Automatic gluing device for assembly based on PCBA (printed circuit board assembly)

Abstract

The invention relates to the technical field of PCBA board processing, and discloses an automatic gluing device for PCBA board assembly, which comprises a base, the upper end of the base is connected with a side plate, a motor cover and a gluing frame, the motor cover is connected with a rotating motor, the output end of the rotating motor is connected with a rotating pointer, the rotating pointer is connected with a rotating column, and the gluing frame is connected with a swing shaft. A swinging plate is rotatably connected to the swinging shaft, a charging barrel is connected to one side of the swinging plate, a nozzle is connected to the lower end of the swinging plate, a first cross rod is slidably connected between the gluing frames, a pushing frame is connected to the first cross rod, the rotating column is slidably connected to the pushing frame, a reset spring is connected to the gluing frames, a placing table is arranged on one side of the pushing frame, and a placing groove is formed in the placing table. According to the circuit board gluing device, the placing table for placing the circuit boards can be driven to move back and forth below the nozzle by utilizing the pushing frame, so that the gluing quality of the circuit boards after gluing each time is ensured to be the same, and the circuit boards after gluing are kept uniform.

Description

Technical Field

[0001] The present invention relates to the technical field of PCBA board processing, and in particular to an automatic glue coating device for PCBA board assembly. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, ultra-thin circuit boards, printed circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts.

[0003] Glue coating on the surface of PCBA boards is mainly to improve the protection performance and functionality. In terms of protection, it can isolate moisture, dust, and chemical erosion, prevent oxidation and corrosion from damaging the circuits, extend the lifespan, and ensure stability and reliability. At the functional level, specific coatings can adjust electrical characteristics. For example, insulating paint can precisely control the electrical insulation between circuits, and some coatings help with heat dissipation to maintain an appropriate working temperature and ensure the efficient operation of the circuit board.

[0004] Traditionally, glue coating on PCBA boards relies on glue coating equipment for operation. To improve the glue coating quality, it is necessary to clean the surface of the circuit board before glue coating. After cleaning, it is manually taken and placed in the glue coating equipment. This transfer operation has the problem of contaminating the circuit board. Moreover, during the glue coating operation of the glue coating equipment, only the nozzle structure moves. When the circuit board is being cleaned, the coating in the glue coating equipment will be static due to the structure, resulting in uneven mixing of the coating, which may cause the problem of subsequent coating blocking the nozzle, thus affecting the uniformity of glue coating on the circuit board.

[0005] Based on this, an automatic glue coating device for PCBA board assembly is proposed. Summary of the Invention

[0006] The purpose of the present invention is to propose an automatic glue coating device for PCBA board assembly in order to solve the above problems.

[0007] In order to achieve the above purpose, the present invention adopts the following technical solutions: An automatic glue - applying device for PCBA board assembly, including a base. A side plate, a motor cover and a glue - applying rack are connected to the upper end of the base. A rotating motor is connected to the motor cover. The output end of the rotating motor is connected to a rotating pointer. A rotating column is connected to the rotating pointer. A swinging shaft is connected to the glue - applying rack. A swinging plate is rotatably connected to the swinging shaft. A material cylinder is connected to one side of the swinging plate. A nozzle is connected to the lower end of the swinging plate. A first cross bar is slidably connected between the glue - applying racks. A pushing frame is connected to the first cross bar. The rotating column is slidably connected to the pushing frame. A reset spring is connected to the glue - applying rack. A placement table is arranged on one side of the pushing frame. A placement groove is opened on the placement table. A clamping piece is connected to one side of the placement table. A transmission mechanism for driving the placement table to move for glue - applying is arranged on one side of the placement table.

[0008] Preferably, the transmission mechanism includes a cylinder. The placement table is slidably connected to the output end of the cylinder. A rotating rod is rotatably connected to the side plate. The output end of the rotating motor is connected to a lower gear. An upper gear is meshed above the lower gear. A clamping groove is opened on the upper gear. A convex strip is connected to one end of the rotating rod.

