Temperature detection device, power module group, motor controller and vehicle

Abstract

The invention provides a temperature detection device, a power module group, a motor controller and a vehicle, and relates to the technical field of motor controllers. The device comprises a circuit board, temperature sensors and connecting terminals, the temperature sensors and the connecting terminals are installed on the circuit board, the temperature sensors are used for being attached to the power module, any temperature sensor corresponds to power chips in the power module in a one-to-one mode, the temperature sensors are used for detecting the temperature of the corresponding power chips in the power module, and the connecting terminals are connected with the power module. One end of the connecting terminal is connected with the temperature sensor, and the other end of the connecting terminal is used for being connected with the control panel so as to transmit temperature data detected by the temperature sensor to a main control chip on the control panel. According to the invention, a temperature sampling plate in the related technology is replaced by a plurality of temperature detection devices, the temperature sensor of each temperature detection device detects the temperature of the corresponding power chip in the power module, the occupied space is smaller, the cost is lower, enough space can be reserved between the power modules, and parasitic parameters are optimized.

Description

Technical Field

[0001] The present invention relates to the technical field of motor controllers, and more particularly, to a temperature detection device, a power module group, a motor controller, and a vehicle. Background Art

[0002] In a motor controller, a power module is usually responsible for current regulation and power conversion. The operating state of the power module directly affects the accuracy and operating efficiency of current output. If the temperature of the power module is too high, it may cause overheating damage, reduced efficiency, and even affect the safety of the system. Therefore, it is necessary to monitor the temperature of the power module in real time, for example, by adding an external sensor to monitor the temperature.

[0003] In the related art, the power module usually adopts a TPAK packaging form, that is, different semiconductor chips are connected together by laser welding technology and packaged in a relatively compact structure, resulting in the need to design additional space and circuits for the power module to arrange temperature sensors, which increases the overall cost and volume of the power module and may affect the overall performance of the system. In addition, the layout of the external temperature sensor may also affect the optimization of the parasitic parameters of the power module, thereby reducing the system efficiency or generating unnecessary interference. Summary of the Invention

[0004] The problem solved by the present invention is how to optimize the spatial layout of the power module.

[0005] To solve the above problems, the present invention provides a temperature detection device, a power module group, a motor controller, and a vehicle.

[0006] In a first aspect, the present invention provides a temperature detection device, including a circuit board, a temperature sensor, and a connection terminal. The temperature sensor and the connection terminal are installed on the circuit board. The temperature sensor is used to be attached to the power module, and any one of the temperature sensors corresponds to a power chip in the power module one by one. The temperature sensor is used to detect the temperature of the corresponding power chip in the power module. One end of the connection terminal is connected to the temperature sensor, and the other end is used to be connected to a control board to transmit the temperature data detected by the temperature sensor to the main control chip on the control board.

[0007] Optionally, the circuit board includes a tolerance compensation component, and the tolerance compensation component is used to compensate for the tolerance in the assembly process of the power module and the control board.

[0008] Optionally, the tolerance compensation component includes a cut groove, and the cut groove is formed by cutting the circuit board. The cut groove is used to compensate for the tolerance in the assembly process of the power module and the control board.

[0009] Optionally, the grooving comprises two arc-shaped grooves symmetrically arranged, the two arc-shaped grooves are respectively located at two side edges of the circuit board, and the temperature sensor and the connection terminal are respectively located on two sides of the connection line of the two arc-shaped grooves.

[0010] Optionally, the grooving is a U-shaped groove, and one end of the connection terminal is connected to the part enclosed by the U-shaped groove in the circuit board.

[0011] Optionally, the connection terminal includes a pin and a support leg, the pin is used for connecting with the control board to transmit the temperature data detected by the temperature sensor to the control board, and the support leg is mounted on the circuit board and connected to the temperature sensor.

[0012] Optionally, the pin is arranged perpendicular to the circuit board.

[0013] Optionally, the temperature sensor is mounted on the circuit board by a crimping method.

[0014] In a second aspect, the present invention provides a power module group, including a power chip and the temperature detection device as described in the first aspect, the temperature sensor in the temperature detection device is arranged in a fitting manner with the power chip, and any one of the temperature detection devices is used for detecting the temperature of the corresponding power chip.

[0015] In a third aspect, the present invention provides a motor controller, including the power module group as described in the second aspect.

[0016] In a fourth aspect, the present invention provides a vehicle, including the motor controller as described in the third aspect.

