Defect identification method and device of composite current collector and computer readable storage medium

Abstract

The invention provides a defect identification method and device for a composite current collector and a computer readable storage medium, relates to the technical field of batteries, and aims at reducing the influence on the composite current collector while identifying defects on a body of the composite current collector. The method comprises the following steps: acquiring an image of a target composite current collector acquired by image acquisition equipment at the current moment; the target composite current collector comprises a body and a tab layer welded on one side of the body in the length direction, the body and the tab layer are the same in length, a plurality of distance marks are distributed on the tab layer at intervals, and the distance marks are used for indicating the distance to the starting end of the tab layer; determining defect information of defects on the body in the image and a target distance identifier in the at least one distance identifier; and establishing a corresponding relationship between the target distance identifier and the defect information of the defect.

Description

Technical Field

[0001] The present application relates to the technical field of batteries, and particularly to a method and device for defect identification of a composite current collector and a computer-readable storage medium. Background Art

[0002] A composite current collector is a battery material with a three-layer structure. The middle layer of the composite current collector is made of a non-conductive material, and the upper and lower layers are made of conductive materials respectively. When a defect is detected on the body of the composite current collector, the existing solution is to spray or paste an identification code at a position near the defect on the body to identify the defect.

[0003] In this solution, since it is necessary to spray or paste an identification code on the body, it will affect the surface of the body, thereby affecting the normal use of the composite current collector. Summary of the Invention

[0004] The present application provides a method and device for defect identification of a composite current collector and a computer-readable storage medium, which can reduce the impact on the composite current collector while identifying the defects on the body of the composite current collector.

[0005] To achieve the above object, the present application adopts the following technical solutions:

[0006] In a first aspect, a method for defect identification of a composite current collector is provided. The method includes: obtaining an image of a target composite current collector collected by an image acquisition device at the current moment; the target composite current collector includes a body and an ear layer welded to one side of the body in the length direction of the body, the body and the ear layer have the same length, and a plurality of distance identifiers are distributed at intervals on the ear layer, and the distance identifiers are used to indicate the distance from the starting end of the ear layer; determining the defect information of the defect on the body in the image and the target distance identifier among at least one distance identifier; establishing a correspondence between the target distance identifier and the defect information of the defect.

[0007] Based on this solution, by obtaining an image of the target composite current collector collected by the image acquisition device at the current moment, since the target composite current collector includes a body and an ear layer welded to one side of the body in the length direction of the body, the body and the ear layer have the same length, and a plurality of distance identifiers are distributed at intervals on the ear layer, and the distance identifiers are used to indicate the distance from the starting end of the ear layer, therefore, after determining the defect information of the defect on the body in the image and the target distance identifier among at least one distance identifier, a correspondence can be established between the target distance identifier and the defect information of the defect, that is, using the target distance identifier on the ear layer as the identifier of the defect, without spraying or pasting an identification code on the body of the composite current collector, and when identifying the defect, the impact on the composite current collector can be reduced.

[0008] In combination with the first aspect, in certain embodiments of the first aspect, determining a target distance identifier among at least one distance identifier includes: determining the vertical distance between a defect and an identification line in an image; one distance identifier is located on one identification line, and the identification line is parallel to the width direction of the composite current collector; determining the distance identifier corresponding to the smallest vertical distance among the vertical distances as the target distance identifier.

[0009] Based on this solution, by determining the vertical distance between a defect and an identification line in an image, and then determining the distance identifier corresponding to the smallest vertical distance among the vertical distances as the target distance identifier, since one distance identifier is located on one identification line and the identification line is parallel to the width direction of the composite current collector, the target distance identifier closest to the defect can be determined in the length direction of the composite current collector.

[0010] In combination with the first aspect, in certain embodiments of the first aspect, the method further includes: using the largest distance among the distances indicated by the distance identifiers of the image as the processing progress value of the target composite current collector.

[0011] Based on this solution, since the composite current collector is photographed only after being processed and the distance identifier is used to indicate the distance from the starting end of the tab layer, therefore, by identifying the distance identifier in the currently acquired image, the largest distance can be used as the processing progress value of the target composite current collector.

[0012] In combination with the first aspect, in certain embodiments of the first aspect, the method further includes: obtaining the number of target distance identifiers among the multiple distance identifiers of the target composite current collector; using the product of the number and a preset length as the scrap length of the target composite current collector.

[0013] Based on this solution, by obtaining the number of target distance identifiers among the multiple distance identifiers of the target composite current collector, and then using the product of the number and a preset length as the scrap length of the target composite current collector, the scrap length of the target composite current collector can be determined.

