Multi-sensor fusion AI temperature control system and computer heat dissipation equipment

Abstract

The invention discloses a multi-sensor fusion computer heat dissipation device. The device comprises a host; the heat dissipation assembly comprises a semiconductor chilling plate; large-area radiating fins; at least one cooling fan; a condensate water protection assembly; a humidity sensor; a plurality of temperature sensors; and an intelligent control module. According to the multi-sensor fusion computer heat dissipation equipment provided by the invention, heating parts of a computer can be effectively cooled and dissipated through the semiconductor chilling plate, meanwhile, the problem of condensate water is effectively solved, and hardware equipment of the computer is protected. The invention provides a multi-sensor fusion AI temperature control system. The system comprises a data acquisition module; a data fusion and preprocessing module; a database; an AI decision module; and an execution module. The working state of computer heat dissipation equipment can be intelligently adjusted according to the real-time temperature of a heating part of a computer, the problem of condensate water is effectively solved while efficient heat dissipation is achieved, the operation stability of the computer is improved, and the service life of hardware is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of computer hardware, and in particular to an AI temperature control system with multi-sensor fusion and a computer heat dissipation device. Background Art

[0002] As the performance of computer hardware continues to improve, the heat generated during its operation is also increasing. The existing air-cooling heat dissipation method is to install a fan in the chassis, and the wind takes away the heat and is discharged through the vents to dissipate the heat for the computer. When facing a computer or computer running at a high load, the heat dissipation effect of the air-cooling heat dissipation method is gradually stretched, which easily leads to hardware overheating. Water cooling refers to the use of the large specific heat capacity of water in a relatively closed computer host, and the water is circulated between the CPU and the fan through a water pump. The heat of the CPU is continuously taken away by the water and the fan to achieve computer heat dissipation. Although water cooling has a high heat dissipation efficiency, there is a risk of water leakage, and the installation and maintenance are relatively complicated. Semiconductor refrigeration technology has the advantages of no mechanical parts, low noise, and fast cooling speed. However, the application of semiconductor refrigeration has problems such as improper treatment of condensed water, which limits its widespread application. Summary of the invention

[0003] An object of the present invention is to solve at least the above problems and to provide at least the advantages which will be described hereinafter.

[0004] Another object of the present invention is to provide a multi-sensor fusion computer cooling device, which can effectively cool and dissipate the heat of the computer's heat-generating components through semiconductor refrigeration sheets, while effectively solving the problem of condensed water and protecting the computer's hardware equipment.

[0005] Another object of the present invention is to provide an AI temperature control system with multi-sensor fusion, which can intelligently adjust the working state of the computer's cooling equipment according to the real-time temperature of the computer's heat-generating components, thereby achieving efficient heat dissipation and effectively solving the problem of condensed water, thereby improving the computer's operating stability and hardware service life.

[0006] In order to achieve these objectives and other advantages according to the present invention, a computer-aided design for multi-sensor fusion is provided. Thermal equipment, including: A host computer, which is arranged in the chassis; A heat dissipation assembly, comprising a semiconductor cooling sheet, a cold surface of which is arranged on the outside of a heat-generating component of a host, and a hot surface of the semiconductor cooling sheet is arranged toward the outside of the host; a large-area heat sink, one end of which is arranged on the hot surface of the semiconductor cooling sheet; at least one heat dissipation fan, which is arranged near a plurality of ventilation holes I of a chassis, and an air inlet side of at least one heat dissipation fan is detachably arranged at the other end of the large-area heat sink; a plurality of ventilation holes II, which are respectively arranged on a front cover and a rear cover of the chassis; A condensate protection assembly, which includes a pair of vertical grooves symmetrically and closely arranged at two side edges of a semiconductor refrigeration chip, and the openings of the pair of vertical grooves face the two side edges of the semiconductor refrigeration chip; a main groove, which is obliquely arranged below the lower edge of the semiconductor refrigeration chip, and the opening of the main groove faces the lower edge of the semiconductor refrigeration chip, and the lower ends of the pair of vertical grooves extend into the groove body of the main groove; a desiccant box filled in the groove bodies of the pair of vertical grooves; a non-woven fabric filter layer detachably arranged in the groove body of the main groove, and there is a certain distance between the non-woven fabric layer and the bottom of the groove body of the main groove; a water collection box detachably arranged on the outer side wall of the chassis of the host, and the main groove is communicated with the water collection box through a conduit; A humidity sensor arranged near the semiconductor refrigeration chip; A plurality of temperature sensors respectively arranged near a heating component, the semiconductor refrigeration chip and at least one cooling fan; and An intelligent control module respectively communicatively connected with the host, the heat dissipation component, the humidity sensor and the plurality of temperature sensors.

