A method for solving the problem of ball height in double-sided encapsulation

Abstract

This invention relates to the field of semiconductor integrated circuit manufacturing technology, and in particular to a method for solving the problem of solder ball height in double-sided packaging, comprising the following steps: S1. Components and chips are mounted on the upper surface of a carrier board, functional devices are mounted on the lower surface of the carrier board, and solder balls are formed on the lower surface of the carrier board to form neatly arranged solder balls; S2. The upper and lower surfaces of the carrier board are encapsulated with epoxy resin, and the epoxy resin is cured to form an upper encapsulation body and a lower encapsulation body; S3. The lower encapsulation body is ground by a grinding component to expose a circular planar solder ball flush with the surface of the lower encapsulation body, and the area around the solder ball is laser-drilled by a laser drilling component to remove the lower encapsulation body around the solder ball, exposing a hemispherical solder ball; S4. The laser-drilled carrier board is sent into a reflow oven, and the hemispherical solder ball is reshaped into a sphere by the high temperature conditions in the reflow oven. The height of the solder ball is determined by controlling the width of the baffle between the solder balls, eliminating the need for secondary solder ball placement to achieve the required height and reducing the packaging process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor integrated circuit manufacturing technology, and in particular to a method for solving the problem of ball height in double-sided packaging. Background Technology

[0002] With the continuous development of packaging technology, double-sided packaging has become the mainstream trend. In the existing double-sided packaging method, the ball is directly placed. However, after encapsulation, the height of the exposed ball often does not meet the expected requirements, and secondary ball placement is often required to make the ball height meet the requirements.

[0003] For example, the method for re-balling a spherical array package chip according to patent application number CN201110452860.5 includes: removing solder from the failed spherical array package chip and cleaning it; positioning the spherical array package chip planarly; placing a solder paste printing board on the spherical array package chip, with its solder paste printing holes corresponding to the ball placement positions of the spherical array package chip; printing solder paste through the solder paste printing holes, so that it leaks onto the ball placement positions of the spherical array package chip; removing the solder paste printing board; placing a solder ball printing board on the spherical array package chip, and making... The solder ball printing holes correspond to the ball placement positions of the ball array package chip; the solder balls are moved to ensure that there are solder balls in the solder ball printing holes; the solder ball printing board is removed to separate it from the ball array package chip; and the ball array package chip after ball placement is taken out and placed in a heating furnace at a predetermined temperature. After a predetermined time, the molten solder paste fixes the solder balls to the ball placement positions of the ball array package chip. However, the disadvantage of this technical solution is that after encapsulation, the exposed ball height of this direct ball placement method does not meet the expected requirements, and secondary ball placement is often required to make the ball height meet the requirements. Summary of the Invention

[0004] The purpose of this invention is to provide a method for solving the problem of ball height in double-sided encapsulation, thereby addressing the problems in the prior art. The specific technical solution is as follows:

[0005] A method for solving the problem of ball height in double-sided encapsulation includes the following steps:

[0006] S1. Mount the components and chips on the upper surface of the carrier board, mount the functional devices on the lower surface of the carrier board, and place the solder balls on the lower surface of the carrier board to form neatly arranged solder balls;

[0007] S2. Epoxy resin is applied to the upper and lower surfaces of the substrate. The epoxy resin is cured to form an upper molded body and a lower molded body. After the molding is completed, a chip packaged product is formed.

[0008] S3. Grind the lower molding compound using the grinding component to expose a circular flat solder ball flush with the surface of the lower molding compound. Then, use the laser drilling component to laser-drill around the solder ball to remove the lower molding compound around the solder ball and expose a hemispherical solder ball.

[0009] S4. The laser-encapsulated chip product is sent into a reflow oven, where the hemispherical solder balls are reshaped into spheres under the high temperature conditions.

[0010] Furthermore, in step S1, multiple functional chips can be stacked on the chip, and the functional chips are connected to the carrier board via copper wires.

