Connector with improved structure

Abstract

A connector with an improved structure comprises a female connector, and the female connector comprises a metal shell, an insulating part and a conductive tongue plate. The metal shell is provided with an interface. The insulating part is installed in the metal shell and is provided with a channel. The conductive lingual plate is installed in the channel, so that the front end portion of the conductive lingual plate is located in the interface. The conductive tongue plate comprises a ceramic substrate and a plurality of conductive contact sheets. The ceramic substrate has a front end portion and a rear end portion. The plurality of conductive contact sheets are arranged on one side surface or two side surfaces of the ceramic substrate. After the male connector is inserted into the interface, the conductive tongue plate is inserted between the upper jaw and the lower jaw of the male connector, so that the plurality of conductive contact pieces are contacted and conducted with the upper conductive contact piece of the upper jaw and the lower conductive contact piece of the lower jaw of the male connector. Therefore, the conductive tongue plate is manufactured by using the ceramic substrate, so that high heat dissipation, reliability and insulation performance required by the semiconductor device are achieved.

Description

Technical Field

[0001] The present invention relates to a connector, and more particularly to a connector with an improved structure using a ceramic substrate as a conductive tongue plate and a conductive additional circuit board of the connector. Background Art

[0002] A connector generally refers to all connection components and their accessories used for electronic signals and power supplies. A connector is a bridge between all signals, and its quality not only affects the reliability of current and signal transmission, but also affects the operation quality of the entire electronic device.

[0003] Connectors can generally be classified into two categories: I / O (Input / Output) and Interconnection. Among them, I / O connectors are used for signal transmission between a computer main system and interface devices such as mice, monitors, keyboards, printers, plotters, and network systems. Related products include circular connectors, angular connectors, coaxial connectors, etc. The Interconnection category is applied within the main system and interface devices for the loading of electronic components and the electrical signal connection between various modules within each system. Related products include integrated circuit sockets, board edge connectors, flat cable wires, and so on.

[0004] A traditional connector has a metal housing. Inside the metal housing, there is an insulating block formed by plastic injection molding. The insulating block has several grooves, and stamping-molded metal conductive pins are embedded in the grooves to form a male or female connector, so that two electronic devices can be interconnected. Since the aforementioned connector uses a plastic-molded insulating block to fix and connect several metal conductive pins, the manufacturing process is too laborious and time-consuming, and the relative manufacturing cost is also high.

[0005] Therefore, in order to improve the past deficiencies, the printed circuit board manufacturing process is used to directly manufacture the main metal conductive pins of the connector on a circuit board (referred to as a tongue plate) to form conductive contact pieces with the same function as the gold fingers. Although using a circuit board for manufacturing can significantly reduce the manufacturing cost and make the connector easy to manufacture. However, under the action of frequent plugging and unplugging at the connection part, the circuit board is easily worn. And during long-term use of the circuit board, due to limited heat dissipation of the circuit board, it will affect the normal operation of the electronic components on the circuit board. Moreover, if some semiconductor devices need to be added to the circuit board, additional processing and manufacturing are required, so it will cause trouble in the manufacturing of connectors with special functions.

[0006] Therefore, the present invention aims to solve the problems generated by the structure of traditional connectors, making the connector durable with good heat dissipation effect, and making it easy to manufacture connectors with special functions. This is the problem to be solved by the present invention. Summary of the Invention

[0007] Therefore, the main object of the present invention is to solve the above problems. The present invention provides a conductive tongue plate of a connector made of a ceramic substrate. When manufacturing the conductive contact piece of the conductive tongue plate, semiconductor devices can be directly manufactured on the ceramic substrate at the same time. At the same time, the ceramic substrate has high thermal conductivity, high strength, high toughness, low density, self-lubrication, and excellent thermal shock resistance to achieve the high heat dissipation, reliability, and insulation performance required by semiconductor devices.

[0008] To achieve the above object, the present invention provides a connector with an improved structure, which is installed inside the connector and includes: a conductive tongue plate installed inside the interface of the connector. The conductive tongue plate includes: a ceramic substrate and several conductive contact pieces. The ceramic substrate has a front end portion and a rear end portion. The several conductive contact pieces are disposed on one side or two sides of the front end portion or the rear end portion of the ceramic substrate.

