Novel anti-radiation tile-type phased-array antenna

Abstract

The invention discloses a novel anti-radiation tile-type phased-array antenna which comprises a network carrier plate, a TR module, a radiation unit and an antenna housing. Wherein the network carrier plate is made of multiple layers of microwave plates and comprises a power supply layer, a control layer and a radio frequency network layer; the TR module adopts a DPC tube shell technology and is composed of a lower layer substrate, an active chip, an upper layer substrate and an enclosure frame, an interface with a network carrier is a BGA ball mounting bonding pad, and interfaces with a radiation oscillator are four radio frequency coaxial bonding pads. The radiation unit adopts a single-point feed cross oscillator form and is composed of an oscillator shell, a medium and an oscillator inner core, and the external interface is a surface-mounted coaxial bonding pad and is composed of an inner conductor welding end face, an outer conductor welding end face, a diversion trench and an exhaust hole. The metal enclosure frame is composed of integrated metal grids and is used for forming a shielding structure between the radiation oscillators. According to the invention, the radiation resistance of the product is improved, the transmission loss is reduced, the antenna gain is improved, and the equalization of unit directional diagrams in the array is improved.

Description

Technical Field

[0001] The present invention belongs to the field of phased array antennas and relates to a new type of radiation-resistant tile phased array antenna. Background Art

[0002] With the increasing improvement of the functions of systems such as communication and radar, higher requirements are put forward for the integration and lightweight of phased array antennas, and the application of tile phased array antennas has become increasingly urgent and extensive. In the traditional tile phased array antenna architecture, the radiation unit is in the form of a microstrip patch, and is interconnected with the TR module by the method of BGA ball planting. The disadvantages of this architecture are: large loss and low gain of the microstrip patch, poor equalization performance of the pattern of the units in the array. When applied to platforms with high irradiation doses in medium orbit and high orbit, problems such as gain reduction and copper layer warping of the microstrip patch will occur, affecting system applications. Summary of the Invention

[0003] The technical problem to be solved by the present invention: Overcoming the deficiencies of the prior art, a new type of radiation-resistant tile phased array antenna is proposed, which can solve the problem that the radiation resistance performance of the existing tile antenna does not meet the requirements of medium orbit and high orbit satellite platforms.

[0004] The technical solution of the present invention:

[0005] The present invention discloses a new type of radiation-resistant tile phased array antenna, including: a network carrier board, a plurality of TR modules, a plurality of radiation units, and an antenna cover; wherein,

[0006] The network carrier board receives the power supply signal, performs shunting and routing layout, and provides the power supply signal for the TR module; receives the control signal of the wave control machine, performs shunting and routing layout, and provides the control signal for the TR module; synthesizes the radio frequency signals of the radiation units received by the TR module and sends them to the external back-end processor; distributes the radio frequency signals sent by the external back-end processor to the TR module;

[0007] The TR module includes a plurality of DPC shell units; a plurality of radio frequency coaxial pads are arranged on the upper surface of the DPC shell unit, and a plurality of BGA ball planting pads are arranged on the lower surface; it is connected to the network carrier board through the BGA ball planting pads and connected to the radiation unit through the radio frequency coaxial pads; forwards the radio frequency signal sent by the network carrier board to the radiation unit; forwards the radio frequency signal received by the radiation unit to the network carrier board;

[0008] The radiation unit includes a plurality of radiation oscillators; the radiation oscillator is vertically connected to the DPC shell unit through a radio frequency coaxial pad; converts the radio frequency signal forwarded by the TR module into a space radio signal and emits it outward; converts the space radio signal into a radio frequency signal and transmits it to the TR module;

[0009] The antenna cover is an integrated metal grille structure, which is used to shield the signals between the radiation oscillators.

