Polyamide composition as well as preparation method and application thereof

By adding metal oxides and organic phosphinate flame retardant to the polyamide composition, the problem that existing materials cannot meet the voltage requirements of photovoltaic applications above 1.5kV and take into account high-grade flame retardant performance, achieving a significant improvement in IPT performance and flame retardant performance.

CN120209566APending Publication Date: 2025-06-27SHANGHAI KINGFA SCI & TECH +2
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Patent Information

Application Number
CN202510334773.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2025-06-27

AI Technical Summary

Technical Problem

Existing polyamide materials cannot meet the voltage requirements for photovoltaic applications above 1.5kV, while taking into account high-grade flame retardant performance.

Method used

A halogen-free flame retardant polyamide composition is prepared by adding metal oxides as tip discharge inhibitors to the polyamide composition, combining organic phosphinate flame retardant and fiber reinforcement.

Benefits of technology

It significantly improves IPT performance and ensures excellent flame retardancy, and is suitable for electronic and electrical fields with high electrical safety.

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Abstract

The invention discloses a halogen-free flame-retardant polyamide composition with high IPT performance, and the halogen-free flame-retardant polyamide composition comprises the following components in parts by weight: 35-75 parts of polyamide resin; 5 to 22 parts of an organic phosphinate flame retardant; 5-50 parts of a fiber reinforcing agent; 5-70 parts of a metal oxide; wherein the specific surface area of the metal oxide is 0.01-1.2 m < 2 > / g. The specific point discharge inhibitor is added into the flame-retardant polyamide composition, so that the IPT performance is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of polymer materials, and particularly to a polyamide composition, a preparation method thereof, and an application thereof. Background Art

[0002] At present, the photovoltaic ("PV") market is shifting from a 1 kVA grid to a 1.5 kVA grid, and this shift has imposed new regulations on photovoltaic connectors and junction boxes. In the field of engineering plastics, there are many products used in photovoltaic applications; however, for high-voltage applications, especially applications at 1.2 kV, 1.5 kV, or 2 kV, less attention has been paid.

[0003] With the increasing requirements for electrical safety of photovoltaic materials under harsh conditions, PA is widely used in the photovoltaic market due to its good mechanical and processing properties. However, this polyamide cannot meet the requirements of photovoltaic applications with voltages higher than 1.5 kV.

[0004] There are very few technical solutions in the currently published materials for improving the IPT (inclined plane tracking and erosion test) performance. Patent 202180053046.8 mentions that by using a long-chain aliphatic polyamide in which each amide group has on average equal to or more than 6 carbon atoms (excluding the carbon atoms in the amide group), the IPT performance at voltages higher than 1 kV can be improved. However, the introduction of the long-chain aliphatic polyamide significantly reduces the heat resistance of the composition material and cannot take into account the high-grade flame retardant performance at the same time.

[0005] Therefore, the prior art lacks a polyamide composition that can meet the requirements of photovoltaic applications with voltages higher than 1.5 kV and can also take into account the high-grade flame retardant performance. Summary of the Invention

[0006] The purpose of the present invention is to overcome the above technical problems and provide a halogen-free flame-retardant polyamide composition that can meet the requirements of photovoltaic applications with voltages higher than 1.5 kV and can also take into account the high-grade flame retardant performance.

[0007] Another purpose of the present invention is to provide a preparation process of the above polyamide composition.

[0008] Another purpose of the present invention is to provide an application of the above polyamide composition.

[0009] The present invention is achieved through the following technical solutions: A polyamide composition, characterized in that, by weight, it comprises the following components: 35-75 parts of polyamide resin; 5-22 parts of organic phosphite flame retardant; 5-50 parts of fiber reinforcing agent; 5-70 parts of metal oxide; Among them, the specific surface area of the metal oxide is 0.01 - 1.2 m 2 / g.

[0010] In the present invention, the measurement method of the specific surface area is the static volumetric method, and the measurement standard is GB / T 19587 - 2017.

[0011] Preferably, the microscopic shape of the metal oxide is spherical.

[0012] In the present invention, the reason for preferably choosing the spherical microscopic shape of the metal oxide is that the surface tip discharge effect of the spherical oxide is weak and the high - voltage arc resistance performance is good, so better IPT performance can be obtained.

[0013] Preferably, the metal element in the metal oxide is at least one of Mg, Al or Zn.

