Method for acquiring thermal resistance, method for acquiring temperature, method for determining radiator design scheme and medium

Abstract

The embodiment of the invention provides a method for obtaining thermal resistance, obtaining temperature and determining a radiator design scheme and a medium, and relates to the technical field of heat dissipation. The method for obtaining the heat resistance of the radiator comprises the steps of obtaining heat dissipation design parameters of the radiator; wherein the heat dissipation design parameters comprise parameters used for representing a substrate structure and a fin structure of the radiator; according to the heat dissipation design parameters, determining a first area of the radiator in contact with a heat dissipation medium, and an effective radiation coefficient and a radiation heat transfer coefficient of the radiator; wherein the effective radiation coefficient represents a correction coefficient of the plane, in contact with the radiating medium, of the radiator to the external radiation heat exchange amount, and the radiation heat exchange coefficient represents the radiation heat exchange amount under the unit temperature difference on the unit area of the radiator; according to the first area, the effective radiation coefficient and the radiation heat transfer coefficient, the radiation heat transfer thermal resistance of the radiator is calculated; and determining the heat resistance of the radiator according to the radiation heat exchange heat resistance.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation, and more specifically, to a method and medium for obtaining thermal resistance, obtaining temperature, and determining a radiator design solution. Background Art

[0002] With the continuous development of autonomous driving technology, the requirement for the computing power of chips in vehicles is getting higher and higher, and the heat dissipation problem of chips has increasingly become a key problem affecting the hardware and even the entire product solution. For the heat dissipation solution of chips, it is usually necessary to obtain the thermal resistance of the radiator to evaluate the heat dissipation effect of the heat dissipation solution. In the related art, the thermal resistance of the radiator can be evaluated by means of simulation modeling, but the simulation evaluation process is relatively cumbersome and time-consuming. Therefore, how to quickly and accurately evaluate the thermal resistance of the radiator has become an urgent problem to be solved. Summary of the Invention

[0003] In view of this, an embodiment of the present disclosure proposes a new technical solution for obtaining the thermal resistance of a radiator.

[0004] According to a first aspect of an embodiment of the present disclosure, a method for obtaining the thermal resistance of a radiator is provided. The method includes:

[0005] Obtain the heat dissipation design parameters of the radiator; wherein, the heat dissipation design parameters include parameters for characterizing the substrate structure and fin structure of the radiator;

[0006] Determine a first area of the radiator in contact with the heat dissipation medium, an effective radiation coefficient of the radiator, and a radiation heat transfer coefficient according to the heat dissipation design parameters; wherein, the effective radiation coefficient is a correction coefficient for characterizing the external radiation heat transfer amount of the plane of the radiator in contact with the heat dissipation medium, and the radiation heat transfer coefficient is a magnitude of the radiation heat transfer amount per unit area and per unit temperature difference of the radiator;

[0007] Calculate the radiation heat transfer thermal resistance of the radiator according to the first area, the effective radiation coefficient, and the radiation heat transfer coefficient;

[0008] Determine the radiator thermal resistance of the radiator according to the radiation heat transfer thermal resistance.

[0009] Optionally, the heat dissipation design parameters include the number of fins, the height of fins, and the pitch of fins of the radiator; the effective radiation coefficient is obtained by the following method:

[0010] Determine the fin density type of the radiator according to the number of fins, the height of fins, and the pitch of fins;

[0011] Based on the pre-set correspondence between fin density and radiation coefficient, determine the effective radiation coefficient corresponding to the fin density type; wherein, the correspondence between fin density and radiation coefficient includes the correspondence between fin density type and effective radiation coefficient, and the larger the fin density, the smaller the corresponding effective radiation coefficient.

[0012] Optionally, determining the fin density type of the radiator according to the number of fins, fin height, and fin pitch includes:

[0013] Calculate a first ratio based on the fin height and the fin pitch;

[0014] When the number of fins is greater than or equal to a first preset threshold and the first ratio is greater than or equal to a second preset threshold, determine that the fin density type of the radiator is the first density type;

[0015] When the number of fins is less than the first preset threshold or the first ratio is less than the second preset threshold, determine that the fin density type of the radiator is the second density type; wherein, the effective radiation coefficient corresponding to the first density type is less than the effective radiation coefficient corresponding to the second density type.

[0016] Optionally, the heat dissipation design parameters further include the surface emissivity, fin temperature, and ambient temperature of the radiator; the radiation heat transfer coefficient is obtained by the following method:

[0017] Calculate the radiation heat transfer coefficient according to the ambient temperature, fin temperature, surface emissivity, and Boltzmann constant; wherein, the Boltzmann constant is the proportionality factor between the average thermal energy of each molecule in an ideal gas and the absolute temperature of the gas.

[0018] Optionally, the heat dissipation design parameters further include the substrate length, substrate width, and substrate thickness of the radiator; the first area where the radiator contacts the heat dissipation medium is obtained by the following method:

[0019] Calculate the heat dissipation area of the fins according to the number of fins, substrate length, and fin height;

[0020] Calculate the bottom area of the substrate according to the substrate length and the substrate width;

[0021] Calculate the side area of the substrate according to the substrate thickness, substrate length, and substrate width;

[0022] Calculate the first area according to the heat dissipation area of the fins, the bottom area of the substrate, and the side area of the substrate.

[0023] Optionally, the determining the heat sink thermal resistance of the radiator according to the radiation heat transfer resistance includes:

[0024] Calculate the heat transfer resistance of the radiator fins based on the radiative heat transfer resistance and the convective heat transfer resistance of the radiator.

[0025] Calculate the radiator thermal resistance based on the heat transfer resistance of the radiator fins, the spreading resistance of the radiator, and the thermal conduction resistance of the radiator substrate.

[0026] Optionally, the convective heat transfer resistance is obtained by the following method:

[0027] Determine the Nusselt number according to the heat dissipation scheme type of the radiator and / or the flow state of the heat dissipation fluid; wherein, the Nusselt number characterizes the ratio of the convective heat to the conductive heat inside the fluid.

[0028] Determine the convective heat transfer coefficient according to the Nusselt number.

[0029] Determine the convective heat transfer resistance according to the convective heat transfer coefficient, the fin efficiency, and the second area of the fin of the radiator in contact with the heat dissipation medium.

[0030] Optionally, the heat dissipation scheme type includes forced air cooling and natural air cooling, and the flow state includes laminar flow, transitional flow, and turbulent flow; the determining the Nusselt number according to the heat dissipation scheme type of the radiator and / or the flow state of the heat dissipation fluid includes:

[0031] When the heat dissipation scheme type of the radiator is forced air cooling, calculate the Reynolds number according to the substrate length, fin gap, average velocity, and kinematic viscosity of the heat dissipation fluid of the radiator, determine the flow state of the heat dissipation fluid according to the Reynolds number, and calculate the Nusselt number using different preset formulas according to the flow state.

[0032] When the heat dissipation scheme type of the radiator is natural air cooling, calculate the Rayleigh number according to the fin height, gravitational acceleration, fin temperature, ambient temperature, and Prandtl constant of the radiator, and determine the Nusselt number according to the Rayleigh number.

[0033] According to the second aspect of the embodiments of the present disclosure, a method for obtaining the chip temperature is provided, and the method includes:

[0034] Obtain the heat dissipation design parameters of the radiator and the chip parameters of the chip; wherein, the chip is a vehicle domain controller, the radiator is connected to the chip and used for dissipating heat of the chip, and the heat dissipation design parameters include parameters for characterizing the substrate structure and fin structure of the radiator and thermal conductive material parameters.