[0010] Further, in the above-mentioned antenna, the network carrier board includes a power supply layer, a control layer, and a radio frequency network layer; wherein, the power supply layer is used to provide power distribution and routing layout for the TR module; the control layer is used to provide control signal distribution and routing layout for the TR module; the radio frequency network layer is used to perform power distribution or power combination on the radio frequency signals of the TR module.

[0011] Further, in the above-mentioned antenna, the DPC package unit adopts the DPC ceramic package process and includes a lower substrate, several mounted chips, an upper substrate, and a frame; wherein, the frame is a rectangular frame structure, and two end faces are respectively connected to the upper substrate and the lower substrate; the upper substrate is provided with radio frequency coaxial pads; the lower substrate is provided with BGA ball grid array pads; the mounted chips are mounted on the lower substrate, and the power supply signal ports, control signal ports, and radio frequency signal ports of the mounted chips are connected to the BGA ball grid array pads; the radio frequency signal ports are connected to the radio frequency coaxial pads of the upper substrate; the lower substrate, the upper substrate, and the frame achieve hermetic packaging and signal shielding of the mounted chips.

[0012] Further, in the above-mentioned antenna, the radiation element includes an element housing, a dielectric, an element inner core, and a cross-shaped arm; the element inner core is a columnar structure, the dielectric is sleeved outside the element inner core, and after being coaxially connected to the element inner core, it is placed in the cavity of the element housing; the cross-shaped arm is connected to the ends of the element inner core and the ends of the element housing.

[0013] Further, in the above-mentioned antenna, the cross-shaped arm includes a short arm and a long arm; the short arm includes a first short arm and a second short arm; the long arm includes a first long arm and a second long arm; wherein, the first short arm, the second short arm, the second long arm, and the second long arm are all perpendicularly connected to the outer circumference of the element housing; the connection line between the first short arm and the second short arm is perpendicular to the connection line between the first long arm and the second long arm, forming a cross structure; the inner ends of the first short arm, the second short arm, the first long arm, or the second long arm are connected to the element inner core.

[0014] Further, in the above-mentioned antenna, the first short arm and the second short arm have the same length, the distance between the outer end faces of the first short arm and the second short arm is less than 1 / 2 of the operating wavelength, the first long arm and the second long arm have the same length, and the distance between the outer end faces of the first long arm and the second long arm is greater than 1 / 2 of the operating wavelength.

[0015] Further, in the above-mentioned antenna, the element housing includes a cylinder and a welding flange; the welding flange is located on the welding surface of the cylinder and is used to increase the welding area; two choke grooves are symmetrically arranged on one side of the cylinder near the cross-shaped arm; the choke grooves are located between the long arm and the short arm.

[0016] Further, in the above antenna, a first diversion groove is provided between the dielectric and the inner core of the oscillator, and a second diversion groove is provided between the dielectric and the welding flange; both the first diversion groove and the second diversion groove are annular groove structures; they are used to guide the solder to flow along the annular groove to avoid short circuit between the inner core of the oscillator and the outer shell of the oscillator; first exhaust holes are symmetrically arranged on the end face of the dielectric; second exhaust holes are symmetrically arranged on both sides of the welding flange.

[0017] Further, in the above antenna, the included angle α between the choke groove and the short radiating arm is 40° to 50°, and the included angle with the long radiating arm is 90° - α; the depth L of the choke groove is 1 / 5 to 1 / 3 times the operating wavelength.

[0018] Further, in the above antenna, the radome includes a plurality of interconnected hollow honeycomb structure units; each radiating oscillator is placed in a honeycomb structure unit; there is a certain distance between the end face of the honeycomb structure unit and the upper end face of the TR module, and the support of the radome is realized through the structural members connected to the periphery.