[0011] Furthermore, in step S1, the functional device is connected to the chip through the internal circuitry of the carrier board, and the component is connected to the solder ball through the internal circuitry of the carrier board.

[0012] Furthermore, in step S2, the chip packaged product is sequentially transported by the transport component to the grinding component, the laser drilling component, and the inspection component for operation or inspection.

[0013] Furthermore, in step S3, while laser drilling is performed around the solder ball using the laser drilling component, water is sprayed onto the laser-drilled area to cool it down using a water spray pipe.

[0014] Furthermore, the transport component includes a transport platform with four grooves equidistantly passing through it. The transport platform rotates on a bracket. A motor is fixed to the bottom of the bracket via a curved support. The output end of the motor is connected to a functional wheel, which is slidably connected to a rotating wheel. The upper end of the rotating wheel passes through the bracket and is fixedly connected to the transport platform. A discharge port is provided on the bracket. A second motor is fixed to the transport platform. The output end of the second motor is connected to a rectangular block. The four corners of the rectangular block are rotatably connected to one end of four curved rods, and the other ends of the four curved rods are rotatably connected to four clamping plates. All four clamping plates are slidably connected to the inside of the transport platform, with the front ends of the clamping plates sliding within the grooves.

[0015] Furthermore, a cylinder is fixed at the lower end of the bracket, the output end of the cylinder is connected to a push rod, a small cylinder is fixed on the push rod, the small cylinder slides in the inclined groove on the lifting plate, the lifting plate is slidably connected to the bracket, and a feeding rack is provided on the side of the bracket.

[0016] Furthermore, the grinding component includes a support frame 1, which is fixedly connected to a bracket. A sliding plate 1 is slidably connected to the support frame 1, and a motor 3 is fixedly mounted on the sliding plate 1. The output end of the motor 3 is connected to an upper rotating rod. The upper rotating rod is slidably connected to a lower rotating rod. The lower rotating rod is rotatably connected to an upper cover. The lower end of the lower rotating rod is fixedly connected to a grinding wheel. A cylinder 2 is fixedly mounted on the upper end of the upper cover. The output end of the cylinder 2 is fixedly connected to the sliding plate 1.

[0017] Furthermore, the slide plate is provided with a long groove, the support plate is fixed on the bracket, the support plate is fixedly connected to the motor, the output end of the motor is connected to one end of the long rod, the other end of the long rod is slidably connected in the long groove, the bracket is fixedly connected to the annular dust collection hood, the air inlet of the annular dust collection hood surrounds the upper end of the groove, and the air outlet of the annular dust collection hood is connected to the connecting pipe.

[0018] Furthermore, the laser drilling component includes a housing, with a motor five fixed to the end of the housing. The output end of the motor five is connected to a lead screw, which rotates within the housing. The lead screw is threadedly connected to an inner slider. An outer slider is slidably connected to the outside of the inner slider. The outer slider is fixedly connected to a cylinder three. The output end of the cylinder three is connected to the outer wall of the inner slider. The outer slider is fixedly connected to a bracket three. A support rod is fixed inside the bracket three. A sliding plate three is fixed on the support rod. Four sliding plates two are slidably connected to the support rod. The sliding plates two are connected to the output end of a cylinder four. The cylinder four is fixed to the end of the bracket three. A connecting rod is provided between two adjacent sliding plates two. A connecting rod is provided between sliding plates two and sliding plates three. A connecting frame is fixed to the front end of each sliding plate three and each of the four sliding plates two. A laser head is fixed to the front end of the connecting frame. The laser head is photoelectrically connected to a laser. The connecting frame is fixedly connected to a water spray pipe, which is connected to a water pipe.

