Electronic equipment adopting immersed liquid cooling mode and electronic module thereof

Abstract

The invention discloses electronic equipment adopting an immersed liquid cooling mode and an electronic module thereof. The electronic equipment comprises a shell, a fan device and the electronic module, the electronic module comprises a container unit, a cover plate, a radiator, a first heat source module and a second heat source module. The container unit is located in the machine shell and provided with an immersion groove. And non-conductive cooling liquid is contained in the immersion tank. The cover plate covers the immersion tank in a sealed manner and is provided with an electric conductive connection part which is arranged on the cover plate in a penetrating manner. The radiator is connected to the outside of the container unit. The first heat source module is fixed in the immersion tank, immersed in the cooling liquid, electrically connected with the electric conduction part and thermally connected with the radiator through the container unit. The second heat source module is located outside the immersion tank and is electrically connected with the first heat source module through the electric conduction connection part. The fan device is located in the machine shell and used for conveying airflow towards the radiator and taking away heat energy of the radiator. According to the electronic equipment, the volume of the container unit and the cost of consumables such as cooling liquid can be reduced, so that the maximum heat dissipation efficiency is generated on the basis of reasonable equipment investment cost.

Description

Technical Field

[0001] The present invention relates to an electronic device, particularly an electronic device and its electronic module adopting an immersion liquid cooling mode. Background Art

[0002] Immersion cooling technology is to immerse the entire architecture (such as a motherboard, a disk array, etc.) containing heat generating elements in a non-conductive coolant to remove the heat energy generated by the operation of the heat generating elements through the coolant.

[0003] However, it will be quite space-consuming in the chassis and costly in terms of consumables such as coolant to set up a cooling water tank in the chassis that can accommodate the above entire architecture. Therefore, how to achieve at least the expected ratio of heat dissipation efficiency and equipment input cost under immersion cooling technology has always been a problem to be solved in the industry.

[0004] It can be seen that the above technology obviously still has inconveniences and defects, which are urgent problems to be solved in this industry. Summary of the Invention

[0005] An object of the present invention is to provide an electronic device and its electronic module adopting an immersion liquid cooling mode to solve the difficulties mentioned in the above prior art.

[0006] An embodiment of the present invention provides an electronic device adopting an immersion liquid cooling mode. The electronic device includes a chassis, a power supply, a fan device, and an electronic module. The chassis has an internal space. The power supply is located in the internal space. The electronic module includes a container unit, a cover plate, a radiator, a first heat source module, and a second heat source module. The container unit includes a container body and an immersion tank. The container body is located in the internal space, and the immersion tank is formed on one side of the container body and contains a non-conductive coolant. The cover plate includes a cover body and a conductive connection part. The cover body hermetically covers the container body and the immersion tank, and the conductive connection part is penetrated through the cover body. The radiator is connected to the outside of the container body. The first heat source module is fixed in the immersion tank and at least partially immersed in the coolant, electrically connected to the conductive connection part, and thermally connected to the radiator through the container body. The second heat source module is located outside the immersion tank, electrically connected to the power supply, and electrically connected to the first heat source module through the conductive connection part. The fan device is located in the internal space, electrically connected to the power supply, and used to deliver air flow towards the radiator and take away the heat energy of the radiator.

[0007] According to one or more embodiments of the present invention, in the above electronic device, the cover body is located between the first heat source module and the second heat source module.

[0008] According to one or more embodiments of the present invention, in the above electronic device, the radiator is integrally formed on the side of the container body facing away from the cover body.

[0009] According to one or more embodiments of the present invention, in the above-mentioned electronic device, the electronic module further includes at least one heat dissipation fin located on the cover.

[0010] According to one or more embodiments of the present invention, in the above-mentioned electronic device, the heat dissipation fins are fixedly disposed on a side of the cover body facing away from the immersion tank, and extend in a direction facing away from the immersion tank.

[0011] According to one or more embodiments of the present invention, in the above-mentioned electronic device, the heat dissipation fins are fixedly disposed on a side of the cover body facing the immersion tank and extend into the immersion tank.

