Laminated common mode filter

Abstract

The present invention relates to a laminated common mode filter which not only enables a coil pattern forming a channel to have uniform resistance and inductance, but also exhibits broadband characteristics. The laminated common mode filter includes a first capacitor layer and a second capacitor layer, respectively, on a top and a bottom of an electrode stack to overlap a plurality of coil patterns and form an additional capacitance, the electrode stack including an upper electrode layer and a lower electrode layer stacked, each electrode layer being a stack provided with a plurality of coil patterns.

Description

Technical Field

[0001] Embodiments of the present invention relate to a stacked common mode filter that can pass differential mode signal current in a C-PHY environment, which is a high-speed signal line supporting high-resolution image sensors and displays, and remove common mode noise current. Background Art

[0002] Generally, mobile terminals adopt the Mobile Industry Processor Interface (MIPI) D-PHY standard as a digital data transmission standard. The MIPI D-PHY standard is a digital data transmission standard for connecting the main circuit of a mobile terminal to a display or a camera and transmitting data in the form of differential signals using two transmission lines.

[0003] As the amount of data transmitted and received in mobile terminals increases rapidly, mobile terminals need a data transmission and reception method with a higher transmission speed than the MIPI D-PHY standard.

[0004] Therefore, recently, research has been conducted on applying the MIPI C-PHY standard to mobile terminals in the field of mobile terminals. The MIPI C-PHY standard uses three transmission lines for differential output. Specifically, different voltages are transmitted from the sending end to each transmission line, and the voltage difference between each transmission line is taken from the receiving end.

[0005] The content described in the background art is for helping to understand the background of the present invention and may include content that does not belong to the disclosed prior art. Summary of the Invention

[0006] Technical Problem

[0007] The present invention is proposed in view of the above situation, and its purpose is to provide a stacked common mode filter that exhibits broadband characteristics by stacking capacitor layers on the top and bottom of an electrode layer, and at the same time makes the coil patterns constituting each channel have uniform resistance and inductance.

[0008] Technical Solution

[0009] A stacked common mode filter according to an embodiment of the present invention includes: an upper electrode layer configured as a stack including a first coil pattern, a second coil pattern, and a third coil pattern; a lower electrode layer configured as a stack including a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern and disposed at the bottom of the upper electrode layer; a first capacitor layer configured as a stack including a capacitor pattern and a ground pattern, disposed on the top of the upper electrode layer, and configured to overlap with the first to sixth coil patterns to form additional capacitance; and a second capacitor layer configured as a stack including a capacitor pattern and a ground pattern, disposed at the bottom of the lower electrode layer, and configured to overlap with the first to sixth coil patterns to form additional capacitance.

[0010] Advantageous Effects

[0011] According to the present invention, the stacked common mode filter can keep the spacing between the coil patterns constituting each channel constant, so that the resistance and inductance of the coil patterns constituting each channel are uniform. That is to say, the stacked common mode filter can minimize the change in the inductance characteristics of the coil patterns by maintaining the spacing between channels.

[0012] In addition, the stacked common mode filter can minimize the change in the inductance characteristics and common mode attenuation characteristics of the coil patterns by providing terminal patterns for connecting to external electrodes at the top and bottom of the electrode stack.

[0013] In addition, in the stacked common mode filter, the capacitor layer is disposed at the top and bottom of the electrode stack, thereby forming an additional depression in the common mode attenuation characteristics, thereby expanding the attenuation frequency band.

[0014] In addition, in the stacked common mode filter, the capacitor layer is disposed at the top and bottom of the electrode stack. Therefore, in addition to the poles formed by the coil patterns of the electrode stack, the capacitor layer and the coil patterns also form additional poles (i.e., additional capacitance). Therefore, the stacked common mode filter can form a double pole like an LC filter structure, thereby exhibiting broadband characteristics.

[0015] In addition, parasitic inductance (parasitic L) is the main factor forming the secondary resonance frequency of the common mode filter, and the parasitic inductance increases according to the mounting direction of the chip, which may cause the secondary resonance point to change. Therefore, in the stacked common mode filter, the capacitor layer is disposed at the top and bottom of the electrode stack to reduce the influence of the chip mounting direction on the parasitic inductance (parasitic L), thereby preventing characteristic deviation due to the mounting direction.

[0016] In addition, the stacked common mode filter can adjust and control the secondary resonance point by increasing or changing the capacitor pattern of the capacitor layer.

[0017] In addition, the stacked common mode filter can improve the magnetic coupling (i.e., electromagnetic coupling) between the first coil to the third coil and minimize the degradation of differential signals.

[0018] In addition, the stacked common mode filter can form an electrode stack by stacking sheets with two or fewer vias, thereby simplifying the manufacturing process.

[0019] That is, the stacked common mode filter can minimize the number of vias required to connect the coil patterns by providing terminal patterns at the top and bottom of the electrode stack, arranging the second coil pattern and the third coil pattern of the second channel between the first coil pattern and the sixth coil pattern of the first channel, and arranging the fourth coil pattern and the fifth coil pattern of the third channel between the third coil pattern and the sixth coil pattern, with no more than two vias formed on each sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a perspective view of a stacked common mode filter according to an embodiment of the present invention.

[0021] Figure 2 is for explaining Figure 1 the filter stack in

[0022] Figure 3 is for explaining Figure 2 an exploded perspective view of an embodiment of the upper electrode layer in

[0023] Figures 4 to 7 is for explaining Figure 3 the upper electrode layer in

[0024] Figure 8 is for explaining Figure 2 an exploded perspective view of an embodiment of the lower electrode layer in

[0025] Figures 9 to 12 is for explaining Figure 8 the lower electrode layer in

[0026] Figures 13 to 16 is for explaining Figure 2 an exploded perspective view of the first capacitor layer and the second capacitor layer in

[0027] Figure 17 is for explaining Figure 2 an exploded perspective view of a modified example of the first capacitor layer and the second capacitor layer in

[0028] Figure 18 is for explaining Figure 2A longitudinal cross-sectional view of the filter stack in

[0029] Figure 19 FIG. is an equivalent circuit diagram showing a stacked common-mode filter according to an embodiment of the present invention.

[0030] Figure 20 and Figure 21 FIG. is a view for explaining the attenuation characteristics of a stacked common-mode filter in the prior art.

[0031] Figure 22 and Figure 23 FIG. is a view for explaining an example of adjusting the secondary resonance point by changing the capacitor pattern of a stacked common-mode filter according to an embodiment of the present invention.

