Positioning method and device for signal acquisition
By using electromagnetic acquisition probes, signal detection modules and acquisition equipment that control the gimbal, the chip electromagnetic signals are automatically positioned and collected, and the low signal quality caused by inaccurate acquisition positions in the prior art is solved, and high-quality signals are collected and improved chip performance is achieved.
Patent Information
- Application Number
- CN202510328503.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2025-06-27
AI Technical Summary
When collecting chip electromagnetic signals, it is difficult to accurately locate the acquisition position, resulting in poor signal quality, which in turn affects chip performance and the normal operation of electronic equipment.
The acquisition equipment including an electromagnetic acquisition probe, a signal detection module and a control panel is adopted to automatically move the electromagnetic acquisition probe to a position with the maximum signal-to-noise ratio and signal intensity for acquisition, ensuring the accuracy of the acquisition position.
High-quality electromagnetic signal acquisition is achieved, equipment damage and low signal quality caused by improper manual operation are avoided, and chip performance and the reliability of electronic equipment are improved.
Smart Images
Figure CN120214428A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of this specification relate to the field of chips, and particularly to a positioning method and device for signal acquisition. Background Art
[0002] During the operation of a chip, corresponding electromagnetic signals will be generated. The distribution and magnitude of the electromagnetic signals will affect the performance and stability of the chip. Therefore, during the chip design and manufacturing process, it is necessary to collect, analyze, and optimize the electromagnetic signals of the chip to improve the performance and reliability of the chip.
[0003] In addition, the electromagnetic signals of the chip will also interfere with the electronic devices carrying the chip, thereby affecting the normal operation of the electronic devices. To reduce or mitigate the impact of such interference, the electromagnetic signals of the chip can also be collected and analyzed to provide a reference for designing relevant anti-interference measures for the electronic devices.
[0004] In the related art, electromagnetic signals are usually collected manually based on personal experience. For example, workers rely on historical experience to locate the collection position, and then collect electromagnetic signals at the collection position. However, due to the increasing precision of chip manufacturing, not only is the volume of the chip getting smaller and smaller, making it increasingly difficult to collect the electromagnetic signals of the chip, but it is also difficult to accurately locate the collection position during manual collection. Moreover, as the internal integrated circuits of the chip become more and more complex, the collection positions provided by historical experience may no longer be the ideal collection positions. Considering the above factors, the quality of the signals collected today is poor, which in turn greatly reduces the analysis effect.
[0005] Therefore, a positioning solution for signal acquisition is needed to meet the requirement of collecting higher-quality signals. Summary of the Invention
[0006] A positioning method and device for signal acquisition provided by the embodiments of this specification are used to solve the problem of inaccurate collection of the electromagnetic signals of the chip.
[0007] According to the first aspect of the embodiments of this specification, a positioning method for signal acquisition is provided, which is applied to a collection device for collecting the electromagnetic signals of a chip. The collection device includes an electromagnetic collection probe, a signal detection module, and a control pan-tilt head. The method includes:
[0008] The control pan-tilt head controls the electromagnetic collection probe to move to a vertical position at a preset vertical distance from the surface of the chip;
[0009] While keeping the vertical position unchanged, the control pan-tilt head controls the electromagnetic collection probe to collect the electromagnetic signals at each horizontal position on a horizontal plane parallel to the surface of the chip, and the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at each horizontal position.
[0010] The control pan-tilt controls the electromagnetic acquisition probe to move to the target horizontal position with the maximum signal-to-noise ratio;
[0011] Keeping the target horizontal position unchanged, the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position in the vertical direction perpendicular to the surface of the chip, and the signal detection module calculates the signal strength at each vertical position;
[0012] The control pan-tilt controls the electromagnetic acquisition probe to move to the target vertical position with the maximum signal strength.
[0013] Optionally, the acquisition device further includes an electron microscope and a vision detection module;
[0014] Before the control pan-tilt controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip, the method further includes:
[0015] The electron microscope captures images of the tip of the electromagnetic acquisition probe and the surface of the chip;
[0016] The vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm, and further calculates the vertical displacement distance for the control pan-tilt to control the electromagnetic acquisition probe to move the electromagnetic acquisition probe based on the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance.
[0017] Optionally, the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position in a horizontal plane parallel to the surface of the chip, including:
[0018] The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position one by one at the horizontal movement step as the acquisition interval within the horizontal acquisition range parallel to the surface of the chip according to the preset horizontal acquisition range and horizontal movement step of the electromagnetic acquisition probe.
[0019] Optionally, the signal-to-noise ratio is calculated by the following method:
[0020]
[0021] Where SNB is the signal-to-noise ratio, N is the number of samplings, and x 1i is the sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling; x 1i is the sample point within the time range corresponding to the noise signal in the electromagnetic signal of the i-th sampling.
