Method, system and device for improving flash memory reading speed and storage medium

Abstract

The embodiment of the invention discloses a method, a system and equipment for improving the reading speed of a flash memory and a storage medium, the method, the system and the equipment are applied to electronic equipment, the electronic equipment comprises the flash memory and a heat dissipation device, and the method comprises the following steps: acquiring a first working temperature of the flash memory; when the first working temperature is greater than a first preset threshold value, detecting the current reading speed of the flash memory; when the current reading speed is smaller than or equal to a second preset threshold value, the environment temperature of the flash memory is obtained; determining a first working parameter of the heat dissipation device according to the environment temperature and the first working temperature; and controlling the heat dissipation device to work according to the first working parameter so as to reduce the first working temperature. By adopting the embodiment of the invention, the flash memory reading speed can be improved, so that the user experience is improved.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a method, system, device and storage medium for improving the reading speed of a flash memory. Background Art

[0002] With the rapid development of information technology, the amount of information has also increased dramatically. Since flash memory is a non-volatile memory, that is, data will not be lost even if the power is off, flash memory has also become a user's preference. However, there may also be a situation where the flash memory reading speed is slow. Therefore, the problem of how to improve the flash memory reading speed needs to be solved urgently. Summary of the invention

[0003] The embodiments of the present application provide a method, system, device and storage medium for improving the reading speed of a flash memory, which can improve the reading speed of the flash memory, thereby improving the user experience.

[0004] In a first aspect, an embodiment of the present application provides a method for improving a flash memory read speed, which is applied to an electronic device, wherein the electronic device includes a flash memory and a heat dissipation device, and the method includes:

[0005] Acquire a first operating temperature of the flash memory;

[0006] When the first operating temperature is greater than a first preset threshold, detecting a current read speed of the flash memory;

[0007] When the current reading speed is less than or equal to a second preset threshold, obtaining an ambient temperature of the flash memory;

[0008] Determining a first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature;

[0009] The heat dissipation device is controlled to operate according to the first operating parameter to reduce the first operating temperature.

[0010] In a second aspect, an embodiment of the present application provides a system for improving the reading speed of a flash memory, which is applied to an electronic device, wherein the electronic device includes a flash memory and a heat dissipation device, and the system includes: an acquisition unit, a detection unit, a determination unit, and a control unit, wherein:

[0011] The acquisition unit is used to acquire a first operating temperature of the flash memory;

[0012] The detection unit is used to detect the current reading speed of the flash memory when the first operating temperature is greater than a first preset threshold;

[0013] The acquisition unit is further configured to acquire the ambient temperature of the flash memory when the current reading speed is less than or equal to a second preset threshold;

[0014] The determining unit is configured to determine a first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature;

[0015] The control unit is configured to control the heat dissipation device to operate according to the first operating parameter, so as to reduce the first operating temperature.

[0016] In a third aspect, an embodiment of the present application provides an electronic device, including a processor, a memory, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the processor, and the programs include instructions for performing the steps in the first aspect of the embodiments of the present application.

[0017] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to execute some or all of the steps described in the first aspect of the embodiments of the present application.

[0018] In a fifth aspect, an embodiment of the present application provides a computer program product, wherein the computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to enable a computer to execute some or all of the steps described in the first aspect of the embodiments of the present application. The computer program product may be a software installation package.

[0019] Implementing the embodiments of the present application has the following beneficial effects:

[0020] It can be seen that a method, a system, a device, and a storage medium for improving the flash memory reading speed described in the embodiments of the present application are applied to an electronic device, the electronic device includes a flash memory and a heat dissipation device, the first operating temperature of the flash memory is obtained, when the first operating temperature is greater than a first preset threshold, the current reading speed of the flash memory is detected, when the current reading speed is less than or equal to a second preset threshold, the ambient temperature of the flash memory is obtained, a first operating parameter of the heat dissipation device is determined according to the ambient temperature and the first operating temperature, and the heat dissipation device is controlled to operate according to the first operating parameter, so as to reduce the first operating temperature. Since the operating parameter of the initially determined appropriate heat dissipation device is dynamically adjusted based on the difference between the operating temperature and the ambient temperature of the flash memory, the final operating parameter of the heat dissipation device deeply conforms to the actual operating temperature situation and also conforms to the actual ambient temperature difference situation. Therefore, it helps to improve the heat dissipation efficiency and also helps to improve the flash memory reading speed, so as to improve the user experience. Description of the Drawings

[0021] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0022] Figure 1A is a schematic flowchart of a method for improving the flash memory read speed provided by an embodiment of the present application;

[0023] Figure 1B is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0024] Figure 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0025] Figure 3 is a functional unit composition block diagram of a system for improving the flash memory read speed provided by an embodiment of the present application. Detailed implementation manners

[0026] In order to enable those skilled in the art to better understand the solutions of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0027] The terms "first", "second", etc. in the specification and claims of the present application and the above accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0028] Referring to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0029] In the embodiments of the present application, the electronic device involved may be a device with communication capabilities. The electronic device may include various wearable devices with wireless communication functions (such as smart glasses, smart bracelets, Internet of Things devices (such as smart refrigerators, smart washing machines, smart TVs), smart watches, etc.), handheld devices, smart home devices, vehicle-mounted devices (such as dash cams, in-vehicle cameras, car speakers, etc.), computing devices or other processing devices connected to a wireless modem, as well as various forms of user equipment (UE), mobile stations (MS), terminal devices, etc.

