Optical fiber connector with heat dissipation function

Abstract

The application provides an optical fiber adapter with heat dissipation function, and belongs to the technical field of optical fiber connection, which comprises a connector main body, a ceramic ferrule and a light-heat cooperation mechanism, wherein the connector main body comprises a heat-conducting inner shell, a graphene outer shell is fixedly installed outside the heat-conducting inner shell, a cavity is formed between the heat-conducting inner shell and the graphene outer shell, two connecting ports are symmetrically formed on the left and right sides of the heat-conducting inner shell, the two connecting ports are communicated, and a ceramic alignment sleeve is fixedly installed between the two connecting ports; the ceramic ferrule is inserted into the ceramic alignment sleeve, the ceramic ferrule is made of zirconia material, an optical fiber is embedded in the ceramic ferrule, and the optical fiber is arranged in the axial direction of the ceramic ferrule and fixed in the center hole of the ceramic ferrule. The application solves the problems of optical fiber aging, structure damage and system failure caused by heat accumulation in high-power optical communication.

Description

Technical Field

[0001] This invention relates to the field of optical fiber connection technology, and in particular to an optical fiber connector with heat dissipation function. Background Technology

[0002] Fiber optic connectors are key components in optical communication systems used to achieve detachable connections between optical fibers or between optical fibers and devices. They are widely used in data centers, telecommunications networks, and sensing systems. With the development of optical communication technology, especially the widespread adoption of high-speed, high-capacity optical transmission systems, the application scenarios for fiber optic connectors are becoming increasingly complex, and the performance requirements for them are also rising.

[0003] In high-power optical transmission or high-density fiber optic connection scenarios, heat can accumulate inside fiber optic connectors due to absorption, scattering, or minor defects at the connector end face during optical signal transmission. If this heat cannot be dissipated in time, it may lead to the following problems: 1. High temperatures can cause aging of fiber optic materials or physical deformation of the connector end face, reducing signal transmission quality and increasing the bit error rate; 2. Overheating may damage the structure of the fiber optic connector, such as the ceramic ferrule, plastic shell, or adhesive, leading to connection failure; 3. In high-density environments such as data centers, heat accumulation may trigger system-level failures, affecting the stability of the overall communication network. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the above and / or prior art, the present invention is proposed.

[0006] Therefore, the technical problem to be solved by the present invention is to design a high-efficiency heat dissipation fiber optic connector to overcome the shortcomings of existing water cooling systems, such as reliance on external equipment, system complexity, high maintenance costs, and space limitations.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an optical fiber connector with heat dissipation function, comprising,

[0008] The connector body includes a thermally conductive inner shell, a graphene outer shell is fixedly installed on the outside of the thermally conductive inner shell, a cavity is formed between the thermally conductive inner shell and the graphene outer shell, and connection ports are symmetrically formed on the left and right sides of the thermally conductive inner shell. The two connection ports are connected and a ceramic alignment sleeve is fixedly installed between them.

[0009] A ceramic ferrule, inserted into the ceramic alignment sleeve, is made of zirconium oxide and contains an embedded optical fiber. The optical fiber passes through the ceramic ferrule along its axial direction and is fixed within the central hole of the ceramic ferrule; and...

[0010] A photothermal synergy mechanism, disposed within the connector body, includes:

[0011] The microstructured heat-conducting network includes a main channel formed around the outer surface of the ceramic alignment sleeve, and branch channels formed at the extension ends of the multiple main channels;

[0012] The phase change heat dissipation unit includes a porous copper foam, a copper metal mesh, and a photosensitive phase change material that surround the middle and rear section of the heat-conducting inner shell and are embedded in the cavity. The photosensitive phase change material fills the pores of the porous copper foam in the form of microcapsules, and the copper metal mesh wraps the porous copper foam.

[0013] The optical signal modulation unit includes a thermosensitive shape memory alloy, a micro electrophoresis pump, a micro valve, a micro sensor, and a flexible circuit board. The thermosensitive shape memory alloy is fixed inside the side wall of the main channel. The micro electrophoresis pump and the micro valve are located outside the entrance of the main channel. The micro sensor is embedded inside the copper metal mesh. The flexible circuit board is embedded inside the graphene shell.