[0019] The advantages of this invention are:

[0020] The solder ball is laser-drilled using a laser drilling component to remove the underlying molding compound around it, forming a laser ring that exposes the hemispherical solder ball. The underlying molding compound between the solder balls acts as a barrier. The smaller the barrier, the higher the height of the exposed hemispherical solder ball after reshaping. When all the barriers between the solder balls are laser-removed, the exposed hemispherical solder ball has the highest height after reshaping, ranging from 45-80µm. Therefore, the height of the solder ball can be determined by controlling the width of the barriers between the solder balls, eliminating the need for secondary ball placement to achieve the required height and reducing the packaging process. Attached Figure Description

[0021] Figure 1 Flowchart of a method for solving the problem of ball height in double-sided encapsulation;

[0022] Figure 2 This is a schematic diagram of the chip packaging product structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of the chip packaged product of the present invention after laser engraving. Figure 1 ;

[0024] Figure 4 This is a schematic diagram of the structure of the chip packaged product of the present invention after laser engraving. Figure 2 ;

[0025] Figure 5 This is a schematic diagram of the structure of the carrier component of the present invention. Figure 1 ;

[0026] Figure 6 This is a schematic diagram of the structure of the carrier component of the present invention. Figure 2 ;

[0027] Figure 7 This is a schematic diagram of the structure of the carrier component of the present invention. Figure 3 ;

[0028] Figure 8 This is a schematic diagram of the structure of the carrier component of the present invention. Figure 4 ;

[0029] Figure 9 This is a schematic diagram of the structure of the carrier component of the present invention. Figure 5 ;

[0030] Figure 10 This is a schematic diagram of the grinding component structure of the present invention. Figure 1 ;

[0031] Figure 11 This is a schematic diagram of the grinding component structure of the present invention. Figure 2 ;

[0032] Figure 12 This is a schematic diagram of the grinding component structure of the present invention. Figure 3 ;

[0033] Figure 13 This is a schematic diagram of the detection component structure of the present invention;

[0034] Figure 14 This is a schematic diagram of the laser drilling component structure of the present invention. Figure 1 ;

[0035] Figure 15 This is a schematic diagram of the laser drilling component structure of the present invention. Figure 2 ;

[0036] Figure 16 This is a schematic diagram of the laser drilling component structure of the present invention. Figure 3 ;

[0037] Figure 17 This is a schematic diagram of the laser drilling component structure of the present invention. Figure 4 ;

[0038] Figure 18 This is a schematic diagram of the laser drilling component structure of the present invention. Figure 5 ;

[0039] Explanation of markings in the diagram:

[0040] 1. Carrier board; 2. Components; 3. Chip; 4. Solder ball; 5. Upper molding compound; 6. Lower molding compound; 7. Laser ring; 8. Baffle; 9. Transport platform; 10. Groove; 11. Bracket; 12. Motor 1; 13. Functional wheel; 14. Rotary wheel; 15. Discharge port; 16. Motor 2; 17. Rectangular block; 18. Bent rod; 19. Clamping plate; 20. Cylinder 1; 21. Push rod; 22. Small cylinder; 23. Lifting plate; 24. Inclined groove; 25. Discharge rack; 26. Bracket 1; 27. Motor 3; 28. Upper rotating rod; 29. ​​Lower rotating rod; 30. Top cover; 31. Grinding wheel; 32. Cylinder 2; 32. Slide plate 1 33; Long groove; 34; Long rod; 35; Motor 4; Support plate; 37; Annular dust collection hood; 38; Connecting pipe; 39; Bracket 2; 40; Upper bracket 3; 41; Locking screw; 42; Camera bracket; 43; Camera; 44; Housing; 45; Motor 5; Lead screw; 47; Inner slider; Outer slider; 49; Cylinder 3; 50; Bracket 3; 51; Cylinder 4; Slide plate 2; 53; Connecting rod; 54; Connecting frame; 55; Laser head; 56; Water spray pipe; 57; Connecting water pipe; 58; Laser; 59; Support rod; 60; Slide plate 3; 61. Detailed Implementation

[0041] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0043] Example 1

[0044] like Figures 1-18 As shown, a method for solving the problem of ball height in double-sided encapsulation includes the following steps:

[0045] S1. Components 2 and chips 3 are mounted on the upper surface of the carrier board 1, functional devices are mounted on the lower surface of the carrier board 1, and solder balls are formed on the lower surface of the carrier board 1 to form neatly arranged solder balls 4.