[0035] Determine the heat sink thermal resistance of the heat sink according to the heat dissipation design parameters; wherein, the heat sink thermal resistance includes a radiative heat transfer thermal resistance, and the radiative heat transfer thermal resistance is calculated according to the first area of the heat sink in contact with the heat dissipation medium, the effective radiation coefficient of the heat sink, and the radiative heat transfer coefficient. The effective radiation coefficient characterizes the correction coefficient of the external radiative heat transfer amount of the plane of the heat sink in contact with the heat dissipation medium, and the radiative heat transfer coefficient characterizes the radiative heat transfer amount per unit area of the heat sink under a unit temperature difference;

[0036] Calculate the total thermal resistance of the chip heat transfer path according to the heat sink thermal resistance of the heat sink, the chip parameters, and the thermal conductive material parameters;

[0037] Calculate the chip temperature according to the total thermal resistance of the chip heat transfer path, the heat transfer power consumption of the chip, and the inlet temperature of the heat dissipation fluid;

[0038] According to a third aspect of the embodiments of the present disclosure, a method for determining a heat sink design scheme is provided. The method includes:

[0039] Obtain a plurality of initial heat sink design schemes and the heat dissipation design parameters corresponding to each initial heat sink design scheme;

[0040] Calculate the heat sink thermal resistance corresponding to each initial heat sink design scheme according to the heat dissipation design parameters; wherein, the heat sink thermal resistance includes a radiative heat transfer thermal resistance, and the radiative heat transfer thermal resistance is calculated according to the first area of the heat sink in contact with the heat dissipation medium, the effective radiation coefficient of the heat sink, and the radiative heat transfer coefficient. The effective radiation coefficient characterizes the correction coefficient of the external radiative heat transfer amount of the plane of the heat sink in contact with the heat dissipation medium, and the radiative heat transfer coefficient characterizes the radiative heat transfer amount per unit area of the heat sink under a unit temperature difference;

[0041] Determine the top N candidate heat sink design schemes with the minimum heat sink thermal resistance from the plurality of initial heat sink design schemes; wherein, N is a positive integer greater than or equal to 1;

[0042] Simulate the N candidate heat sink design schemes to determine the target heat sink design scheme with the minimum heat sink thermal resistance.

[0043] According to a fourth aspect of the embodiments of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method described in any one of the first aspect, the second aspect, or the third aspect is implemented.

[0044] Based on the method for obtaining the thermal resistance of a radiator provided by the embodiments of the present disclosure, a novel optimized calculation method for the radiative heat transfer thermal resistance of a fin radiator is provided, and the influence of radiative heat transfer is incorporated into the overall consideration of the radiator thermal resistance, so that the total thermal resistance of the radiator can be calculated more efficiently and accurately.

[0045] Other features and advantages of the present disclosure will become apparent from the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0047] Figure 1A is a schematic structural diagram of a chip cooling system provided by an embodiment of the present disclosure.

[0048] Figure 1B is a schematic structural diagram of another chip cooling system provided by an embodiment of the present disclosure.

[0049] Figure 2 is a schematic flowchart of a method for obtaining the thermal resistance of a radiator provided by an embodiment of the present disclosure.

[0050] Figure 3 is a schematic flowchart of a method for obtaining the chip temperature provided by an embodiment of the present disclosure.

[0051] Figure 4A is a parameter input interface in tabular form provided by an embodiment of the present disclosure.

[0052] Figure 4B is a result output interface in tabular form provided by an embodiment of the present disclosure.

[0053] Figure 5 is a schematic flowchart of a method for determining a radiator design solution provided by an embodiment of the present disclosure.

[0054] Figure 6 is a schematic structural diagram of an electronic device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0055] Now, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps set forth in these embodiments, numerical expressions and values do not limit the scope of the present disclosure.

[0056] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as a limitation to the present disclosure or its application or use.

[0057] Techniques, methods, and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the above techniques, methods, and equipment should be regarded as part of the specification.

[0058] In all examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0059] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

[0060] First, the application scenarios of the embodiments of the present disclosure will be described. The embodiments of the present disclosure can be applied to the scenario of evaluating the thermal resistance of a radiator, such as the scenario of quickly evaluating the thermal resistance of a radiator or the temperature of a chip during the heat dissipation design stage of a chip. The chips in the embodiments of the present disclosure can be any device with computing and / or control capabilities. For example, the chip can be various controllers in a vehicle, including a central controller, a regional controller, an automated driving control unit (ADCU), etc., or a chip applied in other fields, which is not limited herein.

[0061] Figure 1A and Figure 1B are schematic structural diagrams of a chip heat dissipation system provided by the embodiments of the present disclosure.

[0062] Among them, Figure 1A is a side view of the chip heat dissipation system, Figure 1B is a top view of the chip heat dissipation system. As shown in Figure 1A and Figure 1B , the chip heat dissipation system includes a chip 11, a radiator 12, and a thermal conductive material 13 for connecting the chip and the radiator. Among them, the radiator 12 may include a substrate 121 and fins 122. The thermal conductive material 13 may be, for example, thermal grease located between the substrate 121 and the chip 11.

[0063] In this chip heat dissipation system, the chip serves as a heat source, and the radiator can dissipate heat from the chip to effectively reduce the operating temperature of the chip, ensure that the chip operates stably within a safe temperature range, extend the service life of the chip, and improve the performance and reliability of the entire system. The substrate of the radiator can be made of a high thermal conductivity material (such as aluminum or copper) so as to be able to quickly absorb the heat generated by the chip. The fins of the radiator can increase the contact area between the radiator and the heat dissipation fluid (such as air or liquid), thereby accelerating the dissipation of heat. Through the heat dissipation of the fins, the heat can be transferred to the surrounding environment more efficiently.

[0064] In some examples, such as Figure 1B shown, the fins of the heat sink can be continuously and evenly distributed, and the chip can be located at the geometric center of the heat sink. For example, the surface area of the substrate of the heat sink is greater than or equal to the surface area of the chip, and the upper surface of the chip can be connected to the geometric center of the lower surface of the heat sink substrate through a heat-conducting material.

[0065] In some examples, such as Figure 1A and Figure 1B shown, the relevant structural parameters of the chip heat dissipation system include: L a represents the chip length, W a represents the chip width, L b represents the substrate length of the heat sink, W b represents the substrate width of the heat sink, H T represents the thickness of the heat-conducting material, H b represents the substrate thickness of the heat sink, H f represents the fin height of the heat sink, b1 represents the fin gap of the heat sink, and d represents the fin thickness of the heat sink.

[0066] In some examples, the chip heat dissipation system can be applied to a vehicle with an autonomous driving function. For example, chip 11 in the chip heat dissipation system can be the in-vehicle domain controller of the vehicle. The above autonomous driving can also be referred to as driverless or intelligent driving. A vehicle with an autonomous driving function can perform driving tasks such as environmental perception, decision-making and planning, and control execution. The levels of autonomous driving can refer to the automotive intelligence grading standard formulated by the Society of Automotive Engineers (SAE). For example, level L0 is manual driving, L1 is assisted driving, L2 is partial autonomous driving, L3 is conditional autonomous driving, L4 is highly autonomous driving, and L5 is fully autonomous driving. The above classification method for the levels of autonomous driving is only for illustration, and the present disclosure embodiments do not limit the classification criteria and levels of autonomous driving.