[0007] Preferably, the difference between the width of the groove body of the pair of vertical guide grooves and the thickness of the semiconductor refrigeration chip is less than 5 mm; the difference between the width of the groove body of the main groove and the thickness of the semiconductor refrigeration chip is less than 8 mm.

[0008] Preferably, it further includes: An air guide cover, which is a funnel-shaped cover body, the air guide cover is detachably covered on at least one cooling fan and a large-area heat dissipation plate, and the narrow end of the air guide cover is detachably arranged near the pair of vertical guide grooves and the main groove, and the wide end of the air guide cover is detachably arranged on the inner side wall of the chassis in front of the cooling fan; A plurality of air guide holes evenly distributed on the air guide cover.

[0009] Preferably, the side wall of the air guide cover is a stepped structure, the aperture of the plurality of air guide holes is 2-4 mm, and the center distance between adjacent two air guide holes is 10-20 mm.

[0010] Preferably, it further includes: A plurality of auxiliary intake fans respectively arranged at the front cover and the rear cover of the chassis, and a plurality of auxiliary air guide holes on the air guide cover at the rear end of the auxiliary intake fan face the pair of vertical grooves.

[0011] Preferably, the heating component is a CPU and a GPU.

[0012] A multi-sensor fusion AI temperature control system, including: A data acquisition module for real-time collecting the temperature values of the plurality of temperature sensors and the humidity value of the humidity sensor; A data fusion and preprocessing module, which is used to perform denoising, standardization, and time synchronization processing on the temperature values and humidity values obtained by the data acquisition module to obtain a data group; A database, which pre-stores the temperature threshold of the heating component, the current threshold of the semiconductor refrigeration chip corresponding to the temperature threshold, and the rotation speed threshold of the cooling fan corresponding to the temperature threshold; An AI decision-making module, which is used to adopt an AI algorithm to compare and calculate the data group with the temperature threshold, current threshold, and rotation speed threshold pre-stored in the database to obtain a comparison and calculation result, and generate a power supply control instruction for the semiconductor refrigeration chip and a rotation speed control instruction for at least one cooling fan according to the comparison and calculation result; and An execution module, which is used to receive and execute the power supply control instruction in real time, and control the current flow of the semiconductor refrigeration chip to be within the current threshold in real time; it is also used to receive and execute the rotation speed control instruction of the fan, and control the rotation speed of at least one cooling fan to be within the rotation speed threshold in real time.

[0013] Preferably, the heating component is a CPU and a GPU, and the temperature threshold is 40 - 60 °C; The current threshold of the semiconductor refrigeration chip corresponding to the temperature threshold is 30% - 60% of the rated current; The rotation speed threshold of the cooling fan corresponding to the temperature threshold is 35% - 55% of the rated rotation speed.

[0014] Preferably, if the temperature value in the data group is greater than the temperature threshold, the execution module controls the current flow of the semiconductor refrigeration chip to be greater than 60% of the rated current; and controls the rotation speed of at least one cooling fan to be greater than 55% of the rated rotation speed; and controls the rotation speed of multiple auxiliary intake fans to be within 30% - 50% of the rated rotation speed; If the temperature value in the data group is less than the temperature threshold, the execution module controls the current flow of the semiconductor refrigeration chip to be less than 30% of the rated current; and controls the rotation speed of at least one cooling fan to be less than 35% of the rated rotation speed; and controls to turn off multiple auxiliary intake fans.