[0014] In a second aspect, a defect identification device is provided for implementing the defect identification method of the composite current collector in the above first aspect. The defect identification device includes corresponding modules, units, or means for implementing the above method, and the modules, units, or means can be implemented by hardware, software, or by hardware executing corresponding software. The hardware or software includes one or more modules or units corresponding to the above functions.

[0015] In combination with the second aspect, in some embodiments of the second aspect, the apparatus includes: an acquisition module and a processing module; the acquisition module is configured to acquire an image of a target composite current collector collected by an image acquisition device at the current moment; the target composite current collector includes a body and an ear layer welded to one side in the length direction of the body, the body and the ear layer have the same length, and a plurality of distance identifiers are distributed at intervals on the ear layer, and the distance identifiers are used to indicate the distance from the starting end of the ear layer; the processing module is configured to determine defect information of a defect on the body in the image and a target distance identifier among at least one distance identifier; the processing module is further configured to establish a correspondence relationship between the target distance identifier and the defect information of the defect.

[0016] In combination with the second aspect, in some embodiments of the second aspect, the processing module is configured to determine a target distance identifier among at least one distance identifier, including: determining a vertical distance between the defect and an identification line in the image; one distance identifier is located on one identification line, and the identification line is parallel to the width direction of the composite current collector; determining the distance identifier corresponding to the smallest vertical distance among the vertical distances as the target distance identifier.

[0017] In combination with the second aspect, in some embodiments of the second aspect, the processing module is further configured to: use the largest distance indicated by the distance identifier of the image as the processing progress value of the target composite current collector.

[0018] In combination with the second aspect, in some embodiments of the second aspect, the processing module is further configured to: obtain the number of target distance identifiers among the multiple distance identifiers of the target composite current collector; use the product of the number and a preset length as the scrap length of the target composite current collector.

[0019] In a third aspect, a defect identification apparatus is provided, including: at least one processor and a memory for storing instructions executable by the processor; wherein, the processor is configured to execute the instructions to implement the method provided in the first aspect and any one of its possible embodiments.

[0020] In a fourth aspect, a computer-readable storage medium is provided, when the instructions in the computer-readable storage medium are executed by the processor of the defect identification apparatus, the defect identification apparatus can execute the method provided in the first aspect and any one of its possible embodiments.

[0021] In a fifth aspect, a computer program product including instructions is provided, when it runs on a computer, the computer can execute the method provided in the first aspect and any one of its possible embodiments.

[0022] Wherein, the technical effects brought by any one of the embodiments in the second aspect to the fifth aspect can refer to the technical effects brought by different embodiments of the first aspect above, and will not be elaborated here. Description of the Drawings

[0023] Figure 1 A cross-sectional view of a composite current collector using ABA roll welding provided for this application;

[0024] Figure 2 A cross-sectional view of a composite current collector using ABA AA roll welding provided for this application;

[0025] Figure 3 A schematic structural diagram of a defect identification system provided for this application;

[0026] Figure 4 A schematic flow diagram of a method for identifying defects in a composite current collector provided for this application;

[0027] Figure 5 A top view of a composite current collector provided for this application;

[0028] Figure 6 A bottom view of an assembled current collector provided for this application;

[0029] Figure 7 A schematic flow diagram of another method for identifying defects in a composite current collector provided for this application;

[0030] Figure 8 A schematic diagram of the defect distribution of a composite current collector provided for this application;

[0031] Figure 9 A schematic flow diagram of another method for identifying defects in a composite current collector provided for this application;

[0032] Figure 10 A schematic structural diagram of a defect identification device provided for this application;

[0033] Figure 11 A schematic structural diagram of another defect identification device provided for this application. Detailed implementation manners

[0034] In the description of this application, unless otherwise specified, "a plurality" means two or more than two. "At least one (item)" or its similar expression refers to any combination of these items, including any combination of a single item or multiple items. For example, at least one (item) of a, b, or c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c can be single or multiple.

[0035] In addition, for the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and roles. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and "first", "second", etc. do not necessarily mean different.

[0036] At the same time, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner for easy understanding.

[0037] It can be understood that the "embodiments" mentioned throughout the specification mean that specific features, structures, or characteristics related to the embodiments are included in at least one embodiment of the present application. Therefore, the various embodiments mentioned throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in one or more embodiments in any suitable manner. It can be understood that in the various embodiments of the present application, the magnitude of the sequence numbers of the various processes does not mean the order of execution, and the execution order of the various processes should be determined according to their functions and internal logics, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0038] It can be understood that in the present application, "when", "if", and "in case" all refer to corresponding processing under certain objective circumstances, not limited to time, and do not require a judgment action during implementation, nor do they mean other limitations.

