Circuit board pressing process and pressing equipment

Abstract

The present application relates to the field of circuit board processing, especially to a circuit board pressing process and pressing equipment, comprising a workbench and a limiting frame, etc. The present application describes a circuit board pressing equipment, which is composed of a workbench, a supporting plate, a limiting frame and a pressing plate to form a small air extraction chamber. In the process of pressing the stacked steel plates and circuit board groups into the limiting frame, the air extraction mechanism provided on the limiting frame can complete the air extraction process at a close distance to each layer of circuit board group, reducing the air extraction range and quickly and efficiently completing the residual air extraction process for the circuit board group. A structure for limiting the descending height of the steel plate is also provided on the air extraction mechanism, which allows each layer of circuit board group to have consistent pressing height. This overcomes the problem of inconsistent pressing height of each layer of circuit board group caused by different vacuum extraction effects and different PP sheet softening thicknesses during the simultaneous hot pressing process of multiple layers of circuit board group.

Description

Technical Field

[0001] The present invention relates to the field of circuit board processing, and in particular to a circuit board pressing process and pressing equipment. Background Art

[0002] The circuit board assembly is composed of multiple layers of core boards and multiple layers of PP sheets alternately stacked. The polypropylene material used in the PP sheets is a thermoplastic synthetic resin with excellent performance. In the circuit board lamination process, multiple groups of circuit boards are generally stacked in a pressing device, and a steel plate is placed between each upper and lower adjacent layers of circuit board assemblies for isolation. Subsequently, a hot pressing device is used to perform a hot pressing treatment on the stacked layers of circuit board assemblies. The PP sheets are softened during the hot pressing treatment to form a high-viscosity molten state, which bonds the upper and lower adjacent layers of core boards together. At the same time, a vacuuming device is used to vacuum the circuit board assemblies during pressing, so that the remaining air in the circuit board assemblies is extracted to the outside, thereby enhancing the hot pressing treatment effect of the circuit board assemblies. However, since the vacuuming treatment effect of each layer of the circuit board assemblies is different and the thickness of the PP sheets in each circuit board layer after softening is different, it is easy to cause the pressing height of each layer of the circuit board assemblies to be inconsistent. Summary of the Invention

[0003] In order to overcome the disadvantage of non-uniform pressing heights of various layers of a circuit board assembly due to the influence of different vacuum treatment effects and different softening thicknesses of PP sheets during the simultaneous hot pressing of a multi-layer circuit board assembly, the present invention provides a circuit board pressing process and pressing equipment.

[0004] A circuit board pressing device includes a mounting frame, a workbench, a support plate, a limit frame, an exhaust mechanism, a hydraulic press, a pressing plate and a heating mechanism; the mounting frame is fixedly connected to the workbench; the support plate is connected to the workbench; the limit frame is fixedly connected to the workbench; a support plate structure that is flush with the support plate is provided in the limit frame; an exhaust mechanism is connected to each of the four sides of the limit frame; all the exhaust mechanisms are connected to the workbench; a hydraulic press is installed on the mounting frame; the hydraulic component of the hydraulic press is fixedly connected to the pressing plate; and the supporting plate is connected to the heating mechanism.

[0005] As an improvement to the above solution, the support plate is slidably connected to the workbench; an electric-controlled lift is installed on the mounting frame; and the telescopic end of the electric-controlled lift is fixedly connected to the support plate.

[0006] As an improvement to the above scheme, the exhaust mechanism includes a hollow plate, a slide plate and an electric control push rod; slide plates corresponding to the number of circuit board groups are equidistantly connected to the limit frame for sliding connection; a hollow plate is fixedly connected between all the slide plates; an exhaust pipe structure is connected to the hollow plate; a plug structure connected to the hollow plate is provided on the slide plate; an air inlet hole structure is provided in the plug structure of the slide plate; an electric control push rod is installed on the workbench; the telescopic end of the electric control push rod is fixedly connected to the hollow plate.

[0007] As an improvement to the above solution, the slide plate is provided with a barrier structure for limiting the descending height of the steel plate.

[0008] As an improvement to the above solution, a layer of side frame strips is slidably connected to the side of the pressure plate; a compression spring is fixed between the side frame strips and the pressure plate; and a layer of sealing frame strips is provided at the bottom of the side frame strips.

[0009] As an improvement to the above solution, the limiting frame is provided with a sealing slot structure adapted to the sealing frame strip structure.

[0010] As an improvement to the above solution, a plurality of guide grooves are provided on the surface of the steel plate used.