[0032]

Embodiments of the Invention

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0034] The embodiments are provided to more fully explain the present invention to those skilled in the art to which the present invention pertains. The following embodiments can be modified in various other forms, and the scope of the present invention is not limited to the following embodiments. These embodiments are provided to make the present invention more thorough and complete, and to fully convey the idea of the present invention.

[0035] The terms used in this specification are for describing specific embodiments and are not intended to limit the present invention. In addition, in this specification, unless otherwise clearly defined in the context, singular expressions may include plural expressions.

[0036] In the description of the embodiments, when it is described that each layer (film), region, pattern, or structure is formed "on" or "under" each substrate, layer (film), region, pad, or pattern, this includes two expressions, that is, including forming a layer "directly" on another layer or "indirectly inserting another layer between two layers". In addition, the reference for "on" or "under" each layer is based on the drawings.

[0037] The drawings are only for helping to understand the spirit of the present invention and should not be construed as limiting the scope of the present invention. In addition, in the drawings, for convenience and clarity of explanation, relative thicknesses, lengths, or dimensions may be enlarged.

[0038] Referring to Figure 1 , a stacked common-mode filter according to an embodiment of the present invention includes a filter stack 110, a first external electrode 120, a second external electrode 130, a third external electrode 140, a fourth external electrode 150, a fifth external electrode 160, a sixth external electrode 170, a seventh external electrode 180, and an eighth external electrode 190. For example, the stacked common-mode filter is used as a three-channel C-PHY common-mode filter.

[0039] Refer to Figure 2 , the filter stack 110 is a stack formed by stacking an upper electrode layer 200, a lower electrode layer 300, a first capacitor layer 500a, and a second capacitor layer 500b.

[0040] The upper electrode layer 200 is configured as a stack formed with a plurality of coil patterns. In this case, a magnetic layer formed of ferrite or the like may be further stacked on top of the upper electrode layer 200.

[0041] The upper electrode layer 200 is formed by stacking a plurality of sheets formed with coil patterns. For example, refer to Figure 3 , the upper electrode layer 200 includes a first sheet 210, a second sheet 220 provided at the bottom of the first sheet 210, a third sheet 230 provided at the bottom of the second sheet 220, and a fourth sheet 240 provided at the bottom of the third sheet 230.

[0042] Refer to Figure 4 , a first terminal pattern 212 and a second terminal pattern 213 for connecting the coil pattern of the upper electrode layer 200 to an external electrode are provided on the first sheet 210.

[0043] The first terminal pattern 212 is provided on the upper surface of the first sheet 210. The first end 212a of the first terminal pattern 212 is provided near the center of the first sheet 210. The second end 212b of the first terminal pattern 212 is on the same straight line as the first side of the first sheet 210. Therefore, the second end 212b of the first terminal pattern 212 is exposed on the first side of the filter stack 110.

[0044] The second terminal pattern 213 is provided on the upper surface of the first sheet 210, spaced apart from the first terminal pattern 212. The first end 213a of the second terminal pattern 213 is provided near the center of the first sheet 210. The first end 213a of the second terminal pattern 213 is set to be spaced apart from the first end 212a of the first terminal pattern 212. The second end 213b of the second terminal pattern 213 is on the same straight line as the first side of the first sheet 210. The second end 213b of the second terminal pattern 213 is provided near the fourth side of the first sheet 210 (i.e., the fourth side of the filter stack 110). Therefore, the second end 213b of the second terminal pattern 213 is exposed on the first side of the filter stack 110 while being spaced apart from the second end 212b of the first terminal pattern 212.

[0045] Refer to Figure 5 , the second sheet 220 is provided at the bottom of the first sheet 210. A first coil pattern 221 and a first via V1 forming a first channel are provided on the second sheet 220.

[0046] The first coil pattern 221 is disposed on the upper surface of the second sheet 220. The first coil pattern 221 forms a first annular structure that winds around the center of the second sheet 220 multiple times.

[0047] The first end 221a of the first coil pattern 221 is disposed near the center of the second sheet 220.

[0048] The first end 221a of the first coil pattern 221 is connected to the first end 212a of the first terminal pattern 212 through a via hole.

[0049] The second end 221b of the first coil pattern 221 is in the same straight line as the second side edge of the second sheet 220. Therefore, the second end 221b of the first coil pattern 221 is exposed on the second side surface of the filter stack 110. The second side surface of the filter stack 110 is the side surface opposite to the first side surface of the filter stack 110.

[0050] The first via hole V1 is disposed in the inner peripheral region of the first annular structure formed by the first coil pattern 221. The first via hole V1 is adjacent to the center of the second sheet 220 and is disposed at an interval from the first end 221a of the first coil pattern 221. The first via hole V1 is formed to penetrate the second sheet 220. The upper part of the first via hole V1 is connected to the second terminal pattern 213 through a via hole that penetrates the first sheet 210. The lower part of the first via hole V1 is connected to a coil pattern formed on the third sheet 230, which will be described below.

[0051] Refer to Figure 6 , the third sheet 230 is disposed at the bottom of the second sheet 220. A second coil pattern 231 for forming a second channel is disposed on the third sheet 230.

[0052] The second coil pattern 231 is disposed on the upper surface of the third sheet 230. The second coil pattern 231 forms a second annular structure that winds around the center of the third sheet 230 multiple times.

[0053] The first end 231a of the second coil pattern 231 is disposed near the center of the third sheet 230. The first end 231a of the second coil pattern 231 is connected to the first end 213a of the second terminal pattern 213 through the first via hole V1 of the second sheet 220.

[0054] The second end 231b of the second coil pattern 231 is in the same straight line as the second side edge of the third sheet 230. Therefore, the second end 231b of the second coil pattern 231 is exposed on the second side surface of the filter stack 110.

[0055] Refer to Figure 7, the fourth thin sheet 240 is disposed at the bottom of the third thin sheet 230. A third coil pattern 241 which, together with the second coil pattern 231, forms a second channel is provided on the fourth thin sheet 240.

[0056] The third coil pattern 241 is disposed on the upper surface of the fourth thin sheet 240. A fourth coil pattern 311 forms a fourth annular structure that winds around the center of the fourth thin sheet 240 multiple times.

[0057] The first end 241a of the third coil pattern 241 is disposed near the center of the fourth thin sheet 240. The first end 241a of the third coil pattern 241 is connected to the first end 231a of the second coil pattern 231 and the first end 213a of the second terminal pattern 213 through a first via V1. Thus, the third coil pattern 241 and the second coil pattern 231 together form the coil of the second channel.

[0058] The second end 241b of the third coil pattern 241 is in a straight line with the second side of the fourth thin sheet 240. Thus, the second end of the third coil pattern is exposed on the second side of the filter stack 110.