[0022] Optionally, the acquisition device further includes an electron microscope and a vision detection module; during the process of collecting electromagnetic signals at each horizontal position one by one, after the control pan-tilt moves the horizontal movement step each time, it further includes:
[0023] The electron microscope captures images of the tip of the electromagnetic acquisition probe and the surface of the chip;
[0024] The vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm and determines whether the vertical distance is the preset vertical distance;
[0025] If so, collect the electromagnetic signal at the current horizontal position; if not, the vision detection module further calculates the vertical displacement distance for the control pan-tilt to control the electromagnetic acquisition probe to move the electromagnetic acquisition probe according to the vertical distance, so that after the vertical distance between the tip and the surface of the chip reaches the preset vertical distance, collect the electromagnetic signal at the current horizontal position.
[0026] Optionally, the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position in the vertical direction with respect to the surface of the chip, including:
[0027] The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position one by one at intervals of the vertical movement step within the horizontal acquisition range parallel to the surface of the chip according to the preset vertical acquisition range and vertical movement step of the electromagnetic acquisition probe.
[0028] Optionally, the signal strength is calculated by the following method:
[0029]
[0030] wherein, is the signal strength, N is the number of samplings, and x 1i is the sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling.
[0031] Optionally, the target signal and the noise signal are determined at an accurate stage before the control pan-tilt controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip; the accurate stage includes:
[0032] Manually adjust the control pan-tilt to move the electromagnetic acquisition probe to a preset position to collect a set of electromagnetic signals including a section of noise signal and a section of complete target signal, and record the time ranges of the noise signal and the target signal.
[0033] Optionally, after the control gimbal controls the electromagnetic acquisition probe to move to the target vertical position, the method further includes:
[0034] Acquiring electromagnetic signals at the spatial position formed by the target horizontal position and the target vertical position.
[0035] According to a second aspect of the embodiments of the present specification, there is provided a positioning device for signal acquisition, which is applied to an acquisition device for acquiring electromagnetic signals of a chip. The acquisition device includes an electromagnetic acquisition probe, a signal detection module, and a control gimbal. The device includes:
[0036] A first positioning unit, where the control gimbal controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip;
[0037] A horizontal sampling unit, keeping the vertical position unchanged, the control gimbal controls the electromagnetic acquisition probe to acquire electromagnetic signals at each horizontal position on a horizontal plane parallel to the surface of the chip, and the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals acquired at each horizontal position;
[0038] A second positioning unit, where the control gimbal controls the electromagnetic acquisition probe to move to the target horizontal position with the largest signal-to-noise ratio;
[0039] A vertical sampling unit, keeping the target horizontal position unchanged, the control gimbal controls the electromagnetic acquisition probe to acquire electromagnetic signals at each vertical position in the vertical direction of the surface of the chip, and the signal detection module calculates the signal strength at each vertical position;
[0040] A third positioning unit, where the control gimbal controls the electromagnetic acquisition probe to move to the target vertical position with the largest signal strength.
[0041] Optionally, the acquisition device further includes an electron microscope and a vision detection module;
[0042] Before the first positioning unit, the device further includes:
[0043] An initial positioning unit, where the electron microscope captures an image of the tip of the electromagnetic acquisition probe and the surface of the chip; the vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm, and further calculates the vertical displacement distance for the control gimbal to control the electromagnetic acquisition probe to move the electromagnetic acquisition probe according to the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance.
[0044] Optionally, the horizontal sampling unit is further configured to keep the vertical position unchanged, and the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position one by one within the horizontal acquisition range parallel to the surface of the chip at intervals of the horizontal movement step according to the preset horizontal acquisition range and horizontal movement step of the electromagnetic acquisition probe.
[0045] Optionally, the signal-to-noise ratio is calculated as follows:
[0046]
[0047] where SNB is the signal-to-noise ratio, N is the number of samplings, and xi 1i is the sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling; xi 1i is the sample point within the time range corresponding to the noise signal in the electromagnetic signal of the i-th sampling.
[0048] Optionally, the acquisition device further includes an electron microscope and a vision detection module;
[0049] During the process of the horizontal sampling unit collecting electromagnetic signals at each horizontal position one by one, after the control pan-tilt moves the horizontal movement step each time, it further includes:
[0050] a calibration unit, where the electron microscope captures an image of the tip of the electromagnetic acquisition probe and the surface of the chip; the vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm and determines whether the vertical distance is the preset vertical distance; if so, it collects the electromagnetic signal at the current horizontal position; if not, the vision detection module further calculates the vertical displacement distance for the control pan-tilt to control the electromagnetic acquisition probe to move so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance, and then collects the electromagnetic signal at the current horizontal position.
