Semiconductor device, display device, photoelectric conversion device, and electronic device

Abstract

The invention discloses a semiconductor device, a display device, a photoelectric conversion device, and an electronic device. A semiconductor device according to the present invention comprises: a semiconductor substrate; and a semiconductor chip electrically connected to the semiconductor substrate via a plurality of terminals, in which the semiconductor substrate includes an active element region and a peripheral region surrounding the active element region, the peripheral region being provided with an electrode portion electrically connected to the semiconductor chip, the semiconductor chip is provided with a plurality of rows of terminal groups arranged along a first direction and satisfies W1gt; w1 is a distance from an end portion of the semiconductor chip on a side closest to the active element region to the terminal group, and W2 is a distance from an end portion of the semiconductor chip on a side farthest from the active element region to the terminal group, and W2 is a distance from an end portion of the semiconductor chip on a side farthest from the active element region to the terminal group.

Description

Technical Field

[0001] The present invention relates to a semiconductor device, a display device, a photoelectric conversion device, and an electronic device. Background Art

[0002] In electronic devices, miniaturization, weight reduction, and high performance are required, and the number of external output terminals is increasing rapidly. Regarding the increase in the number of external output terminals, in the conventional wire bonding connection, the narrowing of the connection terminal pitch is limited, and the electronic device becomes large. Therefore, the technology of flip-chip mounting a semiconductor chip has attracted attention.

[0003] In flip-chip mounting, since the bonding pads miniaturized by semiconductor processes can be connected to each other via connection portions (such as bumps, etc.), the pitch of the external output terminals can be significantly narrowed compared to the conventional wire bonding connection.

[0004] Examples of the bonding method for flip-chip mounting include ultrasonic bonding and solder bonding. In the manufacture of a display device such as an organic EL, in order to suppress element deterioration due to heat in the bonding step, a bonding method using an anisotropic conductive film (ACF) that can be bonded at a low temperature is generally used.

[0005] JP 2016-127259 A and JP 2005-26682A propose flip-chip mounting using ACF bonding. In addition, the arrangement of electrodes and bumps and dummy bumps are also described. In the technology described in JP 2016-127259 A, the dummy bumps are arranged between a first bump region and a second bump region divided on both sides of the chip, and the bumps are uniformly arranged on the chip, thereby reducing the warping of the chip during flip-chip mounting and reducing electrical contact failures. In the technology described in JP 2005-26682A, since the stress during crimping is concentrated on the four corners of the chip, dummy bumps are arranged at the four corners of the chip to reduce damage to the electrical connection.

[0006] However, JP 2016-127259 A and JP 2005-26682A do not mention the wiring of the semiconductor substrate, and when the electrodes of the semiconductor chip are arranged on the side close to the effective pixel region of the semiconductor substrate, the wiring routing becomes complicated. Therefore, it is necessary to move the semiconductor chip away from the effective pixel region, and there is a problem of an increase in the size of the semiconductor substrate. In particular, in the case of applying this technology to a display device or a camera device, since the number of output terminals of the semiconductor chip increases and the wiring from the semiconductor chip to the effective pixels becomes dense, a large area is required to route the wiring, and the substrate size becomes larger. Summary of the Invention

[0007] In view of the above problems, the present invention has been made, and the present invention provides a technique that is conducive to reducing the size of the substrate in a semiconductor device.

[0008] The semiconductor device according to the present invention includes: a semiconductor substrate; and a semiconductor chip electrically connected to the semiconductor substrate via a plurality of terminals. Among them, the semiconductor substrate includes an active element region and a peripheral region surrounding the active element region. The peripheral region is provided with an electrode portion electrically connected to the semiconductor chip. The semiconductor chip is provided with a plurality of rows of terminal groups arranged along a first direction, and satisfies W1>W2, where W1 is the distance from the end of the semiconductor chip closest to the active element region to the terminal group, and W2 is the distance from the end of the semiconductor chip farthest from the active element region to the terminal group.