[0030] The embodiments of the present application will be introduced in detail below.

[0031] Please refer to Figure 1A , Figure 1A which is a schematic flowchart of a method for improving the flash memory reading speed provided by the embodiments of the present application. As shown in the figure, it is applied to an electronic device, and the electronic device includes a flash memory and a heat dissipation device. The method for improving the flash memory reading speed includes:

[0032] 101. Obtain the first operating temperature of the flash memory.

[0033] Among them, the heat dissipation device may include at least one of the following: air-cooled radiator, water-cooled radiator, liquid-cooled radiator, semiconductor refrigeration device, compression refrigeration device, etc., which are not limited here.

[0034] In specific implementation, as Figure 1B shown, the electronic device may include a flash memory and a heat dissipation device, and the heat dissipation device can achieve the heat dissipation function.

[0035] Before the above step 101, the heat dissipation device may be in a sleep state or a closed state, so as to reduce the power consumption of the electronic device.

[0036] In the embodiments of the present application, it can be at a fixed time interval or the first operating temperature of the flash memory. The fixed time interval can be preset in advance or the system default. Specifically, when the flash memory is in the working state, the first operating temperature of the flash memory can be obtained.

[0037] In a specific implementation, multiple temperature detection points can be set on the flash memory. The temperature of each temperature detection point can be obtained to get multiple temperatures. An average operation is performed based on the multiple temperatures to obtain a first average value. A standard deviation operation is performed based on the multiple temperatures to obtain a first standard deviation. The number of temperatures greater than the first average value among the multiple temperatures is determined to obtain a first quantity. The number of temperatures less than or equal to the first average value among the multiple temperatures is determined to obtain a second quantity. A mapping relationship between a preset standard deviation and an influence coefficient can be pre-stored. Furthermore, based on this mapping relationship, a first influence coefficient corresponding to the first standard deviation can be determined. The value range of the first influence coefficient is 0 to 0.2. When the first quantity is greater than the second quantity, the first working temperature = (1 + the first influence coefficient) * the first average value. When the first quantity is less than or equal to the second quantity, the first working temperature = (1 - the first influence coefficient) * the first average value. Multiple temperature detection points can avoid the influence of anomalies in a single temperature detection point. Of course, multiple temperature detection points can also reflect the overall working temperature situation of the flash memory. The standard deviation reflects the working stability of the flash memory. The overall temperature of the flash memory is dynamically evaluated based on the working stability of the flash memory, so that the first working temperature is deeply adapted to the working condition of the flash memory, and it also helps to ensure that the first working temperature is deeply related to the flash memory reading speed.

[0038] 102. When the first working temperature is greater than a first preset threshold, detect the current reading speed of the flash memory.

[0039] Among them, the first preset threshold can be set in advance or be the system default. The first preset threshold can be understood as the set normal working temperature. The first preset threshold can be deeply related to the remaining service life of the flash memory. For example, a mapping relationship between the preset remaining service life of the flash memory and the threshold can be pre-stored, and based on this mapping relationship, the corresponding first preset threshold of the remaining service life of the flash memory can be determined.

[0040] In a specific implementation, when the first working temperature is greater than the first preset threshold, it means that the actual working temperature of the flash memory is greater than the set normal working temperature. Continuing to work at this first working temperature may result in flash memory anomalies or events that affect the flash memory life. Therefore, it is necessary to detect the current reading speed of the flash memory. On the contrary, when the first working temperature is less than or equal to the first preset threshold, it means that the actual working temperature of the flash memory is within the set normal working temperature.

[0041] 103. When the current reading speed is less than or equal to a second preset threshold, obtain the ambient temperature of the flash memory.

[0042] Among them, the second preset threshold can be set in advance or be the system default. When the current reading speed is less than or equal to the second preset threshold, it means that due to the abnormal working temperature of the flash memory, events that affect the flash memory reading speed have occurred.

[0043] In a specific implementation, the current reading speed is compared with a second preset threshold to determine whether the actual working temperature of the flash memory significantly affects the reading speed of the flash memory. Thus, while ensuring the reading efficiency of the flash memory, the power consumption of the electronic device can also be reduced.

[0044] Of course, when the current reading speed is greater than the second preset threshold, it indicates that although the working temperature of the flash memory is abnormal, no event that significantly affects the reading of the flash memory has occurred. The heat dissipation device can be controlled to work, or the control of the heat dissipation device can be temporarily suspended, depending on the actual situation. The heat dissipation device can not only cool the flash memory but also cool other components of the electronic device.

