Circuit board pressing process and pressing equipment

Abstract

The invention relates to the field of circuit board processing, in particular to a circuit board press-fit process and press-fit equipment, and the press-fit equipment comprises a workbench, a limiting frame and the like. According to the circuit board pressing equipment, the workbench, the supporting plate, the limiting frame and the pressing plate jointly form a small air exhaust chamber, in the process that the pressing plate presses all layers of steel plates and circuit board sets which are stacked together into the limiting frame, the air exhaust mechanism arranged on the limiting frame can be close to all layers of circuit board sets to complete air exhaust treatment at a short distance, and the air exhaust efficiency is improved. According to the air exhaust device, the air exhaust range is reduced, residual air exhaust treatment work is rapidly and efficiently completed on the circuit board sets, a structure for limiting the descending height of a steel plate is further arranged on the air exhaust mechanism, and the effect that the pressing heights obtained by the circuit board sets are consistent is achieved. The defect that the pressing heights of all layers of circuit board groups are not uniform due to the influence of different vacuumizing treatment effects and different PP sheet softening thicknesses in the synchronous hot pressing treatment work of the multi-layer circuit board groups is overcome.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit board processing, and particularly to a printed circuit board pressing process and pressing equipment. Background Art

[0002] A printed circuit board group is composed of multiple layers of core boards and multiple layers of PP sheets stacked alternately. The polypropylene material used for the PP sheets is a thermoplastic synthetic resin with excellent performance. In the printed circuit board lamination process, generally, multiple groups of printed circuit board groups are stacked in a pressing equipment, and a steel plate is placed between each adjacent upper and lower layers of printed circuit board groups for isolation. Subsequently, a hot pressing equipment is used to perform hot pressing treatment on the stacked layers of printed circuit board groups together, so that the PP sheets are softened to form a high-viscosity molten state to bond the adjacent upper and lower core boards together. At the same time, a vacuum pumping equipment is used to perform vacuum pumping treatment on the printed circuit board groups being pressed together, so that the air remaining in the printed circuit board groups is pumped outwards, strengthening the hot pressing treatment effect of the printed circuit board groups. However, due to the different vacuum pumping treatment effects received by each layer of printed circuit board groups and the different thicknesses of the PP sheets after softening in each group of printed circuit board layers, it is easy to cause the phenomenon that the pressing heights of each layer of printed circuit board groups are not uniform. Summary of the Invention

[0003] In order to overcome the drawback that in the process of synchronously performing hot pressing treatment on multiple layers of printed circuit board groups, affected by different vacuum pumping treatment effects and different softening thicknesses of PP sheets, there is a phenomenon that the pressing heights of each layer of printed circuit board groups are not uniform, the present invention provides a printed circuit board pressing process and pressing equipment.

[0004] A printed circuit board pressing equipment includes a mounting frame, a workbench, a support plate, a limiting frame, an air extraction mechanism, a hydraulic press, a pressing plate, and a heating mechanism; the mounting frame is fixedly connected with the workbench; the workbench is connected with the support plate; the workbench is fixedly connected with the limiting frame; a support plate structure flush with the height of the support plate is arranged inside the limiting frame; an air extraction mechanism is connected to each of the four sides of the limiting frame; all the air extraction mechanisms are connected to the workbench; a hydraulic press is installed on the mounting frame; the hydraulic component of the hydraulic press is fixedly connected with the pressing plate; the heating mechanism is connected inside the support plate.

[0005] As an improvement of the above solution, the support plate is slidably connected to the workbench; an electric control elevator is installed on the mounting frame; the telescopic end of the electric control elevator is fixedly connected with the support plate.

[0006] As an improvement of the above solution, the air extraction mechanism includes a hollow plate, a sliding plate, and an electric control push rod; sliding plates corresponding to the number of printed circuit board groups are equidistantly slidably connected on the limiting frame; a hollow plate is fixedly connected among all the sliding plates; an air extraction pipe structure is connected to the hollow plate; an insertion pipe structure communicating with the hollow plate is arranged on the sliding plate; an air inlet hole structure is opened in the insertion pipe structure of the sliding plate; an electric control push rod is installed on the workbench; the telescopic end of the electric control push rod is fixedly connected with the hollow plate.

[0007] As an improvement to the above solution, the skateboard is provided with a stop bar structure for limiting the descending height of the steel plate.

[0008] As an improvement to the above solution, a side frame bar is slidably connected to the side of the pressing plate; a compression spring is fixedly connected between the side frame bar and the pressing plate; a sealing frame bar is provided at the bottom of the side frame bar.

