Display panel, method for manufacturing display panel, and electronic device

Abstract

Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device, relating to the field of display technology. In the display panel, the thermal expansion coefficient of the packaging unit and the thermal expansion coefficient of the first isolation portion are designed to be equivalent. With this design, even when the temperature changes, the volume changes of the two are also equivalent, that is, the two can expand or contract synchronously. This ensures that the contacting surfaces of the two are always affixed together without any gaps, thereby preventing the first isolation portion and the packaging unit from separating to form a gap when the temperature changes. The packaging of the light-emitting device will not fail due to the gap between the first isolation portion and the packaging unit, thereby ensuring the display effect of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. Due to its excellent color and image quality, it is widely used in various consumer electronic products such as smartphones, TVs, laptops, desktop computers, car displays, wearable devices, etc., and has become the mainstream technology in display panels.

[0003] In traditional display panel manufacturing, pixel patterning is typically achieved using a fine metal mask (FMM). FMM technology is mature and boasts extensive mass production experience. However, FMM also presents challenges such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe FMM-free technology for reference.

[0004] However, the process performance of current OLED display products needs to be further improved. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device.

[0006] In a first aspect of the present application, a display panel is provided, comprising:

[0007] substrate;

[0008] an isolation structure located on the substrate and enclosing an isolation opening on the substrate, the isolation structure comprising a first isolation portion and a second isolation portion stacked in sequence, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0009] a light emitting device, at least partially located within the isolation opening;

[0010] A packaging unit is used to encapsulate the light-emitting device in the isolation opening, and the packaging unit is adhered to the side of the first isolation part facing the corresponding isolation opening, wherein the difference in thermal expansion coefficient between the first isolation part and the packaging unit is within ten percent of the thermal expansion coefficient of the packaging unit.

[0011] In a possible implementation of the present application, the material of the first isolation portion includes at least one metal material;

[0012] Preferably, the material of the first isolation portion includes two metal materials.

[0013] In one possible implementation of the present application, the material of the first isolation portion includes a main metal material and a doped metal material, wherein the mass proportion of the main metal material in the first isolation portion is greater than the mass proportion of the doped metal material in the first isolation portion.

[0014] In a possible implementation of the present application, the main metal material includes aluminum, and the doped metal material includes one of titanium, tungsten, molybdenum, or beryllium; or,

[0015] The main metal material includes copper, and the doped metal material includes tungsten or molybdenum.

[0016] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes titanium, and the mass of the doped metal material accounts for 0.1% to 0.5% of the mass of the main metal material.

[0017] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes iron, and the mass of the doped metal material accounts for 0.1% to 0.3% of the mass of the main metal material.

[0018] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes molybdenum, and the mass of the doped metal material accounts for 0.5% to 2% of the mass of the main metal material.

[0019] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes beryllium, and the mass of the doped metal material accounts for 2%-3% of the mass of the main metal material.

[0020] In a possible implementation manner of the present application, the main metal material includes copper, the doped metal material includes tungsten, and the mass of the doped metal material accounts for 10%-25% of the mass of the main metal material.

[0021] In a possible implementation manner of the present application, the main metal material includes copper, the doped metal material includes molybdenum, and the mass of the doped metal material accounts for 20%-30% of the mass of the main metal material.

[0022] In one possible implementation of the present application, the display panel further includes a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate;

[0023] The pixel defining layer includes a pixel opening, wherein an orthographic projection of the pixel opening on the substrate is located within an orthographic projection of the corresponding isolation opening on the substrate, and at least part of the light emitting device is located within the pixel opening;

[0024] Preferably, the pixel defining layer is an inorganic pixel defining layer;

[0025] Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked-layer structure formed alternately of silicon oxide and silicon nitride;

[0026] Preferably, in a direction away from the substrate, the light-emitting device comprises a first electrode, a light-emitting material layer, and a second electrode that are stacked; wherein the second electrode is electrically connected to the isolation structure;

[0027] The first electrode is disposed on a side of the pixel defining layer close to the substrate, and at least a portion of the first electrode is exposed from the pixel opening;

[0028] Preferably, the isolation structure also includes a third isolation portion, and in the direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate, and the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0029] In a possible implementation manner of the present application, the display panel further includes a first encapsulation layer, the first encapsulation layer is located on a side of the encapsulation unit away from the substrate, and the first encapsulation layer at least covers the encapsulation unit;

[0030] Preferably, the first encapsulation layer comprises a flat surface on a side away from the substrate;

[0031] Preferably, the display panel further comprises a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate;

[0032] Preferably, the encapsulation unit and the second encapsulation layer are inorganic encapsulation layers, and the first encapsulation layer is an organic encapsulation layer.

