Pick-up system and pick-up method

Abstract

A pickup system (100) is provided with: a pickup nozzle (14a); a negative pressure generation unit (153) for generating a negative pressure around the opening (14b) of the pickup nozzle (14a); an ultrasonic wave generation unit (152) that generates ultrasonic waves from the periphery of the opening (14b); and a control unit (101). When the distance from the opening (14b) of the pick-up nozzle (14a) to the chip (6a) becomes a predetermined distance by the lifting of the pick-up nozzle (14a), the control unit (101) starts the generation of ultrasonic waves by the ultrasonic wave generation unit (152). The pick-up nozzle (14a) holds the chip (6a) in a non-contact manner by using an attractive force based on a negative pressure around the opening (14b) and a repulsive force based on the ultrasonic waves around the opening (14b), and the predetermined distance is a distance predetermined according to the frequency of the ultrasonic waves generated by the ultrasonic wave generation unit (152).

Description

Technical Field

[0001] The present disclosure relates to a system for pick-up components and the like. Background Art

[0002] For high functionality of semiconductor packages, hybrid bonding without using bumps, bonding materials, etc. is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or the like using hydrogen bonds or the like in a state where the surface of the semiconductor chip is cleaned. For this reason, in hybrid bonding, it is necessary to maintain a high level of cleanliness of the surface of the semiconductor chip during the period from picking up the semiconductor chip from a dicing tape serving as an adhesive sheet to bonding the semiconductor chip.

[0003] In addition, in the past, a pick-up device using a vacuum type pick-up nozzle has been proposed (for example, refer to Patent Document 1). In this pick-up device, when picking up a semiconductor chip, a metal pick-up nozzle contacts the surface of the semiconductor chip. There is a possibility that the surface of the semiconductor chip is contaminated or damaged due to this contact. As a result, there is a problem that the semiconductor chip cannot be normally bonded to the substrate. For this reason, a technique for picking up a semiconductor chip by the pick-up nozzle without contact is required.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: JP-A-2018-63967 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] However, even when the pick-up nozzle holds the semiconductor chip without contact in the pick-up device of Patent Document 1 described above, there is a problem that it is sometimes difficult to appropriately pick up a component such as a semiconductor chip.

[0009] For this reason, the present disclosure provides a pick-up system that can appropriately pick up components.

[0010] Means for Solving the Problems

[0011] One aspect of the present disclosure relates to a pick-up system including: a holding tool having an opening and capable of moving up and down; a negative pressure generating unit configured to generate a negative pressure around the opening of the holding tool; an ultrasonic generating unit configured to generate ultrasonic waves from around the opening; and a control unit configured to control the negative pressure generating unit and the ultrasonic generating unit. When the distance from the opening of the holding tool to a component adhered to an adhesive sheet becomes a predetermined distance through the up-and-down movement of the holding tool, the control unit starts generating ultrasonic waves of the ultrasonic generating unit, and uses the attractive force based on the negative pressure around the opening and the repulsive force based on the ultrasonic waves around the opening to non-contactingly hold the component by the holding tool. The predetermined distance is a distance specified corresponding to the frequency of the ultrasonic waves generated by the ultrasonic generating unit.

[0012] In addition, these general or specific aspects can also be implemented by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, and can also be implemented by any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. Further, the recording medium can also be a non-temporary recording medium.

[0013] Effects of the Invention

[0014] The pick-up system of the present disclosure can appropriately pick up components.

[0015] In addition, further advantages and effects in one aspect of the present disclosure will become clear from the specification and the drawings. The related advantages and / or effects are provided by several embodiments and the structures described in the specification and the drawings, but not necessarily all the structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view of a component mounting apparatus in Embodiment 1.

[0017] Figure 2 It is a diagram for explaining the operation of mounting a chip on a substrate by the component mounting apparatus in Embodiment 1.

[0018] Figure 3 It is a diagram showing an example of the structure of the pick-up system in Embodiment 1.

[0019] Figure 4 It is a diagram showing an example of the basic operation of picking up a chip by the pick-up nozzle in Embodiment 1.

[0020] Figure 5 It is a diagram showing an example of a case where the position of a chip adhered to an adhesive sheet is deviated.

[0021] Figure 6This is a diagram showing an example of the timing for starting the generation of ultrasonic waves in Embodiment 1.

[0022] Figure 7 This is a flowchart showing an example of the processing operation of the control unit in Embodiment 1.

[0023] Figure 8 This is a diagram showing an example of the structure of the component mounting device in Embodiment 2 and an example of the operation of mounting a chip on a substrate by the component mounting device.

[0024] Figure 9 This is a diagram showing an example of the structure of the pickup system in Embodiment 2.

[0025] Figure 10 This is a diagram showing an example of the recovery of defective chips in Embodiment 2.

[0026] Figure 11 This is a flowchart showing an example of the processing operation of the control unit in Embodiment 2.

[0027] Figure 12 This is a diagram showing another example of the recovery of defective chips in Embodiment 2.

[0028] Figure 13 This is a diagram showing an example of the upward pushing of a chip.

[0029] Figure 14 This is a diagram showing another example of the upward pushing of a chip.

[0030] Figure 15 This is a diagram showing an example of the shape of the upward pushing pin.

[0031] Figure 16 This is a diagram showing another example of the upward pushing of a chip. Detailed Embodiments

[0032] The pickup system according to the first aspect of the present disclosure includes: a holding tool having an opening and being vertically movable; a negative pressure generating unit configured to generate a negative pressure around the opening of the holding tool; an ultrasonic wave generating unit configured to generate ultrasonic waves from around the opening; and a control unit configured to control the negative pressure generating unit and the ultrasonic wave generating unit. The control unit starts the generation of ultrasonic waves of the ultrasonic wave generating unit when the distance from the opening of the holding tool to a component adhered to an adhesive sheet becomes a predetermined distance through the vertical movement of the holding tool, and non-contact holds the component by using the attractive force based on the negative pressure around the opening and the repulsive force based on the ultrasonic waves around the opening. The predetermined distance is a distance specified corresponding to the frequency of the ultrasonic waves generated by the ultrasonic wave generating unit. Further, the holding tool is, for example, a pickup nozzle.

[0033] Thus, when the distance from the opening of the holding tool to the component becomes a specified distance, which is a distance specified corresponding to the frequency of the ultrasonic wave, the generation of the ultrasonic wave starts. Here, when the ultrasonic wave becomes a standing wave, the positions where the vibration in the air, which is the medium for transmitting the ultrasonic wave, is large and small are determined according to the frequency of the ultrasonic wave. Therefore, by starting the generation of the ultrasonic wave when the distance from the opening of the holding tool to the component becomes the specified distance, the vibration of the air caused by the ultrasonic wave at the position of the component can be reduced at the time point when the generation of the ultrasonic wave starts. As a result, the situation where the component deviates from the adhesive sheet due to the vibration of the air is suppressed, and the holding tool can appropriately hold the component.

[0034] In addition, in a second mode subordinate to the first mode of the present disclosure, it is also possible that the specified distance is the distance from the opening of the holding tool to a portion other than the antinode in the ultrasonic wave generated by the ultrasonic wave generating unit.

[0035] Thus, since the specified distance is the distance from the opening of the holding tool to a portion other than the antinode in the ultrasonic wave, a portion other than the antinode (e.g., a node) in the ultrasonic wave appears at the position of the component. Here, at the antinode of the ultrasonic wave, the vibration of the air is large, and at a portion other than the antinode, the vibration of the air is small. Therefore, at the time point when the generation of the ultrasonic wave starts, the vibration of the air caused by the ultrasonic wave at the position of the component can be effectively reduced. As a result, the deviation of the component from the adhesive sheet can be suppressed with high accuracy, and the holding tool can hold the component more appropriately.

[0036] In addition, in a third mode subordinate to the first mode or the second mode of the present disclosure, it is also possible that the control unit releases the component held by the holding tool by controlling the vibration of the ultrasonic wave generated by the ultrasonic wave generating unit in a state where the generation of the negative pressure by the negative pressure generating unit is suppressed.

[0037] Thus, since the generation of the negative pressure is suppressed, the attractive force of the holding tool for attracting the component can be weakened. Furthermore, by controlling the vibration of the ultrasonic wave, the repulsive force between the holding tool and the component can be enhanced. As a result, the component can be effectively released from the holding tool. In addition, in order to release the component from the holding tool, it is considered to eject the atmosphere from the opening of the holding tool. However, if the atmosphere is ejected, there is a possibility that dust around the holding tool will fly. And if the flying dust adheres to other components prepared for mounting on the substrate, the dust will enter the joint portion between the component and the substrate, and there is also a possibility of causing a poor joint. But in the above-mentioned third mode, since the atmosphere is not ejected, the flying of dust can be suppressed.