[0017] The beneficial effect of the temperature detection device of the present invention is that: the temperature sensor mounted on the circuit board is used for temperature detection of the power module, which is equivalent to replacing the temperature sampling board in the related art with a plurality of temperature detection devices, and temperature sensors are arranged on the temperature detection devices, and the temperature sensors of each temperature detection device detect the temperature of the corresponding power chip in the power module, and finally the temperature detection of the power module is realized; the space occupied by this solution is less, not only the cost is lower, but also enough space can be left between the power modules to optimize the parasitic parameters. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of the temperature detection device according to an embodiment of the present invention;

[0019] Figure 2 is a schematic structural diagram of the temperature detection device from another angle according to an embodiment of the present invention;

[0020] Figure 3 is another schematic structural diagram of the circuit board according to an embodiment of the present invention;

[0021] Figure 4 is a plan view of a TPAK packaged power module in the related art;

[0022] Figure 5 is a front view of a temperature sampling board in the related art;

[0023] Figure 6 is a back view of a temperature sampling board in the related art.

[0024] Explanation of reference numerals:

[0025] 1 - circuit board, 11 - cut groove, 2 - temperature sensor, 3 - connection terminal, 31 - pin, 32 - support foot. Detailed implementation manners

[0026] To make the above - mentioned objects, features, and advantages of the present invention more obvious and understandable, the following will describe in detail the specific embodiments of the present invention with reference to the accompanying drawings. Although some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments described herein. On the contrary, these embodiments are provided to more thoroughly and completely understand the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not used to limit the protection scope of the present invention.

[0027] The term "including" and its variants used herein are open - ended, that is, "including but not limited to"; the term "based on" is "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiment". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts such as "first" and "second" mentioned in the present invention are only used to distinguish different devices, modules, or units, and are not used to limit the order or interdependence relationship of the functions performed by these devices, modules, or units.

[0028] It should be noted that the modifications of "one" and "multiple" mentioned in the present invention are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly stated in the context, it should be understood as "one or more".

[0029] In the related art, as shown in Figures 4 to 6 , currently the most common packaging form for power modules is Tpak packaging. The temperature of the power module is sampled through a temperature sampling board, and the isolation distance between high and low voltages is increased through an insulating board; the temperature detection positions of the TPAK power module and the temperature sampling board correspond one by one (for example Figure 4 the No. 1 power chip inFigure 5 the 1st temperature detection position in Figure 6 the temperature transfer pin shown and the drive board to the microcontroller; This solution requires a large-area temperature sampling board, which will increase the overall cost and volume of the power module, and may affect the optimization of the parasitic parameters of the power module, thereby affecting the switching speed and power loss.

[0030] In view of the problems existing in the above related technologies, this embodiment provides a temperature detection device, a power module group, a motor controller and a vehicle.

[0031] As Figure 1 shown, an embodiment of the present invention provides a temperature detection device, including a circuit board 1, a temperature sensor 2 and a connection terminal 3. The temperature sensor 2 and the connection terminal 3 are installed on the circuit board 1. The temperature sensor 2 is used to be attached to the power module. Any one of the temperature sensors 2 corresponds to a power chip in the power module one by one. The temperature sensor 2 is used to detect the temperature of the corresponding power chip in the power module. One end of the connection terminal 3 is connected to the temperature sensor 2, and the other end is used to be connected to a control board to transmit the temperature data detected by the temperature sensor 2 to the main control chip on the control board.

[0032] Specifically, the temperature detection device includes a circuit board 1, a temperature sensor 2, and a connection terminal 3. The temperature sensor 2 and the connection terminal 3 are mounted on the circuit board 1. The temperature sensor 2 is arranged in contact with the power module. Any temperature sensor 2 corresponds one-to-one with the power chip in the power module. The temperature of the corresponding power chip in the power module is detected by the temperature sensor 2, and then the temperature data is transmitted to the main control chip on the control board through the circuit board 1 and the connection terminal 3. Currently, the power module usually adopts the TPAK package. In the TPAK package form, a temperature sensor is usually not integrated (integrating a temperature sensor will increase the complexity of the module, and the spatial and cost considerations in the design may affect the overall design of the module). Therefore, a temperature sampling board is usually adopted in the related art, but it occupies more space. In this embodiment, the temperature sensor 2 mounted on the circuit board 1 is used to detect the temperature of the power module, which is equivalent to replacing the temperature sampling board (large temperature board) in the related art with multiple temperature detection devices (small temperature boards). Temperature sensors are arranged on the temperature detection devices. The temperature sensors of each temperature detection device detect the temperature of the corresponding power chip in the power module (the positions and quantities of the temperature sensors correspond to those of the power chips). Finally, the temperature detection of the power module is realized, and the temperature of each part can be monitored more accurately, avoiding the problem of temperature averaging that may occur in the large temperature board. Local temperature monitoring can be carried out for each component, and more precise thermal management can be achieved. By detecting the temperature at different positions in real time, it helps to take heat dissipation measures in a timely manner to avoid damage caused by too high local temperature. Moreover, if a certain temperature detection device fails, other temperature detection devices can still provide data to ensure the normal operation of the system, and the position of the temperature detection point can be adjusted according to requirements to meet different design requirements. The temperature detection device of this embodiment occupies less space than the temperature sampling board in the related art, not only has a lower cost, but also can leave enough space between power modules to optimize the parasitic parameters, that is, reduce the influence of parasitic effects (such as parasitic inductance, parasitic capacitance, parasitic resistance, etc.) in the circuit on the system performance, and improve the efficiency, stability and reliability of the power module.