[0011] As an improvement to the above solution, the heating mechanism includes a heat transfer plate and a transfer pipe; the heat transfer plate is fixedly connected to the support plate; the transfer pipe is connected to the heat transfer plate; the heat transfer plate is connected to an external hot kerosene heat transfer system through the transfer pipe, allowing the high-temperature hot kerosene to transfer heat through the transfer pipe to the heat transfer plate to heat the steel plate and circuit board group on the support plate.

[0012] As an improvement to the above solution, the limiting frame is provided with the same number of heat transfer bars as the steel plates; the heat transfer plates and the heat transfer bars are each provided with an oil storage cavity structure; a connecting pipe is fixedly connected between all the heat transfer bars and the heat transfer plates; the oil storage cavity structure of the heat transfer plate is connected to the oil storage cavity structures of all the heat transfer bars through the connecting pipe.

[0013] A circuit board pressing process includes the following steps:

[0014] Step 1: Placement preparation: alternately stack the steel plates and the circuit board groups in the limiting frame, with the number of steel plates being one more than the number of circuit board groups;

[0015] Step 2: Hot pressing: the pressing plate cooperates with the heating mechanism in the support plate to press each layer of steel plate and each layer of circuit board assembly into the limit frame, and performs hot pressing on the circuit board assembly;

[0016] Step 3: Close-range vacuuming: Based on step 2, the vacuum mechanisms on the four sides of the limiting frame are used to perform close-range vacuuming on the four sides of each layer of the circuit board assembly to improve the thermal compression treatment effect of the circuit board assembly;

[0017] Step 4: Limit support. Based on step 3, limit the descending height of the steel plate to make the pressing stroke of each layer of circuit board group uniform.

[0018] The present invention describes a circuit board pressing process and pressing equipment, which are composed of a workbench, a support plate, a limit frame and a pressing plate to form a small exhaust chamber. When the pressing plate presses the stacked layers of steel plates and circuit board groups into the limit frame, the exhaust mechanism provided on the limit frame can complete the exhaust treatment at close range close to the layers of circuit board groups, reducing the exhaust range and quickly and efficiently completing the residual air exhaust treatment work for the circuit board groups. The exhaust mechanism is also provided with a structure for limiting the descending height of the steel plates, so that the pressing stroke of the circuit board groups between the layers of steel plates is unified, so that the pressing heights obtained by the circuit board groups of each layer have a consistent effect.

[0019] The circuit board pressing process and pressing equipment of the present invention overcome the disadvantage that, during the simultaneous hot pressing process of a multi-layer circuit board group, the pressing height of each layer of the circuit board group is not uniform due to the influence of different vacuum treatment effects and different softening thicknesses of PP sheets. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A perspective view for describing the present invention;

[0021] Figure 2 A perspective view of a support plate for describing the present invention;

[0022] Figure 3 A cross-sectional view of a limiting frame for describing the present invention;

[0023] Figure 4 A partial perspective view of a skateboard for describing the present invention;

[0024] Figure 5 A perspective view of a pressing plate for describing the present invention;

[0025] Figure 6 A perspective view of the heating mechanism of the present invention is provided;

[0026] Figure 7 A perspective view of the heat transfer frame strip for describing the present invention.

[0027] Numbers in the figure: 1-mounting frame, 2-workbench, 3-support plate, 31-electrically controlled lift, 4-limiting frame, 401-sealing slot, 41-support plate, 51-hollow plate, 510-exhaust pipe, 52-slide plate, 520-air inlet, 521-insertion pipe, 522-blocking bar, 53-electrically controlled push rod, 61-hydraulic press, 62-pressing plate, 63-side frame bar, 64-compression spring, 65-sealing frame bar, 71-heat transfer plate, 72-transfer pipe, 73-heat transfer frame bar, 74-connecting pipe, 8-steel plate, 801-guide groove, 9-circuit board group. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Example 1

[0030] A circuit board pressing device, such as Figure 1-Figure 5 As shown, it includes a mounting frame 1, a workbench 2, a support plate 3, a limit frame 4, an exhaust mechanism, a hydraulic press 61, a pressing plate 62 and a heating mechanism; the workbench 2 is fixedly connected to the mounting frame 1; the support plate 3 is slidably connected to the middle of the workbench 2; an electric lift 31 is installed on the mounting frame 1; the telescopic end of the electric lift 31 is fixedly connected to the support plate 3; the workbench 2 is fixedly connected to the limit frame 4; the lower side of the limit frame 4 is provided with a support plate 41 structure that is flush with the height of the support plate 3; after the pressing work is completed, the electric lift 31 can automatically push the support plate 3 to drive the circuit board groups 9 and adjacent steel plates 8 of each layer that have completed the pressing process to rise upward, so that the staff can directly take the steel plates 8 and the circuit board groups 9 out of the limit frame 4; an exhaust mechanism is connected to each of the four sides of the limit frame 4; all the exhaust mechanisms are connected to the workbench 2; a hydraulic press 61 is installed on the mounting frame 1; the hydraulic component of the hydraulic press 61 is fixedly connected to the pressing plate 62; and a heating mechanism is connected inside the support plate 3.

