Display module, terminal and preparation method

Abstract

The present disclosure is a divisional application of 201910252262. X. The invention also relates to a method for manufacturing the same. The invention relates to a display module, a terminal and a preparation method, and belongs to the technical field of electronic equipment. The display module comprises a backlight module, a substrate layer, a liquid crystal display layer and a driving assembly, wherein the substrate layer, the liquid crystal display layer and the driving assembly are arranged above the backlight module; at least one group of conductive through holes are formed in the substrate layer, conductive materials are arranged in the conductive through holes, and the conductive materials form a signal path of the driving assembly. The conductive through hole is formed in the substrate layer of the display screen, the conductive material is arranged in the conductive through hole, and the conductive material is used as a signal path, so that a circuit is prevented from passing through the occupied space from the side surface of the display screen, the distance between the display screen and the equipment frame is reduced, and the screen-to-body ratio of the electronic equipment is improved.

Description

[0001] This disclosure is a divisional application of the application with the application number 201910252262.X, the application date of March 29, 2019, and the invention title of "Display Module, Terminal and Preparation Method". Technical Field

[0002] This disclosure belongs to the technical field of electronic devices and relates to a display module, a terminal and a preparation method. Background Art

[0003] Electronic products such as mobile phones and tablet computers are provided with a display screen as an external input device.

[0004] Currently, all electronic products pursue a high screen-to-body ratio and reduce the distance between the device frame and the display screen. However, since a driving integrated circuit (IC) needs to be provided at the edge of the display screen, the driving IC occupies the space between the display screen and the device frame, resulting in the problem that it is difficult to reduce the edge distance (lower bezel area) between the device frame and the display screen. Summary of the Invention

[0005] Embodiments of this disclosure provide a display module, which can solve the problem in the related art that since a driving integrated circuit (IC) needs to be provided at the edge of the display screen, the driving IC occupies the space between the display screen and the device frame, resulting in the problem that it is difficult to reduce the edge distance (lower bezel area) between the device frame and the display screen. The technical solution is as follows:

[0006] According to an aspect of the embodiments of this disclosure, a display module is provided. The display module includes a backlight module, a substrate layer disposed above the backlight module, a liquid crystal display layer, and a driving component;

[0007] At least one group of conductive vias are formed on the substrate layer, and a conductive material is disposed in the conductive vias, and the conductive material forms a signal path of the driving component.

[0008] In an optional implementation manner, the driving component includes: a flexible circuit board and a driving chip;

[0009] The signal path is a path between the driving chip and the flexible circuit board;

[0010] Or,

[0011] The signal path is a path between the liquid crystal display layer and the flexible circuit board.

[0012] In an alternative implementation, the driving chip is disposed on the upper surface of the substrate layer, the flexible circuit board is disposed on the lower surface of the substrate layer, an output pin of the driving chip is connected to an input end of the liquid crystal display layer, and an input pin of the driving chip is connected to an output end of the flexible circuit board through the conductive material.

[0013] In an alternative implementation, the flexible circuit board is disposed on the lower surface of the substrate layer, an output end of the flexible circuit board is connected to an input end of the liquid crystal display layer through the conductive material, and an input end of the flexible circuit board is connected to an output pin of the driving chip.

[0014] In an alternative implementation, the aperture of the conductive via is 5um - 30um.

[0015] According to another aspect of the embodiments of the present disclosure, there is provided a terminal, including: a control unit, a middle frame, and a display module disposed on the front surface of the middle frame, where the display module includes the display module described above.

[0016] According to another aspect of the embodiments of the present disclosure, there is provided a method for manufacturing a display module, the method including:

[0017] Determining a calibration position of a conductive via on a substrate layer;

[0018] Performing micro-hole processing on the substrate layer according to the calibration position to form the conductive via;

[0019] Disposing a conductive material in the conductive via;

[0020] Leading out the conductive material in a wiring manner;

[0021] Bonding and disposing the driving component on the surface of the substrate layer, and electrically connecting a pin of the driving component to the conductive material through the wiring;

[0022] Assembling a backlight module on the lower surface of the substrate layer.

[0023] In an alternative implementation, the performing micro-hole processing on the substrate layer includes:

[0024] Performing the micro-hole processing on the substrate layer by any one of laser ablation, ultrasonic drilling, dry etching, and wet etching to form the conductive via;

[0025] Wherein, the aperture of the conductive via is 5um - 30um.

[0026] In an alternative implementation, the disposing a conductive material in the conductive via includes:

[0027] Fill the conductive vias with silver paste;

[0028] Or,

[0029] Deposit a conductive material in the conductive vias by using a light irradiation process.