[0009] As an improvement to the above solution, the limiting frame is provided with a sealing slot structure adapted to the structure of the sealing frame bar.

[0010] As an improvement to the above solution, a number of diversion grooves are provided on the surface of the used steel plate.

[0011] As an improvement to the above solution, the heating mechanism includes a heat transfer plate and a transfer pipeline; the heat transfer plate is fixedly connected inside the support plate; the transfer pipeline is connected to the heat transfer plate; the heat transfer plate is externally connected to a hot kerosene heat transfer system through the transfer pipeline, so that the high-temperature hot kerosene transfers heat through the transfer pipeline to the heat transfer plate to heat and process the steel plate and the circuit board group on the support plate.

[0012] As an improvement to the above solution, the limiting frame is provided with heat transfer frame bars having the same number as the steel plates; each of the heat transfer plate and the heat transfer frame bars is provided with an oil storage cavity structure; all the heat transfer frame bars and the heat transfer plate are fixedly connected with connecting pipelines; the oil storage cavity structure of the heat transfer plate is connected to the oil storage cavity structures of all the heat transfer frame bars through the connecting pipelines.

[0013] A circuit board pressing process includes the following steps: Step 1, placement preparation: alternately stack each layer of steel plate and each layer of circuit board group in the limiting frame, and the number of steel plates is one more than the number of circuit board groups; Step 2, hot pressing: the pressing plate cooperates with the heating mechanism in the support plate to press each layer of steel plate and each layer of circuit board group into the limiting frame to perform hot pressing processing on the circuit board group; Step 3, close-range vacuum pumping: on the basis of Step 2, use the air extraction mechanism on the four sides of the limiting frame to perform air extraction processing on the four sides of each layer of circuit board group respectively to improve the hot pressing processing effect on the circuit board group; Step 4, limiting support: on the basis of Step 3, limit the descending height of the steel plate to make the pressing stroke received by each layer of circuit board group unified.

[0014] A circuit board pressing process and pressing equipment described in the present invention jointly form a small air extraction chamber by a workbench, a support plate, a limit frame, and a pressing plate. During the process of the pressing plate pressing the stacked steel plates and circuit board groups into the limit frame, the air extraction mechanism provided on the limit frame can closely complete the air extraction process close to each layer of circuit board groups, reducing the air extraction range and quickly and efficiently completing the residual air extraction process for the circuit board groups. There is also a structure on the air extraction mechanism that limits the descending height of the steel plates, making the pressing stroke of the circuit board groups between each layer of steel plates unified, so that the pressing heights obtained by each layer of circuit board groups have a consistent effect.

[0015] A circuit board pressing process and pressing equipment of the present invention overcome the disadvantages that in the synchronous hot pressing process of multiple layers of circuit board groups, due to different vacuum pumping treatment effects and different softening thicknesses of PP sheets, there is a phenomenon of inconsistent pressing heights for each layer of circuit board groups. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Is a perspective view for describing the present invention; Figure 2 Is a perspective view of the support plate for describing the present invention; Figure 3 Is a sectional view of the limit frame for describing the present invention; Figure 4 Is a partial perspective view of the slide plate for describing the present invention; Figure 5 Is a perspective view of the pressing plate for describing the present invention; Figure 6 Is a perspective view of the heating mechanism for describing the present invention; Figure 7 Is a perspective view of the heat transfer frame bar for describing the present invention.

[0017] Reference numerals in the figures: 1 - mounting frame, 2 - workbench, 3 - support plate, 31 - electric control elevator, 4 - limit frame, 401 - sealing slot, 41 - support plate, 51 - hollow plate, 510 - air extraction pipe, 52 - slide plate, 520 - air inlet hole, 521 - insertion pipe, 522 - stop bar, 53 - electric control push rod, 61 - hydraulic press, 62 - pressing plate, 63 - side frame bar, 64 - compression spring, 65 - sealing frame bar, 71 - heat transfer plate, 72 - transfer pipeline, 73 - heat transfer frame bar, 74 - connection pipeline, 8 - steel plate, 801 - diversion groove, 9 - circuit board group. DETAILED DESCRIPTION OF THE INVENTION