[0031] like Figure 2-Figure 4 As shown, the exhaust mechanism includes a hollow plate 51, a slide plate 52 and an electric control push rod 53; the slide plates 52 corresponding to the number of the circuit board groups 9 are equidistantly connected to the limit frame 4; the hollow plate 51 is fixedly connected between all the slide plates 52; the hollow plate 51 is connected to an exhaust pipe 510 structure; each slide plate 52 is provided with a plurality of insert tubes 521 structures connected to the hollow plate 51; an air inlet hole 520 structure is provided in the insert tube 521 structure of each slide plate 52 on the side facing the inside of the limit frame 4; an electric control push rod 53 is installed on the workbench 2; the telescopic end of the electric control push rod 53 is fixedly connected to the hollow plate 51; each slide plate 52 is provided with a retaining bar 522 structure on the side facing the inside of the limit frame 4.

[0032] like Figure 5 As shown, the side of the pressure plate 62 is slidably connected to a layer of side frame strips 63; a number of compression springs 64 are fixedly connected between the side frame strips 63 and the pressure plate 62; a layer of sealing frame strips 65 is provided at the bottom of the side frame strips 63, and after the pressure plate 62 is pressed onto the limit frame 4, the sealing frame strips 65 are located between the side frame strips 63 and the limit frame 4 to form a sealing structure; a sealing slot 401 structure adapted to the structure of the sealing frame strips 65 is provided on the surface of the limit frame 4.

[0033] First, the preparation work of a circuit board pressing equipment of the application is carried out.

[0034] The staff first connects the air exhaust pipe 510 of each hollow plate 51 to the external vacuum pump, and then controls the external mechanical suction cup to stack the steel plates 8 and the circuit board group 9 in the limiting frame 4 in turn, so that the steel plates 8 and the circuit board group 9 are placed in the limiting frame 4 in an alternating stacked state, as shown in Figure 3 The number of steel plates 8 is one more than the number of circuit board groups 9, and the steel plate 8 at the bottom is supported by the supporting plate 3 and the supporting plate 41 of the limiting frame 4, and then each electric control push rod 53 pushes the corresponding hollow plate 51 to drive the sliding plate 52 to move along the limiting frame 4 towards the circuit board group 9, so that the insertion pipe 521 on each sliding plate 52 is aligned with the corresponding circuit board group 9, and the preparation work is completed.

[0035] Then, the hot pressing treatment work of a circuit board pressing equipment of the application is carried out.

[0036] The hydraulic machine 61 first drives the pressing plate 62 to press down on the top layer of steel plates 8, and at the same time the pressing plate 62 drives the side frame 63 to be attached to the upper surface of the limiting frame 4, and the sealing frame 65 at the bottom of the side frame 63 is inserted into the sealing slot 401 of the limiting frame 4, and the workbench 2, the supporting plate 3, the limiting frame 4 and the pressing plate 62 together form a small air exhaust chamber, and then the hydraulic machine 61 continues to push the pressing plate 62 to drive the top layer of steel plates 8 and the remaining layers of steel plates 8 and circuit board groups 9 below to be extruded downward, and at the same time the side frame 63 is blocked by the limiting frame 4 and drives the compression spring 64 to be compressed in the opposite direction.

[0037] During the process of extruding the layers of steel plates 8 and the layers of circuit board groups 9 by the pressing plate 62, the heating mechanism on the supporting plate 3 heats the layers of steel plates 8 and the layers of circuit board groups 9, so that the PP sheet in each layer of circuit board group 9 is softened to form a high-viscosity molten state in the hot pressing process, and the softened PP sheet adheres the upper and lower adjacent two layers of core plates in the same circuit board group 9 together, and the external vacuum pump first passes through the air inlet hole 520 of the hollow plate 51 and the insertion pipe 521 to perform air exhaust treatment at the position close to the circuit board group 9 in the small air exhaust chamber, which greatly reduces the air exhaust range, and each circuit board group 9 can be subjected to close air exhaust treatment from four sides, achieving fast and efficient residual air exhaust treatment of the circuit board group 9.