[0045] In a specific implementation, when the current reading speed is less than or equal to the second preset threshold, the ambient temperature of the flash memory can be obtained. Considering the law of conservation of energy, the temperature dissipated from the flash memory will inevitably cause a change in the ambient temperature. In addition, the ambient temperature is mainly affected by two temperatures: the weather and the heat dissipation of the flash memory. The change between the ambient temperature and the working temperature of the flash memory complements each other.

[0046] 104. Determine the first working parameter of the heat dissipation device according to the ambient temperature and the first working temperature.

[0047] Among them, the first working parameter of the heat dissipation device can include at least one of the following: working mode, working current, working voltage, working power, adjustable heat dissipation parameters of various heat dissipation devices, etc., which are not limited here. For example, taking an air-cooled radiator as an example, the adjustable heat dissipation parameters can include at least one of the following: wind speed, wind direction, wind temperature, etc., which are not limited here; for another example, taking a water-cooled radiator as an example, the adjustable heat dissipation parameters can include at least one of the following: water flow size, water flow speed, water pressure, water temperature, etc., which are not limited here; for another example, taking a liquid-cooled radiator as an example, the adjustable heat dissipation parameters can include at least one of the following: liquid-cooling medium, liquid-cooling temperature, liquid-cooling flow rate, etc., which are not limited here; for another example, taking a semiconductor refrigeration device as an example, the adjustable heat dissipation parameters can include at least one of the following: reaction speed of the Peltier effect of the semiconductor material, reaction duration of the Peltier effect of the semiconductor material, other control parameters of the Peltier effect of the semiconductor material, etc., which are not limited here; for another example, taking a compression refrigeration device as an example, the adjustable heat dissipation parameters can include at least one of the following: compression degree, compression speed, pressure magnitude, etc., which are not limited here.

[0048] In a specific implementation, the change between the ambient temperature and the working temperature of the flash memory complements each other. Therefore, the first working parameter of the heat dissipation device can be jointly determined based on factors in two dimensions, so that the actual heat dissipation effect deeply conforms to the actual situation, which helps to improve the heat dissipation efficiency and the flash memory reading speed.

[0049] Optionally, in step 104 above, determining the first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature may be implemented as follows:

[0050] Determine a first difference between the first operating temperature and the preset threshold;

[0051] Determine a reference operating parameter corresponding to the first difference;

[0052] Determine a second difference between the first operating temperature and the ambient temperature;

[0053] Determine a first adjustment parameter corresponding to the second difference;

[0054] Determine the first operating parameter according to the first adjustment parameter and the reference operating parameter.

[0055] Wherein, the reference operating parameters of the heat dissipation device may include at least one of the following: operating mode, operating current, operating voltage, operating power, adjustable heat dissipation parameters of various heat dissipation devices, etc., which are not limited herein.

[0056] In specific implementation, a first difference between the first operating temperature and the preset threshold may be determined, the first difference = the first operating temperature - the preset threshold, and a mapping relationship between the preset difference and the operating parameter may also be stored in advance. Furthermore, a reference operating parameter corresponding to the first difference may be determined based on this mapping relationship. The first difference reflects the degree of difference between the operating temperature of the flash memory and the set normal operating temperature.

[0057] Furthermore, a second difference between the first operating temperature and the ambient temperature may also be determined, the second difference = the first operating temperature - the ambient temperature. The second difference reflects the difference between the operating temperature of the flash memory and the ambient temperature. A mapping relationship between the preset difference and the adjustment parameter may also be stored in advance. Furthermore, a first adjustment parameter corresponding to the second difference may be determined based on this mapping relationship, and then the first operating parameter may be determined according to the first adjustment parameter and the reference operating parameter. Furthermore, the operating parameter of the initially determined appropriate heat dissipation device may be dynamically adjusted based on the difference between the operating temperature of the flash memory and the ambient temperature, so that the final operating parameter of the heat dissipation device fully conforms to the actual operating temperature situation and also conforms to the actual ambient temperature difference situation. Thus, it helps to improve the heat dissipation efficiency and also helps to improve the flash memory reading speed to enhance the user experience.

[0058] Optionally, in the above step of determining the reference operating parameter corresponding to the first difference, it may be implemented as follows:

[0059] Determine a first heat dissipation mode corresponding to the first difference;

[0060] Determine the default operating parameters corresponding to the first heat dissipation mode;

[0061] Obtain the operating temperature of the flash memory in a preset time period before the current moment, obtaining m operating temperatures, with each operating temperature corresponding to a temperature detection moment; m is a positive integer

[0062] Perform fitting based on the m operating temperatures and the corresponding temperature detection moments to obtain a first fitting line;

[0063] Obtain the first slope of the first fitting line;

[0064] Determine the first optimization parameter corresponding to the first slope;

[0065] Optimize the default operating parameters according to the first optimization parameter to obtain the reference operating parameters.