[0030] In an alternative implementation, the driving component includes a driving chip and a flexible circuit board;

[0031] The attaching the driving component to the surface of the substrate layer and electrically connecting the pins of the driving component to the conductive material through the traces includes:

[0032] Attach the driving chip to the upper surface of the substrate layer, and attach the flexible circuit board to the lower surface of the substrate layer, and connect them to the conductive material through traces respectively;

[0033] Or,

[0034] Attach the flexible circuit board to the lower surface of the substrate layer, and connect it to the conductive material through the traces.

[0035] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects:

[0036] By providing conductive vias on the substrate layer of the display screen, and providing a conductive material in the conductive vias, and using the conductive material as a signal path, the space occupied by the circuit passing from the side of the display screen is avoided, the distance between the display screen and the device frame is reduced, and the screen-to-body ratio of the electronic device is improved.

[0037] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure and used together with the specification to explain the principles of the present disclosure.

[0039] Figure 1 is a schematic cross-sectional view of a screen assembly of an electronic device in the related art;

[0040] Figure 2 is a side cross-sectional view of a display module shown according to an exemplary embodiment;

[0041] Figure 3 is a side cross-sectional view of a display module shown according to another exemplary embodiment;

[0042] Figure 4 is a manufacturing flow chart of a display module shown according to an exemplary embodiment;

[0043] Figure 5 is a schematic diagram showing the manufacturing process of a display module according to an exemplary embodiment;

[0044] Figure 6 is a schematic structural diagram of a terminal provided by an exemplary embodiment of the present disclosure. Detailed Description of the Invention

[0045] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0046] Figure 1 is a side cross-sectional view of a display module of a related technology in an electronic device. The screen assembly is a liquid crystal display (LCD).

[0047] The LCD display screen includes a substrate layer 2, which is made of an insulating material and can be glass or other transparent insulating materials. A pixel circuit is arranged on the substrate layer 2, and the pixel circuit includes a gate electrode, a gate insulating layer, and a semiconductor layer. The gate insulating layer is configured to insulate the semiconductor layer and the gate electrode from each other; a source electrode and a drain electrode are also arranged on the substrate substrate.

[0048] A liquid crystal display layer 1 and a driving chip 3 arranged side by side with the liquid crystal display layer 1 are provided on the upper surface of the substrate layer 2. The output pins of the driving chip 3 are connected to the input ends of the pixel circuit, and are used to control the brightness and darkness states of the respective pixels in the pixel circuit, thereby controlling the display state of the liquid crystal display layer 1.

[0049] A backlight module is provided below the substrate layer 2 for providing a light source for the liquid crystal display layer 1.

[0050] The input pins of the driving chip 3 are connected to a flexible circuit board 4. The flexible circuit board 4 winds from the edge of the substrate layer 2 to the lower side of the substrate layer 2 and is connected to the circuit board of the terminal for receiving the control signal of the terminal.

[0051] In the related technology, since a driving chip needs to be installed at the edge of the liquid crystal display layer, the driving chip occupies the space between the liquid crystal display layer and the device frame. At the same time, since the flexible circuit board connecting the driving chip needs to wind from the edge of the substrate layer to the lower side of the substrate layer, the edge distance (boarder, commonly known as the chin) formed at the edge of the liquid crystal display layer and the substrate layer is further increased.

[0052] Figure 2 A side cross-sectional view of a display module shown according to an exemplary embodiment. The display module includes a backlight module 6 and a substrate layer 2, a liquid crystal display layer 1, and a driving component disposed above the backlight module 6:

[0053] At least one set of conductive vias 5 is formed on the substrate layer 2. Schematically, a high density of a plurality of conductive vias 5 is provided on the substrate layer 2, and the number of conductive vias 5 is determined according to the number of connection lines between the liquid crystal display layer and the driving chip. A conductive material is disposed in the conductive vias 5, and the conductive material forms a signal path of the driving component.

[0054] Optionally, the driving components are respectively disposed on the upper surface and the lower surface of the substrate layer 2, and a signal path between the driving components is realized through the conductive material in the conductive vias 5; or, the driving component is disposed on the lower surface of the substrate layer 2, and a signal path is formed between the driving component and the liquid crystal display layer 1 above the substrate layer 2 through the conductive material in the conductive vias 5.

[0055] Optionally, the aperture of the conductive vias 5 is 5um - 30um.

[0056] In summary, for the display module provided in this embodiment, by providing conductive vias on the substrate layer of the display screen and disposing a conductive material in the conductive vias, and using the conductive material as a signal path, the space occupied by the circuit passing through the side of the display screen is avoided, the distance between the display screen and the device frame is reduced, and the screen-to-body ratio of the electronic device is improved.