[0009] Other features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a plan view schematically showing a conventional semiconductor device;

[0011] Figure 2 is a plan view schematically showing the semiconductor device of the first embodiment;

[0012] Figure 3A is a schematic diagram of a conventional semiconductor device;

[0013] Figure 3B is a schematic diagram of the semiconductor device of the first embodiment;

[0014] Figure 4 is a terminal arrangement diagram of a semiconductor chip according to the second embodiment;

[0015] Figure 5A is a terminal arrangement diagram of a semiconductor chip according to the third embodiment, and Figure 5B is a cross-sectional view thereof;

[0016] Figure 6 is a schematic diagram showing a display device according to the fourth embodiment;

[0017] Figure 7A is a schematic diagram showing a camera device according to the fourth embodiment;

[0018] Figure 7B is a schematic diagram showing an electronic device according to the fourth embodiment;

[0019] Figure 8A and Figure 8B is a schematic diagram showing a display device according to the fourth embodiment;

[0020] Figure 9A is a schematic diagram showing the lighting device according to the fourth embodiment;

[0021] Figure 9B is a schematic diagram showing the moving body according to the fourth embodiment; and

[0022] Figure 10A and Figure 10B is a schematic diagram showing the wearable device according to the fourth embodiment. DETAILED DESCRIPTION

[0023] Embodiments of the present invention will be described with reference to the drawings. Note that in the following description and drawings, in multiple drawings, common components are denoted by common reference numerals. Therefore, a common configuration will be described with reference to multiple drawings, and the description of the configuration denoted by the common reference numerals will be appropriately omitted.

[0024] Figure 1 is a plan view (schematic diagram) of a conventional semiconductor device looking down. The arrangement in the plan view is the arrangement when the semiconductor device is viewed from a direction perpendicular to the main surface of the semiconductor substrate 100 (the normal direction of the main surface). The semiconductor substrate 100 includes an active element region AA and a peripheral region located around the active element region AA. In the active element region AA, functional elements (not shown) are provided on a substrate such as silicon. In the peripheral region, an electrode portion (not shown) serving as an external connection terminal is provided, and the electrode portion and the semiconductor chip 300 are electrically coupled. The active element region AA is electrically coupled to the electrode portion through a wiring 60. The semiconductor chip 300 is a semiconductor chip provided with a drive circuit, and a plurality of terminals are arranged on the surface connected to the semiconductor substrate 100 in a terminal group 451 and a terminal group 452 arranged along the longitudinal direction of the semiconductor chip ( Figure 1 the direction D1: the first direction in

[0025] Each of the terminal groups 451 and 452 constitutes an output terminal group or an input terminal group. For example, each terminal of the terminal group 451 may be an output terminal and each terminal of the terminal group 452 may be an input terminal, or each terminal of the terminal group 451 may be an input terminal and each terminal of the terminal group 452 may be an output terminal. A terminal group constituted by a pair of an input terminal and an output terminal arranged in the lateral direction of the semiconductor chip ( Figure 1 the direction D2: the second direction in

[0026] Generally, the number of output terminals is large, and the desired number of output terminals is arranged by reducing the size of the output terminals or increasing the number of rows of output terminals in the lateral direction of the semiconductor chip. Usually, when arranging about 2000 to 10000 output terminals, the length of one side of the output terminal is about 10 μm to 100 μm, and the height of the output terminal is about 3 μm to 50 μm. The interval between output terminals is about 10 μm to 100 μm, and the number of rows of output terminals is about 3 to 20. The electrode portion (not shown) includes a plurality of electrodes, and the plurality of output terminals are connected to the plurality of electrodes via a connection member.

[0027] Generally, the number of input terminals is smaller than the number of output terminals, and the input terminals are required to have low resistance. Therefore, the size of the input terminals is preferably large. Usually, when arranging about 300 to 2000 input terminals, the length of one side of the input terminal is about 10 μm to 200 μm, and the height of the input terminal is about 3 μm to 50 μm. The interval between input terminals is about 10 μm to 50 μm, and the number of rows of input terminals in the lateral direction of the semiconductor chip is about 1 to 5. The electrode portion includes a plurality of electrodes, and the plurality of input terminals are connected to the plurality of electrodes via a connection member.

[0028] Functional elements (not shown) can be provided in the effective element region AA of the semiconductor substrate 100. The functional elements are display elements, photoelectric conversion elements, etc. In the case of a display element, the functional element is an EL element in an electroluminescent display (ELD), a liquid crystal element in a liquid crystal display (LCD), or a reflection element in a digital micromirror device (DMD).

[0029] The peripheral region may include a peripheral circuit region (not shown) in which peripheral circuits are arranged. For example, in the case of a display device, the peripheral circuits include a drive circuit for driving effective pixels, a processing circuit for processing signals input to the effective pixels (e.g., a digital-to-analog conversion circuit (DAC)), etc. The peripheral region may include a non-effective element region (not shown) located outside the effective element region AA and provided with non-effective elements. The non-effective elements are elements that do not function as effective elements, and are dummy elements, reference elements, test elements, or monitoring elements, etc.

