Hole-clamped wire width compensation database manufacturing method and database

Abstract

The invention discloses a hole clamping wire width compensation database manufacturing method and a database, and relates to the technical field of circuit board processing. The manufacturing method of the line width compensation database of the hole-clamped line comprises the following steps: providing a plurality of core plates with copper-clad layers with different thicknesses; a plated-through hole is formed in each core plate; manufacturing non-hole clamping lines and various types of hole clamping lines on each core plate; measuring the line width b of a non-hole clamping line on each core plate and the line width a of each hole clamping line; and obtaining the line width compensation b-a of each hole clamping line on each core plate. According to the hole clamping wire width compensation database manufacturing method and the database provided by the invention, targeted compensation measures can be conveniently taken for different hole clamping wires, so that the compensated hole clamping wires are matched with non-hole clamping wires.

Description

Technical Field

[0001] This application relates to the technical field of circuit board processing, and particularly to a method for manufacturing a database for hole-clamped line width compensation and the database. Background Art

[0002] In the process of manufacturing a printed circuit board (PCB), the production of circuits is the most common and important part. During the process of etching circuits, there are differences in the line widths between hole-clamped lines and non-hole-clamped lines.

[0003] In the related art, a unified standard is adopted to compensate for hole-clamped lines and non-hole-clamped lines, resulting in the compensated circuits still not meeting the standards. Summary of the Invention

[0004] This application provides a method for manufacturing a database for hole-clamped line width compensation and the database, which is convenient for taking targeted compensation measures for different hole-clamped lines, so that the compensated hole-clamped lines are adapted to non-hole-clamped lines.

[0005] This application provides a method for manufacturing a database for hole-clamped line width compensation, including:

[0006] Providing a plurality of core boards with different thicknesses of copper-clad layers;

[0007] Manufacturing metallized holes on each of the core boards;

[0008] Manufacturing non-hole-clamped lines and various types of hole-clamped lines on each of the core boards;

[0009] Measuring the line width b of the non-hole-clamped lines and the line width a of each of the hole-clamped lines on each of the core boards;

[0010] Obtaining the line width compensation b - a of each of the hole-clamped lines on each of the core boards.

[0011] In some possible implementation manners, the providing a plurality of core boards with different thicknesses of copper-clad layers includes:

[0012] Providing a first core board, a second core board, and a third core board, where the thickness of the copper-clad layer of the first core board is 18 um, the thickness of the copper-clad layer of the second core board is 35 um, and the thickness of the copper-clad layer of the third core board is 70 um.

[0013] In some possible implementation manners, the manufacturing metallized holes on each of the core boards includes:

[0014] Fabricate a plurality of first metallization holes on each of the core boards. The plurality of first metallization holes are distributed in regions and form a plurality of first units. The first metallization holes in the same first unit have the same aperture, and the first metallization holes in different first units have different apertures.

[0015] Make each of the first units include multiple groups of the first metallization holes. Each group of the first metallization holes includes a plurality of the first metallization holes arranged in an array. The hole pitch between any two adjacent columns of the first metallization holes is the same, and the groups in the same first unit have different hole pitches.

[0016] In some possible embodiments, the plurality of first metallization holes form twenty first units. The apertures of the first metallization holes in the twenty first units are set to be from 0.2 mm to 4.0 mm, and the aperture gradient is 0.2 mm.

[0017] Make each of the first units include thirty-eight groups of the first metallization holes. The hole pitches of the thirty-eight groups of the first metallization holes are set to be from 3 mil to 40 mil, and the hole pitch gradient is set to be 1 mil.

[0018] In some possible embodiments, fabricating the metallization holes on each of the core boards further includes:

[0019] Fabricate a plurality of second metallization holes and a plurality of third metallization holes on each of the core boards. The second metallization holes and the third metallization holes are arranged alternately. The plurality of second metallization holes and the plurality of third metallization holes are distributed into a plurality of second units. The second metallization holes in the same second unit have the same aperture, and the second metallization holes in different second units have different apertures.

[0020] Make each of the second units include a plurality of modules. Each module includes a plurality of groups. Each group includes a plurality of the second metallization holes and a plurality of the third metallization holes arranged in an array. The third metallization holes in the same module have the same aperture, and the third metallization holes in different modules in the same second unit have different apertures.