[0038] In addition, in a fourth mode subordinate to the third mode of the present disclosure, it is also possible that the control unit releases the component from the holding tool by increasing the vibration frequency of the ultrasonic wave generated by the ultrasonic wave generating unit after suppressing the generation of the negative pressure of the negative pressure generating unit.

[0039] Thereby, since the vibration frequency of the ultrasonic wave is increased, the repulsive force between the holding tool and the component can be appropriately enhanced. As a result, the component can be more effectively released from the holding tool.

[0040] In addition, in a fifth mode subordinate to the fourth mode of the present disclosure, it is also possible that if the component does not fall from the holding tool after a given time has elapsed after suppressing the generation of the negative pressure of the negative pressure generating unit, the control unit increases the vibration frequency of the ultrasonic wave generated by the ultrasonic wave generating unit.

[0041] Thereby, since the vibration frequency of the ultrasonic wave is not increased if the component falls within the given time, the unnecessary increase in the vibration frequency of the ultrasonic wave can be suppressed. As a result, the burden of the processing operation can be suppressed. In addition, when the vibration frequency of the ultrasonic wave is increased, although it is smaller than the ejection of the atmosphere, there is still a possibility of dust flying. However, since the increase in the vibration frequency of the ultrasonic wave is suppressed, the flying of dust can be further suppressed.

[0042] In addition, in a sixth mode subordinate to any one of the first to fifth modes of the present disclosure, it is also possible that the picking system further includes: an upper top that pushes up the component adhered to the adhesive sheet from below through the adhesive sheet, and the control unit further controls the upper top.

[0043] Thereby, by the pushing up of the upper top, the peeling of the component from the adhesive sheet can be promoted, and the attractive force based on the negative pressure and the repulsive force based on the ultrasonic wave can be weakened. As a result, the component can be efficiently held.

[0044] In addition, in a seventh mode subordinate to the sixth mode of the present disclosure, it is also possible that when the component is pushed up by the upper top, the control unit starts the generation of the ultrasonic wave of the ultrasonic wave generating unit.

[0045] Thereby, even in the case where the component is likely to deviate from the adhesive sheet due to the promotion of peeling caused by the pushing up, since the generation of the ultrasonic wave starts when the distance from the opening of the holding tool to the component becomes a specified distance, the deviation of the component can be suppressed. As a result, the component can be more effectively held.

[0046] In addition, in the 8th mode subordinate to the 6th mode or the 7th mode of the present disclosure, the upper top may also have a plurality of upper push pins, and after the control unit controls the upper top so that the plurality of upper push pins push the component up, only one of the plurality of upper push pins further pushes the component up.

[0047] Thus, since the component is pushed up by only one push pin, it is easy to adjust the inclination of the component with the front end of the push pin as a fulcrum. As a result, the mutually facing surfaces of the component and the holding tool can be made parallel, and the holding tool can appropriately hold the component.

[0048] In addition, in the 9th mode belonging to any one of the 1st mode to the 8th mode of the present disclosure, the control unit charges at least one of the opening of the holding tool and the surface of the component on the holding tool side by controlling the electrical equipment, thereby making the opening of the holding tool and the surface of the component have the same polarity.

[0049] Thus, since the opening of the holding tool and the surface of the component on the holding tool side have the same polarity, an electrical reaction force can be generated therebetween. As a result, contact of the component with the holding tool can be suppressed.

[0050] In addition, the general or specific manner of the control unit described above may also be implemented by a system, method, integrated circuit, computer program, or a computer-readable CD-ROM or other recording medium, or by any combination of systems, methods, integrated circuits, computer programs, or recording media. In addition, the recording medium may also be a non-temporary recording medium.

[0051] Hereinafter, embodiments will be described in detail with reference to the drawings.

[0052] In addition, the embodiments described below all represent general or specific examples. The numerical values, shapes, materials, components, configuration positions of components, connection forms, steps, and the order of steps shown in the following embodiments are examples and do not limit the subject matter of the present disclosure. In addition, the components in the following embodiments that are not recorded in the independent claims representing the highest concept are described as arbitrary components.

[0053] In addition, each figure is a schematic diagram and is not necessarily a strict illustration. In addition, in each figure, the same structural member is marked with the same figure mark. In addition, in the following embodiments, expressions such as "approximately at the same time" are used. For example, "approximately at the same time" does not only mean completely at the same time, but also means substantially at the same time, that is, for example, including an error of several %. In addition, "approximately at the same time" means at the same time within the range that can achieve the effect of the present disclosure. The same applies to other expressions using "approximately".

[0054] (Embodiment 1)

[0055] Figure 1 is a perspective view of the component mounting device in the present embodiment.

[0056] The component mounting device 1 in the present embodiment picks up components and mounts the picked-up components on the substrate 7. Therefore, the component mounting device 1 in the present embodiment includes a picking system for picking up components. In addition, the mounting of components on the substrate 7 is also referred to as the bonding of components to the substrate 7. In addition, the substrate 7 in the present embodiment is not limited to a specific type of substrate and may be a silicon substrate or a silicon chip, etc. In addition, in the present disclosure, the vertical direction is referred to as the Z-axis direction or the up-and-down direction, one direction in the plane perpendicular to the vertical direction is referred to as the Y-axis direction, the left-and-right direction or the lateral direction, and the direction perpendicular to the Y-axis direction in the perpendicular plane is referred to as the X-axis direction or the depth direction. In addition, in the present disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In addition, in the present disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In addition, in the present disclosure, the positive side of the X-axis direction is the inner side or the inside, and the negative side of the X-axis direction is the front side or the front.

[0057] The component mounting device 1 includes a base 2, a component supply unit 3, a substrate holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a picking camera 21. The base 2 is the base of the component mounting device 1 and supports each structural member included in the component mounting device 1.

[0058] The component supply unit 3 is placed on the base 2 and supplies components to the component holding unit 15. Such a component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a moving plate 32, and a plurality of support members 33. The holding table 3a holds the semiconductor wafer assembly 6 in a horizontal state. The semiconductor wafer assembly 6 is composed of an adhesive sheet 6b and a plurality of chips 6a. The plurality of chips 6a are single pieces or semiconductor chips obtained by scribing a semiconductor wafer and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is a sheet having adhesiveness. A plurality of chips 6a are pasted on the upper surface of the adhesive sheet 6b. The plurality of support members 33 are columnar members respectively placed on the moving plate 32 starting from the moving plate 32. The plurality of support members 33 support the holding table 3a in a state where the semiconductor wafer assembly 6 held by the holding table 3a is separated upward from the moving plate 32. The moving plate 32 is a plate disposed in the XY table mechanism 31. The XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction. Along with the movement of the moving plate 32, the semiconductor wafer assembly 6 moves in the X-axis direction and the Y-axis direction. That is, the plurality of chips 6a move along the XY plane.

[0059] The pick-up camera 21 is disposed above the component supply unit 3 and images the picked-up chip 6a among the semiconductor wafer assemblies 6.

[0060] The substrate holding unit 5 holds the substrate 7 in a state along the horizontal direction. Such a substrate holding unit 5 includes a transport rail 5a. Further, the substrate holding unit 5 positions and holds the substrate 7 transported through the transport rail 5a at the mounting position. The mounting position is the position where the chip 6a is mounted.

[0061] The component holding unit 15 includes an arm 15a, a pick-up head moving mechanism 15b, and a pick-up head 14. The arm 15a is a columnar member and is mounted on the pick-up head moving mechanism 15b in a state along the X-axis direction. That is, one end (i.e., the base end) in the long side direction of the arm 15a is mounted on the pick-up head moving mechanism 15b. In addition, the pick-up head 14 is mounted at the other end (i.e., the front end) of the arm 15a.

[0062] The pick-up head moving mechanism 15b is suspended from the Y-axis frame 11b in the frame 11 and moves the arm 15a in the X-axis direction, Y-axis direction, and Z-axis direction. Further, the pick-up head moving mechanism 15b rotates the arm 15a about the central axis in the long side direction of the arm 15a. That is, the pick-up head moving mechanism 15b rotates the arm 15a about the axis of the X-axis. The pick-up head 14 is mounted at the front end of the arm 15a as described above. In addition, the pick-up head 14 includes, for example, a metal pick-up nozzle 14a that vacuum-sucks and holds the chip 6a. In addition, vacuum suction is an operation of sucking the atmosphere. Therefore, the pick-up nozzle 14a moves in the X-axis direction, Y-axis direction, and Z-axis direction and rotates about the X-axis by the drive of the pick-up head moving mechanism 15b. In addition, the pick-up head moving mechanism 15b moves the pick-up nozzle 14a based on the imaging result of the pick-up camera 21. Thereby, the pick-up head moving mechanism 15b can lower the pick-up nozzle 14a to correctly approach the upper surface of the chip 6a to be picked up. In addition, the pick-up nozzle 14a in the present embodiment is also simply referred to as a nozzle and is an example of a holding tool having an opening for holding the chip 6a by vacuum suction.