[0014] Preferably, the average particle size range of the metal oxide is 1.5 μm - 100 μm; More preferably, the average particle size range of the metal oxide is 2 μm - 50 μm; Even more preferably, the average particle size range of the metal oxide is 4.5 μm - 25 μm.

[0015] In the present invention, the measurement method of the particle size is the laser diffraction method, and the measurement standard is GB / T 19077 - 2024.

[0016] Preferably, the percentage content range of the metal oxide is 3% - 50%.

[0017] Experimental results prove that the average particle size and specific surface area of the metal oxide will affect the IPT performance of the composition.

[0018] Preferably, the organic hypophosphite flame retardant is at least one of aluminum diethylphosphinate, zinc diethylphosphinate, aluminum methyl ethylphosphinate, aluminum ethyl butylphosphinate or aluminum ethyl hexylphosphinate.

[0019] Preferably, the minimum mass content of the polyamide resin in the polyamide composition is 30%.

[0020] Preferably, the relative viscosity of the polyamide resin is 1.8 - 2.8.

[0021] In the present invention, the test method for the relative viscosity of the polyamide resin: Refer to GB12006.1 - 89, and the specific test method is: Measure the relative viscosity ηr of the polyamide with a concentration of 0.25 g / dl in 98% sulfuric acid at 25 ± 0.01 °C.

[0022] Preferably, the polyamide resin is selected from at least one of aliphatic polyamide resins or semi-aromatic polyamide resins.

[0023] Specifically, the aliphatic polyamide resin is selected from at least one of PA6, PA66, PA66 / 6, PA1010, PA610, PA1012, PA1212; the semi-aromatic polyamide resin is selected from at least one of PA6T, PA10T, PA10T / 66, PA10T / 10I, PA6T / 66, PA6T / 6, PA6T / 6I, PA6T / 6I / 66, PA5T / 6T, PA6T / 10T.

[0024] Preferably, the fiber reinforcing agent is selected from at least one of glass fiber, wollastonite, potassium titanate whisker or kaolin.

[0025] More preferably, the glass fiber has an average fiber diameter of 0.5 - 30 µm.

[0026] The present invention also provides a preparation method of the above polyamide composition, comprising the following steps: mixing each component evenly according to the ratio, and extruding and pelletizing through a twin-screw extruder at a temperature range of 250 - 350 °C to obtain the polyamide composition.

[0027] The present invention also provides an application of the above polyamide composition for preparing electronic and electrical components.

[0028] The present invention also provides a photovoltaic module, which contains the above polyamide composition.

[0029] The present invention has the following beneficial effects compared with the prior art: By adding a metal oxide as a specific tip discharge inhibitor to the flame-retardant polyamide composition, the present invention can not only significantly improve the IPT performance, but also ensure excellent flame retardancy. When the particle size is determined, the specific surface area is reduced, which can significantly reduce the tip discharge effect in the glass fiber reinforced system, thereby greatly improving the IPT performance of the composition material. In addition, the metal oxide also has excellent synergistic flame retardant performance. The polyamide composition provided by the present invention is very suitable for the electronic and electrical fields that require high electrical safety. Specific Embodiments

[0030] The present invention will be described in detail below with reference to specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those of ordinary skill in the art can make several deformations and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0031] Sources of raw materials used in the present invention: PA6: HY2500I, Jiangsu Haiyang, relative viscosity is 2.45.

[0032] PA6T: Amodel A-6000, Solvay USA, relative viscosity is 2.20.

[0033] Spherical alumina 1: DAW-01, average particle size 1.9 μm, specific surface area 1.0 m 2 / g, DENKA Japan.

[0034] Spherical alumina 2: DAM-03, average particle size 4.7 μm, specific surface area 0.4 m 2 / g, DENKA Japan.

[0035] Spherical alumina 3: DAM-07, average particle size 12.5 μm, specific surface area 0.3 m 2 / g, DENKA Japan.

[0036] Spherical alumina 4: DAM-20, average particle size 24.6 μm, specific surface area 0.2 m 2 / g, DENKA Japan.

[0037] Spherical alumina 5: DAM-45, average particle size 42.8 μm, specific surface area 0.2 m 2 / g, DENKA Japan.

[0038] Spherical alumina 6: DAM-90, average particle size 97.1 μm, specific surface area 0.1 m 2 / g, DENKA Japan.

