Porous ultrafine silica powder with core-shell structure and preparation method thereof
By preparing porous ultrafine silicon powder with a core-shell structure, the problem of poor compatibility between silicon powder and resin was solved, and high mechanical strength, low dielectric properties and thermal stability of copper clad laminate were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 广州豫顺新材料科技有限公司
- Filing Date
- 2025-04-16
- Publication Date
- 2026-05-01
AI Technical Summary
Existing silicon micropowder and resin systems have poor compatibility, making it difficult to meet the requirements of low expansion coefficient, high mechanical strength and low dielectric constant for copper clad laminates. Traditional surface modification methods have limited effectiveness.
Porous ultrafine silica powder with a core-shell structure was prepared by sol-gel method. The core was coated with an amorphous porous silica shell. The particle morphology and pore structure were controlled by dispersants and volatile acids to improve sphericity and surface bonding strength.
The mechanical strength and dielectric properties of silicon micropowder are improved, the bonding strength with resin is enhanced, and the coefficient of thermal expansion and dielectric constant are reduced, thus meeting the high-performance requirements of copper clad laminates.
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Abstract
Citation Information
Patent Citations
Core-shell silica and method for producing it
US20090053524A1