[0033] A second aspect of the present application further provides a method for preparing a display panel, the method comprising:

[0034] providing a substrate;

[0035] Fabricating an isolation structure and an isolation opening on the substrate, wherein the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0036] A light-emitting device and a packaging unit for packaging the light-emitting device are formed in the isolation opening, and the packaging unit is adhered to the side of the first isolation portion toward the corresponding isolation opening, wherein the difference in thermal expansion coefficient between the first isolation portion and the packaging unit is within ten percent of the thermal expansion coefficient of the packaging unit.

[0037] In one possible implementation manner of the present application, the step of forming the isolation structure and the isolation opening on the substrate includes:

[0038] Sequentially forming a first isolation material layer and a second isolation material layer on the substrate, wherein the first isolation material layer is formed of at least one metal material;

[0039] The first isolation material layer and the second isolation material layer are patterned to obtain the isolation structure and the isolation opening, wherein the second isolation portion is formed by the etched second isolation material layer, and the first isolation portion is formed by the etched first isolation material layer.

[0040] In one possible implementation manner of the present application, the step of sequentially forming the first isolation material layer and the second isolation material layer on the substrate includes:

[0041] A first isolation material layer formed by mutual doping of two different metals is formed on the substrate by physical vapor deposition;

[0042] The second isolation material layer is formed on a side of the first isolation material layer away from the substrate.

[0043] In one possible implementation of the present application, the step of forming a first isolation material layer formed by mutual doping of two different metals on the substrate by physical vapor deposition includes:

[0044] Using a target material of one metal as a main target material and a target material of another metal as a doping target material, performing gasification control on the main target material and the doping target material respectively, and controlling the number of gaseous metal particles generated by gasification on the main target material to be greater than the number of gaseous metal particles generated by gasification on the doping target material;

[0045] The first isolation material layer is formed by depositing gaseous metal particles of two different metals on one side of the substrate.

[0046] In a third aspect of the present application, an electronic device is further provided, comprising a display panel according to any possible implementation of the first aspect, or a display panel prepared according to any possible implementation of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0048] Figure 1 A schematic diagram illustrating the positional relationship between the isolation structure and the isolation opening provided in this embodiment is provided;

[0049] Figure 2 Example Figure 1 One of the cross-sectional diagrams at the AA position in the middle part;

[0050] Figure 3 Example Figure 1 The second cross-sectional diagram at the AA position;

[0051] Figure 4 Example Figure 1 The third cross-sectional diagram at the AA position;

[0052] Figure 5 Example Figure 1 The fourth cross-sectional diagram at the AA position.

[0053] Figure 6 A schematic diagram illustrating a process of a method for manufacturing a display panel provided in this embodiment;

[0054] Figure 7 for Figure 6 Corresponding process flow chart;

[0055] Figure 8 Example Figure 6 Schematic diagram of the sub-step flow of step S130;

[0056] Figure 9 for Figure 8 Corresponding process flow chart;

[0057] Figure 10 A schematic diagram of depositing a first insulating material layer in a vacuum chamber is illustrated.

[0058] Icons: 1-display panel; 11-substrate; 12-isolation structure; 1201-isolation opening; 121-first isolation portion; 122-second isolation portion; 123-third isolation portion; 13-light-emitting device; 131-first electrode; 132-light-emitting material layer; 133-second electrode; 14-pixel defining layer; 1401-pixel opening; 1611-packaging unit; 162-first packaging layer; 163-second packaging layer; 21-first isolation material layer; 22-second isolation material layer; 20-vacuum chamber. DETAILED DESCRIPTION

[0059] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0060] In the description of this application, it should be noted that the terms "upper" and "lower" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. These are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0061] Increasing the density of light-emitting devices (i.e., pixel density) in display panels is an important way to improve display quality. However, current display panels manufactured using fine metal mask (FMM) technology are limited by technical limitations and cannot further increase the density of light-emitting devices. Long-term research has revealed that, to address this technical issue, some display panels incorporate an isolation structure. During the full-layer vapor deposition of the light-emitting material layer and cathode, the two layers can be disconnected at the isolation structure. Multiple vapor deposition and etching processes can be used to form light-emitting devices of different colors in different isolation openings. This process is also known as light-emitting device patterning.