[0066] In specific implementation, a mapping relationship between preset differences and heat dissipation modes can be stored in advance. Furthermore, the first heat dissipation mode corresponding to the first difference can be determined based on this mapping relationship. Different heat dissipation modes can correspond to different default operating parameters. For example, a mapping relationship between preset heat dissipation modes and default operating parameters can be stored in advance. Furthermore, the default operating parameters corresponding to the first heat dissipation mode can be determined based on this mapping relationship.

[0067] Among them, the preset time period can be set in advance or be the system default.

[0068] Next, the operating temperature of the flash memory in a preset time period before the current moment can be obtained, obtaining m operating temperatures, with each operating temperature corresponding to a temperature detection moment; m is a positive integer. That is, each operating temperature and its corresponding temperature detection moment can be mapped to a coordinate system. The horizontal axis of this coordinate system represents time, and the vertical axis represents temperature. Each operating temperature among the m operating temperatures and its corresponding temperature detection moment can be regarded as a coordinate point. That is, m coordinate points can be obtained. Then, based on these m coordinate points, fitting is performed to obtain a first fitting line. Then, the first slope of the first fitting line is obtained again. The slope reflects the temperature change rate of the flash memory, and / or the temperature change trend. Different slopes reflect different influences of temperature changes on the reading speed of the flash memory.

[0069] Furthermore, the mapping relationship between the preset slope and the optimization parameter can be pre-stored. Furthermore, the first optimization parameter corresponding to the first slope can be determined based on this mapping relationship. Next, the default working parameter can be optimized according to the first optimization parameter to obtain the reference working parameter, that is, the reference working parameter = (1 + the first optimization parameter) * the default working parameter. It is not only possible to adapt the corresponding heat dissipation mode based on the difference between the working temperature of the flash memory and the set normal working temperature. Different heat dissipation modes correspond to different heat dissipation capabilities, that is, a suitable default working parameter can be obtained to match the corresponding heat dissipation capability, and then the default heat dissipation parameter can be dynamically optimized based on the influence of temperature change on the reading speed of the flash memory, so that the reference working parameter is deeply consistent with the working conditions of the flash memory, which helps to ensure the heat dissipation efficiency and also helps to improve the flash memory reading speed to enhance the user experience.

[0070] 105. Control the heat dissipation device to work according to the first working parameter to reduce the first working temperature.

[0071] In the embodiment of the present application, the heat dissipation device can be controlled to work according to the first working parameter to reduce the first working temperature. Since the working parameter of the initially determined appropriate heat dissipation device is dynamically adjusted based on the difference between the working temperature of the flash memory and the ambient temperature, the final working parameter of the heat dissipation device deeply conforms to the actual working temperature situation and also conforms to the actual ambient temperature difference situation. Thus, it helps to improve the heat dissipation efficiency and also helps to improve the flash memory reading speed to enhance the user experience.

[0072] Optionally, after the step 105 of controlling the heat dissipation device to work according to the first working parameter to reduce the first working temperature, the following steps can also be included:

[0073] Detect the working temperature of the flash memory at preset time intervals to obtain n working temperatures, where n is a positive integer;

[0074] Perform fitting based on the n working temperatures to obtain the second fitting line;

[0075] Determine the predicted moment corresponding to the set temperature according to the second fitting line, where the set temperature is less than or equal to the first preset threshold;

[0076] Obtain the absolute value of the slope of the second fitting line to get the first absolute value;

[0077] When the first absolute value is greater than the preset absolute value, perform the step of controlling the heat dissipation device to work according to the first working parameter to reduce the first working temperature according to the predicted moment.

[0078] Among them, the preset time interval can be set in advance or be the system default. The preset time interval can be related to the depth of the attribute parameters of the flash memory. For example, the mapping relationship between the preset attribute parameters of the flash memory and the time interval can be pre-stored. Furthermore, the corresponding preset time interval can be determined based on this mapping relationship. The attribute parameters of the flash memory can include at least one of the following: the model of the flash memory, the material of the flash memory, the circuit structure of the flash memory, the memory size of the flash memory, the system parameters of the flash memory, the storage method of the flash memory, etc., which are not limited herein.

[0079] In a specific implementation, during the heat dissipation process, the working temperature of the flash memory can also be detected at every preset time interval to obtain n working temperatures, where n is a positive integer, that is, to detect whether the actual heat dissipation effect meets the expectation. Among them, each of the n working temperatures can also correspond to a corresponding temperature detection moment.

[0080] Among them, the set temperature can be set in advance or be the system default. The set temperature is less than or equal to the first preset threshold. The preset absolute value can be set in advance or be the system default.

