A power device and a photovoltaic system

Abstract

The application provides a power device and a photovoltaic system to improve the heat dissipation performance of the power device and thus improve the use reliability of the power device. The power device comprises a shell and a heat dissipation device. A partition is arranged in the shell, the partition divides the shell into a first cavity and a second cavity, and the partition is provided with a first opening and a second opening which communicate the first cavity and the second cavity. A device to be cooled is arranged in the first cavity, and the second cavity is provided with an air inlet and an air outlet which are oppositely arranged along a first direction. The heat dissipation device comprises a first fin arranged in the second cavity. The first fin is provided with a channel which penetrates the first fin along a second direction. The two ends of the channel are in communication with the first opening and the second opening, respectively. The smallest included angle between the second direction and the first direction is greater than 0° and less than or equal to 90°.

Description

[0001] This application is a divisional application, the original application number is 202211056306.X, the original application date is August 31, 2022, and the entire contents of the original application are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat dissipation, in particular to a power device and a photovoltaic system. BACKGROUND

[0003] With the increasing power of the inverter, the heat generated by the single board, on-board components and cable structures inside the inverter cabinet is also increasing. Since heat-sensitive devices such as electrolytic capacitors are arranged inside the cabinet, the temperature rise inside the cabinet directly determines the performance of these devices. At present, the inverter cabinet mainly relies on the natural heat dissipation of the cabinet wall surface, but this heat dissipation method has limited heat dissipation capacity, which makes it difficult to achieve effective cooling inside the cabinet, thereby affecting the service life and reliability of the internal components, and further affecting the overall service life of the inverter. SUMMARY

[0004] The present application provides a power device and a photovoltaic system to improve the heat dissipation performance of the power device and further improve the use reliability of the power device.

[0005] In a first aspect, the present application provides a power device, which can include a shell and a heat dissipation device. A partition is arranged inside the shell, which can separate the shell into a first cavity and a second cavity. A first opening and a second opening are arranged on the partition, and the first opening and the second opening respectively communicate the first cavity and the second cavity. A device to be cooled is arranged in the first cavity, and the second cavity is provided with an air inlet and an air outlet, which can be oppositely arranged along a first direction. The heat dissipation device can include a first fin arranged in the second cavity, the surface of the first fin is arranged towards the partition, and a channel is arranged in the first fin, which can penetrate the first fin along a second direction, and the two ends of the channel can respectively communicate with the first opening and the second opening. The smallest included angle between the first direction and the second direction is greater than 0° and less than or equal to 90°.

[0006] In the above scheme, an air circulation loop can be formed between the inside of the first cavity and the channel of the first fin, so that the air in the first cavity can realize heat exchange with the air flowing through the surface of the first fin in the process of circulating flow, thereby effectively improving the heat dissipation effect inside the first cavity, and further reducing the risk of failure of the internal components of the first cavity, and improving the use reliability of the power device.

[0007] Exemplarily, the first direction can be the height direction of the power device, and the second direction can be the width direction of the power device.

[0008] In some possible embodiments, the first fins can be multiple in number, and the adjacent first fins can form air channels extending in the first direction, which can help to improve the heat exchange efficiency between the first fins and the air entering the second cavity, and thus can improve the heat dissipation effect inside the first cavity.

[0009] In some possible embodiments, the heat dissipation device can further include a first flow guide member and a second flow guide member arranged in the second cavity, one end of the first flow guide member being in communication with the first opening and the other end being in communication with one end of the channel of the first fin, one end of the second flow guide member being in communication with the second opening and the other end being in communication with the other end of the channel of the first fin. In addition to the function of connecting the channel of the first fin with the first cavity, the first flow guide member and the second flow guide member can also serve to support and fix the first fin, thereby improving the structural stability of the heat dissipation device.

[0010] In some possible embodiments, the device to be cooled in the first cavity can include a first device to be cooled, which is arranged close to the partition plate. The heat dissipation device can further include a substrate arranged in the second housing and a plurality of second fins, the substrate being arranged on the partition plate and being in thermal contact with the first device to be cooled, and the second fins being arranged on the side of the substrate away from the partition plate and extending away from the partition plate, and the adjacent two second fins can form air channels extending in the first direction. The heat generated by the first device to be cooled when working can be transferred to the substrate and then to the second fins, and further transferred to the air flowing through the surface of the second fins, so as to achieve the heat dissipation of the first device to be cooled.

[0011] Exemplarily, the first device to be cooled can be a power device.

[0012] In some possible embodiments, the first fins can be arranged on the side of the free end of each second fin away from the substrate, so as to improve the compactness of the heat dissipation device.

[0013] In some other possible embodiments, the plurality of second fins can be divided into a first part and a second part, and the height of the second fins in the first part is less than the height of the second fins in the second part in the direction away from the substrate. In this case, the first fins can be arranged on the side of the free end of each second fin in the first part away from the substrate. This design can also improve the compactness of the heat dissipation device.

[0014] In some possible embodiments, a projection of the outer contour of the substrate on the surface of the partition plate can be located between the first opening and the second opening. Alternatively, an area enclosed by the projection of the outer contour of the substrate on the surface of the partition plate can cover the first opening and the second opening, and the substrate can be provided with a first avoiding hole and a second avoiding hole at positions corresponding to the first opening and the second opening respectively, the end of the first flow guide member can pass through the first avoiding hole to communicate with the first opening, and the second flow guide member can pass through the second avoiding hole to communicate with the second opening. This design can increase the area of the substrate, thereby facilitating the improvement of the heat dissipation effect on the first device to be cooled.

[0015] In some possible embodiments, the partition plate can be provided with an opening at a position corresponding to the first device to be cooled, and the first device to be cooled can extend into the opening to be in heat-conducting contact with the substrate, so that the heat exchange efficiency between the first device to be cooled and the heat dissipation device can be improved, thereby facilitating the improvement of the heat dissipation effect on the first device to be cooled.

[0016] In some possible embodiments, the heat dissipation device can further include a first fan arranged in the second cavity, and the air inlet side of the first fan is arranged to face the air inlet, and the air outlet side of the first fan is arranged to face the air outlet. In this way, the air circulation rate in the second cavity can be improved, thereby improving the heat dissipation effect of the heat dissipation device.

