Embedded LED lamp panel manufacturing method and LED lamp panel
By setting a pure glue layer on the cover plate and motherboard of the embedded LED lamp plate and carrying out a pressing process, combined with mechanical or laser drilling technology, the problem of ink covering the thin, curling and hole inner wall of the embedded LED lamp plate is solved, and the production efficiency and product texture are improved.
Patent Information
- Application Number
- CN202510145598.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2025-06-24
AI Technical Summary
In the prior art, the embedded LED lamp plate is thin, curled, and the exposure of holes in the PCS cannot absorb vacuum, which is prone to poor exposure and difficult to cover the ink in the inner wall of the hole, resulting in poor production efficiency and product texture.
The LED cover plate is made through the cover plate making process, and the first pure glue layer is set on its surface. Then the LED motherboard is made through the motherboard making process. After the two are bonded and connected, the LED lamp plate is formed through the pressing process, and finally the target hole is made by mechanical drilling or laser drilling on the LED lamp plate.
This method drills the target hole after the LED cover plate and the LED motherboard are pressed together, solving the problem that the ink and the ink inner wall of the hole is difficult to cover the thin and curling of the ink plate, and improving the production efficiency and production quality of the ink LED lamp plate.
Smart Images
Figure CN120201659A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and particularly to a method for manufacturing an embedded LED lamp board and an LED lamp board. Background Art
[0002] LEDs are widely used in venues, cities, public squares, transportation, corporate image promotion, commercial advertisements, and other applications. The scope of use of LED displays is getting wider and wider, and the types of LED boards are also increasing. The precision requirements for PCBs are getting higher and higher. Currently, the more common types on the market are surface-mounted LED boards, side-mounted LED boards, and embedded lamp boards. Among them, the embedded LED boards are relatively rare. Their quality requirements and manufacturing processes are relatively difficult, and it is difficult to manufacture using traditional process flows and designs. Due to the characteristics of the embedded lamp board being thin, the thickness of a single core board is 0.3 - 0.5 mm. After the core board is made with the second outer layer circuit, solder mask needs to be applied. There are densely arranged copper-free holes with a diameter less than or equal to 3.6 mm in the PCS. It is difficult to cover the inner wall of the holes with ink. At the same time, the embedded lamp board is thin and warped, and there are holes in the PCS, so it is impossible to suck vacuum during exposure, which is prone to poor exposure. Summary of the Invention
[0003] In view of the above problems, the embodiments of the present invention provide a method for manufacturing an embedded LED lamp board and an LED lamp board, which are used to solve the problems in the prior art that due to the characteristics of the embedded lamp board being thin, the thickness of a single core board is 0.3 - 0.5 mm. After the core board is made with the second outer layer circuit, solder mask needs to be applied. There are densely arranged copper-free holes with a diameter less than or equal to 3.6 mm in the PCS. It is difficult to cover the inner wall of the holes with ink. At the same time, the embedded lamp board is thin and warped, and there are holes in the PCS, so it is impossible to suck vacuum during exposure, which is prone to poor exposure.
[0004] According to one aspect of the embodiments of the present invention, a method for manufacturing an embedded LED lamp board is provided. The method includes: Manufacturing an LED cover plate through a cover plate manufacturing process, wherein a first pure glue layer is provided on any surface of the LED cover plate; Manufacturing an LED main board through a main board manufacturing process; Bonding and connecting the LED main board with the first pure glue layer of the LED cover plate, and then laminating the LED main board and the LED cover plate through a lamination process to form an LED lamp board; Manufacturing target holes in the LED lamp board by mechanical drilling or laser drilling.
[0005] In some optional embodiments, the manufacturing of the LED cover plate through the cover plate manufacturing process specifically includes: sequentially manufacturing the LED cover plate through a cutting process, a first drilling process, a second outer layer circuit process, a solder mask process, a text process, a pure glue pasting process, and a second drilling process.
[0006] In some alternative embodiments, for the blanking process: the raw material board is separated into multiple LED cover plates according to the size of the LED lamp board by a material separator; For the first drilling process: the first drilling is made on the LED cover plate by mechanical drilling or laser drilling; For the sub-outer layer circuit process: the first outer layer circuit is made on the LED cover plate, and the first outer layer circuit is detected by outer layer AOI; For the solder mask process: the first solder mask ink layer is made on the board surface of the LED cover plate and the hole wall of the first drilling; For the text process: text is printed on the LED cover plate; For the pure glue pasting process: pure glue is pasted on the LED cover plate to form a first pure glue layer on the surface of the LED cover plate; For the second drilling process, the second drilling is made on the LED cover plate by mechanical drilling or laser drilling to complete the production of the LED cover plate.