[0015] Preferably, the maximum humidity threshold pre-stored in the database is 60% relative humidity. If the humidity value of the humidity sensor is greater than the maximum humidity threshold, the execution module controls the rotation speed of at least one cooling fan to be greater than 60% of the rated rotation speed, and controls the rotation speed of multiple auxiliary intake fans to be greater than 60% of the rated rotation speed.

[0016] The present invention has at least the following beneficial effects: A computer cooling device with multi-sensor fusion, through the intelligent control of the AI temperature control system, adjusts the working state of the thermoelectric cooler in real time according to the temperature of the heating components, realizes precise and efficient heat dissipation, ensures that the heating components (hardware) of the computer always operate at an appropriate temperature, and improves the operating stability and performance of the computer; The condensate protection component effectively collects and processes condensate, and monitors through a humidity sensor, effectively preventing the generation of condensate and avoiding failures such as hardware short circuits caused by condensate, and extending the service life of the hardware; The desiccant box and the non-woven fabric filter layer can further reduce the risk of condensate evaporation and strengthen the protection effect; The thermoelectric cooler has no mechanical rotating parts, and cooperates with at least one cooling fan with adjustable speed, while meeting the heat dissipation requirements, reducing the operating noise of the chassis, and providing a quiet use environment for users; The reasonable air duct design and the layout of the computer cooling device make full use of the internal space of the chassis, improve the heat dissipation efficiency without affecting the overall aesthetics and expandability of the chassis.

[0017] Other advantages, objectives and features of the present invention will be partially reflected by the following description, and partially will also be understood by those skilled in the art through the research and practice of the present invention. Brief Description of the Drawings

[0018] Figure 1 It is a perspective structural schematic diagram of the computer cooling device with multi-sensor fusion described in an embodiment of the present invention; Figure 2 It is a structural schematic diagram of the condensate protection component described in an embodiment of the present invention; Figure 3 It is a perspective structural schematic diagram of the computer cooling device with multi-sensor fusion described in another embodiment of the present invention; Figure 4 It is a perspective structural schematic diagram of the computer cooling device with multi-sensor fusion described in another embodiment of the present invention; Figure 5 It is a top view structural schematic diagram inside the chassis described in another embodiment of the present invention, showing at least one cooling fan and multiple auxiliary intake fans; Figure 6 It is a structural schematic diagram of the AI temperature control system with multi-sensor fusion described in another embodiment of the present invention. Detailed Description of the Invention

[0019] The following further describes the present invention in detail with reference to the drawings, so that those skilled in the art can implement it according to the description in the specification.

[0020] It should be understood that terms such as "having", "comprising", and "including" as used herein do not preclude the presence or addition of one or more other elements or combinations thereof.

[0021] As Figure 1 , 2 shown, the present invention provides a computer heat dissipation device with multi-sensor fusion, including: A mainframe 1, which is arranged inside a chassis 2; A heat dissipation component 3, which includes a thermoelectric cooler 301, whose cold surface is attached to the wall on the outside of the heat-generating component of the mainframe, and the hot surface of the thermoelectric cooler is arranged towards the outside of the mainframe; a large-area heat sink 302, one end of which is attached to the wall on the hot surface of the thermoelectric cooler; at least one cooling fan 303, which is arranged at multiple ventilation holes Ⅰ close to the chassis, and the air inlet side of at least one cooling fan is detachably arranged at the other end of the large-area heat sink; multiple ventilation holes Ⅱ, which are respectively arranged on the front end cover and the rear end cover of the chassis; A condensate protection component 4, which includes a pair of vertical grooves 401, which are symmetrically arranged close to the two side edges of the thermoelectric cooler, and the openings of the pair of vertical grooves face the two side edges of the thermoelectric cooler; a main groove 402, which is obliquely arranged below the lower edge of the thermoelectric cooler, and the opening of the main groove faces the lower edge of the thermoelectric cooler, and the lower ends of the pair of vertical grooves extend into the groove body of the main groove; a desiccant box 403, which is filled in the groove body of the pair of vertical grooves; a non-woven fabric filter layer 404, which is detachably arranged in the groove body of the main groove, and there is a certain distance between the non-woven fabric layer and the bottom of the groove body of the main groove; a water collection box 405, which is detachably arranged on the outer side wall of the chassis of the mainframe, and the main groove is communicated with the water collection box through a conduit 406; a humidity sensor, which is arranged close to the thermoelectric cooler; Multiple temperature sensors, which are respectively arranged close to the heat-generating component, the thermoelectric cooler and at least one cooling fan; and An intelligent control module 5, which is respectively communicatively connected with the mainframe, the heat dissipation component, the humidity sensor and the multiple temperature sensors.