[0067] With the continuous development of autonomous driving technology, the requirement for the computing power of chips in vehicles is getting higher and higher, and the heat dissipation problem of chips is increasingly becoming a key problem affecting the hardware and even the entire product solution. For the heat dissipation solution of chips, it is usually necessary to obtain the thermal resistance of the heat sink to evaluate the heat dissipation effect of the heat dissipation solution. However, in the related art, the thermal resistance of the heat sink can be evaluated by means of simulation modeling, but the simulation evaluation process is relatively cumbersome and time-consuming. Therefore, how to quickly and accurately evaluate the thermal resistance of the heat sink has become an urgent problem to be solved.

[0068] Figure 2 is a schematic flow chart of a method for obtaining the thermal resistance of a heat sink provided by the embodiments of the present disclosure. As Figure 2As shown, the method for obtaining the thermal resistance of the radiator in this embodiment may include the following steps S210 to S240.

[0069] Step S210, obtain the heat dissipation design parameters of the radiator.

[0070] The radiator may include a substrate and a plurality of fins for dissipating heat from the chip. For example Figure 1A or Figure 1B the radiator in the chip heat dissipation system shown. The chip in the chip heat dissipation system may be various controllers in the vehicle, including a central controller, a zone controller, an intelligent driving domain controller, etc.

[0071] The radiator may be a radiator that has been produced or used, or a radiator that has been designed but not yet produced. For example, for a radiator that has been designed but not yet produced, the thermal resistance of the radiator can be quickly obtained based on this method to evaluate the heat dissipation effect of the radiator.

[0072] In some examples, the heat dissipation design parameters of the radiator may include parameters for characterizing the substrate structure and fin structure of the radiator. For example, the substrate length L related to the radiator substrate b , the substrate width W b , the substrate thickness H b , the substrate thermal conductivity K b , etc. One or more of these parameters; for another example, the number of fins N, the fin length L related to the radiator fins f , the fin height H f , the fin gap b1, the fin thickness d, the fin temperature T f in, the fin thermal conductivity K f One or more of the parameters. In some examples, the fin length and the substrate length may be the same, and only one length needs to be provided.

[0073] In some examples, the heat dissipation design parameters may further include parameters related to the heat dissipation fluid. For example, one or more of the parameters such as the thermal conductivity Ka of the heat dissipation fluid, the kinematic viscosity v of the heat dissipation fluid, the average velocity u of the heat dissipation fluid, the Prandtl constant Pr of the heat dissipation fluid, and the inlet temperature Tr of the heat dissipation fluid. It should be noted that the heat dissipation fluid may be a gas or a liquid. For example, for an air-cooled solution, the heat dissipation fluid is a gas, and for a liquid-cooled solution, the heat dissipation fluid is a liquid. The inlet temperature may represent the initial temperature of the heat dissipation fluid when it enters the radiator. Optionally, the inlet temperature may be the ambient temperature.

[0074] In some examples, the heat dissipation design parameters may further include one or more of the parameters such as the surface emissivity ε of the radiator and the ambient temperature Ta.

[0075] In some examples, the heat dissipation design parameters may further include the heat conduction material parameters of the heat conduction material between the heat sink and the chip. The heat conduction material parameters may include relevant parameters of the heat conduction material connecting the heat sink and the chip. For example, the heat conduction material parameters may include the thickness H of the heat conduction material. T and the thermal conductivity K of the heat conduction material T and one or more of the like parameters.

[0076] It should be noted that the heat dissipation design parameters may include some or all of the parameters related to the heat dissipation solution. For example, the above-mentioned multiple parameters can be used in any combination, and the embodiments of the present disclosure do not limit this.

[0077] In some examples, all or part of the above heat dissipation design parameters may be parameters input by the user. For example, an input interface can be provided to the user to receive the heat dissipation design parameters of the heat sink input by the user through this data interface. The user can determine the above parameters based on the design specifications and requirements of the heat sink and input them. In one implementation, the input interface can be provided to the user in the form of a tabular document (such as an EXCEL table), and the user inputs the above heat dissipation design parameters through the table page. Further, the calculation formulas involved in the embodiments of the present disclosure can all be implemented through tabular documents, which can provide a convenient and efficient calculation tool for the user.

[0078] Step S220, determine the first area where the heat sink contacts the heat dissipation medium, the effective radiation coefficient of the heat sink, and the radiation heat transfer coefficient according to the heat dissipation design parameters.

[0079] Among them, the effective radiation coefficient can characterize the correction coefficient of the external radiation heat transfer amount of the plane where the heat sink contacts the heat dissipation medium, and the radiation heat transfer coefficient can characterize the magnitude of the radiation heat transfer amount per unit area and per unit temperature difference of the heat sink.

[0080] The acquisition methods of the above-mentioned effective radiation coefficient, radiation heat transfer coefficient, and first area are introduced separately below:

[0081] In some examples, the above heat dissipation design parameters include the number of fins, the fin height, and the fin pitch of the heat sink; the acquisition method of the effective radiation coefficient may include: determining the fin density type of the heat sink according to the number of fins, the fin height, and the fin pitch; and determining the effective radiation coefficient corresponding to the fin density type based on the pre-set correspondence between the fin density and the radiation coefficient.

[0082] Among them, the correspondence between the fin density and the radiation coefficient may include the correspondence between the fin density type and the effective radiation coefficient, and the type with a larger fin density corresponds to a smaller effective radiation coefficient.

[0083] In one implementation, the above fin density types may include a first density type and a second density type; wherein, the effective radiation coefficient corresponding to the first density type may be less than the effective radiation coefficient corresponding to the second density type. For example, in the correspondence between fin density and radiation coefficient, the first density type is a high-density type, and the corresponding effective radiation coefficient may be 0.3; the second density type is a low-density type, and the corresponding effective radiation coefficient may be 0.5.

[0084] The fin density type can be obtained in the following way: calculate a first ratio based on the fin height and fin pitch; when the number of fins is greater than or equal to a first preset threshold and the first ratio is greater than or equal to a second preset threshold, determine that the fin density type of the radiator is the first density type; when the number of fins is less than the first preset threshold or the first ratio is less than the second preset threshold, determine that the fin density type of the radiator is the second density type. The first density type can be a high-density fin type, and the second density type can be a low-density fin type

[0085] The above first preset threshold and second preset threshold can be preset values. For example, the first preset threshold can be 20, and the second preset threshold can be 10. Taking the number of fins N, fin height H f , fin gap b1 as an example, when N≥20 and H f / b1≥10, determine that the fin density type is the first density type (i.e., high-density fin type), and at this time the effective radiation coefficient can be determined to be 0.3; when N<20 or H f / b1<10, determine that the fin density type is the second density type (i.e., low-density fin type), and at this time the effective radiation coefficient can be determined to be 0.5, that is, for other types except the first density type, the effective radiation coefficient can be determined to be 0.5.

[0086] In this way, different effective radiation coefficients can be set for radiators of different density types to improve the accuracy of calculating the thermal resistance of the radiator.

[0087] In some examples, the above heat dissipation design parameters further include the surface emissivity, fin temperature and ambient temperature of the radiator; the radiation heat transfer coefficient can be obtained in the following way:

[0088] Calculate the radiation heat transfer coefficient according to the ambient temperature, fin temperature, surface emissivity and Boltzmann constant; wherein, the Boltzmann constant is the proportionality factor between the average thermal energy of each molecule in an ideal gas and the absolute temperature of the gas.