[0081] Specifically, n working temperatures and the corresponding temperature detection moments can be used for fitting to obtain the second fitting line. Next, the prediction moment corresponding to the set temperature can be determined according to the second fitting line, and then the absolute value of the slope of the second fitting line can be obtained to get the first absolute value. The first absolute value reflects the downward trend of the flash memory temperature. When the first absolute value is greater than the preset absolute value, it indicates that the actual heat dissipation effect meets the expectation. Then, according to the prediction moment, the step of controlling the heat dissipation device to work according to the first working parameter to reduce the first working temperature can be executed, that is, between the current moment and the preset moment, continuously execute the step of controlling the heat dissipation device to work according to the first working parameter. In this way, it can be detected whether the actual heat dissipation effect meets the expectation, and when the actual heat dissipation effect meets the expectation, the first working parameter is maintained for heat dissipation. Thus, it helps to ensure the heat dissipation efficiency and also helps to improve the flash memory reading speed to enhance the user experience.

[0082] Optionally, the following steps can also be included:

[0083] When the first absolute value is less than or equal to the preset absolute value, determine the first deviation degree between the first absolute value and the preset absolute value;

[0084] Determine the first memory resource optimization parameter corresponding to the first deviation degree;

[0085] Use the first process to execute the step of controlling the heat dissipation device to work according to the first working parameter according to the prediction moment, and use the second process to perform memory optimization on the flash memory according to the first memory resource optimization parameter. The first process and the second process are executed in parallel.

[0086] Among them, the first memory resource optimization parameter may include at least one of the following: optimizing memory, optimizing processes, cleaning the disk, etc., which are not limited herein. Optimizing memory may include at least one of the following: reducing partitions, reducing memory fragmentation, cleaning caches, system upgrades, etc., which are not limited herein. Optimizing processes may include at least one of the following: ending processes, hibernating processes, reducing the execution priority or speed of processes, etc., which are not limited herein. Cleaning the disk may include at least one of the following: cleaning a specified disk, formatting a specified disk, cleaning specified content in the disk, etc., which are not limited herein.

[0087] In a specific implementation, when the first absolute value is less than or equal to the preset absolute value, it indicates that the actual heat dissipation effect does not meet the expectation. That is, the first deviation degree between the first absolute value and the preset absolute value can be determined. The first deviation degree = (the first absolute value - the preset absolute value) / the preset absolute value. That is, the mapping relationship between the preset deviation degree and the memory resource optimization parameter can be stored in advance. Furthermore, based on this mapping relationship, the first memory resource optimization parameter corresponding to the first deviation degree can be determined. That is, the corresponding memory resource optimization parameter can be dynamically determined based on the difference between the actual heat dissipation effect and the expectation.

[0088] Finally, the first process can be used to execute the step of controlling the heat dissipation device to work according to the first working parameter at the predicted moment, and the second process can be used to optimize the memory of the flash memory according to the first memory resource optimization parameter. The first process and the second process are executed in parallel. In this way, when the actual heat dissipation effect does not meet the expectation, not only can the corresponding memory resource optimization parameter be dynamically determined based on the difference between the actual heat dissipation effect and the expectation, but also while continuing to dissipate heat, internal resource optimization can be carried out to assist the heat dissipation effect, which helps to further ensure the flash memory reading speed and improve the user experience.

[0089] Optionally, the following steps may further be included:

[0090] When the first absolute value is less than or equal to the preset absolute value, determine the first deviation degree between the first absolute value and the preset absolute value;

[0091] Determine the first feedback adjustment parameter corresponding to the first deviation degree;

[0092] Perform feedback adjustment on the first working parameter according to the first feedback adjustment parameter to obtain the third working parameter;

[0093] Control the heat dissipation device to work according to the third working parameter.

[0094] In a specific implementation, when the first absolute value is less than or equal to a preset absolute value, it indicates that the actual heat dissipation effect does not meet the expectation. At this time, the first deviation degree between the first absolute value and the preset absolute value can be determined. The first deviation degree = (the first absolute value - the preset absolute value) / the preset absolute value. Then, the mapping relationship between the preset deviation degree and the feedback adjustment parameter can be pre-stored. Furthermore, based on this mapping relationship, the first feedback adjustment parameter corresponding to the first deviation degree can be determined. That is, the first working parameter can be feedback-adjusted according to the first feedback adjustment parameter to obtain the third working parameter. The third working parameter = (1 + the first feedback adjustment parameter) * the first working parameter. Then, the heat dissipation device can be controlled to work according to the third working parameter. In this way, when the actual heat dissipation effect does not meet the expectation, not only can the working parameters of the heat dissipation device be dynamically feedback-adjusted based on the difference between the actual heat dissipation effect and the expectation, but also the heat dissipation effect can be further ensured, which helps to further ensure the flash memory reading speed and improve the user experience.

[0095] It can be seen that a method for improving the flash memory reading speed described in an embodiment of the present application is applied to an electronic device. The electronic device includes a flash memory and a heat dissipation device. The first working temperature of the flash memory is obtained. When the first working temperature is greater than a first preset threshold, the current reading speed of the flash memory is detected. When the current reading speed is less than or equal to a second preset threshold, the ambient temperature of the flash memory is obtained. The first working parameter of the heat dissipation device is determined according to the ambient temperature and the first working temperature. The heat dissipation device is controlled to work according to the first working parameter to reduce the first working temperature. Since the working parameters of the initially determined appropriate heat dissipation device are dynamically adjusted based on the difference between the working temperature of the flash memory and the ambient temperature, the final working parameters of the heat dissipation device are deeply in line with the actual working temperature situation and also in line with the actual ambient temperature difference situation. Therefore, it helps to improve the heat dissipation efficiency and also helps to improve the flash memory reading speed to improve the user experience.