[0014] As a preferred embodiment of the optical fiber connector with heat dissipation function described in this invention, the microstructure heat-conducting network includes a main channel, each main channel being distributed circumferentially along the outer surface of the ceramic alignment sleeve, with a graphene-carbon nanotube composite coating deposited on the inner wall, and the extension end of each main channel being connected to multiple branch channels, the branch channels being connected to the phase change heat dissipation unit through lateral micropores.

[0015] As a preferred embodiment of the optical fiber connector with heat dissipation function described in this invention, the inner wall of the main channel is provided with an elastic deformation groove, and the thermosensitive shape memory alloy is a nickel-titanium alloy microwire, which is fixed in the elastic deformation groove.

[0016] As a preferred embodiment of the optical fiber connector with heat dissipation function described in this invention, wherein: the photosensitive phase change material is filled into the pores of the porous copper foam by vacuum impregnation, and the photosensitive phase change material comprises paraffin-based microcapsules.

[0017] As a preferred embodiment of the fiber optic connector with heat dissipation function described in this invention, two microsensors are embedded at the left and right ends of the copper metal mesh close to the heat-conducting inner shell, and the microsensors are silicon-based thermocouples.

[0018] As a preferred embodiment of the fiber optic connector with heat dissipation function described in this invention, the main channel and branch channels of the microstructure heat-conducting network are filled with photosensitive / thermal microfluidic fluid, the microfluidic fluid is liquid crystal-based, the micro-electrophoresis pump is fixed in a reserved slot outside the inlet of the main channel, the micro-valve is a silicon-based structure, and the micro-electrophoresis pump and the micro-valve work together to control the unidirectional flow of the microfluidic fluid into the main channel.

[0019] As a preferred embodiment of the fiber optic connector with heat dissipation function described in this invention, the flexible circuit board is made of polyimide-based material, circumferentially attached to the inner wall of the graphene shell, and connected to the microsensor, micro-electrophoretic pump, micro-valve and thermosensitive shape memory alloy via copper microwires.

[0020] As a preferred embodiment of the optical fiber connector with heat dissipation function described in this invention, the optical signal modulation unit coordinates the SiO2 optical waveguide of the ceramic alignment sleeve through the refractive index change of the microfluidic and photosensitive phase change material.

[0021] The beneficial effects of this invention are:

[0022] 1. The connectors in this device utilize highly thermally conductive materials such as a thermally conductive inner shell and a ceramic alignment sleeve. Combined with a microfluidic stream that rapidly carries away heat like water, and a phase change material that absorbs heat, the temperature of the optical fiber and connectors is kept very low. This protects the optical fiber from high-temperature aging and prevents end-face deformation, resulting in exceptionally clear optical signal transmission with virtually no bit errors. This makes it particularly suitable for the stable operation of data centers and 5G networks.

[0023] 2. The connectors in this device are made of hard and wear-resistant ceramic materials, combined with high-temperature resistant adhesive and a thermally conductive coating. The thermosensitive shape memory alloy can also automatically adjust the microfluidic flow rate at high temperatures to accelerate heat dissipation. This makes the connectors not only heat-resistant but also capable of repeated insertion and removal without damage. The structure is robust, the adhesive does not soften, and damage caused by overheating is completely avoided. This results in a long service life and exceptional reliability.

[0024] 3. In this device, the connectors utilize a microfluidic and intelligent control system to rapidly conduct heat from the core components to the outer casing for dissipation, making the overall heat dissipation function like a highly efficient "air conditioning system." Microsensors monitor the temperature in real time, and micropumps and microvalves precisely adjust the temperature to prevent heat buildup. This makes it particularly suitable for high-density equipment environments, reducing system failures and ensuring smooth and stable operation of the entire communication network. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0026] Figure 1 This is a perspective view of the overall structure of the present invention;

[0027] Figure 2 This is a front sectional view of the present invention;

[0028] Figure 3 This is an enlarged schematic diagram of the microstructure heat-conducting network of the present invention;

[0029] Figure 4 This is an enlarged schematic diagram of the phase change heat dissipation unit of the present invention. Detailed Implementation

[0030] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0032] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0033] Example

[0034] Reference Figures 1-4 This invention provides a fiber optic connector with heat dissipation capabilities, specifically designed for high-power optical communication scenarios such as data centers, 5G communications, and laser transmission. Through an innovative structure and photothermal synergy mechanism, this connector achieves efficient thermal management and dynamic optical signal modulation, ensuring signal stability and equipment reliability under high-power transmission conditions.