[0039] It can be understood that some optional features in the embodiments of the present application can, in some scenarios, be implemented independently without relying on other features, such as the current solution they are based on, to solve corresponding technical problems and achieve corresponding effects. In some scenarios, they can also be combined with other features according to requirements. Correspondingly, the devices given in the embodiments of the present application can also implement these features or functions accordingly, which will not be elaborated here.

[0040] In this application, unless otherwise specified, the same or similar parts among various embodiments can be referred to each other. In various embodiments of this application and each implementation method in the embodiments, if there is no special specification and logical conflict, the terms and / or descriptions among different embodiments and among each implementation method in the embodiments are consistent and can be cited mutually. The technical features in different embodiments and among each implementation method in the embodiments can be combined to form new embodiments, implementation manners, implementation methods, or implementation means according to their inherent logical relationships. The following implementation manners of this application do not constitute a limitation on the protection scope of this application.

[0041] With the continuous expansion of markets such as new energy vehicles and portable electronic devices, the requirements for battery performance and safety are also getting higher and higher. As a new type of battery material, composite current collectors have broad development prospects. In the future, with the continuous progress of preparation technologies and further cost reduction, composite current collectors are expected to become the mainstream current collector materials for high-performance batteries such as lithium batteries.

[0042] Composite current collectors have the following remarkable advantages:

[0043] High energy density: Due to the lightweight design of composite current collectors, the energy density of the battery can be increased without increasing the battery volume, thereby improving the battery's endurance.

[0044] Good cycle life: The structure of composite current collectors helps to reduce the loss of the battery during charge and discharge, thereby extending the battery's cycle life.

[0045] High safety: The "sandwich" structure of composite current collectors can effectively prevent the generation of metal burrs when the battery is impacted by external forces, reducing the risk of battery short circuit and thus enhancing the battery's safety.

[0046] Low cost: Compared with traditional metal current collectors, composite current collectors have lower raw material costs and relatively simple preparation processes, which is conducive to reducing the overall cost of the battery.

[0047] Composite current collectors are widely used in various high-performance battery fields, such as solar cells, lithium-ion batteries, etc. Especially in lithium-ion batteries, as the positive and negative current collector materials, composite current collectors can significantly improve the performance and safety of the battery.

[0048] Composite current collectors are a type of battery material with a "sandwich" structure, mainly composed of an intermediate layer and two outer layers: Intermediate layer: Usually a polymer layer, such as organic polymer materials like PET (polyethylene terephthalate), PP (polypropylene), or PI (polyimide), serving as a support layer or substrate. Outer layer: A metal conductive layer, such as copper or aluminum, responsible for current conduction.

[0049] In some cases, compared with traditional current collectors, since the middle polymer layer of the composite current collector is non-conductive, the two outer metal layers are separated and cannot be connected and conducted. It is necessary to use ultrasonic high-speed roll welding technology to perform tab transfer welding on one side of the body of the composite current collector, that is, one end of each of the two tabs is welded to both sides of the body of the composite current collector, and then the other ends of the two tabs are welded together to conduct the two outer layers of the composite current collector.

[0050] There are two tab transfer welding processes, namely the ABA roll welding process and the ABA AA roll welding method. Figure 1 As shown in the cross-sectional view of a composite current collector using ABA roll welding provided by this application, as Figure 1 shown, the body of the composite current collector includes two metal layers and a polymer layer between the two metal layers. The outermost ends of the tab layers welded on one side of the two metal layers are two conductive layers. For subsequent battery manufacturing processes, the tab layer is two conductive layers. Figure 2 As shown in the cross-sectional view of a composite current collector using ABA AA roll welding provided by this application, as Figure 2 shown, the outermost ends of the tab layers welded on both sides of the body of the composite current collector are one conductive layer. For subsequent battery manufacturing processes, the tab layer is one conductive layer.

[0051] During the process of processing the composite current collector, for example, when performing coating treatment or roll splitting treatment on the composite current collector, it is necessary to detect whether there are defects on the body of the composite current collector. When defects are detected on the body, the existing solution is to spray or paste identification codes at positions near the defects on the body to identify the defects.

[0052] In this solution, since it is necessary to spray or paste identification codes on the body, it will affect the surface of the body, thereby affecting the normal use of the composite current collector.

[0053] To solve the above problems, this application provides a method for identifying defects in a composite current collector, which includes:

[0054] Obtain an image of the target composite current collector collected by an image acquisition device at the current moment; the target composite current collector includes a body and a tab layer welded on one side in the length direction of the body. The body and the tab layer have the same length. A plurality of distance marks are distributed at intervals on the tab layer, and the distance marks are used to indicate the distance from the starting end of the tab layer; determine the defect information of the defect on the body in the image and the target distance mark among at least one distance mark; establish a correspondence relationship between the target distance mark and the defect information of the defect.