[0063] Thus, the component holding unit 15 in the present embodiment uses the pick-up nozzle 14a, which is a liftable holding tool having an opening, to hold the chip 6a pasted on the adhesive sheet 6b from above.

[0064] The frame 11 is disposed on the positive X-axis side on the base 2 and includes two support columns 11a and a long Y-axis frame 11b. The two support columns 11a support the Y-axis frame 11b in a state where the Y-axis frame 11b is along the Y-axis direction and separated upward from the upper surface of the base 2. That is, the Y-axis frame 11b is suspended by the two support columns 11a. And, as described above, the pick-up head moving mechanism 15b is suspended from the Y-axis frame 11b.

[0065] The Y-axis drive mechanism 12 is installed on the surface of the Y-axis frame 11b on the negative X-axis side, and moves the component mounting portion 13 in the Y-axis direction. The component mounting portion 13 is provided with a mounting component 20. The component mounting portion 13 receives the chip 6a held by the pickup nozzle 14a from the pickup nozzle 14a using the mounting component 20, and mounts the chip 6a on the substrate 7 positioned at the mounting position.

[0066] Figure 2 It is a diagram for explaining the operation of the component mounting device 1 for mounting the chip 6a on the substrate 7.

[0067] The component mounting device 1 picks up the chip 6a configured at the pickup operation position P in the XY plane among the plurality of chips 6a pasted on the adhesive sheet 6b, and mounts the chip 6a on the substrate 7.

[0068] Specifically, the XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to position the chip 6a to be picked up at the pickup operation position P. The chip 6a to be picked up configured at such a pickup operation position P is pushed up by the upper top 34.

[0069] That is, as Figure 2 shown, the component mounting device 1 in the present embodiment includes an upper top 34 configured at the pickup operation position P. In addition, the upper top 34 can also be installed on the component supply unit 3. The upper top 34 pushes up the chip 6a pasted on the adhesive sheet 6b from below through the adhesive sheet 6b. Specifically, the upper top 34 pushes up the chip 6a to be picked up configured at the pickup operation position P.

[0070] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. Such a pickup camera 21 images the pickup operation position P and its periphery among the plurality of chips 6a pasted on the adhesive sheet 6b from above the component supply unit 3. Thereby, the chip 6a to be picked up is imaged, and the position of the chip 6a to be picked up is identified based on the imaging result. That is, the position identification 3 of the chip 6a is performed.

[0071] The pickup nozzle 14a of the pickup head 14 descends by the drive of the pickup head moving mechanism 15b, approaches the chip 6a whose position has been identified based on the imaging result of the pickup camera 21 from above, and holds the chip 6a. Then, the pickup nozzle 14a rises while holding the chip 6a, and then moves, for example, in the negative Y-axis direction. Here, the pickup nozzle 14a rotates the arm 15a realized by the pickup head moving mechanism 15b to make the lower surface (i.e., the bottom surface) of the held chip 6a face upward. Thus, the chip 6a is held by the pickup nozzle 14a in a state of being turned upside down.

[0072] As Figure 2 shown, the component mounting portion 13 not only includes the above-described mounting assembly 20, but also includes a moving plate 13a, a lifting mechanism 13b, and a lifting plate 13c. The moving plate 13a is a plate that is freely movable in the Y-axis direction and is mounted on the Y-axis drive mechanism 12. That is, the moving plate 13a moves in the Y-axis direction by the drive of the Y-axis drive mechanism 12.

[0073] The lifting mechanism 13b is mounted on the front surface of the moving plate 13a and raises and lowers the lifting plate 13c. The mounting assembly 20 is mounted on the lower portion of the lifting plate 13c. The mounting assembly 20 has a component mounting nozzle 20a. The component mounting nozzle 20, for example, receives the chip 6a from the pickup nozzle 14a that holds the chip 6a in an upside-down state. For example, the component mounting nozzle 20a moves above the chip 6a by the drives of the Y-axis drive mechanism 12 and the lifting mechanism 13b respectively, and holds the chip 6a by, for example, vacuum suction. And the component mounting nozzle 20a moves toward the substrate 7 side in the Y-axis direction while holding the chip 6a, and mounts the chip 6a on the substrate 7.

[0074] Figure 3 is a diagram showing an example of the structure of the pickup system in the present embodiment.

[0075] The pickup system 100 in the present embodiment is a system mounted on the component mounting device 1, and includes, for example, the above-described component holding portion 15, the upper top portion 34, and the control portion 101.

[0076] The component holding portion 15 includes a holding main body portion 15c and a pickup nozzle 14a. The holding main body portion 15c is constituted by, for example, the above-described arm 15a, the pickup head moving mechanism 15b, and the parts of the pickup head 14 other than the pickup nozzle 14a. The holding main body portion 15c includes an ultrasonic generating portion 152, a negative pressure generating portion 153, and a drive portion 154.

[0077] The ultrasonic generating portion 152 generates ultrasonic waves from the periphery of the opening 14b of the pickup nozzle 14a by vibrating the pickup nozzle 14a (i.e., ultrasonic vibration). That is, by performing ultrasonic vibration of the pickup nozzle 14a in the vertical direction, the vibration is transmitted to the air in contact with the lower surface of the pickup nozzle 14a. For example, the ultrasonic generating portion 152 vibrates the pickup nozzle 14a with an amplitude of up to about 10 to 20 μm.

[0078] The negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. In the present embodiment, the negative pressure generating unit 153 is configured as a vacuum pump, for example. Such a negative pressure generating unit 153 is a flow path formed in the pickup nozzle 14a, and generates negative pressure around the opening 14b by making the flow path 14c of the atmosphere connected to the opening 14b a negative pressure. In other words, the negative pressure generating unit 153 generates negative pressure around the opening 14b by sucking the atmosphere around the opening 14b through the flow path 14c.

[0079] The driving unit 154, for example, includes a motor, etc., and moves the pickup nozzle 14a in the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, the driving unit 154 rotates the pickup nozzle 14a of the pickup head 14 installed at the front end of the arm 15a by rotating the arm 15a. Such a driving unit 154 can also be incorporated into the pickup head moving mechanism 15b.

[0080] The top portion 34 includes a plurality of lift pins 34a, and the plurality of lift pins 34a are moved up and down. The plurality of lift pins 34a are moved up to push up the adhesive sheet 6b, thereby lifting the chip 6a attached to the adhesive sheet 6b.

[0081] The control unit 101 controls the upper top portion 34 and the component holding portion 15. That is, the control unit 101 controls the upper top portion 34, the driving unit 154, the ultrasonic wave generating unit 152, and the negative pressure generating unit 153.

[0082] Figure 4 This is a diagram for explaining an example of the basic operation of the pickup nozzle 14a picking up the chip 6a in this embodiment.

[0083] First, the moving plate 32 is moved by the XY table mechanism 31, and the adhesive sheet 6b held on the holding table 3a is moved in the X-axis direction and the Y-axis direction. Figure 4 As shown in (a) of FIG. 1 , the chip 6 a to be picked up is arranged at the picking work position P. That is, the chip 6 a to be picked up is arranged on the plurality of upper pins 34 a of the upper top portion 34 .

[0084] Next, if Figure 4 As shown in (b), the top portion 34 pushes the chip 6a up through the adhesive sheet 6b by raising the plurality of push pins 34a. If the chip 6a is pushed up through the adhesive sheet 6b in this way, it is easy to peel the chip 6a off the adhesive sheet 6b. That is, the peeling of the chip 6a from the adhesive sheet 6b is promoted. In addition, the peeling of the chip 6a can be further promoted by sucking the adhesive sheet 6b from below together with the pushing up of the chip 6a.

[0085] Next, if Figure 4As shown in (c), the pick-up nozzle 14a descends and holds the pushed-up chip 6a in a non-contact manner. That is, the pick-up nozzle 14a holds the chip 6a in a non-contact manner using an attractive force to pull the chip 6a closer to the opening 14b side of the pick-up nozzle 14a and a repulsive force to move the chip 6a away from the opening 14b. The attractive force is obtained by the generation of negative pressure by the negative pressure generation unit 153. For example, the distance from the pick-up nozzle 14a to the chip 6a, which is the distance at which the chip 6a can be sucked up by this attractive force, is approximately 0.05 to 1.0 mm. The repulsive force is obtained by the generation of ultrasonic waves by the ultrasonic wave generation unit 152.

