High-airtightness SIP frequency conversion device suitable for radio frequency microwave communication

Abstract

The invention relates to the technical field of communication frequency conversion devices, and mainly relates to a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication, the high-airtightness SIP frequency conversion device comprises a processor body, two sides of the processor body are provided with pins, the high-airtightness SIP frequency conversion device also comprises a protection frame, the processor body is placed in the protection frame, and two sides of the protection frame are provided with abutting parts. The SIP packaging processor comprises a processor body, a protection frame fixed in the processor body, a plurality of pins fixed in the protection frame, abutting portions fixed in the protection frame and used for abutting and limiting the pins, abutting columns fixed in the two sides of the protection frame and attached to the outer side of the processor body, and a buckling portion used for locking the processor body in the protection frame. The processor body can be limited by means of the abutting part and the buckling part, and meanwhile, the pins are protected, so that collision damage is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of communication frequency conversion devices, and specifically to a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication. Background Art

[0002] SIP (System in a Package) is an advanced electronic packaging technology that integrates multiple chips (such as processors, memories, sensors, etc.), passive components (resistors, capacitors, inductors), and interconnection structures within a single package to achieve complete system functions.

[0003] The pins of the high-airtightness SIP frequency conversion device are prone to collision and deformation or fracture during transportation, and the pins will also be damaged due to thermal stress cracking after welding. At the same time, the high-airtightness SIP frequency conversion device realizes environmental isolation through ceramic / metal packaging. While ensuring better airtightness, it will lead to poor internal heat dissipation and affect the performance of the device. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication to solve the problems of easy damage of the pins of the communication frequency conversion device and poor heat dissipation effect mentioned in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication, including a processor body. Pins are arranged on both sides of the processor body. The device further includes a protection frame. The processor body is placed within the protection frame. And on both sides of the protection frame, there are abutting parts, and the pins are abutted and limited through the abutting parts, and abutting columns fixed inside both sides of the protection frame, the abutting columns are in contact with the outer side of the processor body, and a fastening part, and the processor body is locked within the protection frame through the fastening part.

[0006] Preferably, the fastening part includes a fastening plate. Docking blocks are fixed at the four corners of the protection frame. Plug columns inserted into the docking blocks are fixed at both ends of the fastening plate. And on the fastening plate, there is a pressing plate that abuts against the outer side of the processor body. A magnetic block that magnetically attracts the abutting column is fixed on the fastening plate.

[0007] Preferably, a protrusion is fixed on the magnetic block, and a notch is formed inside the abutting column.

[0008] Preferably, a chamfer is formed on the abutting column to facilitate the placement of the processor body.

[0009] Preferably, the abutting part includes an elastic arc plate fixed on the protection frame. An abutting end is fixed at the bottom of the elastic arc plate, and the pins are abutted and limited through the abutting end.

[0010] Preferably, the distance between one of the docking blocks and its two adjacent docking blocks is the same, and extension plates are fixed on both sides of the elastic arc plate.

[0011] Preferably, an opening is formed at the bottom of the protection frame, and copper columns adapted to the opening are fixed on the processor body.

[0012] Preferably, the inner side of the bottom of the protection frame is attached to the outer side of the processor body, and heat sinks are fixed on the outer side of the protection frame.

[0013] Preferably, a jack is formed at the bottom of the protection frame, and a plug rod is threadedly inserted into the jack. The elastic arc plate is pressed by the plug rod to be attached to the pin.

[0014] Preferably, the width of the magnetic block is smaller than the distance between adjacent pins.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention optimizes the SIP package processor and adds a protection frame. When the processor is not welded, the processor body can be limited by the abutting part and the buckling part, and at the same time, the pins are protected to avoid being damaged by collision. After the processor is welded and installed, the protection frame is buckled on the outside of the processor. It can be attached to the processor, dissipate heat from its pins, and improve the heat dissipation effect by means of the copper columns and the heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the protection frame and the processor body of the present invention in a placed state; Figure 2 is a schematic diagram of the docking of the buckling part and the protection frame of the present invention; Figure 3 is a partial cross-sectional side view of the protection frame of the present invention; Figure 4 is a schematic diagram of the state where the protection frame of the present invention is buckled on the processor body; Figure 5 is a schematic diagram of the positional relationship between the opening and the copper column of the present invention; Figure 6 is a schematic diagram of the docking of the heat sink and the protection frame of the present invention.