[0062] In the above display panel, the light-emitting devices manufactured later are prone to dark spot problems, which seriously affect the display effect of the display panel.

[0063] Research has found that the primary cause of these technical issues is a subsequent failure in the light-emitting device packaging, which allows moisture to enter the device, leading to dark spots. Further research revealed that this failure is caused by the significant difference in thermal expansion coefficients between the packaging unit and the isolation structure, which should fit tightly together. This separation creates a gap for moisture to enter when temperatures fluctuate.

[0064] In order to solve the above technical problems, the following technical solutions are innovatively designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the solutions in the above prior art are the results obtained after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in the following embodiments for the above problems should all be contributions made to this application during the invention process, and should not be understood as technical contents known to those skilled in the art.

[0065] Please refer to Figure 1 and Figure 2 , Figure 1 The schematic diagram of the distribution of the isolation structure and the isolation opening is shown as an example. Figure 2 Example Figure 1 Schematic cross-sectional view taken at position AA in FIG. In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13, and an encapsulation unit 1611. The substrate 11 may be a multi-layer structure, including at least a plurality of conductive layers and an insulating layer between adjacent conductive layers. A pixel circuit for providing a drive signal to the light-emitting device 13 is formed within the substrate 11. The conductive layers may be metal conductive layers.

[0066] The isolation structure 12 is located on one side of the substrate 11 and encloses a plurality of isolation openings 1201 on the substrate 11. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 arranged in a stacked manner. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. That is, the second isolation portion 122 extends relative to the first isolation portion 121 toward the corresponding isolation opening 1201 to form an undercut structure. This undercut structure allows the entire surface-evaporated light-emitting device layer (such as the light-emitting material layer and the electrode layer) to be disconnected at this location, thereby facilitating the independent formation of the light-emitting device film layer in different isolation openings 1201.

[0067] At least some of the light-emitting devices 13 are disposed within the isolation openings 1201. The light-emitting devices 13 correspond one-to-one to the isolation openings 1201, with one light-emitting device 13 disposed in one isolation opening 1201. The display panel 1 includes light-emitting devices 13 of multiple different luminous colors. For example, the display panel 1 includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device. Adjacent red light-emitting devices, blue light-emitting devices, and green light-emitting devices can form a pixel unit. By controlling the luminance of the red light-emitting device, blue light-emitting device, and green light-emitting device in each pixel unit, the display brightness and color of each pixel unit can be controlled, thereby achieving display of an image on the display panel 1.

[0068] The packaging unit 1611 is located on the side of the light-emitting device 13 away from the substrate 11. The packaging unit 1611 extends from the surface of the light-emitting device 13 through the first isolation portion 121 toward the side wall of the isolation opening 1201 to the side of the second isolation portion 122 away from the substrate 11, that is, the packaging unit 1611 will be attached to the side wall of the first isolation portion 121 toward the isolation opening 1201.

[0069] Research has found that the packaging unit 1611 is generally made of inorganic materials, while the first isolation portion 121 is generally made of conductive metal. Generally speaking, the thermal expansion coefficient of the packaging unit 1611 is smaller than the thermal expansion coefficient of the first isolation portion 121. When the temperature changes (for example, when the temperature drops), the volume shrinkage of the first isolation portion 12 is greater than the volume shrinkage of the packaging unit 1611. The packaging unit 1611 used to encapsulate the light-emitting device 13 is easily separated from the first isolation portion 121 to form a gap for water vapor to invade, thereby causing packaging failure and dark spots in the light-emitting device 13.

[0070] In this embodiment, the difference in thermal expansion coefficient between the first isolation portion 121 and the packaging unit 161 is within ten percent of the thermal expansion coefficient of the packaging unit 161, including ten percent, that is, the thermal expansion coefficients of the first isolation portion 121 and the packaging unit 161 are basically the same. With this design, even if the temperature changes, the volume expansion or volume contraction of the two is basically the same, that is, the two can expand or contract synchronously, so as to ensure that the surfaces in contact with each other are always fitted together without gaps, thereby avoiding the situation where the first isolation portion 121 and the packaging unit 1611 separate to form a gap when the temperature changes, thereby ensuring the packaging effect of the light-emitting device 13 and the display effect of the display panel 1.

[0071] In this embodiment, the first isolation portion 121 is a conductive isolation portion. The material of the first isolation portion 121 includes at least one metal material. Specifically, the first isolation portion 121 can be made of a single metal with a thermal expansion coefficient comparable to that of the material of the packaging unit 1611, or it can be made by doping multiple metals. While ensuring that the first isolation portion 121 is conductive, research has found that it is easier to achieve this by doping two metals.