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment 1 A circuit board laminating device, as Figures 1 - 5 shown, includes a mounting frame 1, a workbench 2, a support plate 3, a limit frame 4, an air extraction mechanism, a hydraulic press 61, a pressing plate 62, and a heating mechanism; the mounting frame 1 is fixedly connected with the workbench 2; the support plate 3 is slidably connected to the middle of the workbench 2; an electric control elevator 31 is installed on the mounting frame 1; the telescopic end of the electric control elevator 31 is fixedly connected with the support plate 3; the limit frame 4 is fixedly connected to the workbench 2; a support plate structure 41 flush with the height of the support plate 3 is provided on the lower side inside the limit frame 4; after the laminating work is completed, the electric control elevator 31 can automatically push the support plate 3 to drive the laminated circuit board groups 9 and the adjacent steel plates 8 to rise, facilitating the staff to directly take out the steel plates 8 and the circuit board groups 9 from the limit frame 4; one air extraction mechanism is connected to each of the four sides of the limit frame 4; all the air extraction mechanisms are connected to the workbench 2; the hydraulic press 61 is installed on the mounting frame 1; the hydraulic component of the hydraulic press 61 is fixedly connected with the pressing plate 62; the heating mechanism is connected inside the support plate 3.

[0020] As Figures 2 - 4 shown, the air extraction mechanism includes a hollow plate 51, a sliding plate 52, and an electric control push rod 53; sliding plates 52 corresponding to the number of the circuit board groups 9 are equidistantly slidably connected to the limit frame 4; the hollow plate 51 is fixedly connected in common among all the sliding plates 52; an air extraction pipe 510 structure is connected to the hollow plate 51; a plurality of insertion pipes 521 structures communicating with the hollow plate 51 are provided on each sliding plate 52; an air inlet hole 520 structure is opened on each side of the insertion pipe 521 structure of each sliding plate 52 facing the inside of the limit frame 4; the electric control push rod 53 is installed on the workbench 2; the telescopic end of the electric control push rod 53 is fixedly connected with the hollow plate 51; a strip 522 structure is provided on each side of each sliding plate 52 facing the inside of the limit frame 4.

[0021] As Figure 5 shown, a side frame strip 63 is slidably connected to the side of the pressing plate 62; a plurality of compression springs 64 are fixedly connected in common between the side frame strip 63 and the pressing plate 62; a sealing frame strip 65 is provided at the bottom of the side frame strip 63; after the pressing plate 62 is pressed on the limit frame 4, the sealing frame strip 65 is located between the side frame strip 63 and the limit frame 4 to form a sealing structure; a sealing slot 401 structure adapted to the structure of the sealing frame strip 65 is opened on the surface of the limit frame 4.

[0022] First, prepare the laminating equipment of the present invention.

[0023] The staff first externally connect the air extraction pipes 510 of each hollow plate 51 to a vacuum suction machine. Then, the staff operate the externally connected mechanical suction cups to stack each layer of steel plate 8 and circuit board group 9 in the limit frame 4 in sequence, so that the steel plates 8 and the circuit board groups 9 are neatly placed in the limit frame 4 in an alternating stacked state. As Figure 3 shown, the number of steel plates 8 is one more than the number of circuit board groups 9, and the steel plate 8 at the bottom layer is jointly supported by the support plate 3 and the support plate 41 of the limit frame 4. Subsequently, each electric control push rod 53 respectively pushes the corresponding hollow plate 51 to drive the sliding plate 52 to move along the limit frame 4 towards the circuit board group 9, so that the insertion tubes 521 on each sliding plate 52 are respectively aligned with the corresponding circuit board group 9, completing the preparation work.

[0024] After that, perform the hot laminating process of the laminating equipment of the present invention.

[0025] The hydraulic press 61 first drives the pressure plate 62 to press downward on the top-layer steel plate 8. At the same time, the pressure plate 62 drives the side frame strip 63 to press downward against the upper surface of the limit frame 4, and inserts the sealing frame strip 65 at the bottom of the side frame strip 63 into the sealing slot 401 of the limit frame 4. The workbench 2, the support plate 3, the limit frame 4, and the pressure plate 62 jointly form a small air extraction chamber. Then, the hydraulic press 61 continues to push the pressure plate 62 downward to drive the top-layer steel plate 8, and the remaining steel plates 8 and circuit board groups 9 below it to be extruded downward. At the same time, the side frame strip 63 drives the compression spring 64 to be compressed reversely due to the blockage of the limit frame 4.

[0026] During the process of the pressure plate 62 pressing downward on each layer of steel plate 8 and each layer of circuit board group 9, the heating mechanism on the support plate 3 heats each layer of steel plate 8 and each layer of circuit board group 9, so that the PP sheets in each layer of circuit board group 9 are softened to form a high-viscosity molten state during the hot pressing process. The softened PP sheets bond the upper and lower adjacent core boards in the same circuit board group 9 together. At the same time, the externally connected vacuum suction machine successively performs air extraction treatment at the position close to the circuit board group 9 in the small air extraction chamber through the air inlet holes 520 of the hollow plate 51 and the insertion tubes 521, greatly reducing the air extraction range, and each circuit board group 9 can be subjected to air extraction treatment at close range from all four sides, realizing the rapid and efficient removal of residual air from the circuit board group 9.

