Manufacturing method of front open type wafer transfer box device and product thereof

Abstract

A manufacturing method of a front open type wafer transfer box device and a product thereof, the manufacturing method comprising: (a) performing stamping forming on a metal plate to form a metal box comprising a base wall and an enclosure wall to define a space, the enclosure wall defining an opening exposing the space at an end portion away from the base wall; (b) punching and forming the metal box so as to form mounting holes which are formed at intervals in two first wall parts which are oppositely arranged at intervals of the enclosure bulkhead; (c) arranging a door frame at the opening of the metal box; (d) installing a wafer bearing unit in the space so that the wafer bearing unit is fixed in the installation hole, and installing a handle unit outside the space so that the handle unit is fixed in the installation hole of each first wall part; and (e) providing a door panel at the door frame to seal the opening. According to the invention, due to the characteristic that the metal box is not easy to absorb moisture, the problem of moisture absorption caused by the PC material of the existing FOUP can be solved.

Description

Technical Field

[0001] The present invention relates to a wafer cassette, and particularly to a manufacturing method and product of a front opening unified pod (hereinafter referred to as FOUP) device. Background Art

[0002] The FOUP is mainly used to store, fix and carry multiple wafers to be processed into IC components during the process of fabricating integrated circuit (IC) components, and transfer them between deposition, sputtering, cleaning and other workstations. Generally, in terms of cost consideration, the main body of a wafer cassette is mostly made of carbon fiber or polycarbonate (hereinafter referred to as PC). However, in recent years, due to the continuous miniaturization of IC components, and the FOUP made of PC is prone to release moisture inside the FOUP due to its hygroscopic property, which results in adverse effects on the performance of the IC components stored in the FOUP.

[0003] As described above, how to improve the structure and manufacturing process of the front opening unified pod (FOUP) to solve the moisture absorption problem caused by the FOUP made of PC is a problem that needs to be solved by relevant manufacturers in the technical field. Summary of the Invention

[0004] The first object of the present invention is to provide a manufacturing method of a front opening unified pod device that can reduce the moisture absorption problem.

[0005] The manufacturing method of the front opening unified pod device of the present invention is applicable to carrying multiple wafers, and includes the following steps: step (a), step (b), step (c), step (d), and step (e).

[0006] In step (a), a stamping process is applied to a metal plate so that the metal plate is stamped into a metal box. The metal box includes a base wall and a surrounding wall that surrounds the base wall and defines a space, and an opening that exposes the space is defined at an end of the surrounding wall away from the base wall.

[0007] In step (b), a punching process is applied to two first wall portions of the surrounding wall of the metal box that are spaced apart from each other and face each other, so as to punch a plurality of mounting holes that are spaced apart from each other in the first wall portions.

[0009] In step (c), a door frame is provided at the opening of the metal box.

[0010] Step (d) is to install a wafer carrier unit in the space of the metal box, such that the wafer carrier unit is fixed to the mounting holes for carrying the wafer, and to install a handle unit outside the space of the metal box, such that the handle unit is fixed to the mounting holes on the first wall portion.

[0011] Step (e) is to provide a door panel at the door frame to seal the opening of the metal box.

[0012] In the method for manufacturing the front-opening wafer transfer box device of the present invention, in step (a), at least one reinforcing rib is respectively stamped and formed on the first wall portion of the surrounding wall of the metal box and one of the two second wall portions that are connected to the first wall portion and are spaced apart from each other and face each other. Each reinforcing rib is recessed from the surrounding wall toward the space and extends from the base wall toward the opening.