[0072] Specifically, in this embodiment, the material of the first isolation portion 121 includes a bulk metal material and a doped metal material, wherein the bulk metal material accounts for a greater proportion by mass in the first isolation portion 121 than the doped metal material. That is, the bulk metal material is the primary component of the first isolation portion 121.

[0073] Exemplarily, the main metal material includes aluminum, and the doped metal material includes one of titanium, rhodium, molybdenum, or beryllium; or, the main metal material includes copper, and the doped metal material includes tungsten or molybdenum.

[0074] In related art, the first isolation portion 121 is typically made of aluminum. However, the thermal expansion coefficients of aluminum and the packaging unit 1611 differ significantly, making it easy for the two to separate during temperature fluctuations, creating gaps that allow moisture to enter. Therefore, in this embodiment, aluminum can be used as the primary metal material, and the thermal expansion coefficient of the first isolation portion 121 can be altered by doping with other metal materials. Alternatively, other metal materials can be used as the primary metal material, and a different metal can be added to achieve a thermal expansion coefficient comparable to that of the packaging unit 1611.

[0075] Exemplarily, the main metal material includes aluminum (Al), and the doped metal material includes one of titanium (Ti), zirconium (Zr), molybdenum (Mo) or beryllium (Be); or, the main metal material includes copper (Cu), and the doped metal material includes tungsten (W) or molybdenum (Mo).

[0076] In a possible implementation of this embodiment, the main metal material includes aluminum (Al), and the doped metal material includes titanium (Ti). In the first isolation portion 121, the mass ratio of the doped metal material to the mass ratio of the main metal material is 0.1% to 0.5%. For example, the mass ratio of the doped metal material to the mass ratio of the main metal material includes 0.1%, 0.125%, 0.15%, 0.185%, 0.205%, 0.235%, 0.258%, 0.295%, 0.315%, 0.375%, 0.415%, 0.455%, 0.483%, 0.495%, or 0.5%. Due to the above-mentioned mass ratio of doping, the thermal expansion coefficient of the first isolation portion 121 is smaller than that of metal aluminum. Specifically, the thermal expansion coefficient of the first isolation portion 121 can be 10% to 15% smaller than that of metal aluminum, where the thermal expansion coefficient of metal aluminum is 23.6×10 -6 / K, that is, in this embodiment, the thermal expansion coefficient of the first isolation portion 121 is 20.06×10 -6 / K~21.24×10 -6 / K, illustratively, the thermal expansion coefficient of the first isolation portion 121 includes 20.06×10 -6 / K, 20.12×10 -6 / K, 20.28×10 -6 / K, 20.37×10 -6 / K, 20.45×10 -6 / K, 20.54×10 -6 / K, 20.67×10 -6 / K, 20.81×10 -6 / K, 20.93×10 -6 / K, 21.03×10 -6 / K, 21.16×10 -6 / K or 21.24×10 -6 / K, etc.

[0077] In another possible implementation of this embodiment, the main metal material includes aluminum (Al), and the doped metal material includes zirconium (Zr). In the first isolation portion 121, the mass ratio of the doped metal material to the mass ratio of the main metal material is 0.1% to 0.3%. For example, the mass ratio of the doped metal material to the mass ratio of the main metal material includes 0.1%, 0.115%, 0.125%, 0.145%, 0.183%, 0.192%, 0.2%, 0.205%, 0.221%, 0.25%, 0.265%, 0.273%, 0.283%, 0.296%, or 0.3%. Due to the above-mentioned mass ratio of doping, the thermal expansion coefficient of the first isolation portion 121 is smaller than that of metal aluminum. Specifically, the thermal expansion coefficient of the first isolation portion 121 can be 12% to 15% smaller than that of metal aluminum, wherein the thermal expansion coefficient of metal aluminum is 23.6×10 -6 / K, that is, in this embodiment, the thermal expansion coefficient of the first isolation portion 121 is 20.06×10 -6 / K~20.77×10 -6 / K, illustratively, the thermal expansion coefficient of the first isolation portion 121 includes 20.06×10 -6 / K, 20.12×10 -6 / K, 20.23×10 -6 / K, 20.31×10 -6 / K, 20.39×10 -6 / K, 20.43×10 -6 / K, 20.46×10 -6 / K, 20.51×10 -6 / K, 20.56×10 -6 / K, 20.63×10 -6 / K, 20.72×10 -6 / K or 20.77×10 -6 / K, etc.