[0039] Spherical magnesium oxide: DMG-50, average particle size 50 μm, specific surface area 0.2 m 2 / g, DENKA Japan.

[0040] Ordinary alumina 1: MK-37, average particle size 4.7 μm, specific surface area 3.8 m 2 / g, Foshan Huaya Superfine Powder.

[0041] Ordinary alumina 2: MK-35, average particle size 4.7 μm, specific surface area 5.3 m 2 / g, Foshan Huaya Superfine Powder.

[0042] Ordinary alumina 3: M30, average particle size 4.7 μm, specific surface area 6.9 m 2 / g, Foshan Huaya Superfine Powder.

[0043] Organic hypophosphite flame retardant: Aluminum diethyl hypophosphite: OP 1230, Clariant Chemicals.

[0044] Fiber Reinforcer: Glass fiber OCV995, with an average diameter of 10 μm, Owens Corning Composites (OCVTM Reinforcements).

[0045] Test Methods for Each Item: (1) IPT Performance: Tested according to ASTM D2303-13 standard, sample thickness 6 mm. Initial voltage 1.0 kV, step voltage 0.25 kV. Composition of the contaminating liquid: Distilled aqueous solution of 0.1 wt% ammonium chloride and 0.02 wt% polyethylene glycol octylphenyl ether). Resistance of the contaminating liquid: 385 ± 15 Ω·cm.

[0046] (2) Flame Retardancy: Tested according to UL94-2023 standard, thickness 0.75 mm.

[0047] Table 1 Component Weight Parts and Test Results of Polyamide Compositions in Examples 1-9

[0048] Table 2 Component Weight Parts and Test Results of Polyamide Compositions in Examples 10-17

[0049] It can be seen from Examples 1-17 that the IPT of the polyamide composition provided by the present invention can all reach 1.5 kV and above, and at the same time, the flame retardancy can all reach V-0 grade.

[0050] Table 3 Component Weight Parts and Test Results of Polyamide Compositions in Comparative Examples 1-5

[0051] It can be seen from Comparative Example 1 that the IPT of the polyamide composition without the addition of metal oxide did not reach 1.5 kV.

[0052] It can be seen from Comparative Example 2 that the addition amount of the metal oxide did not reach the minimum percentage content, and the IPT did not reach 1.5 kV.

[0053] It can be seen from Comparative Examples 3-5 that the IPT performance of the polyamide composition obtained using ordinary alumina with a specific surface area greater than 1.2 m 2 / g did not reach 1.5 kV.

Claims

1. A polyamide composition, characterized in that By weight, it includes the following components: 35-75 parts of polyamide resin; 5-22 parts of organic phosphinate flame retardant; Fiber reinforcement 5-50 parts; 5-70 parts of metal oxide; Wherein, the specific surface area of ​​the metal oxide is 0.01-1.2m 2 / g.

2. The polyamide composition according to claim 1, characterized in that The metal oxide is spherical in microscopic shape.

3. The polyamide composition according to claim 1, characterized in that The metal element in the metal oxide is at least one of Mg, Al or Zn.

4. The polyamide composition according to claim 1, characterized in that The average particle size of the metal oxide is in the range of 1.5 μm-100 μm, preferably 2 μm-50 μm, and more preferably 4.5 μm-25 μm.

5. The polyamide composition according to claim 1, characterized in that The organic phosphinate flame retardant is selected from at least one of aluminum diethylphosphinate, zinc diethylphosphinate, aluminum methylethylphosphinate, aluminum ethylbutylphosphinate or aluminum ethylhexylphosphinate.

6. The polyamide composition according to claim 1, characterized in that The polyamide resin is selected from at least one of an aliphatic polyamide resin and a semi-aromatic polyamide resin.

7. The polyamide composition according to claim 1, characterized in that The fiber reinforcement is selected from at least one of glass fiber, wollastonite, potassium titanate whisker or kaolin.

8. The method for preparing the polyamide composition according to any one of claims 1 to 7, characterized in that: The method comprises the following steps: mixing the components uniformly according to the proportion, extruding and granulating through a twin-screw extruder to obtain a polyamide composition.

9. Use of the polyamide composition according to any one of claims 1 to 7, characterized in that: Used to prepare electronic devices.

10. A photovoltaic module, characterized in that: The photovoltaic module contains the polyamide composition according to any one of claims 1 to 7.

Citation Information

Patent Citations

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