[0057] Continuing to refer to Figure 2 , the driving component at least includes a driving chip 3 and a flexible circuit board 4, and the signal path is a path between the driving chip 3 and the flexible circuit board 4.

[0058] Optionally, the liquid crystal display layer 1 includes a pixel circuit, an input pin of the pixel circuit is connected to an output pin of the driving chip 3, and an input pin of the driving chip 3 is electrically connected to the conductive material in the conductive vias 5. In an optional embodiment, the pixel circuit is a thin film transistor (TFT).

[0059] The flexible circuit board 4 is disposed on the lower surface of the substrate layer 2. One end of the flexible circuit board 4 is electrically connected to the driving chip 3 disposed on the upper surface of the substrate layer 2 through the conductive material in the conductive vias 5, and the other end of the flexible circuit board 4 is connected to a control unit in the electronic device. The control unit sends an instruction signal to the driving chip 3 through the flexible circuit board 4 and the conductive material, and the driving chip 3 sends a driving signal to the pixel circuit according to the received instruction signal to control the display state of the liquid crystal display layer 1.

[0060] Optionally, an opening is provided on the backlight module 6, and the size of the opening matches that of the flexible circuit board. The flexible circuit board passes through the backlight module 6 through this opening. Since the flexible circuit board has a relatively thin thickness, the impact on the backlight can be ignored.

[0061] In summary, for the display module provided in this embodiment, by separately arranging the driving chip and the flexible circuit board in the driving component on the upper surface layer and the lower surface layer of the substrate layer, and realizing electrical connection through the conductive through holes with conductive ability, the space occupied by the flexible circuit board winding from the edge of the substrate layer 2 to the lower part of the substrate layer 2 is avoided, which helps to reduce the distance between the liquid crystal display layer and the device frame.

[0062] Based on Figure 2 the embodiment of Figure 3 FIG. shows a side cross-sectional view of a display module provided by another exemplary embodiment of the present disclosure. The driving component at least includes a driving chip 3 and a flexible circuit board 4, and the signal path is the path between the liquid crystal display layer 1 and the flexible circuit board 4.

[0063] Optionally, the liquid crystal display layer 1 includes a pixel circuit, and the input pins of the pixel circuit are electrically connected to the conductive material in the conductive through hole 5. In an optional implementation manner, the pixel circuit is a thin film transistor (TFT).

[0064] Wherein the flexible circuit board 4 is arranged on the lower surface of the substrate layer 2, and its output pins are connected to the input pins of the pixel circuit on the upper surface of the substrate layer through the conductive material in the conductive through hole 5; the other end of the flexible circuit board 4 is connected to the output pins of the driving chip 3, and the input pins of the driving chip 3 are connected to the control unit in the electronic device. The control unit sends an instruction signal to the driving chip 3, and the driving chip 3 sends a driving signal to the pixel circuit in the liquid crystal display layer 1 through the flexible circuit board 4 and the conductive material to control the display state of the liquid crystal display layer 1.

[0065] Optionally, an opening is provided on the backlight module 6, and the size of the opening matches that of the flexible circuit board 4. The driving chip 3 is arranged on the flexible circuit board 4, the driving chip 3 is arranged outside the backlight module 6, and the flexible circuit board 4 connects the driving chip 3 to the conductive material in the conductive through hole 5 through the opening.

[0066] In summary, in this embodiment, by arranging the flexible circuit board 4 below the substrate layer 2, the problem of space occupation when the flexible circuit board 4 passes through from the side of the substrate layer 2 is effectively avoided. At the same time, by arranging the driving chip 3 outside the backlight module 6, the problem of interference of the driving chip 3 to the backlight module is avoided.

[0067] This solution provides a terminal, which includes a control unit, a middle frame, and a display module disposed on the front surface of the middle frame. The display module is the display module provided in each of the foregoing embodiments.

[0068] This solution provides a method for manufacturing the display module provided in each of the foregoing embodiments. Combining Figure 4 and Figure 5 , taking the substrate layer 2 as a glass substrate as an example, the manufacturing method specifically includes the following steps:

[0069] Step 101, determine the calibration positions of the conductive vias on the substrate layer.

[0070] On the glass, the positions of the conductive vias are calibrated by light exposure positioning through a photomask (mask). This is used to pre-determine the number of conductive vias 5 and the position of each conductive via 5, so as to prepare for the subsequent drilling operation.

[0071] Step 102, perform micro-hole processing on the substrate layer according to the calibration positions to form conductive vias.

[0072] Perform high-density drilling operations on the specified area of the glass according to the calibration positions in Step 101.