[0089] Exemplarily, the radiation heat transfer coefficient can be calculated based on the following formula (1):

[0090]

[0091] Among them, h rad represents the radiative heat transfer coefficient, ε represents the surface emissivity of the radiator, σ represents the Boltzmann constant, and the value of the Boltzmann constant can be 5.67×10 -8 W / (m 2 ·K 4 ), T f represents the fin temperature, such as the average temperature of multiple fins, and T a represents the ambient temperature.

[0092] In this way, the radiative heat transfer coefficient can be accurately calculated.

[0093] In some examples, the above heat dissipation design parameters further include the substrate length, substrate width, and substrate thickness of the radiator; the first area where the radiator contacts the heat dissipation medium can be obtained in the following manner:

[0094] Calculate the heat dissipation area of the fins based on the number of fins, substrate length, and fin height; calculate the bottom area of the substrate based on the substrate length and substrate width; calculate the side area of the substrate based on the substrate thickness, substrate length, and substrate width; calculate the first area based on the heat dissipation area of the fins, the bottom area of the substrate, and the side area. For example, the sum of the heat dissipation area of the fins, the bottom area of the substrate, and the side area can be used as the first area.

[0095] Exemplarily, the first area can be calculated based on the following formula (2):

[0096] Ay = N×2×L b ×H f +L b ×W b +2×H b ×(W b +L b ) (2)

[0097] Among them, Ay represents the first area, N represents the number of fins, L b represents the substrate length, H f represents the fin height, W b represents the substrate width, and H b represents the substrate thickness. In some examples, the substrate length and the fin length can be the same.

[0098] Step S230, calculate the radiative heat transfer resistance of the radiator according to the first area, the effective radiation coefficient, and the radiative heat transfer coefficient.

[0099] Exemplarily, the reciprocal of the product of the first area, the effective radiation coefficient, and the radiative heat transfer coefficient can be taken to obtain the radiative heat transfer resistance. For example, the radiative heat transfer resistance can be calculated based on the following formula (3):

[0100]

[0101] Among them, R f2 represents the thermal resistance of radiative heat transfer, and η y represents the effective radiation coefficient, and h rad represents the radiative heat transfer coefficient and represents the first area.

[0102] Step S240: Determine the heat sink thermal resistance of the heat sink according to the thermal resistance of radiative heat transfer.

[0103] Among them, the heat sink thermal resistance of the heat sink may include the heat transfer thermal resistance of the heat sink fins, the spreading resistance, and the conduction thermal resistance. The heat transfer thermal resistance of the heat sink fins may further include the thermal resistance of radiative heat transfer and the convective heat transfer thermal resistance. Therefore, the heat sink thermal resistance, that is, the total thermal resistance of the heat sink, can be determined according to the thermal resistance of radiative heat transfer and other thermal resistances.

[0104] By adopting the above method, a novel optimized calculation method for the thermal resistance of radiative heat transfer of the fin heat sink is provided, and the influence of radiative heat transfer is integrated into the overall consideration of the heat sink thermal resistance, so that the total thermal resistance of the heat sink can be calculated more efficiently and accurately.

[0105] In some examples, the heat transfer thermal resistance of the heat sink fins can be calculated according to the thermal resistance of radiative heat transfer and the convective heat transfer thermal resistance of the heat sink; the heat sink thermal resistance can be calculated according to the heat transfer thermal resistance of the heat sink fins, the spreading resistance of the heat sink, and the conduction thermal resistance of the heat sink substrate.

[0106] Exemplarily, the heat transfer thermal resistance of the heat sink fins can be calculated according to the following formula (4):

[0107]

[0108] Among them, R f represents the heat transfer thermal resistance of the heat sink fins, R f1 represents the convective heat transfer thermal resistance, and R f2 represents the thermal resistance of radiative heat transfer.

[0109] In this way, in the calculation of the heat transfer thermal resistance of the heat sink fins, both the convective heat transfer thermal resistance and the thermal resistance of radiative heat transfer are considered, which can improve the accuracy of the heat transfer thermal resistance of the heat sink fins.

[0110] Furthermore, the heat sink thermal resistance can be calculated according to the heat transfer thermal resistance of the heat sink fins, the spreading resistance of the heat sink, and the conduction thermal resistance of the heat sink substrate. For example, the heat sink thermal resistance can be calculated according to the following formula (5):

[0111] R H = R f + R s + R b(5)

[0112] Among them, R H represents the thermal resistance of the heat sink, that is, the total thermal resistance of the heat sink, R f represents the heat transfer thermal resistance of the heat sink fins, R s represents the spreading thermal resistance of the heat sink, R b The thermal conduction thermal resistance of the heat sink substrate.

[0113] The spreading thermal resistance of the above heat sink can be calculated according to the following formula (6):

[0114]

[0115] Among them, R s represents the spreading thermal resistance of the heat sink, K b represents the thermal conductivity of the heat sink substrate, H b represents the thickness of the heat sink substrate, a represents the equivalent radius of the chip, and b represents the equivalent radius of the heat sink substrate. Among them, the thermal conductivity and thickness of the heat sink substrate can be parameters input by the user.

[0116] The equivalent radius a of the chip can be determined based on the following formula (7):

[0117]

[0118] Among them, a represents the equivalent radius of the chip, L a represents the chip length, W a represents the chip width, and π represents pi.

[0119] The equivalent radius b of the substrate can be determined based on the following formula (8):

[0120]

[0121] Among them, b represents the equivalent radius of the heat sink substrate, L b represents the length of the heat sink substrate, W b represents the width of the heat sink substrate, and π represents pi.

[0122] The thermal conduction thermal resistance of the above heat sink substrate can be calculated according to the following formula (9):

[0123]

[0124] Among them, R b represents the thermal conduction thermal resistance of the heat sink substrate, K b represents the thermal conductivity of the heat sink substrate, L b represents the length of the heat sink substrate, W b represents the width of the heat sink substrate, H bIndicates the substrate thickness of the heat sink.

[0125] In some examples, the above convective heat transfer resistance can be obtained through the following steps:

[0126] Step S241, determine the Nusselt number according to the heat dissipation scheme type of the heat sink and / or the flow state of the heat dissipation fluid.

[0127] Among them, the Nusselt number (Nusselt Number, symbol Nu) can be used to describe the strength of convective heat transfer. For example, it can represent the ratio of the convective heat in the fluid to the conductive heat.

[0128] The heat dissipation scheme type can include forced air cooling and natural air cooling. The heat dissipation scheme type can also be a parameter input by the user. For example, the above heat dissipation design parameters can include the heat dissipation scheme type.

[0129] The flow state of the heat dissipation fluid can include at least one of laminar flow, transitional flow, and turbulent flow. It can be determined in different ways under different heat dissipation scheme types:

[0130] For the heat dissipation scheme of the forced air cooling type, the Reynolds number can be calculated according to the substrate length of the heat sink, the fin gap, the average velocity of the heat dissipation fluid, and the kinematic viscosity. The flow state of the heat dissipation fluid can be determined according to the Reynolds number, and the Nusselt number can be calculated using different preset formulas according to the flow state.

