Chip aging test sorting equipment

By installing tight adsorption components on the top plate of the chip aging test sorting device, the problem of possible displacement of the chip during the test is solved, the stable fixation of the chip and the accuracy of the test results are achieved, and the chip separation is achieved.

CN120205490APending Publication Date: 2025-06-27安徽积芯微电子科技有限公司
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Patent Information

Application Number
CN202510487793.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-18
Publication Date
2025-06-27

AI Technical Summary

Technical Problem

Existing chip aging test sorting equipment lacks the means to fix the chip during the test process, which may cause the chip to be displaced and affect the test results.

Method used

A chip aging test sorting device is designed, using the tightening adsorption assembly on the top plate to apply a tightening force to the chip. Through the combination of shrapnel, locking frame and locking rod, the stable adsorption and fixation of the suction cup is achieved to ensure that the chip remains stable during testing.

Benefits of technology

By applying a tightening force, the stability of the chip during testing is ensured, the accuracy of the test results is improved, and the separation of qualified and unqualified chips is achieved.

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Abstract

The invention discloses chip aging test sorting equipment, and belongs to the technical field of chip testing, the chip aging test sorting equipment comprises a base, and conveyor belts are mounted on the two side surfaces of the interior of the base; a plurality of mounting grooves for mounting chips are formed in the test plates; a plurality of abutting adsorption assemblies are installed on the top plate, the abutting adsorption assemblies correspond to the installation grooves one to one, the top plate is driven by a lifting push rod to ascend and descend, the lifting push rod is installed on a fixing frame, and the fixing frame is installed on the base; wherein the conveying belt drives the test plate to move to the position below the top plate for detection, the abutting adsorption assembly adsorbs the unqualified chips and places the unqualified chips on the base, during testing, abutting force can be applied to the chips, stability of the chips during testing is guaranteed, and therefore the test result can be more accurate.
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Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly relates to a chip aging test and sorting device. Background Art

[0002] Aging test is a necessary link for chip product certification and compliance. The aging test can simulate the performance degradation of chips during long-term use, so as to predict their service life. At present, most aging test and sorting devices lack a means to fix the chips during testing, resulting in the chips possibly shifting during the test, thus affecting the test results. To solve the above problems, the present invention provides a chip aging test and sorting device. Summary of the Invention

[0003] Aiming at the above-mentioned existing technical deficiencies, the purpose of the present invention is to provide a chip aging test and sorting device, which can apply a pressing force to the chips during testing, ensuring the stability of the chips during testing, and thus making the test results more accurate.

[0004] To solve the above technical problems, the present invention adopts the following technical solutions: The present invention provides a chip aging test and sorting device, including: A base, on both inner side surfaces of which conveyors are installed; Multiple test boards, on which multiple mounting grooves for mounting chips are provided; A top plate, on which multiple pressing and adsorbing components are installed. The multiple pressing and adsorbing components correspond to the multiple mounting grooves one by one. The top plate is driven to move up and down by a lifting push rod, and the lifting push rod is installed on a fixing frame, and the fixing frame is installed on the base; Among them, the conveyor drives the test board to move below the top plate for detection. The pressing and adsorbing component adsorbs unqualified chips and places them on the base.

[0005] Preferably, the pressing and adsorbing component includes: A suction cup, which is located above the mounting groove; A fixed pipe, which is located above the suction cup. Its lower end is connected to the suction cup through a hose. The upper end of the fixed pipe penetrates through the top plate and extends above the top plate, and is fixedly connected to a fixing plate; A elastic clamping part, which is located between the suction cup and the top plate. During testing, the elastic clamping part has a pressing force that makes the suction cup press against the chip; Multiple reset push rods, which are installed on the upper side surface of the top plate. A fixed rod is fixedly connected to the output rod of the reset push rod. The upper end of the fixed rod penetrates through the fixing plate and turns outwards to form a convex circle.