[0055] Based on this solution, by acquiring the image of the target composite current collector collected by the image acquisition device at the current moment, since the target composite current collector includes a main body and an ear layer welded to one side in the length direction of the main body, the lengths of the main body and the ear layer are the same, and a plurality of distance identifiers are distributed at intervals on the ear layer, and the distance identifiers are used to indicate the distance from the starting end of the ear layer. Therefore, after determining the defect information of the defect on the main body in the image and the target distance identifier among at least one distance identifier, a correspondence relationship can be established between the target distance identifier on the ear layer and the defect information of the defect, that is, using the target distance identifier on the ear layer as the identifier of the defect, without spraying or pasting an identification code on the main body of the composite current collector, which can reduce the impact on the composite current collector when identifying the defect.

[0056] Figure 3 It is a schematic structural diagram of a defect identification system provided by this application. The technical solution of the embodiment of this application can be applied to Figure 3 the defect identification system shown in Figure 3 As shown in

[0057] Among them, the defect identification device 31 is directly or indirectly connected to the image acquisition device 32. In this connection relationship, a wired connection or a wireless connection can be used, and the embodiment of this application does not make a limitation on this.

[0058] The image acquisition device 32 can be an industrial charge coupled device (CCD) camera.

[0059] Data interaction can be carried out between the defect identification device 31 and the image acquisition device 32.

[0060] It should be noted that the defect identification device 31 and the image acquisition device 32 can be independent devices or integrated into the same device, and this application does not make a specific limitation on this.

[0061] When the defect identification device 31 and the image acquisition device 32 are integrated into the same device, the communication method between the defect identification device 31 and the image acquisition device 32 is the communication between internal modules of this device. In this case, the communication process between the two is the same as "the communication process between the defect identification device 31 and the image acquisition device 32 when they are independent of each other".

[0062] In the following embodiments provided by this application, this application takes the defect identification device 31 and the image acquisition device 32 being independently set as an example for illustration.

[0063] The defect identification system can be deployed in a device for processing a composite current collector, for example, in a coating device for performing a coating process on the composite current collector or a roll splitting device for performing a roll splitting process.

[0064] In practical applications, the defect identification method provided by the embodiments of the present application can be applied to the defect identification device 31, or can also be applied to the devices included in the defect identification device 31.

[0065] Next, in conjunction with the accompanying drawings, taking the defect identification method applied to the defect identification device 31 as an example, the defect identification method provided by the embodiments of the present application will be described.

[0066] Figure 4 It is a schematic flowchart of a defect identification method provided by the present application, as Figure 4 shown, the method includes the following steps:

[0067] S401. The defect identification device acquires an image of a target composite current collector collected by an image acquisition device at the current moment.

[0068] Among them, the target composite current collector includes a body and an ear layer welded to one side in the length direction of the body. The body and the ear layer have the same length. A plurality of distance identifiers are distributed at intervals on the ear layer, and the distance identifiers are used to indicate the distance from the starting end of the ear layer.

[0069] It should be noted that the distance identifier can be a number, a two-dimensional code, a bar code. Of course, the distance identifier can also be other types of identifiers, and the present application does not make specific limitations on this.

[0070] The distance between two adjacent distance identifiers can be 10 cm, 20 cm. Of course, it can also be other distances, and the present application does not make specific limitations on this.

[0071] Taking the distance identifier as a two-dimensional code as an example, if a two-dimensional code is recognized and the obtained information shows that the distance is 10 meters, it means that the distance between this two-dimensional code and the starting end of the ear layer is 10 meters.

[0072] In the case where the distance identifier is a two-dimensional code or a bar code, in addition to indicating the distance from the starting end of the ear layer, the distance identifier can also indicate other information, for example, the identifier of the ear layer.

[0073] In some embodiments, a plurality of distance identifiers can be distributed on both the front and back surfaces of the ear layer. The distance identifiers on the front and back surfaces of the ear layer can correspond one by one. For example, a distance identifier is distributed at 10 meters on the front surface of the ear layer, and a distance identifier is also distributed at 10 meters on the back surface of the ear layer.

[0074] In this embodiment, since the distance identifiers on the front and back of the tab layer can correspond one by one, when a defect is detected on one side of the tab layer, the impact of the defect on the other side can be determined based on the corresponding distance identifier on the other side of the tab layer. For example, when a defect is detected at the 10-meter mark on the front of the tab layer, the image at the 10-meter mark on the back of the tab layer can be viewed to determine the impact of the defect on the back of the tab layer.

[0075] Figure 5 The top view of a composite current collector provided by this application is shown in Figure 5 As shown, a tab layer is welded to the right side of the target composite current collector. Three distance identifiers are spaced apart on the front of the tab layer, respectively indicating distances of 10 meters, 11 meters, and 12 meters from the starting end of the tab layer.