[0046] S2. The upper and lower surfaces of the carrier 1 are encapsulated with epoxy resin. The epoxy resin is cured to form an upper encapsulation body 5 and a lower encapsulation body 6. After encapsulation, a chip packaged product is formed.

[0047] S3. Grind the lower molding compound 6 with the grinding component to expose the circular flat solder ball 4 flush with the surface of the lower molding compound 6. Then, use the laser drilling component to laser around the solder ball 4 to remove the lower molding compound 6 around the solder ball 4 and expose the hemispherical solder ball 4.

[0048] S4. The laser-encapsulated chip product is sent into a reflow oven, where the hemispherical solder ball 4 is reshaped into a sphere under the high temperature conditions of the reflow oven.

[0049] The working principle of the above technical solution is as follows: The upper molding compound 5 protects the components 2 and the chip 3, while the lower molding compound 6 protects the functional components. The lower molding compound 6 is ground by a grinding component to achieve the preset thickness requirement and make its lower surface smooth, thereby exposing the solder ball 4. The lower molding compound 6 around the solder ball 4 is laser-drilled by a laser drilling component to remove the lower molding compound 6 around the solder ball 4, forming a laser ring 7, exposing the hemispherical solder ball 4. The lower molding compound 6 between the solder balls 4 acts as a barrier 8. The smaller the barrier 8, the higher the height of the exposed hemispherical solder ball 4 after reshaping. When all the barrier 8 between the solder balls 4 is laser-drilled away, the height of the exposed hemispherical solder ball 4 after reshaping is the highest, with a height range between 45-80um. Therefore, the height of the solder ball 4 can be determined by controlling the width of the barrier 8 between the solder balls 4, eliminating the need for secondary ball placement to achieve the required height and reducing the packaging process.

[0050] Example 2

[0051] like Figures 1-18 As shown, in step S1, multiple functional chips can be stacked on chip 3, and the functional chips are connected to the carrier board 1 by copper wires.

[0052] In step S1, the functional device is connected to the chip 3 through the internal circuitry of the carrier board 1, and the component 2 is connected to the solder ball 4 through the internal circuitry of the carrier board 1.

[0053] The working principle of the above technical solution is as follows: multiple functional chips can be stacked on the chip 3. The functional chips are connected to the carrier board 1 through copper wires. The functional devices are connected to the chip 3 through the internal circuit of the carrier board 1. The component 2 is connected to the solder ball 4 through the internal circuit of the carrier board 1. The signal is transmitted to the customer's carrier board through the solder ball 4.

[0054] Example 3

[0055] like Figures 1-18 As shown, in step S2, the chip packaged product is sequentially transported by the transport component to the grinding component, the laser drilling component and the detection component for operation or detection.

[0056] The working principle of the above technical solution is as follows: The chip packaged product is transported to the grinding component by the transport component for grinding, and the lower molding body 6 is ground to expose the circular planar solder ball 4 flush with the surface of the lower molding body 6. Then it is transported to the laser drilling component, and the area around the solder ball 4 is laser-drilled to remove the lower molding body 6 around the solder ball 4, exposing the hemispherical solder ball 4. Then it is transported to the detection component, and the detection component detects whether the laser-drilled chip packaged product meets the requirements. The automation level is high and the working efficiency is high.

[0057] Example 4

[0058] like Figures 1-18 As shown, in step S3, while laser drilling is performed around the solder ball 4 using the laser drilling component, water is sprayed onto the laser-drilled area through the water spray pipe 57 to cool it down.

[0059] The working principle of the above technical solution is as follows: When laser drilling is performed around the solder ball 4 through the laser drilling component, a high temperature is generated. Water is sprayed onto the laser area through the water spray pipe 57 to cool it down, which can prevent the high temperature from melting the solder ball 4 and reduce the volume of the solder ball 4.