[0086] Here, in the present embodiment, the chip 6a pasted on the adhesive sheet 6b is pushed up from below through the adhesive sheet 6b. Therefore, the peeling of the chip 6a from the adhesive sheet 6b can be promoted, and the attractive force based on negative pressure and the repulsive force based on ultrasonic waves can be weakened. As a result, the chip 6a can be held efficiently.

[0087] Then, as Figure 4 shown in (d), the pick-up nozzle 14a rises through the drive of the drive unit 154 while holding the chip 6a in a non-contact manner.

[0088] Here, depending on the timing of the generation of ultrasonic waves by the ultrasonic wave generation unit 152, the position of the chip 6a pasted on the adhesive sheet 6b may deviate. In such a case, the pick-up nozzle 14a cannot hold the chip 6a in a proper state.

[0089] Figure 5 is a diagram showing an example of a case where the position of the chip 6a pasted on the adhesive sheet 6b deviates.

[0090] As described above, the ultrasonic wave generation unit 152 causes ultrasonic waves to be generated from the periphery of the opening 14b of the pick-up nozzle 14a. The ultrasonic waves thus generated are density waves, which advance toward the chip 6a and are reflected on the upper surface of the chip 6a. As a result, a standing wave is formed from the ultrasonic waves. Therefore, in this ultrasonic wave, there are nodes and antinodes, and the positions of the nodes and antinodes are fixed without changing over time. At the antinode of the ultrasonic wave, the vibration of the air, which is the medium of sound, is large. On the other hand, at the node of the ultrasonic wave, the vibration of this air is small.

[0091] In addition, since the chip 6a receiving the ultrasonic waves is pushed up by a plurality of push-up pins 34a, it becomes a state in which it is easy to be peeled off from the adhesive sheet 6b.

[0092] Therefore, when the generation of ultrasonic waves starts in the middle of the descent of the pick-up nozzle 14a, for example, when the upper surface of the chip 6a is located at a position where an antinode of the ultrasonic wave is supposed to appear as in Figure 5 (a), the chip 6a shakes greatly due to the large vibration of the air. As a result, as Figure 5As shown in FIG. (b), the chip 6a will deviate from the adhesive sheet 6b. If the chip 6a deviates in this way, the pick-up nozzle 14a cannot hold the chip 6a in a proper state.

[0093] For this reason, in the present embodiment, the control unit 101 causes the ultrasonic wave generating unit 152 to start generating the ultrasonic wave when the upper surface of the chip 6a is located at the position where the node of the ultrasonic wave appears.

[0094] Figure 6 FIG. is an example showing the timing of starting the generation of the ultrasonic wave in the present embodiment.

[0095] The control unit 101 controls the drive unit 154 to lower the pick-up nozzle 14a to approach the chip 6a pushed up by the plurality of top pins 34a. Then, as Figure 6 shown in FIG. (a), the control unit 101 causes the ultrasonic wave generating unit 152 to start generating the ultrasonic wave when the upper surface of the chip 6a is located at the position where the node of the ultrasonic wave appears. The position where the node of the ultrasonic wave appears is defined corresponding to the frequency of the ultrasonic wave.

[0096] Specifically, between the pick-up nozzle 14a and the chip 6a, nodes appear every half wavelength of the ultrasonic wave, and antinodes appear every half wavelength of the ultrasonic wave. In addition, an antinode appears at the midpoint between two adjacent nodes, and a node appears at the midpoint between two adjacent antinodes. The wavelength of the ultrasonic wave is obtained by dividing the speed of the ultrasonic wave by the frequency of the ultrasonic wave (i.e., the vibration frequency). For example, the speed of the ultrasonic wave in the air at 20 °C is 343.5 m. Therefore, when the frequency of the ultrasonic wave is 35.2 kHz (i.e., 35200 Hz), the wavelength of this ultrasonic wave is 343.5 (m) / 35200 (Hz) ≈ 10 (mm). In addition, since the ultrasonic wave is generated from the periphery of the opening 14b of the pick-up nozzle 14a, an antinode of the ultrasonic wave appears at the periphery of the opening 14b, and a node of the ultrasonic wave appears at a position 1 / 4 wavelength away from the antinode toward the chip 6a side. When the wavelength is 10 mm, a node of the ultrasonic wave appears at a position 2.5 mm away from the opening 14b of the pick-up nozzle 14a toward the chip 6a side.

[0097] Therefore, when the upper surface of the chip 6a is at a position 2.5 m away from the opening 14b of the pick-up nozzle 14a toward the chip 6a side, the control unit 101 causes the ultrasonic wave generating unit 152 to start generating the ultrasonic wave. As a result, at the upper surface of the chip 6a, a node rather than an antinode of the ultrasonic wave appears, so that the chip 6a can be prevented from shaking due to the vibration of the air. As a result, the deviation of the chip 6a from the adhesive sheet 6b can be suppressed and the chip 6a can be stabilized.

[0098] In addition, in Figure 6In the example of (a), when the upper surface of the chip 6a is located at the position of the node where ultrasonic waves appear, the control unit 101 causes the ultrasonic wave generation unit 152 to start generating ultrasonic waves. However, the timing of starting the generation of the ultrasonic waves is not limited to this. The control unit 101 may also cause the ultrasonic wave generation unit 152 to start generating ultrasonic waves when the upper surface of the chip 6a is located at the position of the antinode where ultrasonic waves do not appear.

[0099] That is, when the distance from the opening 14b of the holding tool, i.e., the pick-up nozzle 14a, to the chip 6a pasted on the adhesive sheet 6b becomes a predetermined distance through the lifting of the pick-up nozzle 14a, the control unit 101 in the present embodiment causes the ultrasonic wave generation unit 152 to start generating ultrasonic waves. This predetermined distance is a distance defined corresponding to the frequency of the ultrasonic waves generated by the ultrasonic wave generation unit 152. Specifically, the predetermined distance is the distance from the opening 14b of the pick-up nozzle 14a to a portion other than the antinode in the ultrasonic waves generated by the ultrasonic wave generation unit 152. The positions of the antinode and node of the ultrasonic waves are defined according to the temperature of the air that becomes the medium for transmitting the ultrasonic waves and the frequency of the ultrasonic waves. In addition, as in Figure 6 the example of (a), the portion other than the antinode may be a node or a given range without an antinode centered on the position of the node. This given range may be, for example, a range of 1 / 4 wavelength.

[0100] Next, as shown in Figure 6 the (b), the control unit 101 causes the pick-up nozzle 14a to further descend by controlling the drive unit 154. For example, the drive unit 154 causes the pick-up nozzle 14a to descend at a speed of 5 mm / second. In addition, the drive unit 154 causes the pick-up nozzle 14a to approach the chip 6a so that the distance from the lower surface of the pick-up nozzle 14a to the upper surface of the chip 6a becomes 100 to 200 μm. Then, the control unit 101 causes the negative pressure generation unit 153 to start sucking air. As a result, a negative pressure is generated around the opening 14b of the pick-up nozzle 14a. As a result, the control unit 101 uses the attractive force based on the negative pressure around the opening 14b and the repulsive force based on the ultrasonic waves around the opening 14b to hold the chip 6a non-contactingly with the pick-up nozzle 14a. In such non-contact holding, a gap of, for example, about 25 μm in width is generated between the pick-up nozzle 14a and the chip 6a.

[0101] After that, as shown in Figure 6 the (c), the control unit 101 causes the pick-up nozzle 14a to rise by controlling the drive unit 154.

[0102] Thus, in the present embodiment, when the distance from the opening 14b of the pick-up nozzle 14a to the chip 6a reaches a specified distance, the generation of ultrasonic waves starts. This specified distance is the distance from the opening 14b of the pick-up nozzle 14a to the node of the ultrasonic waves. Therefore, at the time point when the generation of the ultrasonic waves starts, a node in the ultrasonic waves appears at the position of the chip 6a. Here, at the antinode of the ultrasonic waves, the vibration of the air is large, and at the node, the vibration of the air is small. Therefore, at the time point when the generation of the ultrasonic waves starts, the vibration of the air caused by the ultrasonic waves at the position of the chip 6a can be effectively reduced. As a result, the deviation of the chip 6a from the adhesive sheet 6b can be suppressed with high accuracy, and the pick-up nozzle 14a can hold the chip 6a more appropriately.