[0017] In some possible embodiments, the devices to be cooled in the first cavity can further include a second device to be cooled and a third device to be cooled. The heat dissipation device can further include a second fan arranged in the first cavity, the second device to be cooled can be arranged between the first opening and the air inlet side of the second fan, the third device to be cooled can be arranged between the air outlet side of the second fan and the second opening, and the third device to be cooled is located on the side of the first device to be cooled away from the partition plate. After the air in the first fin that has been cooled by heat exchange enters the first cavity through the first opening, the low-temperature air can first pass through the second device to be cooled, and then be blown by the second fan to the third device to be cooled after heat exchange with the second device to be cooled, so as to further exchange heat with the third device to be cooled, and then flow to the first fin through the second opening, to complete a cycle and achieve heat dissipation on the devices to be cooled in the first cavity.

[0018] In some possible embodiments, the heat dissipation device can further include a third flow guide member arranged in the first cavity, the third flow guide member communicates with the first opening, and the third flow guide member is provided with a first air port at a position facing the third device to be cooled. The second device to be cooled is arranged in the third flow guide member, the second fan is arranged at the first air port, and the air inlet side of the second fan is arranged opposite to the first air port. By arranging the third flow guide member, the second device to be cooled can be limited in a relatively closed space, and the risk of air flowing back to the vicinity of the second device to be cooled on the air outlet side of the second fan can be reduced, thereby facilitating the further improvement of the heat dissipation effect on the second device to be cooled.

[0019] In some possible embodiments, the heat dissipation device can further include a third fan and a fourth flow guide member arranged in the first cavity, the fourth flow guide member being in communication with the second opening, and the fourth flow guide member being provided with a second air outlet facing the third device to be cooled. The third fan can be arranged at the second air outlet, and an air inlet side of the third fan is arranged to face the third device to be cooled, and an air outlet side of the third fan is arranged opposite to the second air outlet. The arrangement of the third fan and the fourth flow guide member can further reduce the risk of air backflow around the second device to be cooled, and help improve the use reliability of the second device to be cooled.

[0020] Exemplarily, the second device to be cooled can be an electrolytic capacitor board, and the third device to be cooled can be an output board.

[0021] In some possible embodiments, a fourth device to be cooled can be arranged in the second cavity, and the fourth device to be cooled can be arranged on a side of the first fin facing the air outlet. Exemplarily, the fourth device to be cooled can be a magnetic device. Since the protection requirement of the magnetic device is relatively low, arranging the magnetic device downstream of the heat dissipation path can also achieve a certain heat dissipation effect, and guarantee normal work of the magnetic device.

[0022] In a second aspect, the present application further provides a photovoltaic system, which can include a cell board and the power device in any possible embodiment of the foregoing first aspect. The cell board can be used to convert solar energy into electrical energy, and the power device can be used to perform power conversion on the current from the cell board, or perform power conversion on the voltage from the cell board, so as to match the output power of the photovoltaic system with the power of an external power consumption device. Since the power device has good heat dissipation performance, the reliability of the photovoltaic system is also improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A side sectional view of a power device provided in an embodiment of the present application;

[0024] Figure 2 A sectional view of the power device shown in FIG. 2 in a top view state; Figure 1

[0025] Figure 3 A partial structure schematic view of a heat dissipation device shown in FIG. 3; Figure 1

[0026] Figure 4 A side sectional view of another power device provided in an embodiment of the present application;

[0027] Figure 5 A sectional view of the power device shown in FIG. 8 in a top view state; Figure 4 ​​​

[0028] Figure 6 for Figure 4 a first cavity of the power device shown in FIG. 1 in a cross-sectional view perpendicular to the third direction;

[0029] Figure 7 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0030] Figure 8 for Figure 7 a first cavity of the power device shown in FIG. 1 in a cross-sectional view perpendicular to the third direction;

[0031] Figure 9 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0032] Figure 10 for Figure 9 a first cavity of the power device shown in FIG. 1 in a cross-sectional view perpendicular to the third direction;

[0033] Figure 11 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0034] Figure 12 for Figure 11 a first cavity of the power device shown in FIG. 1 in a cross-sectional view perpendicular to the third direction;

[0035] Figure 13 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0036] Figure 14 for Figure 13 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0037] Figure 15 for Figure 14 a partial structure schematic view of the heat dissipation device shown in FIG. 1;

[0038] Figure 16 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0039] Figure 17 for Figure 16 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0040] Figure 18 for Figure 16 a partial structure schematic view of the heat dissipation device shown in FIG. 1;

[0041] Figure 19 a cross-sectional view in a top view of another power device provided by an embodiment of the present application;

[0042] Figure 20 for Figure 19 The power device shown is a top-view cross-sectional view;

[0043] Figure 21 for Figure 19 A partial structural schematic diagram of the heat dissipation device shown;

[0044] Figure 22 A side sectional view of another power device provided in an embodiment of this application;

[0045] Figure 23 for Figure 22 The power device shown is a top-view cross-sectional view;

[0046] Figure 24 for Figure 22 The diagram shows a partial structural schematic of the heat dissipation device.

[0047] Figure label:

[0048] 100-power devices;

[0049] 110 - Shell; 111 - Partition; 1111 - First opening; 1112 - Second opening; 1101 - First sidewall; 1102 - Second sidewall;

[0050] 1103 - Third sidewall; 1104 - Fourth sidewall; 1105 - Fifth sidewall; 1106 - Sixth sidewall; 112 - First cavity;

[0051] 113-Second cavity; 1131-Air inlet; 1132-Air outlet;

[0052] 120 - Heat dissipation device; 121 - First fin; 122 - First fan; 123 - First airflow guide component; 124 - Second airflow guide component;

[0053] 125 - Substrate; 1251 - First clearance hole; 1252 - Second clearance hole; 126, 1261, 1262 - Second fins;

[0054] 127 - Second fan; 128 - Third airflow guide component; 129 - Third fan; 1210 - Fourth airflow guide component; 1211 - Mounting plate;

[0055] 1212 - First support component; 1213 - Second support component; 131 - First device to be cooled, power device; 132 - Power board;

[0056] 133 - Second heat-dissipating device, electrolytic capacitor board; 134 - Third heat-dissipating device, output board;

[0057] 135 - Electrolytic capacitor; 136 - Fourth heat dissipation device. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0059] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0060] A photovoltaic (PV) system is a power generation system that utilizes the photovoltaic effect of semiconductor materials to convert solar energy into electrical energy. A PV system typically consists of solar panels and power devices. The solar panels convert solar energy into electrical energy, while the power devices convert the current from the solar panels into power, or they can convert the voltage from the solar panels into power, to match the output power of the PV system with the power of external electrical equipment. Examples of power devices include, but are not limited to, inverters, rectifiers, and choppers. As the power of power devices increases, the heat generated by the circuit boards, on-board components, and cables inside the power device chassis also increases, leading to a rise in the internal temperature of the chassis. This is very detrimental to the components installed inside the chassis, especially heat-sensitive components, whose risk of failure increases significantly under sustained high temperatures.