[0060] Example 5

[0061] like Figures 1-18 As shown, the transport component includes a transport platform 9, with four grooves 10 equidistantly passing through it. The transport platform 9 rotates on a bracket 11. A motor 12 is fixed to the bottom of the bracket 11 via a curved support. The output end of the motor 12 is connected to a functional wheel 13. The functional wheel 13 is slidably connected to a rotating wheel 14. The upper end of the rotating wheel 14 passes through the bracket 11 and is fixedly connected to the transport platform 9. A discharge port 15 is provided on the bracket 11. A second motor 16 is fixed on the transport platform 9. The output end of the second motor 16 is connected to a rectangular block 17. The four corners of the rectangular block 17 are rotatably connected to one end of four curved rods 18. The other ends of the four curved rods 18 are rotatably connected to four clamping plates 19. All four clamping plates 19 are slidably connected to the inside of the transport platform 9. The front end of the clamping plate 19 slides within the groove 10.

[0062] A cylinder 20 is fixed at the lower end of the bracket 11. The output end of the cylinder 20 is connected to the push rod 21. A small cylinder 22 is fixed on the push rod 21. The small cylinder 22 slides in the inclined groove 24 on the lifting plate 23. The lifting plate 23 is slidably connected to the bracket 11. A material unloading rack 25 is provided on the side of the bracket 11.

[0063] The working principle of the above technical solution is as follows: Multiple chip packaged products can be stacked in the unloading rack 25. The chip packaged product at the bottom of the unloading rack 25 falls into the groove 10 of the transport platform 9. The second motor 16 is started, which drives the rectangular block 17 to rotate, drives the four bent rods 18 to rotate, and drives the front end of the clamping plate 19 to slide in the groove 10. The clamping plate 19 clamps the chip packaged product in the groove 10. The first motor 12 is started, which drives the functional wheel 13 to rotate, drives the rotating wheel 14 to rotate 90 degrees, drives the transport platform 9 to rotate 90 degrees, and drives the chip packaged product to rotate 90 degrees, transferring the chip packaged product under the grinding component. The clamping action of the clamping plate 19 prevents the chip packaged product from moving during transportation and construction, maintaining its processing stability.

[0064] Example 6

[0065] like Figures 1-18 As shown, the grinding component includes a bracket 26, which is fixedly connected to the bracket 11. A sliding plate 33 is slidably connected to the bracket 26. A motor 27 is fixed on the sliding plate 33. The output end of the motor 27 is connected to the upper rotating rod 28. The upper rotating rod 28 is slidably connected to the lower rotating rod 29. The lower rotating rod 29 is rotatably connected to the upper cover 30. The lower end of the lower rotating rod 29 is fixedly connected to the grinding wheel 31. A cylinder 32 is fixedly fixed to the upper end of the upper cover 30. The output end of the cylinder 32 is fixedly connected to the sliding plate 33.

[0066] The slide plate 33 is provided with a long groove 34, and the support plate 37 is fixed on the bracket 26. The support plate 37 is fixedly connected to the motor 36. The output end of the motor 36 is connected to one end of the long rod 35. The other end of the long rod 35 is slidably connected in the long groove 34. The bracket 26 is fixedly connected to the annular dust collection hood 38. The air inlet of the annular dust collection hood 38 surrounds the upper end of the groove 10. The air outlet of the annular dust collection hood 38 is connected to the connecting pipe 39.