[0103] That is, when the pick-up nozzle 14a descends, as Figure 5 shown in the example of (a) of Figure 6 if the generation of ultrasonic waves starts at a timing earlier than the example of (a) of Figure 5 , the chip 6a will deviate from the adhesive sheet 6b. In addition, even when ultrasonic waves are generated starting from a timing further earlier than the example of (a) of Figure 5 , that is, when the pick-up nozzle 14a moves further upward away from the chip 6a, the situation shown in the example of (a) of Figure 5 will be generated by the descent of the pick-up nozzle 14a. For this reason, the chip 6a will deviate from the adhesive sheet 6b. However, in the present embodiment, as Figure 6 shown in the example of (a) of Figure 6 , by starting the generation of ultrasonic waves at a timing based on the specified distance, the deviation of the chip 6a from the adhesive sheet 6b can be suppressed. This specified distance is more specifically the distance from the opening 14b of the pick-up nozzle 14a to the first node of the ultrasonic waves. Therefore, even if the pick-up nozzle 14a descends further, as long as the pick-up nozzle 14a does not contact the chip 6a, the upper surface of the chip 6a will not be placed at a position where an antinode of the ultrasonic waves is assumed to appear. In addition, at the timing when the generation of ultrasonic waves starts, the pick-up nozzle 14a is in a state close to the chip 6a. Therefore, the chip 6a can be pulled closer to the pick-up nozzle 14a by the suction force based on negative pressure. For this reason, even if the pick-up nozzle 14a descends further, the deviation of the chip 6a from the adhesive sheet 6b can be suppressed, and the chip 6a can be stabilized.

[0104] In addition, in the present embodiment, the so-called ultrasonic non-contact chuck is realized by the generation of ultrasonic waves by the ultrasonic wave generation unit 152. That is, since a repulsive force can be obtained through the squeezing effect caused by the generation of ultrasonic waves, an appropriate repulsive force can be easily obtained. As a result, the chip 6a can be held efficiently and non-contactingly.

[0105] Figure 7 is a flowchart showing an example of the processing operation of the control unit 101 in the present embodiment.

[0106] First, the control unit 101 starts the upward pushing of the chip 6a by the upper top 34 (step S1).

[0107] Next, the control unit 101 controls the drive unit 154 to lower the pickup nozzle 14a (step S2) so that the node of the ultrasonic wave generated by the ultrasonic wave generation unit 152 in step S3 described later is located on the upper surface of the chip 6a. That is, the control unit 101 sets the distance from the opening 14b of the pickup nozzle 14a to the chip 6a pasted on the adhesive sheet 6b to the above-mentioned specified distance by lowering the pickup nozzle 14a.

[0108] Then, when the distance from the opening 14b of the pickup nozzle 14a to the chip 6a becomes the specified distance, the control unit 101 starts the generation of ultrasonic waves by the ultrasonic wave generation unit 152 (step S3). At this time, since the large shaking of the chip 6a is suppressed by this ultrasonic wave, the deviation of the chip 6a from the adhesive sheet 6b can be suppressed.

[0109] Next, the control unit 101 controls the drive unit 154 to further lower the pickup nozzle 14a (step S4). In addition, in steps S2 to S4, the pickup nozzle 14a may be lowered without stopping. Then, the control unit 101 causes the negative pressure generation unit 153 to generate a negative pressure to non - contact hold the chip 6a by the pickup nozzle 14a (step S5). That is, the control unit 101 generates the above - mentioned attraction force by causing the negative pressure generation unit 153 to generate a negative pressure. Then, the control unit 101 uses the attraction force to pull the chip 6a toward the opening 14b side of the pickup nozzle 14a and the repulsive force to move the chip 6a away from the opening 14b to non - contact hold the chip 6a by the pickup nozzle 14a.

[0110] After that, the control unit 101 controls the drive unit 154 to raise the pickup nozzle 14a (step S6).

[0111] In this way, in the present embodiment, after the chip 6a is upward - pushed, a negative pressure for non - contact holding the chip 6a by the pickup nozzle 14a is generated. Therefore, since the negative pressure is generated after the peeling of the chip 6a from the adhesive sheet 6b is promoted by upward - pushing the chip 6a, the negative pressure can be reduced.

[0112] In addition, in the present embodiment, the so - called ultrasonic non - contact chuck is realized by the generation of ultrasonic waves by the ultrasonic wave generation unit 152. That is, since a repulsive force can be obtained by the squeezing effect caused by the generation of ultrasonic waves, an appropriate repulsive force can be easily obtained. As a result, the chip 6a can be efficiently and non - contact held.

[0113] In addition, in the present embodiment, when the chip 6a is pushed up by the upper top portion 34, the control unit 101 starts the generation of ultrasonic waves by the ultrasonic wave generation unit 152. As a result, after the peeling of the chip 6a from the adhesive sheet 6b is promoted by the pushing up of the chip 6a, the vibration of the air caused by the ultrasonic waves can be further imparted to the chip 6a, and the peeling of the chip 6a can be further promoted. As a result, the negative pressure of the negative pressure generation unit 153 can be suppressed to a small value. In addition, even when the chip 6a is likely to deviate from the adhesive sheet 6b due to the promotion of peeling caused by the pushing up, since the generation of ultrasonic waves starts when the distance from the opening 14b of the pick-up nozzle 14a to the chip 6a becomes a specified distance, the deviation of the chip 6a can be suppressed. As a result, the chip 6a can be held more efficiently.

[0114] (Embodiment 2)

[0115] The pick-up system in the present embodiment further performs additional operations for appropriately picking up the chip 6a with respect to the operation of the pick-up system 100 in Embodiment 1.

[0116] Figure 8 FIG. is a diagram showing a structural example of the component mounting apparatus in the present embodiment and an example of the operation of mounting the chip 6a on the substrate 7 by the component mounting apparatus.

[0117] As Figure 8 shown, the component mounting apparatus 1a in the present embodiment includes each constituent element included in the component mounting apparatus 1 in Embodiment 1, a determination camera 22, and a collection box 9. The determination camera 22 images the chip 6a held by the pick-up nozzle 14a. The chip 6a is reflected in the captured image obtained by the imaging of the determination camera 22. Then, if it is determined by image analysis of the captured image that the chip 6a reflected in the captured image is a defective product, the chip 6a as the defective product is discarded or collected. The collection box 9 is, for example, an open box for collecting the defective chip 6a. In addition, the defective chip 6a is also referred to as a defective chip. In addition, in Figure 8 etc., in order to easily understand the chip 6a collected in the collection box 9, the collection box 9 is shown as a cross-sectional view in the YZ plane.

[0118] Specifically, if the pick-up nozzle 14a holds the chip 6a non-contactingly and rises, the pick-up nozzle 14a rotates around the X-axis by, for example, 90 degrees. Thereby, the lower surface of the chip 6a faces the determination camera 22. In addition, the lower surface of the chip 6a is the surface adhered to the adhesive sheet 6b and is the surface on the opposite side to the upper surface held by the pick-up nozzle 14a. When the lower surface of the chip 6a faces the determination camera 22, the determination camera 22 outputs a captured image by capturing the lower surface of the chip 6a. If there are scratches, defects, stains, etc. on the lower surface of the chip 6a reflected in the captured image, the chip 6a is determined to be a defective chip. As a result, the pick-up nozzle 14a is driven by the drive unit 154 to move above the recycling bin 9, and the chip 6a determined to be a defective chip is released and falls into the recycling bin 9. On the other hand, if it is determined that the chip 6a is not a defective chip, the pick-up nozzle 14a rotates around the X-axis to lift the chip 6a upward and transfers the chip 6a to the component mounting nozzle 20a of the mounting assembly 20.

[0119] Figure 9 It is a diagram showing an example of the structure of the pick-up system in the present embodiment.

[0120] The pick-up system 100a in the present embodiment is a system installed in the component mounting device 1a. Similar to the first embodiment, it includes a component holding unit 15, an upper top 34, and a control unit 101, and also includes the above-mentioned determination camera 22.

[0121] The control unit 101 in the present embodiment controls the determination camera 22 and performs image analysis of the captured image obtained by capturing with the determination camera 22. That is, the control unit 101 determines whether the chip 6a reflected in the captured image is a defective chip. Then, the control unit 101 controls the drive unit 154 based on the determination result. Specifically, the control unit 101 causes the pick-up nozzle 14a to perform the recycling of the defective chip to the recycling bin 9 or the transfer of the chip 6a from the pick-up nozzle 14a to the component mounting nozzle 20a.