[0006] Preferably, the elastic clamping part includes: two elastic pieces, which are respectively located on both sides of the corresponding fixed tube and are symmetric with respect to the axis of the fixed tube. The elastic pieces are in a "U" shape, and the openings of the two elastic pieces face each other. The shape of the closed end of the elastic piece is a circular arc protruding in the direction away from the two elastic pieces. Locking frames are fixedly connected to the inner sides of the closed ends of the two elastic pieces. When the suction cup moves towards the top plate, the closed ends of the two elastic pieces move in opposite directions, and the two locking frames cooperate to clamp the hose.

[0007] Preferably, a locking rod is fixedly connected to the side surface of the locking frame away from the elastic piece to which it is connected. One end of the locking rod away from the locking frame passes through a through hole provided on the corresponding elastic piece, and a plurality of convex rings are fixedly connected to the locking rod.

[0008] Preferably, the number of the reset push rods is twice that of the fixed tubes.

[0009] Preferably, a sunken groove is provided on the upper side surface of the base, and the two conveyor belts are respectively installed on the two side walls of the sunken groove.

[0010] Preferably, a recovery groove is provided on the side wall of the bottom of the sunken groove below the top plate. The bottom of the recovery groove is an inclined surface, and a discharge port is provided at its lower end.

[0011] Preferably, a plurality of heating wires are provided inside the test board. Contacts adapted to the chip are provided inside the installation groove. The heating wires and the contacts are electrically connected to a socket provided on the test board. A plug adapted to the socket is provided on the top plate, and the plug is electrically connected to an external power source.

[0012] The beneficial effects of the present invention are as follows: Through the arrangement of the test board and the top plate, the present invention realizes that during the test, the top plate moves downward, and the plug on the top plate is docked with the socket on the test board. At this time, the contacts inside the installation groove and the heating wires inside the test board are electrically connected to an external power source to perform an aging test on the chip. The pressing and adsorbing assembly provided on the top plate presses against the chip when the top plate moves downward, ensuring the stability of the test.

[0013] Through the arrangement of the elastic piece, the locking frame and the locking rod, the present invention realizes that when the suction cup presses against the chip, the elastic piece contracts and pulls the locking frame to clamp the hose. The locking rod and its convex rings force the elastic piece to maintain a contracted state, so that the suction cup can stably adsorb and fix the chip. Then, when the top plate rises, the reset push rod above the qualified chip is activated, so that the suction cup no longer adsorbs the qualified chip, and the unqualified chip will rise with the top plate. And when the test board is transported away from below the top plate, the reset push rod above the unqualified chip is activated, so that the unqualified chip enters the inside of the recovery groove, thereby realizing the separation of the qualified chip from the unqualified chip. Brief Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 It is a schematic structural diagram of a chip aging test and sorting device provided by an embodiment of the present invention.

[0016] Figure 2 It is a cross-sectional view of the present invention.

[0017] Figure 3 For the present invention Figure 2 An enlarged view of part A.

[0018] Figure 4 It is an exploded view of the locking frame and the hose of the present invention.

[0019] Figure 5 It is an exploded view of the locking rod and the elastic piece of the present invention.

[0020] Description of the reference numerals: 1. Base, 2. Conveyor belt, 3. Test board, 4. Installation groove, 5. Top plate, 6. Lifting push rod, 7. Fixed frame, 8. Suction cup, 9. Fixed pipe, 10. Hose, 11. Reset push rod, 12. Fixed rod, 13. Fixed plate, 14. Elastic piece, 15. Locking frame, 16. Locking rod, 17. Convex ring, 18. Heating wire, 19. Sunk groove, 20. Recovery groove. Detailed Embodiments

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0022] The present invention provides a chip aging test and sorting device, as Figures 1 to 5 shown.

