Circuit board surface mounting device

Abstract

A circuit board surface mounting device comprises an electric roller (1) in which a mounting through groove (2) is formed; the plurality of surface-mounted device adsorption modules (3) are respectively arranged in the mounting through grooves (2), each surface-mounted device adsorption module (3) comprises a limiting sliding rod (31), a first vacuum chuck (32) and a universal ball (33), the limiting sliding rod (31) is connected with the mounting through groove (2) through a spring (34), the first vacuum chuck (32) is arranged at one end of the limiting sliding rod (31), the universal ball (33) is arranged at the other end of the limiting sliding rod (31), and the first vacuum chuck (32) is connected with the universal ball (33). The first vacuum chuck (32) is used for adsorbing the surface-mounted device; the electric push rod (4) is arranged in the mounting through groove (2); and the circular truncated cone pushing piece (5) is arranged at the driving end of the electric push rod (4) and is in abutting connection with the universal ball (33). Therefore, the surface mounting device on the surface mounting winding tape can be grabbed during surface mounting, and the surface mounting efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and particularly relates to a circuit board chip mounter. Background Art

[0002] The main function of circuit board chip mounting is to mount electronic components onto the circuit board. In the related art, a vacuum adsorption module is used to grasp the mounting devices in the tray, and a driving module is used to mount the mounting devices on the vacuum adsorption module onto the circuit board. However, currently, the transportation of mounting devices often adopts the form of a tape. When using this chip mounting method, before the chip mounting work, it is necessary to take out the mounting devices in the tape and place them in the tray, which increases the process, and only after one chip mounting is completed can the next mounting device be grasped, reducing the work efficiency. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems in the above technologies to a certain extent.

[0004] For this reason, the purpose of the present invention is to propose a circuit board chip mounter that can grasp the mounting devices on the chip mounting tape while mounting, with high chip mounting efficiency.

[0005] To achieve the above object, the present invention proposes a circuit board chip mounter, including: an electric roller, in which an installation through groove is provided; a plurality of mounting device adsorption modules, which are respectively arranged in the installation through groove, and the mounting device adsorption module includes: a limit slide bar, a first vacuum suction cup, and a universal ball. Among them, the limit slide bar is connected to the installation through groove through a spring, the first vacuum suction cup is arranged at one end of the limit slide bar, and the universal ball is arranged at the other end of the limit slide bar. Among them, the first vacuum suction cup is used to adsorb the mounting device; an electric push rod, which is arranged in the installation through groove; a frustum pushing member, which is arranged at the driving end of the electric push rod and is in contact connection with the universal ball.

[0006] In an embodiment of the present invention, the installation through groove includes: a groove, a communication groove, and a cavity. Among them, the groove is opened on the surface of the electric roller, a cavity is opened inside the electric roller, and the groove is connected to the cavity through the communication groove.

[0007] In an embodiment of the present invention, one end of the spring is connected to the lower inner wall of the groove, the other end of the spring is connected to the first vacuum suction cup, the limit slide bar sequentially passes through the groove and the communication groove and extends into the cavity, and the electric push rod and the frustum pushing member are respectively arranged in the cavity.

[0008] In an embodiment of the present invention, a limit ring is arranged in the groove, and the first vacuum suction cup is in contact connection with the limit ring.

[0009] In an embodiment of the present invention, it further includes: a feeding assembly, which is arranged above the electric roller. The feeding assembly includes: a material roller, a first waste tape winding roller, a first electric telescopic rod, a second waste tape winding roller, a second electric telescopic rod, and a second vacuum suction cup. Wherein, a patch material tape is wound around the material roller, a carrier tape is wound around the first waste tape winding roller, the first electric telescopic rod is arranged below the material roller, the second waste tape winding roller is arranged at the driving end of the first electric telescopic rod, a cover tape is wound around the second waste tape winding roller, the second electric telescopic rod is arranged above the patch material tape, the second vacuum suction cup is arranged at the driving end of the second electric telescopic rod, and the second vacuum suction cup is used to adsorb the mounting device from the back of the carrier tape.

