Fully-enclosed computer thermal management method, system and device

Abstract

The invention discloses a fully-closed computer thermal management method, system and device, and the method comprises the steps: designing a Smith estimation compensator, compensating a lagging part of a control signal of a temperature control system, and obtaining the output quantity of the Smith estimation compensator of which a lagging link is eliminated; designing a fuzzy self-adaptive PID controller, feeding back the difference value between the actual temperature and the output quantity of the Smith pre-estimation compensator to the input end of the fuzzy self-adaptive PID controller, generating a compensation error e and a compensation error change rate ec, adjusting the parameters of the fuzzy self-adaptive PID controller according to the principle of a fuzzy controller, obtaining the output quantity, and outputting the output quantity. The refrigerating capacity and the heating capacity of the thermoelectric refrigerating unit are controlled; the system and the device both comprise a core controller and are used for realizing the totally-enclosed computer thermal management method. Low-temperature starting and high-temperature heat dissipation of the fully-enclosed computer can be met at the same time, the requirements for precise temperature control and low power consumption are met, and the dynamic performance and robustness of the system are improved.

Description

Technical Field

[0001] The present invention belongs to the field of computer technology and relates to a fully enclosed computer thermal management method, system and device. Background Art

[0002] Fully enclosed computers have become an ideal choice in extreme environments due to their excellent protection performance and high reliability. These devices usually adopt metal materials such as all-aluminum alloy, aluminum-magnesium alloy or titanium alloy, with high protection levels, capable of effectively preventing dust, water and shock, and adopting a fanless design, avoiding dust entry and noise problems caused by fans, and improving the reliability and stability of the system. With the rapid development of electrical and electronic technology, the integration degree of fully enclosed computers is getting higher and higher. And because these devices are often deployed in extreme environments, such as high plateaus, polar regions and desert areas, in the face of cold weather, low temperature may cause circuit components to fail to start or have unstable performance, while in high temperature environments, it may cause the device to overheat, performance degradation or even damage. Therefore, it is crucial to improve their low-temperature start-up ability and high-temperature heat dissipation performance. By applying thermoelectric refrigeration technology and phase change materials, fully enclosed computers can not only start quickly at extremely low temperatures to ensure the timeliness and reliability of tasks, but also effectively dissipate heat under high temperature conditions to avoid thermal runaway problems, providing strong technical support for the smooth execution of key tasks.

[0003] Thermoelectric refrigeration technology (TEC), based on the Peltier Effect, can achieve high-precision temperature control through heat transfer caused by the flow of current in thermoelectric materials. When the direction of the current changes, the roles of the cold end and the hot end will also change accordingly, thus realizing the switching between refrigeration and heating. Compared with traditional air-cooled and liquid-cooled heat dissipation technologies, thermoelectric refrigeration technology can not only operate continuously and stably, but also achieve high-precision bidirectional temperature control, and has a wide temperature difference adjustment range.

[0004] In the field of high-temperature heat dissipation, fully enclosed computer cases currently mainly rely on traditional air-cooled and liquid-cooled technologies, but these technologies all have their own limitations. Although air-cooled heat dissipation has a low cost, its heat dissipation effect is limited and it is difficult to meet the increasing heat dissipation requirements of modern high-power devices. Although liquid-cooled heat dissipation technology has a significant heat dissipation effect, its high manufacturing cost and potential leakage risk limit its wide application.

[0005] In terms of low-temperature start-up, the heating film technology is widely used due to its ability to uniformly heat the entire circuit board. However, the heating speed of the heating film technology is relatively slow and it takes a long time to reach the start-up temperature, which undoubtedly prolongs the start-up time of the device. In addition, the heating film is prone to aging and needs to be inspected and replaced regularly, which undoubtedly increases the maintenance cost and usage difficulty of the device.

[0006] The direct temperature control method of contacting a thermoelectric cooler with a processor, although achieving precise temperature control to a certain extent, also exposes a series of problems. First, when the thermoelectric cooler rapidly switches between cooling and heating, the system may experience short-term temperature fluctuations or control delays, which may have an adverse impact on the stability and performance of the device. Second, during the cooling process, if the heat dissipation capacity of the hot end of the thermoelectric cooler is insufficient and heat cannot be discharged in a timely manner, the temperature of the hot end will become too high. This not only increases the working burden of the thermoelectric cooling module, reduces the cooling capacity, but also may cause the cold end to be unable to maintain the required low temperature, thus affecting the temperature control effect and accuracy. Finally, under high temperature difference and high load conditions, the coefficient of performance (COP) of the thermoelectric cooling module is low, resulting in a significant increase in power consumption. And in the case of low heat load, the thermoelectric cooling module may still operate at a high power, causing unnecessary energy waste. Summary of the Invention