[0078] In another possible implementation of this embodiment, the main metal material includes aluminum (Al), and the doped metal material includes molybdenum (Mo). In the first isolation portion 121, the mass ratio of the doped metal material to the mass ratio of the main metal material is 0.5% to 2%. For example, the mass ratio of the doped metal material to the mass ratio of the main metal material includes 0.5%, 0.55%, 0.65%, 0.78%, 0.83%, 0.92%, 1%, 1.05%, 1.12%, 1.25%, 1.36%, 1.48%, 1.56%, 1.68%, 1.74%, 1.83%, 1.96%, or 2%. Due to the above-mentioned mass ratio of doping, the thermal expansion coefficient of the first isolation portion 121 is smaller than that of metal aluminum. Specifically, the thermal expansion coefficient of the first isolation portion 121 can be 5% to 8% smaller than that of metal aluminum, wherein the thermal expansion coefficient of metal aluminum is 23.6×10 -6 / K, that is, in this embodiment, the thermal expansion coefficient of the first isolation portion 121 is 21.71×10 -6 / K~22.42×10 -6 / K, illustratively, the thermal expansion coefficient of the first isolation portion 121 includes 21.71×10 -6 / K, 21.74×10 -6 / K, 21.78×10 -6 / K, 21.85×10 -6 / K, 21.91×10 -6 / K, 21.97×10 -6 / K, 22.03×10 -6 / K, 22.08×10 -6 / K, 22.15×10 -6 / K, 22.27×10 -6 / K, 22.36×10 -6 / K or 22.42×10 -6 / K, etc.

[0079] In another possible implementation of this embodiment, the main metal material includes aluminum (Al), and the doped metal material includes beryllium (Be). In the first isolation portion 121, the mass ratio of the doped metal material to the mass ratio of the main metal material is 2% to 3%. For example, the mass ratio of the doped metal material to the mass ratio of the main metal material includes 2%, 2.02%, 2.08%, 2.15%, 2.21%, 2.28%, 2.34%, 2.41%, 2.48%, 2.56%, 2.63%, 2.68%, 2.74%, 2.79%, 2.86%, 2.9%, 2.96%, or 3%. Due to the above-mentioned mass ratio of doping, the thermal expansion coefficient of the first isolation portion 121 is smaller than that of metal aluminum. Specifically, the thermal expansion coefficient of the first isolation portion 121 can be 30% to 32% smaller than that of metal aluminum, wherein the thermal expansion coefficient of metal aluminum is 23.6×10 -6 / K, that is, in this embodiment, the thermal expansion coefficient of the first isolation portion 121 is 16.05×10 -6 / K~16.52×10 -6 / K, illustratively, the thermal expansion coefficient of the first isolation portion 121 includes 16.05×10 -6 / K, 16.07×10 -6 / K, 16.09×10 -6 / K, 16.13×10 -6 / K, 16.17×10 -6 / K, 16.21×10 -6 / K, 16.26×10 -6 / K, 16.32×10 -6 / K, 16.38×10 -6 / K、16.45×10 -6 / K、16.5×10 -6 / K or 16.52×10 -6 / K, etc.

[0080] In another possible implementation of this embodiment, the main metal material includes copper (Cu), and the doped metal material includes tungsten (W). In the first isolation portion 121, the mass of the doped metal material accounts for 10%-25% of the mass of the main metal material. Exemplarily, the mass of the doped metal material accounts for 10%, 10.5%, 11.2%, 12.5%, 13.4%, 14.1%, 15.2%, 15.9%, 16.5%, 17.1%, 17.8%, 18.3%, 18.8%, 19.2%, 19.8%, 20%, 21.5%, 23.2%, 24.8% or 25%, etc.

[0081] In yet another possible implementation of this embodiment, the main metal material includes copper (Cu), and the doped metal material includes tungsten (molybdenum). In the first isolation portion 121, the mass of the doped metal material accounts for 20%-30% of the mass of the main metal material. Exemplarily, the mass of the doped metal material accounts for 20%, 20.6%, 21.2%, 22.5%, 23.4%, 24.2%, 25.2%, 25.8%, 26.7%, 27.1%, 27.8%, 28.3%, 28.8%, 29.2%, 29.8% or 20%, etc.