[0131] Exemplarily, the characteristic length is calculated according to the substrate length and fin gap of the heat sink. For example, the characteristic length can be calculated according to the following formula (10):

[0132]

[0133] Among them, L represents the characteristic length, L b represents the substrate length of the heat sink, and b1 represents the fin gap of the heat sink. The characteristic length can be used to characterize the scale effect of fluid flow.

[0134] Furthermore, the Reynolds number is calculated according to the following formula (11):

[0135]

[0136] Among them, Re represents the Reynolds number, u represents the average velocity of the heat dissipation fluid, L represents the characteristic length, v represents the kinematic viscosity of the heat dissipation fluid, and the kinematic viscosity can be defined as the ratio of the dynamic viscosity of the fluid to the fluid density (ρ). The Reynolds number (Reynolds Number, abbreviated as Re) can be used to describe the fluid flow state and reflects the ratio of the inertial force to the viscous force in fluid flow.

[0137] In this way, for a forced air cooling type heat dissipation solution, the flow state of the heat dissipation fluid can be determined according to the Reynolds number. Exemplarily, when the Reynolds number is less than the first threshold, the flow state of the heat dissipation fluid is determined to be laminar flow; when the Reynolds number is between the first threshold and the second threshold, the flow state of the heat dissipation fluid is determined to be transitional flow; when the Reynolds number is greater than the second threshold, the flow state of the heat dissipation fluid is determined to be turbulent flow. Among them, the first threshold is less than the second threshold.

[0138] Taking the first threshold as 2300 and the second threshold as 10000 as an example, when 0 < Re < 2300, the flow state of the heat dissipation fluid is determined to be laminar flow; when 2300 < Re < 10000, the flow state of the heat dissipation fluid is determined to be transitional flow; when Re > 10000, the flow state of the heat dissipation fluid is determined to be turbulent flow. It can be understood that the above 2300 or 10000 are examples, and the first threshold and the second threshold can be set by the user or determined according to empirical data.

[0139] For a natural air cooling type heat dissipation solution, the Rayleigh number can be calculated based on the fin height of the radiator, the acceleration due to gravity, the fin temperature, the ambient temperature, and the Prandtl constant of the heat dissipation fluid, and the flow state of the heat dissipation fluid can be determined according to the Rayleigh number.

[0140] Exemplarily, the coefficient of volume expansion can be determined according to the fin temperature and the ambient temperature of the radiator, the Grashof number can be calculated based on the fin height of the radiator, the acceleration due to gravity, and the coefficient of volume expansion, and the Rayleigh number can be calculated based on the Grashof number and the Prandtl constant of the heat dissipation fluid. Among them, the Grashof Number can be used to describe the relative strength of buoyancy and viscous force in a fluid; the Rayleigh number can be used to describe the natural convection phenomenon driven by buoyancy, for example, to reflect the relative relationship between buoyancy and viscous force in a fluid.

[0141] Specifically, the coefficient of volume expansion can be calculated according to the fin temperature and the ambient temperature. For example, the coefficient of volume expansion can be calculated according to the following formula (12):

[0142]

[0143] Among them, β represents the coefficient of volume expansion, T f represents the fin temperature, and T a represents the ambient temperature.

[0144] The Grashof number is calculated based on the coefficient of volume expansion, the acceleration due to gravity, the fin temperature, the ambient temperature, the fin height of the radiator, and the kinematic viscosity of the fluid. For example, the Grashof number can be calculated according to the following formula (13):

[0145]

[0146] Among them, Gr represents the Grashof number, g represents the acceleration of gravity (9.8 m / s 2 ), β represents the coefficient of volume expansion, T f represents the fin temperature, T a represents the ambient temperature, L represents the characteristic length (which can be the fin height of the radiator), and v represents the kinematic viscosity of the fluid.

[0147] Furthermore, the Rayleigh number is calculated based on the Grashof number and the Prandtl constant of the cooling fluid. For example, the Rayleigh number can be calculated according to the following formula (14):

[0148] Ra = Gr × Pr (14)

[0149] Among them, Ra represents the Rayleigh number, Gr represents the Grashof number, and Pr represents the Prandtl constant of the cooling fluid. This Prandtl number is used to characterize the relative relationship between the momentum diffusion ability and the heat diffusion ability of the fluid and can be a parameter input by the user.

[0150] In this way, for the natural air-cooling type of heat dissipation solution, the flow state of the cooling fluid can be determined according to the Rayleigh number. Exemplarily, when the Rayleigh number is between the third threshold and the fourth threshold, the flow state of the cooling fluid is determined to be laminar; when the Reynolds number is greater than the fourth threshold, the flow state of the cooling fluid is determined to be turbulent. Among them, the third threshold is less than the fourth threshold.

[0151] Taking the third threshold as 10 4 and the fourth threshold as 10 9 as an example, when 10 4 <Re<10 9 , the flow state of the cooling fluid is determined to be laminar; when Re>10 9 , the flow state of the cooling fluid is determined to be turbulent. It can be understood that the above 10 4 and 10 9 are examples, and the third threshold and the fourth threshold can be set by the user or determined according to empirical data.

[0152] Optionally, for the natural air-cooling type of heat dissipation solution, the step of determining the flow state is an optional step, and it is possible not to determine the flow state of the cooling fluid and directly calculate the Nusselt number using a unified preset formula.

[0153] There can be various ways to determine the Nusselt number in this step S241.

[0154] In some examples, in the case where the heat dissipation solution type of the radiator is forced air cooling, the Nusselt number can be calculated using different preset formulas according to the flow state, that is, different flow states correspond to different preset formulas.

[0155] If the heat dissipation solution type is forced air cooling and the flow state is laminar flow, the Nusselt number can be calculated according to the following formula (15):

[0156]

[0157] Among them, Nu represents the Nusselt number, Pr represents the Prandtl constant of the heat dissipation fluid, Re represents the Reynolds number, L b represents the substrate length of the radiator, and H b represents the substrate thickness of the radiator, and b1 represents the fin gap of the radiator.

[0158] If the heat dissipation solution type is forced air cooling and the flow state is transitional flow, the Nusselt number can be calculated according to the following formula (16):

[0159]

[0160] Among them, Nu represents the Nusselt number, Pr represents the Prandtl constant of the heat dissipation fluid, and Re represents the Reynolds number.

[0161] If the heat dissipation solution type is forced air cooling and the flow state is turbulent flow, the Nusselt number can be calculated according to the following formula (17):

[0162]

[0163] Among them, Nu represents the Nusselt number, Pr represents the Prandtl constant of the heat dissipation fluid, and Re represents the Reynolds number.

[0164] In some examples, when the heat dissipation solution type of the radiator is natural air cooling, it is not necessary to distinguish the flow state, and a unified preset formula can be used to calculate the Nusselt number. Exemplarily, if the heat dissipation solution type is natural air cooling, the Nusselt number can be calculated according to the following formula (18):

[0165]

[0166] Among them, Nu represents the Nusselt number, Pr represents the Prandtl constant of the heat dissipation fluid, and Ra represents the Rayleigh number.

[0167] In this way, by using the above method, the accurate Nusselt number can be calculated in different scenarios.

[0168] It should be noted that although other formulas or constants can also be used for calculation, the selection of the above preset formula and the constants therein are obtained by fitting and correction based on a large number of simulation works. For different heat dissipation solutions and different flow states of the fluid, the accuracy of the Nusselt number calculated in their respective scenarios is relatively high.

[0169] Step S242: Determine the convective heat transfer coefficient according to the Nusselt number.