[0051] Optionally, the vertical sampling unit is further configured to keep the target horizontal position unchanged, and the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position one by one within the horizontal acquisition range parallel to the surface of the chip at intervals of the vertical movement step according to the preset vertical acquisition range and vertical movement step of the electromagnetic acquisition probe.
[0052] Optionally, the signal intensity is calculated as follows:
[0053]
[0054] where is the signal strength, N is the number of samplings, and x 1i is a sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling.
[0055] Optionally, the target signal and the noise signal are determined by an accurate unit;
[0056] The accurate unit is configured to manually adjust the control gimbal to move the electromagnetic acquisition probe to a preset position to acquire a set of electromagnetic signals including a section of noise signal and a section of complete target signal, and record the time ranges of the noise signal and the target signal.
[0057] Optionally, after the third positioning unit, the following is further included:
[0058] A signal acquisition unit that acquires electromagnetic signals at the spatial position composed of the target horizontal position and the target vertical position.
[0059] According to a third aspect of the embodiments of the present specification, an electronic device is provided, including:
[0060] A processor;
[0061] A memory for storing instructions executable by the processor;
[0062] Wherein, the processor is configured to perform any one of the above methods.
[0063] The embodiments of the present specification provide a positioning solution for signal acquisition. It can enable the electromagnetic acquisition probe to automatically and accurately locate the acquisition position, and can avoid problems such as equipment damage caused by too close distance between the electromagnetic acquisition probe and the chip due to improper manual operation and poor signal quality due to inaccurate acquisition position. Description of the Drawings
[0064] Figure 1 is a schematic diagram of an acquisition device provided by an embodiment of the present specification;
[0065] Figure 2 is a schematic diagram of the connection relationship of each part in the acquisition device provided by an embodiment of the present specification;
[0066] Figure 3 is a flowchart of a positioning method for signal acquisition provided by an embodiment of the present specification;
[0067] Figure 4 is a hardware structure diagram of a positioning device for signal acquisition provided by an embodiment of the present specification;
[0068] Figure 5 is a module of a positioning device for signal acquisition provided by an embodiment of the present specification. Detailed Embodiments
[0069] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. On the contrary, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.
[0070] The terms used in this specification are for the purpose of describing particular embodiments only and are not intended to limit this specification. The singular forms "a", "the", and "said" used in this specification and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0071] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining".
[0072] As mentioned above, electromagnetic signals are usually collected manually based on personal experience. For example, staff locate the collection position based on historical experience and then collect electromagnetic signals at that collection position. However, due to the increasing precision of chip manufacturing, not only is the volume of the chip getting smaller and smaller, making it more and more difficult to collect the electromagnetic signals of the collection chip, and it is difficult to accurately locate the collection position during manual collection, but also as the internal integrated circuit of the chip becomes more and more complex, the collection positions provided by historical experience may no longer be the ideal collection positions; considering the above factors, the signal quality collected today is not good, which in turn greatly reduces the analysis effect.
[0073] In view of this, this specification aims to provide a positioning scheme for signal collection, automatically locating the collection position through a collection device composed of at least an electromagnetic collection probe, a signal detection module, and a control pan-tilt head; not only can the control pan-tilt head be used to gradually control the electromagnetic collection probe to collect electromagnetic signals at each collection position, so as to detect the ideal collection position by using the signal detection module, but also it can avoid damage to the equipment caused by friction due to the too-close distance between the electromagnetic collection probe and the chip due to improper manual operation.
[0074] Please refer to the following Figure 1An acquisition device for acquiring electromagnetic signals of a chip, the acquisition device may at least include an electromagnetic acquisition probe 12, a signal detection module B, and a control pan-tilt 13.
[0075] As Figure 1 shown, the electromagnetic acquisition probe 12 can be fixed to the control pan-tilt 13, and the control pan-tilt 13 controls the electromagnetic acquisition probe 12 to perform displacement in the horizontal and / or vertical directions above the chip 11. It should be noted that the control pan-tilt 13 can be further controlled by a pan-tilt controller C, and the pan-tilt controller C can store displacement parameters (such as displacement direction, displacement step size, displacement speed, constraint conditions, etc.) for instructing the control pan-tilt 13 to perform displacement. Among them, the constraint conditions can be subdivided into horizontal constraint conditions such as the allowable horizontal acquisition range for displacement, and vertical constraint conditions such as the maximum displacement distance vertically downward.
[0076] Among them, the horizontal acquisition range can be used to limit the acquisition range of the electromagnetic acquisition probe 12 to a horizontal plane parallel to the surface 16 of the chip 11. This horizontal acquisition range can be equal to the surface 16 of the chip 11, slightly smaller than the surface 16 of the chip 11, or slightly larger than the surface 16 of the chip 11.
[0077] The maximum displacement distance vertically downward is used to prevent the tip 15 of the electromagnetic acquisition probe 12 fixed to the control pan-tilt 13 from being too close to the surface 16 of the chip 11, resulting in friction and damage to the device.