[0009] In an embodiment of the present invention, the ceramic substrate is alumina, silicon nitride, aluminum nitride, or silicon carbide.

[0010] In an embodiment of the present invention, the ceramic substrate further includes a semiconductor device, the semiconductor device is electrically fixed to two sides or one side of the ceramic substrate, and is electrically connected to the several conductive contact pieces. Several holes are provided on the rear end portion of the ceramic substrate, and the several holes are used for electrically fixing several conductive pins. The several conductive pins are electrically connected to the several conductive contact pieces through the semiconductor device, or the several conductive pins are directly electrically connected to the several conductive contact pieces.

[0011] In an embodiment of the present invention, the semiconductor device is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip, or a super link chip.

[0012] In an embodiment of the present invention, the connector is Type C, HDMI, USB, Micro USB, or Mini USB.

[0013] To achieve the above object, the present invention further provides a connector with an improved structure, including: a female connector, the female connector includes: a metal housing, an insulating member, and a conductive tongue plate. The metal housing has an interface. The insulating member is installed inside the metal housing, and the insulating member has a channel. The conductive tongue plate is installed in the channel. The conductive tongue plate includes: a ceramic substrate and several conductive contact pieces. The ceramic substrate has a front end portion and a rear end portion. The several conductive contact pieces are disposed on one side or two sides of the ceramic substrate.

[0014] In an embodiment of the present invention, the ceramic substrate is alumina, silicon nitride, aluminum nitride, or silicon carbide.

[0015] In an embodiment of the present invention, the plurality of conductive contact pads are disposed at the front end and the rear end of one side or two sides of the ceramic substrate. The ceramic substrate further includes a semiconductor device, which is electrically fixed to two sides or one side of the ceramic substrate and is electrically connected to the plurality of conductive contact pads. A plurality of holes are provided at the rear end of the ceramic substrate, and the plurality of holes are used to electrically fix a plurality of conductive pins. The plurality of conductive pins are electrically connected to the plurality of conductive contact pads through the semiconductor device, or the plurality of conductive pins are directly electrically connected to the plurality of conductive contact pads.

[0016] In an embodiment of the present invention, the semiconductor device is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip, or a super link chip.

[0017] In an embodiment of the present invention, the female connector is Type C, HDMI, USB, Micro USB, or MiniUSB.

[0018] To achieve the above object, the present invention further provides a connector with an improved structure, including: a male connector, which includes: a metal housing, an insulating member, and a conductive tongue plate. The metal housing has an interface. The insulating member is installed inside the metal housing, and the insulating member has a channel. The conductive tongue plate is installed in the channel and is located in the upper jaw or the lower jaw of the interface. The conductive tongue plate includes: a ceramic substrate and a plurality of conductive contact pads. The ceramic substrate has a front end and a rear end. The plurality of conductive contact pads are disposed on one side of the ceramic substrate.

[0019] In an embodiment of the present invention, the ceramic substrate is alumina, silicon nitride, aluminum nitride, or silicon carbide.

[0020] In an embodiment of the present invention, the ceramic substrate further includes a semiconductor device, which is used to be electrically fixed to two sides or one side of the ceramic substrate and is electrically connected to the plurality of conductive contact pads. A plurality of holes are provided at the rear end of the ceramic substrate, and the plurality of holes are used to electrically fix a plurality of conductive pins. The plurality of conductive pins are electrically connected to the plurality of conductive contact pads through the semiconductor device, or the plurality of conductive pins are directly electrically connected to the plurality of conductive contact pads.

[0021] In an embodiment of the present invention, the semiconductor device is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip, or a super link chip.

[0022] In an embodiment of the present invention, the male connector is a USB. Description of the Drawings

[0023] Figure 1 A three-dimensional external view of the conductive tongue plate of the connector according to the first embodiment of the present invention;

[0024] Figure 2 A three-dimensional external view of the conductive tongue plate of the connector according to the second embodiment of the present invention;

[0025] Figure 3 A three-dimensional external view of the female connector according to the third embodiment of the present invention;

[0026] Figure 4 is Figure 3 a side cross-sectional view of the female connector and the male connector of;

[0027] Figure 5 is Figure 4 a schematic diagram of the connector insertion in;

[0028] Figure 6 Another side cross-sectional view of the female connector and the male connector according to the fourth embodiment of the present invention;

[0029] Figure 7 is Figure 6 a schematic diagram of the connector insertion in.