[0021] Make the hole pitch between the second metallization holes and the third metallization holes in the same group the same. The apertures of the plurality of second metallization holes in the same group are the same, the apertures of the plurality of third metallization holes in the same group are the same, and the aperture of the second metallization hole is different from the aperture of the third metallization hole. The hole pitches between the second metallization holes and the third metallization holes in different groups in the same module are different.

[0022] In some possible embodiments, the multiple second metallization holes and the multiple third metallization holes form twenty of the second units, and the aperture diameters of the second metallization holes of the twenty second units are set to be from 0.2 mm to 4.0 mm, with an aperture diameter gradient of 0.2 mm;

[0023] Each of the second units includes nineteen of the modules, and the aperture diameters of the third metallization holes of the nineteen modules are set to be from 0.2 mm to 4.0 mm, with an aperture diameter gradient of 0.2 mm;

[0024] Each of the modules includes thirty-eight groups, and the hole pitch between the second metallization holes and the third metallization holes in the thirty-eight groups is set to be from 3 mil to 40 mil, with a hole pitch gradient of 1 mil.

[0025] In some possible embodiments, non-hole clamp lines and various types of hole clamp lines are fabricated on each of the core boards, including:

[0026] Fabricating non-hole clamp lines on each of the core boards;

[0027] Fabricating first hole clamp lines and second hole clamp lines at each group position of each of the first units, where the first hole clamp lines and the second hole clamp lines are distributed between two different columns of the first metallization holes, the distance between the first hole clamp lines and the adjacent two columns of the first metallization holes is equal, and the distance between the second hole clamp lines and the adjacent two columns of the first metallization holes is unequal;

[0028] Fabricating third hole clamp lines and fourth hole clamp lines at each group position of each of the modules, where the third hole clamp lines and the fourth hole clamp lines are distributed between different adjacent columns of the second metallization holes and the third metallization holes, the distance between the third hole clamp lines and the adjacent column of the second metallization holes is equal to the distance between the third hole clamp lines and the adjacent column of the third metallization holes, and the distance between the fourth hole clamp lines and the adjacent column of the second metallization holes is different from the distance between the fourth hole clamp lines and the adjacent column of the third metallization holes.

[0029] In some possible embodiments, non-hole clamp lines and various types of hole clamp lines are fabricated on each of the core boards, including:

[0030] Electroplating surface copper with a thickness of 5 μm to 10 μm on the surface of each of the core boards;

[0031] Performing circuit imaging on the core boards covered with surface copper;

[0032] Performing electroplating on the imaged circuits;

[0033] Etching preset positions to obtain the non-hole clamp lines and the hole clamp lines.

[0034] In some possible embodiments, fabricating the metallized holes on each core board includes:

[0035] Drilling holes in the core board;

[0036] Deburring the hole walls;

[0037] Copper plating the hole walls to obtain the metallized holes.

[0038] In addition, the present application also provides a hole clip line width compensation database, which is obtained by the method for fabricating the hole clip line width compensation database provided in each of the above embodiments.

[0039] Advantages of the present application: The method for fabricating the hole clip line width compensation database provided in the present application can fabricate hole clip lines under various conditions and has compensation values corresponding to the hole clip lines. During the subsequent processing of the printed circuit board, the operator can directly obtain the compensation values of the hole clip lines under the corresponding conditions from the hole clip line width compensation database to perform targeted and accurate compensation on the hole clip lines, so that the line width of the hole clip lines on the printed circuit board is consistently matched with the line width of the non-hole clip lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0041] Figure 1 Shows a flowchart of the method for fabricating the hole clip line width compensation database in some embodiments;

[0042] Figure 2 Shows a schematic structural diagram of each core board in some embodiments;

[0043] Figure 3 Shows a schematic distribution structure diagram of the metallized holes on the core board in some embodiments;

[0044] Figure 4 Shows a schematic diagram of the dimension markings of the hole clip lines and non-hole clip lines in some embodiments;

[0045] Figure 5 Shows a schematic flowchart of the manufacturing processes of the hole clip lines and non-hole clip lines in some embodiments.