[0076] Figure 6 The bottom view of a composite current collector provided by this application is shown in Figure 6 As shown, a tab layer is welded to the right side of the target composite current collector. Three distance identifiers are spaced apart on the back of the tab layer, respectively indicating distances of 13 meters, 14 meters, and 15 meters from the starting end of the tab layer.

[0077] In some embodiments, the tab layer will be cut in subsequent processes, and the distance identifiers can be located in the cut area of the tab layer.

[0078] As a possible implementation, in combination with Figure 1 , the defect identification device receives a message from the image acquisition device. This message includes the image of the target composite current collector acquired by the image acquisition device at the current moment. The defect identification device obtains the image of the target composite current collector acquired by the image acquisition device at the current moment from this message.

[0079] S402. The defect identification device determines the defect information of the defect on the body in the image and the target distance identifier among at least one distance identifier.

[0080] It should be noted that the defect information may include the position, size, and type of the defect. Of course, the defect information may also include other information about the defect. This application does not make specific limitations on this.

[0081] As a possible implementation, the defect identification device performs preprocessing on the image to obtain a preprocessed image, and inputs the preprocessed image into a preset model image to obtain the defect information of the defect.

[0082] The defect identification device calculates the straight-line distance between the defect and each distance identifier in the image, and uses the distance identifier corresponding to the minimum straight-line distance as the target distance identifier corresponding to the defect.

[0083] As another possible implementation, the defect identification device preprocesses the image to obtain the preprocessed image, and inputs the preprocessed image into a preset model image to obtain defect information of the defect.

[0084] The defect identification device determines the vertical distance between the defect and the identification line in the image. Subsequently, the distance identification corresponding to the smallest vertical distance among the vertical distances is determined as the target distance identification.

[0085] Wherein, one distance identification is located on one identification line, and the identification line is parallel to the width direction of the composite current collector.

[0086] It should be noted that the specific description of this possible implementation can refer to the relevant description in the subsequent part of the specific implementation manner of this application, and this application will not elaborate here for the time being.

[0087] S403. The defect identification device establishes a correspondence between the target distance identification and the defect information of the defect.

[0088] The defect identification device can also store the correspondence to the data middle platform, so that in subsequent battery manufacturing processes, the change of the defect can be viewed through the target distance identification.

[0089] Based on S401 - S403, by acquiring the image of the target composite current collector collected by the image acquisition device at the current moment, since the target composite current collector includes a body and a tab layer welded on one side in the length direction of the body, the body and the tab layer have the same length, and a plurality of distance identifications are distributed at intervals on the tab layer, and the distance identifications are used to indicate the distance from the starting end of the tab layer. Therefore, after determining the defect information of the defect on the body in the image and the target distance identification among at least one distance identification, a correspondence can be established between the target distance identification and the defect information of the defect, that is, the target distance identification on the tab layer is used as the identification of the defect, without spraying or pasting identification codes on the body of the composite current collector, and the influence on the composite current collector can be reduced when identifying the defect.

[0090] In addition, since a correspondence is established between the target distance identification and the defect information of the defect, the change situation of the defect can be observed in subsequent multiple processes (such as coating, roll splitting, die cutting, and cutting and stacking).

[0091] The above is a general description of the defect identification method for the composite current collector provided by this application. Next, the defect identification method for the composite current collector provided by this application will be further described with reference to the accompanying drawings.

[0092] In one design, Figure 7 is a schematic flowchart of another defect identification method for the composite current collector provided by this application, as Figure 7As shown in the figure, in the specific implementation of the present application, the defect identification device determines the target distance identification among at least one distance identification, which specifically may include the following multiple steps:

[0093] S701. The defect identification device determines the vertical distance between the defect and the identification line in the image.

[0094] Among them, one distance identification is located on one identification line, and the identification line is parallel to the width direction of the composite current collector.

[0095] Take a possible implementation method as an example. Figure 8 For example, Figure 8 FIG. Figure 8 is a schematic diagram of the defect distribution of a composite current collector provided by the present application. As shown in the figure, there is one defect on the body of the composite current collector, and there are 3 distance identifications distributed on the tab layer of the composite current collector, namely the first distance identification, the second distance identification, and the third distance identification. Correspondingly, there are 3 identification lines in the image, namely the first identification line, the second identification line, and the third identification line. The first distance identification is located on the first identification line, the second distance identification is located on the second identification line, and the third distance identification is located on the third identification line. Each identification line is parallel to the width direction of the composite current collector.

[0096] The defect identification device calculates the vertical distance between the defect and the first identification line to obtain the first vertical distance.

