Support device with pulsating heat pipe, power module and computer program product

By constructing the pulsating heat pipe and using a diffusion suppression coating in the support device of the power circuit, the problem of low heat dissipation efficiency of the conductive connection elements is solved, an efficient, reliable and low-cost heat dissipation solution is achieved, and the service life of the device is extended.

CN120226146APending Publication Date: 2025-06-27SIEMENS AG
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Patent Information

Application Number
CN202380083026.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-12-01
Filing Date
2023-10-24
Publication Date
2025-06-27

AI Technical Summary

Technical Problem

While improving the heat dissipation efficiency of power circuits, it is difficult to realize a cost-effective, reliable and low-wear heat dissipation solution, especially in the heat dissipation of conductive connection elements.

Method used

A support device is designed that transfers heat from the conductive connection element to the radiator by constructing a pulsating heat pipe and uses a diffusion suppression coating in some areas to reduce fluid contamination. The support device is partially made of plastic, which uses thermally conductive particles and fibers to improve thermal conductivity, and achieves rapid and simple manufacturing through an additive manufacturing process.

Benefits of technology

It achieves efficient and self-adjusted heat dissipation effect, reduces fluid pollution, extends the service life of the support device, and reduces manufacturing costs, and is suitable for a variety of application scenarios.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a support device (10) for mechanically supporting an electrically conductive connection element (12) to be cooled on a heat sink (14), said support device electrically insulating the connection element (12) from the heat sink (14). According to the invention, at least one pulsating heat pipe (30) for dissipating heat from the connecting element (12) into the heat sink (14) is formed in the support device (10). The invention also relates to a power module (50) equipped with at least one such support device (10). The invention further relates to a computer program product (60) which is designed to simulate an operating behavior of such a support device (10).
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Description

Field of the Invention

[0001] The present invention relates to a support device for a conductive connection element and a power module having such a support device. The present invention also relates to a computer program product for simulating the operating behavior of such a support device. Background Art

[0002] An international application with the document number PCT / EP2022 / 075791, which has not been published so far, discloses a thermally conductive bracket in which channels are formed and can be used as heat pipes. The channels extend substantially along the cylindrical outer peripheral surface in the plastic body and are closed by metal elements on the end faces of the bracket.

[0003] European Patent Application EP 3 336 471 A1 discloses an electronic substrate to be cooled. The electronic substrate has channels located in the substrate plane and passing through the substrate. The channels form a circuit and are used as pulsating heat pipes.

[0004] Patent Document US 6,672,373 B2 describes a pulsating heat pipe that has different diameters and radii of curvature in segments. The pulsating heat pipe is also provided with a compensation container for its fluid. Summary of the Invention

[0005] Power circuits with increased electric power are used in a plurality of applications. Therefore, increased requirements are placed on the heat dissipation of such circuits. At the same time, the goal is to achieve cost-effective and reliable heat dissipation in the power circuit. Low-wear operation is also a priority. This applies in particular to the heat dissipation of the conductive connection elements of such a power circuit, for example its conductive rails. The object of the present invention is to provide a feasible solution for the heat dissipation of a power circuit that provides an improvement in at least one of the above aspects.

[0006] This task is solved by a support device according to the invention, which is suitable for mechanically supporting the conductive connection element to be cooled. The mechanical support can be point-based here. The conductive connection element can be designed as a conductive rail, for example. The conductive connection element (hereinafter also only referred to as the connection element) belongs to an electrical circuit, such as a power module, and the conductive connection element is mechanically supported on the heat sink by the support device, and the heat from the connection element dissipates into this heat sink. The connection element is electrically insulated from the heat sink by the support device. For this purpose, the support device can be at least partially made of plastic, for example. According to the invention, at least one pulsating heat pipe is constructed in the support device, and heat can be transferred from the connection element to the heat sink through this heat pipe. Such a pulsating heat pipe is also called a pulsating heat pipe in English technical terms. In this application, the pulsating heat pipe is also simply referred to as a heat pipe. At least one pulsating heat pipe can be designed as a closed loop or as a pulsating heat pipe with two ends. Here, the pulsating heat pipe can form a loop. At least one pulsating heat pipe is designed to transfer heat from the connection element side end to the heat sink side end of the support device. Therefore, the pulsating heat pipe in the support device is used to dissipate the heat from the hot connection element to the heat sink. Here, the heat sink can be designed as a cooling body, as a housing component or as a component of another electrical circuit.

[0007] Efficient heat dissipation is provided by the pulsating heat pipe, and this heat dissipation can be self-running, that is, not controlled, and can be miniaturized. The pulsating heat pipe can also be geometrically adapted and thus integrated into multiple different types of support devices. In addition, the support device can be at least partially made of an electrically insulating plastic with a reduced thermal conductivity. In the support device according to the invention, the use of costly materials that are electrically insulating and at the same time have an increased thermal conductivity is minimized. The support device can be at least partially made of plastic that can be easily processed, which in turn allows for the rapid, simple and at the same time precise manufacture of at least one pulsating heat pipe.