[0122] Here, in the recovery of the defective chip to the recovery box 9, the control unit 101 suppresses the generation of negative pressure by the negative pressure generation unit 153. In one example, the control unit 101 stops the generation of negative pressure. However, if only the generation of negative pressure is stopped, sometimes the defective chip is not released from the pick-up nozzle 14a and is not recovered into the recovery box 9. In such a case, if the atmosphere in the flow path 14c of the pick-up nozzle 14a is adjusted to positive pressure and the atmosphere is ejected from the opening 14b of the pick-up nozzle 14a, the defective chip can be released from the pick-up nozzle 14a by the ejection of the atmosphere. However, if the atmosphere is ejected inside the component mounting device 1a, there is a possibility that dust will fly inside the component mounting device 1a. And if the flying dust adheres to other chips 6a prepared for mounting on the substrate 7, the dust will enter the bonding portion between the chip 6a and the substrate 7, and there is also a possibility of causing poor bonding. Or, there is a possibility that the chip 6a is further determined to be a defective chip and is recovered. In addition, in the ejection of the atmosphere, since it is necessary to further provide equipment such as piping for adjusting the atmosphere in the flow path 14c of the pick-up nozzle 14a to positive pressure in the pick-up system, there is also a problem that the structure of the pick-up system becomes complicated.

[0123] In addition, even when the generation of negative pressure is stopped, even if the generation of ultrasonic waves is simply continued, there are cases where the defective chip is not released from the pick-up nozzle 14a. The reasons are considered to be static electricity, residual pressure, ultrasonic waves, etc. For example, even when the generation of negative pressure is stopped, there is a possibility that the negative pressure remains temporarily as residual pressure. In addition, there is a possibility that ultrasonic waves generate a minute negative pressure around the opening 14b of the pick-up nozzle 14a. For this reason, especially for thin chips 6a, etc., even when the generation of negative pressure is stopped, it is difficult for the chip 6a to fall by its own weight and there are cases where it is not released from the pick-up nozzle 14a.

[0124] For this reason, the control unit 101 in the present embodiment increases the vibration of the ultrasonic waves generated from around the opening 14b of the pick-up nozzle 14a by controlling the ultrasonic wave generation unit 152. That is, the ultrasonic wave generation unit 152 generates ultrasonic waves with a vibration larger than that used when the chip 6a is held non-contactingly. Thus, by making the repulsive force that causes the defective chip to move away from the opening 14b act more strongly, the defective chip can be dropped and recovered from the pick-up nozzle 14a. In addition, in this case, since the atmosphere is not ejected, the flying of dust can be suppressed.

[0125] Figure 10 It is a diagram showing an example of the recovery of a defective chip.

[0126] The control unit 101 moves the pick-up nozzle 14a in the Y-axis direction by controlling the drive unit 154, as Figure 10As shown in (a) thereof, the chip 6a determined to be a defective chip is disposed above the recycling bin 9. Then, the control unit 101 sets the pickup nozzle 14a to the chip recycling state by rotating the pickup nozzle 14a around the X-axis implemented by the drive unit 154. In the chip recycling state, the opening 14b of the pickup nozzle 14a faces upward at an angle of, for example, 45 degrees downward from the Z-axis direction. Also, at this time, a negative pressure caused by suction is generated, and ultrasonic waves are also generated.

[0127] Then, as Figure 10 shown in (b) thereof, the control unit 101 controls the negative pressure generation unit 153 and the ultrasonic wave generation unit 152 to stop the generation of the negative pressure and make the vibration of the ultrasonic waves larger. The ultrasonic wave generation unit 152 controlled by the control unit 101 can increase the vibration frequency (i.e., frequency) of the ultrasonic waves or increase the amplitude of the ultrasonic waves. As a result, a repulsive force that causes the defective chip 6a to move away from the opening 14b acts strongly, and the defective chip falls from the pickup nozzle 14a. Then, the fallen defective chip is recycled into the recycling bin 9.

[0128] In this way, the control unit 101 in the present embodiment releases the chip 6a held by the pickup nozzle 14a by controlling the vibration of the ultrasonic waves generated by the ultrasonic wave generation unit 152 in a state where the generation of the negative pressure by the negative pressure generation unit 153 is suppressed. As a result, since the generation of the negative pressure is suppressed, the attractive force of the pickup nozzle 14a for attracting the chip 6a can be weakened. Furthermore, by controlling the vibration of the ultrasonic waves, the repulsive force between the pickup nozzle 14a and the chip 6a can be enhanced. As a result, the chip 6a can be effectively released from the pickup nozzle 14a. In addition, when the air is ejected, there is a possibility of dust flying. However, in the present embodiment, since the air is not ejected, the flying of dust can be suppressed. As a result, the occurrence of poor bonding between the other chip 6a and the substrate 7 as described above can be suppressed. Furthermore, since there is no need to additionally provide a device for ejecting air, the complication of the structure of the pickup system 100a can be suppressed.

[0129] In addition, specifically, the control unit 101 releases the chip 6a from the pickup nozzle 14a by increasing the vibration frequency of the ultrasonic waves generated by the ultrasonic wave generation unit 152 after suppressing the generation of the negative pressure by the negative pressure generation unit 153. As a result, since the vibration frequency of the ultrasonic waves increases, the repulsive force between the pickup nozzle 14a and the chip 6a can be appropriately enhanced. As a result, the chip 6a can be further effectively released from the pickup nozzle 14a. In the above example, the vibration frequency of the ultrasonic waves is increased after the suppression of the generation of the negative pressure. However, conversely, the generation of the negative pressure may be suppressed after the vibration frequency of the ultrasonic waves is increased. Alternatively, the suppression of the generation of the negative pressure and the increase in the vibration frequency of the ultrasonic waves may be performed simultaneously.

[0130] In addition, the control unit 101 may further stagger the timing to increase the vibration of the ultrasonic wave from the timing when the generation of the negative pressure stops. That is, after the negative pressure generation unit 153 stops generating the negative pressure, the control unit 101 determines whether the chip 6a has fallen from the pickup nozzle 14a within a given time. If the control unit 101 determines that the chip 6a has fallen within the given time, it causes the ultrasonic wave generation unit 152 to stop generating the ultrasonic wave. On the other hand, if the control unit determines that the chip 6a has not fallen even after the given time, it causes the ultrasonic wave generation unit 152 to increase the vibration of the ultrasonic wave. Here, the control unit 101 may also determine whether the chip 6a has fallen based on the imaging result of the chip 6a by the determination camera 22. In addition, when a pressure gauge or the like is provided in the recovery box 9, the control unit 101 may also determine whether the chip 6a has fallen corresponding to the pressure measured by the pressure gauge.

[0131] In this way, if the chip 6a has not fallen from the pickup nozzle 14a after a given time has elapsed since the generation of the negative pressure by the negative pressure generation unit 153 is suppressed, the control unit 101 in the present embodiment may also increase the vibration frequency of the ultrasonic wave generated by the ultrasonic wave generation unit 152. As a result, if the chip 6a falls within the given time, the vibration frequency of the ultrasonic wave is not increased, so that an unnecessary increase in the vibration frequency of the ultrasonic wave can be suppressed. As a result, the burden of the processing operation can be suppressed. In addition, when the vibration frequency of the ultrasonic wave increases, although it is smaller than the ejection of the atmosphere, there is still a possibility of dust flying. However, since an increase in the vibration frequency of the ultrasonic wave is suppressed, dust flying can be further suppressed.

[0132] Figure 11 It is a flowchart showing an example of the processing operation of the control unit 101 in the present embodiment.

[0133] The control unit 101, for example, after performing the processing of step S6 shown in Figure 7 , causes the determination camera 22 to image the chip 6a held by the pickup nozzle 14a (step S21).

[0134] Next, the control unit 101 determines whether the chip 6a is a defective product, that is, whether it is a wrong chip, based on the captured image obtained by imaging with the determination camera 22 (step S22). Here, if the control unit 101 determines that the chip 6a is not a wrong chip (step S22 "No"), it performs the transfer of the chip 6a from the pickup nozzle 14a to the component mounting nozzle 20a (step S28). That is, the control unit 101 controls the drive unit 154 to move and rotate the pickup nozzle 14a while arranging the chip 6a held by the pickup nozzle 14a at the transfer position to the component mounting nozzle 20a.

[0135] On the other hand, if the control unit 101 determines that the chip 6a is a defective chip (Yes in step S22), it moves the pickup nozzle 14a above the recycling bin 9 and tilts it (step S23). That is, the pickup nozzle 14a is set to the chip recycling state. Then, the control unit 101 suppresses the generation of negative pressure by controlling the negative pressure generation unit 153 (step S24). That is, the control unit 101 causes the negative pressure generation unit 153 to stop generating negative pressure.