[0022] In this solution, the cold surface of the thermoelectric cooler is directly attached to the heat-generating component, and the hot surface is connected to the large-area heat sink. By reasonably arranging the thermoelectric cooler, it is ensured that the heat generated by the heat-generating component can be quickly absorbed; and then the heat on the large-area heat sink is quickly carried away by at least one cooling fan to achieve effective heat dissipation; A pair of vertical grooves are provided at the two side edges of the semiconductor refrigeration chip, and a desiccant box is arranged in the pair of vertical grooves, which can effectively reduce the air humidity around the semiconductor refrigeration chip, and to a certain extent avoid the appearance of condensed water around the semiconductor refrigeration chip. A main groove is arranged below the lower edge of the semiconductor refrigeration chip and is connected to the water collection box through a conduit, which can guide a small amount of dripping condensed water to the water collection box outside the chassis, avoiding excessive humidity inside the chassis; in order to further reduce the evaporation of condensed water in the main groove and return to the inside of the chassis, a non-woven fabric filter layer is arranged in the main groove. The non-woven fabric filter layer has good water absorption, can adsorb condensed water, slow down the water evaporation speed, and can filter impurities to prevent the conduit from being blocked. A plurality of temperature sensors are arranged inside the chassis to monitor the temperatures of heat-generating components such as the CPU and the graphics card in real time; at the same time, a high-precision humidity sensor is installed to comprehensively monitor the humidity inside the chassis; the temperature and humidity sensors transmit the collected data to the intelligent control module; the intelligent control module intelligently regulates the working state of the heat dissipation device inside the chassis according to the preset temperature threshold and humidity threshold, effectively cools and dissipates heat from the heat-generating components of the computer, and at the same time effectively solves the problem of condensed water, protecting the hardware devices of the computer.

[0023] In a preferred solution, the difference between the width of the groove body of the pair of vertical guide grooves and the thickness of the semiconductor refrigeration chip is less than 5 mm; the difference between the width of the groove body of the main groove and the thickness of the semiconductor refrigeration chip is less than 8 mm.

[0024] As Figure 3 shown, in a preferred solution, it further includes: An air guide cover 304, which is a funnel-shaped cover body. The air guide cover is detachably covered on at least one heat dissipation fan and a large-area heat dissipation plate, and the narrow end of the air guide cover is detachably arranged near the pair of vertical grooves and the main groove, and the wide end of the air guide cover is detachably arranged on the inner side wall of the chassis at the front end of the heat dissipation fan; A plurality of air guide holes, which are evenly distributed on the air guide cover. A plurality of ventilation holes II provided on the front cover and the rear cover of the chassis cooperate with at least one heat dissipation fan, and the air flows along a specific path, flowing around the periphery of the semiconductor refrigeration chip, taking away the heat dissipated from the hot end of the semiconductor refrigeration chip and the surrounding hardware, improving the heat dissipation efficiency. At least one heat dissipation fan can be a turbo fan. The powerful air extraction ability of the turbo fan can efficiently discharge hot air, ensuring the formation of continuous and efficient air convection inside the chassis and strengthening the heat dissipation effect. To further improve the heat dissipation efficiency, a funnel-shaped air guide cover is arranged outside the large-area heat sink and at least one heat dissipation fan. A plurality of air guide holes are arranged on the air guide cover, which can balance the air pressure inside the air guide cover and prevent air flow disorder caused by uneven air pressure. When at least one heat dissipation fan is running, part of the air flow flows out or into the air guide cover through the plurality of air guide holes, optimizing the air flow distribution and enabling more air to participate in the heat exchange process of the heat sink, improving the heat dissipation efficiency.