[0007] The present invention aims to solve the technical problems that a fully enclosed computer has difficulty in starting in a low-temperature environment and that components inside the chassis need enhanced heat dissipation due to severe heat generation under high integration. The present invention provides a fully enclosed computer thermal management method, system, and device, and the technical solution adopted is as follows:

[0008] A fully enclosed computer thermal management method includes the following steps:

[0009] S1. Design a Smith predictor compensator to compensate for the lag part of the control signal of the temperature control system, and obtain the output of the Smith predictor compensator that eliminates the lag link;

[0010] S2. Design a fuzzy adaptive PID controller, feedback the difference between the actual temperature and the output of the Smith predictor compensator to the input end of the fuzzy adaptive PID controller, generate a compensation error e and a compensation error change rate e c , and adjust the parameters of the fuzzy adaptive PID controller according to the principle of the fuzzy controller to obtain an output, and control the cooling capacity and heating capacity of the thermoelectric cooler.

[0011] In an embodiment of the present invention, the step S1 includes:

[0012] Perform mathematical modeling on the temperature control system, and the mathematical model of the controlled object of the temperature control system is expressed as:

[0013]

[0014] In formula (1), G0(s)e -ls is the transfer function of the mathematical model of the controlled object, K is the proportional coefficient, T is the time constant, and e -ls is a time-delay link with a delay time of ls;

[0015] The closed-loop transfer function of the temperature control system is expressed as:

[0016]

[0017] In formula (2), C(S) is the Laplace transform of the output, R(S) is the Laplace transform of the input, and G c (s) is the transfer function of the controller of the temperature control system;

[0018] The characteristic equation of the closed-loop transfer function of the temperature control system is expressed as:

[0019] 1 + G c (s)G0(s)e -ls = 0 (3)

[0020] After introducing the Smith predictor compensator, the closed-loop transfer function of the temperature control system is expressed as:

[0021]

[0022] In formula (4), G1(s) is the transfer function of the Smith predictor compensator, and the characteristic equation of the temperature control system is expressed as:

[0023] 1 + G c (s)G1(s) + G c (s)G0(s)e -ls = 0 (5)

[0024] In order to make the characteristic equation of the closed-loop system of the temperature control system be expressed as:

[0025] 1 + G c (s)G0(s) = 0 (6)

[0026] Let:

[0027] 1 + G c (s)G0(s) = 1 + G c (s)G1(s) + G c (s)G0(s)e -ls (7)

[0028] The solution of the transfer function G1(s) of the Smith predictor compensator is obtained as:

[0029] G1(s) = G0(s) - G0(s)e -ls (8)

[0030] The lag link is eliminated.

[0031] In one embodiment of the present invention, the step S2 includes:

[0032] S21. Fuzzification: Set the input variable of the fuzzy adaptive PID controller as the compensation error e and the change rate of the compensation error e c , and set the K p , K i , K d of the PID controller as the output variables of the fuzzy adaptive PID controller. Determine the universe of discourse as {-6, -5, -4, -3, -2, -1, 0, 1, 2, 3, 4, 5, 6}, and divide the universe of discourse into seven fuzzy subsets: negative big (NB), negative medium (NM), negative small (NS), zero (ZO), positive small (PS), positive medium (PM), and positive big (PB);

[0033] S22. Fuzzy inference: Design the change rules of the parameters of the fuzzy adaptive PID controller to obtain the control rules of the output variables;

[0034] a. When the compensation error e is large, take a large K p , a small K d , and K i = 0;

[0035] b. When the compensation error e and the change rate of the compensation error e c are of medium size, take a relatively small K p , a moderate K i and a moderate K d ;

[0036] c. When the compensation error e is small, increase the values of K p , K i , and when the change rate of the compensation error e c is large, take a relatively small K d , otherwise, take a relatively large K d ;

[0037] S23. Defuzzification: Determine the parameters of the fuzzy adaptive PID controller by using the centroid method to obtain the defuzzified output variables K p , K i , K d , so as to control the thermoelectric cooler.

[0038] In an embodiment of the present invention, the controlled object includes a central processing unit and a graphics processing unit.

[0039] A system for implementing the fully enclosed computer thermal management method includes: a core controller, a power supply module, a temperature measurement module, a phase change module, a blue light, a drive module, a thermoelectric cooler, and a main board;

[0040] The core controller is used to implement the fully enclosed computer thermal management method;

[0041] The output end of the power supply module and the output end of the temperature measurement module are both connected to the input end of the core controller, and the output end of the core controller is respectively connected to the input end of the phase change module, the input end of the drive module and the main board;

[0042] The output end of the phase change module is connected to the blue light, and the output end of the drive module is connected to the thermoelectric cooler.