[0009] Preferably, a bottom slide rail is connected to the lower end of the placement table. A slider is slidably connected to the bottom slide rail. A second cross bar and a reset spring are connected to the slider. The slider is fixedly connected to the output end of the cylinder.

[0010] Preferably, a first bevel gear is rotatably connected to the side plate. A brush is connected to the lower end of the first bevel gear. A second bevel gear is connected to the rotating rod.

[0011] Preferably, a dial is connected to the rotating rod.

[0012] Preferably, a sliding frame is connected to the upper end of the placement table. The rotating rod is slidably connected to the sliding frame. A clamping ring is connected to the rotating rod. The clamping ring clamps outside the sliding frame.

[0013] Preferably, an elliptical frame is slidably connected to one side of the sliding frame. A contact spring is connected to the rotating rod. Contact wheel frames are connected to both ends of the contact spring. The contact wheel frames abut against the elliptical frame.

[0014] Preferably, a collar is connected to the motor cover. A socket is rotatably connected to the collar. The socket is fixedly connected to the upper gear.

[0015] In summary, due to the adoption of the above - mentioned technical solutions, the beneficial effects of the present invention are: 1. In this application, by adopting a push frame structure, the push frame can drive the placement table for placing the circuit board to move back and forth under the nozzle, ensuring that the glue application quality of the circuit board after each glue application is the same, making the circuit boards uniform after glue application. A placement groove is also provided on the placement table for placing the circuit board, which can adapt to circuit boards of different sizes for glue application, greatly improving the applicability of the glue application equipment to the processing size of the circuit board.

[0016] 2. In this application, by adopting a brush structure, the brush can clean the glue application surface of the circuit board, avoiding the influence of dust or impurities on the glue application quality. At the same time, during the cleaning process, the paddle can drive the material cylinder to swing, improving the uniformity of the pigment mixing in the material cylinder. The movement of the placement table driven by the cylinder ensures that the cleaning and glue application of each circuit board are carried out alternately, ensuring the orderly progress of the processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Shows a schematic structural diagram of the overall glue application device provided by an embodiment of the present invention; Figure 2 Shows a schematic structural diagram of the connection of the collar provided by an embodiment of the present invention; Figure 3 Shows a schematic structural diagram of the connection of the slider provided by an embodiment of the present invention; Figure 4 Shows an exploded structural diagram of the connection of the rotating rod provided by an embodiment of the present invention; Figure 5 Shows an exploded structural diagram of the connection of the upper gear provided by an embodiment of the present invention; Figure 6 Shows a schematic structural diagram of the connection of the clamping ring provided by an embodiment of the present invention.

[0018] LEGEND DESCRIPTION: 1. Base; 2. Side plate; 3. Cylinder; 4. First bevel gear; 5. Brush; 6. Rotating rod; 7. Placement table; 8. Placement groove; 9. Glue application frame; 10. Motor cover; 11. Rotating motor; 12. First cross bar; 13. Sliding frame; 14. Oval frame; 15. Second bevel gear; 16. Upper gear; 17. Paddle; 18. Ridge; 19. Lower gear; 20. Push frame; 21. Collar; 22. Return spring; 23. Clip; 24. Swing shaft; 25. Swing plate; 26. Material cylinder; 27. Bottom slide rail; 28. Slider; 29. Second cross bar; 30. Clamping ring; 31. Contact wheel frame; 32. Contact spring; 33. Nozzle; 34. Rotating column; 35. Rotating pointer; 36. Socket; 37. Card slot. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Please refer to Figures 1-6 , the present invention provides a technical solution: An automatic glue coating device for PCBA board assembly, including a base 1, a side plate 2, a motor cover 10 and a glue coating rack 9 are connected to the upper end of the base 1. The side plate 2 is vertically and fixedly connected to the base 1. The glue coating rack 9 is a fixed structure. A rotating motor 11 is connected to the motor cover 10. The motor cover 10 can ensure the firm connection of the rotating motor 11. The output end of the rotating motor 11 is connected to a rotating pointer 35. The rotating pointer 35 is vertically connected to the output end of the rotating motor 11. A rotating column 34 is connected to the rotating pointer 35. The rotating column 34 is parallel to the output end of the rotating motor 11. A swing shaft 24 is connected to the glue coating rack 9. A swing plate 25 is rotatably connected to the swing shaft 24. In the natural state, the swing plate 25 is in a vertical state, and the swing shaft 24 is connected to a position slightly above the middle of the swing plate 25 in the vertical state. A material cylinder 26 is connected to one side of the swing plate 25. A nozzle 33 is connected to the lower end of the swing plate 25. The material cylinder 26 is fixedly connected to the swing plate 25. The material cylinder 26 is connected to the nozzle 33 through a delivery pipe. A first cross bar 12 is slidably connected between the glue coating racks 9. A pushing frame 20 is connected to the first cross bar 12. The rotating column 34 is slidably connected to the pushing frame 20. A return spring 22 is connected to the glue coating rack 9. The other end of the return spring 22 is connected to the first cross bar 12. The return spring 22 is sleeved on the first cross bar 12. A placing table 7 is arranged on one side of the pushing frame 20. A placing groove 8 is opened on the placing table 7. A clamping piece 23 is connected to one side of the placing table 7. When applying glue, the clamping piece 23 structure clamps on both sides of the pushing frame 20, and at the same time, the clamping piece 23 clamps on the first cross bar 12. A transmission mechanism for driving the placing table 7 to move for glue coating is arranged on one side of the placing table 7.