[0013] The method for manufacturing the front-opening wafer transfer box of the present invention further includes step (b') after step (a) or step (b). In step (b), two air charging pipes that are spaced apart from each other are punched and formed on the other second wall portion of the surrounding wall of the metal box. The air charging pipes penetrate through the other second wall portion and extend outward from the space. The air charging pipes are adjacent to the opening. Step (b') is to weld a plurality of mounting bumps that are spaced apart from each other on each second wall portion of the surrounding wall of the metal box. Each mounting bump protrudes from each second wall portion away from the space. In step (d): the wafer carrier unit includes two wafer carrier components that are spaced apart from each other and face each other, and each wafer carrier component is installed on the corresponding mounting hole on the first wall portion in the space of the metal box; the handle unit includes two handle components, and each handle component includes a fixing base and a handle. Each fixing base has a first block that is fixed to the mounting hole on each first wall portion, and a second block that extends from its first block to the other second wall portion of the surrounding wall and is sleeved on the mounting bump on the other second wall portion. Each handle is fixed to the first block of the corresponding fixing base; and a transmission flange is installed on one of the second wall portions and a base unit is installed on the other second wall portion, such that the bottom of the transmission flange is limited to the mounting bump on one of the second wall portions, and the base unit is limited to the mounting bump on the other second wall portion and the inner ring surface of each air charging pipe. The base unit includes a base and two air charging components. The base of the base unit is limited to the mounting bump on the other second wall portion, such that the second block of the fixing base of each handle component is clamped between the other second wall portion and the base. Each air charging component of the base unit is sleeved by the base and is limited to the inner ring surface of the corresponding air charging pipe and is clamped between the base and the corresponding air charging pipe.

[0015] For the manufacturing method of the front-opening wafer transfer cassette device of the present invention, in the step (c), the door frame is obtained by injection molding technology, stamping forming process, welding, CNC lathe machining or 3D printing.

[0016] For the manufacturing method of the front-opening wafer transfer cassette device of the present invention, in the step (c), injection molding technology is applied to the metal box disposed in the injection mold, so as to form a rubber frame covering the end of the surrounding wall at the opening of the metal box.

[0017] For the manufacturing method of the front-opening wafer transfer cassette device of the present invention, in the step (a), the metal plate is made of stainless steel or aluminum alloy.

[0018] The second object of the present invention is to provide a front-opening wafer transfer cassette device that can reduce the moisture absorption problem.

[0019] The front-opening wafer transfer cassette device of the present invention is suitable for carrying a plurality of wafers and includes: a metal box, a door frame, a wafer carrying unit, a handle unit, and a door panel.

[0020] The metal box is obtained by a stamping forming process and includes a base wall and a surrounding wall surrounding the base wall and defining a space. The surrounding wall defines an opening exposing the space at an end away from the base wall. The surrounding wall of the metal box has two first wall portions arranged opposite to each other at intervals, and each first wall portion has a plurality of mounting holes arranged at intervals.

[0021] The door frame is disposed at the opening of the metal box.

[0022] The wafer carrying unit is fixed to the mounting holes of each first wall portion of the surrounding wall to be installed in the space of the metal box for carrying the wafers.

[0023] The handle unit is installed outside the space of the metal box and is fixed to the mounting holes of the first wall portion.

[0024] The door panel is located at the door frame to seal the opening of the metal box.

[0025] For the front-opening wafer transfer cassette device of the present invention, the surrounding wall of the metal box further has two second wall portions arranged opposite to each other at intervals and connecting the first wall portions. At least one reinforcing rib obtained by stamping is provided on one of the second wall portions in the first wall portion and the second wall portion. Each reinforcing rib is recessed from the surrounding wall toward the space and extends from the base wall toward the opening.

