Optical element assembly

Abstract

A method of connecting an optical element to a mount includes attaching a connector to an optical element with a first solder and heating the first solder with an ultrasonic heater to form a first solder joint between the connector and the optical element; aligning the optical element in the internal opening of the mounting seat; and attaching the connector to the mount with a second joint, wherein the first solder joint is a polymer-free joint.

Description

[0001] This application claims the benefit of priority of U.S. Provisional Application No. 63 / 423,203, filed on Nov. 7, 2022, the content of which is hereby incorporated by reference in its entirety. TECHNICAL FIELD

[0002] The present disclosure relates to an optical component assembly, and more particularly, to an optical mount coupled to an optical component with a polymer-free joint. BACKGROUND ART

[0003] Optical components such as precision lenses are fixed to an optical mount for use in a lithographic apparatus. A compliant material is typically used to provide a joint between the optical component and the optical mount to secure the two components together. The compliant material should have sufficient flexibility to reduce the deformation induced on the optical component by the optical mount. More specifically, the deformation caused by mechanical stress or thermal strain of the optical mount. Conventionally, the compliant material is an organic polymer because it can bond to both the optical component and the optical mount. Some conventional organic polymers contain organic adhesives such as epoxy resin or cyanoacrylate resin.

[0004] However, the use of organic polymers creates contamination problems that can degrade the performance of the optical component over time. In some conventional systems, the optical component and the optical mount are maintained in special atmospheric conditions to reduce the deterioration of the organic polymer. But requiring such special atmospheric conditions can be very expensive. SUMMARY OF THE INVENTION

[0005] Accordingly, there is a need to firmly attach an optical component to an optical mount without relying on polymer-based joints. Embodiments of the present disclosure relate to polymer-free joints between an optical component and an optical mount. In particular, embodiments of the present disclosure can form a solder joint between the optical component and the optical mount, thus allowing the two components to be firmly fastened while avoiding any contamination problems associated with polymer-based joints. Additionally, connectors can be used to provide a link connecting the optical component and the optical mount.

[0006] According to aspects of the present disclosure, a method of connecting an optical component to a mount is disclosed. The method includes: attaching a connector to the optical component with a first solder and heating the first solder with an ultrasonic heater to form a first welded joint between the connector and the optical component; aligning the optical component within an internal opening of the mount; and attaching the connector to the mount with a second joint. The first welded joint is a polymer-free joint.

[0007] In accordance with aspects of the present disclosure, an optical component is disclosed. The component includes: a mounting base; an optical element disposed within an internal opening of the mounting base; and one or more connectors attached to the optical element via a solder joint, the solder joint being a polymer-free joint composed of one or more metal alloys. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a perspective view of a schematic illustration of an optical component in accordance with an embodiment of the present disclosure;

[0009] Figure 2 is a top view of a schematic illustration of an optical component in accordance with an embodiment of the present disclosure;

[0010] Figure 3A is an enlarged view of an optical element, a connector, and a mounting base in accordance with an embodiment of the present disclosure;

[0011] Figure 3B is another enlarged view showing a joint between an optical element, a connector, and a mounting base in accordance with an embodiment of the present disclosure;

[0012] Figure 4 is another perspective view of a schematic illustration of an optical component in accordance with an embodiment of the present disclosure;

[0013] Figure 5A is a schematic illustration of a process of forming a joint using an ultrasonic heater in accordance with an embodiment of the present disclosure;

[0014] Figure 5B is a schematic illustration of a joint formed using an ultrasonic heater in accordance with an embodiment of the present disclosure;

[0015] Figure 5C is a schematic illustration showing an adhesion promoting coating on a surface of an optical element, a connector, or a mounting base in accordance with an embodiment of the present disclosure;

[0016] Figure 6 shows a process of forming an optical component in accordance with an embodiment of the present disclosure;

[0017] Figure 7 is a schematic illustration of a plurality of connectors attached to an optical element in accordance with an embodiment of the present disclosure;

[0018] Figure 8 is a top view of a schematic illustration of an optical component and an alignment device in accordance with an embodiment of the present disclosure; and

[0019] Figure 9A and 9B is an image of a solder joint formed between an optical element and a connector. DETAILED DESCRIPTION

[0020] Additional features and advantages of the disclosure will be set forth in the detailed description which follows, and in part will be obvious from the description, or may be learned by practice of the disclosure as described in the foregoing description, the claims, and the appended drawings.

[0021] As used herein, when used in a list of two or more items, the term "and / or" means that any one of the listed items can be taken alone, or any combination of two or more of the listed items can be taken. For example, if a composition is described as comprising components A, B, and / or C, the composition can comprise A alone; B alone; C alone; A and B in combination; A and C in combination; B and C in combination; or A, B, and C in combination.