[0043] In one embodiment of the present invention, the core controller adopts an STM32 series chip.

[0044] In one embodiment of the present invention, the power supply module is designed as a power conversion circuit, including a 12V circuit, a 220V to 12V circuit, a 12V to 5V circuit and a 5V to 3.3V circuit.

[0045] In one embodiment of the present invention, the drive module takes a motor drive chip as the core, has an eight-channel buffer chip with three-state output for buffering and isolation, and performs pulse width modulation through the H-bridge drive method to control the output voltage.

[0046] In one embodiment of the present invention, the fully enclosed computer thermal management system further includes a display module, and the input end of the display module is connected to the output end of the core controller.

[0047] A fully enclosed computer thermal management device includes a main board, a power supply, a temperature measurement element, a heating element, a thermoelectric cooler, a phase change material, a blue light strip and a core controller arranged in a chassis box body;

[0048] The core controller is arranged on the main board, and the core controller is used to implement the fully enclosed computer thermal management method;

[0049] The thermoelectric cooler is embedded at the bottom of the chassis box body, the heating element is arranged on the top of the thermoelectric cooler, the heating element is connected to the cold end of the thermoelectric cooler through a high thermal conductivity material, and the main board is arranged on the top of the heating element;

[0050] The phase change material is filled in the gap between the hot end of the thermoelectric cooler and the chassis box body, and the phase change material is connected to the hot end of the thermoelectric cooler through a heat spreader and light response;

[0051] The blue light strip is arranged at the bottom of the phase change material, and the temperature measurement element is arranged on the surfaces of the heating element and the phase change material and the inner side of the box body.

[0052] The beneficial effects of the present invention:

[0053] 1. The fully enclosed computer thermal management method of the present invention combines a Smith predictor compensator with fuzzy adaptive PID control, making full use of the compensation ability of the Smith predictor compensator for pure time-delay links and the characteristics of fuzzy PID control, which has a low dependence on model accuracy and strong robustness. It not only significantly improves the dynamic performance of the system but also enhances the overall robustness of the fully enclosed computer temperature control system, ensuring that the system can still operate stably under complex working conditions.

[0054] 2. The fully enclosed computer thermal management system of the present invention is based on the principles of a thermoelectric cooler and a phase change material, which can accurately control the motherboard temperature, ensuring the stable operation of the fully enclosed computer under various extreme environmental conditions. It also greatly improves its heat dissipation efficiency and effectively solves the technical problems of low-temperature startup and high-temperature heat dissipation of the fully enclosed computer.

[0055] 3. In the fully enclosed computer thermal management device of the present invention, when the chassis is at a high temperature, the heat generated during the operation of the processor and the heat generated by the thermoelectric cooler itself can be stored in the phase change material. When the chassis is in a low-temperature environment, the stored heat is released by adjusting the intensity of the blue light, enabling the system to reach the startup temperature faster, thereby achieving rapid and precise temperature control and ensuring two-way and high-precision control of the temperature inside the chassis. Description of the Drawings

[0056] Figure 1 is a flowchart of the fully enclosed computer thermal management method provided by an embodiment of the present invention;

[0057] Figure 2 is a system structure diagram of the Smith fuzzy adaptive PID controller provided by an embodiment of the present invention;

[0058] Figure 3 is a structural block diagram of the fully enclosed computer thermal management system provided by an embodiment of the present invention;

[0059] Figure 4 is a schematic diagram of the implementation process of the fully enclosed computer thermal management system provided by an embodiment of the present invention;

[0060] Figure 5 is a structural schematic diagram of the fully enclosed computer thermal management device provided by an embodiment of the present invention;

[0061] Appendix Figure 5 In the figure, 1. Chassis housing; 2. Motherboard; 3. Heating element; 4. Thermoelectric cooler; 5. Phase change material; 6. Blue light strip. Detailed Embodiments

[0062] The present invention will be described in detail below in conjunction with the drawings and specific embodiments.