[0027] The front-opening wafer transfer cassette device of the present invention further includes a transfer flange and a base unit. The metal box further includes a plurality of mounting bumps and two gas charging pipes. The mounting bumps are welded to respective second wall portions of the surrounding wall at intervals, and each mounting bump protrudes from each second wall portion away from the space. The gas charging pipes penetrate through one of the second wall portions among the second wall portions and extend outward from the space, and each gas charging pipe is adjacent to the opening of the metal box. The handle unit includes two handle assemblies. Each handle assembly has a fixed seat and a handle. The fixed seat of each handle assembly has a first block fixed to each first wall portion, and a second block extending from its first block to the other second wall portion of the surrounding wall and sleeved on the mounting bump of the other second wall portion. The handle of each handle assembly is fixed to the first block of the corresponding fixed seat. The transfer flange is mounted on one of the second wall portions so that the bottom of the transfer flange is limited on the mounting bump on one of the second wall portions. The base unit is mounted on the other second wall portion so that the base unit is limited on the mounting bumps on the other second wall portion and the inner ring surfaces of the gas charging pipes. The base unit includes: a base limited on the mounting bumps on the other second wall portion so that the second block of the fixed seat of each handle assembly is clamped between the other second wall portion and the base, and two gas charging assemblies sleeved by the base and limited on the inner ring surfaces of the corresponding gas charging pipes and clamped between the base and the corresponding gas charging pipes.

[0028] In the front-opening wafer transfer cassette device of the present invention, the door frame is made by injection molding technology and is a rubber frame disposed at the opening of the metal box to cover the end of the surrounding wall.

[0029] In the front-opening wafer transfer cassette device of the present invention, the metal box is made of stainless steel or aluminum alloy.

[0030] The beneficial effect of the present invention is that the moisture absorption problem caused by the PC material of the existing FOUP can be solved due to the characteristic that the metal box is not easily hygroscopic itself. Description of the Drawings

[0031] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, where:

[0032] Figure 1 is a three-dimensional schematic diagram illustrating a stamping process implemented in step (a) of the manufacturing method of the front-opening wafer transfer cassette device of the present invention;

[0033] Figure 2 is a three-dimensional schematic diagram illustrating a punching process implemented in step (b) of the manufacturing method of the embodiment of the present invention;

[0035] Figure 3 is a three-dimensional schematic diagram illustrating an injection molding technique implemented in step (c) of the manufacturing method of the embodiment of the present invention;

[0036] Figure 4 is a three-dimensional schematic diagram illustrating a wafer carrier unit and a handle unit installed during the implementation of step (d) of the manufacturing method of the embodiment of the present invention;

[0037] Figure 5 is a three-dimensional schematic diagram illustrating a door panel provided during the implementation of step (e) of the manufacturing method of the embodiment of the present invention;

[0038] Figure 6 is a three-dimensional schematic diagram illustrating that two gas injection tubes are also stamped and formed in step (b) of the manufacturing method of the embodiment of the present invention;

[0039] Figure 7a and Figure 7b are each a three-dimensional schematic diagram illustrating a plurality of mounting bumps welded during the implementation of step (b') of the manufacturing method of the embodiment of the present invention;

[0040] Figure 8 is a three-dimensional schematic diagram illustrating that a transfer flange and a base unit are also installed in step (d) of the manufacturing method of the embodiment of the present invention;

[0041] Figure 9 is a three-dimensional schematic diagram illustrating a front-opening wafer transfer cassette device manufactured by the manufacturing method of the embodiment of the present invention;

[0042] Figure 10 is Figure 9 a top view schematic diagram of;

[0043] Figure 11 is along Figure 10 a partial cross-sectional view taken along the straight line XI-XI, illustrating the connection relationship between the handle unit, the wafer carrier unit, and a metal box of the front-opening wafer transfer cassette device of the embodiment of the present invention;

[0044] Figure 12 is along Figure 10 a partial cross-sectional view taken along the straight line XII-XII, illustrating the connection relationship between the handle unit and the metal box of the front-opening wafer transfer cassette device of the embodiment of the present invention;

[0045] Figure 13 is along Figure 10 a partial cross-sectional view taken along the straight line XIII-XIII, illustrating the connection relationship between the transfer flange and the metal box of the front-opening wafer transfer cassette device of the embodiment of the present invention; and

[0046] Figure 14 is a partial sectional view taken along the straight line XIV-XIV, showing the connection relationship among the base unit, the handle unit and the metal box of the front-opening wafer transfer box device according to the embodiment of the present invention. Figure 10 Specific embodiments Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