[0097] The defect identification device calculates the vertical distance between the defect and the second identification line to obtain the second vertical distance.

[0098] The defect identification device calculates the vertical distance between the defect and the third identification line to obtain the third vertical distance.

[0099] S702. The defect identification device determines the distance identification corresponding to the smallest vertical distance among the vertical distances as the target distance identification.

[0100] As a possible implementation method, the defect identification device compares the magnitudes of the 3 vertical distances. For example, Figure 8 the first vertical distance is the smallest vertical distance among the three vertical distances, and the first distance identification corresponding to the first vertical distance is determined as the target distance identification.

[0101] Based on S701 - S702, by determining the vertical distance between the defect and the identification line in the image, and then determining the distance identification corresponding to the smallest vertical distance among the vertical distances as the target distance identification. Since one distance identification is located on one identification line and the identification line is parallel to the width direction of the composite current collector, the target distance identification closest to the defect can be determined in the length direction of the composite current collector.

[0102] In one design, after S401, the method for defect identification of the composite current collector provided by the present application may further include the following steps:

[0103] The defect identification device uses the maximum distance among the distances corresponding to the distance identifications in the image as the processing progress value of the target composite current collector.

[0104] As a possible implementation, the defect identification device identifies each distance identification in the image, obtains the distance corresponding to each distance identification, and uses the maximum distance as the processing progress value of the target composite current collector.

[0105] Exemplarily, taking the target composite current collector being subjected to coating treatment as an example, if the defect identification device determines that the maximum distance among the distances corresponding to the distance identifications in the image is 10 meters, it is determined that the coating progress of the target composite current collector is 10 meters, that is, the target composite current collector has been coated for 10 meters.

[0106] Based on this solution, since the composite current collector is photographed only after being processed, and the distance identification is used to indicate the distance from the starting end of the tab layer, therefore, by identifying the distance identifications in the currently acquired image, the maximum distance can be used as the processing progress value of the target composite current collector.

[0107] In one design, Figure 9 is a schematic flowchart of another method for defect identification of the composite current collector provided by the present application. As shown in Figure 9 After S403, the method for defect identification of the composite current collector provided by the present application may further include the following multiple steps:

[0108] S901: The defect identification device obtains the number of target distance identifications among the multiple distance identifications of the target composite current collector.

[0109] As a possible implementation, the defect identification device counts the number of target distance identifications in the multiple images of the target composite current collector.

[0110] As an example, taking the number of images of the target composite current collector collected as 3, the number of target distance identifications in the first image is 1, the number of target distance identifications in the second image is 2, and the number of target distance identifications in the third image is 3 as an example, the defect identification device counts the number of target distance identifications in the three images and determines that the number of target distance identifications is 6.

[0111] S902: The defect identification device uses the product of the number and the preset length as the scrapped length of the target composite current collector.

[0112] It should be noted that the preset length is used to indicate the scrapped length corresponding to the defect.

[0113] For example, if the preset length is 10 cm, and there is a defect on the target composite current collector, a portion of the target composite current collector with a length of 10 cm including this defect needs to be cut off, and the cut-off portion is scrapped.

[0114] Based on S901 - S902, by obtaining the number of target distance identifiers among multiple distance identifiers of the target composite current collector, and then taking the product of the number and the preset length as the scrap length of the target composite current collector, the scrap length of the target composite current collector can be determined.

[0115] The above mainly introduces the solution provided by the embodiments of the present application from the perspective of the defect identification method of the composite current collector executed by the defect identification device. To implement the above functions, the defect identification device includes the corresponding hardware structure and / or software module for executing each function. Those skilled in the art should easily realize that, combining the units and algorithm steps of each example described in the embodiments disclosed herein, the embodiments of the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed in the way of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0116] The embodiments of the present application can divide the defect identification device into functional modules according to the above method examples. For example, each functional module can be divided corresponding to each function, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware or in the form of a software functional module. Optionally, the division of modules in the embodiments of the present application is illustrative, only a logical function division, and there can be other division methods in actual implementation. In addition, the "module" here can refer to a specific application-specific integrated circuit (ASIC), a circuit, a processor and a memory that execute one or more software or firmware programs, an integrated logic circuit, and / or other devices that can provide the above functions.

[0117] In the case of adopting functional module division, Figure 10 shows a schematic structural diagram of a defect identification device. As Figure 10 shown, the defect identification device 100 includes an acquisition module 1001 and a processing module 1002.

[0118] In some embodiments, the defect identification device 100 may further include a storage module ( Figure 10 not shown in the figure), which is used to store program instructions and data.