[0061] Currently, the main method for power equipment is to remove the chassis walls for natural heat dissipation. However, this method has limited cooling effect and cannot effectively cool the inside of the chassis. As a result, the lifespan and reliability of the components inside the chassis cannot be guaranteed, which in turn affects the overall lifespan of the power equipment.

[0062] To address the aforementioned problems, this application improves the heat dissipation method of the power device, thereby achieving effective heat dissipation inside the power device, reducing the risk of component failure, and improving the reliability of the power device. The power device provided in this application embodiment will be described in detail below with reference to the accompanying drawings.

[0063] Please refer to the above. Figure 1 and Figure 2 As shown,Figure 1 This is a side sectional view of a power device 100 provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shows a top-view cross-sectional view of the power device 100. In this embodiment, the power device 100 may include a housing 110 and a heat dissipation device. A partition 111 may be provided inside the housing 110, dividing the housing 110 into two cavities: a first cavity 112 and a second cavity 113. The first cavity 112 may be a closed cavity, and the second cavity 113 may be a ventilated cavity. Thus, components in the power device 100 with relatively high requirements for waterproofing, dustproofing, or corrosion resistance can be housed in the first cavity 112, while components without such protection requirements or with relatively low protection requirements can be housed in the second cavity 113.

[0064] For example, the housing 110 may be generally a cuboid structure, including a first sidewall 1101, a second sidewall 1102, a third sidewall 1103, a fourth sidewall 1104, a fifth sidewall 1105, and a sixth sidewall 1106. The first sidewall 1101 and the second sidewall 1102 may be arranged opposite each other along a first direction, the third sidewall 1103 and the fourth sidewall 1104 may be arranged opposite each other along a second direction, and the fifth sidewall 1105 and the sixth sidewall 1106 may be arranged opposite each other along a third direction. The minimum included angle between the first and second directions may be greater than 0° and less than or equal to 90°, the minimum included angle between the second and third directions may be greater than 0° and less than or equal to 90°, and the minimum included angle between the first and third directions may be greater than 0° and less than or equal to 90°.

[0065] In one embodiment of this application, the first sidewall 1101 is the bottom wall of the power device, the second sidewall 1102 is the top wall of the power device, the fifth sidewall 1105 is the front sidewall of the power device, and the sixth sidewall 1106 is the rear sidewall of the power device. In this case, the first direction, the second direction, and the third direction can be the height direction, the width direction, and the length direction of the power device 100, respectively, and these three directions are perpendicular to each other. Along the first direction, the two ends of the partition 111 can be connected to the first sidewall 1101 and the second sidewall 1102, respectively, and the resulting first cavity 112 and second cavity 113 are arranged along the third direction. The first sidewall 1101 and the second sidewall 1102 can be respectively provided with an air inlet 1131 and an air outlet 1132 at positions corresponding to the second cavity 113, with the air inlet 1131 and the air outlet 1132 positioned opposite each other, thereby enabling the second cavity 113 to achieve ventilation.

[0066] Please refer to the above. Figure 1 , Figure 2 and Figure 3 , Figure 3 for Figure 1A partial structure schematic diagram of the heat dissipation device 120 is shown in FIG. 1. The heat dissipation device 120 can include a first fin 121 located in the second cavity, and the first fin 121 is arranged towards the partition plate 111. Exemplarily, the first fin 121 can be internally provided with a channel, and the channel can pass through the first fin 121 in the second direction. At this time, the partition plate 111 can be provided with a first opening 1111 and a second opening 1112, and the first opening 1111 and the second opening 1112 respectively communicate the first cavity 112 and the second cavity 113. One end of the channel of the first fin 121 can communicate with the first opening 1111, and the other end of the channel of the first fin 121 can communicate with the second opening 1112, so that an air circulation loop can be formed between the inside of the first cavity 112 and the channel of the first fin 121, so that the air between them can circulate. When the high-temperature air in the first cavity 112 enters the channel of the first fin 121, it can exchange heat with the low-temperature air flowing through the surface of the first fin 121 in the second cavity 113. The air in the second cavity 113 is discharged from the air outlet 1132 after being heated, and the air in the first fin 121 is cooled again and returns to the inside of the first cavity 112, thereby achieving heat dissipation of the inside of the first cavity 112.

[0067] As can be seen from the above description, compared with the natural heat dissipation of the cavity wall surface to the outside in the prior art, the embodiment of the present application can realize the circulation of the air in the first cavity 112 under the design requirements of meeting the related protection performance of the power device 100, thereby effectively improving the heat dissipation effect of the inside of the first cavity 112, and reducing the risk of failure of the components in the first cavity 112, and improving the use reliability of the power device 100.

[0068] In some embodiments, the number of first fins 121 can be multiple, and a channel extending in the first direction can be formed between two adjacent first fins 121, that is, the air duct direction formed between two adjacent first fins 121 is consistent with the ventilation direction of the second cavity 113, which helps to improve the heat exchange efficiency between the first fin 121 and the air entering the second cavity 113, thereby improving the heat dissipation effect of the inside of the first cavity 112. Exemplarily, a plurality of first fins 121 can be arranged in the third direction, that is, a plurality of first fins 121 can be arranged away from the partition plate 111 in sequence.