[0078] In addition, the acquisition device may further include an electron microscope 14. The electron microscope 14 is used to capture an image of the tip 15 of the electromagnetic acquisition probe 12 and the surface 16 of the chip 11, and then the vision detection module A identifies the distance between the tip 15 and the surface 16 of the chip 11 in the image; when the distance meets the requirements, as Figure 2 shown, the vision detection module A can send a signal to the pan-tilt controller C to enable the pan-tilt controller C to instruct the control pan-tilt 13 to perform displacement.
[0079] After the control pan-tilt 13 performs displacement each time based on the displacement parameters of the pan-tilt controller C to control the electromagnetic acquisition probe 12 to perform displacement above the chip 11, the electromagnetic acquisition probe 12 can acquire the electromagnetic signals generated by the chip 11 at the current acquisition position, as Figure 2As shown, the electromagnetic signals collected by the electromagnetic acquisition probe 12 can be transmitted to the signal detection module B, and the signal detection module B analyzes the collected electromagnetic signals. After the signal detection module B receives the electromagnetic signals collected by the electromagnetic acquisition probe 12 at the current acquisition position, the signal detection module B can instruct the control pan-tilt 13 to perform the next displacement. The control pan-tilt 13 will move to the next acquisition position so that the electromagnetic acquisition probe 12 can collect the electromagnetic signals at the next acquisition position. Repeating this process can collect the electromagnetic signals at each acquisition position and the signal detection module B can analyze to obtain which acquisition position has the highest quality of the collected electromagnetic signals, thereby locating the ideal acquisition position.
[0080] It is worth mentioning that the above-mentioned vision detection module A, signal detection module B and pan-tilt controller C can be connected through an internal network or a dedicated network, or can also be connected through an encrypted public network to achieve communication with each other.
[0081] The following please refer to Figure 3 the schematic flow diagram of the positioning method for signal acquisition shown below. This method can be applied to the aforementioned acquisition device, and the acquisition device includes an electromagnetic acquisition probe, a signal detection module and a control pan-tilt. This method can include the following steps:
[0082] Step 310, the control pan-tilt controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip.
[0083] The preset vertical distance can be a preset empirical value. Generally, the preset vertical distance needs to be greater than 0 to ensure that the tip of the electromagnetic acquisition probe does not touch the surface of the chip.
[0084] In practical applications, in order to ensure that the vertical distance between the electromagnetic acquisition probe and the surface of the chip is the preset vertical distance, the electron microscope 14 and the vision detection module A shown above can be used. Figure 1 in the figure.
[0085] Exemplarily, before the above step 310, it can further include:
[0086] The electron microscope captures images of the tip of the electromagnetic acquisition probe and the surface of the chip;
[0087] The vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm, and further calculates the vertical displacement distance of the electromagnetic acquisition probe controlled by the control pan-tilt according to the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance.
[0088] In this example, after the visual detection module calculates the vertical distance (denoted as x1) between the tip of the electromagnetic acquisition probe and the surface of the chip, the vertical displacement distance (denoted as x3) can be obtained according to the preset vertical distance (denoted as x2) and the formula x3 = x1 - x2. Among them, when x3 is negative, it indicates that the current vertical distance x1 is less than the preset vertical distance x2. Therefore, it is necessary to control the pan-tilt to vertically displace upward by a distance of x3; when x3 is positive, it indicates that the current vertical distance x1 is greater than the preset vertical distance x2. Therefore, it is necessary to control the pan-tilt to vertically displace downward by a distance of x3.
[0089] Step 320, keep the vertical position unchanged. The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position on a horizontal plane parallel to the surface of the chip, and the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at each horizontal position.
[0090] After moving the electromagnetic acquisition probe to a vertical position at a preset vertical distance from the surface of the chip, it is necessary to keep this vertical position unchanged, and then the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position one by one on the horizontal plane.
[0091] In an exemplary embodiment, the control pan-tilt controlling the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position on a horizontal plane parallel to the surface of the chip may further include:
[0092] The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position one by one within the horizontal acquisition range parallel to the surface of the chip at intervals of the horizontal displacement step according to the preset horizontal acquisition range and horizontal displacement step of the electromagnetic acquisition probe.
[0093] As described above, the pan-tilt controller connected to the control pan-tilt can store displacement parameters indicating the displacement of the control pan-tilt; further, the displacement parameters include horizontal displacement parameters and subsequent vertical displacement parameters.
[0094] Among them, the horizontal displacement parameters include the allowable horizontal acquisition range and the horizontal displacement step. The horizontal acquisition range can be used to limit the acquisition range of the electromagnetic acquisition probe to a horizontal plane parallel to the surface of the chip. The horizontal acquisition range can be equal to, slightly smaller than, or slightly larger than the surface of the chip. The horizontal displacement step is used to control the distance of each horizontal displacement of the pan-tilt.