[0059] The coil patterns and terminal patterns formed on each thin sheet forming the upper electrode layer 200 can be deformed into various shapes. The upper electrode layer 200 can be deformed into various shapes in terms of the shape of the annular structure formed by the coil patterns, the position where the ends are exposed, etc.

[0060] However, the stacking order of the first terminal pattern 212, the second terminal pattern 213, the first coil pattern 221, the second coil pattern 231, and the third coil pattern 241 in the upper electrode layer 200 remains the order shown in the figure.

[0061] The lower electrode layer 300 is configured as a stack formed with a plurality of coil patterns and is disposed at the bottom of the upper electrode layer 200. The lower electrode layer 300 is formed by stacking a plurality of thin sheets formed with coil patterns. For example, referring to Figure 8 , the lower electrode layer 300 includes a fifth thin sheet 310, a sixth thin sheet 320 disposed at the bottom of the fifth thin sheet 310, a seventh thin sheet 330 disposed at the bottom of the sixth thin sheet 320, and an eighth thin sheet 340 disposed at the bottom of the seventh thin sheet 330.

[0062] Referring to Figure 9 , the fifth thin sheet 310 is disposed at the bottom of the fourth thin sheet 240. A fourth coil pattern 311 that forms a third channel is provided on the fifth thin sheet 310.

[0063] The fourth coil pattern 311 is disposed on the upper surface of the fifth thin sheet 310. The fourth coil pattern 311 forms a fourth annular structure that winds around the center of the fifth thin sheet 310 multiple times.

[0064] The first end 311a of the fourth coil pattern 311 is disposed near the center of the fifth sheet 310.

[0065] The second end 311b of the fourth coil pattern 311 is in a straight line with the second side of the fifth sheet 310. Accordingly, the second end 311b of the fourth coil pattern 311 is exposed on the second side surface of the filter stack 110.

[0066] Referring to Figure 10 , the sixth sheet 320 is disposed at the bottom of the fifth sheet 310. A fifth coil pattern 321 that forms a third channel together with the fourth coil pattern 311 is disposed on the sixth sheet 320.

[0067] The fifth coil pattern 321 is disposed on the upper surface of the sixth sheet 320. The fifth coil pattern 321 forms a fifth annular structure that winds around the center of the sixth sheet 320 multiple times.

[0068] The first end 321a of the fifth coil pattern 321 is disposed near the center of the sixth sheet 320. The first end 321a of the fifth coil pattern 321 is connected to the first end 311a of the fourth coil pattern 311 through a via hole that penetrates the fifth sheet 310.

[0069] The second end 321b of the fifth coil pattern 321 is in a straight line with the second side of the sixth sheet 320. Accordingly, the second end 321b of the fifth coil pattern 321 is exposed on the second side surface of the filter stack 110.

[0070] Referring to Figure 11 , the seventh sheet 330 is disposed at the bottom of the sixth sheet 320. A sixth coil pattern 331 and a second via hole V2 that form a first channel together with the first coil pattern 221 are disposed on the seventh sheet 330.

[0071] The sixth coil pattern 331 is disposed on the upper surface of the seventh sheet 330. The sixth coil pattern 331 forms a sixth annular structure that winds around the center of the seventh sheet 330 multiple times.

[0072] The first end 331a of the sixth coil pattern 331 is disposed near the center of the seventh sheet 330. The second end 331b of the sixth coil pattern 331 is in a straight line with the second side of the seventh sheet 330. Accordingly, the second end 331b of the sixth coil pattern 331 is exposed on the second side surface of the filter stack 110.

[0073] The second via V2 is disposed in the inner peripheral region of the sixth annular structure formed by the sixth coil pattern 331. The second via V2 is disposed at a position adjacent to the center of the seventh sheet 330 and spaced apart from the first end 331a of the sixth coil pattern 331. The second via V2 is formed to penetrate the seventh sheet 330. The upper portion of the second via V2 is connected to the fifth coil pattern 321 and the sixth coil pattern 331. The lower portion of the second via V2 is connected to a terminal pattern formed on the eighth sheet 340, which will be described below.

[0074] Referring to Figure 12 , a third terminal pattern 341 and a fourth terminal pattern 342 for connecting the coil patterns of the lower electrode layer 300 to an external electrode are provided on the eighth sheet 340.

[0075] The third terminal pattern 341 is disposed on the upper surface of the eighth sheet 340. The first end 341a of the third terminal pattern 341 is disposed near the center of the eighth sheet 340. The first end 341a of the third terminal pattern 341 is connected to the first end 311a of the fourth coil pattern 311 and the first end 321a of the fifth coil pattern 321 through the second via V2. The second end 341b of the third terminal pattern 341 is in the same straight line as the first side of the eighth sheet 340. Therefore, the second end 341b of the third terminal pattern 341 is exposed on the first side of the filter stack 110.

[0076] The fourth terminal pattern 342 is disposed on the upper surface of the eighth sheet 340, spaced apart from the third terminal pattern 341. The first end 342a of the fourth terminal pattern 342 is disposed near the center of the eighth sheet 340. The first end 342a of the fourth terminal pattern 342 is connected to the first end 331a of the sixth coil pattern 331 through a via. The second end 342b of the fourth terminal pattern 342 is in the same straight line as the first side of the eighth sheet 340. Therefore, the second end 342b of the fourth terminal pattern 342 is exposed on the first side of the filter stack 110 while being spaced apart from the second end 341b of the third terminal pattern 341.

[0077] The coil patterns and terminal patterns formed on each sheet of the lower electrode layer 300 can be deformed into various shapes. The lower electrode layer 300 can be deformed into various forms in terms of the shape of the annular structure formed by the coil patterns, the position where the ends are exposed, etc. However, the stacking order of the fourth coil pattern 311, the fifth coil pattern 321, the sixth coil pattern 331, the third terminal pattern 341, and the fourth terminal pattern 342 in the lower electrode layer 300 remains the order shown in the figure.

[0078] The upper electrode layer 200 and the lower electrode layer 300 constitute an electrode stack 400. The electrode stack 400 is configured such that the first coil pattern 221, the second coil pattern 231, the third coil pattern 241, the fourth coil pattern 311, the fifth coil pattern 321, and the sixth coil pattern 331 are stacked in sequence. In this case, the first coil pattern 221 and the sixth coil pattern 331 form a first coil constituting a first channel, the second coil pattern 231 and the third coil pattern 241 form a second coil constituting a second channel, and the fourth coil pattern 311 and the fifth coil pattern 321 form a third coil constituting a third channel.