[0010] In an embodiment of the present invention, it further includes: a housing, a hydraulic telescopic device, and an XY electric platform. Wherein, the feeding assembly and the electric roller are respectively arranged inside the housing, the housing is arranged at the telescopic end of the hydraulic telescopic device, and the hydraulic telescopic device is arranged on the XY electric platform.

[0011] In an embodiment of the present invention, it further includes: a conveyor belt assembly and a plurality of circuit board placement devices. Wherein, the conveyor belt assembly is arranged below the electric roller, and the plurality of circuit board placement devices are respectively arranged on the conveyor belt assembly.

[0012] In an embodiment of the present invention, the circuit board placement device includes: a workbench, a plurality of third electric telescopic rods, and a plurality of clamping plates. The plurality of third electric telescopic rods and the plurality of clamping plates correspond one by one. Wherein, the workbench is arranged on the conveyor belt assembly, the plurality of third electric telescopic rods are respectively arranged on the workbench, and the clamping plate is arranged at the driving end of the third electric telescopic rod.

[0013] In an embodiment of the present invention, a plurality of the installation through slots, the plurality of mounting device suction modules, the electric push rods, and the frustum pushers are respectively arranged on the electric roller.

[0014] Advantages of the present invention: When the electric push rod pushes the frustum pusher to move, a plurality of universal balls can drive the limit slide rod to push the first vacuum suction cup out of the installation through slot by sliding on the inclined side surface of the frustum pusher. The first vacuum suction cup that is pushed out of the installation through slot and faces the circuit board can perform patch processing on the mounting device, while the first vacuum suction cup that faces the patch material tape adsorbs and grabs the mounting device. The mounting device on the patch tape is grabbed while mounting, and the patch efficiency is high.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0016] The above-mentioned and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of embodiments in conjunction with the drawings, wherein: Figure 1 It is a schematic structural diagram of a circuit board chip mounting device according to an embodiment of the present invention; Figure 2 It is a schematic cross-sectional structural diagram of a circuit board chip mounting device according to an embodiment of the present invention; Figure 3 It is a schematic cross-sectional structural diagram of a circuit board chip mounting device according to another embodiment of the present invention; Figure 4 It is a schematic structural diagram of a circuit board chip mounting device according to another embodiment of the present invention.

[0017] As shown in the figure: 1. Electric roller, 2. Installation through groove, 21. Groove, 22. Communication groove, 23. Cavity, 3. Chip mounting device adsorption module, 31. Limit slide bar, 32. First vacuum suction cup, 33. Universal ball, 34. Spring, 4. Electric push rod, 5. Frustum push piece, 6. Limit ring, 7. Feeding component, 71. Material roller, 72. First waste tape winding roller, 73. First electric telescopic rod, 74. Second waste tape winding roller, 75. Second electric telescopic rod, 76. Second vacuum suction cup, 8. Chip mounting tape, 9. Carrier tape, 10. Cover tape, 11. Shell, 12. Hydraulic telescopic device, 13. XY electric platform, 14. Conveyor belt component, 15. Circuit board placement device, 151. Workbench, 152. Third electric telescopic rod, 153. Clamping plate. Detailed Embodiments

[0018] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0019] The circuit board chip mounting device according to the embodiment of the present invention will be described below with reference to the drawings.

[0020] As Figure 1 、 Figure 2 and Figure 3 shown, the circuit board chip mounting device according to the embodiment of the present invention may include: an electric roller 1, a plurality of chip mounting device adsorption modules 3, an electric push rod 4, and a frustum push piece 5.

[0021] An installation through groove 2 is provided inside the electric roller 1. The electric push rod 4 is arranged inside the installation through groove 2. The frustum-shaped pushing member 5 is arranged at the driving end of the electric push rod 4 and is in contact connection with the universal ball 33. A plurality of component mounting adsorption modules 3 are respectively arranged inside the installation through groove 2. The component mounting adsorption module 3 includes: a limiting slide rod 31, a first vacuum suction cup 32, and a universal ball 33. Among them, the limiting slide rod 31 is connected to the installation through groove 2 through a spring 34. The first vacuum suction cup 32 is arranged at one end of the limiting slide rod 31, and the universal ball 33 is arranged at the other end of the limiting slide rod 31. Among them, the first vacuum suction cup 32 is used for adsorbing the component to be mounted.