[0170] Exemplarily, the convective heat transfer coefficient can be calculated based on the following formula (19):

[0171]

[0172] where h cov represents the convective heat transfer coefficient, K a represents the thermal conductivity of the heat dissipation fluid, N u represents the Nusselt number, L f represents the equivalent length of the fin, and this equivalent length can be H f + d / 2, that is, equivalent to the sum of the fin height and half of the fin thickness.

[0173] Step S243: Determine the convective heat transfer resistance according to the convective heat transfer coefficient, the fin efficiency, and the second area where the fin of the radiator contacts the heat dissipation medium.

[0174] Exemplarily, the convective heat transfer resistance can be calculated based on the following formula (20):

[0175]

[0176] where R f1 represents the convective heat transfer resistance, η f represents the fin efficiency, h cov represents the convective heat transfer coefficient, (N × 2 × L b × H f + L b × W b ) represents the second area, N represents the number of fins, L b represents the substrate length, H f represents the fin height, W b represents the substrate width. In some examples, the substrate length and the fin length can be the same.

[0177] The above fin efficiency can be calculated based on the following formula (21):

[0178]

[0179] where η f represents the fin efficiency, tanh represents the hyperbolic tangent function, L f represents the equivalent length of the fin, and this equivalent length can be H f + d / 2, m represents an intermediate quantity, for example, where K f represents the thermal conductivity of the fin, d represents the fin thickness of the radiator, hcov Represents the convective heat transfer coefficient of the fin. This intermediate quantity m can reflect the heat transfer efficiency of the fin.

[0180] In this way, the accurate convective heat transfer thermal resistance can be calculated in various scenarios, and further, the heat dissipation thermal resistance of the radiator can be calculated based on the convective heat transfer thermal resistance and the radiative heat transfer thermal resistance.

[0181] By adopting the above method, different calculation schemes for the convective heat transfer thermal resistance can be selected under different heat dissipation schemes and different fluid flow states, so as to calculate the accurate thermal resistance of the radiator.

[0182] Furthermore, after obtaining the thermal resistance of the radiator, the chip temperature can be calculated based on the thermal resistance of the radiator.

[0183] Figure 3 is a schematic flow chart of a method for obtaining the chip temperature provided by an embodiment of the present disclosure. As Figure 3 shown, the method of this embodiment may include the following steps S310 to step S340.

[0184] Step S310, obtain the heat dissipation design parameters of the radiator and the chip parameters of the chip.

[0185] Among them, the chip is a vehicle-mounted domain controller, and the radiator is connected to the chip and used to dissipate heat from the chip.

[0186] In some examples, the heat dissipation design parameters may refer to the description in the foregoing embodiments of the present disclosure, and will not be elaborated here.

[0187] In some examples, the chip parameters may include the chip length L a , the chip width W a , the junction-to-case thermal resistance R of the chip jc , the heat transfer power consumption P between the chip and the radiator (such as the heat transfer power consumption in the direction of the chip radiator), and one or more of other parameters. Optionally, the heat transfer power consumption may be less than the chip power consumption. For example, it may be 95% of the chip power consumption. The above chip parameters can be obtained from the chip manual.

[0188] In some examples, all or part of the heat dissipation design parameters and chip parameters may be parameters input by the user. For example, an input interface may be provided to the user to receive the heat dissipation design parameters and chip parameters input by the user through this data interface. The user can determine the above parameters based on the design specifications and requirements of the radiator and the chip and input them. In one implementation manner, the input interface may be provided to the user in the form of a table document (such as an EXCEL table), and the user inputs the above heat dissipation design parameters and chip parameters through the table page. As Figure 4AAs shown, an input interface in the form of an EXCEL table is provided to facilitate the user to input the above heat dissipation design parameters and chip parameters through the table page. It should be noted that Figure 4A What is given is only an example, and the parameters that the user can input can be Figure 4A more or less than those shown. For example, the user can also input the type of heat dissipation solution. Optionally, different table input interfaces can be provided for different types of heat dissipation solutions, or the same input interface can be provided, and options for the type of heat dissipation solution can be provided.

[0189] Step S320: Determine the heat sink thermal resistance of the heat sink according to the heat dissipation design parameters.

[0190] Among them, the heat sink thermal resistance can include the radiative heat transfer thermal resistance, which is calculated based on the first area of the heat sink in contact with the heat dissipation medium, the effective radiation coefficient of the heat sink, and the radiative heat transfer coefficient. The effective radiation coefficient represents the correction coefficient of the external radiative heat transfer amount of the plane of the heat sink in contact with the heat dissipation medium, and the radiative heat transfer coefficient represents the magnitude of the radiative heat transfer amount per unit area of the heat sink under a unit temperature difference.

[0191] For the specific implementation method of this step S320, reference can be made to the description of obtaining the heat sink thermal resistance in the foregoing embodiments of the present disclosure (for example Figure 2 the steps S220 to S240 of the shown embodiment), which will not be elaborated here.

[0192] Step S330: Calculate the total thermal resistance of the chip heat transfer path according to the heat sink thermal resistance of the heat sink, the chip parameters, and the thermal conductive material parameters.

[0193] Exemplarily, the thermal resistance of the thermal conductive material between the chip and the heat sink can be calculated first according to the thermal conductive material parameters and the chip parameters, and the total thermal resistance of the chip heat transfer path can be calculated according to the heat sink thermal resistance of the heat sink, the chip junction-to-case thermal resistance, and the thermal resistance of the thermal conductive material between the chip and the heat sink.

[0194] Among them, the thermal conductive material parameters for calculating the thermal resistance of the thermal conductive material can include the thickness of the thermal conductive material and the thermal conductivity of the thermal conductive material, and the chip parameters can include the chip length and the chip width, that is, the thermal resistance of the thermal conductive material can be calculated according to the thickness of the thermal conductive material, the thermal conductivity of the thermal conductive material, the chip length, and the chip width. For example, the thermal resistance of the thermal conductive material can be calculated based on the following formula (22):

[0195]

[0196] Among them, R T represents the thermal resistance of the thermal conductive material, H T represents the thickness of the thermal conductive material, K T represents the thermal conductivity of the thermal conductive material, L aDenote the chip length, W a Denote the chip width.

[0197] The total thermal resistance of the chip's heat transfer path can be calculated based on the following formula (23):

[0198] R = R jc + R H + R T (23)

[0199] Wherein, R denotes the total thermal resistance of the chip's heat transfer path, R jc denotes the junction-to-case thermal resistance of the chip, R H denotes the heatsink thermal resistance of the heatsink, R T denotes the thermal resistance of the thermal conductive material.

[0200] Step S340, calculate the chip temperature based on the total thermal resistance of the chip's heat transfer path, the heat transfer power consumption of the chip, and the inlet temperature of the cooling fluid.

[0201] Exemplarily, the chip temperature can be calculated based on the following formula (24):

[0202] T j = T r + P × R (24)

[0203] Wherein, T j denotes the chip temperature, T r denotes the inlet temperature of the cooling fluid, P denotes the heat transfer power consumption of the chip, and R denotes the total thermal resistance of the chip's heat transfer path.

[0204] In some examples, the chip temperature can be the chip junction temperature, i.e., the temperature of the semiconductor junction inside the chip.

[0205] In some examples, one or more of the above chip temperature, total thermal resistance of the chip's heat transfer path, heatsink thermal resistance, and thermal resistance of the thermal conductive material can be output through an EXCEL table, such as Figure 4B shown, providing a result output interface in tabular form for the user to observe the corresponding output results.