[0030] The electrode portion of the semiconductor substrate 100 and the terminal group of the semiconductor chip 300 are both formed at a pitch facing each other. The electrode portion of the semiconductor substrate 100 is made of aluminum or the like disposed in the opening of the passivation layer, and each terminal of the semiconductor chip is a protruding bump formed of gold, copper, nickel, or the like. The bumps can be formed by methods such as electroplating, vapor deposition, or stud bump. The semiconductor substrate 100 and the semiconductor chip 300 can be connected by flip-chip bonding or ultrasonic flip-chip bonding.

[0031] The connecting member between the semiconductor substrate 100 and the semiconductor chip 300 is ACF, NCF, epoxy resin, acrylic resin, solder, etc. For example, the electrodes of the semiconductor substrate 100 and the terminals of the semiconductor chip 300 are electrically connected by thermocompression bonding or ultrasonic compression bonding. ACF is a film in which conductive particles are dispersed in a thermosetting resin, and can be interpreted as an anisotropic conductive resin. As the thermosetting resin, epoxy resin, acrylic resin, etc. are used. The size and number of the conductive particles are selected according to the size of the terminals. For example, in general ACF, the size (diameter) of the conductive particles is about 1 μm to 5 μm, and the number (areal density) of the conductive particles is about 10,000 to 100,000 particles / mm 2 . By using NCF, epoxy resin or acrylic resin, the connection strength and reliability between the electrodes and the terminals can be improved.

[0032] (First Embodiment)

[0033] The first embodiment will be described. Figure 2 is a plan view (schematic diagram) of the semiconductor device according to the first embodiment as viewed from above. In the semiconductor device according to the first embodiment, the input / output terminal group is arranged such that W1 > W2. W1 is the (shortest) distance from the end of the semiconductor chip on the side closest to the effective element region AA of the semiconductor device to the input / output terminal group. W2 is the (shortest) distance from the end of the semiconductor chip on the side farthest from the effective element region AA to the input / output terminal group. In this way, the interval between the terminal group 451 and the terminal group 452 is narrowed, so that the terminal group 451 is arranged at a position away from the effective pixel region of the semiconductor substrate. In this way, a region without terminals is formed in the semiconductor chip (on the side of the effective element region AA), and the wiring in this region (the wiring between the effective element region and the wiring portion) can be routed around. As a result, the wiring routing region (the region between the effective element region and the electrode portion) and the semiconductor chip can overlap, and the semiconductor chip can be close to the effective element region side, so that the size of the semiconductor device itself can be reduced. In particular, in the case of a display device or a imaging device, since the number of output terminals on the effective element side is large, the effect is significant.

[0034] Figure 3A and Figure 3B is a diagram for explaining the dimensional difference between a conventional semiconductor device and the semiconductor device according to the first embodiment in relation to the arrangement of the input / output terminal group in the semiconductor device according to the first embodiment. Figure 3A is a schematic diagram of a conventional semiconductor device, Figure 3BIt is a schematic diagram of a semiconductor device according to the first embodiment. The terminal group on the side closer to the active element region AA is defined as the output terminal group (or input terminal group), and the distance from the active element region AA to the output terminal group (or input terminal group) is defined as B. When the distance B is constant (same wiring pattern), the semiconductor chip can be closer to the active element region side, so that as Figure 3B shown, the size of the semiconductor substrate can be reduced.

[0035] (Second Embodiment)

[0036] The second embodiment will be described. Figure 4 It is a plan view (schematic diagram) of a semiconductor chip according to the second embodiment. In the first embodiment, since the input / output terminal groups of the semiconductor chip are unevenly arranged on one side, there is a possibility that the electrical connection becomes unstable when connecting the semiconductor chip and the semiconductor substrate. In the second embodiment, a dummy terminal group 450 is provided between the end on the side of the semiconductor chip closest to the active element region AA of the semiconductor device and the input / output terminal group. As a result, the load applied between the electrode portion and the terminal group during bonding can be balanced, and the electrical connection can be stabilized.