[0023] Embodiment 1:[[]]END]] A chip aging test and sorting device includes a base 1 and multiple test boards 3. A sunken groove 19 is provided on the upper side of the base 1. Conveyor belts 2 are installed on the two side walls of the sunken groove 19. The two conveyor belts 2 are respectively driven by corresponding motors, and the motors are installed on the base 1. The two conveyor belts 2 cooperate with each other to convey the test boards 3. An electric heating wire 18 is provided inside the test board 3. Multiple mounting grooves 4 for mounting chips are provided on the upper side of the test board 3. Contacts are provided inside the mounting grooves 4. The electric heating wire 18 and the contacts are electrically connected to the sockets provided on the test board 3.

[0024] A fixing frame 7 is fixedly connected to the upper side of the base 1. The fixing frame 7 is in a "U" shape, with its open end facing down and fixedly connected to the base 1, and a lifting push rod 6 is fixedly installed on its closed end. A top plate 5 adapted to the test board 3 is installed on the output rod of the lifting push rod 6. A plug adapted to the socket on the test board 3 is provided on the top plate 5. When the test board 3 moves below the top plate 5, the output rod of the lifting push rod 6 extends, and the top plate 5 moves downward. The plug on the top plate 5 is inserted into the socket of the test board 3. At this time, the electric heating wire 18 is energized and heated, and the contacts inside the mounting grooves 4 are energized to perform high-temperature aging tests and high-voltage aging tests on the chips. After the tests are completed, the output rod of the lifting push rod 6 retracts, and the top plate 5 rises. Then, the conveyor belt 2 continues to transport the tested test boards 3 to the next step, thus completing the aging test work.

[0025] Embodiment Two: On the basis of Embodiment One, in order to ensure the stability of the test, multiple pressing and adsorbing components are installed on the top plate 5. The number and positions of the pressing and adsorbing components correspond one by one to the number and positions of the mounting grooves 4, that is, a pressing and adsorbing component is provided above each mounting groove 4. During the aging test, the pressing and adsorbing components can apply a pressing force to the chips and fix the chips, so that the chips can remain stable during the test. When the detection is completed, the pressing and adsorbing components adsorb the unqualified chips and rise synchronously with the top plate 5. At this time, the qualified chips will remain on the test board 3 and be transported to the next step (taken away by the staff) by the conveyor belt 2. When the tested test board 3 is transported away from below the top plate 5, the pressing and adsorbing components no longer adsorb the unqualified chips. At this time, the unqualified chips will fall into the internal of the recovery groove 20 provided on the bottom side wall of the sunken groove 19. The bottom side wall of the recovery groove 20 is inclined, and a discharge port is provided at one end of the bottom side wall with a lower height of the recovery groove 20. The unqualified chips entering the internal of the recovery groove 20 will be discharged through the discharge port.

[0026] The pressing and adsorbing assembly includes a suction cup 8. The upper side of the suction cup 8 is connected to a fixed pipe 9 through a hose 10. The suction cup 8 is communicated with the fixed pipe 9 through the hose 10. The upper end of the fixed pipe 9 penetrates through the top plate 5 and extends above the top plate 5 and is fixedly connected to a fixing plate 13. The fixing plate 13 is provided with a through hole adapted to the inner diameter of the fixed pipe 9. A resilient clamping part is connected between the suction cup 8 and the top plate 5. When aging testing the chip, the resilient clamping part has a pressing force that makes the suction cup 8 press tightly against the chip, which can ensure the stability of the chip during the test. When the suction cup 8 presses tightly against the chip, the elastic material at the periphery of the suction cup 8 will be compressed and contracted, so as to protect the chip while pressing and fixing it, and avoid damage to the chip caused by excessive extrusion force.

[0027] When the suction cup 8 presses tightly against the chip, the air inside the suction cup 8 is discharged. At the same time, the resilient clamping part will seal the hose 10. When the test is completed, the suction cup 8 rises with the top plate 5. At this time, the suction cup 8 rebounds under its own elastic force, and its internal volume increases. However, the hose 10 is sealed, and the opening of the suction cup 8 is closely attached to the chip, so a negative pressure will be formed inside the suction cup 8 to adsorb the chip.