[0079] Therefore, in the electrode stack 400, the coil patterns of the first channel, the coil patterns of the second channel, the coil patterns of the second channel, the coil patterns of the third channel, the coil patterns of the third channel, and the coil patterns of the first channel are arranged in sequence.

[0080] Accordingly, the stacked common mode filter according to an embodiment of the present invention can keep the spacing (gap) between the coil patterns constituting each channel constant, so that the coil patterns forming each channel can have uniform resistance and inductance.

[0081] In addition, the stacked common mode filter according to an embodiment of the present invention can minimize the change in the inductance characteristics and the common mode attenuation characteristics of the coil patterns by providing terminal patterns for connecting to external electrodes at the top and bottom of the electrode stack 400. In this case, when the terminal pattern is provided only at the top or only at the bottom, the common mode attenuation characteristics also change because the inductance characteristics of each channel or the inductance characteristics of each coil pattern change.

[0082] In addition, the stacked common mode filter according to an embodiment of the present invention can minimize the number of vias required to connect the coil patterns by providing terminal patterns at the top and bottom of the electrode stack 400, arranging the second coil pattern 231 and the third coil pattern 241 of the second channel between the first coil pattern 221 and the sixth coil pattern 331 of the first channel, and arranging the fourth coil pattern 311 and the fifth coil pattern 321 of the third channel between the third coil pattern 241 and the sixth coil pattern 331. In this case, in the stacked common mode filter according to an embodiment of the present invention, the number of vias formed on each sheet does not exceed two.

[0083] The first capacitor layer 500a is configured to form a stack having a ground pattern and a plurality of capacitor patterns. The first capacitor layer 500a is disposed on the upper electrode layer 200. In this case, the first capacitor layer 500a may be stacked on the upper electrode layer 200 with a magnetic layer formed of ferrite or the like interposed between the first capacitor layer 500a and the upper electrode layer 200. A magnetic layer formed of ferrite or the like may also be further stacked on the first capacitor layer 500a.

[0084] The second capacitor layer 500b is configured to form a stack having a ground pattern and a plurality of capacitor patterns. The second capacitor layer 500b is disposed at the bottom of the lower electrode layer 300. In this case, the second capacitor layer 500b may be stacked at the bottom of the lower electrode layer 300 with a magnetic layer formed of ferrite or the like interposed between the second capacitor layer 500b and the lower electrode layer 300. A magnetic layer formed of ferrite or the like may also be further stacked at the bottom of the second capacitor layer 500b.

[0085] In this case, by making the areas of the capacitor patterns included in the capacitor layer 500 (i.e., the first capacitor layer 500a and / or the second capacitor layer 500b) different, a stacked common mode filter having a high capacitance (High Cp) or a low capacitance (Low Cp) can be configured. When the area of the capacitor pattern increases, the stacked common mode filter has relatively high capacitance (High Cp) characteristics, while when the area of the capacitor pattern decreases, the stacked common mode filter has relatively low capacitance (Low Cp) characteristics.

[0086] For example, referring to Figure 13 , the capacitor layer 500 is constituted by stacking a ninth sheet 510, a tenth sheet 520, and an eleventh sheet 530.

[0087] A first ground pattern 511 is provided on the ninth sheet 510. The first ground pattern 511 is provided on the upper surface of the ninth sheet 510.

[0088] Referring to Figure 14 , the first ground pattern 511 may include a first pattern 511a, a second pattern 511b, and a third pattern 511c.

[0089] The first pattern 511a is formed in a plate shape and is provided at the center of the upper surface of the ninth sheet 510. The first pattern 511a may be configured as an island pattern spaced apart from the four sides of the ninth sheet 510.

[0090] The second pattern 511b extends from the third side of the first pattern 511a and is in the same straight line as the third side of the ninth sheet 510. That is, the first end of the second pattern 511b is connected to the third side of the first pattern 511a. The second end of the second pattern 511b is in the same straight line as the third side of the ninth sheet 510 and is exposed on the third side surface of the filter stack 110.

[0091] The third pattern 511c is disposed opposite to the second pattern 511b with the first pattern 511a therebetween. The third pattern 511c extends from the fourth side of the first pattern 511a and is in the same straight line as the fourth side of the ninth sheet 510. That is, the first end of the third pattern 511c is connected to the fourth side of the first pattern 511a. The second end of the third pattern 511c is in the same straight line as the fourth side of the ninth sheet 510 and is exposed on the fourth side surface of the filter stack 110.

[0092] Therefore, the first ground pattern 511 is exposed on the third side surface and the fourth side surface of the filter stack 110.

[0093] The tenth sheet 520 is disposed at the bottom of the ninth sheet 510. A capacitor pattern 521 is provided on the upper surface of the tenth sheet 520.

[0094] The capacitor pattern 521 is disposed to overlap with the coil pattern included in the electrode stack 400. The capacitor pattern 521 and the coil pattern together form a capacitance. Thus, the capacitor pattern 521 forms an additional depression in the common-mode attenuation characteristic to extend the attenuation band, so that the stacked common-mode filter has an attenuation band between about 1 GHz and 10 GHz, achieving broadband characteristics.

[0095] The capacitor pattern 521 includes a plurality of capacitor patterns provided at the input terminal and the output terminal of the stacked common-mode filter.

[0096] For example, referring to Figure 15 , the capacitor pattern 521 includes a first capacitor pattern 522, a second capacitor pattern 523, a third capacitor pattern 524, a fourth capacitor pattern 525, a fifth capacitor pattern 526, and a sixth capacitor pattern 527.

[0097] As an example, the first capacitor pattern 522 to the third capacitor pattern 524 are used as the input terminal of the stacked common-mode filter, and the fourth capacitor pattern 525 to the sixth capacitor pattern 527 are used as the output terminal of the stacked common-mode filter. The first capacitor pattern 522 to the third capacitor pattern 524 can also be used as the output terminal of the stacked common-mode filter, and the fourth capacitor pattern 525 to the sixth capacitor pattern 527 can also be used as the input terminal of the stacked common-mode filter.

[0098] The first capacitor pattern 522 is disposed on the upper surface of the tenth sheet 520.

[0099] The first end 522a of the first capacitor pattern 522 is disposed near the center of the tenth sheet 520. The second end 522b of the first capacitor pattern 522 is in a straight line with the second side of the tenth sheet 520. Accordingly, the first capacitor pattern 522 is exposed to the second side surface of the filter stack 110.

[0100] The second capacitor pattern 523 is disposed on the upper surface of the tenth sheet 520, spaced apart from the first capacitor pattern 522. The second capacitor pattern 523 is disposed at a position adjacent to the fourth side of the tenth sheet 520.