[0096] Consistent with the above embodiment, please refer to Figure 2 , Figure 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As shown in the figure, the electronic device includes a processor, a memory, a communication interface, and one or more programs. The above one or more programs are stored in the above memory and are configured to be executed by the above processor. In an embodiment of the present application, the electronic device includes a flash memory and a heat dissipation device. The above programs include instructions for performing the following steps:

[0097] Obtain the first working temperature of the flash memory;

[0098] When the first working temperature is greater than a first preset threshold, detect the current reading speed of the flash memory;

[0099] When the current reading speed is less than or equal to the second preset threshold, obtain the ambient temperature of the flash memory;

[0100] Determine the first working parameter of the heat dissipation device according to the ambient temperature and the first working temperature;

[0101] Control the heat dissipation device to work according to the first working parameter to reduce the first working temperature.

[0102] Optionally, in terms of determining the first working parameter of the heat dissipation device according to the ambient temperature and the first working temperature, the above program includes instructions for performing the following steps:

[0103] Determine the first difference between the first working temperature and the preset threshold;

[0104] Determine the reference working parameter corresponding to the first difference;

[0105] Determine the second difference between the first working temperature and the ambient temperature;

[0106] Determine the first adjustment parameter corresponding to the second difference;

[0107] Determine the first working parameter according to the first adjustment parameter and the reference working parameter.

[0108] Optionally, in terms of determining the reference working parameter corresponding to the first difference, the above program includes instructions for performing the following steps:

[0109] Determine the first heat dissipation mode corresponding to the first difference;

[0110] Determine the default working parameter corresponding to the first heat dissipation mode;

[0111] Obtain the working temperatures of the flash memory in a preset time period before the current moment, and obtain m working temperatures, each working temperature corresponding to a temperature detection moment; m is a positive integer;

[0112] Perform fitting according to the m working temperatures and the corresponding temperature detection moments to obtain the first fitting line;

[0113] Obtain the first slope of the first fitting line;

[0114] Determine the first optimization parameter corresponding to the first slope;

[0115] Optimize the default working parameter according to the first optimization parameter to obtain the reference working parameter.

[0116] Optionally, after controlling the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature, the above program further includes instructions for performing the following steps:

[0117] Detect the operating temperature of the flash memory at preset time intervals to obtain n operating temperatures, where n is a positive integer;

[0118] Perform fitting based on the n operating temperatures to obtain a second fitting line;

[0119] Determine the predicted time corresponding to the set temperature according to the second fitting line, where the set temperature is less than or equal to the first preset threshold;

[0120] Obtain the absolute value of the slope of the second fitting line to obtain a first absolute value;

[0121] When the first absolute value is greater than the preset absolute value, perform the step of controlling the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature according to the predicted time.

[0122] Optionally, the above program further includes instructions for performing the following steps:

[0123] When the first absolute value is less than or equal to the preset absolute value, determine the first deviation degree between the first absolute value and the preset absolute value;

[0124] Determine the first memory resource optimization parameter corresponding to the first deviation degree;

[0125] Use a first process to perform the step of controlling the heat dissipation device to operate according to the first operating parameter according to the predicted time, and use a second process to perform memory optimization on the flash memory according to the first memory resource optimization parameter, where the first process and the second process are executed in parallel.

[0126] It can be seen that for the electronic device described in the embodiments of the present application, the electronic device includes a flash memory and a heat dissipation device. The first operating temperature of the flash memory is obtained. When the first operating temperature is greater than a first preset threshold, the current reading speed of the flash memory is detected. When the current reading speed is less than or equal to a second preset threshold, the ambient temperature of the flash memory is obtained. The first operating parameter of the heat dissipation device is determined according to the ambient temperature and the first operating temperature. The heat dissipation device is controlled to operate according to the first operating parameter to reduce the first operating temperature. Since the operating parameter of the initially determined appropriate heat dissipation device is dynamically adjusted based on the difference between the operating temperature and the ambient temperature of the flash memory, the final operating parameter of the heat dissipation device fully conforms to the actual operating temperature and the actual ambient temperature difference. Therefore, it helps to improve the heat dissipation efficiency and also helps to improve the flash memory reading speed to enhance the user experience.