[0067] The working principle of the above technical solution is as follows: Start motor 3 27 drives the upper rotating rod 28 to rotate, which in turn drives the grinding wheel 31 to rotate. Start cylinder 2 32 to increase the distance between the upper cover 30 and the slide plate 1 33, which in turn drives the upper cover 30 to move down, which in turn drives the grinding wheel 31 to move down, which causes the upper rotating rod 28 and the lower rotating rod 29 to slide, which causes the grinding wheel 31 to contact the surface of the lower plastic encapsulation body 6 of the chip package product. As the grinding wheel 31 rotates at high speed, the grinding wheel 31 grinds the surface of the lower plastic encapsulation body 6. Start motor 4 36 to drive the long rod 35 to rotate, which causes the long rod 35 to slide and connect with the long groove 34 at the tail end of the slide plate 1 33, which causes the slide plate 1 33 to slide back and forth on the bracket 1 26, which in turn causes the grinding wheel 31 to move back and forth on the surface of the lower plastic encapsulation body 6 of the chip package product to grind, thereby increasing the grinding area.

[0068] Start cylinder 20, which drives push rod 21 to move forward or backward. The small cylinder 22 on push rod 21 slides in inclined groove 24, which drives lifting plate 23 to rise or fall. This, in turn, drives chip package product to move up or down in groove 10, thereby changing the height of chip package product exposed on the upper surface of carrier stage 9, thus changing the thickness of the polished material. This can be adjusted according to actual needs or the size of solder ball 4.

[0069] Connect the end of the connecting pipe 39 to the suction fan, and the annular dust collection hood 38 can collect the dust and debris from the grinding in an annular manner. The annular absorption has a larger dust collection area, reducing the contamination of the working ring by dust.

[0070] Example 7

[0071] like Figures 1-18 As shown, the laser drilling component includes a housing 45, with a motor 46 fixed to one end of the housing 45. The output end of the motor 46 is connected to a lead screw 47, which rotates within the housing 45. The lead screw 47 is threadedly connected to an inner slider 48, and an outer slider 49 is slidably connected to the outside of the inner slider 48. The outer slider 49 is fixedly connected to a cylinder 50, with its output end connected to the outer wall of the inner slider 48. The outer slider 49 is fixedly connected to a bracket 51, and a support rod 60 is fixed inside the bracket 51. A sliding plate 61 is fixed on the support rod 60. Four sliding plates 53 are connected to the upper part of the bracket 51. The sliding plates 53 are connected to the output end of the cylinder 52. The cylinder 52 is fixed to the end of the bracket 51. A connecting rod 54 is provided between two adjacent sliding plates 53. A connecting rod 54 is provided between the sliding plates 53 and the sliding plate 61. A connecting frame 55 is fixed to the front end of the sliding plate 61 and the four sliding plates 53. A laser head 56 is fixed to the front end of the connecting frame 55. The laser head 56 is photoelectrically connected to the laser 59. The connecting frame 55 is fixedly connected to the water spray pipe 57. The water spray pipe 57 is connected to the connecting water pipe 58.

[0072] The working principle of the above technical solution is as follows: Motor 12 is restarted, driving the functional wheel 13 to rotate, which in turn drives the rotating wheel 14 to rotate 90 degrees. This rotates the polished chip package product to below the laser head 56. Multiple laser heads 56 are provided. Cylinder 4 52 is activated, causing the sliding plate 2 53 to slide on the support rod 60. Since the position of the middle sliding plate 3 61 remains unchanged, under the action of multiple connecting rods 54, the sliding plate 3 61 and the multiple sliding plates 2 53 move equidistantly in pairs. Through the connecting frame 55, the multiple laser heads 56 move equidistantly in pairs, adjusting the distance between two adjacent laser heads 56 to a multiple of the distance between two adjacent solder balls 4. The laser 59 controls the multiple laser heads 56 to laser-etch around the solder balls 4, forming... The laser ring 7 is formed. The motor 46 drives the lead screw 47 to rotate, which in turn moves the inner slider 48 and the outer slider 49 in the left and right directions. This causes the bracket 51 to move in the left and right directions, and multiple laser heads 56 to move in the left and right directions. In this way, the multiple laser heads 56 laser the area around the horizontally arranged solder balls 4. The cylinder 50 is activated to change the distance between the inner slider 48 and the outer slider 49, which causes the outer slider 49 to slide against the inner slider 48. This causes the bracket 51 to move in the front and back directions, and multiple laser heads 56 to move in the front and back directions. In this way, the multiple laser heads 56 laser the area around the vertically arranged solder balls 4. By having multiple laser heads 56 work simultaneously, the laser efficiency is increased, and the work efficiency is improved.