[0033] Among them, the temperature sensor 2 can adopt a thermistor (NTC or PTC). The resistance of the NTC (negative temperature coefficient) thermistor decreases as the temperature rises, while the PTC (positive temperature coefficient) thermistor is just the opposite. The change in temperature can be detected through the voltage division principle of the thermistor and the fixed resistor. For example, the thermistor and the fixed resistor are connected in series to form a voltage division circuit, which can convert the temperature change into a voltage change. Then, according to the pre-established voltage-temperature correspondence table (or calculated using a formula), the collected voltage value is converted into the corresponding temperature value, thus realizing accurate temperature measurement.

[0034] Among them, the power module can achieve electrical connection with other components through module busbars. Additionally, an insulating board can be provided for electrical isolation to prevent short circuits or electrical interference between the power module and other circuit boards.

[0035] In this embodiment, a temperature sensor mounted on the circuit board is used to detect the temperature of the power module. This is equivalent to replacing the temperature sampling board in the related art with multiple temperature detection devices, and temperature sensors are provided on the temperature detection devices. The temperature sensors of each temperature detection device detect the temperature of the corresponding power chip in the power module, ultimately achieving the temperature detection of the power module. This solution occupies less space, not only has a lower cost, but also can leave enough space between power modules to optimize parasitic parameters.

[0036] Optionally, the circuit board 1 includes a tolerance compensation component, and the tolerance compensation component is used to compensate for the tolerance in the assembly process of the power module and the control board.

[0037] Specifically, the circuit board 1 includes a tolerance compensation component, and the tolerance compensation component is used to compensate for the tolerance in the assembly process of the power module and the control board. The forms of the tolerance compensation component include but are not limited to: (1) elastic structures such as U-shaped grooves and elastic buckles; (2) silicone pads, foam pads or buffer pads, etc., which can not only compensate for the gap but also improve the temperature conduction efficiency.

[0038] In this optional embodiment, the tolerance in the assembly process of the power module and the control board is compensated by the tolerance compensation component, effectively avoiding the situation of poor assembly or inability to dock due to tolerance problems, and ensuring the overall assembly accuracy and the stability of the components.

[0039] Optionally, the tolerance compensation component includes a cut groove 11, and the cut groove 11 is formed by cutting the circuit board 1. The cut groove 11 is used to compensate for the tolerance in the assembly process of the power module and the control board.

[0040] Specifically, the tolerance compensation component includes a cut groove 11 (also known as a tolerance compensation groove or a tolerance adjustment groove). Its main function is to absorb and accommodate possible tolerance deviations during the assembly process (if not effectively compensated, it may lead to problems such as component misalignment, looseness, or poor contact), ensuring that the components can be accurately installed in place. In any mechanical or electronic assembly, there will be certain manufacturing tolerances, that is, due to variations in processing, assembly, and materials, the dimensions and shapes of parts will deviate. Even the most precise manufacturing process will inevitably produce tolerances. If these tolerances cannot be effectively controlled or compensated, it may lead to problems such as misalignment or excessive gaps during assembly, affecting the assembly quality and performance. Therefore, in this embodiment, by setting the cut groove 11 formed by cutting the circuit board 1, it provides additional space for the installation of relevant components and increases the elastic deformation amount, so that even if the dimensions of the components are slightly deviated, they can still be smoothly installed and automatically adjusted to the correct position during assembly, without causing assembly difficulties due to inconsistent dimensions. If the relevant components need to be slightly adjusted in position during the assembly process, the cut groove 11 can provide the required flexibility to ensure that the components can be correctly aligned and installed, that is, sufficient space is reserved during the design of the circuit board 1 to ensure that even if the dimensional deviations of each part are different, they can be normally assembled, and the components still maintain a high assembly accuracy within the deviation range, thus ensuring the overall quality of the circuit board. In addition, the cut groove 11 can also reduce the mechanical pressure or deformation during the assembly process, so that the stress generated during the assembly process can be effectively dispersed or relieved, avoiding component damage or poor installation caused by assembly stress, avoiding part deformation or damage caused by tolerance deviation, reducing the rework and correction time caused by dimensional tolerance, and improving the feasibility and efficiency of the overall production.