[0063] Embodiment 1:

[0064] To meet the heat dissipation requirements of a fully enclosed computer in a high - temperature environment, achieve rapid startup in a low - temperature environment, and implement precise temperature control, this embodiment provides a heat management method for a fully enclosed computer. Referring to the appendix Figure 1 , the heat management method for the fully enclosed computer includes the following steps:

[0065] S1. Design a Smith predictor compensator to compensate for the lag part of the control signal of the temperature control system, and obtain the output of the Smith predictor compensator that eliminates the lag link;

[0066] S2. Design a fuzzy adaptive PID controller, feedback the difference between the actual temperature and the output of the Smith predictor compensator to the input end of the fuzzy adaptive PID controller, generate a compensation error e and a compensation error change rate e c , and adjust the parameters of the fuzzy adaptive PID controller according to the principle of the fuzzy controller to obtain the output, and control the cooling capacity and heating capacity of the thermoelectric cooler.

[0067] The heat management method of the fully enclosed computer in this embodiment uses a Smith fuzzy adaptive PID controller to perform mathematical modeling on the temperature control system, covering multiple key links such as the dynamic characteristics of the thermoelectric cooler, the temperature change of the phase - change material, and the power consumption change of the processor. Subsequently, determine the three key parameters K p 、K i 、K d of the PID controller (Proportion Integration Differentiation) and the fuzzy relationship between the compensation error e and the compensation error change rate e c . By detecting the compensation error e and the compensation error change rate e c , adjust the three parameters of the PID controller according to the principle of the fuzzy controller, and then add a Smith predictor compensator to be responsible for compensating the system delay to ensure the timeliness and accuracy of the control signal.

[0068] The structure of the Smith fuzzy adaptive PID controller in this embodiment is referred to the appendix Figure 2 . The design idea of the Smith fuzzy adaptive PID controller is to first determine the fuzzy relationship between the three key parameters K p 、K i 、K d in the PID controller and the deviation value e and the change rate e c of the deviation, and then adjust the three key parameters of the fuzzy adaptive PID controller according to the rules and principles of the fuzzy controller, so that the system can achieve better performance in terms of the compensation error e and the compensation error change rate e cUnder changing conditions, appropriate control parameters (i.e., K p , K i , K d ) are obtained. Then, the Smith predictor compensator compensates for the system time-delay link, and finally, the controlled system has good performance indicators.

[0069] The specific implementation of the fully enclosed computer thermal management method includes the following steps:

[0070] S1. Design a Smith predictor compensator. The Smith predictor compensator can compensate for the lag part of the system according to the degree of deviation of the output from the control quantity, overcome the adverse effects brought by the pure lag link, and thus improve the control quality of the system.

[0071] Mathematical modeling is performed on the temperature control system, including the dynamic characteristics of the thermoelectric cooler, the temperature change of the phase change material, and the power consumption change of the core processor. The mathematical model of the controlled object (the main heat-generating components on the motherboard, such as the central processing unit and the graphics processing unit) of the temperature control system is a first-order inertia plus pure lag link, expressed as:

[0072]

[0073] In formula (1), G0(s)e -ls is the transfer function of the mathematical model of the controlled object, K is the proportional coefficient, T is the time constant, and e -ls is the time-delay link with a delay time of ls;

[0074] For a single-input single-output closed-loop system, before introducing the predictor compensator, the closed-loop transfer function of the temperature control system is expressed as:

[0075]

[0076] In formula (2), G c (s) is the transfer function of the controller of the temperature control system, C(S) is the Laplace transform of the output, and R(S) is the Laplace transform of the input;

[0077] The characteristic equation of the closed-loop transfer function of the temperature control system is expressed as:

[0078] 1 + G c (s)G0(s)e -ls = 0 (3)

[0079] After introducing the Smith predictor compensator, the closed-loop transfer function of the temperature control system is expressed as:

[0080]

[0081] In Equation (4), G1(s) is the transfer function of the Smith predictor compensator, and the characteristic equation of the temperature control system is expressed as:

[0082] 1 + G c (s)G1(s) + G c (s)G0(s)e -ls = 0 (5)

[0083] In order to make the characteristic equation of the closed-loop system be expressed as:

[0084] 1 + G c (s)G0(s) = 0 (6)

[0085] Therefore, to eliminate the lag link, let:

[0086] 1 + G c (s)G0(s) = 1 + G c (s)G1(s) + G c (s)G0(s)e -ls (7)

[0087] The solution for the transfer function G1(s) of the Smith predictor compensator is obtained as:

[0088] G1(s) = G0(s) - G0(s)e -ls (8)

[0089] It can be seen from the above process that after introducing the Smith predictor compensator, the system eliminates the influence of the lag link on the system.

[0090] S2. Design a fuzzy adaptive PID controller. Fuzzy control adjusts the input parameters by inferring the variation of PID parameters under different real-time states, making the system more real-time, and thus achieving the purpose of improving the dynamic performance of the system. It not only utilizes the compensation effect of the Smith predictor compensator on the pure lag link but also gives full play to the characteristics of low dependence on model accuracy and strong robustness of fuzzy PID control, which can enhance the dynamic performance of the system while enhancing the robustness of the fully enclosed computer temperature control system, meeting the usage requirements of the fully enclosed computer.