[0082] It can be seen from the above embodiments that in the first isolation part 121 whose main metal material is aluminum or copper, the thermal expansion coefficient of the first isolation part 121 can be controlled by adjusting the mass proportion of the doped metal material. When the material of the packaging unit 1611 is changed, the thermal expansion coefficient of the first isolation part 121 can be made basically equivalent to the thermal expansion coefficient of the packaging unit 1611 in the above manner, thereby avoiding separation of the two due to the difference in thermal expansion coefficients, and ensuring that the packaging effect of the packaging unit 1611 on the light-emitting device 13 is not affected.

[0083] For further information, please refer to Figure 3 The display panel 1 also includes a pixel defining layer 14, which is located on one side of the substrate 11. The isolation structure 12 is located on a side of the pixel defining layer 14 away from the substrate 11. The pixel defining layer 14 includes a pixel opening 1401. At least a portion of the light-emitting device 13 is located within the pixel opening 1401. The pixel opening 1401 is in communication with the isolation opening 1201. Exemplarily, the orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the corresponding isolation opening 1201 on the substrate 11. The orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. In this embodiment, the pixel defining layer 14 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 14 is an inorganic pixel defining layer. When the pixel defining layer 14 is an inorganic pixel defining layer, it can be a single layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure consisting of alternating layers of silicon oxide and silicon nitride.

[0084] Please refer again Figure 3In a direction away from the substrate 11, the light-emitting device 13 includes a first electrode 131, a light-emitting material layer 132, and a second electrode 133, which are stacked in sequence. At least a portion of the first electrode 131 is exposed at the pixel opening 1401. The second electrode 133 extends from the pixel opening 1401 through the pixel defining layer 14 to the sidewall of the isolation structure 12 facing the isolation opening 1201. The second electrode 133 can overlap the first isolation portion 121. For example, the first electrode 131 can be the anode of the light-emitting device 13, and the second electrode 133 can be the cathode of the light-emitting device 13.

[0085] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The provision of the isolation structure 12 enables the formation of film layers of light-emitting devices of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can isolate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, thereby making different light-emitting devices 13 independent of each other, thereby improving crosstalk between adjacent light-emitting devices 13 and enhancing the display effect. Adjacent light-emitting devices 13 are independent of each other and can be independently packaged to improve the packaging yield. At the same time, due to the presence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine metal mask and saving the manufacturing cost of the display panel.

[0086] For further information, please refer to Figure 4 The isolation structure 12 may further include a third isolation portion 123. In a direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are stacked in sequence, with the orthographic projection of the third isolation portion 123 on the substrate 11 located within the orthographic projection of the second isolation portion 122 on the substrate 11. In a cross section perpendicular to the plane of the substrate 11 and passing through the center of the isolation opening 1201, the cross section of the isolation structure 12 may be I-shaped. The third isolation portion 123 is a conductive isolation portion, and the second electrode 133 may also be electrically connected to the third isolation portion 123. For example, the second electrode 133 is electrically connected by overlapping the third isolation portion 123.

[0087] For further information, please refer to Figure 5 The display panel 1 further includes a first encapsulation layer 162, which is located on a side of the encapsulation unit 1611 away from the substrate 11 and covers at least the encapsulation unit 1611. Optionally, the first encapsulation layer 162 includes a flat surface on a side away from the substrate 11.

[0088] Further, please refer again to Figure 4The display panel 1 further includes a second encapsulation layer 163 , which is located on a side of the first encapsulation layer 162 away from the substrate 11 .

[0089] Optionally, encapsulation unit 1611 and second encapsulation layer 163 include an inorganic material, and first encapsulation layer 162 includes an organic material. That is, encapsulation unit 1611 and second encapsulation layer 163 may be inorganic encapsulation layers, and first encapsulation layer 162 may be an organic encapsulation layer. For example, encapsulation unit 1611 and second encapsulation layer 163 may be formed by chemical vapor deposition (CVD), and first encapsulation layer 162 may be formed by inkjet printing (IJP).

[0090] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the second packaging layer 163 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0091] Based on the same inventive concept, this embodiment also provides a method for preparing a display panel, please refer to Figure 6 and Figure 7 ,in Figure 6 The flowchart of the method for manufacturing the display panel provided in this embodiment is shown in FIG. Figure 7 Example Figure 6 The corresponding process diagram is combined with the following Figure 6 and Figure 7 A detailed introduction is given to how this implementation solves the above technical problems through process technology improvements.

[0092] In step S110 , a substrate 11 is provided.

[0093] In this embodiment, the substrate 11 is a multi-layer structure, including at least a plurality of conductive layers and an insulating layer between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device may be formed in the substrate 11 .