[0025] As Figure 4 shown, in a preferred embodiment, the side wall of the air guide cover is a stepped structure, the apertures of the plurality of air guide holes are 2-4 mm, and the center distance between two adjacent air guide holes is 10-20 mm. Since the internal space of the chassis is limited and the layout is complex, in this solution, the side wall of the air guide cover is set to be stepped, and by adjusting the height and width of the steps, it is possible to better avoid other hardware inside the chassis, such as cables and motherboard interfaces, and achieve a perfect fit with the internal structure of the chassis. In addition, the stepped air guide cover can also have a larger effective air guiding area in a limited space, improving the overall heat dissipation performance.

[0026] As Figure 5 shown, in a preferred embodiment, it further includes: a plurality of auxiliary intake fans 304, which are respectively arranged at the front cover and the rear cover of the chassis, and a plurality of auxiliary air guide holes on the air guide cover at the rear end of the auxiliary intake fan are arranged towards the pair of vertical grooves. When it is necessary to further improve the heat dissipation performance or dehumidification performance, the plurality of auxiliary intake fans can be controlled to be turned on through the intelligent control module, further increasing the air speed in the air duct.

[0027] In a preferred embodiment, the heat generating components are the CPU and the GPU.

[0028] As Figure 6 shown, a multi-sensor fusion AI temperature control system includes: A data acquisition module, which is used to collect the temperature values of the plurality of temperature sensors and the humidity value of the humidity sensor in real time; A data fusion and preprocessing module, which is used to perform denoising, normalization, and time synchronization processing on the temperature values and humidity values obtained by the data acquisition module to obtain a data group; A database, which pre-stores the temperature threshold of the heat generating component, the current threshold of the thermoelectric cooler corresponding to the temperature threshold, and the rotation speed threshold of the cooling fan corresponding to the temperature threshold; An AI decision module, which is used to adopt an AI algorithm to compare and calculate the data group with the temperature threshold, current threshold, and rotation speed threshold pre-stored in the database to obtain a comparison and calculation result, and generate a power supply control instruction for the thermoelectric cooler and a rotation speed control instruction for at least one cooling fan according to the comparison and calculation result; and An execution module, which is used to receive and execute the power supply control instruction in real time, and control the current of the thermoelectric cooler in the multi-sensor fusion computer cooling device as claimed in claim 1 to be within the current threshold in real time; it is also used to receive and execute the rotation speed control instruction of the fan, and control the rotation speed of at least one cooling fan in the multi-sensor fusion computer cooling device as claimed in claim 1 to be within the rotation speed threshold in real time.

[0029] The AI temperature control system with multi-sensor fusion provided by the present invention can monitor the temperature of the heating component in real time, and intelligently adjust the magnitude and direction of the current flowing through the thermoelectric cooler. When the temperature of the heating component rises, the current is increased to enhance the refrigeration effect; when the temperature drops to a certain extent, the current is decreased to avoid over-refrigeration. The AI temperature control system with multi-sensor fusion provided by the present invention can also monitor the humidity around the heating component in real time. When the humidity exceeds the set upper limit, at least one cooling fan can be started for dehumidification, or the rotation speed of at least one cooling fan that has been started can be increased to quickly improve the dehumidification effect; that is, while achieving efficient heat dissipation, the problem of condensate water can be effectively solved, and the operation stability and hardware service life of the computer can be improved.