[0091] In an embodiment of the present invention, the fuzzy adaptive PID controller includes a fuzzification module, a fuzzy inference module, and a defuzzification module connected in sequence.

[0092] S21. Fuzzification: Set the input variables of the fuzzy adaptive PID controller as the compensation error e and the compensation error change rate e c , and the K p , Ki, K dSet it as the output variable of the fuzzy adaptive PID controller. Determine the universe of discourse as {-6, -5, -4, -3, -2, -1, 0, 1, 2, 3, 4, 5, 6}, and divide the universe of discourse into seven fuzzy subsets: Negative Big (NB), Negative Medium (NM), Negative Small (NS), Zero (ZO), Positive Small (PS), Positive Medium (PM), and Positive Big (PB).

[0093] S22. Fuzzy inference: Fuzzy inference is the process of reasoning about fuzzy quantities based on fuzzy rules. First, the membership functions of both the fuzzy input variable and the output variable are triangular. Subsequently, design the variation rules for the parameters of the adaptive PID controller:

[0094] a. When the compensation error e is large, it is necessary to accelerate the system response speed. At the same time, to avoid the instantaneous increase in the compensation error e that may cause the derivative to reach the saturation state, resulting in the control ability exceeding the allowable range, and to limit the integral, at this time, take a larger K p , a smaller K d , and K i = 0;

[0095] b. When the compensation error e and the compensation error change rate e c are of medium magnitude, to avoid excessive overshoot and to have a fast response speed, at this time, take a relatively smaller K p , a moderate K i and a moderate K d ;

[0096] c. When the compensation error e is small, to make the system have better steady-state performance, stronger anti-interference ability, and to avoid the system from oscillating, at this time, increase the values of K p , K i . And when the compensation error change rate e c is large, take a relatively smaller K d , and vice versa, take a relatively larger K d .

[0097] Through these three methods of formulating PID parameters, obtain the control rules for the output variable.

[0098] S23. Defuzzification. Defuzzification is the process of converting the result of fuzzy inference into a specific control signal. Determine the parameters of the controller by the centroid method, and finally obtain the defuzzified output variables K p , Ki, K d , thereby controlling the thermoelectric cooler.

[0099] The adoption of the Smith fuzzy adaptive PID control algorithm has self - adaptability, which can automatically adjust the PID parameters according to the system state, adapt to different working conditions, making the system highly robust and capable of excellently fulfilling the requirements of full - enclosed computer low - temperature startup, high - temperature heat dissipation, and low power consumption.

[0100] Embodiment 2:

[0101] This embodiment provides a system for implementing the full - enclosed computer thermal management method of Embodiment 1. This system can solve the technical problem of simultaneously meeting the requirements of low - temperature startup and high - temperature heat dissipation of the full - enclosed computer, ensuring the stable operation of the full - enclosed computer under extreme environmental conditions.

[0102] Refer to the appendix Figure 3 , the full - enclosed computer thermal management system includes: a core controller, a power supply module, a temperature - measuring module, a phase - change module, a blue light, a driving module, a thermoelectric cooler, and a main board. The core controller is used to implement the full - enclosed computer thermal management method of Embodiment 1. The output ends of the power supply module and the temperature - measuring module are both connected to the input end of the core controller, and the output end of the core controller is respectively connected to the input end of the phase - change module, the input end of the driving module, and the main board; the output end of the phase - change module is connected to the blue light, and the output end of the driving module is connected to the thermoelectric cooler. In this embodiment, the full - enclosed computer thermal management system may further include a display module, and the input end of the display module is connected to the output end of the core controller.

[0103] The implementation process of the full - enclosed computer thermal management system of the present invention refers to the appendix Figure 4The entire temperature control system is powered on and starts working. The temperature measurement module continuously detects the temperatures of the surfaces of the main heat-generating components, the interior of the cabinet, and the phase change material. If the temperature is higher than or equal to the starting temperature T1, the STM32 series chip sends a signal, and then the main board is powered on to work. If the temperature is lower than the starting temperature T1, the STM32 series chip controls the thermoelectric cooler to generate heat through the drive module, controls the heat release rate of the phase change material by adjusting the intensity of the blue light, and adjusts the heating capacity of the thermoelectric cooler in real time by detecting the deviation value between the temperature and the starting temperature T1. If the temperature is lower than the starting temperature T1, the STM32 series chip continues to control the thermoelectric cooler to generate heat through the drive module, controls the heat release rate of the phase change material by adjusting the intensity of the blue light, and adjusts the heating capacity of the thermoelectric cooler in real time by detecting the deviation value between the temperature and the starting temperature T1. If the temperature is higher than or equal to the starting temperature T1, the STM32 series chip sends a signal, and then the main board is powered on to work. When the set temperature T2 is reached, the thermoelectric cooler stops heating. When the temperature is higher than the set temperature T3, the STM32 series chip controls the thermoelectric cooler to cool through the drive module. The hot end of the thermoelectric cooler stores heat in the phase change material. The STM32 series chip adjusts the cooling capacity of the thermoelectric cooler in real time according to the power of the processor on the main board. The temperature control system is powered off and stops working.