[0028] The resilient clamping part includes two elastic pieces 14. The two elastic pieces 14 are respectively located on both sides of the corresponding fixed pipe 9 and are symmetric with respect to the axis of the fixed pipe 9. The shape of the elastic piece 14 is "U" - shaped. One end of its open end is fixedly connected to the top plate 5, and the other end is fixedly connected to the suction cup 8. The shape of the closed end of the elastic piece 14 is a circular arc protruding in the direction away from the two elastic pieces 14. When the elastic piece 14 is compressed and contracted, the closed ends of the two elastic pieces 14 will move away from each other.

[0029] A locking frame 15 is fixedly connected to the inner side surface of the closed end of the elastic piece 14. The elastic piece 14 and the locking frame 15 connected to it are respectively located on both sides of the fixed pipe 9. When the suction cup 8 presses tightly against the chip, the closed end of the elastic piece 14 will pull the locking frame 15, and the two locking frames 15 will cooperate with each other to clamp the hose 10 and seal the hose 10, so that the space inside the suction cup 8 forms a closed space.

[0030] A locking rod 16 is fixedly connected to the side surface of the locking frame 15 far away from the elastic piece 14 connected to it. One end of the locking rod 16 far away from the locking frame 15 passes through a through - hole provided on the corresponding elastic piece 14. A plurality of convex rings 17 are fixedly connected to the locking rod 16. The convex rings 17 are in interference fit with the through - hole. When the elastic piece 14 deforms, the locking rod 16 will be pulled, and the convex rings 17 on it will pass through the through - hole. Thus, after the elastic piece 14 deforms, under the blocking action of the convex rings 17, it will overcome its own elastic force and maintain the contracted state without returning to the original state, so that the locking frame 15 can stably clamp the hose 10.

[0031] Below the fixed plate 13 and on the top plate 5, a reset push rod 11 is installed. A fixed rod 12 is fixedly connected to the output rod of the reset push rod 11. The upper end of the fixed rod 12 penetrates through the fixed plate 13 and turns over around to form a convex circle. When it is necessary to make the suction cup 8 no longer adsorb the chip, the reset push rod 11 is started to retract the output rod of the reset push rod 11. At this time, the convex circle on the fixed rod 12 will push the suction cup 8 through the fixed plate 13, so that the suction cup 8 moves away from the top plate 5, so that the elastic piece 14 can overcome the resistance of the convex ring 17 and return to its original state. At this time, the locking frame 15 clamps the clamping hose 10 again, and the suction cup 8 communicates with the outside and no longer adsorbs the chip.

[0032] When the elastic piece 14 contracts under the tightening force, it will drive the locking frame 15 to move upward, so that the locking frame 15 can be tightened against the lower end of the fixed tube 9. When the fixed rod 12 pulls the fixed plate 13 downward, the fixed tube 9 can push the locking frame 15 downward, so that the two elastic pieces 14 can better return to their original shapes.

[0033] When the top plate 5 rises, the reset push rod 11 located above the qualified chip is started to retract its output rod, so that the corresponding suction cup 8 does not adsorb the chip, and the qualified chip will remain on the test board 3. When it is necessary to unload the unqualified chip, the reset push rod 11 located above the unqualified chip is started to retract its output rod. At this time, the unqualified chip will fall into the inside of the recovery tank 20.

[0034] The number of the reset push rods 11 is twice that of the fixed tubes 9, that is, each tightening and adsorbing assembly includes two reset push rods 11. The two reset push rods 11 are symmetric with respect to the axis of the corresponding fixed tube 9, and can drive the fixed plate 13 to descend more stably.

[0035] To achieve the above functions, controlling the start and stop of different reset push rods 11 can be realized by the electronic control module to identify the electrical signals at different positions. This kind of technology has been widely used in various automatic sorting devices and is the prior art, so the present invention will not be elaborated.