[0073] Optionally, high-density micro-hole processing is performed on the glass by means of laser ablation, and the aperture of the through-hole is 5um to 30um.

[0074] Step 103, dispose conductive materials in the conductive vias.

[0075] Optionally, conductive materials such as silver paste and copper paste are filled in the conductive vias 5, or conductive materials are deposited in the conductive vias by means of a light exposure process, so that the upper surface and the lower surface of the through-hole can conduct electricity.

[0076] Step 104, lead out the conductive materials in a wiring manner.

[0077] During the thinning process of the substrate layer 2, the conductive materials in the conductive vias 5 are led out by means of TGV wiring, and the leading-out positions are determined according to the positions where the driving chips will be set.

[0078] Step 105, attach the driving component to the surface of the substrate layer, and electrically connect the pins of the driving component to the conductive materials through wiring.

[0079] Optionally, the driving component includes a driving chip and a flexible circuit board, which are bonded to the upper surface and the lower surface of the substrate layer.

[0080] In an optional implementation manner, the driving chip is attached to the upper surface of the substrate layer, and the flexible circuit board is attached to the lower surface of the substrate layer, and are respectively connected to the conductive materials through wiring. The connection relationship is the same asFigure 2 The content of the embodiment is the same and will not be elaborated here.

[0081] In an optional embodiment, the flexible circuit board is attached to the lower surface of the substrate layer and connected to the conductive material through traces. The connection relationship is the same as that of Figure 3 The content of the embodiment is the same and will not be elaborated here.

[0082] Step 106, assemble the backlight module on the lower surface of the substrate layer.

[0083] Reserve an opening on the backlight module for the flexible circuit board to pass through the opening and connect to external electronic device components.

[0084] In summary, in this embodiment, through holes are pre-set in the substrate layer, and conductive materials are poured into the through holes for the through-hole (Through Glass Via, TGV) design of the substrate layer. By setting conductive materials in the through holes, a signal path that penetrates the upper and lower surfaces of the substrate layer is realized, reducing the lower boarder distance and improving the screen-to-body ratio of the electronic device.

[0085] Figure 6 It is a block diagram of a terminal 500 shown according to an exemplary embodiment. For example, the device 500 can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0086] Referring to Figure 6 , the device 500 may include one or more of the following components: a processing component 502, a memory 504, a power component 506, a multimedia component 508, an audio component 510, an input / output (I / O) interface 512, a sensor component 514, and a communication component 516.

[0087] The processing component 502 generally controls the overall operation of the device 500, such as operations associated with display, telephone calls, data communication, camera operations, and recording operations. The processing component 502 may include one or more processors 520 to execute instructions to complete all or part of the steps of the above method. In addition, the processing component 502 may include one or more modules to facilitate the interaction between the processing component 502 and other components. For example, the processing component 502 may include a multimedia module to facilitate the interaction between the multimedia component 508 and the processing component 502.

[0088] The memory 504 is configured to store various types of data to support the operation of the device 500. Examples of such data include instructions for any application or method operating on the device 500, contact data, phone book data, messages, pictures, videos, etc. The memory 504 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0089] The power supply component 506 provides power to various components of the device 500. The power supply component 506 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the device 500.

[0090] The multimedia component 508 includes a screen that provides an output interface between the device 500 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors can not only sense the boundaries of the touch or swipe actions, but also detect the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component 508 includes a front camera and / or a rear camera. When the device 500 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each of the front camera and the rear camera can be a fixed optical lens system or have a focal length and optical zoom capabilities.

[0091] The audio component 510 is configured to output and / or input audio signals. For example, the audio component 510 includes a microphone (MIC) that is configured to receive external audio signals when the device 500 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals can be further stored in the memory 504 or transmitted via the communication component 516. In some embodiments, the audio component 510 further includes a speaker for outputting audio signals.

[0092] The I / O interface 512 provides an interface between the processing component 502 and a peripheral interface module, which can be a keyboard, a click wheel, buttons, etc. These buttons can include, but are not limited to: a home button, a volume button, a power-on button, and a lock button.

[0093] The sensor assembly 514 includes one or more sensors for providing an assessment of various aspects of the status of the device 500. For example, the sensor assembly 514 can detect the on / off state of the device 500, the relative positioning of components, such as the display and keypad of the device 500. The sensor assembly 514 can also detect a change in the position of the device 500 or a component of the device 500, the presence or absence of user contact with the device 500, the orientation or acceleration / deceleration of the device 500, and a change in the temperature of the device 500. The sensor assembly 514 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 514 can also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 514 can also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0094] The communication component 516 is configured to facilitate communication, either wired or wirelessly, between the device 500 and other devices. The device 500 can access a wireless network based on communication standards, such as Wi-Fi, 2G, or 3G, or a combination thereof. In one exemplary embodiment, the communication component 516 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component 516 also includes a near field communication (NFC) module to facilitate short-range communication.