[0030] Symbol description in the drawings:

[0031] 10, 10a: Conductive tongue plate;

[0032] 101, 101a: Ceramic substrate;

[0033] 1011, 1011a: Front end portion;

[0034] 1012: Rear end portion;

[0035] 1013: Hole;

[0036] 102, 102a: Conductive contact piece;

[0037] 103: Semiconductor device;

[0038] 20, 50: Female connector;

[0039] 201, 501, 601: Metal housing;

[0040] 202, 502, 602: Insulator;

[0041] 2021, 5021, 6021: Channel;

[0042] 203, 503, 603: interface;

[0043] 30, 60: male connector;

[0044] 301: upper conductive contact sheet;

[0045] 302: lower conductive contact sheet;

[0046] 40: electronic device;

[0047] 401: Circuit board. DETAILED DESCRIPTION

[0048] The technical content and detailed description of the present invention are now described in conjunction with the drawings as follows:

[0049] See also Figure 1 , is a perspective view of the appearance of the conductive tongue of the connector of the first embodiment of the present invention. As shown in the figure: the connector with an improved structure of the present invention includes a conductive tongue 10, and the conductive tongue 10 includes a ceramic substrate 101, a plurality of conductive contact pieces (gold fingers) 102 and a semiconductor device 103.

[0050] The ceramic substrate 101 has a front end 1011 and a rear end 1012. The ceramic substrate 101 is used as a carrier for carrying the plurality of conductive contact sheets 102 and the semiconductor device 103. At the same time, the ceramic substrate 101 has high thermal conductivity, high strength, high toughness, low density, self-lubricating property, and excellent thermal shock resistance, so as to achieve high heat dissipation, reliability, and insulation performance required by the semiconductor device 103. In this figure, the ceramic substrate 101 is aluminum oxide (Al2O3), silicon nitride (Si3N4), aluminum nitride (AlN), or silicon carbide (SIC).

[0051] The plurality of conductive contact pieces 102 are disposed at the positions of the front end 1011 and the rear end 1012 of the two side surfaces or one side surface of the ceramic substrate 101. The plurality of conductive contact pieces 102 are plated with a titanium metal layer (not shown in the figure) on both side surfaces or one side surface of the ceramic substrate 101 by the known active metal brazing (AMB) technology, and a copper layer (not shown in the figure) is plated on the titanium metal layer; after the copper layer is plated, the copper layer is plated at a high temperature of 300 to 700 degrees and 4 ± 1.5 kg / mm 2 A thick copper plate (not shown) is directly pressed and fixed on the above copper layer by pressure; after the thick copper plate and the above copper layer are combined, the required pattern is etched out by yellow light development, thus forming the several conductive contact sheets 102, thereby completing the production of the ceramic circuit board.

[0052] The semiconductor device 103 is electrically fixed to two sides or one side of the ceramic substrate 101 and is electrically connected to the plurality of conductive contact pieces 102. Similarly, when the plurality of conductive contact pieces 102 are fabricated, the semiconductor device 103 can also be fabricated on the ceramic substrate 101 by the active metal brazing (AMB) technique. In this figure, the semiconductor device 103 is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip, or a super link chip.

[0053] It is worth mentioning that after the conductive tongue plate 10 of the present invention is fabricated, when it is encapsulated into a female connector or a male connector, the plurality of conductive contact pieces 102 on the front end portion 1011 of the conductive tongue plate 10 are used for conductive plugging with a related male connector or female connector.

[0054] Please refer to Figure 2 , which is a three-dimensional external view of the conductive tongue plate of the connector according to the second embodiment of the present invention. As shown in the figure: This embodiment is substantially the same as the first embodiment. The difference lies in that at the rear end portion 1012 of the ceramic substrate 101, when the ceramic substrate 101 is fabricated, a plurality of holes 1013 can be drilled on the rear end portion 1012 of the ceramic substrate 101 by a drilling technique. The plurality of holes 1013 are used to provide electrical fixation for a plurality of conductive pins (not shown in the figure). The plurality of conductive pins are electrically connected to the plurality of conductive contact pieces 102 through the semiconductor device 103, or the plurality of conductive pins are directly electrically connected to the plurality of conductive contact pieces 102. The plurality of conductive pins are used to provide electrical connection to the circuit board of an electronic device (not shown in the figure) that can be used in combination after being encapsulated into a connector, or to electrically connect a transmission line or a flat cable.