[0008] In the support device according to the invention, at least one pulsating heat pipe is at least partially provided with a diffusion suppression coating. The diffusion suppression coating can be constructed as a metal coating or a ceramic or glassy coating. The diffusion suppression coating is designed to prevent liquids, such as water vapor or gases from the ambient air, from entering the pulsating heat pipe. Thereby, the contamination of the fluid in the pulsating heat pipe can be reduced or avoided. A negative pressure can exist in at least one pulsating heat pipe relative to the ambient air, and this negative pressure can be changed by dirt. Such a pulsating heat pipe can operate persistently and reliably with the corresponding coating. Thereby, an increased service life of the claimed support device is generally ensured.

[0009] In an embodiment of the claimed support device, the support device is made of a first material having a first thermal conductivity in the middle section. In addition, the support device is made of a second material having a second thermal conductivity at one connection element side end and / or at the radiator side end. Here, the middle section is understood as the section of the support device between the connection element side end and the radiator side end. In the middle section, the thermal edge effect occurring at the connection element side end and / or at the radiator side end can be minimized. In addition, the second thermal conductivity can be higher than the first thermal conductivity. Thereby, an improved thermal coupling of the support device to the connection element and / or the radiator is achieved. The first material and the second material can each be configured as a plastic in which a preset content of heat-conducting particles and / or fibers is present. The heat-conducting particles can be added to the plastic, for example, by an additive manufacturing method. The particles or fibers can be made at least partially of glass, ceramic, metallic material, or carbon. In addition, the particles and / or fibers can be accommodated in the corresponding components of the support device such that the support device is in electrical contact with the radiator side end or the connection element side end to the greatest extent possible. The middle section and the connection element side or radiator side end made of the first material and the second material respectively can be designed as separate components of the support device or as an integral part. In addition, the middle section, the connection element side end, and / or the radiator side end can be manufactured by injection molding. There can be a substantially discrete boundary or a preset transition between the first material and the second material. The discrete boundary and the preset transition can be manufactured, for example, by an additive manufacturing method. Alternatively or additionally, an adhesive connection or a weld can also be provided on the preset transition. In addition, a sealing element can also be arranged on the preset transition. If the middle section and the connection element side end or the radiator side end are designed as separate components, that is, the support device has a differential design, they can be made entirely of the first material and the second material.

[0010] In addition, mounting bases can be constructed on the connection element side end and / or on the radiator side end of the claimed support device. The mounting bases can be constructed on the connection element side end or on the radiator side end and are designed substantially in a two-dimensional manner. At least one pulsating heat pipe extends at least partially through the mounting base. The mounting base provides an enlarged area for thermal coupling of the support element to the connection element and / or the radiator.

[0011] In a further embodiment of the claimed support device, at least one pulsating heat pipe is at least partially filled with an electrically conductive fluid. The electrically conductive fluid can be, for example, water or an aqueous solution. By means of the claimed support device, the connecting element is electrically insulated from the heat sink, such that there is no risk of the heat sink being charged when using an electrically conductive fluid. It is not necessary to use an electrically insulating fluid or a fluid with a negligible conductivity (< 100 μS / cm, in particular < 10 μS / cm) in the claimed support device. Accordingly, a wider range of fluids can be utilized, by means of which the heat transfer characteristics of the pulsating heat pipe can be specified more precisely. In particular, water, ethanol, a coolant, a ferrofluid, an electron fluid or a dielectric fluid, such as a perfluorinated compound (2-methyl-3-pentanone), can be used as the fluid. The fluid can be doped with metal particles, by means of which the current heat dissipation efficiency of at least one pulsating heat pipe can be measured. The claimed support device can generally be manufactured cost-effectively and can be adapted as required to a wide range of applications.

[0012] Furthermore, the claimed support device can be designed as an integral unit. For this purpose, the support device can be manufactured substantially entirely by additive manufacturing, such as 3D printing. By additive manufacturing, a larger number of pulsating heat pipes can be produced while maintaining the same structural space, and the net diameter and / or the radius of curvature of at least one pulsating heat pipe can be reduced. Thereby, at least one pulsating heat pipe is even suitable for performing heat dissipation on the slender section of the support device. Thus, an improved heat dissipation efficiency can be achieved. Optionally, the claimed support device can include a core section and a bell-shaped section. The bell-shaped section can be sleeved onto the core section during installation. At least one pulsating heat pipe can be formed by grooves or a combination of grooves on the core section and / or the bell-shaped section. The grooves or the combination of grooves can be manufactured respectively by injection molding or integral molding of the core section and / or the bell-shaped section or by machining the core section and / or the bell-shaped section. The core section and the bell-shaped section can be manufactured quickly and simply respectively, whereby the claimed support device can also be manufactured cost-effectively. In addition, the bell-shaped section can also be used to construct the connection element side or the radiator side of the support device. If the contact surfaces at the connection element side and the radiator side are not parallel, the bell-shaped section can include the radiator side and the connection element side of the support device. In particular, the core section can be made of a first material having a first thermal conductivity, and the bell-shaped section can be made of a second material having a second thermal conductivity. Optionally, the core section and / or the bell-shaped section can also be segmented and made of the first material and the second material respectively. Thus, the heat transfer characteristics of at least one pulsating heat pipe can be further set by the structures of the core section and the bell-shaped section. In addition, the bell-shaped section and the core section can also be configured in a conical shape, especially with an improved mating draft angle. In particular, in this way, the gap between multiple adjacent pulsating heat pipes can be simply avoided. The bell-shaped section and / or the core section can have different optical transmission characteristics, whereby these sections can be connected to each other, for example, by laser beam welding. Similarly, the bell-shaped section can be made of a transparent material, which allows for a simple visual inspection of the support device.