[0036] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A chip aging test sorting equipment, characterized in that: include: A base (1), wherein conveyor belts (2) are installed on both side surfaces inside the base (1); A plurality of test boards (3), wherein the test boards (3) are provided with a plurality of mounting slots (4) for mounting chips; A top plate (5), wherein a plurality of abutting adsorption components are mounted on the top plate (5), wherein the plurality of abutting adsorption components correspond to the plurality of mounting grooves (4) in a one-to-one manner, wherein the top plate (5) is driven to rise and fall by a lifting push rod (6), wherein the lifting push rod (6) is mounted on a fixing frame (7), and wherein the fixing frame (7) is mounted on a base (1); The conveyor belt (2) drives the test plate (3) to move to the bottom of the top plate (5) for testing, and presses against the adsorption component to adsorb unqualified chips and place them on the base (1).

2. A chip aging test sorting device as claimed in claim 1, characterized in that: The abutting adsorption component comprises: A suction cup (8), the suction cup (8) being located above the mounting groove (4); a fixed tube (9), the fixed tube (9) being located above the suction cup (8), the lower end of which being connected to the suction cup (8) via a hose (10), the upper end of which passing through the top plate (5) extending to above the top plate (5), and being fixedly connected to a fixed plate (13); An elastic clamping portion, the elastic clamping portion being located between the suction cup (8) and the top plate (5), and having a pressing force to cause the suction cup (8) to press against the chip during testing; A plurality of reset push rods (11) are mounted on the upper side of the top plate (5); a fixed rod (12) is fixedly connected to an output rod of the reset push rod (11); the upper end of the fixed rod (12) passes through the fixed plate (13) and is folded around to form a convex circle.

3. A chip aging test sorting device as claimed in claim 2, characterized in that: The elastic clamping portion comprises: two spring sheets (14), the two spring sheets (14) being respectively located on both sides of a corresponding fixed tube (9) and symmetrical with respect to the axis of the fixed tube (9), the spring sheets (14) being in a "U" shape, and the openings of the two spring sheets (14) being arranged facing each other, and the closed ends of the spring sheets (14) being in a circular arc shape protruding in directions opposite to the two spring sheets (14); The inner side surfaces of the closed ends of the two spring pieces (14) are fixedly connected to locking frames (15); when the suction cup (8) moves toward the top plate (5), the closed ends of the two spring pieces (14) move in opposite directions, and the two locking frames (15) cooperate with each other to clamp the hose (10).

4. A chip aging test sorting device as claimed in claim 3, characterized in that: A locking rod (16) is fixedly connected to a side surface of the locking frame (15) away from the spring sheet (14) connected thereto, one end of the locking rod (16) away from the locking frame (15) passes through a through hole provided on the corresponding spring sheet (14), and a plurality of convex rings (17) are fixedly connected to the locking rod (16).

5. A chip aging test sorting device as claimed in claim 2, characterized in that: The number of the reset push rods (11) is twice the number of the fixed tubes (9).

6. The chip aging test sorting equipment according to claim 1, characterized in that: A trough (19) is provided on the upper side of the base (1), and the two conveyor belts (2) are respectively mounted on two side walls of the trough (19).

7. A chip aging test sorting device as claimed in claim 6, characterized in that: A recovery trough (20) is provided below the top plate (5) and on the side wall of the bottom of the trough (19). The bottom of the recovery trough (20) is an inclined surface, and a discharge outlet is provided at the lower end thereof.

8. The chip aging test sorting equipment according to claim 1, characterized in that: The test board (3) is provided with a plurality of heating wires (18) inside, the mounting groove (4) is provided with contacts matching the chip inside, the heating wires (18) and the contacts are electrically connected to a socket provided on the test board (3), the top board (5) is provided with a plug matching the socket, and the plug is electrically connected to an external power source.