[0104] For the fully enclosed computer thermal management system of the present invention, in terms of the control method, the core controller uses the STM32 series chip. The Smith fuzzy adaptive PID control algorithm is implemented in C language through the keil5 software and then imported into the STM32 series chip to achieve the control function. In terms of power supply, considering the need to support the direct drive of the thermoelectric cooler with 12V and the circuits of converting 220V to 12V, 12V to 5V, and 5V to 3.3V for the main control chip and temperature detection modules, etc., a power conversion circuit is designed in the power supply module. In terms of temperature detection, a thermistor is used as the temperature sensor to achieve the temperature measurement function for constant temperature control to obtain the real-time temperature. In the drive module of the thermoelectric cooler, a motor drive chip is used as the core, and an eight-channel buffer chip with three-state output is used for buffering and isolation. Pulse width modulation is carried out through the H-bridge drive method to control the output voltage, achieving precise control of the thermoelectric cooler. Finally, the circuit board is fabricated and hardware tests are conducted to ensure normal circuit power supply and stable voltage.

[0105] The fully enclosed computer thermal management system of the present invention realizes the control of the temperature of the main board inside the fully enclosed computer. When the computer needs to process a large number of tasks, the load on the processor increases significantly, and the heat generation also rises accordingly. At this time, the temperature control system will control the cooling capacity of the thermoelectric cooler according to the temperature changes of the main board and the phase change material, so that it increases synchronously. Under the synergistic effect of the thermoelectric cooler and the phase change material, the heat is efficiently conducted from the processor to the phase change material, and the phase change material stores the heat generated by the processor, thus meeting the heat dissipation requirements of the fully enclosed computer in a high-temperature environment, ensuring that the computer still operates stably under high load, and during the phase change plateau period, reducing the cooling capacity of the thermoelectric cooler and relying on the phase change material to maintain temperature stability to achieve low-power design. In a low-temperature environment, the temperature control system detects that the current temperature is lower than the startup temperature. At this time, the system drives the thermoelectric cooler to generate heat, transfers the heat from the hot end of the thermoelectric cooler to the cold end, and then transfers it to the surface of the main components. Moreover, the heat stored by the phase change material at high temperature is released, and the release speed of the heat of the phase change material is controlled by adjusting the gear of the blue light, so that the computer can be successfully started in a low-temperature environment and ensure its normal operation in cold conditions.

[0106] Based on the principles of thermoelectric coolers and phase change materials, the present invention studies a temperature control system for precisely controlling the temperature of the main board, aiming at the thermal management problems of current fully enclosed computers, and has significant advantages. When the computer processes a large number of tasks, the load on the processor increases significantly, and the heat generation also rises accordingly. At this time, the temperature control system will intelligently adjust the cooling capacity of the thermoelectric cooler according to the temperatures of the main board and the phase change material. The thermoelectric cooler and the phase change material work together to efficiently conduct the heat generated by the processor to the phase change material, and the phase change material stores the heat, thus meeting the heat dissipation requirements of the fully enclosed computer in a high-temperature environment and ensuring that the computer still operates stably under high load. In a low-temperature environment, the temperature control system can detect that the current temperature does not meet the startup conditions. At this time, the system will automatically control the heat generation amount of the thermoelectric cooler to increase it synchronously, and control the intensity of the blue light under the phase change material to increase the heat released by the phase change material, and transfer the thermal energy from the hot end of the thermoelectric cooler to the surface of the main components.