[0012] According to one or more embodiments of the present invention, in the above-mentioned electronic device, the cover plate further includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion and the second electrical connection portion are respectively located on two opposite surfaces of the cover body, and are respectively connected to the electrical conductive portion, the first electrical connection portion is electrically connected to the first heat source module, the second electrical connection portion is electrically connected to the second heat source module, and is staggered with the heat dissipation fins, wherein the heat dissipation fins are located on the long side of the cover plate.

[0013] According to one or more embodiments of the present invention, in the above-mentioned electronic device, the container body further includes an outlet and an inlet, which are formed on the side wall of the container body and are respectively connected to the immersion tank, wherein the outlet is located between the inlet and the cover.

[0014] According to one or more embodiments of the present invention, the electronic device further comprises a liquid cooling switch, which is connected to the immersion tank through an outlet and an inlet to receive and send cooling liquid in the immersion tank.

[0015] According to one or more embodiments of the present invention, in the electronic device described above, the housing further comprises a partition plate, a first tube body and a second tube body, the partition plate is fixed in the internal space, and the internal space is divided into an upper layer area and a lower layer area stacked on each other. The liquid cooling switch is fixed in the lower layer area, and the electronic module is fixed in the upper layer area, the first tube body is respectively connected to the inlet and the liquid cooling switch, and the second tube body is respectively connected to the outlet and the liquid cooling switch.

[0016] One embodiment of the present invention provides an electronic module. The electronic module includes a container unit, a cover plate, a heat sink, a first heat source module and a second heat source module. The container unit includes a container body and an immersion tank. The immersion tank is formed on one side of the container body and is used to hold a non-conductive coolant. The cover plate includes a cover body and an electrical conductive connection portion. The cover body tightly covers the container body and the immersion tank, and the electrical conductive connection portion is disposed on the cover body. The heat sink is connected to the outside of the container body. The first heat source module is fixed in the immersion tank, at least partially immersed in the coolant, electrically connected to the electrical conductive connection portion, and thermally connected to the heat sink through the container body. The second heat source module is located outside the immersion tank and is electrically connected to the first heat source module through the electrical conductive connection portion.

[0017] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the cover is located between the first heat source module and the second heat source module.

[0018] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the heat sink is integrally formed on a side of the container body facing away from the cover body.

[0019] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the electronic module further includes at least one heat dissipation fin, and the heat dissipation fin is located on the cover.

[0020] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the heat dissipation fins are fixedly disposed on a side of the cover body facing away from the immersion tank, and extend in a direction facing away from the immersion tank.

[0021] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the heat dissipation fins are fixedly disposed on a side of the cover body facing the immersion tank and extend into the immersion tank.

[0022] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the cover plate further includes a first electrical connection portion and a second electrical connection portion. The first electrical connection portion and the second electrical connection portion are respectively located on two opposite surfaces of the cover body and are respectively connected to the electrical conductive connection portion, the first electrical connection portion is electrically connected to the first heat source module, the second electrical connection portion is electrically connected to the second heat source module, and is staggered with the heat dissipation fins, wherein the heat dissipation fins are located on the long side of the cover body.

[0023] According to one or more embodiments of the present invention, in the above-mentioned electronic module, the container body further includes an outlet and an inlet, which are formed on the side wall of the container body and are respectively connected to the immersion tank, wherein the outlet is located between the inlet and the cover.

[0024] Thus, through the above structure, the electronic device of this case and its electronic module using immersion liquid cooling mode can reduce the volume of container units and the cost of consumables such as coolant, thereby achieving maximum heat dissipation efficiency based on reasonable equipment investment costs.