[0136] After that, the control unit 101 determines whether the chip 6a determined to be a defective chip has fallen from the pickup nozzle 14a (step S25). Here, if it is determined that the chip 6a has fallen (Yes in step S25), the control unit 101 ends the process for the defective chip. On the other hand, if the control unit 101 determines that the chip 6a has not fallen (No in step S25), it determines whether a given time has elapsed since the process in step S24, that is, the stop of negative pressure generation (step S26). If the control unit 101 determines that the given time has not elapsed (No in step S26), it repeats the process in step S25. On the other hand, if the control unit 101 determines that the given time has elapsed (Yes in step S26), it increases the vibration frequency of the ultrasonic wave by the ultrasonic wave generation unit 152 (step S27). As a result, the chip 6a determined to be a defective chip falls from the pickup nozzle 14a and is recycled into the recycling bin 9.

[0137] In this way, in the present embodiment, defective chips can be recycled efficiently or effectively.

[0138] In addition, in the present embodiment, the pickup nozzle 14a holds the chip 6a non - contactingly, but even when the chip 6a is held in contact, ultrasonic waves can be used during the fall of the chip 6a.

[0139] Figure 12 It is a diagram showing another example of the recycling of defective chips. In Figure 12 the example, the pickup nozzle 14a holds the chip 6a determined to be a defective chip in contact therewith.

[0140] The control unit 101 controls the drive unit 154 to move the pickup nozzle 14a in the Y - axis direction. As shown in Figure 12 (a) of, the chip 6a determined to be a defective chip is arranged above the recycling bin 9. Then, the control unit 101 sets the state of the pickup nozzle 14a to the above - mentioned chip recycling state by rotating the pickup nozzle 14a around the X - axis realized by the drive unit 154. In addition, in Figure 12 (a) of, ultrasonic waves are not generated from the periphery of the opening 14b of the pickup nozzle 14a, and the pickup nozzle 14a vacuum - adsorbs the chip 6a by the negative pressure caused by suction.

[0141] Then, as shown inFigure 12 As shown in (b) thereof, the control unit 101 stops the generation of negative pressure and generates ultrasonic waves by controlling the negative pressure generation unit 153 and the ultrasonic wave generation unit 152. Thus, due to the repulsive force that causes the defective chip 6a to move away from the opening 14b, the defective chip falls from the pick-up nozzle 14a. Then, the fallen defective chip is collected in the collection box 9.

[0142] Even in such a case, since air is not ejected for the collection of defective chips, dust scattering can be suppressed. As a result, the occurrence of poor bonding can be suppressed.

[0143] (Other Modification Examples)

[0144] As described above, the pick-up system according to one or more aspects has been described based on each embodiment, but the present disclosure is not limited to these embodiments. As long as it does not depart from the gist of the present disclosure, a solution obtained by making various modifications conceived by those skilled in the art to the above-described embodiments and a configuration formed by combining the constituent elements in each embodiment may also be included in the present disclosure.

[0145] For example, in the above-described Embodiments 1 and 2, the chip 6a pushed up is held non-contact, but the chip 6a not pushed up may also be held non-contact. In addition, the chip 6a to be picked up may be adhered to the adhesive sheet 6b or placed on a tray or the like. Even in these cases, the control unit 101 may start the generation of ultrasonic waves of the ultrasonic wave generation unit 152 when the distance from the opening 14b of the pick-up nozzle 14a to the chip 6a reaches a specified distance.

[0146] In addition, in the above-described Embodiments 1 and 2, the negative pressure generation unit 153 generates negative pressure after starting the generation of ultrasonic waves and the pick-up nozzle 14a descends. However, the timing of generating negative pressure is not limited to this. For example, the negative pressure generation unit 153 may always generate negative pressure except during the collection of defective chips. Alternatively, the negative pressure generation unit 153 may generate negative pressure simultaneously with the generation of ultrasonic waves, or may generate negative pressure before the start of the generation of ultrasonic waves.

[0147] In addition, in the above-described Embodiments 1 and 2, when the component mounting nozzle 20a holds the chip 6a, the lower surface of the chip 6a contacts the component mounting nozzle 20a, but the lower surface of the chip 6a may be cleaned later.

[0148] In addition, in the above-described Embodiments 1 and 2, the pick-up nozzle 14a holds the chip 6a non-contact, but the component mounting nozzle 20a may also hold the chip 6a non-contact in the same manner as the pick-up nozzle 14a.

[0149] In addition, in the above-described Embodiment 2, it is determined that the determination camera 22 images the lower surface of the chip 6a. However, not only the lower surface but also, instead of the lower surface, the side surface of the chip 6a may be imaged. On the side surface of the chip 6a, cutting chips (e.g., Si, etc.) generated during dicing may sometimes adhere. Therefore, the chip 6a with such cutting chips adhering thereto can be recovered as a defective chip. In addition, the determination camera 22 may image the lower surface of the chip 6a from above. For example, the determination camera 22 is disposed at a position higher than the pick-up head 14 and the pick-up nozzle 14a at the pick-up operation position P shown in Figure 8 Then, the determination camera 22 images the lower surface of the chip 6a held by the pick-up nozzle 14a that is rotated, for example, 180 degrees around the X axis from above.

[0150] In addition, in the above-described Embodiment 2, in order to recover defective chips, the negative pressure generation unit 153 stops generating negative pressure. However, instead of stopping, the generated negative pressure may be reduced.

[0151] In addition, in the above-described Embodiments 1 and 2, the final step of pushing up the pushed-up chip 6a may be performed by pushing up with one pin (i.e., the push-up pin 34a).

[0152] Figure 13 is a diagram showing an example of pushing up the chip 6a.

[0153] As Figure 13 shown in (a) and (b) of, after the upper pushing portion 34 pushes up the chip 6a with a plurality of push-up pins 34a, in the final step, the center of the chip 6a is pushed up with one push-up pin 34b among the plurality of push-up pins 34a. As a result, the chip 6a can be moved by ultrasonic vibration from above. As a result, as Figure 13 shown in (c) of, the chip 6a can be picked up after correcting the parallelism between the chip 6a and the pick-up nozzle 14a.

[0154] Figure 14 is a diagram showing another example of pushing up the chip 6a.

[0155] When the outer shape of the chip 6a is large, if the chip 6a is pushed up with one push-up pin 34b, the chip 6a may sometimes break. For this reason, in such a case, as Figure 14 shown in (a) of, the diameter of the push-up pin 34b may be made larger than that of the other push-up pins 34a.

[0156] The pushing up of such a push-up pin 34b is performed by the control of the upper pushing portion 34 by the control unit 101. That is, the control unit 101 controls the upper pushing portion 34 so that after the plurality of push-up pins 34a push up the chip 6a, only one push-up pin 34b among the plurality of push-up pins 34a further pushes up the chip 6a.

[0157] Thus, since the chip 6a is only pushed up by one upper push pin 34b, it is easy to adjust the inclination of the chip 6a with the front end of the upper push pin 34b as a fulcrum. As a result, the surfaces of the chip 6a and the pick-up nozzle 14a facing each other can be made parallel, and the pick-up nozzle 14a can appropriately hold the chip 6a.

[0158] In addition, as shown in (b) of Figure 14 , the upper push pin 34b can also be constituted by a plurality of small-diameter pins 34c. The plurality of pins 34c function as one upper push pin 34b. In addition, the total cross-sectional area in the horizontal direction of the plurality of pins 34c can be the same as that of the upper push pin 34b, or can be the same as that of other upper push pins 34a other than the upper push pin 34b. That is, the plurality of pins 34b push up a part of the lower surface of the chip 6a having an area small enough with respect to the outer shape of the chip 6a.

[0159] Figure 15 is a diagram showing an example of the shape of the upper push pin 34a. In addition, Figure 15 The unit of the dimensions shown is, for example, mm.

[0160] As shown in Figure 15 , R processing can also be performed on the front end of the upper push pin 34a. Thereby, compared with a pin having a flat front end, the parallelism of the chip is corrected more appropriately. In addition, compared with a pin having a pointed front end, there is a feature that even when a thin chip 6a is pushed up, the chip 6a is less likely to break. The shape, dimensions, etc. of the upper push pin 34a can be appropriately adjusted corresponding to the outer shape, thickness, etc. of the chip 6a. In addition, Figure 15 the upper push pin 34a shown can be the upper push pin 34b or the pin 34c.

[0161] Figure 16 is a diagram showing another example of the pushing up of the chip 6a. In addition, Figure 16 (a), (b1), (b2), and (b3) in (A) of Figure 16 show examples in which the chip 6a is inappropriately held, and

[0162] (a) and (b) in (B) of Figure 16 show examples in which the chip 6a is appropriately held. Figure 16Improper holding of the chip 6a as shown in (b1), (b2), or (b3) of (A). That is, as shown in (b1), one-sided warping of the chip 6a occurs before holding the chip 6a. That is, only one end of the chip 6a is pulled closer to the pick-up nozzle 14a side. Or, as shown in (b2), when holding the chip 6a, the chip 6a comes into contact with the pick-up nozzle 14a and is adsorbed. Or, as shown in (b3), when holding the chip 6a, the chip 6a is unstable and moves around randomly.