[0119] Among them, an acquisition module 1001 is configured to acquire an image of a target composite current collector collected by an image acquisition device at the current moment; the target composite current collector includes a body and an ear layer welded to one side in the length direction of the body, the body and the ear layer have the same length, and a plurality of distance identifiers are distributed at intervals on the ear layer, and the distance identifiers are used to indicate the distance from the starting end of the ear layer; a processing module 1002 is configured to determine defect information of a defect on the body in the image and a target distance identifier among at least one distance identifier; the processing module 1002 is further configured to establish a correspondence between the target distance identifier and the defect information of the defect.

[0120] In combination with the second aspect, in some embodiments of the second aspect, the processing module 1002 is configured to determine a target distance identifier among at least one distance identifier, including: determining a vertical distance between the defect and a marking line in the image; one distance identifier is located on one marking line, and the marking line is parallel to the width direction of the composite current collector; and determining the distance identifier corresponding to the smallest vertical distance among the vertical distances as the target distance identifier.

[0121] In combination with the second aspect, in some embodiments of the second aspect, the processing module 1002 is further configured to: use the largest distance among the distances indicated by the distance identifiers of the image as the processing progress value of the target composite current collector.

[0122] In combination with the second aspect, in some embodiments of the second aspect, the processing module 1002 is further configured to: obtain the number of target distance identifiers among the multiple distance identifiers of the target composite current collector; and use the product of the number and a preset length as the scrap length of the target composite current collector.

[0123] All relevant contents of each step involved in the above method embodiment can be cited in the function description of the corresponding functional module, and will not be elaborated here.

[0124] In the case of implementing the functions of the above functional modules in the form of hardware Figure 11 shows a structural schematic diagram of another defect identification device. As Figure 11 shown, the defect identification device 110 includes a processor 1101, a memory 1102, and a bus 1103. The processor 1101 and the memory 1102 can be connected through the bus 1103.

[0125] The processor 1101 is the control center of the defect identification device 110, and can be a single processor or a collective term for multiple processing elements. For example, the processor 1101 can be a general-purpose central processing unit (CPU), or other general-purpose processors, etc. Among them, the general-purpose processor can be a microprocessor or any conventional processor, etc.

[0126] As an example, the processor 1101 may include one or more CPUs, such as Figure 11 CPU 0 and CPU 1 shown in

[0127] The memory 1102 may be a read-only memory (ROM) or other type of static storage device that can store static information and instructions, a random access memory (RAM) or other type of dynamic storage device that can store information and instructions, or may also be an electrically erasable programmable read-only memory (EEPROM), a magnetic disk storage medium, or other magnetic storage device, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto.

[0128] As a possible implementation, the memory 1102 may exist independently of the processor 1101. The memory 1102 may be connected to the processor 1101 through a bus 1103 for storing instructions or program code. When the processor 1101 invokes and executes the instructions or program code stored in the memory 1102, the method for identifying defects of the composite current collector provided in the embodiments of the present application can be implemented.

[0129] In another possible implementation, the memory 1102 may also be integrated with the processor 1101.

[0130] The bus 1103 may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, etc. This bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 11 only a thick line is shown in

[0131] It should be noted that Figure 11 the shown structure does not constitute a limitation on the defect identification device 110. In addition to Figure 11 the shown components, the defect identification device 110 may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0132] As an example, in combination with Figure 10 , the functions implemented by the acquisition module 1001 and the processing module 1002 in the defect identification device 100 are the same as those of Figure 11 the processor 1101 in

[0133] Optionally, as shown in Figure 11 , the defect identification device 110 provided by the embodiments of the present application may further include a communication interface 1104.

[0134] The communication interface 1104 is used to connect to other devices through a communication network. The communication network may be an Ethernet, a radio access network, a wireless local area network (WLAN), etc. The communication interface 1104 may include a receiving unit for receiving data and a sending unit for sending data.

[0135] In a possible implementation manner, in the defect identification device 110 provided by the embodiments of the present application, the communication interface 1104 may also be integrated in the processor 1101, and the embodiments of the present application do not make specific limitations on this.

[0136] As a possible product form, the defect identification device of the embodiments of the present application may also be implemented by the following: one or more field programmable gate arrays (FPGAs), programmable logic devices (PLDs), controllers, state machines, gate logics, discrete hardware components, any other suitable circuits, or any combination of circuits capable of performing various functions described throughout the present application.

[0137] Through the description of the above embodiments, those skilled in the art can clearly understand that for the convenience and brevity of description, only the above division of each functional unit is used as an example for illustration. In practical applications, the above functions may be allocated to different functional units according to needs, that is, the internal structure of the device is divided into different functional units to complete all or part of the functions described above. The specific working processes of the systems, devices, and units described above may refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein.

[0138] The embodiments of the present application also provide a computer-readable storage medium, on which a computer program or instruction is stored. When the computer program or instruction is executed, the computer executes each step in the method flow shown in the foregoing method embodiments.