[0046] MAIN ELEMENT SYMBOL DESCRIPTION:

[0047] 100 - Core board; 110 - First core board; 120 - Second core board; 130 - Third core board; 101 - Copper clad layer;

[0048] 210 - The first metallized hole; 220 - The second metallized hole; 230 - The third metallized hole;

[0049] 310 - The first unit; 320 - The second unit; 321 - Module;

[0050] 410 - Non - hole clamping wire; 420 - Hole clamping wire; 421 - The first hole clamping wire; 422 - The second hole clamping wire; 423 - The third hole clamping wire; 424 - The fourth hole clamping wire. Detailed implementation manners

[0051] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application.

[0052] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

[0053] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0054] In the present application, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0055] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0056] As Figure 1 and Figure 4 shown, an embodiment provides a method for fabricating a via clamp line width compensation database, which can be used to obtain a via clamp line width compensation database. When manufacturing a printed circuit board, the compensation data corresponding to the via clamp line 420 can be directly queried from the via clamp line width compensation database to perform a compensation operation on the via clamp line 420, so that the line width of the via clamp line 420 is adapted to be consistent with the line width of the non-via clamp line 410.

[0057] As Figures 1 to 3 shown, the method for fabricating a via clamp line width compensation database includes:

[0058] S100, providing a plurality of core boards 100 with copper-clad layers 101 of different thicknesses.

[0059] In some embodiments, a first core board 110, a second core board 120, and a third core board 130 are respectively provided. The sizes of the first core board 110, the second core board 120, and the third core board 130 can all be set to 621mm * 544mm. Among them, the thickness H1 of the copper-clad layer 101 of the first core board 110 is 18um. The thickness H2 of the copper-clad layer 101 of the second core board 120 is 35um. The thickness H3 of the copper-clad layer 101 of the third core board 130 is 70um.

[0060] In some other embodiments, any two of the first core board 110, the second core board 120, and the third core board 130 can also be provided.

[0061] S200, fabricating metallized holes on each core board 100.

[0062] In some embodiments, holes can be drilled on the first core board 110, the second core board 120, and the third core board 130 respectively by methods such as laser drilling or mechanical drilling. Then, deburring treatment is performed on the hole walls. After that, copper deposition and electroplating are sequentially performed on the hole walls to deposit copper on the hole walls, that is, to achieve the metallization treatment of the holes, so as to obtain metallized holes.

[0063] In some embodiments, a plurality of first metallization holes 210 are formed on each core board 100. The plurality of first metallization holes 210 are distributed into a plurality of first units 310, that is, the plurality of first metallization holes 210 are distributed by region and form a plurality of first units 310. The first metallization holes 210 in the same first unit 310 all have the same hole diameter. Wherein, the hole diameter of the first metallization hole 210 may refer to the diameter of the first metallization hole 210. The first metallization holes 210 in each different first unit 310 have different hole diameters, that is, the hole diameter of the first metallization hole 210 in any first unit 310 is different from the hole diameter of the first metallization hole 210 in other first units 310.

[0064] In some embodiments, each first unit 310 includes multiple groups of first metallization holes 210, that is, the multiple first metallization holes 210 in each first unit 310 are distributed by region and form multiple groups. Each group of first metallization holes 210 includes a plurality of first metallization holes 210 arranged in an array, that is, the multiple first metallization holes 210 in the same group are arranged in an array. Among the multiple first metallization holes 210 in each group, the same hole pitch exists between any two adjacent columns of first metallization holes 210. In the same first unit 310, the first metallization holes 210 in each group have different hole pitches, that is, the hole pitch between two adjacent columns of first metallization holes 210 in any group is different from the hole pitch between two adjacent columns of first metallization holes 210 in other groups. Wherein, the hole pitch may refer to the margin between two adjacent columns of first metallization holes 210 in the same group.