[0013] Furthermore, in the claimed support device, a plurality of pulsating heat pipes can be constructed in the region of the circumferential wall, which is located between the side end of the connecting element and the side end of the radiator. The circumferential wall can extend from the side end of the connecting element to the side end of the radiator and connect them. The circumferential wall defines the surface of the support device in the middle section. The circumferential wall can be designed substantially as a cylindrical outer surface. Optionally, the circumferential wall can be designed as any cylindrical outer surface. The pulsating heat pipes can be located in the region of the surface inside the support device, which is beneficial for heat dissipation to the ambient air. The pulsating heat pipes can extend especially up to 5 mm below the surface area of the circumferential wall within the middle section of the support device. Additionally, the increased surface energy is used for the pulsating heat pipes, thereby further supporting the heat dissipation of the connecting element. Providing an increased surface area enables the grooves for the pulsating heat pipes to be manufactured with increased manufacturing tolerances, which in turn simplifies the manufacturing. Furthermore, in a support device having a bell-shaped section and a core section, the bell-shaped section has a thin wall, which can also simplify the manufacturing, for example, by injection molding.

[0014] In a further embodiment of the claimed support device, the diffusion-inhibiting coating can be manufactured by chemical vapor deposition, physical vapor deposition, sol-gel process, thermal spraying, vapor deposition, autocatalytic coating or by an electroplating process.

[0015] Furthermore, in the claimed support device, its circumferential wall, its side end of the connecting element and / or its side end of the radiator can be provided with a diffusion-inhibiting coating. The diffusion-inhibiting coating can be designed as a metal coating, a ceramic or a glassy coating. A negative pressure can exist with respect to the ambient air at at least one pulsating heat pipe. By means of this diffusion-inhibiting coating, the penetration of liquids (such as water vapor) or gases from the ambient air into the support device can be reduced or avoided. The coating of the circumferential wall, the side end of the connecting element and / or the side end of the radiator can be constructed on its surface or arranged inside it. The coating on the surface can be manufactured in a particularly simple manner. The coating located inside the circumferential wall, inside the side end of the connecting element and / or inside the side end of the radiator is in turn protected by the corresponding components. Therefore, when in permanent contact with the ambient air, the coating can be made of a chemically unstable material. By avoiding mechanical stress, the coating can have a reduced coating thickness. Additionally, such a coating can be produced by means of an additive manufacturing process. Furthermore, such a coating provides the claimed support device with increased insulation strength.

[0016] In the claimed support device, at least one pulsating heat pipe can also be enclosed by the radiator and / or the connecting element to be cooled. At least one pulsating heat pipe can be designed as a through-hole that extends through the middle section of the support device in the region of the circumferential wall. On the end face of the support device, at least one pulsating heat pipe can continue as a groove, i.e., essentially as an open channel that is closed by the connecting element or the radiator in the installed state. In such a support device, an electrically insulating fluid is used in the pulsating heat pipe. The corresponding support device has a reduced number of components and can thus be manufactured in a particularly simple manner. In addition, a more direct thermal contact with the connecting element or with the radiator can be established in this way.

[0017] In addition, the claimed support device can include a sensor that is designed to detect at least one physical variable of the pulsating heat pipe and / or the components of the support device. For example, the sensor can be designed as a pressure sensor or a temperature sensor, through which the pressure or temperature of the fluid in the pulsating heat pipe can be detected. The pressure or temperature of the fluid can be used to infer the degree of heat transfer capacity of the pulsating heat pipe at a given measurement time. The sensor can also be designed to detect vibrations. In addition, the sensor can be designed to perform so-called energy harvesting. For this purpose, the sensor can, for example, have a thermoelectric generator or a piezoelectric film and / or obtain electrical energy for the operation of the sensor by induction. The sensor can thus operate reliably for a long time. In addition, the sensor can have a communication unit, especially a wireless communication unit. This can simplify the monitoring of the state of the support device. Based on the data obtained via the sensor, an application using the support device, such as a power module, can be optimized in terms of thermal load. Faults can also be detected and the remaining technically available service life of the support device can be estimated.