[0041] Among them, the cut groove 11 can be formed through the following processes: (1) Mechanical milling: By using a rotating milling cutter to cut the circuit board material, a cut groove is formed at the edge or other specified positions of the circuit board; (2) Laser cutting: By heating the circuit board material with a high-energy laser beam to make it melt or vaporize, the required cut groove is formed; (3) Waterjet cutting: Using high-pressure water flow and tiny abrasive particles for cutting, the circuit board material can be accurately cut without generating excessive heat; (4) Stamping: Using a mold and high-pressure mechanical force to cut or form the circuit board material, and the circuit board is pressed under pressure to form a precise cut groove; (5) Drilling: Cutting can be performed at the edge or specified position of the circuit board, and the required groove is formed through different drill bit shapes.

[0042] In this alternative embodiment, a certain degree of flexibility and additional space are provided through the cut groove to compensate for the tolerances in production, effectively avoiding assembly defects or inability to dock caused by tolerance problems, and ensuring the overall assembly accuracy and the stability of the components.

[0043] Optionally, the grooving 11 is two arc-shaped grooves arranged symmetrically. The two arc-shaped grooves are respectively located at the two side edges of the circuit board 1, and the temperature sensor 2 and the connection terminal 3 are respectively located on both sides of the line connecting the two arc-shaped grooves.

[0044] Specifically, the grooving 11 is two arc-shaped grooves arranged symmetrically. The two arc-shaped grooves are located at the two side edges of the circuit board 1. The arc-shaped grooves can provide additional mechanical space and increase the elastic deformation amount, and can absorb the tolerance deviation during the assembly process. The temperature sensor 2 and the connection terminal 3 are respectively located on both sides of the line connecting the two arc-shaped grooves, which is convenient for the temperature sensor 2 to fit with the power module and the connection terminal 3 to be installed on the control board (assuming that the temperature sensor 2 and the connection terminal 3 are respectively located on the same side of the line connecting the two arc-shaped grooves. After the connection terminal 3 is installed on the control board, there may be problems such as improper fitting angle between the temperature sensor 2 and the power module).

[0045] In this optional embodiment, by setting the arc-shaped grooves and the temperature sensor and the connection terminal are respectively located on both sides of the line connecting the two arc-shaped grooves, it can effectively avoid the situation of poor assembly or inability to dock due to tolerance problems, and is also convenient for realizing the fitting of the temperature sensor with the power module and the installation of the connection terminal on the control board.

[0046] Optionally, the grooving 11 is a U-shaped groove, and one end of the connection terminal 3 is connected to the part enclosed by the U-shaped groove in the circuit board 1.

[0047] Specifically, in combination with Figure 3 As shown, the grooving 11 is a U-shaped groove, and one end of the connection terminal 3 is connected to the part enclosed by the U-shaped groove in the circuit board 1. Using the U-shaped groove can also provide additional mechanical space and increase the elastic deformation amount, and can absorb the tolerance deviation during the assembly process.

[0048] In this optional embodiment, by setting the U-shaped groove, the situation of poor assembly or inability to dock due to tolerance problems is effectively avoided.

[0049] Optionally, the connection terminal 3 includes a pin 31 and a support leg 32. The pin 31 is used to connect with the control board to transmit the temperature data detected by the temperature sensor 2 to the control board, and the support leg 32 is installed on the circuit board 1 and connected to the temperature sensor 2.

[0050] Specifically, in combination with Figure 2As shown, the connection terminal 3 includes a pin 31 and a support leg 32. The pin 31 is usually in a long strip shape or cylindrical shape, such as cylindrical, square, or with a head of a specific shape. By connecting the pin 31 to the control board, the temperature data detected by the temperature sensor 2 can be transmitted to the control board. At the same time, the pin 31 can also play a role in mechanical fixation to ensure the physical connection between the circuit board 1 and other components (such as the control board); the support leg 32 is connected to the circuit board 1 to realize the connection between the connection terminal 3 and the circuit board 1.

[0051] In this alternative embodiment, by setting the connection terminal to include a pin and a support leg, while realizing the transmission of temperature data, the physical connection between the circuit board and other components is achieved, thereby ensuring stable signal transmission.

[0052] Optionally, the pin 31 is arranged perpendicular to the circuit board 1.

