312 is configured as a button by means of which the user can switch on or off the thermal imaging camera 100 and can call up a menu selection. The third operating element 313 and the fourth operating element 314 are configured to switch between operating modes within the menu selection. The fifth operating element 315 is configured to confirm and activate the desired operating mode. Here, the occupancy of the operating elements 311, 312, 313, 314, 315 is mentioned by way of example, so that it is clear to a person skilled in the art that the occupancy can also be different. The output device 320 is arranged to present, provide and display two-dimensional temperature information, in particular a thermal image, to the user. Exemplarily, the output device 320 is shaped as a display 322, see Figure 1b The output device 320 is arranged on the housing 110 opposite to the front bracket 120. The energy supply unit 330 is configured for battery operation by means of a hand-held power tool battery pack 332. The energy supply unit 330 is configured to supply energy at least for the thermal imaging camera 100. The housing includes an access opening 111. Visual radiation and / or infrared radiation can enter into the access opening 111. The infrared structure group 140 defines an optical axis 102, which is the main incident direction of the infrared radiation and / or visual radiation through the access opening 111.

[0037] Figure 2Fragment 400 showing a longitudinal section of the thermal imaging camera 100. The cooling element 180 is shaped to cool at least the infrared structure group 140, wherein the cooling element is made of a thermally conductive material. The cooling element 180 is arranged opposite to the front bracket 120. The cooling element 180 is arranged axially along the optical axis 102 between the front bracket 120 and the output device 300. The housing 110 receives the front bracket 120. The front bracket 120 includes an opening 121 for the infrared structure group and an opening 122 for the visual structure group 160. The front bracket 120 includes a receiving portion 123 for the visual structure group 160. The receiving portion 123 for the visual structure group 160 at least partially surrounds the visual structure group 160. The visual structure group 160 abuts against the receiving portion 123 of the front bracket 120 by means of the end face 161. The visual structure group 160 abuts against the front bracket 120 by means of the visual optics 162. The visual structure group 160 has a visual camera 164 for taking at least one image and / or video in the visible spectral range of the radiation, an optics 162 for the visual camera 164, and a circuit board 166 for the visual camera 164. The visual structure group 160, in particular the circuit board 166 for the visual camera 164, is connected to the control unit 300 in terms of signal technology by means of a cable 168.

[0038] The infrared structure group 140 includes an infrared housing 142, an infrared sensor 144, infrared optics 146, an infrared circuit board 148, and a connection cable 150. The infrared housing 142 arranges the infrared optics 146 relative to the infrared sensor 144. The infrared sensor 144 is shaped as an infrared detector array. For measuring infrared radiation, the thermal imaging camera 100 includes an infrared structure group 140 and an analysis and processing unit. The infrared structure group 140 is connected to the analysis and processing unit by means of the connection cable 150, wherein, here, the control unit 300 has the analysis and processing unit. The infrared optics 146 focuses the infrared radiation incident through the inlet opening 111 and forwards the infrared radiation to the infrared sensor 144. The infrared sensor 144 is arranged on the infrared circuit board 148, wherein the infrared sensor 144 is arranged between the infrared circuit board 148 and the infrared optics 146. The infrared circuit board 148 is connected to the control unit 300 by means of the connection cable 150. The infrared structure group 140 is at least partially fitted into the notch 124 of the front bracket 120, wherein the infrared structure group 140 is fitted into the notch 124 by means of the infrared optics 146.

[0039] The control unit 300 is connected to the infrared structure group 140 in terms of signal technology by means of a connecting cable 150 and to the vision structure group 160 by means of a cable 168. The control unit 300 includes a main circuit board 302, which is arranged opposite the front bracket 120. The main circuit board 302 is arranged axially between the front bracket 120 and the output device 320, in particular relative to the optical axis 102. In addition, the main circuit board 302 is arranged axially between the cooling element 180 and the output device 320, in particular relative to the optical axis 102.