[0047] An embodiment of the manufacturing method and product of the front-opening wafer transfer box device of the present invention is applicable to carrying a plurality of wafers 9 as

[0048] shown. The manufacturing method of the embodiment includes the following steps: a step (a), a step (b), a step (c), a step (d), and a step (e). Figure 4

[0049] Referring to Figure 1 , in the step (a), a stamping process is applied to a metal plate (not shown in the figure) so that the metal plate is stamped into a metal box 2. The metal box 2 includes a base wall 21 and a surrounding wall 22 surrounding the base wall 21 and defining a space 201, and an opening 202 exposing the space 201 is defined at one end of the surrounding wall 22 away from the base wall 21. The metal plate applicable to the embodiment of the present invention is made of stainless steel or aluminum alloy.

[0050] Referring to Figure 2 , in the step (b), a punching process is applied to two first wall portions 221 of the surrounding wall 22 of the metal box 2 that are spaced apart from each other and face each other, so as to punch a plurality of mounting holes 2210 spaced apart from each other in the two first wall portions 221. Preferably, in the step (a), as Figure 1 shown, at least one reinforcing rib 23 is also stamped on each of the first wall portions 221 of the surrounding wall 22 of the metal box 2 and one of the two second wall portions 2221, 2222 that connect the first wall portions 221 and are spaced apart from each other and face each other (that is, the second wall portion 2221 located on the upper side of the surrounding wall 22). Each reinforcing rib 23 is recessed from the surrounding wall 22 toward the space 201 and extends from the base wall 21 toward the opening 202. In the embodiment of the present invention, each reinforcing rib 23 is described by taking the example of being obtained by the stamping process, but is not limited thereto. The reinforcing rib 23 can also be formed by welding a plurality of metal sheets (not shown in the figure) to the surrounding wall 22 of the metal box 2, or formed on the surrounding wall 22 of the metal box 2 by means of 3D printing.

[0051] Figure 3 ​​, step (c) is to provide a door frame 3 at the opening 202 of the metal box 2. Preferably, the door frame 3 in step (c) is obtained by injection molding technology, stamping process, welding, CNC lathe machining or 3D printing. Specifically, in the embodiment of the present invention, step (c) is to perform an injection molding technology on the metal box 2 disposed in an injection molding die (not shown) to form a rubber frame covering the end of the surrounding wall 22 at the opening 202 of the metal box 2 as an example, but not limited thereto. For example, the door frame 3 can also be obtained by performing another stamping process on the end of the surrounding wall 22 of the metal box 2 after the stamping process of step (a) is completed. For another example, the door frame 3 can be obtained by 3D printing a composition containing metal powder to obtain a metal door frame and then welding the metal door frame to the opening 202 of the metal box 2, or the metal box 2 can be disposed on a machine table (not shown) of a CNC lathe machining machine to obtain the end of the surrounding wall 22 of the metal box 2 by turning and machining.

[0053] Refer to Figure 4 , step (d) is to install a wafer carrier unit in the space 201 of the metal box 2, so that the wafer carrier unit is fixed to the mounting hole 2210 for carrying the wafer 9, and to install a handle unit outside the space 201 of the metal box 2, so that the handle unit is fixed to the mounting hole 2210 of the first wall portion 221.

[0054] Refer to Figure 5 And Figure 9 , step (e) is to provide a door panel 6 at the door frame 3 to seal the opening 202 of the metal box 2.

[0055] Preferably, as Figure 6 shown, in step (b), two air charging pipes 25 spaced apart from each other are formed by punching in the other second wall portion 2222 (that is, the second wall portion 2222 located at the lower side of the surrounding wall 22) of the second wall portions 2221 and 2222 of the surrounding wall 22 of the metal box 2. The air charging pipes 25 penetrate through the other second wall portion 2222 and extend outward from the space 201, and the air charging pipes 25 are adjacent to the opening 202.