[0035] Its core components include connector body 100, ceramic ferrule 200 and photothermal co-processing mechanism 300. These components work closely together to form a compact and durable fiber optic connection system that complies with SC standards.

[0036] The connector body 100 is the skeleton of the fiber optic connector, responsible for structural support, heat conduction, and external protection. It includes a thermally conductive inner shell 101, a graphene outer shell 102, a cavity 103, a connector port 101a, and a ceramic alignment sleeve 104. The thermally conductive inner shell 101 is made of aluminum nitride, with a thermal conductivity of approximately 170 W / m·K and high mechanical strength (compression resistance greater than 500 MPa). It fixes the ceramic alignment sleeve 104 and the ceramic ferrule 200, rapidly transferring the high heat generated by fiber optic transmission to the photothermal coordination mechanism 300, reducing the temperature rise to below 7°C (this principle is explained in detail below).

[0037] The graphene shell 102 is made of graphene composite material with a thermal conductivity greater than 700 W / m·K. As an outer protective structure, it dissipates internal heat to the external environment, preventing heat buildup. It is lightweight (density approximately 2 g / cm³). 3 The high strength (tensile strength greater than 200 MPa) and other characteristics make the connector compact and durable.

[0038] A cavity 103 is formed between the thermally conductive inner shell 101 and the graphene outer shell 102, providing space for the phase change heat dissipation unit 302 and the flexible circuit board 303e of the photothermal synergy mechanism 300, while isolating heat and electrical signal interference, and enhancing system stability.

[0039] Symmetrical connection ports 101a are opened on the left and right sides of the thermally conductive inner shell 101. The two connection ports 101a are connected to ensure precise connection between the optical fiber 201 and the external optical cable. A ceramic alignment sleeve 104 is fixedly installed between the connection ports 101a. The ceramic alignment sleeve 104 is made of zirconium oxide material with a hardness greater than 1200 HV, with an embedded SiO2 optical waveguide, a refractive index of 1.46, and a graphene-carbon nanotube composite coating on its surface, with a thermal conductivity greater than 6000 W / m·K. The ceramic alignment sleeve 104 achieves optical alignment of the optical fiber 201 through the waveguide, with an insertion loss of less than 0.08 dB and a return loss greater than 65 dB. At the same time, the high thermal conductivity coating transfers heat from the end face to the microstructure thermally conductive network 301, providing a basis for photothermal synergy.

[0040] The ceramic alignment sleeve 104 achieves precise connection between optical fiber 201 and external optical cable through an embedded SiO2 optical waveguide, achieving an insertion loss of less than 0.08 dB and a return loss of more than 65 dB. Its underlying mechanism lies in high-precision alignment, low refractive index mismatch, smooth end face, optimized thermal management, and structural stability, which together ensure efficient optical signal transmission and extremely low reflection.

[0041] 1. High-precision alignment: The SiO2 optical waveguide of the ceramic alignment sleeve 104 is aligned with the fiber core diameter of the optical fiber 201, which is approximately 8-10 μm in diameter, with a deviation of less than 0.1 μm and an angular deviation of less than 0.01°. The connection port 101a of the heat-conducting inner shell 101 firmly fixes the alignment sleeve 104, ensuring that the optical signal is transmitted as if through a seamless pipe, with almost no light loss or offset. This precise alignment results in extremely low optical power loss, with an insertion loss of less than 0.08 dB, while reducing optical signal bounce and achieving a return loss of greater than 65 dB.

[0042] 2. Low Refractive Index Mismatch: The refractive index of the SiO2 waveguide (1.46) is very close to that of the 201 fiber core (1.468), with a difference of less than 0.008. This near-identical refractive index ensures that the optical signal experiences almost no reflection at the waveguide and fiber interface, much like light passing smoothly through transparent glass. This extremely low reflection results in only a slight increase in insertion loss (less than 0.001 dB), a reflected light power as low as 0.00003%, and a return loss exceeding 65 dB.

[0043] 3. Smooth End Faces: The end faces of the ceramic alignment sleeve 104 and the optical fiber 201 are polished to a mirror-like smoothness, with a roughness of less than 0.01 μm and a contact gap of less than 0.1 μm. This high smoothness prevents optical signals from scattering or diffusely reflecting at the end faces, similar to how a beam of light does not diffuse when passing through smooth glass. Scattering loss is also less than 0.01 dB, reflected light is almost non-existent, contributing to insertion loss <0.08 dB and return loss >65 dB.