[0007] In some alternative embodiments, the LED main board is manufactured through the main board manufacturing process, which specifically includes: successively through the blanking process, the first drilling process, the sub-outer layer circuit process, the solder mask process, the text process, the first testing process, and the chemical gold plating process, to manufacture the LED main board.
[0008] In some alternative embodiments, for the blanking process: the raw material board is separated into multiple LED main boards according to the size of the LED lamp board by a material separator; For the first drilling process: the third drilling is made on the LED main board by mechanical drilling or laser drilling; For the sub-outer layer circuit process: the second outer layer circuit is made on the LED main board, and the second outer layer circuit is detected by outer layer AOI; For the solder mask process: the second solder mask ink layer is made on the board surface of the LED main board and the hole wall of the third drilling; For the text process: text is printed on the LED main board; For the first testing process: the LED main board is subjected to electrical testing; For the chemical gold plating process: the LED main board is immersed in the electroless copper plating solution to form a first copper plating layer on the LED main board.
[0009] In some alternative embodiments, the raw material board is a black material board or an S1000H board, and the thickness of the raw material board is 0.3 mm.
[0010] In some alternative embodiments, the LED main board and the LED cover plate are laminated to form an LED lamp board through the lamination process, which specifically includes: Place the bonded LED main board and LED cover plate in a laminating machine, and laminate them at a pressure of 300 - 400 psi, a temperature of 80°C - 400°C, and a lamination time of at least 60 minutes to form an LED light board.
[0011] In some alternative embodiments, the aperture of the target hole is less than or equal to 3.6 mm; the size of the PNL board of the LED light board is 400 mm * 460 mm.
[0012] In some alternative embodiments, after manufacturing the target hole in the LED light board by mechanical drilling or laser drilling, the following steps are further included: A forming process, which performs a forming treatment on the edge of the LED light board to form an LED light board with a target shape; A secondary testing process, which performs any one or more of appearance inspection, electrical performance testing, function testing, and reliability testing on the LED light board; An FQC process: performing a final quality control test on the LED light board; An OSP packaging process: covering the surface of the LED light board with an organic solder mask and packaging and shipping the LED light board.
[0013] According to another aspect of the embodiments of the present invention, an LED light board is provided, and the printed circuit board is manufactured by performing an inlaid LED light board manufacturing method as described above.
[0014] The beneficial effects of the inlaid LED light board manufacturing method and the LED light board of the present invention are as follows: The present invention manufactures an LED cover plate through a cover plate manufacturing process, wherein a first pure glue layer is provided on any surface of the LED cover plate; manufactures an LED main board through a main board manufacturing process; laminates and connects the LED main board with the first pure glue layer of the LED cover plate, and then laminates the LED main board and the LED cover plate to form an LED light board; manufactures a target hole in the LED light board by mechanical drilling or laser drilling. By the method of the present invention, after the LED cover plate and the LED main board are laminated, the target hole is drilled; the problems that it is difficult to cover the ink on the inner wall of the hole, the inlaid light board is thin, warped, and it is impossible to suck vacuum during hole exposure in the PCS, resulting in easy exposure defects are solved; the production efficiency and production quality of the inlaid LED light board are greatly improved.
[0015] The above description is only an overview of the technical solutions of the embodiments of the present invention. In order to be able to understand the technical means of the embodiments of the present invention more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features, and advantages of the embodiments of the present invention more obvious and understandable, the following specifically illustrates the embodiments of the present invention. Description of the Drawings
[0016] The accompanying drawings are only used to illustrate the embodiments and are not considered as limitations to the present invention. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings: Figure 1 It shows a schematic flow chart of the method for manufacturing an embedded LED light board according to Embodiment 1 provided by the present invention; Figure 2 It shows a schematic flow chart of the cover plate manufacturing process according to Embodiment 2 provided by the present invention; Figure 3 It shows a schematic flow chart of the main board manufacturing process according to Embodiment 2 provided by the present invention; Figure 4 It shows a schematic flow chart after Step 140 according to Embodiment 2 provided by the present invention. Detailed Embodiments
[0017] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein.