[0095] In an exemplary embodiment, the device 500 can be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for performing the above-described method.

[0096] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions, such as the memory 504 including instructions, is also provided. The above instructions can be executed by the processor 520 of the terminal 500 to complete the above-described method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0097] It should be understood that the "plurality" mentioned herein refers to two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0098] The serial numbers of the above embodiments of the present disclosure are only for description and do not represent the superiority or inferiority of the embodiments.

[0099] The above are only the preferred embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. A display module, characterized in that, The display module includes a backlight module, a substrate layer, a liquid crystal display layer, and a driving component. The substrate layer, the liquid crystal display layer, and the driving component are disposed above the backlight module. The driving component includes a driving chip and a flexible circuit board. The flexible circuit board is disposed on the lower surface of the substrate layer, and the driving chip is disposed on the flexible circuit board and outside the backlight module; At least one set of conductive vias is formed on the substrate layer, and a conductive material is disposed in the conductive vias. The conductive material forms a signal path of the driving component, and the signal path is a path between the liquid crystal display layer and the flexible circuit board; The output pins at one end of the flexible circuit board are connected to the input pins of the pixel circuit on the upper surface of the substrate layer through the conductive material. The input pins at the other end of the flexible circuit board are connected to the output pins of the driving chip. The input pins of the driving chip are connected to a control unit in the electronic device. The control unit is configured to send an instruction signal to the driving chip, and the driving chip is configured to send a driving signal to the pixel circuit in the liquid crystal display layer through the flexible circuit board and the conductive material according to the received instruction signal; An opening is provided on the backlight module, and the size of the opening matches that of the flexible circuit board. The flexible circuit board passes through the backlight module through the opening.

2. The display module according to claim 1, wherein The aperture of the conductive via is 5um - 30um.

3. The display module according to claim 1, wherein The pixel circuit in the liquid crystal display layer includes a thin film transistor.

4. The display module according to claim 1, wherein There is one opening provided on the backlight module.

5. The display module according to claim 1 or 4, wherein The flexible circuit board connects the driving chip and the conductive material through the opening.

6. A terminal, characterized in that, The terminal includes: a control unit, a middle frame, and a display module disposed on the front surface of the middle frame. The display module includes the display module according to any one of claims 1 to 5.

7. A method for preparing a display module, characterized in that, The method includes: Determining a calibration position of the conductive via on the substrate layer; Performing micro-hole machining on the substrate layer according to the calibration position to form the conductive via; Disposing a conductive material in the conductive via; Leading out the conductive material by a wiring method; Bonding and disposing the driving component on the surface of the substrate layer, and electrically connecting the pins of the driving component and the conductive material through the wiring; the driving component includes a driving chip and a flexible circuit board; Assembling a backlight module on the lower surface of the substrate layer; Wherein, the bonding and disposing the driving component on the surface of the substrate layer, and electrically connecting the pins of the driving component and the conductive material through the wiring includes: The flexible circuit board is bonded and disposed on the lower surface of the substrate layer and connected to the conductive material through the wiring. The driving chip is disposed on the flexible circuit board and outside the backlight module; The output pins at one end of the flexible circuit board are connected to the input pins of the pixel circuit on the upper surface of the substrate layer through the conductive material. The input pins at the other end of the flexible circuit board are connected to the output pins of the driving chip. The input pins of the driving chip are connected to a control unit within the electronic device. The control unit is configured to send an instruction signal to the driving chip, and the driving chip is configured to send a driving signal to the pixel circuit in the liquid crystal display layer through the flexible circuit board and the conductive material according to the received instruction signal; An opening is reserved on the backlight module, and the size of the opening matches that of the flexible circuit board. The flexible circuit board passes through the backlight module through the opening.

8. The method according to claim 7, wherein The micro-hole processing on the substrate layer includes: Performing the micro-hole processing on the substrate layer by any one of laser ablation, ultrasonic drilling, dry etching, and wet etching to form the conductive through-hole; Wherein, the aperture of the conductive through-hole is 5um to 30um.

9. The method according to claim 7, wherein The setting of the conductive material in the conductive through-hole includes: Filling silver paste in the conductive through-hole; Or, Depositing a conductive material in the conductive through-hole by a light exposure process.

10. The method according to claim 7, wherein There is one opening reserved on the backlight module.

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