[0069] In addition, the heat dissipation device can also include a first fan 122 (see FIG. 1), which is arranged on the partition plate 111 and is arranged to drive the air in the second cavity 113 to flow in the second direction. Figure 1The first fan 122 is arranged in the second cavity 113, and an air inlet side of the first fan 122 is arranged towards the air inlet 1131, and an air outlet side of the first fan 122 is arranged towards the air outlet 1132, so that air is sent to the side of the air outlet 1132, so as to improve the air flow rate in the second cavity 113, and then the heat dissipation effect of the heat dissipation device can be improved. Exemplarily, the first fan 122 can be located at one end close to the first side wall 1101, or can also be located at one end close to the second side wall 1102, and the present application does not make any limitation in this regard.

[0070] When the channels of the first fins 121 are communicated with the first cavity 112, the heat dissipation device 120 can further comprise a first flow guide member 123 and a second flow guide member 124, both of which are arranged in the second cavity 113, and one end of the first flow guide member 123 is communicated with the first opening 1111, and the other end can be communicated with one end of each first fin 121, and one end of the second flow guide member 124 is communicated with the second opening 1112, and the other end is communicated with the other end of each first fin 121. In the present embodiment, in addition to the function of communicating the channels of the first fins 121 with the inside of the first cavity 112, the first flow guide member 123 and the second flow guide member 124 can also play a supporting and fixing role for the first fins 121, so as to improve the structural stability of the heat dissipation device 120.

[0071] At the end of the first flow guide member 123 communicated with the first opening 1111, the first flow guide member 123 can be fixed at the first opening 1111 of the partition plate 111 by welding, or can also be arranged in the first opening 1111 by assembling such as insertion, and the present application does not make any limitation in this regard. It should be noted that when the first flow guide member 123 is arranged in the first opening 1111 by insertion, a sealing ring can be arranged between the outer wall of the first flow guide member 123 and the inner wall of the first opening 1111, so as to reduce the risk of air leakage of the first cavity 112 through the first opening 1111. At the end of the first flow guide member 123 communicated with the channels of the first fins 121, the first flow guide member 123 can be provided with an opening corresponding to each first fin 121, and each first fin 121 can be connected with the corresponding opening by welding or insertion. Similarly, when the first fin 121 is arranged in the opening by insertion, a sealing ring can be arranged between the outer wall of the first fin 121 and the inner wall of the opening, so as to reduce the risk of air leakage at the opening. The connection mode of the second flow guide member 124 and the second opening 1112 and each first fin 121 can be arranged by referring to the first flow guide member 123, and details are not described herein.

[0072] In some embodiments, the first opening 1111 and the second opening 1112 can be arranged along the second direction, and the first flow guide member 123 and the second flow guide member 124 can be oppositely arranged along the second direction, so as to reduce the obstruction to the air flow in the second cavity 113, and the air entering the second cavity 113 can flow smoothly into the air ducts formed by the adjacent first fins 121.

[0073] Please continue to refer to Figure 1 、 Figure 2 and Figure 3 In some embodiments, the heat dissipation device can further include a substrate 125 and a second fin 126, wherein the substrate 125 can be arranged on the partition plate 111, and the second fin 126 can be arranged on the side of the substrate 125 away from the partition plate 111, and the second fin 126 extends away from the substrate 125. For example, the second fin 126 can be a solid sheet structure. In one implementation, the device arranged in the first cavity 112 can include a first device to be cooled 131, which is arranged close to the partition plate 111 and can be in thermal contact with the substrate 125 arranged in the second cavity 113, so as to transfer the heat generated during operation of the first device to be cooled 131 to the substrate 125, and further to the second fin 126 through the substrate 125. In this way, the external air enters the second cavity 113 through the air inlet 1131, and is discharged from the air outlet 1132 after heat exchange with the second fin 126, so as to take away the heat of the second fin 126, thereby achieving heat dissipation of the first device to be cooled 131.

[0074] In some embodiments, the first device to be cooled 131 can be attached to the side of the partition plate 111 facing the first cavity 112, and the first device to be cooled 131 and the substrate 125 can be indirectly in thermal contact through the partition plate 111.

[0075] In some other embodiments, the partition plate 111 can be provided with a through hole corresponding to the position of the first device to be cooled 131, and the first device to be cooled 131 can at least partially extend into the through hole to achieve direct thermal contact with the substrate 125. In this way, the heat exchange efficiency between the first device to be cooled 131 and the heat dissipation device can be improved, thereby helping to improve the heat dissipation effect of the first device to be cooled 131.

[0076] Exemplarily, the first device to be cooled 131 can be a power device. It should be noted that the reference of the power device below is the same as that of the first device to be cooled 131. Since the power device 131 generates relatively large amount of heat when working, part of the heat can be dissipated into the first cavity 112 and dissipated outward through the first fins 121 in communication with the first cavity 112, and the other part of the heat can be dissipated outward through the second fins 126 in the above-mentioned heat conduction contact manner, so as to enhance the heat dissipation effect of the power device 131 and improve the working reliability of the power device 131.

[0077] In one implementation, the power device 100 can further include a power board 132 disposed in the first cavity 112. The power board 132 can be substantially parallel to the partition 111, and the power device 131 can be disposed on a side of the power board 132 facing the partition 111. In addition, the number of the power device 131 can be one or more, which is not limited in the present application. When the power device 131 is multiple, a through hole can be provided on the partition 111 corresponding to the position of each power device 131, so that each power device 131 can be cooled by direct heat conduction contact. Of course, in addition to the power device 131, other electronic components such as capacitors can also be disposed on the power board 132. These electronic components can be disposed on the side of the power board 132 facing the partition 111 or on the side of the power board 132 away from the partition 111, which is also not limited in the present application.

[0078] In the embodiment, the projection of the outer contour of the substrate 125 on the surface of the partition 111 can be located between the first opening 1111 and the second opening 1112. Alternatively, it can be understood that the projection of the line constituting the outer edge of the substrate 125 on the surface of the partition 111 can be located between the first opening 1111 and the second opening 1112. At this time, the first flow guide member 123 and the second flow guide member 124 can be located on both sides of the substrate 125 along the second direction. In addition, the number of the second fins 126 can be multiple, and the multiple second fins 126 can be arranged along the second direction. At this time, the air passages extending along the first direction can be formed between adjacent second fins 126. That is, the air direction of the air duct formed between adjacent second fins 126 is consistent with the ventilation direction of the second cavity 113, which helps to improve the heat exchange efficiency between the second fins 126 and the air entering the second cavity 113, and thus the heat dissipation effect of the first device to be cooled 131 can be improved.