[0018] In addition, the support device claimed for protection can have a groove on the side end of the connecting element and / or on the side end of the radiator, through which a toothed surface is formed. The groove can be constructed on the end face of the support device, for example. The toothed surface is used for thermal coupling to the connecting element or radiator to be cooled. The groove constitutes an enlarged surface in the area of ​​the connecting element side or the radiator side end, at which surface a heat-conducting contact with the connecting element or the radiator can be established. Improved thermal coupling can be achieved while saving structural space. Therefore, the support device claimed for protection can be adapted to applications with improved miniaturization, especially power modules. At least one heat pipe can extend in the area of ​​the groove, especially in the area of ​​the wall defining the groove. The pulsating heat pipe can be constructed in a substantially U-shaped manner in the area of ​​the groove. The groove also provides for centering of the installation of the support device. In particular, the groove can be constructed in the end face of the core section of the support device. The groove in the core section is centered with the corresponding bell-shaped section of the support device. In addition, a coupling element can be accommodated in the groove forming the toothed surface for thermal coupling, and the coupling element is made of a metal material. The coupling element is designed for thermal connection between the connecting element or the heat sink and the supporting device via a toothed surface. In addition, the toothed surface and / or the coupling element can be conically shaped, thereby ensuring simple and precise manufacturing. In addition, the toothed surface and / or the coupling element can be designed for mutual crimping, or can be undercut, thereby enabling the construction of a form-locking connection. In addition, the toothed surface and the coupling element can be connected to each other by bonding. The coupling element can be designed as a bushing and / or can be designed for the construction of a detachable connection with the connecting element or the heat sink. For this purpose, the coupling element can be provided with a threaded hole, for example. In the installed state, the coupling element is subjected to minimized tensile stress and peeling stress. On the contrary, the coupling element is mainly subjected to shear stress. This means that the coupling element is subjected to mechanical stress suitable for the component.

[0019] In another embodiment, the support device claimed is at least partially produced by an additive manufacturing process. The support device can be designed as an integral part and produced in sections by an additive manufacturing process, or manufactured as a component. The additive manufacturing process allows the production of a support device with locally adjustable properties (especially thermal conductivity) by a pre-set additive mixture (such as heat-conducting particles). In addition, the additive manufacturing process can simply and cost-effectively manufacture fine or geometrically complex, such as interlocking pulsating heat pipes. This can further fully utilize the technical characteristics of the materials used. This in turn allows for a stronger miniaturization of the support device claimed. The additive manufacturing process can be, for example, 3D printing, a printing method without a powder bed, in particular fused deposition modeling, stereolithography or a jetting method.

[0020] The described task is also solved by an execution module according to the invention. The power module can for example belong to a so-called power module or converter. The power module includes a substrate which is provided with at least one conductive connecting element, such as a conductive rail, which is cooled in the active operating state of the power module. The connecting element is mounted on a heat sink in a manner supported by a support device in the power module, and the connecting element can dissipate heat into the heat sink. According to the invention, the support device is constructed according to at least one of the above-described embodiments. Thus, the features of the claimed support device can be similarly transferred to the power module according to the invention. The claimed power module can, together with a superior control unit, belong to a system by which the above task can also be solved. The system is designed to monitor the operating state of the power module. For this purpose, at least one support device in the power module has a sensor which is communicatively coupled indirectly or directly to the superior control unit. The superior control unit is designed to evaluate the data received from the sensor and output a warning. The superior control unit can be integrated into the power module.

[0021] Furthermore, the underlying task is solved by a computer program product according to the invention, which is constructed to simulate the operating behavior of the support device. The operating behavior to be simulated can exist during the active operation of a power module in which the support device is arranged. The computer program product includes instructions which, when the computer program product is implemented by a computer, cause the computer program product to simulate the operating behavior of the support device. According to the invention, the support device is constructed according to one of the above-described embodiments. The features outlined above can therefore also be similarly transferred to the computer program product according to the invention.

[0022] A computer program product can have a physical module for simulation, in which the support device is at least partially represented. For this purpose, for example, the support device can be simulated in terms of its structure and its mode of operation, for example as a digital image belonging to the computer program product. Alternatively or additionally, the support device can also be designed as a computational model in the physical module. The physical module is designed to simulate, in particular under settable operating conditions, the thermal characteristics, flow characteristics, evaporation characteristics and / or condensation characteristics of the fluid used therein of the support device. The settable operating conditions include, for example, the ambient temperature, the pressure of the fluid, the thermal conductivity of the fluid and / or the individual components of the support device, the temperature of the connecting element to be cooled and / or the temperature of the radiator. The computer program product can have a data interface through which corresponding data can be preset by user input, and can also have a data connection to a higher-level control unit of a real system having a power module with a corresponding support device and / or other simulation-oriented computer programs. The computer program product can also have a data interface for outputting simulation results and / or other simulation-oriented computer program products to the user. The computer program product can, for example, identify a defective support device, a defective connection between the support device and the radiator or the connecting element, and / or a leak on at least one pulsating heat pipe. In particular, the operating behavior of the support device (represented, for example, by the measured values of sensors accommodated therein or by the measured values of sensors in the power module) can be checked for plausibility by comparison with the simulated support device. For example, the operating behavior of the pulsating heat pipe can be realistically simulated. At least one pulsating heat pipe can be reproduced as a two-dimensional model in the claimed computer program product. The pulsating heat pipe can be simulated with high practical accuracy with minimized computational effort. Thus, the support device can be modeled in a simple manner, i.e., its operating behavior can be recalculated with a minimum of CFD calculations. In particular, the heat transfer behavior in the pulsating heat pipe can be approximated with sufficient accuracy by algebraic calculations. Thus, the computer program product according to the invention can model the underlying support device with a low computational power requirement. Thereby, for example, multiple such support devices can also be simulated in a power module. Thus, overall, a particularly realistic process image of the operation of the corresponding application can be provided in a simple manner. Also, due to the reduced computational effort, the claimed computer program product can be made real-time capable in a simple manner, thereby enabling efficient monitoring of the corresponding support device or the corresponding power module. The computer program product can be designed as a so-called digital twin, as described, for example, in the published text US 2017 / 286572 Al. The disclosure of US 2017 / 286572 A1 is incorporated by reference in this application. Thus, the digital twin is designed to correspond to a support device according to one of the above-described embodiments. The computer program product can be implemented monolithically, i.e., it can be implemented entirely on a hardware platform.Optionally, the computer program product can be modularly constructed and include a plurality of subroutines that can be executed on separate hardware platforms and cooperate via a communication data connection. Such a communication data connection can be a network connection, an Internet connection, and / or a mobile radio connection. In addition, the support device can be tested and / or optimized by simulation using the computer program product according to the present invention. Description of the Drawings