[0044] 4. Optimized Thermal Management: The ceramic alignment sleeve 104 is coated with a graphene-carbon nanotube coating, which has extremely high thermal conductivity (>6000 W / m·K). This rapidly transfers the heat generated by high-power transmission (50W-500W) to the microstructured heat-conducting network 301, keeping the alignment sleeve temperature below 55°C. This stable temperature prevents refractive index drift or micro-deformation of the end face, with a deviation of <0.1 μm, ensuring consistent optical signal transmission and maintaining excellent insertion and return losses over the long term.

[0045] 5. Structural Stability: The ceramic alignment sleeve 104 is made of zirconium oxide material with a hardness exceeding 1200 HV, high compressive strength, and deformation less than 0.001 mm. The connection port 101a of the thermally conductive inner shell 101 provides stable support, and the insertion and extraction force is controlled within 2-5 N. This robust structure ensures that the end face and alignment accuracy remain unchanged over a long period, and the optical signal transmission and reflection performance are stable, with insertion loss always <0.08 dB and return loss >65 dB.

[0046] Technical Achievements: Through the above mechanisms, the ceramic alignment sleeve 104 allows optical signals to flow like water through a seamless pipe, transmitting with virtually no loss (insertion loss <0.08 dB) and almost no light bounce (return loss >65 dB). High-precision alignment and smooth end faces reduce light loss, low refractive index mismatch suppresses reflection, thermal management maintains stable performance, and a robust structure ensures long-term reliability. This comprehensive optimization supports high-power transmission (50W-500W), making it suitable for data centers and 5G communications.

[0047] Furthermore, the ceramic ferrule 200 is the optical core of the fiber optic connector, responsible for fixing the fiber and transmitting signals. It is inserted into the ceramic alignment sleeve 104, made of zirconium oxide material with a hardness greater than 1200 HV and a thermal conductivity of approximately 2 W / m·K, exhibiting high precision and wear resistance. The ceramic ferrule 200 embeds the optical fiber 201, which passes through the ferrule axially and is fixed within a central hole 202 with a diameter of 0.125-0.127 mm. This central hole is bonded using a high-precision adhesive 203, which is an epoxy resin with a temperature resistance greater than 150°C, an adhesive strength greater than 5 MPa, and an alignment deviation of less than 0.1 μm. The optical fiber 201 transmits high-power optical signals (50W-500W) through the SiO2 optical waveguide of the ceramic alignment sleeve 104, and its end-face heat is efficiently managed by an adaptive coating on the ferrule surface. The adaptive coating exhibits a reflectivity greater than 85% at temperatures above 60°C. Embedded carbon nanotube fibers with a thermal conductivity greater than 3000 W / m·K rapidly transfer heat to the microstructured heat-conducting network 301, while simultaneously reducing thermal radiation damage to the optical fiber 201, protecting it from thermal stress and mechanical damage. The precise mating (approximately 2-5 N insertion / extraction force) between the ceramic ferrule 200 and the ceramic alignment sleeve 104 ensures stable optical and thermal performance, and works in conjunction with the optical signal modulation unit 303 to achieve dynamic signal adjustment, improving signal stability during high-power transmission.

[0048] The photothermal synergy mechanism 300 is the innovative core of the connector, integrating a microstructure heat-conducting network 301, a phase-change heat dissipation unit 302, and an optical signal modulation unit 303 to achieve a seamless combination of thermal management and optical signal modulation. It is located within the connector body 100 and, through its integrated photothermal design, solves the problems of heat accumulation and signal distortion in high-power transmission.

[0049] The microstructured heat-conducting network 301 includes four main channels 301a, each circumferentially distributed along the outer surface of the ceramic alignment sleeve 104, with a diameter of 0.2-0.3 mm. The inner wall of each main channel 301a is deposited with a graphene-carbon nanotube composite coating, 0.5 μm thick, with a thermal conductivity greater than 6000 W / m·K and a surface roughness Ra less than 0.01 μm. The extended ends of the main channels 301a connect to 8-12 branch channels 301b, each 0.1 mm in diameter, which communicate with the phase change heat dissipation unit 302 through lateral micropores (0.1 mm in diameter, 20 per segment).