[0019] The advantages of the present invention compared with the prior art are as follows:

[0020] (1) The radiation unit of the present invention selects a metal cross-radiating oscillator structure, and realizes radio frequency signal transmission and structural integration with the rear-end TR module through surface-mounted pads; there is no transition structure between the two, and the loss is small; the TR module is packaged with a DPC ceramic package, the external interface of the lower substrate is BGA ball grid array, the external interface of the upper substrate is a coaxial pad, and the upper and lower substrates realize radio frequency signal transmission through a coaxial-like structure formed by internal metal columns, the signal path is short, and the transmission loss is small; a metal grid structure is added between the radiating oscillators, which can improve the isolation between the radiating oscillators and improve the pattern equalization.

[0021] (2) The radiation oscillator of the present invention has the advantages of low insertion loss, high gain, and good pattern equalization performance, and can improve the beam performance of the traditional tile-type phased array antenna; it can solve the problems of large unit loss, low gain, and poor equalization performance in the existing tile-type antenna array.

[0022] (3) The radiation unit of the present invention adopts a metal radiation oscillator form. The inner core of the oscillator is made of beryllium bronze plated with gold, and the outer conductor is made of tin bronze plated with gold. Both are insensitive to irradiation. The dielectric is polyimide, which has good anti-irradiation performance. Using this metal radiation oscillator to replace the traditional microstrip radiation patch solves the problems of increased loss and copper layer warping that occur in the case of high irradiation dose of the microstrip radiation patch, and can solve the problem that the anti-irradiation performance of the existing tile-type antenna does not meet the requirements of the medium-orbit and high-orbit satellite platforms.

[0023] (4) The present invention proposes a novel anti-radiation tile phased array antenna architecture that highly integrates a metal radiation oscillator with a tile-type RF front end. Compared with the traditional tile antenna architecture, while having the advantages of high integration and light weight, the present invention greatly improves the anti-radiation performance of the product, reduces transmission loss, increases antenna gain, improves the pattern equalization of the elements in the array, significantly enhances the antenna performance, meets the application requirements of various satellite platforms and ground equipment, especially meets the application requirements of satellite platforms with higher radiation doses such as medium-orbit and high-orbit satellites, and has a broad market application prospect. Description of the Drawings

[0024] Figure 1 is a schematic structural diagram of the present invention;

[0025] Figure 2 is a schematic diagram of the structural composition of the present invention;

[0026] Figure 3 is a coaxial metal structure diagram of the TR module class of the present invention;

[0027] Figure 4 is a solder pad structure diagram of the radiation oscillator of the present invention;

[0028] Figure 5 is a housing structure diagram of the radiation oscillator of the present invention;

[0029] Figure 6 is a schematic diagram after the radiation oscillator and the TR module are welded of the present invention;

[0030] Figure 7 is a front view of the cross-shaped vibrating arm of the present invention. Detailed Embodiments

[0031] As Figure 1 and Figure 2 shown, the present invention discloses a novel anti-radiation tile phased array antenna, including: a network carrier board 1, a plurality of TR modules 2, a plurality of radiation units 3, and an antenna radome 4; wherein,

[0032] The network carrier board 1 receives the power supply signal, performs shunt and routing layout, and provides the power supply signal for the TR module 2; receives the control signal of the wave control machine, performs shunt and routing layout, and provides the control signal for the TR module 2; synthesizes the RF signals of the radiation units 3 received by the TR module 2 and sends them to the external back-end processor; distributes the RF signals sent by the external back-end processor to the TR module 2;

[0033] The TR module 2 includes several DPC package units; multiple RF coaxial pads are arranged on the upper surface of the DPC package unit, and multiple BGA ball grid array pads are arranged on the lower surface; it is connected to the network carrier board 1 through the BGA ball grid array pads and connected to the radiation unit 3 through the RF coaxial pads; it forwards the RF signal sent by the network carrier board 1 to the radiation unit 3; and forwards the RF signal received by the radiation unit 3 to the network carrier board 1.

[0034] The radiation unit 3 includes several radiation oscillators; the radiation oscillators are vertically connected to the DPC package unit through RF coaxial pads; it converts the RF signal forwarded by the TR module 2 into a spatial wireless signal and emits it outward; and converts the spatial wireless signal into an RF signal and transmits it to the TR module 2.