[0023] The present invention will be explained in more detail below with reference to the various embodiments in the drawings. The drawings should be understood as being complementary to each other, since the same reference numerals in different drawings have the same technical meaning. The features of the various embodiments can also be combined with each other. In addition, the embodiments shown in the drawings can be combined with the features described above. Specifically shown in the drawings are:

[0024] Figure 1 A power module with an embodiment of the claimed support device is shown in an oblique view;

[0025] Figure 2 A first embodiment of the claimed support device is shown in a longitudinal section;

[0026] Figure 3 A second embodiment of the claimed support device is shown in an oblique view;

[0027] Figure 4 A third embodiment of the claimed support device in an uninstalled state is shown in an oblique view;

[0028] Figure 5 A third embodiment of the claimed support device in an installed state is shown in an oblique view;

[0029] Figure 6 A third embodiment of the claimed support device in an installed state is shown from below in an oblique view. Detailed Description of the Embodiments

[0030] Figure 1An embodiment of the power module 50 is shown in an oblique view, wherein at least one support device 10 according to the invention is used. The power module 50 includes a plurality of conductive connection elements 12, which are each designed as conductive rails 17. The conductive connection elements 12 are also only referred to as connection elements 12 hereinafter. The connection elements 12 are heated during the active operating state of the power module 50 and are accordingly cooled. The connection elements 12 are each mechanically supported on a housing part 18 by means of the support device 10, and this housing part serves as a heat sink 14. Alternatively or additionally, a cooling body (not shown) can also serve as the heat sink 14. The connection elements 12 are each correspondingly understood as heat sources 13. During the compliant operation of the power module 50, there is respectively a heat flow 15 from the connection elements 12, i.e., the heat sources 13, to the heat sink 14. The heat flow 15 respectively flows through the corresponding support device 10. At least one of the support devices is designed according to one of the embodiments outlined above or below. The operating behavior of at least one support device 10 designed according to one of the embodiments described above or below is simulated by a computer program product 60 not shown in detail. The computer program product 60 can be designed as a so-called digital twin of the corresponding support device.

[0031] Figure 2 A first embodiment of the claimed support device 10 is schematically shown in a longitudinal section. The support device 10 is arranged between the conductive connection element 12 forming the heat source 13 and the heat sink 14, and the heat sink 14 can be designed as a housing part 18 or a cooling body 16. The support device 10 is designed as an integral unit and includes an intermediate section 20 between respective end sections 25 located at the connection element side end 22 and the heat sink side end 24. In the intermediate section 20, the support device 10 is made of a first material 21 having a first thermal conductivity. In the region of the connection element side end 22 and at the respective end sections 25, the support device 10 is made of a second material 23 having a second thermal conductivity. Similarly, the support device 10 is made of a second material having a thermal conductivity in the region of its heat sink side end 24, i.e., in the respective end sections 25. The second thermal conductivity is higher than the first thermal conductivity here. The first material and the second material are each plastics that are suitable for additive manufacturing and are mixed with thermally conductive particles in a presettable form, i.e., with a substantially selectable content. The different thermal conductivities of the first material and the second materials 21, 23 are set by presetting the content of the thermally conductive particles respectively during the additive manufacturing of the support device. The heat flow 15 from the heat source 13 flows through a thermal paste layer 27 at the connection element side end 22 and enters the support device 10 at the connection element side end 22 and into the end section 25.

[0032] The heat flow 15 entering at the side end 22 of the connection element causes partial evaporation of the fluid 32, which is accommodated in a plurality of pulsating heat pipes 30. The pulsating heat pipes 30 are each configured as grooves inside the support device 10 and are arranged inside the support device 10. Thus, the pulsating heat pipes 30 are enclosed by the support device 10 itself. By making the second thermal conductivity in the end section 25 at the connection element side end 22 higher than the first thermal conductivity in the intermediate section 20, the evaporation of the fluid 32 is promoted. A gas phase 33 is formed in the pulsating heat pipe 30, and the gas phase moves along the pulsating heat pipe 30 as bubbles. During normal operation, an oscillation 35 of the gas phase 33 is achieved, thereby ensuring heat transfer to the radiator side end 24. Thus, overall, heat dissipation 19 from the connection element 12 to the radiator 14 is achieved. Corresponding to the heat flow 15 entering at the connection element side end 22, the heat flow 15 is discharged from the pulsating heat pipe 30 at the radiator side end 24. The end section 25 at the radiator side end 24 is made of a second material 23, which supports heat transfer from the pulsating heat pipe 30 to the corresponding end section 25. The heat flow 15 entering the radiator 14 from the support device 10 flows through a thermal paste layer 27 arranged between the support device 10 and the radiator 14.