[0065] In some embodiments, the multiple first metallization holes 210 are distributed to form twenty first units 310. The hole diameters of the first metallization holes 210 in the twenty first units 310 are set to be from 0.2 mm to 4.0 mm, and the hole diameter gradient is 0.2 mm. That is, the hole diameters of the first metallization holes 210 in the twenty first units 310 are arranged in a gradient distribution and can increase from 0.2 mm to 4.0 mm in sequence. The hole diameter of the first metallization hole 210 in the latter first unit 310 is 0.2 mm larger than the hole diameter of the first metallization hole 210 in the previous first unit 310.

[0066] In some embodiments, each first unit 310 includes thirty-eight groups of first metallization holes 210. The hole pitches of the thirty-eight groups of first metallization holes 210 are set to be from 3 mil to 40 mil, and the hole pitch gradient is set to 1 mil. That is, the hole pitches of the thirty-eight groups of first metallization holes 210 are arranged in a gradient distribution and increase from 3 mil to 40 mil in sequence. The hole pitch of the latter group of first metallization holes 210 is 1 mil larger than the hole pitch of the previous group of first metallization holes 210.

[0067] In some embodiments, fabricating the metallization holes on each core board 100 further includes:

[0068] On each core board 100, a plurality of second metallization holes 220 and a plurality of third metallization holes 230 are fabricated. The second metallization holes 220 and the third metallization holes 230 are arranged alternately, that is, a column of second metallization holes 220, a column of third metallization holes 230, a column of second metallization holes 220... In addition, the plurality of second metallization holes 220 and the plurality of third metallization holes 230 are distributed into a plurality of second units 320, that is, the plurality of second metallization holes 220 and the plurality of third metallization holes 230 are arranged in a regional distribution and form a plurality of second units 320. Each second unit 320 includes a plurality of modules 321, that is, the second metallization holes 220 and the third metallization holes 230 of each second unit 320 are arranged in a regional distribution and form a plurality of modules 321. Each module 321 includes a plurality of groups, and each group includes a plurality of second metallization holes 220 and a plurality of third metallization holes 230 arranged in an array, and the second metallization holes 220 and the third metallization holes 230 are alternately arranged in sequence, that is, a column of second metallization holes 220, a column of third metallization holes 230, a column of second metallization holes 220... That is, the second metallization holes 220 and the third metallization holes 230 of each module 321 are arranged in a regional distribution and form a plurality of groups.

[0069] In some embodiments, the apertures of the plurality of second metallization holes 220 in the same group are the same, the apertures of the plurality of third metallization holes 230 in the same group are also the same, and the aperture of the second metallization hole 220 is different from the aperture of the third metallization hole 230. In addition, in the same group, there is the same hole pitch between each column of second metallization holes 220 and the third metallization holes 230. Herein, the aperture of the second metallization hole 220 refers to the diameter of the second metallization hole 220, and the aperture of the third metallization hole 230 refers to the diameter of the third metallization hole 230.

[0070] In some embodiments, in the same module 321, the hole pitches between the second metallization holes 220 and the third metallization holes 230 of different groups are different. In some embodiments, in different modules 321 of the same second unit 320, the third metallization holes 230 have different apertures, and the second metallization holes 220 of each module 321 in the same second unit 320 have the same aperture. In some embodiments, in different second units 320, the second metallization holes 220 have different apertures.

[0071] In some embodiments, the aperture diameter of the second metallization holes 220 in each second unit 320 is set to be 0.2 mm to 4.0 mm, and the aperture diameter gradient is 0.2 mm. That is, the aperture diameters of the second metallization holes 220 of the twenty second units 320 are arranged in a gradient distribution, and can be increased from 0.2 mm to 4.0 mm in sequence. The aperture diameter of the second metallization hole 220 of the latter second unit 320 is increased by 0.2 mm compared with the aperture diameter of the second metallization hole 220 of the previous second unit 320.

[0072] In some embodiments, the same second unit 320 may include nineteen modules 321. The aperture diameters of the third metallization holes 230 of the nineteen modules 321 are set to be 0.2 mm to 4.0 mm, and the aperture diameter gradient is 0.2 mm. That is, the aperture diameters of the third metallization holes 230 of the nineteen modules 321 are arranged in a gradient distribution, and can be increased from 0.2 mm to 4.0 mm in sequence. The aperture diameter of the third metallization hole 230 of the latter module 321 is increased by 0.2 mm compared with the aperture diameter of the third metallization hole 230 of the previous module 321. And in the same group, the aperture diameter of the third metallization hole 230 is different from the aperture diameter of the second metallization hole 220.