[0018] Embodiment 1: Refer to Figure 1 , the present invention provides a first embodiment of a method for manufacturing an embedded LED light board. This method is used to manufacture an LED light board to solve the problems in the prior art that it is difficult to cover the ink on the inner wall of the hole, the embedded light board is thin, warped, and it is impossible to suck vacuum during the hole exposure in the PCS, resulting in easy exposure defects. This method includes: 110. Manufacture an LED cover plate through the cover plate manufacturing process. Among them, a first pure glue layer is provided on any surface of the LED cover plate; in Step 110, manufacture the LED cover plate through the cover plate manufacturing process, specifically including: successively through the processes of blanking, primary drilling, sub - outer layer circuit, solder mask, text, pure glue pasting, and secondary drilling to manufacture the LED cover plate.
[0019] 120. Manufacture an LED main board through the main board manufacturing process; in Step 120, manufacture the LED main board through the main board manufacturing process, specifically including: successively through the processes of blanking, primary drilling, sub - outer layer circuit, solder mask, text, primary testing, and gold plating to manufacture the LED main board.
[0020] 130. Bond the LED main board to the first pure glue layer of the LED cover plate, and then press the LED main board and the LED cover plate through a pressing process to form an LED lamp board. In step 130, pressing the LED main board and the LED cover plate through a pressing process to form an LED lamp board specifically includes: placing the bonded LED main board and LED cover plate in a press, and pressing at a pressure of 300 - 400 psi, a temperature of 80°C - 400°C, and a pressing time of greater than or equal to 60 minutes to form an LED lamp board.
[0021] 140. Make target holes in the LED lamp board by mechanical drilling or laser drilling. In step 140, the diameter of the target hole is less than or equal to 3.6 mm; the PNL board size of the LED lamp board is 400 mm * 460 mm.
[0022] The present invention manufactures an LED cover plate through a cover plate manufacturing process, wherein a first pure glue layer is provided on any surface of the LED cover plate; manufactures an LED main board through a main board manufacturing process; bonds the LED main board to the first pure glue layer of the LED cover plate, and then presses the LED main board and the LED cover plate through a pressing process to form an LED lamp board; makes target holes in the LED lamp board by mechanical drilling or laser drilling. By the method of the present invention, after the LED cover plate and the LED main board are pressed, target holes are drilled; the problems that it is difficult to cover the ink on the inner wall of the hole, the embedded lamp board is thin, warped, and it is impossible to suck vacuum during hole exposure in the PCS, resulting in easy exposure defects are solved; the production efficiency and production quality of the embedded LED lamp board are greatly improved.
[0023] Embodiment 2: Based on Embodiment 1, the present invention provides a first embodiment of a method for manufacturing an embedded LED lamp board. This method includes: manufacturing an LED cover plate through a cover plate manufacturing process, wherein a first pure glue layer is provided on any surface of the LED cover plate; manufacturing an LED main board through a main board manufacturing process; bonding the LED main board to the first pure glue layer of the LED cover plate, and then pressing the LED main board and the LED cover plate through a pressing process to form an LED lamp board; making target holes in the LED lamp board by mechanical drilling or laser drilling. In this embodiment, the above steps are further described.
[0024] In some optional embodiments, manufacturing the LED cover plate through a cover plate manufacturing process specifically includes: successively manufacturing the LED cover plate through a blanking process, a first drilling process, a sub - outer layer circuit process, a solder mask process, a text process, a pure glue pasting process, and a second drilling process.
[0025] See Figure 2, 210, Blanking process: The raw material board is separated into multiple LED cover plates according to the size of the LED lamp board by a material separator. 220, Primary drilling process: A first drill hole is made in the LED cover plate by mechanical drilling or laser drilling. 230, Sub - outer layer circuit process: A first outer layer circuit is made on the LED cover plate, and the first outer layer circuit is detected by outer - layer AOI. 240, Solder mask process: A first solder mask ink layer is made on the plate surface of the LED cover plate and the hole wall of the first drill hole. 250, Lettering process: Letters are printed on the LED cover plate. 260, Pure glue pasting process: Pure glue is pasted on the LED cover plate to form a first pure glue layer on the surface of the LED cover plate. 270, Second drilling process: A second drill hole is made in the LED cover plate by mechanical drilling or laser drilling to complete the production of the LED cover plate. In this embodiment, the raw material board is a black material board or an S1000H board, and the thickness of the raw material board is 0.3 mm. In this embodiment, the raw material board is selected as a 0.3 - mm (H / H) black material board without a copper core board. The black material board can achieve full - board printing of ink, and the NPTH hole wall does not need to be covered with ink; it reduces the overall board thickness; cancels the manual pasting of pure glue PP, and can achieve mass production.