[0038] A baffle 522 structure is also provided on the slide 52 of the exhaust mechanism to limit the descending height of the steel plate 8. When the steel plate 8 is pressed down by the pressing plate 62, the downwardly moving steel plate 8 will be supported by the baffle 522 structure below it. Since the height distances between the baffles 522 of each layer are consistent, the pressing strokes of the circuit board groups 9 between each layer of steel plates 8 are unified, so that the pressing heights obtained by each layer of circuit board groups 9 have a consistent effect, completing the hot pressing process.

[0039] Example 2

[0040] like Figure 1-Figure 5 As shown, the difference from Example 1 is that a plurality of guide grooves 801 are respectively provided on the upper surface and the lower surface of each steel plate 8 used in this embodiment.

[0041] In this embodiment, after the circuit board group 9 is clamped between the upper and lower adjacent layers of steel plates 8, a gap formed by various guide grooves 801 remains between the circuit board group 9 and the steel plates 8. When the exhaust mechanism is close to the two layers of steel plates 8 to perform exhaust work, the air remaining in the middle of the circuit board group 9 can be exhausted outward through the guide grooves 801 of the steel plates 8, which not only improves the exhaust effect of the residual air in the middle of the circuit board group 9, but also speeds up the exhaust speed of all residual air in the circuit board group 9, thereby improving the exhaust work efficiency of the circuit board group 9 and improving the heat pressing treatment effect of the circuit board group 9.

[0042] Example 3

[0043] like Figure 1-Figure 7 As shown, the difference from Example 1 is that the heating mechanism of this embodiment includes a heat transfer plate 71, an adapter pipe 72, a heat transfer frame bar 73 and a connecting pipe 74; the heat transfer plate 71 is fixedly connected to the support plate 3; the adapter pipe 72 is connected to the heat transfer plate 71; the heat transfer plate 71 is connected to the hot kerosene heat transfer system through the adapter pipe 72, allowing the high-temperature hot kerosene to transfer heat to the heat transfer plate 71 through the adapter pipe 72, thereby heating the steel plate 8 and the circuit board assembly 9 on the support plate 3; the limiting frame 4 is provided with the same number of heat transfer frames 73 as the steel plates 8; the heat transfer plate 71 and each heat transfer frame bar 73 each have an oil storage cavity structure; a connecting pipe 74 is fixedly connected between all the heat transfer frames 73 and the heat transfer plate 71; the oil storage cavity structure of the heat transfer plate 71 is connected to the oil storage cavity structures of all the heat transfer frames 73 through the connecting pipe 74.

[0044] In this embodiment, the hot kerosene in the external hot kerosene heat transfer system enters the oil storage cavity structure of the heat transfer plate 71 and the oil storage cavity structure of each heat transfer frame bar 73 through the adapter pipe 72. After each steel plate 8 and the corresponding circuit board group 9 are placed in the limit frame 4, the four side surfaces of each steel plate 8 are respectively in close contact with the four inner walls of the corresponding heat transfer frame bar 73. The external hot kerosene heat transfer system continuously heats the hot kerosene in the heat transfer plate 71 and each heat transfer frame bar 73. At the same time, the heat transfer plate 71 and each heat transfer frame bar 73 heat each steel plate 8 synchronously, so that each upper and lower adjacent steel plate 8 is heated. The two layers of steel plates 8 simultaneously perform multi-directional heating treatment on the corresponding circuit board group 9, which not only speeds up the heating efficiency of the steel plates 8 and the circuit board group 9, but also compared with the general heating method that can only rely on heat to be transferred from the bottom layer to the top layer, this middle-layer synchronous heating method allows heat to be directly transferred to the middle layer area, which not only saves the time of heat diffusion and transfer layer by layer, but also enhances the uniformity of all-directional heat transfer to the circuit board group 9, that is, the middle layer is directly heated, and there is no need to consider the heat transfer loss that causes the bottom layer to need to set a heat source higher than the target temperature, thereby further improving the heat pressing treatment effect of the circuit board group 9.

[0045] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art from this disclosure that various changes or modifications may be made to the present invention without departing from the principles and spirit of the invention as defined in the claims. Therefore, the detailed description of the disclosed embodiments is intended to be illustrative only and not to limit the present invention, which is to be defined by the claims.