[0022] In this document, relational terms such as first and second, top and bottom, etc. are used only to distinguish one entity or action from another entity or action, and do not necessarily require or imply any actual such relationship or order between such entities or actions.

[0023] Those of ordinary skill in the art will understand that the described disclosure and the construction of other components are not limited to any particular material. Unless otherwise described herein, other exemplary embodiments of the disclosure disclosed herein can be formed of a wide variety of materials.

[0024] Equally important is to note that the construction and arrangement of the elements of the disclosure as shown in the exemplary embodiments are illustrative only. Although only a few embodiments are described in detail in this disclosure, those skilled in the art who review this disclosure will readily understand that many modifications can be made (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, parameter values, installation arrangements, material uses, colors, orientations, etc.) without materially departing from the novel and non-obvious teachings and advantages of the recited subject matter. For example, elements shown as integrally formed can be constructed of multiple parts, or elements shown as multiple parts can be integrally formed, the operation of the interfaces can be reversed or otherwise changed, the length or width of the structure and / or members or connectors or other elements of the system can be changed, and the nature or amount of adjustment positions provided between the elements can be changed. It should be noted that the elements and / or components of the system can be constructed of any of a wide variety of materials in any of a wide variety of colors, textures, and combinations that provide sufficient strength or durability. Accordingly, all such modifications are intended to be included within the scope of this disclosure. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the desired and other exemplary embodiments without departing from the spirit of this disclosure.

[0025] Reference will now be made in detail to some exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Where appropriate, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0026] Reference Figure 1 , there is shown an optical assembly 10, which includes an optical element 20 fixed to a mount 30. A plurality of connectors 40 can connect the optical element 20 to the mount 30. In an embodiment, the optical assembly 10 does not include a polymeric joint for connecting the optical element 20 to the mount 30. Thus, the connection between the optical element 20 and the mount 30 is polymer-free. Alternatively, the connectors 40 can be connected to each of the optical element 20 and the mount 30 by an ultrasonic welding process.

[0027] In an embodiment, the optical element 20 can be a lens, a mirror, or a prism. In an embodiment, the optical element 20 is made of glass, glass-ceramic, or ceramic. Glass and glass-ceramic materials include, for example, silicate glass, aluminosilicate glass, alkali aluminosilicate glass, alkaline earth aluminosilicate glass, borosilicate glass, borosilicate glass, alkali metal aluminoborosilicate glass, alkaline earth metal aluminoborosilicate glass, calcium sodium glass, fused silica (fused quartz), or other types of glass. Exemplary glass materials include, but are not limited to, high-purity fused silica sold by Corning Incorporated of Corning, New York and EAGLE borosilicate glass also sold by Corning Incorporated of Corning, New York. Other glass substrates include, but are not limited to, ultra-low expansion glass, Lotus TM NXT glass, Iris TM glass, glass, glass, glass, Vycor TM glass, or glass. In some embodiments, the optical element 20 is made of float glass such as soda-lime glass. In some embodiments, the optical element 20 is made of magnesium fluoride and / or calcium fluoride. In still other embodiments, the optical element 20 is made of silica glass having 80 wt% or more, or 85 wt% or more, or 90 wt% or more, or 95 wt% or more, or 99 wt% or more of silica.

[0028] Exemplary glass-ceramics include, for example, lithium disilicate, nepheline, β-spodumene, and β-quartz. Exemplary commercially available materials include, for example, those sold by Corning Incorporated of Corning, New York and

[0029] As Figure 1-3B shown, the optical element includes a top surface 21, a bottom surface 23, and at least one side surface 25. In addition, the outer diameter 22 of the optical element 20 (formed by the side surface 25) is smaller than the inner diameter 34 of the mount 30. Thus, when assembling the optical assembly 10, the optical element 20 is configured to fit within the inner portion of the mount 30 and is disposed within the inner portion. As further discussed below, when assembling the optical assembly 10, a gap may be provided between the side surface 25 of the optical element 20 and the mount 30. In addition, as Figure 1 shown, when assembling the optical assembly 10, the optical element 20 and the mount 30 are concentric.

[0030] In Figure 1 an embodiment, the optical assembly 10 includes three connectors 40 that are equally spaced apart around the optical element 20 (e.g., at an angular spacing of 180°). However, it is contemplated that the optical assembly 10 may include more or fewer connectors 40, and the connectors 40 may be spaced apart in a different configuration than Figure 1 shown.