[0025] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0027] Figure 1 is a side view of an electronic module according to an embodiment of the present invention;

[0028] Figure 2 Side view of an electronic module for Figure 1 ;

[0029] Figure 3 Side view of an electronic module according to an embodiment of the present invention;

[0030] Figure 4 Side view of an electronic module according to an embodiment of the present invention;

[0031] Figure 5 Top view of an electronic module according to an embodiment of the present invention;

[0032] Figure 6A Is Figure 5 The cross-sectional view taken along the line AA in;

[0033] Figure 6B Is Figure 5 The cross-sectional view taken along the line BB in;

[0034] Figure 7 Side view of an electronic device according to an embodiment of the present invention;

[0035] Figure 8 Side view of an electronic device according to an embodiment of the present invention;

[0036] Figure 9 Side view of an electronic device according to an embodiment of the present invention.

[0037]

Symbol Explanation

[0038] 10, 11, 12: Electronic device

[0039] 100: Housing

[0040] 110: Internal space

[0041] 120: Air inlet

[0042] 130: Air outlet

[0043] 140: Partition board

[0044] 150: Upper layer area

[0045] 160: Lower layer area

[0046] 170: First pipe body

[0047] 180: Second pipe body

[0048] 200: Power supply

[0049] 300: Fan device

[0050] 400: Liquid cooling exchanger

[0051] 500, 501, 502, 503, 504: Electronic module

[0052] 510: Container unit

[0053] 511: Container body

[0054] 511T: Top surface

[0055] 511B: Bottom surface

[0056] 512: Immersion tank

[0057] 513: Outlet section

[0058] 514: Inlet section

[0059] 520: Cover plate

[0060] 521, 525: Cover body

[0061] 521A: First side

[0062] 521B: Second side

[0063] 522: Long side

[0064] 523, 524: Conductive connection part

[0065] 530: First electrical connection part

[0066] 540: Second electrical connection part

[0067] 550, 560: Heat dissipation fins

[0068] 551: First heat dissipation fin

[0069] 561: Second heat dissipation fin

[0070] 570: Radiator

[0071] 571: Base

[0072] 572: Fin body

[0073] 573: Channel

[0074] 580: First heat source module

[0075] 590: Second heat source module

[0076] AA, BB: Line segment

[0077] C: Cooling liquid

[0078] G: Spacing area

[0079] R1, R2: Airflow

[0080] W: Conductive wire

[0081] X, Y, Z: Axes Detailed implementation manners

[0082] Multiple embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details are not used to limit the present invention. That is to say, in one embodiment of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.

[0083] Figure 1 It is a side view of an electronic module 500 according to an embodiment of the present invention. Figure 2 is Figure 1 a side view of the electronic module 500. In this embodiment, as shown in Figure 1 and Figure 2 , an electronic module 500 adopting an immersion liquid cooling mode includes a container unit 510, a cover plate 520, a radiator 570, a first heat source module 580, and a second heat source module 590. The container unit 510 includes a container body 511 and an immersion tank 512. The immersion tank 512 is formed on one side of the container body 511, and a non-conductive coolant C is contained therein. In this embodiment, the coolant C fills or almost fills the immersion tank 512. The cover plate 520 includes a cover body 521 and a plurality of electrical connection portions 523. The cover body 521 hermetically covers the container body 511 and the immersion tank 512. These electrical connection portions 523 are spaced apart on the cover body 521, and each electrical connection portion 523 penetrates through the cover body 521. The cover body 521 includes a first surface 521A and a second surface 521B opposite to each other. Two ends of each electrical connection portion 523 are respectively connected to the first surface 521A and the second surface 521B of the cover body 521. The radiator 570 is connected to the outside of the container body 511. The first heat source module 580 is fixed in the immersion tank 512 and is immersed in the coolant C. The first heat source module 580 is electrically connected to these electrical connection portions 523 and is thermally connected to the radiator 570 through the container body 511. The second heat source module 590 is located outside the immersion tank 512 and is electrically connected to the first heat source module 580 located in the immersion tank 512 through these electrical connection portions 523 of the cover body 521.

[0084] Thus, when the first heat source module 580 operates, the heat energy of the first heat source module 580 is evenly distributed in the coolant C, and then transferred from the container body 511 to the radiator 570, so as to be diffused into the air by the radiator 570 to achieve the purpose of heat dissipation and temperature reduction.