Claims

1. A circuit board pressing device, comprising: a mounting frame (1); a workbench (2) fixedly connected to the mounting frame (1); a support plate (3) connected to the workbench (2); Its characteristics are: It also includes a limit frame (4), an air extraction mechanism, a hydraulic press (61), a pressure plate (62) and a heating mechanism; the limit frame (4) is fixedly connected to the workbench (2); a support plate (41) structure that is flush with the height of the support plate (3) is provided in the limit frame (4); a suction mechanism is connected to each of the four sides of the limit frame (4); all the suction mechanisms are connected to the workbench (2); a hydraulic press (61) is installed on the mounting frame (1); the hydraulic component of the hydraulic press (61) is fixedly connected to the pressure plate (62); and a heating mechanism is connected in the support plate (3); The air extraction mechanism comprises a hollow plate (51), a slide plate (52) and an electric control push rod (53); slide plates (52) corresponding to the number of the circuit board group (9) are equidistantly slidably connected to the limit frame (4); the hollow plate (51) is fixedly connected to all the slide plates (52); an air extraction pipe (510) structure is connected to the hollow plate (51); a plug (521) structure connected to the hollow plate (51) is provided on the slide plate (52); an air inlet (520) structure is opened in the plug (521) structure of the slide plate (52); an electric control push rod (53) is installed on the workbench (2); and the telescopic end of the electric control push rod (53) is fixedly connected to the hollow plate (51).

2. A circuit board pressing device according to claim 1, characterized in that: The support plate (3) is slidably connected to the workbench (2); an electric-controlled lift (31) is installed on the mounting frame (1); and the telescopic end of the electric-controlled lift (31) is fixedly connected to the support plate (3).

3. A circuit board pressing device according to claim 1, characterized in that: The slide plate (52) is provided with a stop bar (522) structure for limiting the descending height of the steel plate (8).

4. A circuit board pressing device according to claim 1, characterized in that: A side frame strip (63) is slidably connected to the side of the pressure plate (62); a compression spring (64) is fixedly connected between the side frame strip (63) and the pressure plate (62); and a sealing frame strip (65) is provided at the bottom of the side frame strip (63).

5. A circuit board pressing device according to claim 4, characterized in that: The limiting frame (4) is provided with a sealing slot (401) structure adapted to the structure of the sealing frame strip (65).

6. The circuit board pressing device according to claim 1, characterized in that: A plurality of guide grooves (801) are provided on the surface of the steel plate (8) used.

7. The circuit board pressing device according to claim 1, characterized in that: The heating mechanism includes a heat transfer plate (71) and a transfer pipe (72); the heat transfer plate (71) is fixedly connected to the support plate (3); the transfer pipe (72) is connected to the heat transfer plate (71); the heat transfer plate (71) is connected to a hot kerosene heat transfer system through the transfer pipe (72), so that the high-temperature hot kerosene transfers heat through the transfer pipe (72) to the heat transfer plate (71) to heat the steel plate (8) and the circuit board group (9) on the support plate (3).

8. A circuit board pressing device according to claim 7, characterized in that: The limiting frame (4) is provided with the same number of heat transfer frame bars (73) as the number of the steel plates (8); an oil storage cavity structure is respectively provided in the heat transfer plate (71) and the heat transfer frame bar (73); a connecting pipe (74) is fixedly connected between all the heat transfer frame bars (73) and the heat transfer plate (71); the oil storage cavity structure of the heat transfer plate (71) is connected to the oil storage cavity structures of all the heat transfer frame bars (73) through the connecting pipe (74).

9. A circuit board pressing process, the process using a circuit board pressing device according to any one of claims 1 to 8, characterized in that: The following steps are included: Step 1: preparation for placement, alternately stacking the layers of steel plates (8) and the layers of circuit board groups (9) and placing them in the limiting frame (4), with the number of steel plates (8) being one more than the number of circuit board groups (9); Step 2: hot pressing. The pressing plate (62) cooperates with the heating mechanism in the support plate (3) to press each layer of steel plate (8) and each layer of circuit board assembly (9) into the limit frame (4), and performs hot pressing on the circuit board assembly (9); Step three, close-range vacuuming: based on step two, the vacuuming mechanisms on the four sides of the limit frame (4) are used to perform close-range vacuuming on the four sides of each layer of the circuit board assembly (9), thereby improving the thermal compression treatment effect on the circuit board assembly (9); Step 4: Limit support. On the basis of step 3, the descending height of the steel plate (8) is limited so that the pressing stroke of each layer of the circuit board group (9) is unified.

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