[0035] The radome 4 is an integrated metal grille structure, which is used to shield the signals between the radiation oscillators.

[0036] Preferably, the network carrier board 1 includes a power supply layer, a control layer, and an RF network layer; among them, the power supply layer is used to provide power distribution and routing layout for the TR module 2; the control layer is used to provide control signal distribution and routing layout for the TR module 2; and the RF network layer is used to perform power distribution or power combination on the RF signal of the TR module 2.

[0037] Preferably, as Figure 3 shown, the DPC package unit adopts the DPC ceramic package process and includes a lower substrate, several mounted chips, an upper substrate, and a frame; among them, the frame is a rectangular frame structure, and the two end faces are respectively connected to the upper substrate and the lower substrate; the upper substrate is provided with RF coaxial pads; the lower substrate is provided with BGA ball grid array pads; the mounted chips are mounted on the lower substrate, and the power supply signal ports, control signal ports, and RF signal ports of the mounted chips are connected to the BGA ball grid array pads; the RF signal ports are connected to the RF coaxial pads of the upper substrate; the lower substrate, the upper substrate, and the frame realize the hermetic packaging and signal shielding of the mounted chips.

[0038] Preferably, as Figure 4 shown, the radiation oscillator includes an oscillator housing 31, a dielectric 32, an oscillator inner core 33, and a cross-shaped arm 34; the oscillator inner core 33 is a columnar structure, the dielectric 32 is sleeved outside the oscillator inner core 33, and after being coaxially connected to the oscillator inner core 33, it is placed in the cavity of the oscillator housing 31; the cross-shaped arm 34 is connected to the ends of the oscillator inner core 33 and the oscillator housing 31.

[0039] Preferably, as Figure 5As shown, the cross-shaped vibrating arm 34 includes a short vibrating arm and a long vibrating arm; the short vibrating arm includes a first short arm 341 and a second short arm 342; the long vibrating arm includes a first long arm 343 and a second long arm 344; wherein, the first short arm 341, the second short arm 342, the second long arm 344, and the second long arm 344 are all perpendicularly connected to the outer circumference of the oscillator housing 31; the connection line between the first short arm 341 and the second short arm 342 is perpendicular to the connection line between the first long arm 343 and the second long arm 344, forming a cross structure; the inner ends of the first short arm 341, the second short arm 342, the first long arm 343, or the second long arm 344 are connected to the oscillator inner core 33.

[0040] Preferably, the first short arm 341 and the second short arm 342 have the same length, the distance between the outer end faces of the first short arm 341 and the second short arm 342 is less than 1 / 2 times the operating wavelength, the first long arm 343 and the second long arm 344 have the same length, and the distance between the outer end faces of the first long arm 343 and the second long arm 344 is greater than 1 / 2 times the operating wavelength.

[0041] Preferably, the oscillator housing 31 includes a cylinder 311 and a welding flange 312; the welding flange 312 is located on the welding surface of the cylinder 311 for increasing the welding area; two choke grooves 314 are symmetrically arranged on one side of the cylinder 311 near the cross-shaped vibrating arm 34; the choke grooves 314 are located between the long vibrating arm and the short vibrating arm.

[0042] Preferably, a first flow guiding groove is provided between the dielectric 32 and the oscillator inner core 33, and a second flow guiding groove is provided between the dielectric 32 and the welding flange 312; both the first flow guiding groove and the second flow guiding groove are annular groove structures; for guiding the solder to flow along the annular groove to avoid short circuit between the oscillator inner core 33 and the oscillator housing 31; first exhaust holes 303 are symmetrically arranged on the end face of the dielectric 32; second exhaust holes 313 are symmetrically arranged on both sides of the welding flange 312. The exhaust holes are a rectangular channel formed on the outer conductor welding end face and the oscillator inner core end face, for discharging the internal air during the welding process to prevent the formation of large voids and improve the welding strength and welding quality.