[0073] In some embodiments, each module 321 includes thirty-eight groups. The hole pitch between the second metallization holes 220 and the third metallization holes 230 in the thirty-eight groups is set to be 3 mil to 40 mil, and the hole pitch gradient is set to be 1 mil. That is, in the thirty-eight groups, the hole pitch between the second metallization holes 220 and the third metallization holes 230 in the adjacent columns is arranged in a gradient distribution, and is increased from 3 mil to 40 mil in sequence. The hole pitch between the second metallization holes 220 and the third metallization holes 230 in the adjacent columns of the latter group is increased by 1 mil compared with the hole pitch between the second metallization holes 220 and the third metallization holes 230 in the adjacent columns of the previous group.

[0074] S300, fabricate non-hole clip lines 410 and various types of hole clip lines 420 on each core board 100. As Figures 2 to 5 shown, in some embodiments, step S300 may include the following steps:

[0075] S310, electroplate surface copper with a thickness of 5 μm to 10 μm on the surface of each core board 100.

[0076] It can be understood that surface copper with a thickness of 5 μm to 10 μm is electroplated on the surfaces of the first core board 110, the second core board 120, and the third core board 130, and corresponding copper-clad laminates can be obtained. Exemplarily, the thickness of the surface copper on the core board 100 can be set to 5 μm, 5.5 μm, 6 μm, 7 μm, 7.5 μm, 8 μm, 9 μm, 10 μm, or any other thickness within 5 μm to 10 μm.

[0077] S320, perform circuit exposure on the core board 100 with copper on its surface.

[0078] Specifically, the copper clad laminate can be processed through exposure and development to retain the copper on the surface at the preset positions.

[0079] S330, perform electroplating on the exposed circuits.

[0080] In the embodiment, electroplating copper and / or electroplating tin can be performed on the surface of the retained copper to make the circuit thickness meet the required specifications.

[0081] S340, perform etching to obtain non-hole clamping lines 410 and hole clamping lines 420 at the preset positions.

[0082] In the embodiment, non-hole clamping lines 410 and hole clamping lines 420 can be obtained at the preset positions through an alkaline etching process.

[0083] In some embodiments, one non-hole clamping line 410 can be fabricated on each core board 100. Among them, the non-hole clamping line 410 is disposed away from the metallized holes, that is, the non-hole clamping line 410 is disposed away from the first metallized hole 210, the second metallized hole 220, and the third metallized hole 230.

[0084] Of course, in other embodiments, two or three or any other arbitrary number of non-hole clamping lines 410 can be fabricated on each core board 100.

[0085] In some embodiments, a first hole clamping line 421 and a second hole clamping line 422 are fabricated at each group position of each first unit 310. The first hole clamping line 421 and the second hole clamping line 422 are distributed between two different columns of first metallized holes 210. Among them, the distance between the first hole clamping line 421 and the adjacent two columns of first metallized holes 210 is equal, that is, the first hole clamping line 421 can coincide with the central axis between the adjacent two columns of first metallized holes 210. The distance between the second hole clamping line 422 and the adjacent two columns of first metallized holes 210 is not equal, that is, the second hole clamping line 422 is disposed offset relative to the central axis between the adjacent two columns of first metallized holes 210.

[0086] In some embodiments, in the second unit 320, third hole clamping wires 423 and fourth hole clamping wires 424 are fabricated at each group position of each module 321. The third hole clamping wires 423 and the fourth hole clamping wires 424 are distributed between the second metallization holes 220 and the third metallization holes 230 in different adjacent columns. Among them, the distance between the third hole clamping wire 423 and the second metallization hole 220 in the adjacent column is equal to the distance between the third hole clamping wire 423 and the third metallization hole 230 in the adjacent column. That is, the central axis between the third hole clamping wire 423 and the second metallization hole 220 and the third metallization hole 230 in the adjacent column coincides. The distance between the fourth hole clamping wire 424 and the second metallization hole 220 in the adjacent column is different from the distance between the fourth hole clamping wire 424 and the third metallization hole 230 in the adjacent column. That is, the central axis between the fourth hole clamping wire 424 and the second metallization hole 220 and the third metallization hole 230 in the adjacent column is arranged in a dislocation manner.