[0107] Embodiment 3:

[0108] This embodiment provides a device for implementing the fully enclosed computer thermal management method of Embodiment 1, referring to the attached Figure 5, the fully enclosed computer thermal management device includes a main board 2, a power supply, a temperature measuring element, a heating element 3, a thermoelectric cooler 4, a phase change material 5, a blue light strip 6 and a core controller arranged in the chassis box body 1; the core controller is arranged on the main board 2, and the core controller is used to implement the fully enclosed computer thermal management method of Embodiment 1. The thermoelectric cooler 4 is embedded at the bottom of the chassis box body 1, the heating element 3 is arranged on the top of the thermoelectric cooler 4, and the heating element 3 is connected to the cold end of the thermoelectric cooler 4 through a high thermal conductivity material. The main board 2 is arranged on the top of the heating element 3; the phase change material 5 is filled in the gap between the hot end of the thermoelectric cooler 4 and the chassis box body 1, and the phase change material 5 is connected to the hot end of the thermoelectric cooler 4 through a heat pipe and a light response; the blue light strip 6 is arranged at the bottom of the phase change material 5, and the temperature measuring element is arranged on the surfaces of the heating element and the phase change material and the inner side of the box body.

[0109] The core controller adopts an STM32 series chip. The Smith fuzzy adaptive PID control algorithm is implemented in C language through keil5 software and then imported into the STM32 series chip to achieve the control function. The heating element 3 (the controlled object of the temperature control system) of the present invention includes a central processing unit, a graphics processing unit, etc., and is in contact with the cold end of the thermoelectric cooler through a high thermal conductivity material such as graphene or copper foil. The hot end of the thermoelectric cooler is combined with the photo-responsive phase change material through a heat pipe. The phase change material is selected according to the phase change temperature close to the chip operating temperature and has a photo-responsive characteristic. Such as the photo-responsive azobenzene phase change material, which can effectively respond to the light source and realize the controllable storage and release of heat energy.

[0110] When the surface temperature of the main heating element on the main board is too high, the thermoelectric cooler starts to cool. The heat on the surface of the main heating element and the cold end of the thermoelectric cooler is transferred to the hot end of the thermoelectric cooler, and then the heat is stored through the phase change material. In terms of heating, when the temperature control system detects that the current temperature is lower than the starting temperature, it controls the thermoelectric cooler to start heating. The thermoelectric cooler transfers the heat at the hot end to the cold end and then transports it to the surface of the processor. At the same time, the blue light is turned on to make the phase change material release heat. By controlling the intensity of the blue light, the heat release of the phase change material is controlled, and the heat release speed is adjusted, so that the system reaches the operating temperature faster and maintains stability.

[0111] In the present invention, the intensity of the blue light strip is divided into three gears. When starting at low temperature, the blue light operates at the highest gear to make the phase change material release the maximum amount of heat; when the actual temperature of the fully enclosed chassis system differs from the starting temperature by 5°C, the blue light is adjusted to operate at the middle gear to make the phase change material reduce the heat release; in the high-temperature heat dissipation stage, the blue light is turned off, and the system stores heat through the phase change material.

[0112] In summary, by combining the Smith predictor compensator with fuzzy adaptive PID control, the present invention fully utilizes the compensation ability of the Smith predictor compensator for the pure time-delay link and the characteristics of fuzzy PID control, which has low dependence on model accuracy and strong robustness. This combination not only significantly improves the dynamic performance of the temperature control system but also enhances the overall robustness of the fully enclosed computer temperature control system, ensuring that the system can still operate stably under complex working conditions. This advanced control algorithm perfectly meets the usage requirements of the fully enclosed computer, providing a strong guarantee for the stable operation of the fully enclosed computer in various extreme environments.

[0113] The above is only a specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention by those skilled in the art within the technical scope disclosed by the present invention shall be covered by the protection scope of the present invention.

Claims

1. A fully enclosed computer thermal management method, characterized in that: The steps include: S1. Design a Smith predictor compensator to compensate for the lag part of the control signal of the temperature control system and obtain the output of the Smith predictor compensator that eliminates the lag link; S2. Design a fuzzy adaptive PID controller, feed back the difference between the actual temperature and the output of the Smith predictor compensator to the input of the fuzzy adaptive PID controller, and generate a compensation error e and a compensation error change rate e c According to the principle of the fuzzy controller, the parameters of the fuzzy adaptive PID controller are adjusted to obtain the output and control the cooling capacity and heating capacity of the thermoelectric refrigerator.