[0027] On the slide plate 52 of the air extraction mechanism, there is also a stop strip 522 structure for limiting the descending height of the steel plate 8. During the process of the steel plate 8 being pressed down by the pressing plate 62, the descending steel plate 8 will be supported by the stop strip 522 structure below it. Since the height distances between the layers of the stop strips 522 are the same, the pressing strokes received by the circuit board groups 9 between the layers of the steel plates 8 are unified, so that the pressing heights obtained by the circuit board groups 9 have the same effect, and the hot pressing process is completed.

[0028] Embodiment 2 As Figures 1 - 5 shown, the difference from Embodiment 1 is that on the upper and lower surfaces of each steel plate 8 used in this embodiment, a plurality of diversion grooves 801 are respectively opened.

[0029] In this embodiment, after the circuit board group 9 is clamped between the upper and lower adjacent layers of steel plates 8, there are gaps formed by the respective diversion grooves 801 between the circuit board group 9 and the steel plates 8. During the air extraction work of the air extraction mechanism close to the two layers of steel plates 8, the air remaining in the middle of the circuit board group 9 can be pumped outwards through the diversion grooves 801 of the steel plates 8. This not only improves the air extraction effect on the air remaining in the middle of the circuit board group 9, but also speeds up the air extraction speed of all the remaining air in the circuit board group 9, improves the air extraction work efficiency of the circuit board group 9, and realizes the improvement of the hot pressing treatment effect on the circuit board group 9.

[0030] Embodiment 3 As Figures 1 - 7 shown, the difference from Embodiment 1 is that the heating mechanism of this embodiment includes a heat transfer plate 71, a transfer pipe 72, a heat transfer frame strip 73 and a connecting pipe 74; the heat transfer plate 71 is fixedly connected inside the support plate 3; the transfer pipe 72 is connected to the heat transfer plate 71; the heat transfer plate 71 is externally connected to a hot kerosene heat transfer system through the transfer pipe 72, so that the high-temperature hot kerosene transfers heat through the transfer pipe 72 to the heat transfer plate 71 to heat the steel plates 8 and the circuit board groups 9 on the support plate 3; there are heat transfer frame strips 73 with the same number as the steel plates 8 inside the limit frame 4; a storage oil cavity structure is respectively opened in the heat transfer plate 71 and each heat transfer frame strip 73; all the heat transfer frame strips 73 and the heat transfer plate 71 are fixedly connected with a connecting pipe 74 in common; the storage oil cavity structure of the heat transfer plate 71 is connected to the storage oil cavity structures of all the heat transfer frame strips 73 through the connecting pipe 74.

[0031] In this embodiment, the hot kerosene in the external hot kerosene heat transfer system enters the oil storage cavity structure of the heat transfer plate 71 and the oil storage cavity structures of each heat transfer frame bar 73 through the transfer pipeline 72 successively. After each steel plate 8 and the corresponding circuit board group 9 are placed in the limit frame 4, the four side surfaces of each steel plate 8 are respectively in close contact with the four inner walls of the corresponding heat transfer frame bar 73, and the external hot kerosene heat transfer system continuously heats the hot kerosene in the heat transfer plate 71 and each heat transfer frame bar 73. At the same time, the heat transfer plate 71 and each heat transfer frame bar 73 heat each steel plate 8 synchronously, so that each pair of adjacent upper and lower steel plates 8 heat the corresponding circuit board group 9 in multiple directions synchronously. This not only improves the heating efficiency of the steel plates 8 and the circuit board group 9, but also compared with the heating method that generally only relies on heat transfer from the bottom layer by layer upward, this middle-layer synchronous heating method directly transfers heat to the middle layer area, which not only saves the time for heat diffusion and transfer layer by layer, but also enhances the uniformity of heat transfer in all directions of the circuit board group 9, that is, the middle layer is directly heated, and there is no need to consider that the bottom layer needs to set a heat source higher than the target temperature due to heat transfer loss, further improving the hot pressing treatment effect on the circuit board group 9.

[0032] Although the present invention has been described in detail with reference to the above embodiments, it is obvious to those skilled in the art through the present disclosure that various changes or modifications can be made to the present invention without departing from the principle and spirit scope of the present invention defined by the claims. Therefore, the detailed description of the embodiments of the present disclosure is only used to explain, rather than to limit the present invention, and the scope of protection is defined by the content of the claims.