[0079] Continuing to refer to Figure 1 , Figure 2 and Figure 3In one specific embodiment, the first fin 121 can be disposed on the side of each of the plurality of second fins 126 away from the substrate 125 at its free end. The free end of the second fin 126 can be understood as the end of the second fin 126 away from the substrate. Exemplarily, the projections of the plurality of first fins 121 onto the surface of the substrate 125 and the projections of the plurality of second fins 126 onto the surface of the substrate 125 can overlap. This design improves the structural compactness of the heat dissipation device 120, reducing its space occupation within the power device 100. Furthermore, in the ventilation direction of the second cavity 113, the first fins 121 and the second fins 126 are approximately at the same height. Therefore, the low-temperature air entering the second cavity 113 from the air inlet 1131 can pass through the first fins 121 and the second fins 126 approximately synchronously, ensuring that the temperatures of the two sets of fins do not affect each other, thus improving the heat dissipation effect of the heat dissipation device.

[0080] Please refer to the above. Figure 4 and Figure 5 As shown, Figure 4 This is a side sectional view of another power device 100 provided in an embodiment of this application. Figure 5 for Figure 4 The diagram shows a top-view cross-sectional view of the power device 100. In this embodiment, the heat dissipation device may further include a second fan 127, which may be disposed within the first cavity 112 and positioned near the first opening 1111. The devices disposed within the first cavity 112 may also include a second heat-dissipating device 133 and a third heat-dissipating device 134. The second heat-dissipating device 133 may be disposed between the first opening 1111 and the air inlet side of the second fan 127, and the third heat-dissipating device 134 may be disposed between the air outlet side of the second fan 127 and the second opening 1112. In one implementation, the second heat-dissipating device 133 may be located at one end of the third heat-dissipating device 134 along a second direction, and the third heat-dissipating device 134 may be located on the side of the first heat-dissipating device 131 facing away from the partition 111.

[0081] The air in the first fin 121 after heat exchange and cooling enters the first cavity 112 through the first opening 1111, and the low-temperature air can first pass through the second device to be cooled, exchanges heat with the second device to be cooled, and then is blown by the second fan 127 to the third device to be cooled, so as to further exchange heat with the third device to be cooled, and then flows to the first fin 121 through the second opening 1112, completing a cycle. Through this arrangement, the position of the device to be cooled in the first cavity 112 can be arranged according to the heat dissipation priority or heat dissipation amount of the device to be cooled in the first cavity 112. For example, the device to be cooled with relatively high heat dissipation priority can be placed upstream of the device to be cooled with relatively low heat dissipation priority, or the device to be cooled with relatively small heat dissipation amount can be placed upstream of the device to be cooled with relatively large heat dissipation amount, so as to ensure the heat dissipation effect of each device to be cooled.

[0082] Exemplarily, the second device to be cooled 133 can be an electrolytic capacitor board, and the third device to be cooled 134 can be an output board. It should be noted that the reference numerals of the electrolytic capacitor board below are the same as those of the second device to be cooled 133, and the reference numerals of the output board are the same as those of the third device to be cooled 134. One or more electrolytic capacitors 135 can be arranged on the electrolytic capacitor board 133, and relays, common-mode inductors, capacitors and other devices can be arranged on the output board 134. The electrolytic capacitor 135 has relatively small heat dissipation amount, so it is arranged upstream of the heat dissipation circuit. The low-temperature air entering the first cavity 112 through the first opening 1111 can still be at a relatively low temperature after heat exchange with the electrolytic capacitor 135, so that the downstream devices can still achieve good heat dissipation effect. Moreover, since the electrolytic capacitor 135 is a heat-sensitive device, placing it at the first opening 1111 can reduce the risk of failure of the electrolytic capacitor 135 due to high temperature, thereby improving the overall use reliability of the power device 100.

[0083] In some embodiments, the heat dissipation device can further include a third flow guide member 128 arranged in the first cavity 112, and one end of the third flow guide member 128 can be in communication with the first opening 1111, and the position of the third flow guide member 128 facing the third device to be cooled 134 is provided with a first air outlet (not shown in the figure). At this time, the second device to be cooled 133 can be arranged in the third flow guide member 128, and the second fan 127 can be arranged at the first air outlet of the third flow guide member 128, and the air inlet side of the second fan 127 is opposite to the first air outlet, so as to blow the air in the third flow guide member 128 to the third device to be cooled 134. By arranging the third flow guide member 128, the second device to be cooled 133 can be limited in a relatively closed space, reducing the risk of air flowing back to the vicinity of the second device to be cooled 133 on the air outlet side of the second fan 127, thereby helping to further improve the heat dissipation effect of the second device to be cooled 133.

[0084] Figure 6 for Figure 4 The first cavity 112 of the power device 100 shown is in a cross-sectional view perpendicular to a third direction. (See also...) Figure 4 to Figure 6 In this embodiment, the second heat-dissipating device 133 can be arranged approximately parallel to the third heat-dissipating device 134. When the second heat-dissipating device 133 is an electrolytic capacitor plate and the third heat-dissipating device 134 is an output plate, the electrolytic capacitor plate 133, the output plate 134 and the power plate 132 can be parallel to each other, and the output plate 134 is located on the side of the power plate 132 away from the partition 111.

[0085] Please refer to the above. Figure 7 and Figure 8 As shown, Figure 7 A top-view cross-sectional view of another power device 100 provided in an embodiment of this application. Figure 8 for Figure 7 The first cavity 112 of the power device 100 shown is in a cross-sectional view perpendicular to a third direction. In this embodiment, the heat dissipation device of the power device 100 can be referenced. Figure 4 to Figure 6 The embodiment shown is configured differently, except that in this embodiment, the second heat-dissipating device 133 and the third heat-dissipating device 134 can be arranged approximately perpendicularly. When the second heat-dissipating device 133 is an electrolytic capacitor plate and the third heat-dissipating device 134 is an output plate, the electrolytic capacitor plate 133 can be arranged parallel to the first direction, and the output plate 134 can still be located on the side of the power plate 132 away from the partition and parallel to the power plate 132.