[0043] Preferably, as Figure 7 shown, the included angle α between the choke groove 314 and the short vibrating arm is 40 - 50°, and the included angle with the long vibrating arm is 90° - α; the depth L of the choke groove 314 is 1 / 5 - 1 / 3 times the operating wavelength.

[0044] Preferably, the radome 4 includes a number of interconnected hollow honeycomb structure units; each radiation oscillator is placed in a honeycomb structure unit; there is a certain distance between the end face of the honeycomb structure unit and the upper end face of the TR module 2, and the support of the radome 4 is realized through the structural members connected to the periphery.

[0045] Embodiment

[0046] AsFigure 1 , Figure 2 As shown in Figure 2 , this embodiment includes, from bottom to top: a structural carrier board, a network carrier board, a number of TR modules, a number of radiation units, and a radome. The design methods for each part are as described below:

[0047] The structural carrier board is processed from a metal plate and is used to provide structural strength and external mounting interfaces.

[0048] The network carrier board is made of a microwave multilayer board and includes a power supply, a control layer, and a radio frequency network layer. The power supply and control layer receives the power supply signal, performs shunting and routing layout, and provides the power supply signal for each TR module; receives the control signal from the wave control machine, performs shunting and routing layout, and provides the control signal for each TR module. In the receiving mode, the radio frequency network layer receives the radio frequency signals output by each TR module, performs equal-power synthesis, and then sends them to the back-end processor; in the transmitting mode, the radio frequency network layer performs equal-power distribution on the radio frequency signals sent by the back-end processor, sends them to each TR module, and is converted into wireless signals through the radiation unit and radiated to a specified direction in space. The interface between the network carrier board and the TR module is a BGA ball grid array pad, and the power supply signal, control signal, radio frequency signal, and heat transfer of each TR module are realized through the BGA ball grid array.

[0049] The TR module adopts the DPC ceramic package process and is composed of a lower substrate, an upper substrate, a number of mounted chips, and a frame; 4 radio frequency coaxial pads are arranged on the upper surface of the DPC ceramic package, and a number of BGA ball grid array pads are arranged on the lower surface; it is connected to the network carrier board through the BGA ball grid array pads and connected to the radiation unit through the radio frequency coaxial pads; the power supply signal, control signal, and radio frequency signal sent by the network carrier board are transmitted to the lower substrate of the TR module to realize the power supply and control of the mounted chips on the substrate; and in the receiving mode, it receives the radio frequency signal of the radiation unit and transmits it to the lower substrate through the internal metal column to realize radio frequency signal amplification, phase shift, attenuation, and power synthesis; in the transmitting mode, the radio frequency signal sent by the network carrier board is transmitted to the lower substrate of the TR module to realize radio frequency signal phase shift, attenuation, amplification, and power distribution, and is transmitted to the radiation unit through the internal metal column. As Figure 3 shown.

[0050] The radiation unit adopts the form of a radiation oscillator and is composed of an oscillator housing, a dielectric, an oscillator inner core, and 4 cross-shaped arms; the oscillator inner core is a columnar structure, the dielectric is sleeved outside the oscillator inner core, and after being coaxially connected to the oscillator inner core, it is placed in the cavity of the oscillator housing. As Figure 4 , 5 , 6 shown.

[0051] The cross-shaped vibrating arm is connected to the end of the inner core of the vibrator and the end of the vibrator housing. The cross-shaped vibrating arm includes a first short arm, a second short arm, a first long arm, and a second long arm; the above four vibrating arms are all perpendicularly connected to the outer circumference of the vibrator housing, and the long arm and the short arm are perpendicular to each other, forming a cross structure; among them, the two short arms have the same length, and the end-to-end distance of the short arms is slightly less than 1 / 2 of the working wavelength; the two long arms have the same length, and the end-to-end distance of the long arms is slightly greater than 1 / 2 of the working wavelength; the difference in the lengths of the long arm and the short arm just forms a 90° phase difference, which can form a circularly polarized radiation field. One of the four vibrating arms extends inward and is connected to the inner core (33) of the vibrator.