[0056] Preferably, a step (b’) is further included after step (a) or step (b). As Figure 7a And Figure 7bAs shown, in step (b’), a plurality of mounting bumps 24 are respectively welded on each of the second wall portions 2221 and 2222 of the surrounding wall 22 of the metal box 2, and the mounting bumps 24 are spaced from each other and protrude from each of the second wall portions 2221 and 2222 away from the space 201.

[0057] Refer to again Figure 4 and refer to in conjunction with Figure 10 and Figure 11 , in step (d) of the embodiment of the present invention, the wafer carrier unit includes two wafer carrier components 4 arranged opposite to each other with a space therebetween, and in the space 201 of the metal box 2, each wafer carrier component 4 is tightly mounted on the mounting hole 2210 of its corresponding first wall portion 221 through a plurality of bolts. The wafer carrier component 4 in the embodiment of the present invention can be assembled with an existing wafer carrier component, which is not the technical focus of the present invention and will not be elaborated herein.

[0058] Refer to again Figure 4 , in step (d) of the embodiment of the present invention, the handle unit includes two handle components 5 (only one handle component 5 is shown in the figure), and each handle component 5 includes a fixing base 51 and a handle 52. As Figure 10 , Figure 11 and Figure 12 shown, the fixing base 51 of each handle component 5 has a first block 511 (please refer to Figure 11 ) fixed on the mounting hole 2210 of each first wall portion 221, and a second block 512 (please refer to Figure 12 ) extending from its first block 511 to the other second wall portion 2222 of the surrounding wall 22 and sleeved on the mounting bump 24 of the other second wall portion 2222. Each handle 52 is fixed on the first block 511 of its corresponding fixing base 51. Specifically, the first block 511 of the fixing base 51 of each handle component 5 shares the bolts with its corresponding wafer carrier component 4 and is tightly fixed on the mounting hole 2210 of each first wall portion 221.

[0059] Refer to again Figure 4 and refer to in conjunction with Figure 10 , Figure 13 and Figure 14 , in step (d) of the embodiment of the present invention, a transmission flange 7 is further installed on one of the second wall portions 2221, and a base unit 8 is installed on the other second wall portion 2222, so that a bottom portion of the transmission flange 7 is limited by the mounting bump 24 on one of the second wall portions 2221, and the base unit 8 is limited by the mounting bump 24 on the other second wall portion 2222 and an inner ring surface 251 of each gas charging pipe 25.

[0060] Specifically, as Figure 13 shown, the transmission flange 7 is further fixed to the mounting bump 24 located on one of the second wall portions 2221 by bolts (not shown in the figure). In addition, as Figure 14 shown, the base unit 8 includes a base 81 and two inflating components 82. The base 81 of the base unit 8 is limited to the mounting bump 24 located on the other second wall portion 2222, so that the second block 512 of the fixing seat 51 of each handle assembly 5 is clamped between the other second wall portion 2222 and the base 81, and the base 81 and each second block 512 are fixed to the mounting bump 24 located on the other second wall portion 2222 by bolts (not shown in the figure). Each inflating component 82 of the base unit 8 is sleeved by the base 81 to be limited to the inner ring surface 251 of the corresponding inflating pipe 25 and is clamped between the base 81 and the corresponding inflating pipe 25.

[0061] From the detailed description of the above manufacturing method, it can be seen that the front-opening wafer transfer box device manufactured by the manufacturing method of the embodiment of the present invention is as Figure 5 and Figure 9 shown, including the metal box 2, the door frame 3, the wafer carrying component 4, the handle component 5, the door panel 6, the transmission flange 7, and the base unit 8.