[0021] Specifically, as Figure 1 and Figure 5As shown in the figure, the transmission mechanism includes a cylinder 3, which is vertically connected to the side plate 2. The placement table 7 is slidably connected to the output end of the cylinder 3. A rotating rod 6 is rotatably connected to the side plate 2. The output end of the rotating motor 11 is connected to a lower gear 19. An upper gear 16 is meshed above the lower gear 19. A clamping groove 37 is provided on the upper gear 16. One end of the rotating rod 6 is connected with a convex strip 18. The structure of the rotating rod 6 connected with the convex strip 18 can just fit with the clamping groove 37. That is, when the convex strip 18 is clamped in the clamping groove 37, the rotation of the rotating rod 6 can drive the upper gear 16 to rotate. When the convex strip 18 is separated from the clamping groove 37, the rotation of the rotating rod 6 cannot drive the upper gear 16 to rotate.

[0022] Specifically, as Figure 3 shown, a bottom slide rail 27 is connected to the lower end of the placement table 7. A slider 28 is slidably connected to the bottom slide rail 27. A cross bar two 29 and a return spring 22 are connected to the slider 28. The slider 28 is fixedly connected to the output end of the cylinder 3. Through the mutual sliding cooperation of the bottom slide rail 27 and the slider 28, the telescopic movement of the cylinder 3 can drive the placement table 7 to move, and does not interfere with the reciprocating movement of the placement table 7 in the direction perpendicular to the cylinder 3.

[0023] Specifically, as Figure 3 shown, a bevel gear one 4 is rotatably connected to the side plate 2. A brush 5 is connected to the lower end of the bevel gear one 4. A bevel gear two 15 is connected to the rotating rod 6. When the cylinder 3 contracts, the placement table 7 can be moved below the brush 5. At this time, the bevel gear one 4 just meshes with the bevel gear two 15, and the brush 5 can be driven to rotate to complete the cleaning of the circuit board placed in the placement groove 8. The rotating structure can separate dust or impurities from the circuit board by centrifugal force. When the brush 5 approaches the circuit board, the brush 5 can also brush and clean the circuit board.

[0024] Specifically, as Figure 1 shown, a dial 17 is connected to the rotating rod 6. When the cylinder 3 contracts, the convex strip 18 enters the clamping groove 37. When the rotating motor 11 rotates, the dial 17 can be driven to rotate. After moving, the dial 17 can also drive the swing plate 25 to rotate by rotation. At this time, the cleaning operation of the circuit board surface is in progress. The swinging of the material cylinder 26 in this state helps the internal pigment to be mixed evenly by oscillation.