[0050] The main channel 301a and branch channel 301b are filled with photosensitive / thermosensitive microfluidics. The microfluidics are liquid crystal-based, with a refractive index of 1.5-1.7, doped with 5 wt% azobenzene dye, a response wavelength of 400-700 nm, and a flow rate of 0.1 μL / s. The microfluidics circulate in the main channel 301a, absorbing heat from the ceramic alignment sleeve 104 and ceramic ferrule 200 like water flow, and are then introduced into the phase change heat dissipation unit 302 through the branch channel 301b. Simultaneously, the refractive index of the microfluidics changes by approximately 0.2 when illuminated at 400-700 nm or at a temperature greater than 60°C. This change, Δn, works in conjunction with the SiO2 optical waveguide to dynamically adjust the optical signal attenuation (0-3 dB), similar to adjusting the brightness of a light bulb. An elastic deformation groove 301c is opened on the inner wall of the main channel 301a to fix the thermosensitive shape memory alloy 303a. The thermosensitive shape memory alloy 303a is a nickel-titanium alloy microwire with a diameter of 0.05 mm. It shrinks when the temperature is greater than 60°C, with a deformation of about 5%, which expands the diameter of the main channel 301a to 0.3 mm and increases the microfluidic flow rate by about 30%, thereby enhancing heat dissipation and modulation efficiency.

[0051] The enhanced heat dissipation and modulation efficiency are due to the dynamic flow regulation of the thermistor shape memory alloy 303a. Thermistor shape memory alloy 303a is a nickel-titanium microwire with a diameter of 0.05 mm. At temperatures >60°C, it shrinks by approximately 5%, expanding the diameter of the main channel 301a from 0.2 mm to 0.3 mm, increasing the microfluidic flow rate by 30%, from 0.1 μL / s to 0.13 μL / s. This accelerates microfluidic convective heat transfer, allowing heat from the ceramic alignment sleeve 104 and ceramic ferrule 200 to be more quickly transferred to the phase change heat dissipation unit 302, reducing the temperature rise by 2-3°C. Simultaneously, the increased flow rate makes the microfluidic refractive index change more uniform, synergizing with the SiO2 optical waveguide to improve the modulation accuracy of the optical signal.

[0052] The phase change heat dissipation unit 302 is responsible for absorbing and storing heat, ensuring that the temperature rise of the connector is less than 7°C. It surrounds the rear section of the heat-conducting inner shell 101 and is embedded in the cavity 103, comprising a porous copper foam 302a, a copper metal mesh 302b, and a photosensitive phase change material 302c. The porous copper foam 302a has a gradient porosity greater than 90%, an inner pore diameter of 0.1 mm, and an outer pore diameter of 0.3 mm, and is filled with the photosensitive phase change material 302c through vacuum impregnation. The photosensitive phase change material 302c is a paraffin-based microcapsule with a diameter of 10-50 μm, a filling rate greater than 95%, a latent heat of approximately 220 kJ / kg, a melting point of 50°C, a refractive index of 1.6-1.8, and a response wavelength of 500-800 nm. The photosensitive phase change material 302c melts at 50°C, absorbing heat like melting ice, with a latent heat of 220 kJ / kg, effectively controlling the temperature rise. At the same time, the refractive index changes (Δn is about 0.15) under 500-800 nm light illumination, which helps to modulate the optical signal.

[0053] A copper mesh 302b encapsulates a porous copper foam 302a. The mesh has a pore diameter of 0.2 mm, a thickness of 0.5 mm, and a thermal conductivity of approximately 400 W / m·K. Its surface is coated with a fluorinated hydrophobic layer with a contact angle greater than 120° to prevent microfluidic leakage. Two microsensors 303d are embedded at the left and right ends of the copper mesh 302b, close to the thermally conductive inner shell 101. These microsensors 303d are silicon-based thermocouples, measuring 0.5 mm × 0.3 mm, with an accuracy of ±0.1°C. They monitor temperatures above 50°C or light-controlled signals, triggering the dynamic response of the light signal modulation unit 303. The phase change heat dissipation unit 302 and the microstructure heat conduction network 301 work together through microfluidics and thermal interface material (graphite-based, 0.05 mm thick, thermal conductivity greater than 10 W / m·K). The microfluidics introduces heat from the main channel 301a through the branch channel 301b into the porous copper foam 302a. The photosensitive phase change material 302c absorbs the heat, and the copper metal mesh 302b further conducts it to the graphene shell 102. The thermal resistance is less than 0.2 K / W.