[0052] The vibrator housing includes a cylinder and a welding flange; the welding flange is located at the welding surface position for increasing the welding area and improving the welding strength; two choke grooves are opened on the side of the cylinder close to the radiation vibrating arm, and the choke grooves are located between the long vibrating arm and the short vibrating arm, and the included angles with the short vibrating arm and the long vibrating arm are approximately 45°, and the depth of the choke groove is approximately 1 / 4 of the working wavelength.

[0053] The radio frequency coaxial welding pad of the radiation vibrator includes an inner and outer conductor welding end face, a flow guiding groove, and an exhaust hole; among them, the inner and outer conductor welding end face is connected to the vibrator housing and the inner core of the vibrator;

[0054] The radome includes a number of interconnected hollow honeycomb structure units; each radiation vibrator is placed in a honeycomb structure unit; there is a certain 0.2 mm gap between the end face of the honeycomb structure unit and the upper end face of the TR module, and the support of the radome is realized by connecting to the peripheral structural members.

[0055] Although the content of the present invention has been introduced in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and substitutions of the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

[0056] The content not described in detail in the specification of the present invention belongs to the well-known technology of those skilled in the art.

Claims

1. A novel radiation-resistant tile phased array antenna, characterized in that: include: A network carrier board (1), a plurality of TR modules (2), a plurality of radiation units (3) and a radome (4); wherein: The network carrier board (1) receives a power supply signal, performs branching and wiring layout, and provides a power supply signal for the TR module (2); receives a control signal from a wave controller, performs branching and wiring layout, and provides a control signal for the TR module (2); performs power synthesis on a radio frequency signal of a radiation unit (3) received by the TR module (2), and sends the signal to an external back-end processor; and distributes the radio frequency signal sent by the external back-end processor to the TR module (2); The TR module (2) comprises a plurality of DPC tube shell units; a plurality of radio frequency coaxial pads are arranged on the upper surface of the DPC tube shell unit, and a plurality of BGA ball pads are arranged on the lower surface; the TR module (2) is connected to the network carrier board (1) via the BGA ball pads, and is connected to the radiation unit (3) via the radio frequency coaxial pads; the radio frequency signal sent by the network carrier board (1) is forwarded to the radiation unit (3); and the radio frequency signal received by the radiation unit (3) is forwarded to the network carrier board (1); The radiation unit (3) includes a plurality of radiation oscillators; the radiation oscillators are vertically connected to the DPC tube shell unit through a radio frequency coaxial pad; the radio frequency signal forwarded by the TR module (2) is converted into a spatial wireless signal and transmitted outward; the spatial wireless signal is converted into a radio frequency signal and transmitted to the TR module (2); The antenna cover (4) is an integrated metal grid structure and is used to shield signals between radiating elements.

2. The novel radiation-resistant tile phased array antenna according to claim 1 is characterized in that: The network carrier board (1) comprises a power supply layer, a control layer and a radio frequency network layer; wherein the power supply layer is used to provide power supply distribution and wiring layout for the TR module (2); the control layer is used to provide control signal distribution and wiring layout for the TR module (2); and the radio frequency network layer is used to perform power distribution or power synthesis on the radio frequency signal of the TR module (2).