[0139] An embodiment of the present application provides a computer program product including instructions. When the instructions run on a computer, the computer is caused to execute each step in the method flow shown in the above method embodiment.

[0140] An embodiment of the present application provides a chip system, including: a processor and an interface circuit; the interface circuit is configured to receive a computer program or instructions and transmit them to the processor; the processor is configured to execute the computer program or instructions so that the chip system executes each step in the method flow shown in the above method embodiment.

[0141] Among them, a computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk. Random Access Memory (RAM), Read-Only Memory (ROM), Erasable Programmable Read Only Memory (EPROM), registers, hard disks, optical fibers, portable compact disc read-only memory (Compact Disc Read-Only Memory, CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above, or any other form of computer-readable storage medium in the art. An exemplary storage medium is coupled to the processor so that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can be located in a specific-purpose ASIC. In an embodiment of the present application, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0142] Since the defect identification device, computer-readable storage medium, and computer program product provided in this embodiment can be applied to the defect identification method of the composite current collector provided in the above embodiment, the technical effects that can be obtained can also refer to the above method embodiment, and the embodiments of the present application will not be elaborated here.

[0143] Although the present application has been described in connection with various embodiments, it will be understood by those skilled in the art that other variations of the disclosed embodiments can be understood and achieved by viewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or other unit may implement several functions recited in the claims. Certain measures are recited in mutually different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0144] Although the present application has been described in connection with specific features and their embodiments, it will be apparent that various modifications and combinations can be made without departing from the spirit and scope of the present application. Accordingly, the specification and drawings are merely exemplary illustrations of the present application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. A defect identification method for a composite current collector, characterized in that: The method comprises: Acquire an image of a target composite current collector acquired by an image acquisition device at the current moment; the target composite current collector comprises a body and a tab layer welded on one side of the length direction of the body, the body and the tab layer have the same length, a plurality of distance marks are spaced apart on the tab layer, and the distance marks are used to indicate the distance from the starting end of the tab layer; Determining defect information of a defect on the body in the image and a target distance marker in at least one distance marker; A corresponding relationship is established between the target distance identifier and the defect information of the defect.

2. The method according to claim 1, characterized in that Determining a target range indicator in at least one range indicator includes: Determine a vertical distance between the defect and an identification line in the image; a distance identification is located on an identification line, and the identification line is parallel to a width direction of the composite current collector; The distance identifier corresponding to the smallest vertical distance among the vertical distances is determined as the target distance identifier.

3. The method according to claim 1, characterized in that: The method further comprises: The maximum distance among the distances indicated by the distance markers of the image is used as the processing progress value of the target composite current collector.

4. The method according to any one of claims 1 to 3, characterized in that: The method further comprises: Obtaining the number of target distance identifiers among multiple distance identifiers of the target composite current collector; The product of the number and the preset length is used as the scrap length of the target composite current collector.

5. A defect identification device for a composite current collector, characterized in that: The device comprises: an acquisition module and a processing module; The acquisition module is used to acquire an image of a target composite current collector acquired by an image acquisition device at a current moment; the target composite current collector comprises a body and a tab layer welded on one side of the length direction of the body, the body and the tab layer have the same length, a plurality of distance marks are spaced apart on the tab layer, and the distance marks are used to indicate the distance from the starting end of the tab layer; The processing module is used to determine defect information of the defect on the body in the image and a target distance mark in at least one distance mark; The processing module is further used to establish a corresponding relationship between the target distance identifier and the defect information of the defect.

6. The device according to claim 5, characterized in that The processing module is used to determine a target distance indicator in at least one distance indicator, including: Determine a vertical distance between the defect and an identification line in the image; a distance identification is located on an identification line, and the identification line is parallel to a width direction of the composite current collector; The distance identifier corresponding to the smallest vertical distance among the vertical distances is determined as the target distance identifier.

7. The device according to claim 5, characterized in that The processing module is further used for: The maximum distance among the distances indicated by the distance markers of the image is used as the processing progress value of the target composite current collector.

8. The device according to any one of claims 5 to 7, characterized in that: The processing module is further used for: Obtaining the number of target distance identifiers among multiple distance identifiers of the target composite current collector; The product of the number and the preset length is used as the scrap length of the target composite current collector.

9. A defect identification device, characterized in that: The defect identification device comprises: a processor, the processor is coupled to a memory, the memory is used to store programs or instructions, when the program or instructions are executed by the processor, the device executes the method as described in any one of claims 1 to 4.

10. A computer-readable storage medium having a computer program or instruction stored thereon, characterized in that: When the computer program or instructions are executed, the computer is caused to perform the method according to any one of claims 1 to 4.

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