[0094] Step S120 , manufacturing an isolation structure 12 and an isolation opening 1201 on the substrate 11 .

[0095] In this embodiment, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 which are stacked in sequence. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11, that is, the second isolation portion 122 extends toward the corresponding isolation opening 1201 relative to the first isolation portion 121. The first isolation portion 121 and the second isolation portion 122 form an undercut structure to facilitate the formation of independent light-emitting devices in each isolation opening when the device film layer of the light-emitting device is evaporated on the entire surface.

[0096] In step S130 , the light emitting device 13 and the packaging unit 1611 for packaging the light emitting device 13 are formed in the isolation opening 1201 . The packaging unit 1611 and the first isolation portion 121 are attached to the side surface corresponding to the isolation opening 1201 .

[0097] In this embodiment, the difference in thermal expansion coefficient between the first isolation portion 121 and the packaging unit 161 is within ten percent of the thermal expansion coefficient of the packaging unit 161, that is, the thermal expansion coefficients of the first isolation portion 121 and the packaging unit 161 are basically equivalent. In this way, when the temperature changes, the volumes of the first isolation portion 121 and the packaging unit 1611 can basically keep changing synchronously, and the two will not separate due to the difference in volume change to form a gap for water vapor to invade.

[0098] For further information, please refer to Figure 8 and Figure 9 , step S130 can be implemented through the following steps.

[0099] In step S1301 , a first isolation material layer 21 and a second isolation material layer 22 are sequentially formed on the substrate 11 , wherein the first isolation material layer 21 is formed of at least one metal material.

[0100] In this embodiment, the specific method of implementing step S1301 may be as follows.

[0101] First, a first isolation material layer 21 formed by doping two different metals is formed on the substrate 11 by physical vapor deposition.

[0102] For details, please refer to Figure 10Two different metal targets (for example, a metal aluminum target and a metal molybdenum target) can be placed in the vacuum chamber 20. First, the substrate 11 is placed in the vacuum chamber 20. Then, the metal on the target is converted into a gaseous state by evaporation, sputtering or arc discharge to form two metal gas particles. Then, the two metal gas particles are ionized in the vacuum chamber to form two metal plasmas, and the two metal plasmas are uniformly mixed. Then, the mixed two metal plasmas can move to the substrate 11 under the action of the electric field and be deposited on the substrate 11 to form a first isolation material layer 21.

[0103] In the process of converting the metal on the metal target into gaseous particles, a target of one metal is used as the main target and a target of another metal is used as the doping target. The main target and the doping target are respectively controlled to be vaporized, and the number of gaseous metal particles generated by vaporization on the main target is controlled to be greater than the number of gaseous metal particles generated by vaporization on the doping target. The specific materials and proportions can be referred to the previous article and will not be repeated here.

[0104] The first isolation material layer 21 is formed by depositing gaseous metal particles of two different metals on one side of the substrate 11 .

[0105] Next, a second isolation material layer 22 is formed on a side of the first isolation material layer 21 away from the substrate 11 .

[0106] In step S1302 , the first isolation material layer 21 and the second isolation material layer 22 are patterned to obtain an isolation structure 12 and an isolation opening 1201 , wherein the second isolation portion 122 is formed by the etched second isolation material layer 22 , and the first isolation portion 121 is formed by the etched first isolation material layer 21 .

[0107] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a car display device, a smart wearable device, a television, a laptop computer, and other devices with display functions.

[0108] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, the thermal expansion coefficient of the packaging unit and the thermal expansion coefficient of the first isolation portion are designed to be equivalent. With this design, even if the temperature changes, the volume changes of the two are also equivalent, that is, the two can expand or contract synchronously. This ensures that the surfaces of the two contacting each other are always fitted together without any gaps, thereby avoiding the situation where the first isolation portion and the packaging unit separate to form a gap when the temperature changes. The packaging of the light-emitting device will not fail due to the gap between the first isolation portion and the packaging unit, thereby ensuring the display effect of the display panel.

[0109] The foregoing description is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; an isolation structure located on the substrate and enclosing an isolation opening on the substrate, the isolation structure comprising a first isolation portion and a second isolation portion stacked in sequence, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; a light emitting device, at least partially located within the isolation opening; an encapsulation unit, for encapsulating the light-emitting device in the isolation opening, the encapsulation unit being bonded to the side of the first isolation portion facing the side corresponding to the isolation opening, wherein a difference in thermal expansion coefficient between the first isolation portion and the encapsulation unit is within 10% of the thermal expansion coefficient of the encapsulation unit; The material of the first isolation portion includes a main metal material and a doped metal material, wherein the thermal expansion coefficient of the main metal material is greater than the thermal expansion coefficient of the doped metal material, and the mass proportion of the main metal material in the first isolation portion is greater than the mass proportion of the doped metal material in the first isolation portion; The main metal material includes aluminum, and the doped metal material includes one of titanium, rhodium, molybdenum or beryllium.