[0055] Please refer to Figures 3 - 5 , which is a three-dimensional external view of the female connector according to the third embodiment of the present invention, Figure 3 a side cross-sectional view of the female connector and the male connector, and Figure 4 a plugging schematic diagram. As shown in the figure: In this embodiment, the above-mentioned conductive tongue plate 10 is applied to the female connector 20. The female connector 20 has a metal housing 201. There is an insulating member 202 inside the metal housing 201. There is a channel 2021 on the insulating member 202. The conductive tongue plate 10 passes through the channel 2021 so that the front end portion 1011 of the conductive tongue plate 10 can be assembled into the interface 203 of the metal housing 201. The rear end portion 1012 of the conductive tongue plate 10 is located behind the insulating member 202 to be electrically fixed to the circuit board 401 of the electronic device 40 or a transmission line (not shown in the figure). In this figure, the female connector 20 is Type C, HDMI, USB, Micro USB, or Mini USB.

[0056] When the female header connector 20 and the male header connector 30 are plugged together, after the male header connector 30 is inserted into the interface 203 of the female header connector 20, the conductive tongue plate 10 of the female header connector 20 is inserted between the upper jaw and the lower jaw of the male header connector 30, so that the several conductive contact pieces 102 on the two side surfaces of the conductive tongue plate 10 are in contact conduction with the upper conductive contact piece 301 and the lower conductive contact piece 302 on the upper jaw and the lower jaw of the male header connector 30, so that the signal of the male header connector 30 can be transmitted to the female header connector 20, or transmitted from the female header connector 20 to the male header connector 30.

[0057] It is worth mentioning that during the signal transmission process, the signal can be processed by the semiconductor device 103 on the ceramic substrate 101, such as signal processing such as file or document encryption, macro conversion, noise reduction, signal enhancement, sensing or hyperlinking.

[0058] Please refer to Figure 6 、 7 Another side cross-sectional view of the female header connector and the male header connector and Figure 6 The plugging schematic diagram of. As shown in the figure: In this embodiment, the above-mentioned conductive tongue plate 10 is applied to the female header connector 50 and the male header connector 60. The female header connector 50 has a metal housing 501, and an insulating member 502 is provided inside the metal housing 501. A channel 5021 is provided on the insulating member 502, and the conductive tongue plate 10 passes through the channel 5021, so that the front end portion 1011 of the conductive tongue plate 10 can be assembled into the interface 503 of the metal housing 501. The rear end portion 1012 of the conductive tongue plate 10 is located behind the insulating member 502 to be electrically fixed to the circuit board 401 or the transmission line (not shown in the figure) of the electronic device 40. In this figure, the female header connector 50 is a USB female header connector.

[0059] The male header connector 60 also has a metal housing 601, and an insulating member 602 is provided inside the metal housing 601. A channel 6021 is provided on the insulating member 602, and the conductive tongue plate 10a passes through the channel 6021, so that the front end portion 1011a of the ceramic substrate 101a of the conductive tongue plate 10a is located at the position of the upper jaw or the lower jaw of the interface 603 of the metal housing 601. In this figure, the male header connector 60 is a USB male header connector.

[0060] When the female head connector 50 is plugged into the male head connector 60, after the male head connector 60 is inserted into the interface 503 of the female head connector 50, the plurality of conductive contact pieces 102 on one side of the conductive tongue plate 10 of the female head connector 50 are brought into contact conduction with the plurality of conductive contact pieces 102a on one side of the conductive tongue plate 10a of the upper jaw or lower jaw of the male head connector 60, so that the signals of the male head connector 60 can be transmitted to the female head connector 50, or be transmitted from the female head connector 50 to the male head connector 60.

[0061] It is worth mentioning that during the signal transmission process, the signal can be processed by the semiconductor device 103 on the ceramic substrate 101, such as signal processing like file or document encryption, macro conversion, noise reduction, signal enhancement, sensing or hyperlinking.

[0062] The above description is only the preferred embodiment of the present invention, and is not intended to limit the patent protection scope of the present invention. Therefore, all equivalent changes made by using the content of the specification or drawings of the present invention are equally included in the scope of the rights protection of the present invention, which is hereby stated.