[0101] The first end 523a of the second capacitor pattern 523 is disposed near the center of the tenth sheet 520. The second end 523b of the second capacitor pattern 523 is in a straight line with the second side of the tenth sheet 520. Accordingly, the second capacitor pattern 523 is exposed to the second side surface of the filter stack 110.

[0102] The third capacitor pattern 524 is disposed on the upper surface of the tenth sheet 520. The third capacitor pattern 524 is disposed on the upper surface of the tenth sheet 520, spaced apart from the first capacitor pattern 522 and the second capacitor pattern 523. The third capacitor pattern 524 is disposed at a position adjacent to the third side of the tenth sheet 520 and is disposed opposite to the second capacitor pattern 523 with the first capacitor pattern 522 therebetween.

[0103] The first end 524a of the third capacitor pattern 524 is disposed near the center of the tenth sheet 520. The second end 524b of the third capacitor pattern 524 is in a straight line with the second side of the tenth sheet 520. Accordingly, the third capacitor pattern 524 is exposed to the second side surface of the filter stack 110.

[0104] The fourth capacitor pattern 525 is disposed on the upper surface of the tenth sheet 520. The fourth capacitor pattern 525 is disposed opposite to the first capacitor pattern 522.

[0105] The first end 525a of the fourth capacitor pattern 525 is disposed near the center of the tenth sheet 520 and is opposite to the first end 522a of the first capacitor pattern 522. The second end 525b of the fourth capacitor pattern 525 is in a straight line with the first side of the tenth sheet 520. Accordingly, the fourth capacitor pattern 525 is exposed to the first side surface of the filter stack 110.

[0106] The fifth capacitor pattern 526 is disposed on the upper surface of the tenth sheet 520, spaced apart from the fourth capacitor pattern 525. The fifth capacitor pattern 526 is disposed at a position adjacent to the fourth side of the tenth sheet 520. The fifth capacitor pattern 526 is disposed opposite to the second capacitor pattern 523.

[0107] The first end 526a of the fifth capacitor pattern 526 is disposed near the center of the tenth sheet 520 and is opposite to the first end 523a of the second capacitor pattern 523. The second end 526b of the fifth capacitor pattern 526 is in a straight line with the first side of the tenth sheet 520. Accordingly, the fifth capacitor pattern 526 is exposed to the first side surface of the filter stack 110.

[0108] The sixth capacitor pattern 527 is disposed on the upper surface of the tenth sheet 520, spaced apart from the fourth capacitor pattern 525 and the fifth capacitor pattern 526. The sixth capacitor pattern 527 is disposed at a position adjacent to the third side of the tenth sheet 520 and is opposite to the third capacitor pattern 524. In this case, the sixth capacitor pattern 527 and the fifth capacitor pattern 526 are disposed opposite to each other with the fourth capacitor pattern 525 therebetween.

[0109] The first end 527a of the sixth capacitor pattern 527 is disposed near the center of the tenth sheet 520 and is opposite to the first end 524a of the third capacitor pattern 524. The second end 527b of the sixth capacitor pattern 527 is in a straight line with the first side of the tenth sheet 520. Accordingly, the sixth capacitor pattern 527 is exposed to the first side surface of the filter stack 110.

[0110] The capacitor pattern 521 may include a plurality of patterns (i.e., the first capacitor pattern 522 to the third capacitor pattern 524) disposed at the input terminal of the stacked common mode filter, or may include a plurality of patterns (i.e., the fourth capacitor pattern 525 to the sixth capacitor pattern 527) disposed at the output terminal of the stacked common mode filter.

[0111] The eleventh sheet 530 is disposed at the bottom of the tenth sheet 520. A second ground pattern 531 is disposed on the eleventh sheet 530.

[0112] Refer to Figure 16 , the second ground pattern 531 is disposed on the upper surface of the eleventh sheet 530. The second ground pattern 531 may include a fourth pattern 531a, a fifth pattern 531b, and a sixth pattern 531c.

[0113] The fourth pattern 531a is formed in a plate shape and is disposed at the center of the upper surface of the eleventh sheet 530. The fourth pattern 531a may be configured as an island pattern spaced apart from the four sides of the eleventh sheet 530.

[0114] The fifth pattern 531b extends from the third side of the fourth pattern 531a and is in the same straight line as the third side of the eleventh sheet 530. That is, the first end of the fifth pattern 531b is connected to the third side of the fourth pattern 531a. The second end of the fifth pattern 531b is in the same straight line as the third side of the eleventh sheet 530 and is exposed on the third side surface of the filter stack 110.

[0115] The sixth pattern 531c is disposed opposite to the fifth pattern 531b with the fourth pattern 531a therebetween. The sixth pattern 531c extends from the fourth side of the fourth pattern 531a and is in the same straight line as the fourth side of the eleventh sheet 530. That is, the first end of the sixth pattern 531c is connected to the fourth side of the fourth pattern 531a. The second end of the sixth pattern 531c is in the same straight line as the fourth side of the eleventh sheet 530 and is exposed on the fourth side surface of the filter stack 110.

[0116] Therefore, the second ground pattern 531 is exposed on the third side surface and the fourth side surface of the filter stack 110.

[0117] To adjust the position of the additional pole, the capacitor layer 500 may further include a sheet provided with a ground pattern and a sheet provided with a capacitor pattern.

[0118] For example, referring to Figure 17 , the capacitor layer 500 may further include a twelfth sheet 540 provided with a plurality of capacitor patterns 541 and a thirteenth sheet 550 provided with a third ground pattern 551. In this case, since the position of the additional pole in the stacked common-mode filter is adjusted by capacitance, the number of capacitor patterns and ground patterns to be added may vary.

[0119] The first external electrode 120 is disposed on the second side surface of the filter stack 110. The first external electrode 120 is connected to the second end 221b of the first coil pattern 221 and the second end 331b of the sixth coil pattern 331 that are exposed on the second side surface of the filter stack 110. The first external electrode 120 is also connected to the second end 522b of the first capacitor pattern 522 that is exposed on the second side surface of the filter stack 110. Both ends of the first external electrode 120 may be formed to extend to the upper surface and the lower surface of the filter stack 110.

[0120] The second external electrode 130 is disposed on the second side surface of the filter stack 110. The second external electrode 130 is spaced apart from the first external electrode 120 and is disposed at a position adjacent to the fourth side surface of the filter stack 110. The second external electrode 130 is connected to the second end 231b of the second coil pattern 231 and the second end 241b of the third coil pattern 241 that are exposed on the second side surface of the filter stack 110. The second external electrode 130 is also connected to the second end 523b of the second capacitor pattern 523 that is exposed on the second side surface of the filter stack 110. Both ends of the second external electrode 130 may be formed to extend to the upper surface and the lower surface of the filter stack 110.