[0031] The mount 30 may be formed in an annular shape having an inner diameter 34 and an outer diameter 32. Thus, the mount 30 may be an annular member. In an embodiment, the mount 30 is made of a metal such as a stainless steel alloy, nickel steel, titanium, aluminum, or brass. In some embodiments, the mount 30 is made of glass, glass-ceramic, or ceramic, such as the materials described above with reference to the optical element 20. As Figure 1 shown, holes 36 may be formed in the mount 30 for attachment to an alignment device, as further discussed below.

[0032] The mount 30 may be further assembled in an optical system that includes, for example, imaging and illumination systems, such as a lithography system, a semiconductor inspection system, a microscope assembly, or a polarization system.

[0033] Although Figure 1 the optical element 20 and the mount 30 are shown as circular, it should be noted that one or both of these components may include other shapes. For example, in some embodiments, the outer perimeter of the mount 30 may be square.

[0034] As Figure 1 and 2As shown, the connector 40 provides an attachment between the optical element 20 and the mounting base 30. Thus, as discussed further below, the connector 40 can be individually fixed to both the optical element 20 and the mounting base 30. In an embodiment, the connector 40 can be made of metal, glass, glass-ceramic, or ceramic. Thus, the connector 40 can be made of any of the materials described above with reference to the optical element 20 and / or the mounting base 30. The connector 40 can be disposed within a recess 38 formed within the mounting base 30, as discussed further below.

[0035] Figure 3A An enlarged view of the connector 40 is shown before it is attached to the optical element 20 or the mounting base 30. And Figure 3B An enlarged view of the connector 40 is shown after it is attached to both the optical element 20 and the mounting base 30 by ultrasonic welding. Referring Figure 3A , the connector 40 includes an arm 50 connected to a retainer 60. The arm 50 can form a cantilever member extending from the retainer 60. Additionally, the arm 50 can include a first end 52 connected to the retainer 60 and a second end 54. Before being attached to the optical element 20, the second end 54 of the arm 50 is a free end. Additionally, the second end 54 of the arm 50 can form a support surface for supporting the optical element 20. As discussed further below, the second end 54 of the arm 50 is attached to the optical element 20 through an ultrasonic welding process. The first end 52 of the arm can be connected to the retainer 60 by any well-known attachment means. In some other embodiments, the first end 52 and the retainer 60 are a single integral member.

[0036] The retainer 60 can include a vertical opening 62 and / or a horizontal opening 64 for attachment to the mounting base 30, as discussed further below. Also as discussed below, when the optical assembly 10 is fully assembled, the retainer 60 can be disposed within a recess within the mounting base 30.

[0037] The connector 40 is dimensioned and configured to provide a load-bearing surface for the optical element 20 and to decouple the optical element 20 from any mechanical stress and / or thermal strain applied to the mounting base 30. Thus, the connectors 40 each act as a buffer to absorb any stress or strain applied to the mounting base 30 such that the stress or strain does not reach or affect the optical element 20. When assembling the optical assembly 10, the connectors 40 should be spaced apart around the optical element 20 by a sufficient distance to provide such load-bearing and stress-absorbing characteristics.

[0038] Although Figure 3A the arm 50 of the connector 40 is shown as a straight rectangular member, it is contemplated that the arm 50 can include other shapes and configurations. For example, Figure 4An embodiment is shown in which the arm 50 forms an inverted U-shaped profile between a first end 52 and a second end 54. In still other embodiments, the arm 50 may form an L-shaped profile, an S-shaped profile, or a serpentine profile between the first end 52 and the second end 54.

[0039] Referring again to Figure 3A and 3B , the connector 40 may be attached to the optical element 20 and / or the mount 30 by one or more solder joints 70. As discussed further below, the solder joints 70 provide a mechanical attachment and may be formed by an ultrasonic soldering process. In particular, the second end 54 of the arm 50 of the connector 40 may be attached to the optical element 20 by a first solder joint 72. As Figure 3B shown, the first solder joint 72 may attach the optical element 20 directly to the second end 54 of the arm 50 such that no other components (other than the first solder joint 72 itself) are disposed between the optical element 20 and the arm 50. In an embodiment, the first solder joint 72 specifically attaches the second end 54 of the arm 50 to the side surface 25 of the optical element 20. Thus, in some embodiments, only the second end 54 of the arm 50 is directly attached to the optical element 20 via the solder joint 70. In some other embodiments, it is also contemplated that the arm 50 having a length longer than the second end 54 is directly attached to the optical element 20 via the solder joint 70.