Claims

1. A connector with an improved structure is installed inside the connector, characterized in that, Comprising: A conductive tongue plate, installed inside the interface of the connector, the conductive tongue plate comprising: A ceramic substrate, having a front end portion and a rear end portion; A plurality of conductive contact pieces, disposed on one side surface or two side surfaces of the front end portion or the rear end portion of the ceramic substrate.

2. The connector with an improved structure according to claim 1, characterized in that, The ceramic substrate is alumina, silicon nitride, aluminum nitride or silicon carbide.

3. The connector with an improved structure according to claim 1, characterized in that, The ceramic substrate further comprises a semiconductor device, the semiconductor device being electrically fixed to two side surfaces or one side surface of the ceramic substrate and electrically connected to the plurality of conductive contact pieces. A plurality of holes are provided on the rear end portion of the ceramic substrate, and the plurality of holes are used for electrically fixing a plurality of conductive pins, and the plurality of conductive pins are electrically connected to the plurality of conductive contact pieces through the semiconductor device, or the plurality of conductive pins are directly electrically connected to the plurality of conductive contact pieces.

4. The connector with an improved structure according to claim 3, characterized in that, The semiconductor device is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip or a superlink chip.

5. The connector with an improved structure according to claim 1, wherein, The connector is Type C, HDMI, USB, Micro USB or Mini USB.

6. A connector with an improved structure, characterized in that, Including: A female connector, comprising: A metal housing, having an interface thereon; An insulating member, installed inside the metal housing, the insulating member having a channel; A conductive tongue plate, installed in the channel, the conductive tongue plate comprising: A ceramic substrate, having a front end portion and a rear end portion thereon; A plurality of conductive contact pieces, disposed on one side surface or two side surfaces.

7. The connector with an improved structure according to claim 6, characterized in that, The ceramic substrate is alumina, silicon nitride, aluminum nitride or silicon carbide.

8. The connector with an improved structure according to claim 6, characterized in that, The plurality of conductive contact pieces are disposed at the front end portion and the rear end portion of one side surface or the two side surfaces of the ceramic substrate. The ceramic substrate further comprises a semiconductor device, the semiconductor device being electrically fixed to two side surfaces or one side surface of the ceramic substrate and electrically connected to the plurality of conductive contact pieces. A plurality of holes are provided on the rear end portion of the ceramic substrate, and the plurality of holes are used for electrically fixing a plurality of conductive pins, and the plurality of conductive pins are electrically connected to the plurality of conductive contact pieces through the semiconductor device, or the plurality of conductive pins are directly electrically connected to the plurality of conductive contact pieces.

9. The connector with an improved structure according to claim 8, wherein, The semiconductor device is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip or a superlink chip.

10. The connector with an improved structure according to claim 6, wherein, The female connector is TypeC, HDMI, USB, Micro USB or Mini USB.

11. A connector with an improved structure, characterized in that, Including: A male connector, comprising: A metal housing, having an interface thereon; An insulating member, installed inside the metal housing, the insulating member having a channel; A conductive tongue plate, installed in the channel and located in the upper jaw or lower jaw of the interface, the conductive tongue plate comprising: A ceramic substrate, having a front end portion and a rear end portion thereon; A plurality of conductive contact pieces, disposed on one side surface.

12. The connector with an improved structure according to claim 11, characterized in that, The ceramic substrate is alumina, silicon nitride, aluminum nitride or silicon carbide.

13. The connector with an improved structure according to claim 11, wherein The ceramic substrate further includes a semiconductor device, which is used to be electrically fixed to two sides or one side of the ceramic substrate and is electrically connected to the plurality of conductive contact pads. A plurality of holes are provided at the rear end of the ceramic substrate, and the plurality of holes are used to electrically fix a plurality of conductive pins. The plurality of conductive pins are electrically connected to the plurality of conductive contact pads through the semiconductor device, or the plurality of conductive pins are directly electrically connected to the plurality of conductive contact pads.

14. The connector with an improved structure according to claim 13, characterized in that, The semiconductor device is a file or document encryption chip, a macro chip, a noise reduction chip, a signal enhancement function chip, a sensing chip or a super link chip.

15. The connector with an improved structure according to claim 11, wherein, The male connector is a USB.

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