[0054] The optical signal modulation unit 303 achieves dynamic signal modulation and thermal management through photothermal synergy, optimizing signal stability for high-power transmission. It includes a microfluidic system, a photosensitive phase change material 302c, a SiO2 optical waveguide with a ceramic alignment sleeve 104, a thermosensitive shape memory alloy 303a, a micro-electrophoretic pump 303b, a micro-valve 303c, a micro-sensor 303d, and a flexible circuit board 303e. The micro-electrophoretic pump 303b is fixed to a pre-reserved slot outside the inlet of the main channel 301a, with dimensions of 0.2 mm × 0.2 mm × 0.1 mm, an operating voltage of 3V, and a flow rate of 0.1 μL / s. The micro-valve 303c is a silicon-based MEMS structure with a diameter of 0.1 mm, containing a polydimethylsiloxane membrane, and a response time of less than 0.01 s. It works in conjunction with the micro-electrophoretic pump 303b to control the unidirectional flow of the microfluidic system into the main channel 301a, precisely regulating the water flow like a faucet. The microfluidic flows in the main channel 301a, interacting with the SiO2 optical waveguide. It modulates the optical signal attenuation (0-3 dB) and polarization rotation (less than 10°) through refractive index changes (Δn approximately 0.2). The thermosensitive shape memory alloy 303a shrinks at temperatures above 60°C, adjusting the microfluidic flow rate and enhancing modulation accuracy.

[0055] The photosensitive phase change material 302c exhibits a refractive index change (Δn approximately 0.15) under 500-800 nm illumination, further optimizing signal stability. The microsensor 303d monitors temperature and light control signals in real time, transmitting I signals via the flexible circuit board 303e. 2 The C and PWM signals control the micro electrophoresis pump 303b, the micro valve 303c, and the thermosensitive shape memory alloy 303a, forming a closed-loop feedback.

[0056] The flexible circuit board 303e is made of polyimide-based material with a thickness of 0.05 mm. It is circumferentially bonded to the inner wall of the graphene shell 102 and connected to the micro-sensor 303d, micro-electrophoretic pump 303b, micro-valve 303c and thermal shape memory alloy 303a through copper microwires to ensure stable signal transmission.

[0057] The optical signal modulation unit 303 achieves an insertion loss of less than 0.08 dB and a return loss of more than 65 dB by dynamically changing the refractive index of the microfluidic and photosensitive phase change material 302c, combined with the optical alignment of the waveguide, thus adapting to high-power transmission.

[0058] The principle behind reducing the temperature rise of the thermally conductive inner shell 101 to below 7°C is as follows:

[0059] The thermally conductive inner shell 101 is made of aluminum nitride, which has a thermal conductivity of up to 170 W / m·K, far exceeding that of traditional plastics or low-thermal-conductivity ceramics. The lattice structure of aluminum nitride gives it high thermal conductivity, allowing heat to be transferred rapidly through lattice vibrations. When the optical fiber 201 transmits high-power optical signals, the end face of the ceramic ferrule 200 generates heat due to light absorption and scattering (power density can reach 10 W / m·K).5 -10 6 W / m 2 The heat is first transferred to the ceramic alignment sleeve 104 (zirconia, with a graphene-carbon nanotube coating, thermal conductivity >6000 W / m·K). The thermally conductive inner shell 101 is in close contact with the ceramic alignment sleeve 104 (contact thermal resistance <0.05 K / W). The high thermal conductivity of aluminum nitride rapidly absorbs heat from the surface of the alignment sleeve 104 into the interior of the inner shell 101, achieving a heat flux density of up to 10⁻⁶ W / m·K. 4 W / m 2 This efficient heat conduction ensures that heat does not accumulate at the ferrule 200 and alignment sleeve 104, initially reducing local temperature rise;

[0060] Subsequently, the thermally conductive inner shell 101 surrounds the ceramic alignment sleeve 104. Four main channels 301a (0.2-0.3 mm in diameter) of the microstructured thermally conductive network 301 are circumferentially distributed along the outer surface of the alignment sleeve 104, and the inner wall is coated with a graphene-carbon nanotube composite coating (thermal conductivity >6000 W / m·K). The main channels 301a are filled with photosensitive / thermal-sensitive microfluidic fluid (liquid crystal-based, flow rate 0.1 μL / s). The microfluidic fluid acts as a "heat transporter," rapidly transferring heat from the inner shell 101 to the branch channels 301b through convection and conduction. The branch channels 301b are connected to the phase change heat dissipation unit 302 through lateral micropores, forming a continuous heat flow path.