[0087] Correspondingly, four different types of hole clamping wires 420 can be fabricated on each core board 100, including the first hole clamping wire 421 with the same aperture and equal spacing, the second hole clamping wire 422 with the same aperture and unequal spacing, the third hole clamping wire 423 with unequal apertures and equal spacing, and the fourth hole clamping wire 424 with unequal hole distances and unequal spacing.

[0088] S400, measure the line width b of the non-hole clamping wires 410 on each core board 100 and the line width a of each hole clamping wire 420.

[0089] During the spray etching process, etching is achieved through the penetration of the chemical solution existing in the liquid film, and at the same time, the exchange of the liquid film is realized by means of high-pressure spraying. On the basis of the original liquid level etching and chemical solution exchange, due to the penetration ability of the metallization holes, the liquid film will flow rapidly at the positions of the metallization holes, that is, the rapid flow of the chemical solution is realized, and the exchange of the liquid film at this position is realized in a non-impact state. Therefore, the etching ability at the positions of the metallization holes will exceed the etching ability at the positions of the non-metallization holes.

[0090] In addition, the size of the metallization holes will also affect the etching ability. The smaller the aperture, the relatively weaker the through-hole ability of the chemical solution, the slower the liquid film migration speed, and the relatively weaker the etching ability. The larger the aperture, the stronger the through-hole ability of the chemical solution, the faster the liquid film migration speed, and the stronger the etching ability. At the same time, the spray pressure during the etching process will also affect the etching rate. In the embodiments, the spray pressure can be set to be the same.

[0091] Correspondingly, the line width a of the hole clamping wire 420 at the position of the metallization hole will be smaller than the line width b of the non-hole clamping wire 410.

[0092] S500, obtain the line width compensation b - a of each hole clamping wire 420 on each core board 100.

[0093] In the embodiments, the line width compensation of the first hole clamping line 421, the line width compensation of the second hole clamping line 422, the line width compensation of the third hole clamping line 423, and the line width compensation of the fourth hole clamping line 424 can be obtained respectively under various conditions.

[0094] During the processing of the printed circuit board, according to the conditions where the hole clamping line 420 is located, the corresponding line width compensation can be obtained from the line width compensation database of the hole clamping line, so as to perform a separate and accurate compensation process on the hole clamping line 420, ensuring that the line width of the hole clamping line 420 in the printed circuit board is adapted to the line width of the non-hole clamping line 410.

[0095] In the embodiments, a line width compensation database of the hole clamping line is also provided, which can be obtained by the method for making the line width compensation database of the hole clamping line provided in the embodiments.

[0096] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0097] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A method for preparing a hole clamp line width compensation database, characterized in that: include: Providing a plurality of core boards with copper cladding layers of different thicknesses; Making metallized holes on each of the core boards; Making non-hole clip lines and multiple types of hole clip lines on each of the core plates; Measure the line width b of the non-hole clip line on each core plate and the line width a of each hole clip line; Obtain the line width compensation ba of each hole clip line on each core plate.

2. The method for preparing a hole clamp line width compensation database according to claim 1, characterized in that: The method provides a plurality of core boards with copper clad layers of different thicknesses, comprising: A first core board, a second core board and a third core board are provided, wherein the copper clad layer thickness of the first core board is 18um, the copper clad layer thickness of the second core board is 35um, and the copper clad layer thickness of the third core board is 70um.

3. The method for preparing a hole clamp line width compensation database according to claim 1, characterized in that: The step of making a metallized hole on each core board comprises: A plurality of first metallized holes are made on each of the core boards, the plurality of first metallized holes are distributed in a region and form a plurality of first units, the first metallized holes of the same first unit have the same aperture, and the first metallized holes of different first units have different apertures; Each of the first units includes multiple groups of the first metallized holes, each group of the first metallized holes includes multiple first metallized holes distributed in an array, any two adjacent columns of the first metallized holes have the same hole spacing, and each group in the same first unit has different hole spacings.