[0022] It should be noted that in this embodiment, the frustum-shaped pushing member 5 is in the shape of a frustum column. A plurality of universal balls 33 are all in contact connection with the inclined side surface of the frustum-shaped pushing member 5. When the electric push rod 4 pushes the frustum-shaped pushing member 5 to move horizontally, through the rolling of the universal balls 33 on its inclined side surface, the first vacuum suction cup 32 can be pushed out of the installation through groove 2 through the limiting slide rod 31. The first vacuum suction cup 32 that is pushed out of the installation through groove 2 performs the adsorption and grasping or chip mounting process of the component to be mounted.

[0023] Furthermore, a recessed groove is provided at the bottom end (the end with a larger surface area) of the frustum-shaped pushing member 5. The electric push rod 4 can be inserted into the recessed groove, and the driving end of the electric push rod 4 is connected to the inner wall of the recessed groove.

[0024] In an embodiment of the present invention, as Figure 2 and Figure 3 shown, the installation through groove 2 may include: a groove 21, a communication groove 22, and a cavity 23. Among them, the groove 21 is provided on the surface of the electric roller 1, a cavity 23 is provided inside the electric roller 1, and the groove 21 is connected to the cavity 23 through the communication groove 22. One end of the spring 34 is connected to the lower inner wall of the groove 21, the other end of the spring 34 is connected to the first vacuum suction cup 32. The limiting slide rod 31 sequentially passes through the groove 21 and the communication groove 22 and extends into the cavity 23. The electric push rod 4 and the frustum-shaped pushing member 5 are respectively arranged inside the cavity 23. A limiting ring 6 is arranged inside the groove 21, and the first vacuum suction cup 32 is in contact connection with the limiting ring 6.

[0025] It can be understood that the elastic potential energy of the spring 34 described in this embodiment can pull the first vacuum suction cup 32 towards the limiting ring 6. When the frustum-shaped pushing member 5 does not exert a thrust on the limiting slide rod 31, the spring 34 can fix the first vacuum suction cup 32 inside the groove 21.

[0026] In an implementation of the present invention, as Figure 1 and Figure 2As shown, it may also include: a feeding assembly 7, which is arranged above the electric roller 1, and the feeding assembly 7 may include: a material roller 71, a first waste tape winding roller 72, a first electric telescopic rod 73, a second waste tape winding roller 74, a second electric telescopic rod 75 and a second vacuum suction cup 76, wherein a patch material tape 8 is wound around the material roller 71, a carrier tape 9 is wound around the first waste tape winding roller 72, the first electric telescopic rod 73 is arranged below the material roller 71, the second waste tape winding roller 74 is arranged at the driving end of the first electric telescopic rod 73, a cover tape 10 is wound around the second waste tape winding roller 74, the second electric telescopic rod 75 is arranged above the patch material tape 8, and the second vacuum suction cup 76 is arranged at the driving end of the second electric telescopic rod 75, and the second vacuum suction cup 76 is used to adsorb the mounting device from the back of the carrier tape 9.

[0027] It should be noted that the carrier tape 9 described in this embodiment is a tape made of plastic with grooves 21, which is used to fix and protect electronic components. The size and shape of the grooves 21 are designed according to the specific components loaded. The cover tape 10 is a transparent or translucent tape covering the carrier tape 9 to prevent the components from falling off or shifting during transportation and handling.

[0028] Specifically, before performing the patch work, the patch tape reel can be installed on the material roller 71, one end of the carrier tape 9 of the patch material tape 8 is fixed on the first waste tape winding roller 72, one end of the cover tape 10 of the patch material tape 8 is fixed on the second waste tape winding roller 74, the second electric telescopic rod 75 controls the second vacuum suction cup 76 to absorb the patch device from the back side of the patch material tape 8, the first electric telescopic rod 73 uncovers the cover tape 10 through the second waste tape winding roller 74, and the second waste tape winding roller 74 can wind the uncovered cover tape 10.