[0085] More specifically, in the present embodiment, the power of the first heat source module 580 (i.e., the degree of heat generation) is greater than the power of the second heat source module 590 (i.e., the degree of heat generation). For example, the first heat source module 580 is, for example, a power switching module (such as a metal oxide semiconductor field effect transistor, MOSFET), and the second heat source module 590 is, for example, passive components such as capacitors and inductors. However, the present invention is not limited thereto.

[0086] In the present embodiment, the combination of the cover 521 and the container body 511 can make the immersion tank 512 a closed tank, that is, the immersion tank 512 is not in communication with the outside. However, the present invention is not limited thereto. For example, the container body 511 is in the shape of a rectangular body, and the cover 521 is located on the side of the container body 511 having the immersion tank 512 (hereinafter referred to as the top surface 511T). The first surface 521A of the cover 521 directly covers and contacts the top surface 511T of the container body 511.

[0087] In the present embodiment, the cover 521 is located between the first heat source module 580 and the second heat source module 590. For example, the cover 521 is in the shape of a flat plate and is directly fixed between the first heat source module 580 and the second heat source module 590. In other words, the first heat source module 580 is locked to the cover plate 520 and is directly clamped between the cover 521 and the inner wall of the immersion tank 512, so as to quickly conduct heat energy to the radiator 570. The second heat source module 590 is locked to the cover plate 520 and receives the load of the cover plate 520, so as to smoothly exchange signals with the first heat source module 580. However, the present invention is not limited thereto. The first heat source module 580 is located in the immersion tank 512 and directly contacts the cover 521 and the inner wall of the immersion tank 512.

[0088] Furthermore, the cover plate 520 is a circuit board, including a plurality of first electrical connection portions 530 and second electrical connection portions 540. The first electrical connection portions 530 and the second electrical connection portions 540 are respectively located on two opposite surfaces of the cover 521 and are respectively connected to these electrical connection portions 523. The electrical connection portions 523 are, for example, vias. The first electrical connection portions 530 directly contact the first heat source module 580, and the second electrical connection portions 540 directly contact the second heat source module 590. However, the present invention is not limited thereto. In other embodiments, the cover plate 520 may also be an adapter board or a combination of a circuit board and an adapter board.

[0089] In the present embodiment, the radiator 570 is located on the side of the container body 511 opposite to the cover 521 (hereinafter referred to as the bottom surface 511B), and the radiator 570 is integrally formed on the bottom surface 511B of the container body 511. For example, the radiator 570 is a fin group. The fin group can be matched with various heat sinks (such as aluminum extrusion or milling, etc.). However, the present invention is not limited thereto. In other embodiments, the radiator 570 can be a heat pipe or a tower type, etc.

[0090] Figure 3 A side view of the electronic module 501 according to an embodiment of the present invention. The electronic module 501 of this embodiment is substantially the same as the electronic module 500 of the above embodiment, except that, as Figure 3 shown, the electronic module 501 further includes at least one heat dissipation fin 550. The heat dissipation fin 550 is made on the cover plate 520 and is located outside the immersion tank 512. In this embodiment, more specifically, the heat dissipation fin 550 is fixedly provided on the side of the cover body 525 facing away from the immersion tank 512 (such as the second surface 521B) and extends in the direction away from the immersion tank 512 (such as the Z-axis) to accelerate the removal of part of the heat energy of the first heat source module 580 and the second heat source module 590.

[0091] In addition, compared with Figure 1 the cover plate 520 of which is a circuit board, the cover plate 520 of this embodiment is an adapter board. Wherein the cover body 525 is, for example, a rigid substrate (such as a metal or plastic substrate), and the electrical connection portion 524 is, for example, a metal column passing through two opposite surfaces of the rigid substrate (such as the first surface 521A and the second surface 521B). Both ends of the metal column are exposed outside the rigid substrate and are respectively electrically connected to the first heat source module 580 and the second heat source module 590. That is to say, compared with the characteristics of the circuit board, the surface of the adapter board does not have a layout circuit, a first electrical connection portion 530 and a second electrical connection portion 540.