[0037] Furthermore, in the second embodiment, when the distance from the end on the side of the semiconductor chip closest to the active element region AA of the semiconductor device to the dummy terminal group 450 is W3, the dummy terminal group 450 is arranged such that W2 = W3. As a result, the uniformity of the terminal arrangement of the semiconductor chip is further improved, and the electrical connection can be further stabilized. According to the second embodiment, the effect of balancing the load applied between the electrode portion and the terminal group during bonding can be obtained, and the size of the semiconductor device can be reduced and the electrical connection can be stabilized.

[0038] (Third Embodiment)

[0039] The third embodiment will be described. Figure 5A It is a terminal arrangement diagram of a semiconductor chip according to the third embodiment. In the second embodiment, a dummy terminal group is provided between the end on the side of the semiconductor chip closest to the active element region AA and the output terminal (or input terminal) 451. In the third embodiment, the shape and number of each terminal in the dummy terminal group are made the same as the shape and number of each terminal in the terminal group 452 on the side farthest from the active element region. As a result, the load can be applied more evenly, and connection stability can be achieved. According to the third embodiment, the effect of balancing the load applied between the electrode portion and the terminal group during bonding can be obtained, and the size of the semiconductor device can be reduced and the electrical connection can be stabilized.

[0040] Figure 5BIt is a cross-sectional view of the joint between a semiconductor chip and a semiconductor substrate according to the third embodiment. The semiconductor chip 300 is electrically connected to the electrode portion 33 of the semiconductor substrate 100 via a connection member 500. For the connection member 500, a conductive member such as an anisotropic conductive adhesive film (ACF), a non-conductive adhesive film (NCF), an epoxy resin, or an acrylic resin is used. The semiconductor substrate 100 is made of a semiconductor such as single crystal silicon.

[0041] As described above, by using the semiconductor device according to the first to third embodiments, the size of the semiconductor device can be reduced.

[0042] (Fourth Embodiment)

[0043] In the fourth embodiment, examples of applying the semiconductor device according to the first to third embodiments to various devices will be described. When the semiconductor device is used for a display device, the semiconductor substrate 100 is a display element substrate, and light-emitting elements are arranged in the effective element region AA. In addition, when the semiconductor device is used for a camera device, the semiconductor substrate 100 is a camera element substrate, and camera elements are arranged in the effective element region AA.

[0044] Figure 6 It is a schematic diagram showing a display device 1000 as an example of a display device according to the fourth embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009.

[0045] The display panel 1005 is a display unit including the semiconductor device according to the first to third embodiments, and performs display using the light emitted from the semiconductor device. Flexible printed circuits FPC 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. A control circuit including transistors is printed on the circuit board 1007, and various controls such as control of the display panel 1005 are performed. Unless the display device is a portable device, the battery 1008 may not be provided, or even if the display device is a portable device, the battery 1008 may be provided at other positions. The display device 1000 may include three types of color filters corresponding to red, green, and blue, respectively. A plurality of color filters may be arranged in a delta array.

[0046] The display device 1000 can be used for the display unit of a mobile terminal. At this time, the display device 1000 may have both a display function and an operation function. Examples of mobile terminals include mobile phones such as smart phones, tablet computers, and head-mounted displays.

[0047] The display device 1000 can be used for a display unit of an imaging device including an optical unit having a plurality of lenses and an imaging element that receives light passing through the optical unit. The imaging device may include a display unit that displays information acquired by the imaging element (such as an image captured by the imaging element). In addition, the display unit may be a display unit exposed to the outside of the imaging device or a display unit arranged in the viewfinder. The imaging device may be a digital camera, a digital video camera, or the like.

[0048] Figure 7A FIG. is a schematic diagram showing an imaging device 1100 as an example of an imaging device according to the fourth embodiment. The imaging device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may include a display device according to the fourth embodiment (a display device including a semiconductor device according to the first to third embodiments and using light emitted from the semiconductor device for display). In this case, the display device can display not only the image to be captured but also environmental information, imaging instructions, and the like. The environmental information may be the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject is blocked by an occluding object, and the like. The rear display 1102 may also include a display device according to the fourth embodiment.

[0049] Since the timing suitable for imaging is a short time, it is best to display the information as soon as possible. Therefore, it is preferable to use a display device using an organic light-emitting element having a high response speed. Compared with a liquid crystal display device or the like, a display device using an organic light-emitting element can be applied to a device that requires a display speed.