2. The fully enclosed computer thermal management method according to claim 1, characterized in that: The step S1 comprises: The temperature control system is mathematically modeled, and the mathematical model of the controlled object of the temperature control system is expressed as: In formula (1), G0(s)e -ls is the transfer function of the mathematical model of the controlled object, K is the proportional coefficient, T is the time constant, e -ls is the time-delay link with a delay time of ls; The closed-loop transfer function of the temperature control system is expressed as: In formula (2), C(S) is the Laplace transform of the output, R(S) is the Laplace transform of the input, and G c (s) is the transfer function of the temperature control system controller; The characteristic equation of the closed-loop transfer function of the temperature control system is expressed as: 1+G c (s)G0(s)e -ls =0 (3) After the Smith Predictor compensator is introduced, the closed-loop transfer function of the temperature control system is expressed as: In formula (4), G1(s) is the transfer function of the Smith predictor compensator, and the characteristic equation of the temperature control system is expressed as: 1+G c (s)G1(s)+G c (s)G0(s)e -ls =0 (5) In order to express the characteristic equation of the closed-loop system of the temperature control system as: 1+G c (s)G0(s)=0 (6) make: 1+G c (s)G0(s)=1+G c (s)G1(s)+G c (s)G0(s)e -ls (7) The solution of the transfer function G1(s) of the Smith predictor compensator is obtained as: G1(s)=G0(s)-G0(s)e -ls (8) Eliminate lag time.

3. The fully enclosed computer thermal management method according to claim 1, characterized in that: The step S2 comprises: S21, fuzzification: setting the input variables of the fuzzy adaptive PID controller to the compensation error e and the compensation error change rate e c , K of PID controller p , K i , K d Set it as the output variable of the fuzzy adaptive PID controller, determine the domain to be {-6, -5, -4, -3, -2, -1, 0, 1, 2, 3, 4, 5, 6}, and divide the domain into seven fuzzy subsets: negative large (NB), negative medium (NM), negative small (NS), zero (ZO), positive small (PS), positive medium (PM), and positive large (PB); S22, fuzzy reasoning: designing the variation rules of the fuzzy adaptive PID controller parameters to obtain the control rules of the output variables; a. When the compensation error e is large, take a larger K p , smaller K d , K i =0; b. When the compensation error e and the compensation error change rate e c When the size is medium, take a relatively small K p , moderate K i and moderate K d ; c. When the compensation error e is small, increase K p , K i The value of the compensation error change rate e c When it is larger, take a relatively small K d , otherwise, take a relatively large K d ; S23, clarification: The parameters of the fuzzy adaptive PID controller are obtained by formulating parameters through the center of gravity method, and the clarified output variable K is obtained. p , K i , K d , thereby controlling the thermoelectric cooler.

4. The fully enclosed computer thermal management method according to claim 2, characterized in that: The controlled objects include a central processing unit and a graphics processing unit.

5. A fully enclosed computer thermal management system, characterized in that: include: Core controller, power module, temperature measurement module, phase change module, blue light, drive module, thermoelectric cooler and mainboard; The core controller is used to implement the fully enclosed computer thermal management method according to any one of claims 1 to 4; The output end of the power module and the output end of the temperature measurement module are both connected to the input end of the core controller, and the output end of the core controller is respectively connected to the input end of the phase change module, the input end of the drive module and the mainboard; The output end of the phase change module is connected to the blue light, and the output end of the driving module is connected to the thermoelectric cooler.

6. A fully enclosed computer thermal management system according to claim 5, characterized in that: The core controller adopts STM32 series chips.

7. A fully enclosed computer thermal management system according to claim 5, characterized in that: The power module is designed as a power conversion circuit, including a 12V circuit, a 220V to 12V circuit, a 12V to 5V circuit and a 5V to 3.3V circuit.

8. A fully enclosed computer thermal management system according to claim 5, characterized in that: The driving module uses a motor driving chip as the core, and an eight-channel buffer chip with three-state output for buffering and isolation. The output voltage is controlled by pulse width modulation through an H-bridge driving method.

9. A fully enclosed computer thermal management system according to claim 5, characterized in that: It also includes a display module, the input end of the display module is connected to the output end of the core controller.

10. A fully enclosed computer thermal management device, characterized in that: It includes a mainboard, a power supply, a temperature measuring element, a heating element, a thermoelectric cooler, a phase change material, a blue light strip and a core controller arranged in the chassis; The core controller is arranged on the mainboard, and the core controller is used to implement the fully enclosed computer thermal management method according to any one of claims 1 to 4; The thermoelectric cooler is embedded in the bottom of the chassis body, the heating element is arranged on the top of the thermoelectric cooler, the heating element is connected to the cold end of the thermoelectric cooler through a high thermal conductivity material, and the mainboard is arranged on the top of the heating element; The phase change material fills the gap between the hot end of the thermoelectric cooler and the chassis body, and the phase change material is connected to the hot end of the thermoelectric cooler through a heat spreader and a light response; The blue light strip is arranged at the bottom of the phase change material, and the temperature measuring element is arranged on the surface of the heating element and the phase change material and the inner side of the box.

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