[0025] Specifically, as Figure 1 and Figure 4 shown, a sliding frame 13 is connected to the upper end of the placement table 7. The placement table 7 and the sliding frame 13 are fixedly connected. When the placement table 7 moves, the sliding frame 13 can be driven to move synchronously. The movement of the sliding frame 13 can drive the rotating rod 6 to move horizontally synchronously. The rotating rod 6 is slidably connected to the sliding frame 13. A clamping ring 30 is connected to the rotating rod 6. The clamping ring 30 clamps outside the sliding frame 13.

[0026] Specifically, as Figure 1 、 Figure 4 and Figure 6 shown, an elliptical frame 14 is slidably connected to one side of the sliding frame 13, a contact spring 32 is connected to the rotating rod 6, and both ends of the contact spring 32 are connected to a contact wheel frame 31. The contact wheel frame 31 abuts against the elliptical frame 14. A roller is rotatably connected to the contact wheel frame 31. The structure of the rotating rod 6 can be reset by relying on the contact wheel frame 31. During the rotation of the rotating rod 6, the roller at one end of the contact wheel frame 31 is in rolling contact with the inner wall of the elliptical frame 14. When the rotating rod 6 is reset, the dial 17 will only be in the vertically upward or vertically downward state.

[0027] Specifically, as Figure 5 shown, a collar 21 is connected to the motor cover 10, and a socket 36 is rotatably connected to the collar 21. The socket 36 is fixedly connected to the upper gear 16. The upper gear 16 can be limited through the collar 21 to ensure the stability of the rotation of the upper gear 16.

[0028] In summary, for an automatic glue coating device based on PCBA board assembly provided in this embodiment, when it is necessary to apply glue to the circuit board, the operator only needs to place the circuit board on the placement table 7, and then the operator can remotely operate the cylinder 3 away from the equipment. A placement groove 8 is provided on the placement table 7. For circuit boards that do not fit the placement groove 8, different-shaped molds can be placed on the placement groove 8, and then the circuit board can be placed on the mold to achieve the effect of applying glue to different types of circuit boards.

[0029] After the placement is completed, the operator starts the cylinder 3. The operating state of the cylinder 3 is to contract first, and then stop for a period of time to clean the surface of the circuit board. Then the cylinder 3 extends, and when the cylinder 3 stops for a period of time, glue is applied to the surface of the circuit board. When the cylinder 3 is operating, the rotating motor 11 does not operate. Only after the cylinder 3 stops expanding and contracting will the rotating motor 11 rotate.

[0030] When the cylinder 3 is retracted, the placement table 7 moves synchronously with the rotating rod 6. When the cylinder 3 is retracted to the maximum extent, the convex strip 18 is inserted into the slot 37, and the rotating motor 11 starts to rotate. When the rotating motor 11 rotates, it can drive the lower gear 19 and the upper gear 16 to rotate. At this time, the paddle 17 moves horizontally to the top of the swing plate 25, and the bevel gear 14 and the bevel gear 2 15 are meshed with each other. At this time, the rotation of the bevel gear 14 can drive the brush 5 to clean the upper surface of the circuit board. After the cleaning is completed, the cylinder 3 begins to extend, the rotating motor 11 stops rotating, and the cylinder 3 can push the placement table 7 to move to the nozzle 3 3, at this time, the clip 23 is clamped on the outside of the push frame 20, the convex strip 18 is separated from the slot 37, and the lower gear 19 rotates, while the rotating rod 6 does not rotate. The rotating motor 11 drives the rotating column 34 to rotate, thereby driving the push frame 20 to move back and forth, and synchronously driving the placement table 7 to move back and forth under the nozzle 33, and cooperating with the nozzle 33 to achieve gluing on the surface of the circuit board, wherein the timing of the barrel 26 transmitting the paint into the nozzle 33 is when the rotating motor 11 starts to rotate. When the rotating motor 11 completes the rotation, the circuit board completes the gluing operation, and each structure of the gluing device moves to the initial position.