[0121] The third external electrode 140 is disposed on the second side surface of the filter stack 110. The third external electrode 140 is spaced apart from the first external electrode 120 and is disposed at a position adjacent to the third side surface of the filter stack 110. The third external electrode 140 is opposed to the second external electrode 130 with the first external electrode 120 in the middle, and the first external electrode 120 is located between the second external electrode 130 and the third external electrode 140.

[0122] The third external electrode 140 is connected to the second end 311b of the fourth coil pattern 311 and the second end 321b of the fifth coil pattern 321 that are exposed on the second side surface of the filter stack 110. The third external electrode 140 is also connected to the second end 524b of the third capacitor pattern 524 that is exposed on the second side surface of the filter stack 110. Both ends of the third external electrode 140 may be formed to extend to the upper surface and the lower surface of the filter stack 110.

[0123] The fourth external electrode 150 is disposed on the first side surface of the filter stack 110. The fourth external electrode 150 is disposed opposite to the first external electrode 120 with the filter stack 110 therebetween. The fourth external electrode 150 is connected to the second end 212b of the first terminal pattern 212 and the second end 342b of the fourth terminal pattern 342 that are exposed on the first side surface of the filter stack 110. The fourth external electrode 150 is also connected to the second end 525b of the fourth capacitor pattern 525 that is exposed on the first side surface of the filter stack 110. Both ends of the fourth external electrode 150 may be formed to extend to the upper surface and the lower surface of the filter stack 110.

[0124] The fifth external electrode 160 is disposed on the first side surface of the filter stack 110. The fifth external electrode 160 is spaced apart from the fifth external electrode 160 and is disposed at a position adjacent to the fourth side surface of the filter stack 110. The fifth external electrode 160 and the second external electrode 130 are oppositely disposed with the filter stack 110 therebetween. The fifth external electrode 160 is connected to the second end 213b of the second terminal pattern 213 exposed on the first side surface of the filter stack 110. The fifth external electrode 160 is also connected to the second end 526b of the fifth capacitor pattern 526 exposed on the first side surface of the filter stack 110. Both ends of the fifth external electrode 160 may be formed to extend to the upper and lower surfaces of the filter stack 110.

[0125] The sixth external electrode 170 is disposed on the first side surface of the filter stack 110. The sixth external electrode 170 is spaced apart from the fourth external electrode 150 and the fifth external electrode 160 and is disposed at a position adjacent to the third side surface of the filter stack 110. The sixth external electrode 170 and the third external electrode 140 are oppositely disposed with the filter stack 110 therebetween. The sixth external electrode 170 and the fifth external electrode 160 are oppositely disposed with the fourth external electrode 150 therebetween, and the fourth external electrode 150 is disposed between the fifth external electrode 160 and the sixth external electrode 170. The sixth external electrode 170 is connected to the second end 341b of the third terminal pattern 341 exposed on the first side surface of the filter stack 110. The sixth external electrode 170 is also connected to the second end 527b of the sixth capacitor pattern 527 exposed on the first side surface of the filter stack 110. Both ends of the sixth external electrode 170 may be formed to extend to the upper and lower surfaces of the filter stack 110.

[0126] The seventh external electrode 180 is disposed on the third side surface of the filter stack 110. The seventh external electrode 180 is connected to the first ends of the ground patterns 511 and 531. Both ends of the seventh external electrode 180 may be formed to extend to the upper and lower surfaces of the filter stack 110.

[0127] The eighth external electrode 190 is disposed on the fourth side surface of the filter stack 110. The eighth external electrode 190 and the seventh external electrode 180 are oppositely disposed with the filter stack 110 therebetween. The eighth external electrode 190 is connected to the second ends of the ground patterns 511 and 531. Both ends of the eighth external electrode 190 may be formed to extend to the upper and lower surfaces of the filter stack 110.

[0128] The first external electrode 120 and the fourth external electrode 150 serve as the input terminal and the output terminal of the first channel formed by the first terminal pattern 212, the first coil pattern 221, the sixth coil pattern 331, and the fourth terminal pattern 342.

[0129] The second external electrode 130 and the sixth external electrode 170 serve as the input terminal and the output terminal of a second channel formed by the second coil pattern 231, the third coil pattern 241, and the second terminal pattern 213.

[0130] The third external electrode 140 and the fifth external electrode 160 serve as the input terminal and the output terminal of a third channel formed by the fourth coil pattern 311, the fifth coil pattern 321, and the third terminal pattern 341.

[0131] Referring to Figure 18 , the stacked common mode filter according to an embodiment of the present invention includes six coil patterns forming three channels.

[0132] The first coil pattern 221 and the sixth coil pattern 331 form a first coil constituting the first channel, and are respectively sandwiched between terminal patterns provided at the top and bottom of the electrode stack 400. The second coil pattern 231 and the third coil pattern 241 are sandwiched between the first coil pattern 221 and the sixth coil pattern 331 to form a second coil constituting the third channel. The fourth coil pattern 311 and the fifth coil pattern 321 are sandwiched between the third coil pattern 241 and the sixth coil pattern 331 to form a third coil constituting the third channel.

[0133] Accordingly, the stacked common mode filter can minimize the change in the inductance characteristics of the coil patterns by configuring the spacing (gap) between the channels to be constant.

[0134] In addition, in this stacked common mode filter, since the terminal patterns for connecting the coil patterns to the external electrodes are provided at the top and bottom of the electrode stack 400, the distance between the coil patterns of each channel and the terminal patterns can be configured to be the same, so that the coil patterns forming each channel have uniform resistance and inductance.

[0135] The stacked common mode filter according to an embodiment of the present invention can improve the magnetic coupling (i.e., electromagnetic coupling) between the first coil to the third coil and minimize the degradation of the differential signal.

[0136] Referring to Figure 19 , in the stacked common mode filter according to an embodiment of the present invention, a capacitor is formed between the first coil and the second coil, between the second coil and the third coil, and between the first coil and the third coil. In this case, since the first capacitor layer 500a and the second capacitor layer 500b are respectively provided at the top and bottom of the electrode stack 400 including the upper electrode layer 200 and the lower electrode layer 300, a coupling effect is generated between the coil and the capacitor pattern 521, and thus an additional capacitor is formed between the coil and the capacitor pattern 521.