[0040] The retainer 60 of the connector 40 may be attached to the mount 30 by a second solder joint 74. As discussed further below, to attach the retainer 60 to the mount 30, the retainer 60 may be disposed within a recess 39 in the mount 30, and the arm 50 may be disposed within a recessed hole 38. As Figure 3A and 3B shown, the recess 39 is connected to the recessed hole 38 by a channel 37. The second solder joint 74 may be disposed within a vertical opening 62 and a horizontal opening 64 to provide a direct attachment between the mount 30 and the retainer 60 of the connector 40 such that no other components (other than the second solder joint 74 itself) are disposed between the mount 30 and the retainer 60. In an embodiment, the second solder joint 74 specifically attaches the retainer 60 of the connector 40 to the bottom surface 33 of the recess 39 of the mount 30. In still other embodiments, the retainer 60 may be connected to the mount 30 by different attachment means other than solder joints. For example, the retainer 60 may be attached to the mount 30 by a ceramic-based or polymer-based attachment.

[0041] The solder joints 70 (e.g., the first solder joint 72, the second solder joint 74) may be formed of solder 80, as Figure 5AAs shown, the solder is melted or heated by an ultrasonic heater 90. For example, the solder 80 may be disposed on at least a portion of a first surface 85, which may be one of the connector 40, the optical element 20, and the mount 30. Once the solder 80 is melted on the first surface 85 by the ultrasonic heater 90, a second surface 87 may be applied to the solder 80 to attach the first surface 85 and the second surface 87. Then, the solder 80 may be cured to form a solder joint 70, thereby forming an attachment between the first surface 85 and the second surface 87 through the solder joint 70 (as Figure 5B shown). The second surface 87 may be one of the connector 70, the optical element 20, and the mount 30. Thus, for example, the first surface 85 is the connector 40 and the second surface 87 is the optical element 20. In other instances, the first surface 85 is the connector 40 and the second surface 87 is the mount 30.

[0042] It should be noted that the solder 80 can be used to form a strong and fixed attachment between components formed of the same or different materials. Thus, for example, the first surface 85 may be formed of a different material than the second surface 87. In some embodiments, the first surface 85 is formed of glass and the second surface 87 is formed of metal.

[0043] The solder 80 may be composed of one or more metal alloys that include, for example, tin (Sn), silver (Ag), copper (Cu), titanium (Ti), cerium (Ce), and gallium (Ga). In some embodiments, the solder 80 comprises a majority of tin (i.e., greater than about 50 wt%, or greater than about 60 wt%, or greater than about 70 wt%, or greater than about 80 wt%, or greater than about 90 wt%). Without wishing to be bound by theory, it is believed that the inclusion of titanium in the solder 80 aids in bonding the solder 80 to glass, and the inclusion of cerium in the solder 80 helps prevent oxidation of the solder joint 70. In some embodiments, the solder 80 is preformed into a desired shape that mates with a bonding part on the connector 40.

[0044] In an embodiment, the solder joint 70 may have a surface area on the first surface 85 and / or the second surface 87 sufficient to provide a strong attachment between the first surface 85 and the second surface 87. It should be noted that the surface area of the solder joint 70 is related to the number of connectors 40 used, so the fewer the connectors 40, the greater the surface area each connector may require. The solder joints 70 in the assembled optical assembly 10 should be strong enough to withstand an impact load of about 10×9.81 m / s 2 to about 50×9.81 m / s 2 for a period of about one millisecond, or withstand an impact load of about 20×9.81 m / s 2 to about 40×9.81 m / s 2for a period of impact load of about one millisecond, or withstand an impact load of about 30×9.81 m / s 2 to about 35×9.81 m / s 2 for a period of about one millisecond. Accordingly, the welded joint 70 should not break when exposed to such impact loads.

[0045] The welded joint 70 can form a joint between the first surface 85 and the second surface 87 such that the joint itself is stronger than the first surface 85 or the second surface 87. Thus, when the assembled optical component 10 is exposed to, for example, torsional forces, the connector 40 will break first before the welded joint 70. In an embodiment, the welded joint 70 can withstand a pressure load of about 1 pound per square inch (psi) to about 2,000 psi, or about 10 psi to about 1,500 psi, or about 100 psi to about 1,000 psi, or about 100 psi or greater, or about 500 psi or greater, or about 1,000 psi or greater, or about 1,500 psi or greater, or about 2,000 psi or greater when attached to the glass connector 40. In an embodiment, the welded joint 70 can withstand a pressure load of about 1 psi to about 200,000 psi, or about 10 psi to about 150,000 psi, or about 100 psi to about 100,000 psi, or about 100 psi or greater, or about 1,000 psi or greater, or about 10,000 psi or greater, or about 100,000 psi or greater, or about 200,000 psi or greater when attached to the metal connector 40.

[0046] Referring again to Figure 5A , the ultrasonic heater 90 can heat the solder 80 such that a reaction layer 82 is formed between the solder 80 and 85. The reaction layer 82 can be a transition zone that forms a gradient between the materials of the first surface 85 and the solder 80. Accordingly, the interface between the first surface 85 and the solder 80 may not have a distinct boundary. Alternatively, within the reaction layer 82, the materials of the solder 80 and the first surface 82 can be interlaced with each other.