[0033] The fluid 32 has a negative pressure relative to the ambient air 48 in which the support device 10 is used. A diffusion-inhibiting coating 26 is constructed in the support device 10, which minimizes the penetration of gases or liquids from the ambient air 48 into the pulsating heat pipes 30. The diffusion-inhibiting coating 26 can be designed as a metallic or ceramic coating. The diffusion-inhibiting coating 26 can also be manufactured by additive manufacturing. The pulsating heat pipes 30 ensure efficient and self-regulating heat dissipation 19 of the connection element 12 to the radiator 14. In addition, a sensor 28 is arranged in the support device 10, which is coupled to one of the pulsating heat pipes 30. The sensor 28 is designed to detect physical variables of the pulsating heat pipe 30, such as the temperature or pressure of the fluid 32 in the respective pulsating heat pipe 30. The sensor 28 is connected to a communication unit 29. The communication unit 29 is in turn connected via a communication data connection 41, such as a wireless connection, to a superior control unit 40. The superior control unit 40 is designed to monitor the heat dissipation 19 and can belong to a power module 50 in which the support device 10 is employed. There is also a computer program product 60, not shown in more detail, which is designed as a so-called digital twin of the support device 10. The computer program product 60 can include an image, in particular a digital image, of the support device 10 and can be designed to simulate the current operating state of the support device 10. The computer program product 60 can check the physical variables detected by the sensor 28, especially for reasonableness. The computer program product 60 can be stored, for example, executable, on the superior control unit 40.

[0034] At Figure 3Figure 2 schematically shows a second embodiment of the claimed support device 10 in a longitudinal section. The support device 10 is arranged between a conductive connecting element 12 forming a heat source 13 and a heat sink 14, which can be designed as a housing part 18 or a cooling body 16. The support device 10 is manufactured from a plurality of interconnected parts. These parts are interconnected via a material-locking connection 31. The support device 10 includes an intermediate section 20, which is located between an end section 25 at the connecting element side end 22 and a heat sink side end 24. In the intermediate section 20, the support device 10 is manufactured from a first material 21 having a first thermal conductivity. The end section 25 on the connecting element side end 22 is manufactured from a second material 23 having a second thermal conductivity. Similarly, the support device 10 is manufactured from the second material having a thermal conductivity in the region of its heat sink side end 24, i.e., in the respective end section 25. The second thermal conductivity is higher than the first thermal conductivity. The first material and the second material are each a plastic that is suitable for additive manufacturing and is mixed with thermally conductive particles in a settable form, i.e., a substantially selectable content. The different thermal conductivities in the first material and the second material 21, 23 are set by presetting the content of the thermally conductive particles when additively manufacturing the support device. The heat flow 15 from the heat source 13 flows over a thermal paste layer 27 at the connecting element side end 22 and enters the end section 25 at the connecting element side end 22 into the support device 10.

[0035] The heat flow 15 entering at the connecting element side end 22 causes partial evaporation of a fluid 32, which is accommodated in a plurality of pulsating heat pipes 30. The pulsating heat pipes 30 are each configured as grooves inside the support device 10 and are arranged inside the support device 10. Thus, the pulsating heat pipes 30 are enclosed by the end sections 25 of the support device 10. By making the second thermal conductivity in the end section 25 at the connecting element side end 22 higher than the first thermal conductivity in the intermediate section 20, the evaporation of the fluid 32 is promoted. A gas phase 33 is formed in the pulsating heat pipes 30, and the gas phase moves along the pulsating heat pipes 30 as bubbles. During normal operation, an oscillation 35 of the gas phase 33 is achieved, such that heat is transferred to the heat sink side end 24. Thus, heat dissipation 19 from the connecting element 12 to the heat sink 14 is generally achieved. Corresponding to the heat flow 15 entering at the connecting element side end 22, the pulsating heat pipes 30 discharge the heat flow 15 at the heat sink side end 24. The end section 25 at the heat sink side end 24 is manufactured from the second material 23, and heat transfer from the pulsating heat pipes 30 to the respective end section 25 is supported by this second material. The heat flow 15 entering the heat sink 14 from the support device 10 flows over a thermal paste layer 27 arranged between the support device 10 and the heat sink 14.