[0127] Figure 3 FIG. 4 is a functional unit block diagram of a system 300 for improving the flash memory reading speed according to an embodiment of the present application. The system 300 for improving the flash memory reading speed is applied to an electronic device. The electronic device includes a flash memory and a heat dissipation device. The system 300 for improving the flash memory reading speed includes: an obtaining unit 301, a detecting unit 302, a determining unit 303, and a control unit 304, where

[0128] The obtaining unit 301 is configured to obtain the first operating temperature of the flash memory;

[0129] The detecting unit 302 is configured to detect the current reading speed of the flash memory when the first operating temperature is greater than a first preset threshold;

[0130] The obtaining unit 301 is further configured to obtain the ambient temperature of the flash memory when the current reading speed is less than or equal to a second preset threshold;

[0131] The determining unit 303 is configured to determine the first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature;

[0132] The control unit 304 is configured to control the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature.

[0133] Optionally, in terms of determining the first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature, the determining unit 303 is specifically configured to:

[0134] Determine a first difference between the first operating temperature and the preset threshold;

[0135] Determine a reference operating parameter corresponding to the first difference;

[0136] Determine a second difference between the first operating temperature and the ambient temperature;

[0137] Determine a first adjustment parameter corresponding to the second difference;

[0138] Determine the first operating parameter according to the first adjustment parameter and the reference operating parameter.

[0139] Optionally, in terms of determining the reference operating parameter corresponding to the first difference, the determining unit 303 is specifically configured to:

[0140] Determine a first heat dissipation mode corresponding to the first difference;

[0141] Determine a default operating parameter corresponding to the first heat dissipation mode;

[0142] Obtain the operating temperatures of the flash memory in a preset time period before the current moment, obtaining m operating temperatures, each operating temperature corresponding to a temperature detection moment; m is a positive integer;

[0143] Perform fitting according to the m operating temperatures and the corresponding temperature detection moments to obtain a first fitting line;

[0144] Obtain a first slope of the first fitting line;

[0145] Determine a first optimization parameter corresponding to the first slope;

[0146] Optimize the default operating parameter according to the first optimization parameter to obtain the reference operating parameter.

[0147] Optionally, after controlling the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature, the above program further includes instructions for performing the following steps:

[0148] Detect the operating temperature of the flash memory at preset time intervals to obtain n operating temperatures, n being a positive integer;

[0149] Perform fitting according to the n operating temperatures to obtain a second fitting line;

[0150] Determine a prediction moment corresponding to a set temperature according to the second fitting line, the set temperature being less than or equal to the first preset threshold;

[0151] Obtain an absolute value of the slope of the second fitting line to obtain a first absolute value;

[0152] When the first absolute value is greater than a preset absolute value, according to the predicted time, execute the step of controlling the heat dissipation device to work according to the first working parameter to reduce the first working temperature.

[0153] Optionally, the above program further includes instructions for performing the following steps:

[0154] When the first absolute value is less than or equal to the preset absolute value, determine a first deviation degree between the first absolute value and the preset absolute value;

[0155] Determine a first memory resource optimization parameter corresponding to the first deviation degree;

[0156] Use a first process to execute the step of controlling the heat dissipation device to work according to the first working parameter according to the predicted time, and use a second process to perform memory optimization on the flash memory according to the first memory resource optimization parameter, and the first process and the second process are executed in parallel.

[0157] It can be understood that, in the system for improving the flash memory reading speed described in the embodiments of the present application, which is applied to an electronic device, the electronic device includes a flash memory and a heat dissipation device, obtain a first working temperature of the flash memory, when the first working temperature is greater than a first preset threshold, detect a current reading speed of the flash memory, when the current reading speed is less than or equal to a second preset threshold, obtain an ambient temperature of the flash memory, determine a first working parameter of the heat dissipation device according to the ambient temperature and the first working temperature, and control the heat dissipation device to work according to the first working parameter to reduce the first working temperature. Since the working parameter of the heat dissipation device is dynamically adjusted based on the difference between the working temperature of the flash memory and the ambient temperature, the final working parameter of the heat dissipation device deeply conforms to the actual working temperature situation and also conforms to the actual ambient temperature difference situation. Therefore, it helps to improve the heat dissipation efficiency and also helps to improve the flash memory reading speed to improve the user experience.

[0158] It should be noted that the functions of the program modules of the system for improving the flash memory reading speed in this embodiment can be specifically implemented according to the methods in the above method embodiments, and the specific implementation process can refer to the relevant descriptions of the above method embodiments, which will not be elaborated here.

[0159] The embodiments of the present application further provide a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to execute some or all of the steps of any method recorded in the above method embodiments.

[0160] The embodiments of the present application also provide a computer program product. The computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute some or all of the steps of any one of the methods described in the foregoing method embodiments. The computer program product may be a software installation package.

[0161] It should be noted that, for the foregoing method embodiments, for simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the present application is not limited by the described action sequence, because according to the present application, some steps may be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present application.

[0162] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0163] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the above division of units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of the device or unit can be in an electrical or other form.

[0164] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0165] In addition, in each embodiment of the present application, the functional units can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0166] If the above integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the above methods in various embodiments of this application. The aforementioned memory includes: various media such as USB flash drives, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), external hard drives, magnetic disks, or optical discs that can store program codes.