[0163] Therefore, it is also possible to make the surfaces of the opening 14b of the pick-up nozzle 14a and the upper surface of the chip 6a have the same polarity for picking up. That is, as Figure 16 shown in (a) of (B), an electrical device 35 such as an ionizer is used to make the surface of the chip 6a negatively charged. Thus, as Figure 16 shown in (b) of (B), the contact between the pick-up nozzle 14a and the chip 6a can be suppressed by the electrical reaction. Such an electrical device 35 such as an ionizer is controlled by the control unit 101, for example. That is, the control unit 101 makes at least one of the opening 14b of the pick-up nozzle 14a and the surface of the chip 6a on the pick-up nozzle 14a side of the pick-up nozzle 14a charged by controlling the electrical device, thereby making the opening 14b of the pick-up nozzle 14a and the above-mentioned surface of the chip 6a have the same polarity.

[0164] As a result, since the opening 14b of the pick-up nozzle 14a and the surface of the chip 6a on the pick-up nozzle 14a side have the same polarity, an electrical reaction force can be generated between them. As a result, the contact of the chip 6a with the pick-up nozzle 14a can be suppressed.

[0165] In addition, in each of the above embodiments, the control unit 101 and the like can be constituted by dedicated hardware, or can be implemented by executing a software program suitable for the control unit 101. The control unit 101 can also be implemented by a program execution unit such as a CPU (Central Processing Unit) or a processor reading out and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory. Here, the software for implementing the control unit 101 and the like in the above embodiments causes a computer to execute, for example, Figure 7 or Figure 11 each step of the flowchart shown.

[0166] In addition, the following cases are also included in the present disclosure.

[0167] (1) The control unit 101 may specifically be a computer system composed of a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), a hard disk component, a display component, a keyboard, a mouse, etc. A computer program is stored in the RAM or the hard disk component. By operating according to the computer program by the microprocessor, the control unit 101 achieves its functions. Here, the computer program is composed of combining a plurality of command codes representing instructions for the computer in order to achieve a given function.

[0168] (2) The control unit 101 may also be composed of one system LSI (Large Scale Integration). The system LSI is a super multi-functional LSI manufactured by integrating a plurality of structural parts on one chip. Specifically, it is a computer system including a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. By operating according to the computer program by the microprocessor, the system LSI achieves its functions.

[0169] (3) The control unit 101 may be composed of a detachable IC card or a single module. The IC card or the module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or the module may also include the above-mentioned super multi-functional LSI. By operating according to the computer program by the microprocessor, the IC card or the module achieves its functions. The IC card or the module may also have tamper resistance.

[0170] (4) The present disclosure may also be the method shown above. In addition, it may also be a computer program for implementing these methods by a computer, or a digital signal composed of a computer program.

[0171] In addition, the present disclosure may record the computer program or the digital signal on a computer-readable recording medium, such as a floppy disk, a hard disk, a CD (Compact Disc)-ROM, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. In addition, it may also be a digital signal recorded on these recording media.

[0172] In addition, the present disclosure may also transmit the computer program or the digital signal via an electrical communication line, a wireless or wired communication line, a network represented by the Internet, data broadcasting, etc.

[0173] In addition, it may also be implemented by an independent other computer system by recording the program or the digital signal on a recording medium and transferring it, or by transferring the program or the digital signal via a network or the like.

[0174] Industrial Applicability

[0175] The present disclosure can be utilized, for example, in a system that picks up a component and performs an operation using the component.

[0176] Explanation of Reference Numerals

[0177] 1, 1a Component Mounting Device

[0178] 2 Base

[0179] 3 Component Supply Unit

[0180] 3a Holding Workbench

[0181] 5 Substrate Holding Unit

[0182] 5a Conveyor Track

[0183] 6 Semiconductor Wafer Assembly

[0184] 6a Chip (Component)

[0185] 6b Adhesive Sheet

[0186] 7 Substrate

[0187] 9 Recycling Bin

[0188] 11 Frame

[0189] 11a Support Column

[0190] 11b Y - Axis Frame

[0191] 12 Y - Axis Driving Mechanism

[0192] 13 Component Mounting Portion

[0193] 13a Moving Plate

[0194] 13b Lifting Mechanism

[0195] 13c Lifting Plate

[0196] 14 Pickup Head

[0197] 14a Pickup Suction Nozzle (Holding Tool)

[0198] 14b Opening

[0199] 14c Flow Path

[0200] 15 Component Holding Portion

[0201] 15a Arm

[0202] 15b Pickup Head Moving Mechanism

[0203] 15c Holding Main Body Portion

[0204] 20 Mounting Component

[0205] 20a Component Mounting Nozzle

[0206] 21 Pick-up Camera

[0207] 22 Judgment Camera

[0208] 31 XY Table Mechanism

[0209] 32 Moving Plate

[0210] 33 Support Member

[0211] 34 Upper Top

[0212] 100, 100a Pick-up System

[0213] 101 Control Unit

[0214] 152 Ultrasonic Generation Unit

[0215] 153 Negative Pressure Generation Unit

[0216] 154 Driving Unit.

Claims

1. A picking system comprising: Holding tool, with opening and free lifting and lowering; a negative pressure generating portion for generating negative pressure around the opening of the holding tool; an ultrasonic wave generating unit configured to generate ultrasonic waves from the periphery of the opening; and a control unit, controlling the negative pressure generating unit and the ultrasonic generating unit, The control unit performs the following processing: When the distance from the opening of the holding tool to the component attached to the adhesive sheet becomes a predetermined distance determined in advance by the lifting and lowering of the holding tool, the ultrasonic wave generating unit starts generating ultrasonic waves, The holding tool holds the component in a non-contact manner using an attractive force based on negative pressure around the opening and a repulsive force based on ultrasonic waves around the opening, The predetermined distance is a distance that is determined according to the frequency of the ultrasonic wave generated by the ultrasonic wave generating unit.

2. The picking system according to claim 1, wherein: The predetermined distance is a distance from the opening of the holding jig to a portion other than an antinode of the ultrasonic wave generated by the ultrasonic wave generating unit.

3. The picking system according to claim 1, wherein: The control unit releases the component held by the holding tool from the holding tool by controlling the vibration of the ultrasonic wave generated by the ultrasonic wave generating unit in a state in which the generation of negative pressure by the negative pressure generating unit is suppressed.

4. The picking system according to claim 3, wherein: The control unit releases the component from the holding tool by increasing the vibration frequency of the ultrasonic wave generated by the ultrasonic wave generating unit after suppressing the generation of negative pressure by the negative pressure generating unit.

5. The picking system according to claim 4, wherein: The control unit increases the vibration frequency of the ultrasonic wave generated by the ultrasonic wave generating unit if the component does not fall from the holding jig after a predetermined time has passed since the generation of the negative pressure by the negative pressure generating unit was suppressed.

6. The picking system according to any one of claims 1 to 5, wherein: The picking system also has: The component attached to the adhesive sheet is pushed upward from the bottom through the adhesive sheet. The control unit further controls the upper top portion.

7. The picking system according to claim 6, wherein: The control unit starts the generation of ultrasonic waves by the ultrasonic wave generating unit when the component is pushed up by the upper portion.

8. The picking system according to claim 7, wherein: The upper top portion is provided with a plurality of upper ejector pins. The control unit controls the lift head so that, after the plurality of lift pins have pushed up the component, only one of the plurality of lift pins further pushes up the component.

9. The picking system according to claim 1, wherein: The control unit controls an electrical device to charge at least one of the opening of the holding tool and a surface of the component on the holding tool side, thereby making the opening of the holding tool and the surface of the component have the same polarity.

10. A picking method, The negative pressure generating unit generates negative pressure around the opening of the lifting and lowering holding tool. Cause the ultrasonic generating unit to generate ultrasonic waves from the periphery of the opening. Use the suction force based on the negative pressure at the periphery of the opening and the repulsive force based on the ultrasonic waves at the periphery of the opening to hold the component non - contactingly with the holding tool. During the generation of the ultrasonic waves. When the distance from the opening of the holding tool to the component pasted on the adhesive sheet becomes a predetermined distance through the lifting of the holding tool, cause the ultrasonic generating unit to start generating the ultrasonic waves. The predetermined distance is a distance specified corresponding to the frequency of the ultrasonic waves generated by the ultrasonic generating unit.

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