[0036] The fluid 32 has a negative pressure relative to the ambient air 48, and the support device 10 is used in this ambient air. A diffusion-inhibiting coating 26 is constructed in the support device 10, and this coating minimizes the penetration of gas or liquid from the ambient air 48 into the pulsating heat pipe 30. The diffusion-inhibiting coating 26 can be constructed as a metallic or ceramic coating. The diffusion-inhibiting coating 26 can also be manufactured by additive manufacturing. The pulsating heat pipe 30 ensures that the connecting element 12 dissipates heat 19 efficiently and self-regulatingly into the radiator 14. The diffusion-inhibiting coating 26 is applied in a groove, that is, on the inner surface of the pulsating heat pipe 30. Thereby, the intermediate section 20 can be used as a protective absorption section that absorbs fluid, such as gas, from the ambient air 48 and thus minimizes or prevents its penetration into the pulsating heat pipe 30. Similarly, the diffusion-inhibiting coating 26 is applied in the region of the boundary between the intermediate section 20 and the end section 35. These are designed to minimize the penetration of fluid from the ambient air 48 via the end section 25 at the connecting element side end 22 or at the radiator side end 24. There is also a computer program product 60, not shown in detail, which is designed as a so-called digital twin of the support device 10. The computer program product 60 can include an image of the support device 10, in particular a digital image, and is designed to simulate the current operating state of the support device 10.

[0037] The third embodiment of the claimed support device 10 is in Figure 4The middle is shown in a perspective view in an uninstalled state. The support device 10 includes a core section 38, which is designed substantially in a cylindrical shape and has a cylindrical outer peripheral surface on its circumferential wall 39, and a plurality of grooves 34 are formed on the cylindrical outer peripheral surface. In the installed state, the grooves 34 form a pulsating heat pipe 30, and a fluid 32 is accommodated in the heat pipe, and the required heat dissipation 19 is achieved through the fluid. The grooves 34 extend from the connecting element side end 22 to the radiator side end 24 in the middle section 20. In the uninstalled state, the grooves 34 form a substantially open channel. The core section 38 is made of a first material 21, which is constructed as a plastic. At the connecting element side end 22, the core section 38 has an end face 37, and the grooves 34 are continuous on the end face. The grooves 34 are constructed substantially in a star shape on the end face 37. The grooves are constructed substantially in the center on the end face 37, creating a toothed surface 42. The grooves 34 that form the pulsating heat pipe 30 in the installed state also extend along the toothed surface 42. The toothed surface 42 is circumferential and is used for thermal coupling 43 of the core section 38 in the installed state, that is, in the region of the connecting element side end 22 of the support device 10. The toothed surface 42 creates an increased surface for the heat flow 15, and the heat flow is transported from the connecting element 12, which is not shown in more detail, via the pulsating heat pipe 30 to the radiator 14, which is not shown in more detail, that is, the cooling body 16 or the housing component 18. In addition, the core section 38 can be designed as a hollow body, which can be easily manufactured by injection molding.

[0038] The support device 10 is provided with a mounting base 36 on the radiator side end 24, and the support device 10 can be coupled to the radiator 14 via the mounting base. The coupling with the radiator 14 includes mechanical coupling and thermal coupling. In addition, there is a computer program product 60, which is not shown in more detail, and the computer program product is designed as a so-called digital twin of the support device 10. The computer program product 60 can include an image of the support device 10, especially a digital image, and is designed to simulate the current operating state of the support device 10.

[0039] As shown in Figure 4 in Figure 5 a third embodiment of the claimed support device 10 is shown in a perspective view in the installed state. The description regarding Figure 4 also similarly applies to Figure 5 . In Figure 5 , the core section 38 is connected to a bell-shaped section 44, and the bell-shaped section is substantially sleeved on the core section 38. For clarity and easy understanding, the bell-shaped section 44 is shown in Figure 5is shown transparently. The bell-shaped section 44 is substantially designed as a hollow cylinder that is closed on one side and open on the other side. The groove 34 that forms a channel in the non-mounted state on the core section 38 is closed at least in the middle section 20 by the bell-shaped section 44 and is thus suitable for accommodating the fluid 32, through which the functionality of the pulsating heat pipe 30 is achieved. An installation base 36 is also formed on the bell-shaped section 44, and the shape of this installation base corresponds to the installation base 36 of the core section 38. Alternatively, the installation base 36 can also be designed as a separate component that is connected to the core section 38 when the support device 10 is manufactured. A groove 34 is constructed in the installation base 36 of the bell-shaped section 44, and the groove extends through the installation base 36. The groove 34 in the installation base 36 of the bell-shaped section 44 is connected to the groove 34 on the core section 38, such that these grooves are also partially filled with the fluid 32. Accordingly, a pulsating heat pipe 30 is also constructed by the groove 34 in the installation base 36 of the bell-shaped section 44. The increased surface area of the installation base 36 on the core section 38 or the bell-shaped section 44 enables an improved thermal coupling of the support device 10 with a radiator 14 not shown in detail. The core section 38 and / or the bell-shaped section 44 can be manufactured by additive manufacturing, such that the increased portion of its installation base 36 can be used for the pulsating heat pipe 30 and thus for the required heat dissipation 19. Thus, the claimed support device 10 can be better utilized in terms of heat transfer. Since the fluid 32 is electrically insulated from the connecting element 12 via the installation base 36, the fluid 32 itself can be conductive.