[0031] The reset spring 22 can drive the placement table 7 and the pushing frame 20 to move to the middle position, and the placement table 7 moves to the middle position to ensure that the clip 23 can be accurately docked with the pushing frame 20, and the pushing frame 20 moves to the initial position to be able to dock with the clip 23, and at the same time it can also ensure that the slot 37 is in a state of just docking with the convex strip 18, wherein the initial state of the convex strip 18 is reset by the abutment wheel frame 31, wherein the elliptical frame 14 itself is slidably connected to the sliding frame 13, and the abutment spring 32 is relied on to ensure that the abutment wheel frame 31 can abut against the longer diameter inside the elliptical frame 14.

[0032] The gluing device can automatically complete the gluing operation of the circuit board. Each time the placement of the circuit board is completed, the operator can operate at a safe distance. The equipment can be optimized to realize automatic placement of the circuit board through the mechanical structure, so as to realize fully automated circuit board gluing operation, greatly improving the gluing efficiency of the circuit board and the gluing quality of the circuit board, so that the pigment can be evenly coated on the surface of the circuit board, reducing the labor intensity of the operator.

[0033] The above description of the embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automated glue coating device for PCBA board assembly, including a base (1), characterized in that, The upper end of the base (1) is connected to a side plate (2), a motor cover (10), and a glue application rack (9). A rotary motor (11) is connected to the motor cover (10). The output end of the rotary motor (11) is connected to a rotary pointer (35). A rotary column (34) is connected to the rotary pointer (35). A swing shaft (24) is connected to the glue application rack (9). A swing plate (25) is rotatably connected to the swing shaft (24). A material cylinder (26) is connected to one side of the swing plate (25). A nozzle (33) is connected to the lower end of the swing plate (25). A first cross bar (12) is slidably connected between the glue application racks (9). A pushing frame (20) is connected to the first cross bar (12). The rotary column (34) is slidably connected to the pushing frame (20). A return spring (22) is connected to the glue application rack (9). A placing table (7) is arranged on one side of the pushing frame (20). A placing groove (8) is formed in the placing table (7). A clamping piece (23) is connected to one side of the placing table (7). A transmission mechanism for driving the placing table (7) to move for glue application is arranged on one side of the placing table (7).

2. The automatic glue coating device for PCBA board assembly according to claim 1, characterized in that, The transmission mechanism includes a cylinder (3). The placing table (7) is slidably connected to the output end of the cylinder (3). A rotary rod (6) is rotatably connected to the side plate (2). The output end of the rotary motor (11) is connected to a lower gear (19). An upper gear (16) is meshed above the lower gear (19). A clamping groove (37) is formed in the upper gear (16). A convex strip (18) is connected to one end of the rotary rod (6).

3. An automatic glue coating device for PCBA board assembly according to claim 1, characterized in that, A bottom slide rail (27) is connected to the lower end of the placing table (7). A slider (28) is slidably connected to the bottom slide rail (27). A second cross bar (29) and a return spring (22) are connected to the slider (28). The slider (28) is fixedly connected to the output end of the cylinder (3).

4. An automatic glue coating device for PCBA board assembly according to claim 2, characterized in that, A first bevel gear (4) is rotatably connected to the side plate (2). A brush (5) is connected to the lower end of the first bevel gear (4). A second bevel gear (15) is connected to the rotary rod (6).

5. An automatic glue coating device for PCBA board assembly according to claim 2, characterized in that, A dial (17) is connected to the rotary rod (6).

6. The automatic glue coating device for PCBA board assembly according to claim 2, wherein, A sliding frame (13) is connected to the upper end of the placing table (7). The rotary rod (6) is slidably connected to the sliding frame (13). A clamping ring (30) is connected to the rotary rod (6). The clamping ring (30) clamps outside the sliding frame (13).

7. An automatic glue coating device for PCBA board assembly according to claim 6, characterized in that, An elliptical frame (14) is slidably connected to one side of the sliding frame (13). An abutting spring (32) is connected to the rotary rod (6). The two ends of the abutting spring (32) are connected to abutting wheel frames (31). The abutting wheel frames (31) abut against the elliptical frame (14).

8. An automatic glue coating device for PCBA board assembly according to claim 1, characterized in that, A collar (21) is connected to the motor cover (10). A socket (36) is rotatably connected to the collar (21). The socket (36) is fixedly connected to the upper gear (16).

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