[0026] In the above - mentioned embodiment, the blanking process is to cut a large - area copper - clad laminate into small - block LED cover plates of various required specifications. Specifically, an automatic blanking machine is used to cut the large - area copper - clad laminate into LED cover plates of the required size, and then edge - grinding and rounding - off treatments are carried out to remove burrs and right - angled edges to ensure the smooth progress of subsequent processes. The drilling process is to use a drilling machine to drill holes of different diameters and sizes on the LED cover plate according to customer requirements for through - holes and heat dissipation. During the drilling process, the rotational speed, feed rate, and cutting depth of the drill bit need to be precisely controlled to ensure the dimensional accuracy and position accuracy of the holes. Sub - outer layer circuit process: Select a suitable substrate, such as FR4, CEM - 1, etc., and cut the board according to the design requirements. The substrate is laminated with copper foil to form a prepreg. An exposure machine is used to transfer the circuit pattern to the prepreg to form a sub - outer layer circuit. The excess copper foil on the first outer layer circuit is removed by chemical etching, leaving the metal circuit. An AOI device is used to optically scan and detect the inner - layer circuit board, and defective phenomena such as gaps and depressions are found, and repairs and wire - filling are carried out to ensure the accuracy and integrity of the inner - layer circuit. The solder mask process is to coat a solder - resist layer on the surface of the LED cover plate by screen - printing ink to prevent short - circuit during soldering. After pre - baking, the pads and holes to be soldered are exposed through exposure and development, and other places are covered with the solder - resist layer. At the same time, the required letters, trademarks, or component symbols, etc., are made. The lettering process is to screen - print lettering ink on the PCB multi - layer board according to the lettering materials.
[0027] In some alternative embodiments, the LED main board is manufactured through the main - board manufacturing process, which specifically includes: sequentially going through the blanking process, primary drilling process, sub - outer layer circuit process, solder mask process, lettering process, primary testing process, and gold plating process to manufacture the LED main board.
[0028] See Figure 3 , 310, Blanking process: The raw material board is separated into multiple LED main boards according to the size of the LED lamp board by a material separator. 320, First drilling process: The third drilling is made on the LED main board by mechanical drilling or laser drilling. 330, Sub-outer layer circuit process: The second outer layer circuit is made on the LED main board, and the second outer layer circuit is detected by outer layer AOI. 340, Solder mask process: The second solder mask ink layer is made on the board surface of the LED main board and the hole wall of the third drilling. 350, Lettering process: Letters are printed on the LED main board. 360, First testing process: Electrical testing is performed on the LED main board. 370, Immersion gold process: The LED main board is immersed in the electroless copper plating solution to form the first copper plating layer on the LED main board. The raw material board is a black material board or an S1000H board, and the thickness of the raw material board is 0.3 mm. In this embodiment, the raw material board is selected as a 0.3 mm (H / H) black material board without a copper core board. The black material board can achieve full-board printing of ink, and the NPTH hole wall does not need to be covered with ink; the overall board thickness is reduced; manual lamination of pure gum PP is cancelled, and mass production can be achieved.
[0029] In the above embodiment, the blanking process is to cut the large copper clad laminate into small LED main boards of various required specifications. Specifically, an automatic blanking machine is used to cut the large copper clad laminate into LED main boards of the required size, and then edge grinding and rounding are performed to remove burrs and right-angled edges to ensure the smooth progress of subsequent processes. The drilling process is to drill holes with different diameters and sizes on the LED main board according to customer requirements for through holes and heat dissipation. During the drilling process, the rotation speed, feed speed, and cutting depth of the drill bit need to be precisely controlled to ensure the dimensional accuracy and position accuracy of the holes. Sub-outer layer circuit process: Select a suitable substrate, such as FR4, CEM-1, etc., and cut the board according to the design requirements. The substrate is laminated with copper foil to form a prepreg. An exposure machine is used to transfer the circuit pattern to the prepreg to form the sub-outer layer circuit. The excess copper foil on the first outer layer circuit is removed by chemical etching, leaving the metal circuit. An AOI device is used to optically scan and detect the inner layer circuit board, and defects such as gaps and depressions are found, and repairs and wire filling are performed to ensure the accuracy and integrity of the inner layer circuit. The solder mask process is to coat a solder resist layer on the LED main board surface by screen printing ink to prevent short circuits during soldering. After pre-baking, the pads and holes to be soldered are exposed by exposure and development, and the other places are covered with the solder resist layer. At the same time, the required letters, trademarks, or component symbols are made.