[0062] As Figure 1 , Figure 2 and Figure 6 shown, the metal box 2 is made of stainless steel or aluminum alloy and is obtained by the stamping forming process. The metal box 2 includes the base wall 21, the surrounding wall 22 surrounding the base wall 21 and defining the space 201, and the reinforcing ribs 23. The surrounding wall 22 defines the opening 202 exposing the space 201 at the end far from the base wall 21. The surrounding wall 22 of the metal box 2 has the first wall portion 221 arranged at intervals facing each other and the second wall portions 2221, 2222 arranged at intervals facing each other and connecting the first wall portion 221. The reinforcing ribs 23 on the first wall portion 221 and one of the second wall portions 2221 are recessed from the surrounding wall 22 toward the space 201 and extend from the base wall 21 toward the opening 202. Each first wall portion 221 has the mounting holes 2210 punched and formed at intervals through the punching forming process, and the punching forming process also punches and forms the inflating pipe 25 on the other second wall portion 2222, so that the inflating pipe 25 penetrates the other second wall portion 2222 and extends outward from the space 201. As Figure 7a and Figure 7bAs shown, each mounting lug 24 of the metal box 2 is welded to each second wall portion 2221, 2222 of the surrounding wall 22, and each mounting lug 24 protrudes from each second wall portion 2221, 2222 away from the space 201. It is worth mentioning here that the metal box 2 of the embodiment of the present invention can solve the moisture absorption problem caused by the PC material of the existing FOUP based on the characteristic that its metal material is not easy to absorb moisture itself.

[0064] The door frame 3 is a rubber frame made by the injection molding technique, and is disposed at the opening 202 of the metal box 2 to cover the end of the surrounding wall 22.

[0065] The wafer carrier assembly 4 is fixed to the mounting holes 2210 of each first wall portion 221 of the surrounding wall 22, and is installed in the space 201 of the metal box 2 to carry the wafer 9.

[0066] As Figure 11 and Figure 12 shown, each handle assembly 5 is installed outside the space 201 of the metal box 2 and is fixed to the mounting holes 2210 of each first wall portion 221. The fixing seat 51 of each handle assembly 5 has a first block 511 fixed to each first wall portion 221, and a second block 512 extending from its first block 511 to the other second wall portion 2222 of the surrounding wall 22 and sleeved on the mounting lug 24 of the other second wall portion 2222. The handle 52 of each handle assembly 5 is fixed to the first block 511 of the corresponding fixing seat 51. The door panel 6 is located at the door frame 3 to seal the opening 202 of the metal box 2.

[0067] It is worth mentioning that the mounting lug 24 welded to the metal box 2 of the embodiment of the present invention can not only be sleeved by the second block 512 of the fixing seat 51 of each handle assembly 5 (please see Figure 12 ), but also limit the bottom of the transfer flange 7 to the mounting lug 24 on one of the second wall portions 2221 (please see Figure 13 ), and can also limit the base 81 of the base unit 8 to the mounting lug 24 on the other second wall portion 2222, so that the second block 512 of the fixing seat 51 of each handle assembly 5 is clamped between the other second wall portion 2222 and the base 81 (please see Figure 12 and Figure 14 ). Therefore, in order to externally connect the transfer flange 7 and the base unit 8, the FOUP of the embodiment of the present invention only needs to use the mounting lug 24 and the existing bolts to achieve, and it does not need to add mounting holes for installing / fixing the transfer flange 7 and the base unit 8 to the metal box 2, which can improve the sealing performance of the FOUP of the embodiment of the present invention.

[0068] More notably, the fixing bases 51 of each handle assembly 5 are simultaneously fixed to each first wall portion 221 of the surrounding wall 22 and the other second wall portion 2222, and the second block 512 of each fixing base 51 is further clamped between the other second wall portion 2222 and the base 81. Therefore, when the FOUP of the embodiment is stressed due to being carried by an operator in a wafer foundry, each fixing base 51 can disperse the stress to each first wall portion 221 and the other second wall portion 2222 simultaneously, so as to avoid deformation of the metal box 2. In addition, each inflating assembly 82 is sleeved by the base 81 and limited to the inner ring surface 251 of its corresponding inflating pipe 25, and is clamped between the base 81 and its corresponding inflating pipe 25. When the FOUP of the embodiment of the present invention is mounted on an inflating machine (not shown) in a wafer foundry, the inflating machine can supply nitrogen to each inflating pipe 25 from each inflating assembly 82, so that nitrogen can be transmitted through each inflating pipe 25 towards the space 201 of the metal box 2, thereby preventing the wafers 9 in the space 201 of the metal box 2 from being oxidized.