[0061] Meanwhile, the elastic deformation groove 301c fixed to the main channel 301a is a nickel-titanium alloy microwire with a diameter of 0.05 mm. When the temperature is greater than 60°C, the alloy shrinks (deformation of about 5%), expanding the diameter of the main channel 301a to 0.3 mm, increasing the microfluidic flow rate by about 30% from 0.1 μL / s to 0.13 μL / s, accelerating heat transfer, and reducing the local temperature rise by about 2-3°C. The micro electrophoresis pump 303b (size 0.2 mm × 0.2 mm × 0.1 mm, voltage 3V, flow rate 0.1 μL / s) and the microvalve 303c (silicon-based MEMS, diameter 0.1 mm, PDMS membrane, response time <0.01 s) are fixed outside the inlet of the main channel 301a to control the unidirectional inflow of microfluidic fluid and prevent backflow interference. Microsensor 303d (silicon-based thermocouple, accuracy ±0.1°C) is embedded in copper mesh 302b to monitor temperature (>50°C) or light control signals (400-700 nm) in real time, via flexible circuit board 303e (polyimide-based, I... 2 C / PWM signal (100 Hz) triggers electrophoresis pump 303b and microvalve 303c to dynamically adjust flow rate and optimize heat dissipation efficiency;

[0062] Finally, the microfluidic introduces heat from the branch channel 301b into the porous copper foam 302a. The photosensitive phase change material 302c melts at 50°C, absorbing a large amount of heat like a "heat sponge" and effectively suppressing the temperature rise. The copper metal mesh 302b is connected to the branch channel 301b through a thermally conductive interface material (graphite-based, thermal conductivity >10 W / m·K, thickness 0.05 mm), conducting the remaining heat to the graphene shell 102, and finally diffusing it into the external environment.

[0063] The overall working principle and component coordination of this device are as follows: When the optical fiber 201 transmits high-power optical signals (50W-500W), heat is generated at the end face of the ceramic ferrule 200. The adaptively coated carbon nanotube fibers, with a thermal conductivity greater than 3000 W / m·K, transfer the heat to the ceramic alignment sleeve 104. The graphene-carbon nanotube coating of the alignment sleeve 104, with a thermal conductivity greater than 6000 W / m·K, further conducts the heat to the microstructure heat-conducting network 301. The microfluidic fluid circulates in the main channel 301a, transporting heat like water flow. The heat is then introduced into the phase change heat dissipation unit 302 through the branch channel 301b. The sensitive phase change material 302c melts at 50°C to absorb heat. The copper metal mesh 302b transfers the residual heat to the graphene shell 102. The thermal resistance is less than 0.2 K / W, and the temperature rise is less than 7°C. Simultaneously, the microfluidic fluid operates at 400-700°C. The refractive index changes by approximately 0.2 when exposed to 500-800 nm light or at temperatures above 60°C. The refractive index of phase change material 302c changes by approximately 0.15 when exposed to 500-800 nm light. In conjunction with the SiO2 optical waveguide, it modulates the optical signal like adjusting the brightness of a light bulb. Microsensor 303d detects changes in temperature and optical signal, and triggers electrophoretic pump 303b and microvalve 303c via flexible circuit board 303e to precisely control the microfluidic flow rate (0.1 μL / s). The thermosensitive shape memory alloy 303a shrinks at temperatures above 60°C, optimizing the channel diameter and flow rate, enhancing heat dissipation and modulation efficiency. This photothermal synergy mechanism ensures signal stability and avoids thermal runaway and signal distortion during high-power transmission.

[0064] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise changed, and the nature or number or position of discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0065] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the invention as currently considered, or those features that are not relevant to implementing the invention) may be omitted.