[0073] One end of the water pipe 58 is connected to a water source, and the other end of the water pipe 58 is connected to multiple water spray pipes 57. When laser is applied to the area around the solder ball 4 through the laser drilling component, a high temperature is generated. Water is sprayed onto the laser area through the water spray pipes 57 to cool it down, which can prevent the high temperature from melting the solder ball 4 and reduce the volume of the solder ball 4.

[0074] Example 8

[0075] like Figures 1-18 As shown, the detection component includes a second bracket 40, which is fixedly connected to the bracket 11. An upper bracket 3 41 is slidably connected to the upper end of the second bracket 40. A locking screw 42 is provided between the second bracket 40 and the upper bracket 3 41. Multiple camera brackets 43 are rotatably connected to the front end of the upper bracket 3 41. Cameras 44 are installed on the camera brackets 43.

[0076] The working principle of the above technical solution is as follows: Restart motor 12 to drive the function wheel 13 to rotate, which in turn drives the rotating wheel 14 to rotate 90 degrees. The laser-encapsulated chip product is then rotated to a position below multiple cameras 44. The multiple cameras 44 detect whether the laser-encapsulated chip product meets the requirements. By tightening the screw 42, the bracket 2 40 and the upper bracket 3 41 can slide, thereby changing the height of the camera bracket 43. Rotating the camera bracket 43 changes the shooting angle of the camera 44. Adjusting the camera 44 to a suitable height and angle ensures the best shooting effect. Start motor 2 16 to drive the rectangular block 17 to rotate, which in turn drives the four bent rods 18 to rotate. This causes the front end of the clamping plate 19 to slide backward within the groove 10. The clamping plate 19 releases its grip on the chip packaged product, and the chip packaged product falls from the discharge port 15 into the collection box.

[0077] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.

Claims

1. A method for solving the problem of ball height in double-sided encapsulation, characterized in that, Includes the following steps: S1. Components (2) and chips (3) are mounted on the upper surface of the carrier board (1), functional devices are mounted on the lower surface of the carrier board (1), and balls are placed on the lower surface of the carrier board (1) to form neatly arranged solder balls (4). S2. The upper and lower surfaces of the carrier board (1) are encapsulated with epoxy resin. The epoxy resin is cured into an upper encapsulation body (5) and a lower encapsulation body (6). After encapsulation, a chip packaged product is formed. S3. Grind the lower molding compound (6) with the grinding component to expose the circular planar solder ball (4) flush with the surface of the lower molding compound (6). Laser drill the area around the solder ball (4) with the laser drilling component to remove the lower molding compound (6) around the solder ball (4) and expose the hemispherical solder ball (4). S4. The laser-encapsulated chip product is sent into a reflow oven, and the hemispherical solder ball (4) is reshaped into a sphere by the high temperature conditions in the reflow oven. In step S2, the chip packaged product is sequentially transported by the transport component to the grinding component, the laser drilling component, and the detection component for operation or detection. The transport component includes a transport platform (9), on which four grooves (10) are equally spaced. The transport platform (9) rotates on a bracket (11). A motor (12) is fixed to the bottom of the bracket (11) by a curved bracket. The output end of the motor (12) is connected to a functional wheel (13). The functional wheel (13) is slidably connected to a rotating wheel (14). The upper end of the rotating wheel (14) passes through the bracket (11) and is fixedly connected to the transport platform (9). (11) is provided with a feeding port (15), and a motor (16) is fixed on the transport platform (9). The output end of the motor (16) is connected to the rectangular block (17). The four corners of the rectangular block (17) are rotatably connected to one end of four bent rods (18), and the other end of the four bent rods (18) is rotatably connected to four clamps (19). The four clamps (19) are slidably connected to the inside of the transport platform (9), and the front end of the clamps (19) slides in the groove (10). The lower end of the bracket (11) is fixed with a cylinder (20), the output end of the cylinder (20) is connected to the push rod (21), a small cylinder (22) is fixed on the push rod (21), the small cylinder (22) slides in the inclined groove (24) on the lifting plate (23), the lifting plate (23) is slidably connected to the bracket (11), and a feeding rack (25) is provided on the side of the bracket (11).