[0069] In summary, the manufacturing method and product of the front-opening wafer transfer box device of the present invention can solve the moisture absorption problem of the existing FOUP caused by its PC material due to the property that the metal box 2 itself is not easily moisture-absorbing. The transmission flange 7 and the base unit 8 can also be installed outside the metal box 2 by means of the installation bumps 24 without the need for installation holes, improving the sealing performance of the FOUP. Therefore, the object of the present invention can be truly achieved.

[0070] However, the above are only the embodiments of the present invention, and the scope of implementation of the present invention cannot be limited thereby. All simple equivalent changes and modifications made according to the claims and the content of the specification of the present invention still fall within the scope covered by the present invention.

Claims

1. A manufacturing method of a front-opening wafer transfer cassette device, suitable for carrying a plurality of wafers, characterized in that: It includes the following steps: Step (a): Applying a stamping process to a metal plate to stamp the metal plate into a metal box. The metal box includes a base wall and a surrounding wall that surrounds the base wall and defines a space, and an opening that exposes the space is defined at an end of the surrounding wall away from the base wall; Step (b): Applying a punching process to two first wall portions of the surrounding wall of the metal box that are spaced apart from each other and face each other, so as to punch a plurality of mounting holes that are spaced apart from each other in the first wall portions; Step (c): Providing a door frame at the opening of the metal box; Step (d): Installing a wafer carrier unit in the space of the metal box, fixing the wafer carrier unit to the mounting holes for carrying the wafer, and installing a handle unit outside the space of the metal box, fixing the handle unit to the mounting holes of the first wall portion; And Step (e): Providing a door panel at the door frame to seal the opening of the metal box.

2. The manufacturing method of the front-opening wafer transfer cassette device according to claim 1, characterized in that: In step (a), at least one reinforcing rib is respectively stamped on one of the second wall portions that connects the first wall portions and is spaced apart from each other and faces each other in the surrounding wall of the metal box. Each reinforcing rib is recessed from the surrounding wall towards the space and extends from the base wall towards the opening.

3. The manufacturing method of the front-opening wafer transfer box according to claim 2, characterized in that: After step (a) or step (b), it further includes step (b'): In step (b), two gas charging pipes that are spaced apart from each other are punched in the other second wall portion of the surrounding wall of the metal box. The gas charging pipes penetrate through the other second wall portion and extend outwards from the space, and the gas charging pipes are adjacent to the opening; Step (b') is to weld a plurality of mounting bumps that are spaced apart from each other on each second wall portion of the surrounding wall of the metal box. Each mounting bump protrudes from each second wall portion away from the space; In step (d): The wafer carrier unit includes two wafer carrier components that are spaced apart from each other and face each other, and each wafer carrier component is installed on the mounting hole of the corresponding first wall portion in the space of the metal box; The handle unit includes two handle components, and each handle component includes a fixing base and a handle. Each fixing base has a first block fixed to the mounting hole of each first wall portion, and a second block extending from its first block to the other second wall portion of the surrounding wall and sleeved on the mounting bump of the other second wall portion. Each handle is fixed to the first block of the corresponding fixing base; And A transfer flange is also installed on one of the second wall portions, and a base unit is installed on the other second wall portion, such that the bottom of the transfer flange is limited by the mounting bumps on one of the second wall portions, and the base unit is limited by the mounting bumps on the other second wall portion and on the inner circumferential surfaces of the respective inflation tubes. The base unit includes a base and two inflation assemblies. The base of the base unit is limited by the mounting bumps on the other second wall portion, so that the second block of the fixing seat of each handle assembly is clamped between the other second wall portion and the base. Each inflation assembly of the base unit is sleeved by the base and is limited on the inner circumferential surface of the respective inflation tube corresponding thereto, and is clamped between the base and the respective inflation tube corresponding thereto.