[0086] Please refer to the above. Figure 9 and Figure 10 As shown, Figure 9 A top-view cross-sectional view of another power device 100 provided in an embodiment of this application. Figure 10 for Figure 9The first cavity 112 of the power device 100 shown in FIG. 1 is shown in a cross-sectional view perpendicular to the third direction. In this embodiment, the heat dissipation device can further include a third fan 129 and a fourth flow guide member 1210, both of which can be disposed in the first cavity 112 and close to the second opening 1112. One end of the fourth flow guide member 1210 can be in communication with the second opening 1112, and the fourth flow guide member 1210 can be provided with a second air outlet (not shown in the figure) toward the position of the third device to be cooled 134. The third fan 129 can be disposed at the second air outlet, and the air inlet side of the third fan 129 is disposed toward the third device to be cooled 134, and the air outlet side of the third fan 129 is opposite the second air outlet, so that the high-temperature air after heat exchange with the third device to be cooled 134 is sent into the fourth flow guide member 1210 and further flows into the channel of the first fin 121 for heat exchange and cooling.

[0087] In a specific embodiment, the third fan 129 and the second fan 127 can be arranged on the two sides of the first cavity 112 along the second direction. At this time, the fourth flow guide member 1210 and the third flow guide member 128 are also arranged opposite to each other along the second direction. This embodiment can improve the air flow rate in the first cavity 112, thereby improving the heat dissipation efficiency of each device to be cooled in the first cavity 112, and on the other hand, the arrangement of the third fan 129 and the fourth flow guide member 1210 can further reduce the risk of air backflow around the second device to be cooled 133, which helps to improve the use reliability of the second device to be cooled 133.

[0088] In addition, in this embodiment, the second device to be cooled 133 can be arranged substantially parallel to the third device to be cooled 134. When the second device to be cooled 133 is an electrolytic capacitor plate and the third device to be cooled 134 is an output plate, the electrolytic capacitor plate 133, the output plate 134 and the power plate 132 can be parallel to each other, and the output plate 134 is located on the side of the power plate 132 away from the partition plate.

[0089] Of course, in other embodiments, the second device to be cooled and the third device to be cooled can also be arranged substantially perpendicular to each other as shown in Figure 7 and Figure 8 When the second device to be cooled is an electrolytic capacitor plate and the third device to be cooled is an output plate, the electrolytic capacitor plate can be arranged parallel to the first direction, and the output plate can still be located on the side of the power plate away from the partition plate and parallel to the power plate.

[0090] Referring to Figure 11 and Figure 12 , Figure 11 is another power device 100 provided by the embodiment of the present application in a cross-sectional view in a top view, Figure 12for Figure 11 The first cavity 112 of the power device 100 shown is in a cross-sectional view perpendicular to a third direction. (As described above) Figure 9 to Figure 10 Compared to the illustrated embodiment, this embodiment omits the third airflow guide component. In this case, to facilitate the installation of the second fan 127, a mounting plate 1211 can be provided inside the first cavity 112. This mounting plate 1211 is positioned between the second heat-dissipating device 133 and the third heat-dissipating device 134, and a third air vent (not shown in the figure) can be provided on the mounting plate 1211. In this case, the second heat-dissipating device 133 can be isolated in the space between the side wall of the housing and the mounting plate 1211. The second fan 127 is positioned at the third air vent of the mounting plate 1211, with the air inlet side of the second fan 127 facing the third air vent, so as to blow the air between the side wall and the mounting plate 1211 towards the third heat-dissipating device 134. This solution also reduces the risk of air from the exhaust side of the second fan 127 flowing back to the vicinity of the second heat-dissipating device 133, thereby helping to improve the heat dissipation effect on the second heat-dissipating device 133.

[0091] Similarly, in this embodiment, the second heat-dissipating device 133 and the third heat-dissipating device 134 can be arranged substantially parallel to each other. When the second heat-dissipating device 133 is an electrolytic capacitor plate and the third heat-dissipating device 134 is an output plate, the electrolytic capacitor plate 133, the output plate 134 and the power plate 132 can be parallel to each other, and the output plate 134 is located on the side of the power plate 132 away from the partition.

[0092] Of course, in some other implementation methods, reference can also be made. Figure 7 and Figure 8 The arrangement shown allows the second and third heat-dissipating devices to be positioned approximately perpendicularly. When the second heat-dissipating device is an electrolytic capacitor plate and the third heat-dissipating device is an output board, the electrolytic capacitor plate can be positioned parallel to the first direction, and the output board can still be located on the side of the power board away from the partition and parallel to the power board.

[0093] Please refer to the above. Figure 13 , Figure 14 and Figure 15 As shown, Figure 13 This is a side sectional view of another power device 100 provided in an embodiment of this application. Figure 14 for Figure 13 The power device 100 shown is a cross-sectional view in a top view. Figure 15 for Figure 14A partial structure schematic diagram of the heat dissipation device 120 is shown in FIG. 12. In this embodiment, the heat dissipation device 120 can also include the first fins 121, the substrate 125, the second fins 126, the first flow guide member 123, the second flow guide member 124, the first fan 122, and the like. Different from the foregoing embodiments, the second fins 126 in this embodiment can be designed as two parts with different heights, i.e., a first part and a second part, and the two-part second fins 126 are arranged along the first direction. Among them, the height of the second fins 1261 in the first part is less than the height of the second fins 1262 in the second part. It should be noted that the height direction of the second fins 126 here can be understood as the direction away from the substrate 125, i.e., the third direction defined above. At this time, the first fins 121 can be arranged on the side away from the substrate 125 of the free end of each second fin 1261 in the first part. That is, the projection of the plurality of first fins 121 on the surface of the substrate 125 can overlap the projection of the plurality of second fins 1261 in the first part on the surface of the substrate 125, and this design can also achieve the effect of improving the compactness of the heat dissipation device.