[0092] However, the present invention is not limited thereto. In other embodiments, the cover plate 520 may also be a combination of a rigid substrate and a circuit board, for example, the circuit board is integrated onto the rigid substrate.

[0093] Figure 4 A side view of the electronic module 502 according to an embodiment of the present invention. As Figure 4 shown, the electronic module 502 of this embodiment is substantially the same as the above Figure 3 electronic module 500, except that the heat dissipation fin 560 is located inside the immersion tank 512. In this embodiment, more specifically, the heat dissipation fin 560 is fixedly provided on the side of the cover body 521 facing the immersion tank 512 (such as the first surface 521A) and extends into the immersion tank 512 to accelerate the removal of part of the heat energy of the second heat source module 590.

[0094] In addition, in this embodiment, there is a spacer G between the first heat source module 580 and the cover body 521, and the heat dissipation fin 560 located in the spacer G extends from the cover body 521 towards the first heat source module 580 to accelerate the removal of part of the heat energy of the first heat source module 580 and the second heat source module 590. The cover plate 520 of this embodiment is a circuit board, and the circuit board is electrically connected to the first heat source module 580 through a wire W.

[0095] Figure 5FIG. 5 is a top view of an electronic module 503 according to an embodiment of the present invention. Figure 6A for Figure 5 A cross-sectional view taken along line segment AA. Figure 6B for Figure 5 The electronic module 503 of this embodiment is substantially the same as the electronic module 501 of the above embodiment, and the difference is that Figures 5 to 6B As shown, the heat dissipation fins include a plurality of first heat dissipation fins 551 and a plurality of second heat dissipation fins 561. The first heat dissipation fins 551 and the second heat dissipation fins 561 are respectively fixedly disposed on two opposite surfaces of the cover 521 (such as the first surface 521A and the second surface 521B). More specifically, the first heat dissipation fins 551 are located on a side of the cover 521 facing the immersion tank 512 (such as the first surface 521A), and are staggered with the first electrical connection portion 530, and the second heat dissipation fins 561 are located on a side of the cover 521 facing away from the immersion tank 512 (such as the second surface 521B), and are staggered with the second electrical connection portion 540. The first heat dissipation fins 551 and the second heat dissipation fins 561 are respectively located on the long sides of the cover 521.

[0096] More specifically, for example, the first electrical connection portion 530 is located between the two long sides 522 of the first surface 521A of the cover 521, and the first heat dissipation fin 551 is located adjacent to one of the long sides 522 of the first surface 521A of the cover 521. The second electrical connection portion 540 is located between the two long sides 522 of the second surface 521B of the cover 521, and the second heat dissipation fin 561 is located adjacent to the other long side 522 of the second surface 521B of the cover 521.

[0097] Figure 7 FIG. 1 is a side view of an electronic device 10 according to an embodiment of the present invention. Figure 2 and Figure 7 As shown, the electronic device 10 includes a housing 100, a power supply 200, a fan device 300 and the above Figure 1 The housing 100 has an internal space 110, an air inlet 120 and an air outlet 130. The air inlet 120 and the air outlet 130 are opposite to each other, respectively formed on different side walls of the housing 100, and respectively connected to the internal space 110. The power supply 200, the fan device 300 and the electronic module 500 are respectively fixed in the internal space 110, and the power supply 200 is electrically connected to the fan device 300 and the electronic module 500. However, the present invention is not limited thereto, and in other embodiments, the electronic module may also be the electronic modules 501 to 503 ( Figures 3 to 6B ).

[0098] For example, the radiator 570 includes a base 571 and a plurality of fin bodies 572. The base 571 is connected to the bottom surface 511B of the container body 511. These fin bodies 572 are arranged at intervals in the horizontal axis direction (such as the X-axis) on the base 571 (such as the X-axis), and a channel 573 is formed between any two adjacent fin bodies 572. Each fin body 572 and the channel 573 are both strip-shaped, and the long axis directions (such as the Y-axis) of the fin body 572 and the channel 573 are parallel to each other.