[0029] The electric push rod 4 pushes the round table pusher 5 to move in the cavity 23. The moving round table pusher 5 can make the universal ball 33 roll on the oblique side of the round table pusher 5. The universal ball 33 pushes the first vacuum suction cup 32 out of the installation slot 2 through the limit slide bar 31. The first vacuum suction cup 32 pushed out of the installation slot 2 and facing the circuit board performs SMT processing on the SMT device, while the first vacuum suction cup 32 facing the SMT material strip 8 absorbs and grabs the SMT device. After a SMT is completed, the round table pusher 5 is controlled to reset, and the spring 34 pulls the corresponding first vacuum suction cup 32 back into the groove 21 (when the first vacuum suction cup 32 that has just been sucked and grabbed retracts, the second vacuum suction cup 76 no longer absorbs the SMT device), and the electric roller 1 rotates to move the first vacuum suction cup 32 that has already absorbed the SMT device toward the circuit board. By repeating the above process, the mounted components can be adsorbed and grabbed while the chips are being mounted, thereby improving the efficiency of the mounting. At the same time, the mounted components can be directly obtained from the material tape, reducing the process of removing the mounted components from the material tape and placing them on the tray, thereby further improving the efficiency of the mounting.

[0030] In one embodiment of the present invention, as Figure 1 and Figure 4 shown, it may further include: a housing 11, a hydraulic telescopic device 12, and an XY electric platform 13. Among them, the feeding assembly 7 and the electric roller 1 are respectively arranged inside the housing 11. The housing 11 is arranged at the telescopic end of the hydraulic telescopic device 12, and the hydraulic telescopic device 12 is arranged on the XY electric platform 13. A mounting through groove 2, a plurality of mounting device adsorption modules 3, an electric push rod 4, and a frustum pushing member 5 are respectively provided with a plurality on the electric roller 1.

[0031] It can be understood that the hydraulic telescopic device 12 described in this embodiment can adjust the Z-direction movement of the feeding assembly 7 and the electric roller 1 through the housing 11, and the XY electric platform 13 can control the X- and Y-direction movement of the feeding assembly 7 and the electric roller 1 by adjusting the position of the hydraulic telescopic device 12. By moving the electric roller 1 in the X, Y, and Z directions, the working position of the mounting device adsorption module 3 that adsorbs different mounting devices can be adjusted quickly and conveniently.

[0032] In one embodiment of the present invention, it may further include: a conveyor belt assembly 14 and a plurality of circuit board placement devices 15. Among them, the conveyor belt assembly 14 is arranged below the electric roller 1, and the plurality of circuit board placement devices 15 are respectively arranged on the conveyor belt assembly 14. The circuit board placement device 15 may include: a workbench 151, a plurality of third electric telescopic rods 152, and a plurality of clamping plates 153. The plurality of third electric telescopic rods 152 and the plurality of clamping plates 153 correspond one by one. Among them, the workbench 151 is arranged on the conveyor belt assembly 14, the plurality of third electric telescopic rods 152 are respectively arranged on the workbench 151, and the clamping plate 153 is arranged at the driving end of the third electric telescopic rod 152. It should be noted that the workbench 151 is connected to the conveyor belt assembly 14 through a connecting column.

[0033] It should be noted that the electric roller 1, the first waste tape winding roller 72, and the second waste tape winding roller 74 described in this embodiment are all electrically driven roller bodies, which include: a roller body and a motor. The roller body is arranged at the driving end of the motor, and the motor can drive the roller body to rotate. The motor is equipped with a brake, and the motor can be quickly stopped through the brake. A speed reducer is arranged at the driving end of the motor, the driving end of the motor is connected to the input end of the speed reducer, and the output end of the speed reducer constitutes the driving end of the motor. The rotation speed output by the motor is adjusted through the speed reducer.

[0034] In summary, the circuit board chip mounter of the embodiment of the present invention can grasp the mounting devices on the chip tape while mounting, and has high chip mounting efficiency.