[0094] In addition, it should be noted that in this embodiment, the third flow guide member, the fourth flow guide member 1210, and the second fan and the third fan 129 can be selectively arranged according to the heat dissipation requirement in the first cavity, Figure 14 In FIG. 12, only the case of arranging the fourth flow guide member 1210 and the third fan 129 in the first cavity 112 is schematically shown.

[0095] Referring to FIGS. 1, Figure 16 、 Figure 17 and Figure 18 together, Figure 16 is another side cross-sectional view of the power device 100 provided by the embodiments of the present application, Figure 17 is a cross-sectional view of the power device 100 shown in FIG. 1 in a top view state, Figure 16 is a cross-sectional view of the power device 100 shown in FIG. 1 in a top view state, Figure 18 is a cross-sectional view of the power device 100 shown in FIG. 1 in a top view state, Figure 16FIG. 12 is a schematic diagram of a partial structure of the heat dissipation device 120 shown in FIG. 11. In the present embodiment, the heat dissipation device 120 can also include the first fin 121, the substrate 125, the second fin 126, the first flow guide member 123, the second flow guide member 124, the first fan 122, and the like. Different from the foregoing embodiments, in the present embodiment, the outer contour of the substrate 125 can cover the first opening 1111 and the second opening 1112 in the projection on the partition surface. In other words, the projection of the line constituting the outer edge of the substrate 125 on the partition surface can cover the first opening 1111 and the second opening 1112. At this time, in order to communicate the first flow guide member 123 and the second flow guide member 124 with the first cavity 112, the substrate 125 can be provided with the first avoiding hole 1251 and the second avoiding hole 1252 at positions opposite to the first opening 1111 and the second opening 1112, respectively. Exemplarily, the end of the first flow guide member 123 can pass through the first avoiding hole 1251 to communicate with the first opening 1111, and the end of the second flow guide member 124 can pass through the second avoiding hole 1252 to communicate with the second opening 1112. Such a design can increase the area of the substrate 125, thereby facilitating the improvement of the heat dissipation effect on the first device to be cooled 131.

[0096] Referring to FIGS. 1-3 Figure 19 , Figure 20 and Figure 21 together, Figure 19 is another side sectional view of the power device 100 provided by the present embodiment, Figure 20 is a sectional view of the power device 100 shown in FIG. 1 in a top view state, Figure 19 is a schematic diagram of a partial structure of the heat dissipation device 120 shown in FIG. 1. In the present embodiment, the first fin 121 and the second fin 126 can adopt the arrangement manner in the embodiments shown in FIGS. 2 and 3, and different from the embodiments shown in FIGS. 4 and 5, in the present embodiment, the outer contour of the substrate 125 can also cover the first opening 1111 and the second opening 1112 in the projection on the partition surface, and the first avoiding hole 1251 and the second avoiding hole 1252 can be respectively arranged on the substrate at positions opposite to the first opening 1111 and the second opening 1112, so as to facilitate the communication of the first flow guide member 123 and the second flow guide member 124 with the first cavity 112. Figure 21 Figure 19 Referring to FIGS. 1-3 Figure 12 and Figure 13 together, Figure 12 is another side sectional view of the power device 100 provided by the present embodiment, Figure 13 is a sectional view of the power device 100 shown in FIG. 1 in a top view state, is a schematic diagram of a partial structure of the heat dissipation device 120 shown in FIG. 1. In the present embodiment, the first fin 121 and the second fin 126 can adopt the arrangement manner in the embodiments shown in FIGS. 2 and 3, and different from the embodiments shown in FIGS. 4 and 5, in the present embodiment, the outer contour of the substrate 125 can also cover the first opening 1111 and the second opening 1112 in the projection on the partition surface, and the first avoiding hole 1251 and the second avoiding hole 1252 can be respectively arranged on the substrate at positions opposite to the first opening 1111 and the second opening 1112, so as to facilitate the communication of the first flow guide member 123 and the second flow guide member 124 with the first cavity 112.

[0097] Figure 22 Referring to FIGS. 1-3 Figure 23 and Figure 22 together, Figure 23 is another side sectional view of the power device 100 provided by the present embodiment, Figure 22 ​A sectional view of the power device 100 in a top view, Figure 24 For Figure 22 A partial structure schematic diagram of the heat dissipation device 120 is shown in FIG. 12. In this embodiment, the heat dissipation device can include the first fins 121, the substrate 125, the second fins 126 and the first fan 122 structure, and the positional relationship of each component can refer to the description in the foregoing embodiments, which will not be described herein. Different from the foregoing embodiments, in this embodiment, the first fins 121 and the second fins 126 can both adopt a solid sheet structure, and the first fins 121 are no longer in communication with the first cavity 112. At this time, the heat dissipation device further includes the first support 1212 and the second support 1213, which are oppositely arranged in the second cavity 113 along the second direction, and one end of each of the first support 1212 and the second support 1213 is fixedly connected with the substrate 125, and the other end of each of the first support 1212 and the second support 1213 is fixedly connected with two ends of each of the first fins 121, so as to support the first fins 121 on the side of the second fins 126 away from the substrate 125.

[0098] In this embodiment, when the first device to be cooled 131 generates heat, a part of the heat can be directly transferred to the second fins 126 through the substrate 125, and another part of the heat can be transferred to the first support 1212 and the second support 1213 through the substrate 125, and further transferred to the first fins 121 by the first support 1212 and the second support 1213. After the external air enters the second cavity 113 through the air inlet 1131, the air exchanges heat with the first fins 121 and the second fins 126 respectively, and is finally discharged from the air outlet 1132, so as to take away the heat of the first fins 121 and the second fins 126. It can be seen that in this embodiment, the first fins 121 and the second fins 126 are both used for cooling the first device to be cooled 131, so as to improve the cooling effect on the first device to be cooled 131.

[0099] In addition, it should be noted that in the foregoing embodiments, the fourth device to be cooled 136 can also be arranged in the second cavity 113 of the power device 100, and the fourth device to be cooled 136 can be arranged on the side of the first fins 121 facing the air outlet 1132, i.e., located downstream of the ventilation path of the second cavity 113, so that the low-temperature air entering the second cavity 113 can first exchange heat with the first fins 121 and the second fins 126, so as to ensure the cooling effect on the devices in the first cavity 112, and since the protection requirement of the fourth device to be cooled 136 is relatively low, arranging the fourth device to be cooled 136 downstream of the cooling path can also achieve a certain cooling effect and ensure the normal operation of the fourth device to be cooled 136. Exemplarily, the fourth device to be cooled 136 can be a magnetic device, such as an inductor.