4. The method for preparing a hole clamp line width compensation database according to claim 3, characterized in that: The plurality of first metallized holes constitute twenty first units, and the apertures of the first metallized holes of the twenty first units are set to be 0.2 mm to 4.0 mm, and the aperture gradient is 0.2 mm; Each of the first units includes thirty-eight groups of the first metallized holes, the hole spacing of the thirty-eight groups of the first metallized holes is set to 3 mil to 40 mil, and the hole spacing gradient is set to 1 mil.

5. The method for preparing a hole clamp line width compensation database according to claim 3, characterized in that: The step of making metallized holes on each core plate further comprises: A plurality of second metallized holes and a plurality of third metallized holes are made on each of the core boards, the second metallized holes and the third metallized holes are arranged alternately, the plurality of second metallized holes and the plurality of third metallized holes are distributed into a plurality of second units, the second metallized holes of the same second unit have the same aperture, and the second metallized holes of different second units have different apertures; Each of the second units includes a plurality of modules, each of the modules includes a plurality of groups, each group includes a plurality of the second metallized holes and a plurality of the third metallized holes distributed in an array, the third metallized holes in the same module have the same aperture, and the third metallized holes in different modules of the same second unit have different apertures; The second metallized holes and the third metallized holes in the same group have the same hole spacing, the apertures of multiple second metallized holes in the same group are the same, the apertures of multiple third metallized holes are the same, and the apertures of the second metallized holes are different from those of the third metallized holes, and the hole spacings between the second metallized holes and the third metallized holes in different groups in the same module are different.

6. The method for preparing a hole clamp line width compensation database according to claim 5, characterized in that: The plurality of second metallized holes and the plurality of third metallized holes constitute twenty second units, and the apertures of the second metallized holes of the twenty second units are set to be 0.2 mm to 4.0 mm, and the aperture gradient is 0.2 mm; Each of the second units includes nineteen modules, and the apertures of the third metallized holes of the nineteen modules are set to be 0.2 mm to 4.0 mm, with an aperture gradient of 0.2 mm; Each of the modules includes thirty-eight groups, and the hole spacing between the second metallized holes and the third metallized holes in the thirty-eight groups is set to 3 mil to 40 mil, and the hole spacing gradient is set to 1 mil.

7. The method for preparing a hole clamp line width compensation database according to claim 5 or 6, characterized in that: The non-hole clip lines and various types of hole clip lines are made on each core plate, including: Making a non-hole clip line on each of the core plates; A first hole clamp line and a second hole clamp line are made at each group position of each first unit, the first hole clamp line and the second hole clamp line are distributed between two different columns of the first metallized holes, the distance between the first hole clamp line and the first metallized holes in two adjacent columns is equal, and the distance between the second hole clamp line and the first metallized holes in two adjacent columns is not equal; A third hole clamp line and a fourth hole clamp line are made at each group position of each module, and the third hole clamp line and the fourth hole clamp line are distributed between the second metallized holes and the third metallized holes in different adjacent columns. The distance between the third hole clamp line and the second metallized holes in the adjacent column is equal to the distance between the third hole clamp line and the third metallized holes in the adjacent column, and the distance between the fourth hole clamp line and the second metallized holes in the adjacent column is different from the distance between the fourth hole clamp line and the third metallized holes in the adjacent column.

8. The method for preparing a hole clamp line width compensation database according to claim 1, characterized in that: The non-hole clip lines and various types of hole clip lines are made on each core plate, including: Electroplating surface copper with a thickness of 5 μm to 10 μm on the surface of each core board; Performing circuit display on the core board covered with surface copper; Electroplating is performed on the revealed circuits; The preset position is etched to obtain the non-hole clamp line and the hole clamp line.

9. The method for preparing a hole clamp line width compensation database according to claim 1, characterized in that: The step of making a metallized hole on each core board comprises: Drilling holes in the core plate; Deburring the hole wall; Copper is plated on the hole wall to obtain a metallized hole.

10. A hole clamp line width compensation database, characterized in that: It is obtained by the method for preparing a hole clamp line width compensation database as described in any one of claims 1 to 9.

Images