2. The display panel according to claim 1, wherein The main metal material includes aluminum, the doped metal material includes titanium, and the mass of the doped metal material accounts for 0.1% to 0.5% of the mass of the main metal material.

3. The display panel according to claim 1, wherein The main metal material includes aluminum, the doped metal material includes iron, and the mass of the doped metal material accounts for 0.1% to 0.3% of the mass of the main metal material.

4. The display panel according to claim 1, wherein: The main metal material includes aluminum, the doped metal material includes molybdenum, and the mass of the doped metal material accounts for 0.5% to 2% of the mass of the main metal material.

5. The display panel according to claim 1, wherein The main metal material includes aluminum, the doped metal material includes beryllium, and the mass of the doped metal material accounts for 2%-3% of the mass of the main metal material.

6. The display panel according to claim 1, wherein: The display panel further includes a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer includes a pixel opening, wherein an orthographic projection of the pixel opening on the substrate is located within an orthographic projection of the corresponding isolation opening on the substrate, and at least part of the light emitting device is located within the pixel opening; In a direction away from the substrate, the light emitting device includes a first electrode, a light emitting material layer, and a second electrode that are stacked; wherein the second electrode is electrically connected to the isolation structure; The first electrode is disposed on a side of the pixel definition layer close to the substrate, and at least a portion of the first electrode is exposed from the pixel opening.

7. The display panel according to claim 1, wherein: The isolation structure also includes a third isolation portion. In the direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate, and the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

8. The display panel according to claim 1, wherein: The display panel further includes a first encapsulation layer, the first encapsulation layer is located on a side of the encapsulation unit away from the substrate, and the first encapsulation layer at least covers the encapsulation unit; The display panel further includes a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate; The encapsulation unit and the second encapsulation layer are inorganic encapsulation layers, and the first encapsulation layer is an organic encapsulation layer.

9. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; Fabricating an isolation structure and an isolation opening on the substrate, wherein the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; A light-emitting device and a packaging unit for packaging the light-emitting device are formed in the isolation opening, and the packaging unit is adhered to the side of the first isolation part facing the corresponding isolation opening, wherein the difference in thermal expansion coefficient between the first isolation part and the packaging unit is within ten percent of the thermal expansion coefficient of the packaging unit, the material of the first isolation part includes a main metal material and a doped metal material, the thermal expansion coefficient of the main metal material is greater than the thermal expansion coefficient of the doped metal material, the mass proportion of the main metal material in the first isolation part is greater than the mass proportion of the doped metal material in the first isolation part, the main metal material includes aluminum, and the doped metal material includes one of titanium, rhodium, molybdenum or beryllium.

10. The method for manufacturing a display panel according to claim 9, wherein: The step of manufacturing the isolation structure and the isolation opening on the substrate includes: Sequentially forming a first isolation material layer and a second isolation material layer on the substrate, wherein the first isolation material layer is formed of at least one metal material; The first isolation material layer and the second isolation material layer are patterned to obtain the isolation structure and the isolation opening, wherein the second isolation portion is formed by the etched second isolation material layer, and the first isolation portion is formed by the etched first isolation material layer.

11. The method for manufacturing a display panel according to claim 10, wherein: The step of sequentially forming a first isolation material layer and a second isolation material layer on the substrate includes: A first isolation material layer formed by mutual doping of two different metals is formed on the substrate by physical vapor deposition; The second isolation material layer is formed on a side of the first isolation material layer away from the substrate.

12. The method for manufacturing a display panel according to claim 11, wherein: The step of forming a first isolation material layer formed by mutual doping of two different metals on the substrate by physical vapor deposition comprises: Using a target material of one metal as a main target material and a target material of another metal as a doping target material, performing gasification control on the main target material and the doping target material respectively, and controlling the number of gaseous metal particles generated by gasification on the main target material to be greater than the number of gaseous metal particles generated by gasification on the doping target material; The first isolation material layer is formed by depositing gaseous metal particles of two different metals on one side of the substrate.

13. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 8, or a display panel prepared by the method for preparing a display panel according to any one of claims 9 to 12.

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