[0099] Therefore, since the radiator 570 is located between the air inlet 120 and the air outlet 130, and the fan device 300 is located between the air inlet 120 and the radiator 570, when the fan device 300 operates, the fan device 300 generates an air flow R1 through the air inlet 120, conveys the air flow R1 towards these channels 573 of the radiator 570 to the air outlet 130, and allows a part of the air flow R1 to take away the heat energy of the radiator 570 from the air outlet 130. Another part of the air flow R2 circulates through the second heat source module 590 in the internal space 110 to the fan device 300.

[0100] Figure 8 A side view of the electronic device 11 according to an embodiment of the present invention. The electronic device 11 of this embodiment is substantially the same as the electronic device 10 of the above embodiment, and the difference is that, as Figure 8 shown, the container unit 510 of the electronic module 504 further includes an outlet portion 513 and an inlet portion 514. The outlet portion 513 and the inlet portion 514 are formed on different side walls of the container body 511, and are respectively connected to the immersion tank 512, and the outlet portion 513 is located between the inlet portion 514 and the cover body 521. The immersion tank 512 is respectively connected to a liquid cooling exchanger 400 located outside the chassis 100 through the outlet portion 513 and the inlet portion 514. The liquid cooling exchanger 400 is used to receive and send the coolant C in the immersion tank 512.

[0101] Figure 9 A side view of the electronic device 12 according to an embodiment of the present invention. The electronic device 11 of this embodiment is substantially the same as the electronic device 12 of the above embodiment, and the difference is that, as Figure 9 shown, the chassis 100 further has a partition plate 140, a first pipe body 170 and a second pipe body 180. The partition plate 140 is fixed in the internal space 110, and divides the internal space 110 into an upper layer area 150 and a lower layer area 160 that are stacked on each other. The electronic module 504 is fixed in the upper layer area 150, and the above-mentioned liquid cooling exchanger 400 is fixed in the lower layer area 160, rather than being located outside the chassis 100. The first pipe body 170 is respectively connected to the inlet portion 514 and the liquid cooling exchanger 400, and the second pipe body 180 is respectively connected to the outlet portion 513 and the liquid cooling exchanger 400. For example, the chassis 100 is a rack for accommodating standard rack-mounted servers such as 2U or 3U. However, the present invention is not limited thereto.

[0102] In this way, through the above architecture, the electronic device of this case and its electronic module adopting the immersion liquid cooling mode can reduce the container volume and the consumable costs such as the coolant, so as to generate the maximum heat dissipation efficiency on the basis of reasonable equipment investment costs.

[0103] Finally, in the above-disclosed embodiments, they are not intended to limit the present invention. Any person skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention, and all can be protected by the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.

Claims

1. An electronic device adopting an immersion liquid cooling mode, characterized in that, include: A housing having an internal space; a power supply located in the internal space; An electronic module comprising: A container unit, comprising a container body and an immersion tank, wherein the container body is located in the internal space, the immersion tank is formed on one side of the container body and contains a non-conductive cooling liquid; A cover plate, comprising a cover body and an electrical conductive portion, wherein the cover body hermetically covers the container body and the immersion tank, and the electrical conductive portion is disposed through the cover body; a heat sink connected to the outer side of the container body; a first heat source module, fixed in the immersion tank, at least partially immersed in the cooling liquid, electrically connected to the electrical conductive portion, and thermally connected to the heat sink through the container body; and a second heat source module, located outside the immersion tank, electrically connected to the power supply, and electrically connected to the first heat source module through the electrical conductive portion; and A fan device is located in the internal space and electrically connected to the power supply to transport air flow toward the radiator and take away the heat energy of the radiator.

2. The electronic device adopting the immersion liquid cooling mode as described in claim 1, wherein The cover is located between the first heat source module and the second heat source module.

3. The electronic device adopting the immersion liquid cooling mode according to claim 1, wherein The radiator is integrally formed on a side of the container body facing away from the cover body.