[0040] The core section 38 is also covered in the region of its end face 37 and thus closes the groove 34, which forms an open channel in the non-mounted state. At the connecting element side end 22, a coupling element 46 is arranged on the bell-shaped section 44, and this coupling element is made of a metallic material. The coupling element 46 is designed to contact a connecting element 12 not shown in detail and thereby introduce a heat flow 15 into the support device 10. The bell-shaped section 44 in the region of the toothed surface 42 is as Figure 4shown in has a groove in which the coupling element 46 is received. Since the coupling element 46 is made of a metallic material, the coupling element has a higher thermal conductivity compared to the first material 21 of the intermediate section 20 of the manufacturing core section 38. The increased surface on the toothed face 42 can thus introduce an increased heat flow 15 into the pulsating heat pipe 15. The core section 38 and the bell section 44 can be manufactured in a simple manner, for example by additive manufacturing or injection molding, and provide an increased ability to dissipate heat 19 for the connecting element 12. Accordingly, the functions of mechanical support and heat dissipation are integrated in a particularly cost-effective manner. In addition, there is a computer program product 60, not shown in detail, which is configured to support the so-called digital twin of the device 10. The computer program product 60 can include an image of the support device 10, in particular a digital image, and is designed to simulate the current operating state of the support device 10.

[0041] In addition, in Figure 6 a third embodiment of the claimed support device 10 in the installed state is shown in an oblique view from below. For clarity, the mounting base 36 of the core section 38 is shown transparently. In the region of the mounting base 36, grooves 34 are constructed in the core section 38, which grooves 34 are interconnected on the circumferential wall 39 of the core section 38. In addition, grooves 34 are constructed in the region of the mounting base 36 of the bell section 44, and the annular grooves 34 are connected to the circumferential wall 39 of the core section 38. Thereby, a pulsating heat pipe 30 is constructed in the mounting base 36, which heat pipe in turn uses the surface area of the mounting base 36 of the core section 38 to dissipate heat 19. In addition, there is a computer program product 60, not shown in detail, which is designed as the so-called digital twin of the support device 10. The computer program product 60 can include an image of the support device 10, in particular a digital image, and is designed to simulate the current operating state of the support device 10.

Claims

1. A support device (10) for mechanically supporting an electrically conductive connecting element (12) to be cooled on a heat sink (14), the support device electrically insulating the connecting element (12) from the heat sink (14), wherein, At least one pulsating heat pipe (30) for dissipating heat from the connecting element (12) to the radiator (14) is constructed in the support device (10), characterized in that the at least one pulsating heat pipe (30) is at least partially provided with a diffusion-inhibiting coating (26).

2. The support device (10) according to claim 1, characterized in that, The support device (10) is constructed of a first material (21) having a first thermal conductivity in an intermediate section (20) and the support device is made of a second material (23) having a second thermal conductivity at the connecting element side end (22) and / or the radiator side end (24).

3. The support device (10) according to claim 1 or 2, characterized in that, A mounting base (36) is constructed at the connecting element side end (22), and at least one pulsating heat pipe (30) extends through the mounting base (36).

4. The support device (10) according to any one of claims 1 to 3, characterized in that, The at least one pulsating heat pipe (30) is at least partially filled with an electrically conductive fluid (32).

5. The support device (10) according to any one of claims 1 to 4, characterized in that The support device (10) is designed to be integral or has a core section (38) to which a bell-shaped section (44) is attached.

6. The support device (10) according to any one of claims 1 to 5, characterized in that A plurality of pulsating heat pipes (30) are constructed in the region of the circumferential wall (39) between the connecting element side end (22) and the radiator side end (24).

7. The support device (10) according to any one of claims 1 to 6, characterized in that, The diffusion-inhibiting coating (26) can be manufactured by chemical vapor deposition, physical vapor deposition, sol-gel process, thermal spraying, vapor deposition, autocatalytic coating or by an electroplating process.

8. The support device (10) according to any one of claims 6 or 7, characterized in that A diffusion-inhibiting coating (26) is provided on the surface of the circumferential wall (39), the connecting element side end (22) and / or the radiator side end (24) of the support device (10) or inside the circumferential wall, the connecting element side end and / or the radiator side end.

9. The support device (10) according to any one of claims 1 to 8, characterized in that, The at least one pulsating heat pipe (30) is enclosed by the radiator (14) and / or the connecting element (12).

10. The support device (10) according to any one of claims 1 to 9, characterized in that, The support device (10) has a sensor (28) for detecting physical variables of the at least one pulsating heat pipe (30) and / or components of the support device (10).

11. The support device (10) according to any one of claims 1 to 10, characterized in that, The support device (10) has grooves on the connecting element side end (22) and / or the radiator side end (24), and a toothed surface (42) is thermally coupled (43) to the connecting element (12) or the radiator (14) to be cooled by means of the grooves.

12. The support device (10) according to claim 11, characterized in that, A coupling element (46) made of a metallic material is received in the grooves forming the toothed surface (42) for the thermal coupling (43).

13. The support device (10) according to any one of claims 1 to 12, characterized in that, The support device (10) is at least partially produced by an additive manufacturing process.

14. A power module (50) comprising a substrate with at least one conductive connecting element (12) to be cooled, wherein, The connecting element (12) is mounted on the radiator (14) in a manner supported by the support device (10), characterized in that the support device (10) is designed according to any one of claims 1 to 13.

15. A computer program product (60) comprising instructions which, when the computer executes the computer program product (60), cause the computer to simulate the operating behavior of the support device (10) according to any one of claims 1 to 13.

Citation Information

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