[0167] Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing relevant hardware through a program. This program can be stored in a computer-readable memory, and the memory can include: flash drives, read-only memories (abbreviation: ROM, English: Read-Only Memory), random access memories (abbreviation: RAM, English: Random Access Memory), magnetic disks, or optical discs, etc.

[0168] The above has introduced the embodiments of this application in detail. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to this application.

Claims

1. A method for improving flash memory reading speed, characterized in that: Applied to an electronic device, the electronic device includes a flash memory and a heat dissipation device, and the method includes: Acquire a first operating temperature of the flash memory; When the first operating temperature is greater than a first preset threshold, detecting a current read speed of the flash memory; When the current reading speed is less than or equal to a second preset threshold, obtaining an ambient temperature of the flash memory; Determining a first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature; The heat dissipation device is controlled to operate according to the first operating parameter to reduce the first operating temperature.

2. The method according to claim 1, characterized in that The determining the first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature includes: determining a first difference between the first operating temperature and the preset threshold; determining a reference operating parameter corresponding to the first difference; determining a second difference between the first operating temperature and the ambient temperature; determining a first adjustment parameter corresponding to the second difference; The first operating parameter is determined according to the first adjustment parameter and the reference operating parameter.

3. The method according to claim 2, characterized in that The determining of a reference operating parameter corresponding to the first difference includes: determining a first heat dissipation mode corresponding to the first difference; Determining default operating parameters corresponding to the first heat dissipation mode; Obtaining the operating temperature of the flash memory in a preset time period before the current moment, obtaining m operating temperatures, each operating temperature corresponding to a temperature detection moment; m is a positive integer; Perform fitting according to the m operating temperatures and the corresponding temperature detection moments to obtain a first fitting straight line; Obtaining a first slope of the first fitting straight line; determining a first optimization parameter corresponding to the first slope; The default operating parameters are optimized according to the first optimization parameters to obtain the reference operating parameters.

4. The method according to any one of claims 1 to 3, characterized in that: After controlling the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature, the method further includes: Detecting the operating temperature of the flash memory at every preset time interval to obtain n operating temperatures, where n is a positive integer; Perform fitting according to the n operating temperatures to obtain a second fitting straight line; Determine a predicted time corresponding to a set temperature according to the second fitting straight line, wherein the set temperature is less than or equal to the first preset threshold; Obtaining the absolute value of the slope of the second fitting straight line to obtain a first absolute value; When the first absolute value is greater than a preset absolute value, the step of controlling the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature is performed according to the predicted time.

5. The method according to claim 4, characterized in that The method further comprises: When the first absolute value is less than or equal to the preset absolute value, determining a first deviation between the first absolute value and the preset absolute value; Determining a first memory resource optimization parameter corresponding to the first deviation; A first process is used to execute the step of controlling the heat dissipation device to work according to the first working parameter based on the predicted moment, and a second process is used to optimize the memory of the flash memory according to the first memory resource optimization parameter. The first process and the second process are executed in parallel.

6. A system for improving flash memory reading speed, characterized in that: Applied to electronic equipment, the electronic equipment includes a flash memory and a heat dissipation device, the system includes: an acquisition unit, a detection unit, a determination unit and a control unit, wherein: The acquisition unit is used to acquire a first operating temperature of the flash memory; The detection unit is used to detect the current reading speed of the flash memory when the first operating temperature is greater than a first preset threshold; The acquisition unit is further configured to acquire the ambient temperature of the flash memory when the current reading speed is less than or equal to a second preset threshold; The determining unit is used to determine a first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature; The control unit is used to control the heat dissipation device to operate according to the first operating parameter to reduce the first operating temperature.

7. The system according to claim 6, characterized in that In the aspect of determining the first operating parameter of the heat dissipation device according to the ambient temperature and the first operating temperature, the determining unit is specifically used for: determining a first difference between the first operating temperature and the preset threshold; determining a reference operating parameter corresponding to the first difference; determining a second difference between the first operating temperature and the ambient temperature; determining a first adjustment parameter corresponding to the second difference; The first operating parameter is determined according to the first adjustment parameter and the reference operating parameter.

8. The system according to claim 7, characterized in that In terms of determining the reference operating parameter corresponding to the first difference, the determining unit is specifically configured to: determining a first heat dissipation mode corresponding to the first difference; Determining default operating parameters corresponding to the first heat dissipation mode; Obtaining the operating temperature of the flash memory in a preset time period before the current moment, obtaining m operating temperatures, each operating temperature corresponding to a temperature detection moment; m is a positive integer; Perform fitting according to the m operating temperatures and the corresponding temperature detection moments to obtain a first fitting straight line; Obtaining a first slope of the first fitting straight line; determining a first optimization parameter corresponding to the first slope; The default operating parameters are optimized according to the first optimization parameters to obtain the reference operating parameters.

9. An electronic device, characterized in that: The method comprises a processor, a memory, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for executing the steps in the method according to any one of claims 1 to 5.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method according to any one of claims 1 to 5.

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