[0040] The positioning device 200 is shaped to position the vision structure group 160 mechanically relative to the infrared structure group 140. Exemplarily, the positioning device 200 is shaped as a frame 210, also see Figure 3 to FIG. 4. The positioning device 200 is arranged around the optical axis 102 and thermally insulates the infrared structure group 140 from the vision structure group 160. The positioning device 200 thermally decouples the cooling element 180 from the front bracket 120. The positioning device 200 is arranged axially along the optical axis 102 between the front bracket 120 and the cooling element 180. The infrared structure group 140 abuts against the cooling element 180 by means of an infrared circuit board 148. The cooling element 180 includes a receiving portion 182 for the infrared structure group 140. The receiving portion 182 of the cooling element 180 at least partially receives the infrared structure group 140. The positioning device 200 at least partially and / or at least in sections abuts against the cooling element 180 and the front bracket 120. In addition, the cooling element 180 is at least partially embedded in the positioning device 200. The infrared structure group 140 and the vision structure group 160 are arranged overlapping each other axially along the optical axis 102 by means of the positioning device 200. Here, at least the infrared optical device 146 and the circuit board 166 for the vision camera 164 overlap. The infrared structure group 140 and the vision structure group 160 are arranged radially spaced apart from each other, in particular relative to the optical axis 102. The positioning device 200 includes a receiving portion 220 for the infrared structure group 140. The receiving portion 220 for the infrared structure group 140 of the positioning device 200 at least partially, in particular substantially completely, surrounds the infrared structure group 140. Exemplarily, the receiving portion 220 for the infrared structure group 140 of the positioning device 200 is shaped as a quadrilateral opening 222, also see Figure 3and FIG. 4. The receiving part 220 of the arrangement device 200 for the infrared structure group 140 at least partially surrounds the infrared housing 142. Here, the receiving part 220 of the arrangement device 200 for the infrared structure group 140 is spaced apart from the infrared structure group such that there is a spacing between the infrared housing 142 and the receiving part 220. The arrangement device 200 includes a receiving part 230 for the visual structure group 160. The receiving part 230 of the arrangement device 200 for the visual structure group 160 at least partially surrounds and at least partially receives the visual structure group 160. The visual structure group 160 only partially abuts against the receiving part 230 of the arrangement device 200 for the visual structure group 160. The receiving part 230 of the arrangement device 200 for the visual structure group 160 at least partially surrounds the circuit board 166 for the visual camera 164. The receiving part 220 of the arrangement device 200 for the infrared structure group 140 and the receiving part 230 of the arrangement device 200 for the visual structure group 160 are shaped on the arrangement device 200 such that they are radially offset from each other, in particular with respect to the optical axis 102. Exemplarily, the receiving part 230 of the arrangement device 200 for the visual structure group 160 is shaped like a shell.

[0041] The arrangement device 200 includes a shielding element 240. The shielding element 240 is arranged to shield the thermal radiation of the visual structure group 160 relative to the infrared structure group 140. Exemplarily, the arrangement device 200 is constructed with the shielding element such that the arrangement device and the shielding element are integrally formed here. The shielding element 240 extends axially along the optical axis 102. The shielding element 240 extends in the direction towards the front bracket 120. Exemplarily, the shielding element 240 is shaped as a shielding tab 242. The front bracket 120 includes an insulating element 126. The insulating element 126 is arranged to insulate the infrared structure group 140. The front bracket 120 is shaped with the insulating element 126 such that the front bracket and the insulating element are integrally formed. The insulating element 126 extends axially along the optical axis 102 in the direction towards the infrared structure group 140 and the cooling element 180. Exemplarily, the insulating element 126 is shaped as an insulating tab. The shielding element 240 abuts against the insulating element 126. The arrangement device 200 includes at least one arrangement element 250. The arrangement element 250 is arranged to arrange the front bracket 120 relative to the infrared structure group 140 and the visual structure group 160. The arrangement device 200 is shaped with the arrangement element 250 such that the arrangement device and the arrangement element are integrally formed. The arrangement element 250 orients the front bracket 120 relative to the infrared structure group 140 and the visual structure group 160 such that the opening 121 in the front bracket 120 for the infrared structure group 140 and the opening 122 in the front bracket 120 for the visual structure group 160 are axially oriented relative to the infrared structure group 140 and the visual structure group 160 respectively. Exemplarily, the arrangement element 250 is shaped in the form of screw bosses (Schraubdoms) 252, where four arrangement elements 250 are provided here. The arrangement element 250 is fitted into the front bracket 120. The front bracket 120 includes a receiving portion 130 for the arrangement element 250. The receiving portion 130 for the arrangement element 250 receives the arrangement element 250 at least form-locked. Exemplarily, the four receiving portions 130 are each constructed for one of the arrangement elements 250. The cooling element 180 includes at least one orientation element 184. The arrangement device 200 includes at least one receiving portion 260 for the orientation element 184. The orientation element 186 is arranged to orient the arrangement device 20 relative to the cooling element 180 by means of the receiving portion 260 for the orientation element 186. Exemplarily, the cooling element 180 is shaped with the orientation element 184 such that the cooling element and the orientation element are integrally formed. The orientation element 186 is at least form-locked fitted into the receiving portion 260 of the arrangement device 200 for the orientation element 184. Exemplarily, the orientation element 184 is shaped as an orientation bolt 186. Here, exemplarily, two orientation bolts 186 and two receiving portions 260 are constructed, also see Figure 3 and FIG. 4. The receiving portions 260 are each shaped as through openings 262.