4. The electronic device adopting the immersion liquid cooling mode as described in claim 1, characterized in that, The electronic module further includes at least one heat dissipation fin, and the heat dissipation fin is located on the cover.

5. The electronic device adopting the immersion liquid cooling mode according to claim 4, characterized in that, The heat dissipation fin is fixedly arranged on a side of the cover body facing away from the immersion tank, and extends in a direction facing away from the immersion tank.

6. The electronic device adopting the immersion liquid cooling mode as described in claim 4, wherein The heat dissipation fin is fixedly arranged on a side of the cover body facing the immersion tank and extends into the immersion tank.

7. The electronic device adopting the immersion liquid cooling mode as described in claim 4, wherein The cover plate further includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion and the second electrical connection portion are respectively located on two opposite surfaces of the cover body and are respectively connected to the electrical conductive portion, the first electrical connection portion is electrically connected to the first heat source module, the second electrical connection portion is electrically connected to the second heat source module, and is staggered with the heat dissipation fins, wherein the heat dissipation fins are located on the long side of the cover plate.

8. The electronic device adopting the immersion liquid cooling mode as described in claim 1, wherein, The container body further comprises an outlet and an inlet, wherein the outlet and the inlet are formed on the side wall of the container body and are respectively connected to the immersion tank, wherein the outlet is located between the inlet and the cover plate.

9. The electronic device adopting the immersion liquid cooling mode as described in claim 8, characterized in that Also includes: A liquid cooling exchanger is connected to the immersion tank through the outlet and the inlet to receive and send the cooling liquid in the immersion tank.

10. The electronic device adopting the immersion liquid cooling mode as described in claim 9, wherein The housing further comprises a partition plate, a first tube body and a second tube body. The partition plate is fixed in the internal space to separate the internal space into an upper layer area and a lower layer area stacked on each other. The liquid cooling switch is fixed in the lower area, and the electronic module is fixed in the upper area. The first tube body is respectively connected to the inlet and the liquid cooling switch, and the second tube body is respectively connected to the outlet and the liquid cooling switch.

11. An electronic module, characterized in that, include: A container unit includes a container body and an immersion tank, wherein the immersion tank is formed on one side of the container body and contains a non-conductive cooling liquid; A cover plate, comprising a cover body and an electrical conductive portion, wherein the cover body hermetically covers the container body and the immersion tank, and the electrical conductive portion is disposed through the cover body; a heat sink connected to the outer side of the container body; a first heat source module, fixed in the immersion tank, at least partially immersed in the cooling liquid, electrically connected to the electrical conductive portion, and thermally connected to the heat sink through the container body; and A second heat source module is located outside the immersion tank and is electrically connected to the first heat source module through the electrical conductive portion.

12. The electronic module according to claim 11, wherein, The cover is located between the first heat source module and the second heat source module.

13. The electronic module according to claim 11, characterized in that, The radiator is integrally formed on a side of the container body facing away from the cover body.

14. The electronic module according to claim 11, characterized in that, Also includes: At least one heat dissipation fin is located on the cover.

15. The electronic module according to claim 14, characterized in that, The heat dissipation fin is fixedly arranged on a side of the cover body facing away from the immersion tank, and extends in a direction facing away from the immersion tank.

16. The electronic module according to claim 14, characterized in that, The heat dissipation fin is fixedly arranged on a side of the cover body facing the immersion tank and extends into the immersion tank.

17. The electronic module according to claim 14, wherein, The cover plate further includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion and the second electrical connection portion are respectively located on two opposite surfaces of the cover body and are respectively connected to the electrical conductive portion, the first electrical connection portion is electrically connected to the first heat source module, the second electrical connection portion is electrically connected to the second heat source module, and is staggered with the heat dissipation fins, wherein the heat dissipation fins are located on the long side of the cover body.

18. The electronic module according to claim 11, characterized in that, The container body further comprises an outlet and an inlet, wherein the outlet and the inlet are formed on the side wall of the container body and are respectively connected to the immersion tank, wherein the outlet is located between the inlet and the cover plate.

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