2. The method for solving the problem of ball height in double-sided encapsulation according to claim 1, characterized in that, In step S1, multiple functional chips can be stacked on the chip (3), and the functional chips are connected to the carrier board (1) by copper wires.

3. The method for solving the problem of ball height in double-sided encapsulation according to claim 1, characterized in that, In step S1, the functional device is connected to the chip (3) through the internal circuit of the carrier board (1), and the component (2) is connected to the solder ball (4) through the internal circuit of the carrier board (1).

4. The method for solving the problem of ball height in double-sided encapsulation according to claim 1, characterized in that, In step S3, while laser drilling is performed around the solder ball (4) using the laser drilling component, water is sprayed onto the laser-drilled area through the water spray pipe (57) to cool it down.

5. The method for solving the problem of ball height in double-sided encapsulation according to claim 1, characterized in that, The grinding component includes a support (26), which is fixedly connected to a bracket (11). A sliding plate (33) is slidably connected to the support (26). A motor (27) is fixedly mounted on the sliding plate (33). The output end of the motor (27) is connected to an upper rotating rod (28). The upper rotating rod (28) is slidably connected to a lower rotating rod (29). The lower rotating rod (29) is rotatably connected to an upper cover (30). The lower end of the lower rotating rod (29) is fixedly connected to a grinding wheel (31). A cylinder (32) is fixedly mounted on the upper end of the upper cover (30). The output end of the cylinder (32) is fixedly connected to the sliding plate (33).

6. The method for solving the problem of ball height in double-sided encapsulation according to claim 5, characterized in that, The slide plate (33) is provided with a long groove (34), and the support plate (37) is fixed on the bracket (26). The support plate (37) is fixedly connected to the motor (36). The output end of the motor (36) is connected to one end of the long rod (35). The other end of the long rod (35) is slidably connected in the long groove (34). The bracket (26) is fixedly connected to the annular dust collection hood (38). The air inlet of the annular dust collection hood (38) surrounds the upper end of the groove (10). The air outlet of the annular dust collection hood (38) is connected to the connecting pipe (39).

7. The method for solving the problem of ball height in double-sided encapsulation according to claim 6, characterized in that, The laser drilling component includes a housing (45), a motor (46) fixed at one end of the housing (45), the output end of the motor (46) connected to a lead screw (47), the lead screw (47) rotating inside the housing (45), the lead screw (47) threadedly connected to an inner slider (48), an outer slider (49) slidably connected to the outside of the inner slider (48), the outer slider (49) fixedly connected to a cylinder (50), the output end of the cylinder (50) connected to the outer wall of the inner slider (48), the outer slider (49) fixedly connected to a bracket (51), a support rod (60) fixed inside the bracket (51), a sliding plate (61) fixed on the support rod (60), and the support rod (60) Four sliding plates (53) are connected to the upper part of the bracket (51). The sliding plates (53) are connected to the output end of the cylinder (52). The cylinder (52) is fixed at the end of the bracket (51). A connecting rod (54) is provided between two adjacent sliding plates (53). A connecting rod (54) is provided between the sliding plates (53) and the sliding plate (61). A connecting frame (55) is fixed at the front end of the sliding plate (61) and the four sliding plates (53). A laser head (56) is fixed at the front end of the connecting frame (55). The laser head (56) is photoelectrically connected to the laser (59). The connecting frame (55) is fixedly connected to the water spray pipe (57). The water spray pipe (57) is connected to the connecting water pipe (58).

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