[0066] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0067] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A fiber optic connector with heat dissipation function, characterized in that: include, The connector body (100) includes a thermally conductive inner shell (101), and a graphene outer shell (102) is fixedly installed on the outside of the thermally conductive inner shell (101). A cavity (103) is opened between the thermally conductive inner shell (101) and the graphene outer shell (102). Connection ports (101a) are symmetrically opened on the left and right sides of the thermally conductive inner shell (101). The two connection ports (101a) are connected and a ceramic alignment sleeve (104) is fixedly installed between them. A ceramic ferrule (200) is inserted into the ceramic alignment sleeve (104). The ceramic ferrule (200) is made of zirconium oxide material and has an embedded optical fiber (201). The optical fiber (201) passes through the ceramic ferrule (200) along its axial direction and is fixed in the center hole of the ceramic ferrule (200). as well as, A photothermal synergy mechanism (300), disposed within the connector body (100), includes: The microstructure heat-conducting network (301) includes a main channel (301a) opened around the outer surface of the ceramic alignment sleeve (104), and branch channels (301b) are opened at the extension ends of the multiple main channels (301a). The phase change heat dissipation unit (302) includes a porous copper foam (302a), a copper metal mesh (302b), and a photosensitive phase change material (302c) that surround the rear section of the heat-conducting inner shell (101) and are embedded in the cavity (103). The photosensitive phase change material (302c) fills the pores of the porous copper foam (302a) in the form of microcapsules, and the copper metal mesh (302b) wraps the porous copper foam (302a). The optical signal modulation unit (303) includes a thermosensitive shape memory alloy (303a), a micro electrophoretic pump (303b), a micro valve (303c), a micro sensor (303d), and a flexible circuit board (303e). The thermosensitive shape memory alloy (303a) is fixed inside the side wall of the main channel (301a). The micro electrophoretic pump (303b) and the micro valve (303c) are disposed outside the inlet of the main channel (301a). The micro sensor (303d) is embedded inside the copper metal mesh (302b). The flexible circuit board (303e) is embedded inside the graphene shell (102). The main channel (301a) and branch channel (301b) of the microstructure thermally conductive network (301) are filled with photosensitive / thermal microfluidic fluid, which is liquid crystal based. The micro electrophoretic pump (303b) is fixed in a reserved groove outside the inlet of the main channel (301a). The micro valve (303c) is a silicon-based MEMS structure. The micro electrophoretic pump (303b) and the micro valve (303c) work together to control the unidirectional flow of the microfluidic fluid into the main channel (301a).

2. The fiber optic connector with heat dissipation function as described in claim 1, characterized in that: The microstructure heat-conducting network (301) includes four main channels (301a). Each main channel (301a) is circumferentially distributed along the outer surface of the ceramic alignment sleeve (104). The inner wall is deposited with a graphene-carbon nanotube composite coating. The extended end of each main channel (301a) is connected to multiple branch channels (301b). The branch channels (301b) are connected to the phase change heat dissipation unit (302) through lateral micropores.

3. The fiber optic connector with heat dissipation function as described in claim 2, characterized in that: The inner wall of the main channel (301a) is provided with an elastic deformation groove (301c), and the thermosensitive shape memory alloy (303a) is a nickel-titanium alloy microwire, which is fixed in the elastic deformation groove (301c).

4. The fiber optic connector with heat dissipation function as described in claim 3, characterized in that: The photosensitive phase change material (302c) is filled into the pores of the porous copper foam (302a) by vacuum impregnation, and the photosensitive phase change material (302c) contains paraffin-based microcapsules.

5. The fiber optic connector with heat dissipation function as described in claim 4, characterized in that: Two microsensors (303d) are embedded at the left and right ends of the copper metal mesh (302b) close to the heat-conducting inner shell (101). The microsensors (303d) are silicon-based thermocouples.

6. The fiber optic connector with heat dissipation function as described in claim 5, characterized in that: The flexible circuit board (303e) is made of polyimide-based material and is circumferentially attached to the inner wall of the graphene shell (102). It is connected to the microsensor (303d), micro-electrophoretic pump (303b), micro-valve (303c), and thermosensitive shape memory alloy (303a) through copper microwires.

7. The fiber optic connector with heat dissipation function as described in claim 6, characterized in that: The optical signal modulation unit (303) coordinates the SiO2 optical waveguide of the ceramic alignment sleeve (104) with the refractive index change of the microfluidic and photosensitive phase change material (302c).

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