[0095] By controlling the horizontal acquisition range and the horizontal displacement step, each horizontal displacement of the pan-tilt will drive the electromagnetic acquisition probe to displace on the horizontal acquisition plane. After each movement of the horizontal displacement step, it will remain stationary for a period of time to allow the electromagnetic acquisition probe to collect the electromagnetic signals of the chip at the new horizontal position. The collected electromagnetic signals can be associated with the corresponding horizontal positions, so that when the signal detection module B compares the electromagnetic signals with the highest quality, it can locate the horizontal position where the electromagnetic signal with the highest quality is collected.
[0096] In an exemplary embodiment, after each movement of the horizontal displacement step by the pan-tilt, it may further include:
[0097] The electron microscope captures images of the tip of the electromagnetic acquisition probe and the surface of the chip;
[0098] The vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm and determines whether the vertical distance is the preset vertical distance;
[0099] If so, collect the electromagnetic signals at the current horizontal position; if not, the vision detection module further calculates the vertical displacement distance for the pan-tilt to control the electromagnetic acquisition probe to move the electromagnetic acquisition probe according to the vertical distance, so that after the vertical distance between the tip and the surface of the chip reaches the preset vertical distance, collect the electromagnetic signals at the current horizontal position.
[0100] In this embodiment, since there may be changes in the vertical direction when the pan-tilt makes a horizontal displacement, after each horizontal displacement of the pan-tilt, the vertical distance between the tip of the electromagnetic acquisition probe and the surface of the chip can be corrected to the preset vertical distance, so as to ensure that the vertical distance is consistent during each horizontal position acquisition, and reduce the adverse impact of inconsistent vertical distances on electromagnetic signal acquisition.
[0101] In this specification, when the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at each horizontal position, the signal-to-noise ratio can be calculated in the following manner:
[0102]
[0103] where SNB is the signal-to-noise ratio, N is the number of samplings, and x 1i is the sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling; x 1i is the sample point within the time range corresponding to the noise signal in the electromagnetic signal of the i-th sampling.
[0104] In this specification, the target signal and the noise signal may be determined during signal sampling of the electromagnetic signal at an accurate stage before step 310. The process of the preparation stage may be as follows:
[0105] The staff can manually operate the control gimbal to move the electromagnetic acquisition probe to a suitable position relative to the chip, and then collect a set of relatively clear electromagnetic signals; then use the signal detection module to detect the signal characteristics and determine the acquisition parameters. The acquisition parameters may include the acquisition trigger moment, the sampling rate, and the sampling time, so that the collected electromagnetic signal contains a segment of noise signal and a complete target signal in time, and the starting moments of the noise signal and the target signal need to be recorded for use in the process of calculating the signal-to-noise ratio in the positioning stage such as step 320 and calculating the signal strength in step 340.
[0106] Step 330, the control gimbal controls the electromagnetic acquisition probe to move to the target horizontal position with the maximum signal-to-noise ratio.
[0107] After the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at each horizontal position, the target horizontal position with the maximum signal-to-noise ratio can be determined through comparison; then the signal detection module can send the target horizontal position to the control gimbal or the gimbal controller, and the gimbal controller sends it to the control gimbal; thus enabling the control gimbal to move to this target horizontal position. Since the electromagnetic acquisition probe is fixed to the control gimbal, the displacement of the control gimbal will drive the electromagnetic acquisition probe to move to the target horizontal position at the same time. At this time, the electromagnetic acquisition probe will be positioned at the target horizontal position at a preset vertical distance from the surface of the chip.
[0108] Step 340, keeping the target horizontal position unchanged, the control gimbal controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position in the vertical direction with respect to the surface of the chip, and the signal detection module calculates the signal strength at each vertical position;
[0109] After moving the electromagnetic acquisition probe to the target horizontal position, the control gimbal further starts to automatically determine the vertical positions in the vertical direction.
[0110] Exemplarily, it is necessary to keep this target horizontal position unchanged, and then the control gimbal controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position one by one in the vertical direction.
[0111] In an exemplary embodiment, the control gimbal controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position in the vertical direction with respect to the surface of the chip, which may further include:
[0112] The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position one by one within the horizontal acquisition range parallel to the surface of the chip at intervals of the vertical displacement step according to the preset vertical acquisition range and vertical displacement step of the electromagnetic acquisition probe.
[0113] As described above, the pan-tilt controller connected to the control pan-tilt can store displacement parameters for instructing the control pan-tilt to perform displacement, and the displacement parameters include vertical displacement parameters.