[0017] In the figure: 1. Processor body; 2. Pin; 3. Protection frame; 4. Abutting part; 5. Abutting column; 6. Buckling part; 7. Buckling plate; 8. Docking block; 9. Inserting column; 10. Supporting plate; 11. Magnetic block; 12. Protrusion; 13. Notch; 14. Chamfer; 15. Elastic arc plate; 16. Abutting end; 17. Extension plate; 18. Opening; 19. Copper column; 20. Heat sink; 21. Jack; 22. Plug rod. Detailed implementation mode

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present invention.

[0019] Embodiment 1: Please refer to Figure 1 - Figure 3 , the high airtightness SIP frequency conversion device suitable for radio frequency and microwave communication in the figure includes a processor body 1, pins 2 are arranged on both sides of the processor body 1, and further includes a protective frame 3. The processor body 1 is placed in the protective frame 3. Opposing parts 4 are arranged on both sides of the protective frame 3, and the pins 2 are opposed and limited through the opposing parts 4, and opposing columns 5 fixed inside both sides of the protective frame 3, the opposing columns 5 are attached to the outer side of the processor body 1, and a fastening part 6, and the processor body 1 is locked in the protective frame 3 through the fastening part 6; In this solution, the unmounted processor body 1 is placed in the protective frame 3. With the help of the opposing part 4 and the fastening part 6, the positioning of the processor body 1 is realized, and the pins 2 are protected. After the processor body 1 is welded and installed, the protective frame 3 is buckled on the outer side of the processor body 1. In addition to protecting the welded pins 2, it can also be attached to the outer side of the processor body 1, which helps with heat dissipation.

[0020] Furthermore, refer to Figure 1 - Figure 4 , the fastening part 6 includes a fastening plate 7, docking blocks 8 are fixed at the four corners of the protective frame 3, insertion posts 9 inserted into the docking blocks 8 are fixed at both ends of the fastening plate 7, and a pressing plate 10 that abuts against the outer side of the processor body 1 is arranged on the fastening plate 7, and a magnet 11 that magnetically attracts the opposing column 5 is fixed on the fastening plate 7; Among them, in order to facilitate the docking of the magnet 11 and the opposing column 5, a protrusion 12 is fixed on the magnet 11, and a notch 13 is opened in the opposing column 5; In this solution, after the processor body 1 is placed in the protective frame 3, the operator inserts the insertion posts 9 at both ends of the fastening plate 7 into the two docking blocks 8, and then after the magnet 11 and the opposing column 5 are attached, the limiting of the processor body 1 is ensured.

[0021] It should also be noted that in order to make the placement of the processor body 1 in the protective frame 3 smoother, a chamfer 14 for facilitating the placement of the processor body 1 is opened on the opposing column 5.

[0022] Furthermore, refer to 2- Figure 4, the abutting portion 4 includes an elastic arc plate 15 fixed to the protective frame 3. Abutting ends 16 are fixed to the bottom of the elastic arc plate 15, and the pins 2 are abutted and limited by the abutting ends 16; In this solution, the elastic arc plate 15 is elastic. When placing the processor body 1 in the protective frame 3, the operator can first press the elastic arc plate 15. After the processor body 1 is placed in the protective frame 3, under the elastic action of the elastic arc plate 15 itself, it will expand outwards, so that the abutting end 16 abuts against the pin 2. Similarly, when it is necessary to remove the processor body 1, only the elastic arc plate 15 needs to be pressed so that the elastic arc plate 15 no longer abuts against the pin 2; It should also be noted that in order not to cause damage due to rigid contact when abutting against the pin 2, the abutting end 16 is designed to be made of a flexible material.

[0023] Further, refer to Figure 5 , an opening 18 is formed at the bottom of the protective frame 3, and a copper post 19 adapted to the opening 18 is fixed on the processor body 1; At the same time, refer to Figure 6 , in another embodiment of the protective frame 3, a heat sink 20 can be fixed on the outside of the protective frame 3 to assist in heat dissipation through the heat sink 20; In this solution, the principle of heat dissipation for the SIP-packaged communication processor body 1 is as follows: First, after the processor body 1 is welded and installed, the operator then buckles the protective frame 3 outside the processor body 1, inserts the copper post 19 into the opening 18, and then tightens it with a threaded cap to lock and position the protective frame 3. After buckling the protective frame 3, the protective frame 3 fits against the outside of the processor body 1, and the copper post 19 and the heat sink 20 are used to conduct heat to achieve a heat dissipation effect.