[0047] The ultrasonic heater 90 can include an oscillator that converts high-frequency current into vibrating ultrasonic waves. In some embodiments, the ultrasonic heater 90 is a piezoelectric transducer. The ultrasonic heater 90 can operate at an oscillation frequency of about 10 kHz to about 100 kHz or about 20 kHz to about 60 kHz and can have an output power of about 10 watts to about 1,000 watts. As is known in the art, the ultrasonic heater 90 can include a transducer and an oscillator attached to a horn in order to generate the oscillation frequency. Although in Figure 5AAlthough not shown, the tip of the ultrasonic heater 90 may include an open channel through which air may flow to cool the transducer. The ultrasonic heater 90 may apply an ultrasonic application to a material (e.g., solder 80) such that the ultrasonic application relies on the cavitation phenomenon to attach the material to the first surface 85 or the second surface 87, thereby forming a solder joint 70.

[0048] Cavitation is the formation and subsequent collapse of bubbles in a material under conditions of a rapidly changing pressure field. More specifically, the ultrasonic heater 90 induces ultrasonic vibrations on a material (e.g., solder 80) such that the vibrations pass through the material. In particular, these vibrations pass through the material as a series of compression waves and rarefaction waves. The compression waves and rarefaction waves form regions of relatively low pressure and relatively high pressure within the material, which in turn causes the formation of cavities in the material. The cavities take the form of bubbles, and as the ultrasonic vibrations are continuously applied, the bubbles increase in size within the material. The bubbles continue to grow until they reach a critical size, at which point the bubbles collapse and release a high level of energy and pressure, thereby forming microjets. The microjets impact the surface to which the material is attached. When the microjets impact the surface, they impact the surface with a force that breaks the oxide layer on the surface. By breaking the oxide layer, the material is able to bond and firmly attach to the surface. In the embodiments disclosed herein, the material forming the microjets is solder 80, and the surface on which the microjets break the oxide layer is the first surface 85 or the second surface 87. In some specific embodiments, after applying the ultrasonic application to the solder 80, the solder 80 forms microjets that break the oxide layer on the connector 40 formed of glass. Additionally, in some specific embodiments, after applying the ultrasonic application to the solder 80, the solder forms microjets that break the oxide layer on the connector 40 formed of metal. It should be noted that without breaking the oxide layer on the glass or metal connector 40, the metal solder 80 will not be able to bond and attach to the glass or metal material of the connector 40.

[0049] Once the material (e.g., solder 80) is fixed to the surface (e.g., connector 40), the ultrasonic application is terminated and the material is allowed to cure and harden, thereby forming a solder joint 70 between the material and the surface. During the ultrasonic application, the ultrasonic heater 90 may be heated to a temperature of about 450 °C or lower, or about 400 °C or lower, or about 350 °C or lower, or in the range of about 100 °C to about 450 °C, or about 150 °C to about 450 °C, or about 200 °C to about 450 °C, or about 100 °C to about 400 °C, or about 150 °C to about 400 °C, or about 200 °C to about 400 °C, or about 250 °C to about 400 °C.

[0050] In some embodiments, it is also contemplated that the material (e.g., solder 80) may first be exposed to a preheating treatment prior to the ultrasonic application. The preheating treatment may include heating the material to melt and liquefy (or at least partially liquefy) the material. Liquefying the material allows ultrasonic vibrations (induced by ultrasonic heater 90) to be more effectively transmitted throughout the material. This helps to initiate the cavitation process, as discussed above. In some embodiments, the preheating treatment includes heating the material to a temperature of about 100°C to about 300°C, or about 150°C to about 250°C, or about 200°C to about 250°C.

[0051] In some embodiments, ultrasonic heater 90 also includes a resistive heater that applies the preheating treatment to the material. In other embodiments, the preheating treatment is achieved using a different heating device separate from ultrasonic heater 90, such as conduction heating (e.g., a heating plate), convection heating, radiation heating, or induction heating.

[0052] In some embodiments, an adhesion promoting coating 89 may be provided on at least one of the first surface 85 and / or the second surface 87 to promote adhesion of the surface to the solder 80, as Figure 5C shown. The adhesion promoting coating 89 may comprise, for example, titanates (e.g., Tyzor 131 available from DuPont), zirconates (e.g., Tyzor 217 available from DuPont), silanes (e.g., SIB 1824 and SIB 1821 available from Gelest), or thin film metals such as nickel, stainless steel, aluminum, and / or indium.