[0114] Among them, the vertical displacement parameters include a vertical acquisition range and a vertical displacement step. The vertical acquisition range can be used to limit the acquisition range of the electromagnetic acquisition probe to a distance range perpendicular to the surface of the chip, such as (0, Y], indicating that the vertical distance between the tip of the electromagnetic acquisition probe and the surface of the chip needs to be greater than 0 and less than Y, and the Y represents the maximum value of the vertical upward displacement of the control pan-tilt. The vertical displacement step is used to control the distance of each vertical displacement of the control pan-tilt.
[0115] Through the vertical acquisition range and the vertical displacement step, each vertical displacement of the control pan-tilt will drive the electromagnetic acquisition probe to displace in the vertical direction, and after each movement of the vertical displacement step, it will be stationary for a period of time for the electromagnetic acquisition probe to collect the electromagnetic signals of the chip at the new vertical position. The collected electromagnetic signals can be associated with the corresponding vertical positions; so that when the signal detection module B compares the electromagnetic signals with the highest quality, it can locate the vertical position where the electromagnetic signal with the highest quality is collected.
[0116] In this specification, when the signal detection module calculates the signal strength at each vertical position, the signal strength can be calculated by the following method:
[0117]
[0118] Among them, is the signal strength, N is the number of samplings, and x 1i is the sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling.
[0119] Step 350, the control pan-tilt controls the electromagnetic acquisition probe to move to the target vertical position with the maximum signal strength.
[0120] After the signal detection module calculates the signal intensities of the electromagnetic signals collected at each vertical position, the target vertical position with the maximum signal intensity can be determined through comparison. Then, the signal detection module can send the target vertical position to the control pan-tilt or the pan-tilt controller, and the pan-tilt controller can send it to the control pan-tilt, so that the control pan-tilt is displaced to the target vertical position. Since the electromagnetic acquisition probe is fixed to the control pan-tilt, the displacement of the control pan-tilt will drive the electromagnetic acquisition probe to move to the target vertical position at the same time. At this time, the electromagnetic acquisition probe will be positioned at the spatial position formed by the target horizontal position and the target vertical position. In this way, the electromagnetic acquisition probe can be automatically and accurately positioned at the acquisition position, and problems such as equipment damage caused by too close distance between the electromagnetic acquisition probe and the chip due to improper manual operation and poor signal quality due to inaccurate acquisition position can be avoided.
[0121] After positioning to the spatial position formed by the target horizontal position and the target vertical position, it may further include:
[0122] Collect the electromagnetic signals at the spatial position formed by the target horizontal position and the target vertical position.
[0123] Since the electromagnetic signals collected at this spatial position have the maximum signal-to-noise ratio and signal intensity, this spatial position can be used as the signal acquisition position to achieve the acquisition of high-quality electromagnetic signals.
[0124] Corresponding to the foregoing embodiment of the positioning method for signal acquisition, this specification also provides an embodiment of the positioning device for signal acquisition. The device embodiment can be implemented by software, or by hardware or a combination of software and hardware. Taking software implementation as an example, as a logically meaningful device, it is formed by the processor of the device where it is located reading the corresponding computer program in the non-volatile memory into the memory and running. From the hardware level, as Figure 4 shown, it is a hardware structure diagram of the device where the positioning device for signal acquisition in this specification is located. In addition to Figure 4 the shown processor, network interface, memory, and non-volatile memory, the device where the embodiment is located usually includes other hardware according to the actual communication function, which will not be elaborated here.
[0125] Please refer to Figure 5 for the module diagram of the positioning device for signal acquisition provided by an embodiment of this specification. The device corresponds to Figure 3 the shown embodiment and is applied to an acquisition device for collecting electromagnetic signals of a chip. The acquisition device includes an electromagnetic acquisition probe, a signal detection module, and a control pan-tilt. The device includes:
[0126] The first positioning unit, the control pan-tilt controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip;
[0127] The horizontal sampling unit, keeping the vertical position unchanged, the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position on a horizontal plane parallel to the surface of the chip, and the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at each horizontal position;
[0128] The second positioning unit, the control pan-tilt controls the electromagnetic acquisition probe to move to the target horizontal position with the maximum signal-to-noise ratio;
[0129] The vertical sampling unit, keeping the target horizontal position unchanged, the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position in the vertical direction of the surface of the chip, and the signal detection module calculates the signal intensity at each vertical position;
[0130] The third positioning unit, the control pan-tilt controls the electromagnetic acquisition probe to move to the target vertical position with the maximum signal intensity.
[0131] Optionally, the acquisition device further includes an electron microscope and a vision detection module;
[0132] Before the first positioning unit, the device further includes:
[0133] The initial positioning unit, the electron microscope captures images of the tip of the electromagnetic acquisition probe and the surface of the chip; the vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm, and further calculates the vertical displacement distance for the control pan-tilt to move the electromagnetic acquisition probe according to the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance.