[0035] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0037] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A circuit board patch device, characterized in that: include: A motorized roller (1) having a mounting groove (2) formed therein; A plurality of mounting device adsorption modules (3) are respectively arranged in the mounting through slot (2), the mounting device adsorption modules (3) comprising: a limiting slide bar (31), a first vacuum suction cup (32) and a universal ball (33), wherein the limiting slide bar (31) is connected to the mounting through slot (2) via a spring (34), the first vacuum suction cup (32) is arranged at one end of the limiting slide bar (31), and the universal ball (33) is arranged at the other end of the limiting slide bar (31), wherein the first vacuum suction cup (32) is used to adsorb the mounting device; An electric push rod (4) is arranged in the installation slot (2); The truncated table pusher (5) is arranged at the driving end of the electric push rod (4) and is in abutting connection with the universal ball (33).

2. The circuit board mounting device according to claim 1, characterized in that: The mounting through groove (2) comprises: a groove (21), a connecting groove (22) and a cavity (23), wherein the groove (21) is provided on the surface of the electric roller (1), the cavity (23) is provided inside the electric roller (1), and the groove (21) is connected to the cavity (23) via the connecting groove (22).

3. The circuit board mounting device according to claim 2, characterized in that: One end of the spring (34) is connected to the lower inner wall of the groove (21), and the other end of the spring (34) is connected to the first vacuum suction cup (32). The limiting sliding rod (31) sequentially passes through the groove (21) and the connecting groove (22) and extends into the cavity (23). The electric push rod (4) and the round table push member (5) are respectively arranged in the cavity (23).

4. The circuit board mounting device according to claim 2, characterized in that: A limiting ring (6) is arranged in the groove (21), and the first vacuum suction cup (32) and the limiting ring (6) are in abutting connection.

5. The circuit board mounting device according to claim 1, characterized in that: Also includes: A feeding assembly (7) is arranged above the electric roller (1), and comprises: a material roller (71), a first waste tape winding roller (72), a first electric telescopic rod (73), a second waste tape winding roller (74), a second electric telescopic rod (75) and a second vacuum suction cup (76), wherein a patch material tape (8) is wound around the material roller (71), a carrier tape (9) is wound around the first waste tape winding roller (72), the first electric telescopic rod (73) is arranged below the material roller (71), the second waste tape winding roller (74) is arranged at the driving end of the first electric telescopic rod (73), a cover tape (10) is wound around the second waste tape winding roller (74), the second electric telescopic rod (75) is arranged above the patch material tape (8), the second vacuum suction cup (76) is arranged at the driving end of the second electric telescopic rod (75), and the second vacuum suction cup (76) is used to absorb the patch device from the back of the carrier tape (9).

6. The circuit board mounting device according to claim 5, characterized in that: Also includes: A housing (11), a hydraulic telescopic device (12) and an XY electric platform (13), wherein the feeding assembly (7) and the electric roller (1) are respectively arranged in the housing (11), the housing (11) is arranged at the telescopic end of the hydraulic telescopic device (12), and the hydraulic telescopic device (12) is arranged on the XY electric platform (13).

7. The circuit board mounting device according to claim 1, characterized in that: Also includes: A conveyor belt assembly (14) and a plurality of circuit board placement devices (15), wherein the conveyor belt assembly (14) is arranged below the electric roller (1), and the plurality of circuit board placement devices (15) are respectively arranged on the conveyor belt assembly (14).

8. The circuit board mounting device according to claim 7, characterized in that: The circuit board placement device (15) comprises: a workbench (151), a plurality of third electric telescopic rods (152) and a plurality of clamping plates (153), wherein the plurality of third electric telescopic rods (152) and the plurality of clamping plates (153) correspond to each other one by one, wherein the workbench (151) is arranged on the conveyor belt assembly (14), the plurality of third electric telescopic rods (152) are respectively arranged on the workbench (151), and the clamping plates (153) are arranged on the driving ends of the third electric telescopic rods (152).

9. The circuit board mounting device according to claim 1, characterized in that: The installation through groove (2), the plurality of mounting device adsorption modules (3), the electric push rod (4), and the round table pusher (5) are respectively arranged in plurality on the electric roller (1).

Images