[0053] In addition, prior to applying the solder 80, the first surface 85 and / or the second surface 87 may be prepared by applying a cleaner or chemical to remove organic materials (e.g., the oxide layer discussed above). This may be supplementary to the ultrasonic application of ultrasonic heater 90, as discussed above. Additionally or alternatively, prior to applying the solder 80, contaminants on the first surface 85 and / or the second surface 87 may be cleaned by applying a weak acid or using an ultraviolet (UV) ozone cleaning technique.

[0054] Figure 6 The process 100 of forming the optical assembly 10 is shown. The process 100 includes attaching one or more connectors 40 to the optical element 20 in step 110. As discussed above and as Figure 7 shown, the connector 40 may be attached to the side surface 25 of the optical element 20 during step 110. It should be noted that Figure 7 embodiments are depicted where three of the connectors 40 all have the same configuration while the connector 40' includes a different configuration.

[0055] During step 110, attaching each connector 40 to the optical element 20 may include applying solder 80 to the second end 54 of each connector 40 and then heating the solder 80 with an ultrasonic heater 90, as discussed above. Thus, the ultrasonic heater 90 may apply an ultrasonic application to the solder 80. Additionally, the solder 80 may be preheated prior to the ultrasonic application. Next, the connector 40 with the solder joint is then attached to the optical element 20 such that the solder 80 contacts both the connector 40 and the optical element 20. When attaching the connector 40 with the solder joint to the optical element 20, the connector 40 and the optical element 20 may be held in specific and precise positions relative to each other (e.g., using an alignment device 200, as discussed below). In an embodiment and as Figure 7 shown, the solder 80 is applied to the side surface 25 of the optical element 20. However, as discussed above, it is also contemplated that one or more connectors 40 may be attached to other surfaces of the optical element 20. Once the solder 80 contacts both the connector 40 and the optical element 20 and upon termination of the ultrasonic application, the solder 80 cures and hardens to form a solder joint 70 (e.g., a first solder joint 72). As discussed above, the cavitation process (induced by the ultrasonic application) joins the optical element 20 and the connector 40 together and attaches them via the solder joint 70.

[0056] In some embodiments, once the solder 80 contacts both the connector 40 and the optical element 20, additional heat may be applied. This additional heat may be applied to slow down the curing of the solder 80. This may provide additional time to further align the connector and the optical element before they are joined together and relatively fixed by the curing and hardening of the solder 80.

[0057] Referring again to process 100, in step 120, the optical element 20 with one or more connectors 40 attached is positioned within the annular structure of the mount 30. Thus, the optical element 20 is positioned within the internal opening formed by the inner diameter 34 of the mount 30 (e.g., Figure 1 shown). Additionally, the alignment device 200, such as Figure 8 shown, may also be used to align the optical element 20 relative to the mount 30. Figure 8 A top view of the optical element 20 fixed and joined to the connector 40 is shown. However, in Figure 8 , the connector 40 has not yet been fixed to the mount 30. The optical element 20 is properly positioned and aligned relative to the mount 30 using the alignment device 200, and these components are then fixed together via the solder joint 70.

[0058] In some embodiments, during the positioning and alignment process, the alignment device 200 moves the optical element 20 relative to the mount 30 while the mount 30 remains stationary. Thus, the optical element 20 can be oriented in various directions relative to the mount 30 during the positioning and alignment process. The optical element 20 can move horizontally (e.g., left and right) and vertically (e.g., up and down), and the optical element 20 can be tilted at an angle relative to the mount 30 to achieve the desired positioning and alignment with the mount 30. In other embodiments, during the positioning and alignment process, the mount 30 moves relative to the optical element 20 while the optical element 20 remains stationary. Thus, the mount 30 can move horizontally and vertically and can be tilted at an angle relative to the optical element 20. In still other embodiments, both the optical element 20 and the mount 30 move during the positioning and alignment process.

[0059] It should be noted that the alignment device 200 can be attached to the hole 36 in the mount 30 to move and position the mount 30 during the positioning and alignment process. Additionally, a gap 220 can be provided between the optical element 20 and the mount 30 during the positioning and alignment of these components. The gap 220 can remain even after the optical element 20 is fixed to the mount 30 via the welding joint 70. Thus, when fully assembled in the optical assembly 10, the optical element 20 and the mount 30 can still be spaced apart by the gap 220. In an embodiment, the gap 220 is from about 0.20 mm to about 2.00 mm, or from about 0.25 mm to about 1.75 mm, or from about 0.50 mm to about 1.50 mm, or from about 0.75 mm to about 1.25 mm, or from about 1.00 mm to about 1.50 mm, or from about 0.50 mm to about 1.00 mm.