[0030] In the prior art, due to the dense ¢3.6mm copper-free holes drilled in the board, when making the LED cover plate or LED main board, the solder mask cannot absorb the board surface of the LED cover plate or LED main board when using the LDI exposure machine, and the board surface of the LED cover plate or LED main board has uneven problems, which is prone to poor exposure of the warped position. In the present application, the target hole is made after lamination, and the LED main board and the LED cover plate are pressed together by the lamination process to form the LED light board, which specifically includes: placing the bonded LED main board and the LED cover plate in the laminating machine, pressing at a pressure of 300~400 psi, a temperature of 80℃~400℃, and a pressing time of greater than or equal to 60min, thereby forming the LED light board. The aperture of the target hole is less than or equal to 3.6mm; the PNL board size of the LED light board is 400mm *460mm. In this embodiment, the PNL size is designed according to 400*460mm, and the lamination process avoids the lack of support in the middle of the PNL board, resulting in the layer deflection slide. Among them, the target hole is a 3.6mm hole without a hole.
[0031] In some optional embodiments, see Figure 4 , after making the target holes in the LED light board by mechanical drilling or laser drilling, it also includes: 410, a molding process, performing molding processing on the edge of the LED light board to form the LED light board of a target shape; 420, secondary testing process, performing any one or more of appearance testing, electrical performance testing, functional testing and reliability testing on the LED light board; 430, FQC process: final quality control test of LED light panels; 440, OSP packaging process: Cover the surface of the LED light board with organic solder paste, and package the LED light board before shipment.
[0032] In this embodiment, after the target holes of the LED light board are made, the LED light board is formed and tested through a molding process, a secondary testing process, a FQC process, and an OSP packaging process, and is packaged and shipped only after no problems are found on the LED light board.
[0033] Embodiment 3: According to another aspect of the embodiments of the present invention, an LED light board is provided, which is manufactured by a printed circuit board through performing a manufacturing method of an embedded LED light board as described in Embodiment 1 or Embodiment 2. In this embodiment, the embedded bead light board is designed as a four-layer board. After the cover plate L1 / L2 layer and the main board L3 / L4 layer are finished with solder mask, they are laminated with pure glue. The embedded bead Pad is on the L3 layer of the four-layer board structure, and the surface treatment method is nickel-palladium-gold. When the two core ink surfaces are combined, pure glue PP is required for lamination. The present invention manufactures an LED cover plate through the cover plate manufacturing process, wherein a first pure glue layer is provided on any surface of the LED cover plate; an LED main board is manufactured through the main board manufacturing process; the LED main board is bonded and connected to the first pure glue layer of the LED cover plate, and then the LED main board and the LED cover plate are laminated to form an LED light board through the lamination process; target holes are drilled in the LED light board through mechanical drilling or laser drilling. Through the method of the present invention, after the LED cover plate and the LED main board are laminated, the target holes are drilled; the problems that it is difficult to cover the ink on the inner wall of the holes, the embedded light board is thin, warped, and it is impossible to suck vacuum during hole exposure in the PCS, and it is easy to have poor exposure are solved; the production efficiency and production quality of the embedded LED light board are greatly improved. Through the verification of such process optimization and replacement of new material process flows, the production of the embedded light board is smooth, and the production quality is improved by 20% compared with the original.
[0034] In the specification provided herein, a large number of specific details are set forth. It will be understood, however, that embodiments of the invention may be practiced without these specific details. Similarly, in order to streamline the present invention and assist in understanding one or more of the various inventive aspects, in the description of the exemplary embodiments of the present invention above, the various features of the embodiments of the present invention are sometimes grouped together in a single embodiment, figure, or description thereof. Among them, the claims following the specific implementation manners are hereby expressly incorporated into the specific implementation manners, and each claim itself serves as a separate embodiment of the present invention.
[0035] Those skilled in the art can understand that the modules in the devices in the embodiments can be adaptively changed and arranged in one or more devices different from this embodiment. The modules or units or components in the embodiments can be combined into a module or unit or component, and in addition, they can be divided into multiple sub-modules or sub-units or sub-components. Except that at least some of such features and / or processes or units are mutually exclusive.