[0042] Figure 3 A exploded view showing the front bracket 120, the arrangement device 200, the sensor bracket 500, the cooling element 180, the infrared structure group 140 and the vision structure group 160 is shown. The front bracket 120 includes an additional receiving portion 132. The additional receiving portion 132 of the front bracket 120 includes an adhesive pad 134. The additional receiving portion 132 of the front bracket 120 is configured to receive, via the adhesive pad 134, an infrared window 152 for the infrared structure group 140 and a glass plate 170 for the vision structure group 160. A seal 136 is adhered to the front bracket 120 to enclose the housing 110 relative to the working environment.

[0043] Figure 4a A perspective front view showing the arrangement device 200 is shown, wherein Figure 4b A perspective rear view showing the arrangement device 200 is shown.

Claims

1. A thermal imaging camera (100), comprising a housing (110), a front support (120), an infrared structural group (140) for detecting infrared radiation, a visual structural group (160) for receiving visual radiation, and at least one cooling element (180), the cooling element being used at least to cool the infrared structural group (140), wherein: The infrared structure group (140) and the visual structure group (160) are basically arranged in the housing (110), Features An arrangement device (200) is configured to arrange the visual structure group (160) relative to the infrared structure group (140).

2. The thermal imaging camera (100) according to claim 1, characterized in that: The arrangement device (200) is arranged between the front bracket (120) and the cooling element (180).

3. The thermal imaging camera (100) according to claim 1 or 2, characterized in that: The infrared structure group (140) and the visual structure group (160) are arranged to overlap each other by means of the arrangement device (200).

4. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The arrangement device (200) has at least one receiving portion (220) for the infrared structure group (140), and the receiving portion at least partially surrounds the infrared structure group (140).

5. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The arrangement device (200) has a receiving portion (230) for the visual structure group (160), the receiving portion at least partially surrounding the visual structure group (160).

6. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The arrangement device (200) has at least one shielding element (240) which is configured to shield the thermal radiation of the visual structure group (160) from the infrared structure group (140).

7. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The front support (120) has at least one insulating element (126) which is designed to insulate the infrared structure group (140).

8. The thermal imaging camera (100) according to claim 6 and 7, characterized in that The shielding element (240) bears against the insulating element (126).

9. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The arrangement device (200) has at least one arrangement element (250) which is configured to arrange the front support (120) relative to the infrared structure group (140) and / or the visual structure group (160).

10. The thermal imaging camera (100) according to any one of the preceding claims, characterized in that The cooling element (180) has at least one orientation element (184), and the arrangement device (200) includes at least one receiving portion (260) for the orientation element (184), wherein the orientation element (184) is designed to orient the arrangement device (200) relative to the cooling element (180) by means of the receiving portion (260) for the orientation element (184).

Citation Information

Patent Citations

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