[0137] Thus, in the stacked common-mode filter according to an embodiment of the present invention, since an additional capacitance is formed between each coil and the capacitor pattern 521, the capacitance can be increased without adding an electrode layer including a sheet layer provided with a coil pattern.

[0138] In addition, in the stacked common-mode filter according to an embodiment of the present invention, since an additional capacitance is formed between the coil and the capacitor pattern 521, an additional notch can be formed in the common-mode attenuation characteristic to expand the attenuation frequency band.

[0139] Generally, in a stacked common-mode filter having an LC filter structure, a secondary resonance point is formed by the equivalent series inductance (ESL) of the parallel capacitance formed between the coil pattern and the capacitor pattern.

[0140] Refer to Figure 20 and Figure 21 , the stacked common-mode filter according to the prior art is formed into an LC filter structure A in which the capacitor layer is provided on top of the electrode stack, or an LC filter structure B in which the capacitor layer is provided at the bottom of the electrode stack. In the stacked common-mode filter according to the prior art, the equivalent series inductance of the parallel capacitance varies greatly depending on the stacking direction, and the change in the equivalent series inductance causes a great change in the secondary resonance point (A→B). Therefore, the stacked common-mode filter according to the prior art has different common-mode attenuation frequency bands depending on the mounting direction of the chip.

[0141] The stacked common-mode filter according to an embodiment of the present invention is formed into an LC filter structure (i.e., an LPF filter structure) in which the capacitor layer is provided on top and bottom of the electrode stack. Therefore, even if the stacking direction changes, the change in the equivalent series inductance of the parallel capacitance of the stacked common-mode filter according to an embodiment of the present invention is small. Therefore, even if the mounting direction of the chip changes, the change in the secondary resonance point of the stacked common-mode filter according to an embodiment of the present invention is small, and a common-mode attenuation frequency band can be formed at a constant level.

[0142] Refer to Figure 22 and Figure 23 , the stacked common-mode filter according to an embodiment of the present invention can adjust the secondary resonance point by changing the area of the capacitor pattern.

[0143] In an embodiment of the present invention, the stacked common-mode filter C including the capacitor pattern having the first area forms a secondary resonance point at about 5.5 GHz, while the stacked common-mode filter D including the capacitor pattern having the second area larger than the first area forms a secondary resonance point at about 6.5 GHz.

[0144] Thus, the stacked common mode filter according to an embodiment of the present invention can shift the secondary resonance point to a higher frequency by expanding the area of the capacitor pattern, and can shift the secondary resonance point to a lower frequency by reducing the area of the capacitor pattern.

[0145] The above description is only an illustration of the technical idea of the present invention. Those skilled in the art can make various changes and deformations to the present invention without departing from the essential features of the present invention. Therefore, the embodiments of the present invention should not be construed as limiting the technical idea of the present invention, but as illustrative of the technical idea of the present invention. The technical idea of the present invention is not limited by the embodiments. The protection scope of the present invention should be construed based on the claims, and all technical ideas within the equivalent scope of the present invention should be understood to be covered by the claims of the present invention.

Claims

1. A stacked common mode filter, characterized in that, Comprising: An upper electrode layer configured as a stack including a first coil pattern, a second coil pattern, and a third coil pattern; A lower electrode layer configured as a stack including a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern, and disposed at the bottom of the upper electrode layer; A first capacitor layer configured as a stack including a capacitor pattern and a ground pattern, disposed on top of the upper electrode layer, and configured to overlap with the first to sixth coil patterns to form additional capacitance; And A second capacitor layer configured as a stack including a capacitor pattern and a ground pattern, disposed at the bottom of the lower electrode layer, and configured to overlap with the first to sixth coil patterns to form additional capacitance.

2. The stacked common mode filter according to claim 1, wherein The upper electrode layer and the lower electrode layer form an electrode stack, The electrode stack is configured such that the first coil pattern, the second coil pattern, the third coil pattern, the fourth coil pattern, the fifth coil pattern, and the sixth coil pattern are stacked in sequence, The first coil pattern and the sixth coil pattern form a first coil constituting a first channel, The second coil pattern and the third coil pattern are disposed between the first coil pattern and the sixth coil pattern to form a second coil constituting a second channel, The fourth coil pattern and the fifth coil pattern are disposed between the third coil pattern and the sixth coil pattern to form a third coil constituting a third channel.

3. The stacked common mode filter according to claim 1, wherein The upper electrode layer includes: A first thin sheet having a first terminal pattern and a second terminal pattern spaced apart from each other on its first surface; A second thin sheet having the first coil pattern and a first via hole on its first surface, and disposed at the bottom of the first thin sheet; A third thin sheet having the second coil pattern on its first surface, and disposed at the bottom of the second thin sheet; and A fourth thin sheet having the third coil pattern on its first surface, and disposed at the bottom of the third thin sheet.

4. The stacked common mode filter according to claim 3, wherein, The first coil pattern is disposed on the first surface of the second thin sheet, sandwiched between the first thin sheet and the second thin sheet, and connected to the sixth coil pattern to form a first channel, The first end of the first coil pattern is connected to the first end of the first terminal pattern, The second end of the first coil pattern is in a straight line with the second side of the second thin sheet, and the second side of the second thin sheet is disposed opposite to the first side of the second thin sheet.

5. The stacked common mode filter according to claim 3, characterized in that, The second coil pattern is disposed on the first surface of the third thin sheet, sandwiched between the second thin sheet and the third thin sheet, The first end of the second coil pattern is connected to the first end of the second terminal pattern through the first via hole, The second end of the second coil pattern is in a straight line with the second side of the third thin sheet, and the second side of the third thin sheet is disposed opposite to the first side of the third thin sheet.

6. The stacked common mode filter according to claim 3, wherein, The third coil pattern is disposed on the first surface of the fourth thin sheet, sandwiched between the third thin sheet and the fourth thin sheet, The first end of the third coil pattern is connected to the first end of the second terminal pattern, The second end of the third coil pattern is on the same straight line as the second side of the fourth sheet, and the second side of the fourth sheet is disposed opposite to the first side of the fourth sheet.

7. The stacked common mode filter according to claim 3, wherein, The first end of the first terminal pattern is disposed near the center of the first sheet and is connected to the first end of the first coil pattern, and the second end of the first terminal pattern is on the same straight line as the first side of the first sheet. The first end of the second terminal pattern is disposed near the center of the first sheet and is connected to the first end of the second coil pattern through the first via, and the second end of the second terminal pattern is on the same straight line as the first side of the first sheet.