[0060] In some embodiments, as noted above, the alignment device 200 can also be used to align the relative positions of the components when the connector 40 is fixed to the optical element 20 via the welding joint 70. However, it is also contemplated that another device other than the alignment device 200 can align the relative positions of the connector 40 and the optical element 20.

[0061] In addition, referring Figure 3A and 3B , during the positioning and alignment of the optical element 20 and the mount 30, the connectors 40 can be respectively disposed in the recessed holes 38 of the mount 30. In particular, at least a portion of the arm 50 (which includes at least an intermediate portion of the arm 50 between the first end 52 and the second end 54) is positioned within the recessed hole 38 to facilitate the relative movement of the optical element 20 and the mount 30 with respect to each other. During the positioning and alignment of the optical element 20 and the mount 30, the recessed hole 38 provides a void for the connector 40.

[0062] Also as Figure 3A and3B As shown, during the positioning and alignment process of the optical element 20 and the mount 30, the retainer 60 of the connector 40 is disposed within the recess 39, and the first end 52 of the arm 50 is disposed within the channel 37.

[0063] Once the optical element 20 and the mount 30 are properly positioned and aligned, the connector 40 can then be fixed to the mount 30 via a solder joint 70 (e.g., the second solder joint 74), as shown in step 130 of process 100. It should be noted that during this connection, the optical element 20 and / or the mount 30 continue to be held in the desired position and aligned via the alignment device 220. Additionally, during this connection, the connector 40 has been fixed to the optical element 20. Attaching each connector 40 to the mount 30 during step 130 can include applying solder 80 to the horizontal opening 62 and the vertical opening 64 of each retainer 60, and then heating the solder 80 with an ultrasonic heater 90, as discussed above. Then, the connector 40 with the attached solder joint is attached to the bottom surface 33 of the recess 39 of the mount 30 such that the solder 80 contacts both the connector 40 and the bottom surface 33. After attaching the connector 40 to the mount 30 via the solder 80, the solder 80 cures and hardens to form the solder joint 70 (e.g., the second solder joint 74).

[0064] However, it should also be noted that the connector 40 can be attached to the mount 30 via a ceramic-based or polymer-based attachment rather than the second solder joint 74. When using such ceramic-based or polymer-based attachments, ultrasonic application from the ultrasonic heater 90 is not required.

[0065] The optical assembly 10 can be formed after the connector 40 is attached to the mount 30 (and thus, the optical element 20 is attached to the mount 30). However, in process 100, it is also contemplated that the connector 40 is first attached and fixed to the mount 30 before being attached to the optical element 20. Additionally, in still some other embodiments, the connector 40 can be fixed and attached to both the mount 30 and the optical element 20 simultaneously.

[0066] As shown in step 140 of process 100, after fixing the connector 40 to the mount 30, a filling material can be disposed within the recessed hole 38 of the mount 30 to firmly position the connector 40 relative to the mount 30. Thus, the filling material engages both the recessed hole 38 and the connector 40 (specifically, the arm 50) to anchor the connector 40. After the filling material hardens, the connector 40 may not be able to move independently of the mount 30. Thus, the connector 40 is firmly anchored to the mount 30. Exemplary filling materials include, for example, inorganic materials such as glass, sand, or metal or polymer materials.

[0067] In some embodiments, it is also contemplated that such a packing material is not added to the recess 39 (or the mount 30 does not even include such a recess). Instead, the solder joint 70 may provide the only attachment between the connector 40 and the mount 30. This allows some flexibility of the connector 40 and thus allows some relative movement between the optical element 20 and the mount 30.

[0068] It should be noted that in conventional assemblies where a polymeric joint is used to fasten an optical element to a mount, the polymeric joint may degrade or become contaminated over time. Thus, after a certain period of time, the joint must be removed and replaced. Consequently, the optical element and the mount cannot be firmly anchored to each other (e.g., with a packing material as disclosed above). Instead, due to the unstable nature of the polymeric joint, a more temporary and less permanent attachment is required. In contrast to conventional assemblies, the embodiments disclosed herein do not utilize a polymeric joint to fix the optical element 20 to the mount 30 via the connector 40. Instead, as discussed above, the solder joint 70 creates a strong and polymer-free joint between these components. Due to the polymer-free nature of the joint 70, these components can be more permanently fixed together via the packing material, thereby forming a highly stable and robust assembly.