Claims

1. A circuit board pressing device, comprising: a mounting frame (1); a workbench (2) fixedly connected to the mounting frame (1); a support plate (3) connected to the workbench (2); Its characteristics are: It also comprises a limit frame (4), an exhaust mechanism, a hydraulic press (61), a pressing plate (62) and a heating mechanism; the limit frame (4) is fixedly connected to the workbench (2); a support plate (41) structure which is flush with the support plate (3) is provided in the limit frame (4); each of the four sides of the limit frame (4) is connected to an exhaust mechanism; all the exhaust mechanisms are connected to the workbench (2); a hydraulic press (61) is installed on the mounting frame (1); the hydraulic component of the hydraulic press (61) is fixedly connected to the pressing plate (62); and the heating mechanism is connected in the support plate (3).

2. A circuit board pressing device according to claim 1, characterized in that: The support plate (3) is slidably connected to the workbench (2); an electric-controlled lift (31) is installed on the mounting frame (1); and the telescopic end of the electric-controlled lift (31) is fixedly connected to the support plate (3).

3. A circuit board pressing device according to claim 1, characterized in that: The air extraction mechanism comprises a hollow plate (51), a slide plate (52) and an electric control push rod (53); the limit frame (4) is equidistantly slidably connected with slide plates (52) corresponding to the number of the circuit board group (9); the hollow plate (51) is fixedly connected between all the slide plates (52); the hollow plate (51) is connected with an air extraction pipe (510) structure; the slide plate (52) is provided with a plug pipe (521) structure connected with the hollow plate (51); the plug pipe (521) structure of the slide plate (52) is provided with an air inlet hole (520) structure; the electric control push rod (53) is installed on the workbench (2); and the telescopic end of the electric control push rod (53) is fixedly connected to the hollow plate (51).

4. A circuit board pressing device according to claim 3, characterized in that: The slide plate (52) is provided with a stop bar (522) structure for limiting the descending height of the steel plate (8).

5. A circuit board pressing device according to claim 1, characterized in that: A layer of side frame strips (63) is slidably connected to the side of the pressing plate (62); a compression spring (64) is fixedly connected between the side frame strips (63) and the pressing plate (62); and a layer of sealing frame strips (65) is provided at the bottom of the side frame strips (63).

6. A circuit board pressing device according to claim 5, characterized in that: The limiting frame (4) is provided with a sealing slot (401) structure adapted to the structure of the sealing frame strip (65).

7. A circuit board pressing device according to claim 1, characterized in that: A plurality of guide grooves (801) are provided on the surface of the steel plate (8) used.

8. A circuit board pressing device according to claim 1, characterized in that: The heating mechanism comprises a heat transfer plate (71) and a transfer pipe (72); the heat transfer plate (71) is fixedly connected inside the support plate (3); the transfer pipe (72) is connected to the heat transfer plate (71); the heat transfer plate (71) is externally connected to a hot kerosene heat transfer system via the transfer pipe (72), so that the high-temperature hot kerosene transfers heat to the heat transfer plate (71) via the transfer pipe (72) to heat the steel plate (8) and the circuit board group (9) on the support plate (3).

9. A circuit board pressing device according to claim 8, characterized in that: The limiting frame (4) is provided with the same number of heat transfer frame bars (73) as the number of the steel plates (8); an oil storage cavity structure is respectively provided in the heat transfer plate (71) and the heat transfer frame bar (73); a connecting pipe (74) is fixedly connected between all the heat transfer frame bars (73) and the heat transfer plates (71); and the oil storage cavity structure of the heat transfer plate (71) is connected to the oil storage cavity structures of all the heat transfer frame bars (73) via the connecting pipe (74).

10. A circuit board pressing process, the process using a circuit board pressing device according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: preparation for placement, alternately stacking each layer of steel plates (8) and each layer of circuit board groups (9) and placing them in a limiting frame (4), wherein the number of steel plates (8) is one more than the number of circuit board groups (9); Step 2: hot pressing, the pressing plate (62) cooperates with the heating mechanism in the support plate (3) to press each layer of steel plate (8) and each layer of circuit board assembly (9) into the limiting frame (4), and performs hot pressing on the circuit board assembly (9); Step three, close-range vacuuming: based on step two, the vacuuming mechanisms on the four sides of the limiting frame (4) are used to perform close-range vacuuming on the four sides of each layer of the circuit board assembly (9), thereby improving the thermal compression treatment effect on the circuit board assembly (9); Step 4: limit support. On the basis of step 3, the descending height of the steel plate (8) is limited so that the pressing stroke of each layer of the circuit board assembly (9) is uniform.

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