[0050] The imaging device 1100 includes an optical unit (not shown). The optical unit includes a plurality of lenses and forms an image of light on an imaging element housed in the housing 1104. The plurality of lenses can adjust the focus by adjusting their relative positions. This operation can also be performed automatically. The imaging device 1100 may be referred to as a photoelectric conversion device. The photoelectric conversion device may include methods for detecting differences from a previous image, methods for cropping a part of a recorded image, etc. as imaging methods instead of sequential imaging.

[0051] Figure 7BFIG. is a schematic diagram showing an electronic device 1200 as an example of an electronic device according to the fourth embodiment. The electronic device 1200 includes a display unit 1201, an operation unit 1202, and a housing 1203. The display unit 1201 includes a semiconductor device according to the first to third embodiments, and performs display using light emitted from the semiconductor device. The electronic device 1200 may include a circuit, a printed circuit board including the circuit, a battery, and a communication unit for communicating with the outside in the housing 1203. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric unit that recognizes fingerprints and releases locks, etc. An electronic device having a communication unit may also be referred to as a communication device. The electronic device may also include a camera function by including a lens and an imaging element. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smart phone and a laptop computer.

[0052] Figure 8A FIG. is a schematic diagram showing a display device 1300 as an example of a display device according to the fourth embodiment. The display device 1300 is a display device such as a TV monitor or a PC monitor. The display device 1300 includes a frame 1301, a display unit 1302, and a base 1303 that supports the frame 1301 and the display unit 1302. The display unit 1302 includes a semiconductor device according to the first to third embodiments, and performs display using light emitted from the semiconductor device. The form of the base 1303 is not limited to Figure 8A the form. The lower side of the frame 1301 may also be used as the base 1303. The frame 1301 and the display unit 1302 may be bent. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0053] Figure 8B FIG. is a schematic diagram showing a display device 1310 as an example of a display device according to the fourth embodiment. The display device 1310 is a so-called foldable display device configured to be bendable. The display device 1310 includes a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. Each of the first display unit 1311 and the second display unit 1312 includes a semiconductor device according to the first to third embodiments, and performs display using light emitted from the semiconductor device. The first display unit 1311 and the second display unit 1312 may be a single display device without seams. The first display unit 1311 and the second display unit 1312 may be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or the first display unit 1311 and the second display unit 1312 may display one image.

[0054] Figure 9AFIG. is a schematic view showing a lighting device 1400 as an example of a lighting device according to the fourth embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusing portion 1405. The light source 1402 includes a semiconductor device according to the first to third embodiments. The optical film 1404 may be a filter (optical filter) that improves the color rendering property of the light source 1402. The light diffusing portion 1405 can effectively diffuse the light of the light source 1402 such as lighting up a bulb and transmit the light to a wide range. The optical film 1404 and the light diffusing portion 1405 may be provided on the light emitting side of the lighting device 1400. If necessary, a cover may be provided on the outermost side.

[0055] For example, the lighting device 1400 is a device for illuminating the interior. The lighting device 1400 can emit white light, neutral white light, and other colors (any color from blue to red). White is a color having a color temperature of 4200K, and neutral white is a color having a color temperature of 5000K. The lighting device 1400 may include a light control circuit that controls the emission color of the lighting device 1400. The lighting device 1400 may include a power supply circuit connected to the light source 1402. The power supply circuit is a circuit that converts an AC voltage into a DC voltage. In addition, the lighting device 1400 may include a color filter. In addition, the lighting device 1400 may include a heat dissipation portion. The heat dissipation portion releases the heat in the device to the outside of the device, and examples thereof include a metal having a high specific heat and liquid silicon.

[0056] Figure 9B FIG. is a schematic view showing a vehicle 1500 as an example of a moving body according to the fourth embodiment. The vehicle 1500 may include a tail lamp 1501 as an example of a lamp. The tail lamp 1501 is turned on in response to a braking operation or the like.

[0057] The tail lamp 1501 includes a semiconductor device according to the first to third embodiments. The tail lamp 1501 may include a protective member that protects the semiconductor device. The protective member has a certain degree of high strength and is preferably made of polycarbonate or the like, but the material is not limited as long as it is transparent. A furan dicarboxylic acid derivative, an acrylonitrile derivative, etc. may be mixed with polycarbonate.

[0058] The vehicle 1500 may have a body 1503 and a window 1502 attached to the body 1503. The window 1502 may be a transparent display as long as it is not a window for checking the front and rear of the vehicle 1500. The transparent display may include a semiconductor device according to the first to third embodiments. In this case, constituent materials such as electrodes included in the semiconductor device are formed of a transparent member.