[0100] It should be understood that in the embodiments of the present application, the devices arranged in the first cavity are not limited to the first, second and third devices to be cooled mentioned above, and similarly, the devices arranged in the second cavity are not limited to the fourth device to be cooled mentioned above. In actual applications, the matched devices can be arranged according to the specific types of power devices, and details are not described herein.

[0101] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A power device (100), characterized in that, Includes a housing (110) and a heat dissipation device (120), wherein: The housing (110) is provided with a partition (111), which divides the housing (110) into a first cavity (112) and a second cavity (113). The partition (111) is provided with a first opening (1111) and a second opening (1112) that connect the first cavity (112) and the second cavity (113). The first cavity (112) is provided with a heat dissipation device, and the second cavity (113) is provided with an air inlet (1131) and an air outlet (1132). The heat dissipation device (120) includes a first fin (121) disposed in the second cavity (113), the surface of the first fin (121) facing the partition (111), a channel disposed in the first fin (121), the channel penetrating the first fin (121) along a second direction; the two ends of the channel are respectively connected to the first opening (1111) and the second opening (1112); The heat dissipation device in the first cavity (112) includes a first heat dissipation device (131), which is disposed close to the partition (111); The heat dissipation device (120) further includes a substrate (125) and a plurality of second fins (126). The substrate (125) is disposed on the partition and is in thermal contact with the first heat dissipation device (131). The second fins (126) are disposed on the side of the substrate (125) away from the partition (111) and extend in a direction away from the partition (111). An air duct extending in a first direction is formed between adjacent second fins (126). The minimum angle between the second direction and the first direction is greater than 0° and less than or equal to 90°.

2. The power device (100) as claimed in claim 1, characterized in that, There are multiple first fins (121), and air ducts extending along the first direction are formed between adjacent first fins (121).

3. The power device (100) as described in claim 1 or 2, characterized in that, The heat dissipation device (120) further includes a first flow guide (123) and a second flow guide (124) disposed in the second cavity (113). One end of the first flow guide (123) is connected to the first opening (1111) and the other end is connected to one end of the channel. One end of the second flow guide (124) is connected to the second opening (1112) and the other end is connected to the other end of the channel.

4. The power device (100) as claimed in claim 1, characterized in that, The first fin (121) is disposed on the side of the free end of each of the plurality of second fins (126) away from the substrate (125).

5. The power device (100) as claimed in claim 1, characterized in that, The plurality of second fins (126) are divided into a first part and a second part. Along the direction away from the substrate (125), the height of the second fin (1261) located in the first part is less than the height of the second fin (1262) located in the second part. The first fin is disposed on the side of the free end of each of the second fins within the first portion, away from the substrate.

6. The power device (100) as claimed in claim 1, characterized in that, The projection of the outer contour of the substrate (125) onto the surface of the partition (111) lies between the first opening (1111) and the second opening (1112); or, The area enclosed by the projection of the outer contour of the substrate (125) onto the surface of the partition (111) covers the first opening (1111) and the second opening (1112). The substrate is provided with a first clearance hole and a second clearance hole at the positions corresponding to the first opening (1111) and the second opening (1112), respectively.

7. The power device (100) as claimed in claim 1, characterized in that, The partition (111) has an opening corresponding to the position of the first heat dissipation device (131), and the first heat dissipation device (131) extends into the opening and makes thermal contact with the substrate (125).

8. The power device (100) as claimed in claim 1, characterized in that, The heat dissipation device (120) further includes a first fan (122) disposed in the second cavity (113), with the air inlet side of the first fan (122) facing the air inlet (1131) and the air outlet side of the first fan (122) facing the air outlet (1132).

9. The power device (100) as claimed in claim 1, characterized in that, The heat-dissipating devices in the first cavity (112) include a second heat-dissipating device (133) and a third heat-dissipating device (134); The heat dissipation device (120) further includes a second fan (127) disposed in the first cavity (112), the second heat dissipation device (133) is disposed between the first opening (1111) and the air inlet side of the second fan (127), the third heat dissipation device (134) is disposed between the air outlet side of the second fan (127) and the second opening (1112), and the third heat dissipation device (134) is located on the side of the first heat dissipation device (131) away from the partition (111).

10. The power device (100) as claimed in claim 9, characterized in that, The heat dissipation device (120) further includes a third flow guide member (128) disposed in the first cavity (112), the third flow guide member (128) is connected to the first opening (1111), and the third flow guide member (128) is provided with a first air vent facing the third heat dissipation device (134); The second heat dissipation device (133) is disposed inside the third air guiding member (128), the second fan (127) is disposed at the first air outlet, and the air inlet side of the second fan (127) is disposed opposite to the first air outlet.

11. The power device (100) as claimed in claim 1, characterized in that, The heat dissipation device in the first cavity (112) includes a third heat dissipation device (134), which is disposed between the first opening (1111) and the second opening (1112) and is located on the side of the first heat dissipation device (131) away from the partition (111). The heat dissipation device (120) further includes a third fan (129) and a fourth air guide member (1210) disposed in the first cavity (112). The fourth air guide member (1210) is connected to the second opening (1112), and the fourth air guide member (1210) is provided with a second air vent facing the third heat dissipation device (134). The third fan (129) is located at the second air outlet, with the air inlet side of the third fan (129) facing the third heat dissipation device (134) and the air outlet side of the third fan (129) facing the second air outlet.

12. The power device (100) as claimed in claim 9, characterized in that, The second heat-dissipating device (133) is an electrolytic capacitor plate; and / or, the third heat-dissipating device (134) is an output plate.

13. The power device (100) as claimed in claim 1, characterized in that, The second cavity (113) is provided with a fourth heat dissipation device (136), which is located on the side of the first fin (121) facing the air outlet (1132).

14. A photovoltaic system, characterized in that, Includes a solar panel and a power device (100) as described in any one of claims 1 to 13, the solar panel being used to convert solar energy into electrical energy, and the power device being used to convert current and / or voltage from the solar panel.

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