[0030] In a preferred solution, the heating component is a CPU and a GPU, and the temperature threshold is 40 - 60 °C; the current threshold of the thermoelectric cooler corresponding to the temperature threshold is 30% - 60% of the rated current; the rotation speed threshold of the cooling fan corresponding to the temperature threshold is 35% - 55% of the rated rotation speed.

[0031] In a preferred solution, if the temperature value in the data group is greater than the temperature threshold, the execution module controls the current flow of the thermoelectric cooler to be greater than 60% of the rated current; and controls the rotation speed of the at least one cooling fan to be greater than 55% of the rated rotation speed; and controls the rotation speeds of multiple auxiliary intake fans to be between 30% - 50% of the rated rotation speed; If the temperature value in the data group is less than the temperature threshold, the execution module controls the current flow of the thermoelectric cooler to be less than 30% of the rated current; and controls the rotation speed of the at least one cooling fan to be less than 35% of the rated rotation speed; and controls to turn off multiple auxiliary intake fans.

[0032] In a preferred solution, the maximum humidity threshold pre-stored in the database is 60% relative humidity. If the humidity value of the humidity sensor is greater than the maximum humidity threshold, the execution module controls the rotation speed of the at least one cooling fan to be greater than 60% of the rated rotation speed, and controls the rotation speeds of multiple auxiliary intake fans to be greater than 60% of the rated rotation speed.

[0033] Although the embodiments of the present invention have been disclosed above, it is not limited to only the applications listed in the specification and embodiments. It can be fully applied to various fields suitable for the present invention. For those familiar with the field, additional modifications can be easily made. Therefore, without departing from the general concept defined by the claims and the equivalent scope, the present invention is not limited to specific details and the examples shown and described herein.

Claims

1. A multi-sensor fusion computer heat dissipation device, characterized in that: include: A host computer, which is arranged in the chassis; The heat dissipation assembly includes a semiconductor cooling sheet, the cold surface of which is arranged on the outside of the heat-generating component of the host, and the hot surface of the semiconductor cooling sheet is arranged toward the outside of the host; a large-area heat sink, one end of which is arranged on the hot surface of the semiconductor cooling sheet; at least one heat dissipation fan, which is arranged near a plurality of ventilation holes I of the chassis, and the air inlet side of at least one heat dissipation fan is detachably arranged at the other end of the large-area heat sink; A plurality of ventilation holes II, which are respectively arranged on the front cover and the rear cover of the chassis; A condensation water protection component, comprising a pair of vertical grooves, which are symmetrically arranged near the two side edges of the semiconductor refrigeration plate, and the notches of the pair of vertical grooves are arranged opposite to the two side edges of the semiconductor refrigeration plate; a main guide groove, which is obliquely arranged below the lower edge of the semiconductor refrigeration plate, and the notches of the main guide groove are arranged opposite to the lower edge of the semiconductor refrigeration plate, and the lower ends of the pair of vertical grooves extend into the groove bodies of the main guide grooves; a desiccant box, which is filled and arranged in the groove bodies of the pair of vertical grooves; a non-woven fabric filter layer, which is detachably arranged in the groove body of the main guide groove, and a certain distance is spaced between the non-woven fabric layer and the bottom of the groove body of the main guide groove; a water collection box, which is detachably arranged on the outer side wall of the chassis of the host, and the main guide groove is connected to the water collection box through a conduit; A humidity sensor is arranged near the semiconductor cooling chip; A plurality of temperature sensors are respectively arranged near the heat generating component, the semiconductor cooling sheet and at least one heat dissipation fan; as well as The intelligent control module is respectively connected to the host, the heat dissipation component, the humidity sensor and a plurality of temperature sensors for communication.

2. The multi-sensor fusion computer heat dissipation device according to claim 1, characterized in that: The difference between the width of the groove body of the pair of vertical guide grooves and the thickness of the semiconductor refrigeration plate is less than 5 mm; the difference between the width of the groove body of the main guide groove and the thickness of the semiconductor refrigeration plate is less than 8 mm.