[0206] In some other examples, the calculation results of the above intermediate quantities can also be output through an EXCEL table.

[0207] By adopting the above method, the accurate heatsink thermal resistance can be calculated under different heat dissipation schemes and different fluid flow states, and then the accurate chip temperature can be obtained.

[0208] To verify the accuracy of the chip temperature obtained by the technical solution of the present disclosure, the technical solution of the present disclosure and the simulation software were compared under the same conditions. As shown in Table 1 below, under the condition of an ambient temperature of 20 °C, the accuracy comparison was carried out for the forced air cooling heat dissipation solution and the natural air cooling heat dissipation solution respectively. Based on Table 1, it can be seen that under different specifications of the forced air cooling heat dissipation solution, the error between the chip temperature value obtained by the technical solution of the present disclosure and the chip temperature value obtained by the simulation software is between -1.65% and -4.70%; under different specifications of the natural air cooling heat dissipation solution, the error between the chip temperature value obtained by the technical solution of the present disclosure (such as Figure 3 the technical solution shown) and the chip temperature value obtained by the simulation software is between 0.42% and 5.72%. That is, the error between the technical solution of the present disclosure and the simulation software is within 10%, and the chip temperature can be calculated efficiently and accurately.

[0209]

[0210] Table 1

[0211] Figure 5 is a schematic flowchart of a method for determining a radiator design solution provided by an embodiment of the present disclosure. As Figure 5 shown, the method of this embodiment may include the following steps S510 to step S540.

[0212] Step S510, obtain a plurality of initial radiator design solutions and the heat dissipation design parameters corresponding to each initial radiator design solution.

[0213] Step S520, calculate the radiator thermal resistance corresponding to each initial radiator design solution according to the heat dissipation design parameters.

[0214] Among them, the radiator thermal resistance includes the radiation heat transfer thermal resistance, and the radiation heat transfer thermal resistance is calculated according to the first area of the radiator in contact with the heat dissipation medium, the effective radiation coefficient of the radiator, and the radiation heat transfer coefficient. The effective radiation coefficient represents the correction coefficient of the external radiation heat transfer amount of the plane of the radiator in contact with the heat dissipation medium, and the radiation heat transfer coefficient represents the magnitude of the radiation heat transfer amount per unit area and per unit temperature difference of the radiator.

[0215] For the specific method of obtaining the radiator thermal resistance corresponding to each heat dissipation design solution in step S520, reference may be made to the description of obtaining the radiator thermal resistance in the foregoing embodiments of the present disclosure, and details are not described herein again.

[0216] Step S530, determine the top N candidate radiator design solutions with the smallest radiator thermal resistance from the plurality of initial radiator design solutions.

[0217] Among them, N is a positive integer greater than or equal to 1, for example, N is 3 or 5.

[0218] In some examples, the number of candidate radiator design solutions is less than the number of initial radiator design solutions. For example, the number of initial radiator design solutions is 10, and the number of candidate radiator design solutions is 5.

[0219] Step S540: Simulate the N candidate radiator design solutions to determine the target radiator design solution with the minimum radiator thermal resistance.

[0220] The simulation algorithm in this step can adopt the simulation algorithms in related technologies, and the specific simulation method is not limited in the embodiments of the present disclosure.

[0221] Using the above method, in the case of multiple initial radiator design solutions, the radiator thermal resistance can be determined first through simplified calculations to screen out N candidate radiator design solutions, and then the selected candidate radiator design solutions can be simulated more accurately to obtain a more accurate radiator thermal resistance. In this way, both the simulation workload can be reduced and a more accurate radiator thermal resistance can be obtained to determine the target radiator design solution based on the radiator thermal resistance.

[0222] Figure 6 It is a schematic structural diagram of an electronic device provided by an embodiment of the present disclosure. As Figure 6 shown, the electronic device 1000 may include a memory 1010 and a processor 1020. The memory 1010 may be used to store computer instructions, and the processor 1020 may be used to call the computer instructions from the memory 1010 to execute all or part of the steps of any of the methods in the foregoing embodiments of the present disclosure. Among them, the processor may be one or more, and the one or more processors may execute instructions alone or jointly. The memory may also be one or more, and the one or more memories may store the above computer instructions alone or jointly.

[0223] An embodiment of the present disclosure also provides a vehicle, which may include a memory and a processor. The memory may be used to store computer instructions, and the processor may be used to call the computer instructions from the memory to execute all or part of the steps of any of the methods in the foregoing embodiments of the present disclosure. Among them, the processor may be one or more, and the one or more processors may execute instructions alone or jointly. The memory may also be one or more, and the one or more memories may store the above computer instructions alone or jointly.

[0224] The vehicle in the foregoing embodiments of the present disclosure may be an electric vehicle, a hybrid vehicle, a fuel cell vehicle, or other types of vehicles. The vehicle may be an autonomous vehicle or a non-autonomous vehicle.

[0225] Embodiments of the present disclosure also provide a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, any of the methods in the foregoing embodiments of the present disclosure is implemented. Optionally, the computer-readable storage medium may be a non-transitory storage medium, but is not limited thereto, and it may also be a transitory storage medium.

[0226] Embodiments of the present disclosure also provide a chip, which may include a processing unit, and the processing unit may be used to execute all or part of the steps of any of the methods in the foregoing embodiments of the present disclosure. The chip may be a chip in the form of an application specific integrated circuit (ASIC), a system on chip (SOC), a field programmable gate array (FPGA), etc., and this embodiment does not limit this. Optionally, the chip may further include a storage unit, and the storage unit may be used to store computer instructions, and the processing unit may be used to call the computer instructions from the storage unit to execute all or part of the steps of any of the methods in the foregoing embodiments of the present disclosure.

[0227] Embodiments of the present disclosure also provide a computer program product, which may include a computer program. When the computer program is executed by a processor, any of the methods in the foregoing embodiments of the present disclosure is implemented.

[0228] The present disclosure may be a system, a method, and / or a computer program product. The computer program product may include a computer-readable storage medium, on which computer-readable program instructions for causing a processor to implement any of the methods in the foregoing embodiments of the present disclosure are uploaded.

[0229] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but is not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punched card or raised structures in a groove having instructions stored thereon, and any suitable combination of the foregoing. The computer-readable storage medium used herein is not construed as an instantaneous signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0230] The computer-readable program instructions described herein can be downloaded to various computing / processing devices from a computer-readable storage medium or downloaded to an external computer or external storage device through a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network may include copper transmission cables, optical fiber transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in each computing / processing device.

[0231] The computer program instructions for performing the operations of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state-setting data, or source code or object code written in any combination of one or more programming languages, which may include object-oriented programming languages - such as Smalltalk, C++, etc., and conventional procedural programming languages - such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, executed as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network - including a local area network (LAN) or a wide area network (WAN) - or, alternatively, may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by using the state information of the computer-readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field-programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer-readable program instructions to implement various aspects of the present disclosure.

[0232] Aspects of the present disclosure are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0233] These computer-readable program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus to produce a machine such that the instructions, when executed by the processor of the computer or other programmable data processing apparatus, create means for implementing the functions / acts specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions may also be stored in a computer-readable storage medium that causes a computer, a programmable data processing apparatus, and / or other devices to function in a particular manner, such that the computer-readable medium storing the instructions comprises a manufacture including instructions for implementing various aspects of the functions / acts specified in one or more blocks of the flowchart and / or block diagram.