[0036] It should be noted that the above embodiments illustrate the present invention rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention can be implemented by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims listing several systems, several of these systems can be embodied by the same item of hardware. The use of the words first, second, and third, etc. does not denote any order. These words can be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be construed as limiting the order of execution.
Claims
1. A method for manufacturing an embedded LED light panel, characterized in that: The method comprises: The LED cover plate is manufactured by a cover plate manufacturing process, wherein a first pure glue layer is provided on any surface of the LED cover plate; Make LED mainboard through mainboard manufacturing process; The LED main board is bonded and connected with the first pure adhesive layer of the LED cover plate, and then the LED main board and the LED cover plate are pressed together by a pressing process to form an LED light board; Target holes are made on the LED light board by mechanical drilling or laser drilling.
2. The method for manufacturing an embedded LED light board according to claim 1, characterized in that: The LED cover is manufactured through the cover manufacturing process, specifically including: manufacturing the LED cover in sequence through a material cutting process, a primary drilling process, a secondary outer layer circuit process, a solder mask process, a text process, a pure glue pasting process, and a second drilling process.
3. The method for manufacturing an embedded LED light board according to claim 2, characterized in that: The material cutting process: using a material dividing machine to divide the raw material board into multiple LED cover boards according to the size of the LED light board; The first drilling process: making a first drill hole in the LED cover plate by mechanical drilling or laser drilling; The second outer layer circuit process: manufacturing a first outer layer circuit on the LED cover plate, and inspecting the first outer layer circuit through outer layer AOI; The solder resist step: forming a first solder resist ink layer on the board surface of the LED cover board and in the wall of the first drilled hole; The text process: printing text on the LED cover; The pure glue pasting step: pasting pure glue on the LED cover to form a first pure glue layer on the surface of the LED cover; The second drilling process is to make a second hole in the LED cover plate by mechanical drilling or laser drilling to complete the production of the LED cover plate.
4. The method for manufacturing an embedded LED light board according to claim 1, characterized in that: The manufacturing of the LED main board through the main board manufacturing process specifically includes: manufacturing the LED main board through a material cutting process, a primary drilling process, a secondary outer layer circuit process, a solder mask process, a text process, a primary testing process, and a gold processing process in sequence.
5. The method for manufacturing an embedded LED light board according to claim 4, characterized in that: The material cutting process: using a material dividing machine to divide the raw material board into multiple LED main boards according to the size of the LED light board; The first drilling process: making a third drill hole on the LED main board by mechanical drilling or laser drilling; The second outer layer circuit process: making a second outer layer circuit on the LED main board, and inspecting the second outer layer circuit through outer layer AOI; The solder resist step: forming a second solder resist ink layer on the board surface of the LED main board and in the hole wall of the third drill hole; The text process: printing text on the LED main board; The first testing process: performing electrical testing on the LED mainboard; Gold plating process: immersing the LED mainboard in a chemical copper plating solution to form a first copper plating layer on the LED mainboard.
6. The method for manufacturing an embedded LED light board according to claim 3 or 5, characterized in that: The raw material plate is a black material plate or an S1000H plate, and the thickness of the raw material plate is 0.3 mm.
7. The method for manufacturing an embedded LED light board according to claim 1, characterized in that: The method of pressing the LED main board and the LED cover board to form the LED light board by a pressing process specifically includes: The bonded LED main board and LED cover are placed in a pressing machine, and pressed at a pressure of 300-400 psi, a temperature of 80°C-400°C, and a pressing time of greater than or equal to 60 minutes to form an LED light board.
8. The method for manufacturing an embedded LED light board according to claim 1, characterized in that: The aperture of the target hole is less than or equal to 3.6 mm; the PNL board size of the LED light board is 400 mm * 460 mm.
9. The method for manufacturing an embedded LED light board according to claim 1, characterized in that: After making the target hole on the LED light board by mechanical drilling or laser drilling, the method further includes: A molding process is to perform molding processing on the edge of the LED light board to form an LED light board of a target shape; A secondary testing process, performing any one or more of appearance testing, electrical performance testing, functional testing and reliability testing on the LED light board; FQC process: final quality control test of the LED light panel; OSP packaging process: Cover the surface of the LED light board with an organic solder paste, and package the LED light board for shipment.
10. An LED light board, characterized in that: The printed circuit board is manufactured by executing the above-mentioned method for manufacturing an embedded LED light board.