3. The computer heat dissipation device with multi-sensor fusion as claimed in claim 1, characterized in that: Also includes: The air guide cover is a funnel-shaped cover body, the air guide cover is detachably arranged on at least one cooling fan and a large-area cooling plate, and the narrow end of the air guide cover is detachably arranged near a pair of vertical guide grooves and a main guide groove, and the wide end of the air guide cover is detachably arranged on the inner side wall of the chassis at the front end of the cooling fan; A plurality of air guide holes are evenly distributed on the air guide cover.

4. The computer heat dissipation device with multi-sensor fusion as claimed in claim 3, characterized in that: The side wall of the air guide cover is a stepped structure, the apertures of the multiple air guide holes are 2-4 mm, and the center distance between two adjacent air guide holes is 10-20 mm.

5. The computer heat dissipation device with multi-sensor fusion as claimed in claim 1, characterized in that: Also includes: A plurality of auxiliary inlet fans are respectively arranged at the front cover and the rear cover of the chassis, and a plurality of auxiliary air guide holes on the air guide cover at the rear end of the auxiliary inlet fans are arranged toward the pair of vertical slots.

6. The computer heat dissipation device for multi-sensor fusion as claimed in claim 1, wherein the heat generating components are a CPU and a GPU.

7. A multi-sensor fusion AI temperature control system, characterized in that: include: A data acquisition module, which is used to collect in real time the temperature values ​​of the multiple temperature sensors and the humidity value of the humidity sensor in the multi-sensor fusion computer heat dissipation device according to claim 1; A data fusion and preprocessing module is used to perform denoising, standardization and time synchronization processing on the temperature and humidity values ​​obtained by the data acquisition module to obtain a data group; A database in which the temperature threshold of the heat generating component, the current threshold of the semiconductor cooling sheet corresponding to the temperature threshold, and the speed threshold of the cooling fan corresponding to the temperature threshold are pre-stored; An AI decision module, which is used to use an AI algorithm to compare the data group with the temperature threshold, current threshold and speed threshold pre-stored in the database, obtain a comparison result, and generate a power supply control instruction for the semiconductor cooling plate and a speed control instruction for at least one cooling fan according to the comparison result; as well as An execution module is used to receive and execute the power supply control instruction in real time, and control the current of the semiconductor refrigeration plate in the multi-sensor fusion computer heat dissipation device as claimed in claim 1 to be within the current threshold in real time; it is also used to receive and execute the fan speed control instruction, and control the speed of at least one cooling fan in the multi-sensor fusion computer heat dissipation device as claimed in claim 1 to be within the speed threshold in real time.

8. The multi-sensor fusion AI temperature control system according to claim 7, characterized in that: The heat generating components are CPU and GPU, and the temperature threshold is 40-60°C; The current threshold of the semiconductor cooling sheet corresponding to the temperature threshold is 30%~60% of the rated current; The speed threshold of the cooling fan corresponding to the temperature threshold is 35% to 55% of the rated speed.

9. The multi-sensor fusion AI temperature control system according to claim 8, characterized in that: If the temperature value in the data group is greater than the temperature threshold, the execution module controls the current of the semiconductor cooling plate to be greater than 60% of the rated current; and controls the speed of the at least one cooling fan to be greater than 55% of the rated speed; And control the speed of multiple auxiliary inlet fans to be 30%~50% of the rated speed; If the temperature value in the data group is less than the temperature threshold, the execution module controls the current of the semiconductor cooling plate to be less than 30% of the rated current; and controls the speed of the at least one cooling fan to be less than 35% of the rated speed; And control to shut down multiple auxiliary intake fans.

10. The multi-sensor fusion AI temperature control system according to claim 7, characterized in that: The maximum humidity threshold pre-stored in the database is 60% relative humidity. If the humidity value of the humidity sensor is greater than the maximum humidity threshold, the execution module controls the rotation speed of at least one cooling fan to be greater than 60% of the rated speed, and controls the rotation speed of multiple auxiliary inlet fans to be greater than 60% of the rated speed.

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