4. The manufacturing method of the front-opening wafer transfer cassette device according to claim 1, wherein: In the step (c), the door frame is made by injection molding technology, stamping process, welding, CNC lathe machining or 3D printing.

5. The manufacturing method of the front-opening wafer transfer cassette device according to claim 4, characterized in that: In the step (c), injection molding technology is applied to the metal box disposed in the injection molding die, so as to form a rubber frame covering the end of the surrounding wall at the opening of the metal box.

6. The manufacturing method of the front-opening wafer transfer cassette device according to claim 1, characterized in that: In the step (a), the metal plate is made of stainless steel or aluminum alloy.

7. A front-opening wafer transfer cassette device, suitable for carrying a plurality of wafers, characterized in that: The front-opening wafer transfer box device includes: A metal box, which is made by stamping process, and includes a base wall and a surrounding wall surrounding the base wall and defining a space. The surrounding wall defines an opening exposing the space at the end away from the base wall. The surrounding wall of the metal box has two first wall portions arranged opposite to each other with a space therebetween, and each first wall portion has a plurality of mounting holes arranged at intervals. A door frame, which is disposed at the opening of the metal box; A wafer carrying unit, which is fixed to the mounting holes of each first wall portion of the surrounding wall to be installed in the space of the metal box for carrying the wafer; A handle unit, which is installed outside the space of the metal box and is fixed to the mounting holes of the first wall portion; and A door panel, which is located at the door frame to seal the opening of the metal box.

8. The front-opening wafer transfer cassette device according to claim 7, wherein: The surrounding wall of the metal box further has two second wall portions arranged opposite to each other with a space therebetween and connecting the first wall portions. At least one reinforcing rib formed by stamping is provided on one of the second wall portions of the first wall portion and the second wall portion. Each reinforcing rib is recessed from the surrounding wall toward the space and extends from the base wall toward the opening.

9. The front-opening wafer transfer cassette device according to claim 8, wherein: It further includes a transfer flange and a base unit. The metal box further includes a plurality of mounting bumps and two inflation tubes. The mounting bumps are welded to the respective second wall portions of the surrounding wall at intervals, and each mounting bump protrudes from each second wall portion away from the space. The inflation tubes penetrate through the other second wall portion of the second wall portions and extend outward from the space, and each inflation tube is adjacent to the opening of the metal box. The handle unit includes two handle assemblies. Each handle assembly has a fixed seat and a handle. The fixed seat of each handle assembly has a first block fixed to each first wall portion, and a second block extending from its first block to the other second wall portion of the surrounding wall to be sleeved on the mounting bump of the other second wall portion. The handle of each handle assembly is fixed to the first block of the corresponding fixed seat; The transmission flange is mounted on one of the second wall portions so that the bottom of the transmission flange is limited on the mounting bump on one of the second wall portions; and The base unit is mounted on the other second wall portion so that the base unit is limited on the mounting bump on the other second wall portion and on the inner ring surface of each inflatable tube. The base unit includes: A base limited on the mounting bump on the other second wall portion so that the second block of the fixed seat of each handle assembly is clamped between the other second wall portion and the base, and Two inflatable components sleeved by the base to be limited on the inner ring surface of the corresponding inflatable tube and clamped between the base and the corresponding inflatable tube.

10. The front-opening wafer transfer cassette device according to claim 7, wherein: The door frame is made by injection molding technology and is a rubber frame disposed at the opening of the metal box to cover the end of the surrounding wall.

11. The front-opening wafer transfer cassette device according to claim 7, wherein: The metal box is made of stainless steel or aluminum alloy.

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