[0069] Figure 9A and 9B An embodiment showing a solder joint 70 formed between the side surface 25 of the glass connector 40 and the glass optical element 20 is presented. In Figure 9A and 9B the embodiment, solder material is placed on the surface of the glass connector and solder material is placed on the surface of the glass optical element. The solder material is then heated by an ultrasonic heater operating at an oscillation frequency of 65 kHz. The tip of the ultrasonic heater is set to 165 °C. Next, the glass connector and the glass optical element are aligned using an alignment device and the two solder materials are brought into contact. The combined solder material is then preheated by a hot plate operating at a temperature of 140 °C. Finally, the ultrasonic heater applies an ultrasonic application to the combined solder material, during which the ultrasonic heater operates at an oscillation frequency of 65 kHz and the tip of the ultrasonic heater is set to 165 °C. The ultrasonic application is then terminated and the solder is cured into a solder joint.

[0070] Unless otherwise indicated, it is contemplated that any feature of any embodiment can be used in any other embodiment, unless incompatible. Optical elements that can be employed include lenses, mirrors, and prisms.

[0071] The described embodiments are preferred and / or illustrative, but not limiting. Various modifications are contemplated within the scope and purview of the appended claims.

Claims

1. A method of connecting an optical component to a mounting base, the method comprising: Attaching a connector to the optical component with a first solder and heating the first solder with an ultrasonic heater to form a first soldered joint between the connector and the optical component; Aligning the optical component within an internal opening of the mounting base; And Attaching the connector to the mounting base with a second joint, wherein the first soldered joint is a polymer-free joint.

2. The method according to claim 1, further comprising applying an oscillation frequency of about 10 kHz to about 100 kHz with the ultrasonic heater.

3. The method according to claim 1 or claim 2, further comprising aligning the optical component within the internal opening of the mounting base with an alignment device.

4. The method according to claim 3, wherein the alignment device moves the optical component relative to the mounting base to align the optical component with the mounting base.

5. The method according to any one of claims 1-4, wherein the method comprises forming the first soldered joint between the connector and the optical component before forming the second joint between the connector and the mounting base.

6. The method according to any one of claims 1-5, further comprising positioning the connector within a recess in the mounting base.

7. The method according to claim 6, further comprising filling the recess with a filling material to fixedly secure the connector to the mounting base.

8. The method according to any one of claims 1-7, wherein the optical component is firmly fixed to the mounting base via the connector.

9. The method according to any one of claims 1-8, wherein the first soldered joint comprises one or more of tin (Sn), silver (Ag), copper (Cu), titanium (Ti), cerium (Ce), and gallium (Ga).

10. The method according to any one of claims 1-9, wherein the second joint is a soldered joint that is a polymer-free joint.

11. The method according to claim 10, wherein the second soldered joint comprises one or more of tin (Sn), silver (Ag), copper (Cu), titanium (Ti), cerium (Ce), and gallium (Ga).

12. The method according to any one of claims 1-11, wherein the optical component is a lens.

13. The method according to any one of claims 1-12, wherein the optical component comprises glass and the connector is made of metal and / or glass.

14. The method according to any one of claims 1-13, wherein the first soldered joint between the connector and the optical component is capable of withstanding a pressure load of about 500 psi or greater.

15. An optical assembly, the optical assembly comprising: A mounting base; An optical component disposed within an internal opening of the mounting base; And One or more connectors, each connector being attached to the optical component via a soldered joint that is a polymer-free joint composed of one or more metal alloys.

16. The optical component according to claim 15, wherein the mounting seat is an annular member having an inner diameter and an outer diameter, and the inner diameter forms the inner opening of the mounting seat.

17. The optical component according to claim 15 or claim 16, wherein the optical element includes a top surface, a bottom surface, and a side surface, and the solder joint is directly attached to the side surface of the optical element.

18. The optical component according to any one of claims 15-17, wherein the one or more metal alloys include one or more of tin (Sn), silver (Ag), copper (Cu), titanium (Ti), cerium (Ce), and gallium (Ga).

19. The optical component according to any one of claims 15-18, wherein the solder joint between the connector and the optical element is capable of withstanding a pressure load of about 500 psi or greater.

20. The optical component according to any one of claims 15-19, wherein the connector includes a cantilever.

21. The optical component according to claim 20, wherein the solder joint is connected to one end of the cantilever.

22. The optical component according to any one of claims 15-21, wherein the solder joint includes a first solder joint, and the optical component further includes a second solder joint between the connector and the mounting seat.

23. The optical component according to any one of claims 15-22, wherein the connector is made of glass, the optical element is made of glass, and the mounting seat is made of metal.

24. The optical component according to any one of claims 15-23, further including a gap between the optical element and the mounting seat.

25. The optical component according to claim 24, wherein the gap has a length of about 0.20 mm to about 2.00 mm.

26. The optical component according to any one of claims 15-25, wherein the optical element is a lens.

27. The component according to any one of claims 15-26, wherein the optical element includes glass, and the connector is made of metal and / or glass.

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