[0134] Optionally, the horizontal sampling unit is further configured to keep the vertical position unchanged, and the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position one by one within a horizontal acquisition range parallel to the surface of the chip at intervals of the horizontal movement step size according to the preset horizontal acquisition range and horizontal movement step size of the electromagnetic acquisition probe.
[0135] Optionally, the signal-to-noise ratio is calculated in the following manner:
[0136]
[0137] where SNB is the signal-to-noise ratio, N is the number of samplings, x 1iis a sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling; x 1i is a sample point within the time range corresponding to the noise signal in the electromagnetic signal of the i-th sampling.
[0138] Optionally, the acquisition device further includes an electron microscope and a vision detection module;
[0139] During the process of the horizontal sampling unit collecting electromagnetic signals at each horizontal position one by one, after the control pan-tilt moves the horizontal movement step each time, it further includes:
[0140] A correction unit, the electron microscope captures images of the tip of the electromagnetic acquisition probe and the surface of the chip; the vision detection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm and determines whether the vertical distance is the preset vertical distance; if so, collect the electromagnetic signal at the current horizontal position; if not, the vision detection module further calculates the vertical displacement distance for the control pan-tilt to move the electromagnetic acquisition probe according to the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance, and then collect the electromagnetic signal at the current horizontal position.
[0141] Optionally, the vertical sampling unit is further configured to keep the target horizontal position unchanged, and the control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position one by one within the horizontal acquisition range parallel to the surface of the chip at intervals of the vertical movement step according to the preset vertical acquisition range and vertical movement step of the electromagnetic acquisition probe.
[0142] Optionally, the signal strength is calculated by the following method:
[0143]
[0144] where is the signal strength, N is the number of samplings, x 1i is a sample point within the time range corresponding to the target signal in the electromagnetic signal of the i-th sampling.
[0145] Optionally, the target signal and the noise signal are determined by an accuracy unit;
[0146] The accuracy unit is used to manually adjust the control pan-tilt to move the electromagnetic acquisition probe to a preset position to collect a group of electromagnetic signals including a section of noise signal and a section of complete target signal, and record the time ranges of the noise signal and the target signal.
[0147] Optionally, after the third positioning unit, it further includes:
[0148] A signal acquisition unit that acquires electromagnetic signals at the spatial position formed by the target horizontal position and the target vertical position.
[0149] The systems, devices, modules, or units described in the above embodiments can be specifically implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer, and the specific form of the computer can be a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email transceiver device, a game console, a tablet computer, a wearable device, or a combination of any several of these devices.
[0150] For the implementation processes of the functions and roles of each unit in the above device, please refer to the implementation processes of the corresponding steps in the above method for details, which will not be elaborated here.
[0151] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to the partial descriptions of the method embodiments. The device embodiments described above are only illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they can be located in one place, or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution in this specification. Those of ordinary skill in the art can understand and implement it without creative efforts.
[0152] Above Figure 5 The internal functional modules and structural schematic of the positioning device for signal acquisition are described above. In essence, the execution subject can be an electronic device, including:
[0153] A processor;
[0154] A memory for storing executable instructions of the processor;
[0155] Wherein, the processor is configured to execute the embodiments of any of the above positioning methods for signal acquisition.
[0156] In the above embodiments of the electronic device, it should be understood that the processor may be a central processing unit (CPU for short), or other general-purpose processors, digital signal processors (DSP for short), application specific integrated circuits (ASIC for short), etc. The general-purpose processor may be a microprocessor or any conventional processor, etc., and the aforementioned memory may be a read-only memory (ROM for short), a random access memory (RAM for short), a flash memory, a hard disk, or a solid-state drive. The steps of the method disclosed in combination with the embodiments of the present invention may be directly embodied as being executed by a hardware processor, or executed by a combination of hardware and software modules in the processor.
[0157] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the embodiments of the electronic device, since it is basically similar to the method embodiments, the description is relatively simple. For the relevant parts, reference can be made to the partial description of the method embodiments.
[0158] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily think of other embodiments of this specification. This specification is intended to cover any variations, uses, or adaptations of this specification, which follow the general principles of this specification and include the common general knowledge or conventional technical means in the technical field not disclosed in this specification. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of this specification are pointed out by the following claims.
[0159] It should be understood that this specification is not limited to the exact structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of this specification is only limited by the appended claims.
Claims
1. A signal acquisition positioning method, characterized in that: A collection device for collecting electromagnetic signals of a chip, the collection device comprising an electromagnetic collection probe, a signal detection module and a control pan / tilt, the method comprising: The control pan / tilt controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip; Keeping the vertical position unchanged, the control pan / tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at various horizontal positions on a horizontal plane parallel to the surface of the chip, and the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at various horizontal positions; The control pan / tilt controls the electromagnetic acquisition probe to move to a target horizontal position with a maximum signal-to-noise ratio; Keeping the horizontal position of the target unchanged, the control pan / tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at various vertical positions in a direction perpendicular to the surface of the chip, and the signal detection module calculates the signal strength at each vertical position; The control pan / tilt controls the electromagnetic acquisition probe to move to a target vertical position with maximum signal strength.