[0059] The mobile body according to the fourth embodiment can be a ship, an aircraft, a drone, or the like. The mobile body may include a body and a lamp provided on the body. The lamp can emit light to notify the position of the body. The lamp includes the semiconductor device according to the first embodiment to the third embodiment.

[0060] The display device according to the fourth embodiment (a display device that includes the semiconductor device according to the first embodiment to the third embodiment and uses the light emitted from the semiconductor device for display) can also be applied to wearable devices such as smart glasses, HMDs, and smart contacts. The display device according to the fourth embodiment can also be applied to a system including wearable devices and the like. The imaging display device used as a wearable device or the like includes an imaging device capable of photoelectrically converting visible light and a display device capable of emitting visible light.

[0061] Figure 10A FIG. is a schematic diagram showing glasses 1600 (smart glasses) as an example of the wearable device according to the fourth embodiment. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front side of the lens 1601 of the glasses 1600. The display device according to the fourth embodiment (a display device that includes the semiconductor device according to the first embodiment to the third embodiment and uses the light emitted from the semiconductor device for display) is provided on the back side of the lens 1601.

[0062] The glasses 1600 further include a control device 1603. The control device 1603 serves as a power source for supplying power to the imaging device 1602 and the display device. In addition, the control device 1603 controls the operations of the imaging device 1602 and the display device. The lens 1601 is formed by an optical system for focusing light on the imaging device 1602.

[0063] Figure 10B FIG. is a schematic diagram showing glasses 1610 (smart glasses) as an example of the wearable device according to the fourth embodiment. The glasses 1610 include a control device 1612, and an imaging device corresponding to the imaging device 1602 and the display device according to the fourth embodiment are mounted on the control device 1612. The lens 1611 is formed by the imaging device in the control device 1612 and an optical system for projecting the light emitted from the display device, and an image is projected on the lens 1611. The control device 1612 serves as a power source for supplying power to the imaging device and the display device, and controls the operations of the imaging device and the display device.

[0064] The control device may include a line-of-sight detector that detects the line of sight of the wearer of the glasses 1610. Infrared light can be used to detect the line of sight. The infrared light emitting unit emits infrared light to the eyeball of the user who is gazing at the display image. An image of the eyeball is obtained by an imaging unit including a light receiving element that detects the reflected light from the eyeball of the emitted infrared light. By including a reducing unit that reduces the light from the infrared light emitting unit to the display unit in the plan view, the quality degradation of the image projected onto the lens 1611 from the display device is reduced. The control device detects the user's line of sight with respect to the display image from the image of the eyeball obtained by imaging with infrared light. Any known method can be applied to the line-of-sight detection using the image of the eyeball. As an example, a line-of-sight detection method based on the Purkinje image caused by the reflection of the irradiated light at the cornea can be used. More specifically, a line-of-sight detection process based on the pupil and corneal reflection method is performed. Using the pupil and corneal reflection method, a line-of-sight vector indicating the direction (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the image of the eyeball, thereby detecting the user's line of sight.

[0065] Note that in the case of performing display control based on visual recognition detection (line-of-sight detection), the semiconductor device according to the first to third embodiments can be preferably applied to smart glasses having an imaging device that images the outside. The smart glasses can display the imaged outside information in real time.

[0066] Note that the display device according to the fourth embodiment (including the semiconductor device according to the first to third embodiments and using the light emitted from the semiconductor device for display) may include an imaging device having a light receiving element, and may control the display image based on the user's line-of-sight information from the imaging device. Specifically, based on the line-of-sight information, a first field-of-view region where the user is gazing and a second field-of-view region other than the first field-of-view region are determined. The first field-of-view region and the second field-of-view region may be determined by the control device of the display device, or may be determined by an external control device and received by the display device. In the display area of the display device, the display resolution of the first field-of-view region can be controlled to be higher than the display resolution of the second field-of-view region. That is, the resolution of the second field-of-view region can be lower than the resolution of the first field-of-view region.

[0067] In addition, the display area may have a first display area and a second display area different from the first display area, and an area with a high priority may be determined from the first display area and the second display area based on the line-of-sight information. The first display area and the second display area may be determined by a control device of the display device, or may be determined by an external control device and received by the display device. The resolution of the area with a high priority may be controlled to be higher than the resolution of areas other than the area with a high priority. That is, the resolution of an area with a relatively low priority may be reduced.