[0024] Embodiment 2: Please refer to Figure 5 and Figure 6 , this embodiment further describes Embodiment 1, and the difference lies in optimizing the adjustment method of the elastic arc plate 15.

[0025] Specifically, the distance between one docking block 8 and its two adjacent docking blocks 8 is the same. Extension plates 17 are fixed to both sides of the elastic arc plate 15. At the same time, for convenience, through the magnetic block 11, the width of the magnetic block 11 is designed to be smaller than the distance between adjacent pins 2.

[0026] At the same time, a jack 21 is formed at the bottom of the protective frame 3, and a plug rod 22 is threadedly inserted into the jack 21 to press the elastic arc plate 15 against the pin 2 for fitting.

[0027] It should be noted that since the distance between one docking block 8 and its two adjacent docking blocks 8 is the same, when a person presses the elastic arc plate 15, they only need to insert the insertion post 9 into the docking block 8 and then press down, and can press the elastic arc plate 15 by squeezing the extension plate 17, so as to realize the detachment of the pin 2, facilitating the person to remove the processor body 1; After the protection frame 3 is outside the processor body 1, a person can insert the insertion rod 22 and use the insertion rod 22 to abut against the inner side of the elastic arc plate 15, so that the elastic arc plate 15 is attached to the pin 2, and the heat on the pin 2 can be conducted, achieving a heat dissipation effect, and at the same time, the pin 2 can be protected.

[0028] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0029] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high airtightness SIP frequency conversion device suitable for radio frequency and microwave communication, comprising: A processor body (1), with pins (2) arranged on both sides of the processor body (1); Characterized in that it further comprises: A protective frame (3), the processor body (1) is placed in the protective frame (3), and both sides of the protective frame (3) are provided with abutting parts (4), and the pins (2) are abutted and limited by the abutting parts (4), and; Abutting columns (5) fixed inside both sides of the protective frame (3), the abutting columns (5) are attached to the outer side of the processor body (1), and; A fastening part (6), through which the processor body (1) is locked in the protective frame (3).

2. The highly airtight SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 1, wherein: The fastening part (6) includes a fastening plate (7), docking blocks (8) are fixed at the four corners of the protective frame (3), insertion columns (9) inserted into the docking blocks (8) are fixed at both ends of the fastening plate (7), and a pressing plate (10) abutting against the outer side of the processor body (1) is arranged on the fastening plate (7), and a magnetic block (11) magnetically attracted to the abutting column (5) is fixed on the fastening plate (7).

3. The highly airtight SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 2, wherein: A protrusion (12) is fixed on the magnetic block (11), and a notch (13) is formed in the abutting column (5).

4. The high airtightness SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 1, wherein: A chamfer (14) facilitating the placement of the processor body (1) is formed on the abutting column (5).

5. The highly airtight SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 2, wherein: The abutting part (4) includes an elastic arc plate (15) fixed on the protective frame (3), a butt end (16) is fixed at the bottom of the elastic arc plate (15), and the pins (2) are abutted and limited by the butt end (16).

6. The high airtightness SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 5, characterized in that: The distance between one of the docking blocks (8) and its two adjacent docking blocks (8) is the same, and extension plates (17) are fixed on both sides of the elastic arc plate (15).

7. The highly airtight SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 1, wherein: An opening (18) is formed at the bottom of the protective frame (3), and a copper column (19) adapted to the opening (18) is fixed on the processor body (1).

8. The high airtightness SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 1, wherein: The inner side of the bottom of the protective frame (3) is attached to the outer side of the processor body (1), and a heat sink (20) is fixed on the outer side of the protective frame (3).

9. The highly airtight SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 5, characterized in that: A jack (21) is formed at the bottom of the protective frame (3), and a plug rod (22) is threadedly inserted into the jack (21), and the elastic arc plate (15) is pressed by the plug rod (22) to be attached to the pins (2).

10. The highly airtight SIP frequency conversion device suitable for radio frequency and microwave communication according to claim 2, characterized in that: The width of the magnetic block (11) is smaller than the distance between adjacent pins (2).

Images