8. The stacked common mode filter according to claim 1, characterized in that, The lower electrode layer includes: A fifth sheet having the fourth coil pattern disposed on its first surface and disposed at the bottom of the upper electrode layer; A sixth sheet having the fifth coil pattern disposed on its first surface and disposed at the bottom of the fifth sheet; A seventh sheet having the sixth coil pattern and a second via disposed on its first surface and disposed at the bottom of the sixth sheet; and An eighth sheet having a third terminal pattern and a fourth terminal pattern disposed thereon at intervals on its first surface.

9. The stacked common mode filter according to claim 8, wherein, The fourth coil pattern is disposed on the first surface of the fifth sheet and is sandwiched between the upper electrode layer and the fifth sheet. The first end of the fourth coil pattern is disposed near the center of the fifth sheet and is connected to the first end of the fifth coil pattern. The second end of the fourth coil pattern is on the same straight line as the second side of the fifth sheet, and the second side of the fifth sheet is disposed opposite to the first side of the fifth sheet.

10. The stacked common mode filter according to claim 8, characterized in that, The fifth coil pattern is disposed on the first surface of the sixth sheet and is sandwiched between the fifth sheet and the sixth sheet. The first end of the fifth coil pattern is disposed near the center of the sixth sheet, is connected to the first end of the fourth coil pattern, and is connected to the first end of the third terminal pattern through the second via. The second end of the fifth coil pattern is on the same straight line as the second side of the sixth sheet, and the second side of the sixth sheet is disposed opposite to the first side of the sixth sheet.

11. The stacked common mode filter according to claim 8, wherein The sixth coil pattern is disposed on the first surface of the seventh sheet and is sandwiched between the sixth sheet and the seventh sheet. The first end of the sixth coil pattern is disposed near the center of the sixth sheet, is connected to the first end of the fourth coil pattern, and is connected to the first end of the third terminal pattern through the second via. The second end of the sixth coil pattern is on the same straight line as the second side of the seventh sheet, and the second side of the seventh sheet is disposed opposite to the first side of the seventh sheet.

12. The stacked common mode filter according to claim 8, wherein The first end of the third terminal pattern is disposed near the center of the eighth sheet and is connected to the first end of the fifth coil pattern through the second via, and the second end of the third terminal pattern is on the same straight line as the first side of the eighth sheet. The first end of the fourth terminal pattern is disposed near the center of the eighth thin sheet and is connected to the first end of the sixth coil pattern, and the second end of the fourth terminal pattern is on the same straight line as the first side of the eighth thin sheet.

13. The stacked common mode filter according to claim 1, wherein The number of vias formed on each of the plurality of thin sheets constituting the upper electrode layer and the lower electrode layer does not exceed two.

14. The stacked common mode filter according to claim 1, characterized in that, Each of the first capacitor layer and the second capacitor layer includes: a ninth thin sheet having a ground pattern disposed on a first surface thereof and disposed at the bottom of the lower electrode layer; and a tenth thin sheet having a capacitor pattern disposed on a first surface thereof and disposed at the bottom of the ninth thin sheet, wherein the capacitor pattern is configured to overlap with a coil pattern included in an electrode stack in which the upper electrode layer and the lower electrode layer are stacked to form an additional capacitance.

15. The stacked common mode filter according to claim 14, wherein The ground pattern includes: a first ground pattern formed in a plate shape, disposed on the first surface of the ninth thin sheet, and having an outer periphery spaced apart from the outer periphery of the ninth thin sheet; a second ground pattern having a first end connected to the first ground pattern and a second end on the same straight line as the third side of the ninth thin sheet; and a third ground pattern disposed opposite to the second ground pattern with the first ground pattern therebetween, having a first end connected to the first ground pattern and a second end on the same straight line as the fourth side of the ninth thin sheet, the fourth side of the ninth thin sheet being disposed opposite to the third side of the ninth thin sheet.

16. The stacked common mode filter according to claim 14, wherein The capacitor pattern includes: a first capacitor pattern disposed on the upper surface of the tenth thin sheet; a second capacitor pattern disposed on the upper surface of the tenth thin sheet and spaced apart from the first capacitor pattern; a third capacitor pattern disposed on the upper surface of the tenth thin sheet and spaced apart from the first capacitor pattern and the second capacitor pattern; a fourth capacitor pattern disposed on the upper surface of the tenth thin sheet and opposite to the first capacitor pattern; a fifth capacitor pattern disposed on the upper surface of the tenth thin sheet and spaced apart from the fourth capacitor pattern and opposite to the second capacitor pattern; and a sixth capacitor pattern disposed on the upper surface of the tenth thin sheet and spaced apart from the fourth capacitor pattern and the fifth capacitor pattern and opposite to the third capacitor pattern, wherein the first ends of the first capacitor pattern to the third capacitor pattern are on the same straight line as one of the first side and the second side of the tenth thin sheet, and the first ends of the fourth capacitor pattern to the sixth capacitor pattern are on the same straight line as the other of the first side and the second side of the tenth thin sheet.

17. The stacked common mode filter according to claim 14, wherein The capacitor layer is configured such that a plurality of ground patterns and a plurality of capacitor patterns are alternately stacked.

18. The stacked common mode filter according to claim 1, characterized in that, The upper electrode layer, the lower electrode layer, the first capacitor layer, and the second capacitor layer constitute a filter stack, The stacked common mode filter further includes: a first external electrode disposed on a second side of the filter stack and connected to the first coil pattern and the sixth coil pattern exposed on the second side of the filter stack; A second external electrode, which is disposed on a second side surface of the filter stack body and is connected to the second coil pattern and the third coil pattern exposed on the second side surface of the filter stack body; A third external electrode, which is disposed on the second side surface of the filter stack body, is disposed opposite to the second external electrode with the first external electrode therebetween, and is connected to the fourth coil pattern and the fifth coil pattern exposed on the second side surface of the filter stack body; A fourth external electrode, which is disposed on a first side surface of the filter stack body opposite to the second side surface and is connected to the first terminal pattern and the fourth terminal pattern exposed on the first side surface of the filter stack body; A fifth external electrode, which is disposed on the first side surface of the filter stack body and is connected to the second terminal pattern exposed on the first side surface of the filter stack body; A sixth external electrode, which is disposed on the first side surface of the filter stack body, is disposed opposite to the fifth external electrode with the fourth external electrode therebetween, and is connected to the third terminal pattern exposed on the first side surface of the filter stack body; A seventh external electrode, which is disposed on a third side surface of the filter stack body and is connected to a first end of the ground pattern exposed on the third side surface of the filter stack body; and An eighth external electrode, which is disposed on a fourth side surface of the filter stack body opposite to the third side surface and is connected to a second end of the ground pattern exposed on the fourth side surface of the filter stack body.

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