[0234] The computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process such that the instructions executed on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in one or more blocks of the flowchart and / or block diagram.

[0235] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of code, or a portion of an instruction, which comprises one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by special-purpose hardware-based systems that perform the specified functions or acts, or by combinations of special-purpose hardware and computer instructions. It should be noted that implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0236] The embodiments of the present disclosure have been described above. The above description is exemplary and not exhaustive, and is also not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or the technical improvements to the technology in the market, or to enable other ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A method for obtaining the thermal resistance of a heat sink, characterized in that: The method comprises: Acquire heat dissipation design parameters of the heat sink; wherein the heat dissipation design parameters include parameters for characterizing a substrate structure and a fin structure of the heat sink; Determine the first area of ​​the radiator contacting the heat dissipation medium, the effective radiation coefficient and the radiation heat transfer coefficient of the radiator according to the heat dissipation design parameters; wherein the effective radiation coefficient represents the correction coefficient of the plane of the radiator contacting the heat dissipation medium to the external radiation heat transfer, and the radiation heat transfer coefficient represents the radiation heat transfer amount per unit temperature difference per unit area of ​​the radiator; Calculating the radiation heat transfer thermal resistance of the heat sink according to the first area, the effective radiation coefficient and the radiation heat transfer coefficient; The heat sink thermal resistance of the heat sink is determined according to the radiation heat transfer thermal resistance.

2. The method according to claim 1, characterized in that The heat dissipation design parameters include the number of fins, fin height and fin spacing of the radiator; the effective radiation coefficient is obtained by: Determining the fin density type of the heat sink according to the number of fins, fin height and fin spacing; Based on the preset fin density radiation coefficient correspondence relationship, the effective radiation coefficient corresponding to the fin density type is determined; wherein the fin density radiation coefficient correspondence relationship includes the correspondence relationship between the fin density type and the effective radiation coefficient, and the type with a larger fin density has a smaller corresponding effective radiation coefficient.

3. The method according to claim 2, characterized in that Determining the fin density type of the heat sink according to the number of fins, the fin height and the fin spacing includes: Calculating a first ratio according to the fin height and the fin spacing; When the number of fins is greater than or equal to a first preset threshold and the first ratio is greater than or equal to a second preset threshold, determining that the fin density type of the heat sink is a first density type; When the number of fins is less than the first preset threshold or the first ratio is less than the second preset threshold, the fin density type of the radiator is determined to be a second density type; wherein the effective radiation coefficient corresponding to the first density type is less than the effective radiation coefficient corresponding to the second density type.

4. The method according to claim 2, characterized in that: The heat dissipation design parameters also include the surface emissivity, fin temperature and ambient temperature of the radiator; the radiation heat transfer coefficient is obtained by: The radiation heat transfer coefficient is calculated based on the ambient temperature, the fin temperature, the surface emissivity and the Boltzmann constant, wherein the Boltzmann constant is a proportionality factor between the average thermal energy of each molecule in an ideal gas and the absolute temperature of the gas.

5. The method according to any one of claims 1 to 4, characterized in that The step of determining the heat sink thermal resistance of the heat sink according to the radiation heat transfer thermal resistance comprises: Calculate the heat transfer resistance of the fin of the radiator according to the radiation heat transfer resistance and the convection heat transfer resistance of the radiator; The heat resistance of the heat sink is calculated according to the heat exchange resistance of the heat sink fin, the diffusion resistance of the heat sink, and the heat conduction resistance of the heat sink substrate.

6. The method according to claim 5, characterized in that The convective heat transfer thermal resistance is obtained by the following method: Determine the Nusselt number according to the type of heat dissipation scheme of the heat sink and / or the flow state of the heat dissipation fluid; wherein the Nusselt number represents the ratio of the convection heat to the conduction heat inside the fluid; determining a convective heat transfer coefficient according to the Nusselt number; The convection heat transfer thermal resistance is determined according to the convection heat transfer coefficient, the fin efficiency, and a second area of ​​the fin of the heat sink contacting the heat dissipation medium.

7. The method according to claim 6, characterized in that The heat dissipation scheme types include forced air cooling and natural air cooling, and the flow state includes laminar flow, transitional flow and turbulent flow; and determining the Nusselt number according to the heat dissipation scheme type of the radiator and / or the flow state of the heat dissipation fluid includes: When the heat dissipation scheme type of the radiator is forced air cooling, the Reynolds number is calculated according to the base plate length, fin gap, average velocity and kinematic viscosity of the radiator, the flow state of the heat dissipation fluid is determined according to the Reynolds number, and the Nusselt number is calculated according to different preset formulas according to the flow state; When the heat dissipation scheme type of the radiator is natural air cooling, the Rayleigh number is calculated according to the fin height, gravity acceleration, fin temperature, ambient temperature and Prandtl constant of the radiator, and the Nusselt number is determined according to the Rayleigh number.

8. A method for obtaining chip temperature, characterized in that: The method comprises: Acquire heat dissipation design parameters of the heat sink and chip parameters of the chip; wherein the chip is a vehicle-mounted domain controller, the heat sink is connected to the chip and is used to dissipate heat for the chip, and the heat dissipation design parameters include parameters for characterizing a substrate structure and a fin structure of the heat sink and parameters of a thermal conductive material; Determine the heat sink thermal resistance of the heat sink according to the heat dissipation design parameters; wherein the heat sink thermal resistance includes radiation heat transfer thermal resistance, which is calculated based on the first area of ​​the heat sink contacting the heat dissipation medium, the effective radiation coefficient of the heat sink and the radiation heat transfer coefficient, wherein the effective radiation coefficient represents the correction coefficient of the plane of the heat sink contacting the heat dissipation medium to the external radiation heat transfer, and the radiation heat transfer coefficient represents the radiation heat transfer amount per unit temperature difference per unit area of ​​the heat sink; Calculating the total thermal resistance of the chip heat transfer path according to the heat sink thermal resistance of the heat sink, the chip parameters and the thermal conductive material parameters; The chip temperature is calculated based on the total thermal resistance of the chip heat transfer path, the heat transfer power consumption of the chip and the inlet temperature of the heat dissipation fluid.

9. A method for determining a heat sink design scheme, characterized in that: The method comprises: Acquire multiple initial heat sink design solutions and heat dissipation design parameters corresponding to each initial heat sink design solution; The heat sink thermal resistance corresponding to each initial heat sink design scheme is calculated according to the heat dissipation design parameters; wherein the heat sink thermal resistance includes radiation heat transfer thermal resistance, which is calculated according to the first area of ​​the heat sink contacting the heat dissipation medium, the effective radiation coefficient of the heat sink and the radiation heat transfer coefficient, wherein the effective radiation coefficient represents the correction coefficient of the plane of the heat sink contacting the heat dissipation medium to the external radiation heat transfer, and the radiation heat transfer coefficient represents the radiation heat transfer amount per unit temperature difference per unit area of ​​the heat sink; Determine the top N candidate heat sink design schemes with the smallest heat sink thermal resistance from the multiple initial heat sink design schemes; wherein N is a positive integer greater than or equal to 1; The N candidate heat sink design solutions are simulated to determine a target heat sink design solution with the minimum heat sink thermal resistance.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, the computer program implements: the method according to any one of claims 1 to 9.

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