[0068] Note that AI can be used to determine the first field-of-view area and the area with a high priority, etc. The AI may be a model configured to estimate the angle of the line of sight and the distance to a target object in front of the line of sight from an image of the eyeball using the image of the eyeball and the actual viewing direction of the eyeball in the image as guiding data. The AI program may be included in the display device, the imaging device, or an external device. In the case where the external device has the AI program, the determination is transmitted to the display device via communication.

[0069] As described above, by using the semiconductor device according to the first to third embodiments, various devices can perform stable display with good image quality for a long time.

[0070] Note that the functional units (configurations) of various devices described in the fourth embodiment may or may not be separate hardware. The functions of two or more functional units may be implemented by common hardware. Each of the multiple functions of one functional unit may be implemented by separate hardware. Two or more functions of one functional unit may be implemented by common hardware. In addition, each functional unit may or may not be implemented by hardware such as ASIC, FPGA, and DSP. For example, the device may include a processor and a memory (storage medium) that stores a control program. Then, the functions of at least some of the functional units included in the device may be implemented by the processor reading the control program from the memory and executing the control program.

[0071] According to the present invention, a technique advantageous for reducing the size of a semiconductor device can be provided. By arranging the terminals of the semiconductor chip at positions away from the effective element region of the semiconductor substrate, the wiring on the substrate side can be routed around the area without terminals. Therefore, since the routing area (the area between the effective element region and the electrode portion) and the semiconductor chip can overlap, the size of the semiconductor device itself can be reduced. In particular, in the case of a display device or an imaging device, since the number of output terminals on the effective pixel side is large, the effect is significant.

[0072] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A semiconductor device comprising: Semiconductor substrates; as well as a semiconductor chip electrically connected to the semiconductor substrate via a plurality of terminals, The semiconductor substrate includes an effective element region and a peripheral region surrounding the effective element region. The peripheral region is provided with an electrode portion electrically connected to the semiconductor chip. The semiconductor chip is provided with a plurality of rows of terminal groups arranged along a first direction, and W1>W2 is satisfied, wherein W1 is the distance from the end of the semiconductor chip on the side closest to the effective element area to the terminal group, and W2 is the distance from the end of the semiconductor chip on the side farthest from the effective element area to the terminal group.

2. The semiconductor device according to claim 1, wherein A dummy terminal group is arranged between an end portion of the semiconductor chip on a side closest to the effective element region of the semiconductor substrate and the terminal group.

3. The semiconductor device according to claim 2, wherein: The dummy terminals are arranged so as to satisfy W2=W3, Here, W3 is the distance from the end of the semiconductor chip on the side closest to the effective element region of the semiconductor substrate to the dummy terminal group.

4. The semiconductor device according to claim 2, wherein: The shape of each terminal in the dummy terminal group and the number of terminals are the same as the shape of each terminal in the terminal group on the side farthest from the effective element region of the semiconductor substrate and the number of terminals.

5. The semiconductor device according to any one of claims 1 to 4, wherein: The semiconductor chip is electrically connected to the semiconductor substrate by flip chip bonding.

6. The semiconductor device according to any one of claims 1 to 4, wherein: The semiconductor chip is electrically connected to the semiconductor substrate using an anisotropic conductive film.

7. The semiconductor device according to any one of claims 1 to 4, wherein: The semiconductor chip is electrically connected to the semiconductor substrate by ultrasonic flip-chip bonding.

8. The semiconductor device according to any one of claims 1 to 4, wherein: The semiconductor chip is electrically connected to the semiconductor substrate through solder.

9. The semiconductor device according to any one of claims 1 to 4, wherein: The terminal group includes input terminals or output terminals.

10. The semiconductor device according to any one of claims 1 to 4, wherein: The terminal group includes an input terminal and an output terminal.

11. A display device, comprising: A display unit comprising the semiconductor device according to any one of claims 1 to 10; as well as A control circuit is configured to control the display unit.

12. A photoelectric conversion device comprising: Optical unit; an imaging element configured to receive light having passed through the optical unit; as well as a display unit configured to display the image captured by the imaging element, The display unit includes the semiconductor device according to any one of claims 1 to 10.

13. An electronic device comprising: A display unit comprising the semiconductor device according to any one of claims 1 to 10; a housing, wherein the display unit is disposed in the housing; as well as A communication unit is disposed in the housing and communicates with the outside.

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