3. The novel radiation-resistant tile phased array antenna according to claim 1 is characterized in that: The DPC tube shell unit adopts the DPC ceramic tube shell process, including a lower substrate, a plurality of mounted chips, an upper substrate and a surrounding frame; wherein the surrounding frame is a rectangular frame structure, and two end faces are respectively connected to the upper substrate and the lower substrate; the upper substrate is provided with a radio frequency coaxial pad; the lower substrate is provided with a BGA ball pad; the mounted chip is mounted on the lower substrate, and the power supply signal port, control signal port and radio frequency signal port of the mounted chip are connected to the BGA ball pad; the radio frequency signal port is connected to the radio frequency coaxial pad of the upper substrate; the lower substrate, the upper substrate and the surrounding frame realize the airtight packaging and signal shielding of the mounted chip.

4. The novel radiation-resistant tile phased array antenna according to claim 3 is characterized in that: The radiation oscillator comprises an oscillator shell (31), a medium (32), an oscillator inner core (33) and a cross oscillator arm (34); the oscillator inner core (33) is a columnar structure; the medium (32) is sleeved outside the oscillator inner core (33), is coaxially connected to the oscillator inner core (33) and is placed in the cavity of the oscillator shell (31); and the cross oscillator arm (34) is connected to the end of the oscillator inner core (33) and the end of the oscillator shell (31).

5. The novel radiation-resistant tile phased array antenna according to claim 4 is characterized in that: The cross vibrating arm (34) comprises a short vibrating arm and a long vibrating arm; the short vibrating arm comprises a first short arm (341) and a second short arm (342); the long vibrating arm comprises a first long arm (343) and a second long arm (344); wherein the first short arm (341), the second short arm (342), the second long arm (344) and the second long arm (344) are all vertically connected to the outer circumference of the vibrator housing (31); the connecting line of the first short arm (341) and the second short arm (342) and the connecting line of the first long arm (343) and the second long arm (344) are perpendicular to each other, forming a cross structure; the inner ends of the first short arm (341), the second short arm (342), the first long arm (343) or the second long arm (344) are connected to the vibrator inner core (33).

6. The novel radiation-resistant tile phased array antenna according to claim 5 is characterized in that: The first short arm (341) and the second short arm (342) have the same length, and the distance between the outer end face of the first short arm (341) and the outer end face of the second short arm (342) is less than 1 / 2 times the working wavelength; the first long arm (343) and the second long arm (344) have the same length, and the distance between the outer end face of the first long arm (343) and the outer end face of the second long arm (344) is greater than 1 / 2 times the working wavelength.

7. The novel radiation-resistant tile phased array antenna according to claim 5 is characterized by: The vibrator housing (31) comprises a column (311) and a welding flange (312); the welding flange (312) is located on the welding surface of the column (311) and is used to increase the welding area; two choke slots (314) are symmetrically arranged on one side of the column (311) near the cross vibration arm (34); and the choke slots (314) are located between the long vibration arm and the short vibration arm.

8. The novel radiation-resistant tile phased array antenna according to claim 7 is characterized in that: A first guide groove is arranged between the medium (32) and the vibrator inner core (33), and a second guide groove is arranged between the medium (32) and the welding flange (312); the first guide groove and the second guide groove are both annular groove structures; they are used to guide the solder to flow along the annular groove to avoid a short circuit between the vibrator inner core (33) and the vibrator outer shell (31); the first exhaust holes (303) are symmetrically arranged on the end surface of the medium (32); and the second exhaust holes (313) are symmetrically arranged on both sides of the welding flange (312).

9. The novel radiation-resistant tile phased array antenna according to claim 6 is characterized in that: The included angle α between the choke slot (314) and the short vibration arm is 40-50°, and the included angle between the choke slot (314) and the long vibration arm is 90°-α; the depth L of the choke slot (314) is 1 / 5-1 / 3 times the working wavelength.

10. The novel radiation-resistant tile phased array antenna according to claim 1, characterized in that: The antenna cover (4) comprises a plurality of interconnected hollow honeycomb structural units; each radiating element is placed in a honeycomb structural unit; there is a certain distance between the end face of the honeycomb structural unit and the upper end face of the TR module (2), and the antenna cover (4) is supported by structural members connected to the periphery.

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