[0053] Specifically, in combination with Figure 2 As shown, the pin 31 is arranged perpendicular to the circuit board 1. When installing the temperature detection device, the pin 31 is connected to the control board (for example, inserted into the jack of the control board), and the pin 31 is fixed to the pad or contact point on the control board by welding, for example, to ensure good electrical conduction between the pin 31 and the control board (the end of the pin transmits current or signal by contacting the conductive path on the pad), and can withstand mechanical stress.

[0054] In this alternative embodiment, the pin being arranged perpendicular to the circuit board is beneficial to ensuring good electrical conduction between the circuit board and the control board and having a firm connection strength.

[0055] Optionally, the temperature sensor 2 is installed on the circuit board 1 by a crimping method.

[0056] Specifically, the temperature sensor 2 can achieve electrical contact with the pad or connection point on the circuit board 1. For example, the pin of the temperature sensor 2 is placed on the pad or connection point of the circuit board 1 to ensure accurate docking between the pin and the pad and avoid pin offset or poor contact, resulting in unstable connection. Then, a crimping tool is used to crimp the pins of the temperature sensor 2 one by one, and the pins are firmly crimped to the pads of the circuit board through uniform pressure. By applying appropriate pressure, a stable electrical connection can be formed between the pin and the pad.

[0057] In this alternative embodiment, by installing the temperature sensor on the circuit board by a crimping method, the stability of the electrical connection and the mechanical firmness between the temperature sensor and the circuit board can be ensured.

[0058] Another embodiment of the present invention provides a power module group, which includes a power chip and a temperature detection device. The temperature sensor 2 in the temperature detection device is attached to the power chip, and any one of the temperature detection devices is used to detect the temperature of the corresponding power chip.

[0059] Another embodiment of the present invention provides a motor controller, which includes a power module group.

[0060] Another embodiment of the present invention provides a vehicle, which includes a motor controller.

[0061] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will all fall within the protection scope of the present invention.

Claims

1. A temperature detection device, characterized in that: The invention comprises a circuit board (1), a temperature sensor (2) and a connecting terminal (3), wherein the temperature sensor (2) and the connecting terminal (3) are mounted on the circuit board (1), the temperature sensor (2) is used to be arranged in close contact with a power module, any temperature sensor (2) corresponds to a power chip in the power module on a one-to-one basis, the temperature sensor (2) is used to detect the temperature of the corresponding power chip in the power module, one end of the connecting terminal (3) is connected to the temperature sensor (2), and the other end is used to be connected to a control board, so as to transmit the temperature data detected by the temperature sensor (2) to the main control chip on the control board.

2. The temperature detection device according to claim 1, characterized in that: The circuit board (1) comprises a tolerance compensation component, and the tolerance compensation component is used to compensate for the tolerance of the assembly process of the power module and the control board.

3. The temperature detection device according to claim 2, characterized in that: The tolerance compensation component comprises a cutout (11), wherein the cutout (11) is formed by cutting the circuit board (1), and the cutout (11) is used to compensate for the tolerance of the assembly process of the power module and the control board.

4. The temperature detection device according to claim 3, characterized in that: The cutting grooves (11) are two symmetrically arranged arc-shaped grooves, the two arc-shaped grooves are respectively located on two side edges of the circuit board (1), and the temperature sensor (2) and the connecting terminal (3) are respectively located on two sides of the connection line of the two arc-shaped grooves.

5. The temperature detection device according to claim 3, characterized in that: The cutting groove (11) is a U-shaped groove, and one end of the connecting terminal (3) is connected to a portion of the circuit board (1) enclosed by the U-shaped groove.

6. The temperature detection device according to claim 1, characterized in that: The connecting terminal (3) comprises a pin (31) and a supporting foot (32); the pin (31) is used to connect to the control board to transmit the temperature data detected by the temperature sensor (2) to the control board; and the supporting foot (32) is mounted on the circuit board (1) and connected to the temperature sensor (2).

7. The temperature detection device according to claim 6, characterized in that: The pin (31) is arranged perpendicular to the circuit board (1).

8. The temperature detection device according to any one of claims 1 to 7, characterized in that: The temperature sensor (2) is mounted on the circuit board (1) by means of crimping.

9. A power module group, characterized in that: It comprises a power chip and a temperature detection device as claimed in any one of claims 1 to 8, wherein a temperature sensor (2) in the temperature detection device is arranged in close contact with the power chip, and any one of the temperature detection devices is used to detect the temperature of the corresponding power chip.

10. A motor controller, characterized in that: Comprising the power module group as claimed in claim 9.

11. A vehicle, characterized in that: Includes the motor controller as claimed in claim 10.

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