2. The method according to claim 1, characterized in that: The acquisition equipment also includes an electron microscope and a visual detection module; Before the control platform controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip, the method further includes: The electron microscope captures an image of the tip of the electromagnetic collection probe and the surface of the chip; The visual inspection module calculates the vertical distance between the tip and the surface of the chip in the image through a ranging algorithm, and further calculates the vertical displacement distance of the electromagnetic acquisition probe controlled by the control gimbal based on the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance.
3. The method according to claim 1, characterized in that: The control pan / tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at various horizontal positions on a horizontal plane parallel to the surface of the chip, including: The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each horizontal position one by one within the horizontal acquisition range parallel to the surface of the chip and with the horizontal displacement step as the acquisition interval, according to the preset horizontal acquisition range and horizontal displacement step of the electromagnetic acquisition probe.
4. The method according to claim 3, characterized in that: The signal-to-noise ratio is calculated as follows: Where SNB is the signal-to-noise ratio, N is the number of sampling times, x 1i is the sample point in the time range corresponding to the target signal in the electromagnetic signal sampled for the i-th time; 1i is the sample point within the time range corresponding to the noise signal in the electromagnetic signal sampled for the i-th time.
5. The method according to claim 3, characterized in that: The acquisition device further includes an electron microscope and a visual detection module; in the process of acquiring electromagnetic signals at each horizontal position one by one, after the control platform moves the horizontal displacement step each time, it also includes: The electron microscope captures an image of the tip of the electromagnetic collection probe and the surface of the chip; The visual inspection module calculates the vertical distance between the tip and the surface of the chip in the image by using a distance measurement algorithm, and determines whether the vertical distance is the preset vertical distance; If yes, the electromagnetic signal of the current horizontal position is collected; if not, the visual detection module further calculates the vertical displacement distance of the electromagnetic acquisition probe controlled by the control gimbal according to the vertical distance, so that the vertical distance between the tip and the surface of the chip reaches the preset vertical distance, and then the electromagnetic signal of the current horizontal position is collected.
6. The method according to claim 1, characterized in that The control pan / tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at various vertical positions in a direction perpendicular to the surface of the chip, including: The control pan-tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at each vertical position one by one within a horizontal acquisition range parallel to the surface of the chip, with the vertical displacement step as the acquisition interval, according to the pre-set vertical acquisition range and vertical displacement step of the electromagnetic acquisition probe.
7. The method according to claim 6, characterized in that The signal strength is calculated as follows: in, is the signal strength, N is the number of sampling times, x 1i is the sample point within the time range corresponding to the target signal in the electromagnetic signal sampled for the i-th time.
8. The method according to claim 4 or 7, wherein the target signal and the noise signal are determined in an accurate stage before the control pan / tilt controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip; the accurate stage comprises: The control pan-tilt is manually adjusted to move the electromagnetic acquisition probe to a preset position to collect a set of electromagnetic signals including a noise signal and a complete target signal, and the time range of the noise signal and the target signal is recorded.
9. The method according to claim 1, characterized in that: After the pan-tilt control unit controls the electromagnetic acquisition probe to move to the target vertical position, the method further includes: The electromagnetic signal of the spatial position formed by the horizontal position of the target and the vertical position of the target is collected.
10. A positioning device for signal collection, characterized in that: A collection device for collecting electromagnetic signals of a chip, the collection device includes an electromagnetic collection probe, a signal detection module and a control pan / tilt, and the device includes: A first positioning unit, the control platform controls the electromagnetic acquisition probe to move to a vertical position at a preset vertical distance from the surface of the chip; A horizontal sampling unit, wherein the vertical position is kept unchanged, the control pan / tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at various horizontal positions on a horizontal plane parallel to the surface of the chip, and the signal detection module calculates the signal-to-noise ratio of the electromagnetic signals collected at various horizontal positions; A second positioning unit, the control platform controls the electromagnetic acquisition probe to move to a target horizontal position with a maximum signal-to-noise ratio; A vertical sampling unit, wherein the horizontal position of the target is kept unchanged, the control pan / tilt controls the electromagnetic acquisition probe to collect electromagnetic signals at various vertical positions in a direction perpendicular to the surface of the chip, and the signal detection module calculates the signal strength at each vertical position; The third positioning unit controls the gimbal to move the electromagnetic acquisition probe to a target vertical position with maximum signal strength.
11. An electronic device, characterized in that: include: processor; a memory for storing processor-executable instructions; The processor is configured to execute the method according to any one of claims 1 to 9.